Wafer wet processing and cleaning system and method
By using multiple wet treatment tanks and flip devices in the wet wafer processing and cleaning system, the problem of difficulty in cleaning and drying of 3D-IC wafer surface residues and complex structures is solved, and more efficient cleaning and drying effects are achieved .
Patent Information
- Application Number
- CN202311006296.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-10
- Publication Date
- 2025-02-18
AI Technical Summary
During the wet treatment and cleaning of 3D-IC wafers, residues are easily left between the surface structures, and it is difficult for the prior art to effectively clean and dry wafers of complex structures, resulting in the failure of deionized water to completely clean or wafers or wafers. Not dry, water marks remain.
A wafer wet processing and cleaning system is provided, including a first flip device, a conveying device, a plurality of wet processing tanks, a second flip device, a moisturizing device and a single wafer processing device. The wafer is soaked in sequence through different process liquids in multiple wet treatment tanks, and the wafer is kept moist using a flip device and a moisturizing device, and finally subsequent cleaning and drying is performed in a single wafer processing device.
Effectively prevent deionized water from being completely cleaned and removed wafer particles, or the wafer is not drying, resulting in water marks residue, improving the cleaning and drying effect of wafers, and solving the problem that the existing technology cannot effectively clean and dry complex structure wafers. question.
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Figure CN119480677A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a wafer wet processing and cleaning system and method. Background Art
[0002] In the current three-dimensional integrated circuit (3D-IC) packaging technology field, there are stacked chips on the surface of a wafer, thereby forming a wafer surface with a complex structure.
[0003] Although the conventional wet bench multi-tank can successfully achieve high throughput etching cleaning when performing etching cleaning process on general wafers, when cleaning the surface of a wafer with a special complex structure, such as the above-mentioned 3D-IC wafer 40, Figure 1 As shown, residues 42 are likely to be left between the surface structures 41. The residues 42 may be unwashed wafer particles or undried cleaning liquid.
[0004] When etching and cleaning the 3D-IC wafer 40, it will go through multiple processes. In the final deionized water cleaning (DI Rinse) and drying (Dry) process, using a Quick Dump Rinse (QDR) tank to batch clean wafers with complex structures, and using an isopropanol (IPA) tank to batch dry wafers with complex structures, may still not meet the requirements of effectively cleaning and drying these wafers. For example, the deionized water produced may not be able to completely clean and remove wafer particles, or the wafer may not be dried, resulting in water marks remaining.
[0005] Under such circumstances, only using conventional equipment for cleaning will not be able to achieve the required cleanliness. Therefore, a wafer wet processing and cleaning system and method are needed to solve the above conventional problems. Summary of the invention
[0006] Based on the above-mentioned purpose, the present disclosure provides a wafer wet processing and cleaning system, including a first flipping device, a conveying device, a plurality of wet processing tanks, a second flipping device, a moisturizing device and at least one single wafer processing device. The first flipping device can be used to flip the wafer carrier cassette 90 degrees along a first direction. The conveying device can be used to receive and move the wafer carrier cassette. A plurality of process liquids can be respectively arranged in a plurality of wet processing tanks, and the conveying device sequentially immerses at least one wafer carried by the wafer carrier cassette in a plurality of wet processing tanks. The conveying device can selectively move the wafer carrier cassette to a second flipping device, and the second flipping device flips the wafer carrier cassette 90 degrees along a second direction opposite to the first direction. The moisturizing device can be arranged on the second flipping device to provide moisturizing liquid to the second flipping device. The wafer in the wafer carrier cassette after flipping by the second flipping device is placed in the single wafer processing device.
[0007] Preferably, the conveying device comprises a carrying mechanism, a translation mechanism and a lifting mechanism. The carrying mechanism is used to receive and carry the wafer carrier. The translation mechanism is connected to the carrying mechanism and is used to drive the carrying mechanism to move in the horizontal direction. The lifting mechanism is connected to the translation mechanism and is used to drive the carrying mechanism to move in the vertical direction.
[0008] Preferably, the wafer wet processing and cleaning system disclosed herein further comprises a first horizontal conveying device, which takes wafers in a horizontal state from the wafer loading and unloading area of the wafer wet processing and cleaning system to the wafer carrier cassette.
[0009] Preferably, the wafer wet processing and cleaning system disclosed herein also includes a second horizontal conveying device. After the second flipping device flips the wafer carrier cassette 90 degrees along the second direction, the second horizontal conveying device takes the wafer in a horizontal state from the wafer loading and unloading area to the single wafer processing device.
[0010] Preferably, the single wafer processing device comprises a rotating table and a liquid supply device. The rotating table can be used to place the wafer. The liquid supply device is arranged above the rotating table and is used to apply at least one processing liquid to the wafer.
[0011] Preferably, the processing liquid includes deionized water or etching solution.
[0012] Preferably, the plurality of process liquids include one or more of an etching solution, a desiccant, and deionized water.
[0013] Preferably, different plurality of process liquids are respectively disposed in different plurality of wet processing tanks.
[0014] Preferably, the wafer wet processing and cleaning system disclosed herein further comprises at least one drying tank, and the wafer carrier cassette can be selectively transferred to the drying tank by the transfer device.
[0015] Based on the above objectives, the present disclosure further provides a wafer wet processing and cleaning method, which includes the following steps:
[0016] Taking at least one wafer to a wafer carrier cassette disposed on a first flipping device;
[0017] Using a first flipping device to flip the wafer carrier cassette 90 degrees along a first direction;
[0018] A conveying device is used to receive and move the wafer carrier cassette to a plurality of wet processing tanks, wherein a plurality of process liquids are respectively disposed in the plurality of wet processing tanks;
[0019] Using a conveying device to sequentially immerse the wafers carried by the wafer carrier cassette in the plurality of wet processing tanks;
[0020] The wafer carrier cassette can be selectively moved to the second turning device by using the conveying device;
[0021] The wafer carrier cassette is flipped 90 degrees along a second direction opposite to the first direction by a second flipping device.
[0022] Using a moisturizing device disposed on the second flipping device to provide moisturizing liquid to the second flipping device so that the wafer remains moistened; and
[0023] The wafer in the wafer carrier cassette flipped by the second flipping device is placed on the single wafer processing device.
[0024] Preferably, the wafer wet processing and cleaning method disclosed herein further comprises: applying at least one processing liquid to the wafer by a liquid supply device of the single wafer processing apparatus; and rotating the wafer by a rotating table of the single wafer processing apparatus.
[0025] Preferably, the wafer wet processing and cleaning method disclosed herein further comprises: providing at least one drying tank; and using a conveying device to convey the wafer carrier cassette to the drying tank or the second turning device.
[0026] The present disclosure provides a wafer wet processing and cleaning system and method, which can prevent deionized water from failing to completely clean and remove wafer particles, or wafers from not drying and resulting in water marks remaining. In the present disclosure, a wet bench (WetBench) device, a single wafer processing device, and a wafer carrier cassette flipping device are integrated with each other. Therefore, after the wafer undergoes batch immersion etching or a cleaning tank process, it can take advantage of the advantages of a single wafer processing device for subsequent processing, such as spraying deionized water to clean the wafer surface, high-speed rotation to dry the wafer, etc. Therefore, the above-mentioned problem that the use of QDR tank body cleaning and the use of IPA tank body drying cannot achieve effective cleaning and drying of complex structure wafers is solved. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Non-limiting examples of the embodiments disclosed herein are described below with reference to the drawings listed after this paragraph.Description The drawings and the description are intended to illustrate and clarify the embodiments disclosed herein and should not be considered limiting in any way.
[0028] Figure 1 FIG. 1 is a schematic diagram of a 3D-IC wafer after cleaning in the conventional technology.
[0029] Figure 2 is a schematic diagram of a wafer wet processing and cleaning system according to an embodiment of the present disclosure.
[0030] Figure 3 It is a schematic diagram of a horizontal transfer device according to an embodiment of the present disclosure.
[0031] Figure 4A It is a first schematic diagram of a flip device according to an embodiment of the present disclosure.
[0032] Figure 4B It is a second schematic diagram of the flipping device according to the embodiment of the present disclosure.
[0033] Figure 5 It is a schematic diagram of a conveying device according to an embodiment of the present disclosure.
[0034] Figure 6 It is a schematic diagram of an implementation of a wafer wet processing and cleaning system according to an embodiment of the present disclosure.
[0035] Figure 7 It is a second schematic diagram of the flipping device according to the embodiment of the present disclosure.
[0036] Figure 8 is a schematic diagram of a single wafer processing device according to an embodiment of the present disclosure. DETAILED DESCRIPTION
[0037] In order to help the examiner understand the technical features, contents and advantages of the present disclosure and the effects that can be achieved, the present disclosure is hereby described in detail in the form of embodiments in conjunction with the accompanying drawings. The drawings used therein are only for illustration and auxiliary explanation purposes and may not be the actual proportions and precise configurations after the implementation of the present disclosure. Therefore, the proportions and configurations of the attached drawings should not be interpreted to limit the scope of rights of the present disclosure in actual implementation. This should be stated in advance.
[0038] The following will describe embodiments of the present disclosure with reference to the relevant drawings. To facilitate understanding, the same elements in the following embodiments are labeled with the same symbols.
[0039] like Figure 2 and Figure 3As shown, the wafer wet processing and cleaning system 10 may include a first turning device 101, a conveying device 102, a plurality of wet processing tanks 103, a second turning device 104, at least one single wafer processing device 106, a first horizontal conveying device 107 and a wafer loading and unloading area 109.
[0040] Further, in the present disclosure, in one embodiment, the first horizontal transfer device 107 can first take the wafer 30 from the front opening unified pod (FOUP) through the wafer loading / unloading port 109 and transfer it to the first flipping device 101. After the wafer 30 is placed in the first flipping device 101, Figure 4A and Figure 4B As shown, the first flipping device 101 flips the wafer carrier cassette 20 to turn the wafer 30 from a horizontal orientation to a vertical orientation.
[0041] At this time, if Figures 5 and 6 As shown, the conveyor 102 will take the wafer cassette 20 containing the wafer 30, transfer the wafer cassette 20 to the wet processing tank 103, and immerse the wafer 30 in the wet processing tank 103. Then, according to the process settings, such as the order and time of immersing the wafer cassette in the wet processing tank 103 with different process liquids, continuous processes such as batch immersion etching and cleaning of the wafer 30 are performed.
[0042] Further explanation, such as Figure 3 As shown, the first horizontal transfer device 107 may include a first telescopic arm 1071 and a first receiving portion 1072. The first receiving portion 1072 has a component that can attract or clamp the wafer 30, such as a clamping claw, a suction cup, an air extraction hole, etc., to clamp or attract the wafer 3. In one embodiment, the first horizontal transfer device 107 takes the wafer 30 in a horizontal state from the wafer loading and unloading area 109 of the wafer 30 wet processing and cleaning system 10 to the wafer carrier cassette 20.
[0043] In one embodiment, if Figure 4A and Figure 4B As shown, in one embodiment, the first flipping device 101 may include a base 1011, a support frame 1012, a flipping frame 1013, a flipping power unit 1014, a limiting component 1015, a limiting power unit 1016 and a driving element 1017. The first flipping device 101 can be used to flip the crystal carrier cassette 20 90 degrees along a first direction (for example, clockwise).
[0044] In a preferred embodiment, the flip frame 1013 is rotatably arranged on the two support frames 1012, and the flip power unit 1014 is arranged on one of the support frames 1012 and connected to the flip frame 1013, and is used to rotate the flip frame 1013 so that the flip frame 1013 is in a vertical state or a horizontal state. The flip power unit 1014 can be a motor, such as a stepping motor, a servo motor, etc. The motor has a rotatable shaft, which is fixed to the flip frame 1013 to drive the flip frame 1013 to rotate.
[0045] In addition, the limiting members 1015 may be pivoted on two opposite sides of the wafer carrier cassette 20, and used to pivot to a limiting position or a release position. The limiting members 1015 may be close to the center of the wafer carrier cassette 20 in the limiting position, wherein when the limiting members 1015 are pivoted to the limiting position, the distance between the two limiting members 1015 will be less than the width of the wafer carrier cassette 20. When the two limiting members 1015 are pivoted to the release position, the distance between the two limiting members 1015 will be equal to or greater than the width of the wafer carrier cassette 20. The width generally refers to the width of the widest part of the wafer carrier cassette 20.
[0046] Further description, in a preferred embodiment, if Figure 4A and Figure 4B As shown, each limiting member 1015 may include a limiting cross bar, and the wafer 30 may be placed in the wafer carrier slot 201 of the wafer carrier cassette 20. The length of the limiting cross bar may be equal to or greater than the total length of all the wafer carrier slots 201 in the side-by-side direction, thereby ensuring that the limiting cross bar can simultaneously abut against the edges of all wafers 30 in the wafer carrier cassette 20 to fix the position of the wafer 30.
[0047] To further illustrate, the driving element 1017 can be connected to the limiting power unit 1016 so that the corresponding limiting component 1015 can be driven by the limiting power unit 1016 to pivot from the limiting position to the release position, or can be driven by the limiting power unit 1016 to pivot the corresponding limiting component 1015 from the release position to the limiting position.
[0048] In one embodiment, the conveying device 102 may include a carrying mechanism 1021, a translation mechanism 1022, and a lifting mechanism 1023, and is used to receive and carry the wafer carrier 20. To further explain, the translation mechanism 1022 is connected to the carrying mechanism 1021 to drive the carrying mechanism 1021 to move in the horizontal direction, and the lifting mechanism 1023 is connected to the translation mechanism 1022 to drive the carrying mechanism 1021 to move in the vertical direction to receive and move the wafer carrier 20.
[0049] like Figures 5 and 6As shown, the carrier mechanism 1021 can be driven by the translation mechanism 1022 and the lifting mechanism 1023 to the receiving position to prepare to receive the wafer carrier cassette 20 that has been flipped by the first flipping device 101. At this time, the wafers 30 in the wafer carrier cassette 20 are in a vertical state, so that each wafer 30 in the wafer carrier cassette 20 can be evenly soaked by the process solution in the wet processing tank 103.
[0050] In one embodiment, the translation mechanism 1022 and the lifting mechanism 1023 may include one or more of a stepper motor, a servo motor, gears, a linear slide rail, a pneumatic cylinder, and a hydraulic cylinder; in addition, the supporting mechanism 1021 may include one or more of joining elements such as hooks, suction cups, magnetic devices, and latches, so that the supporting mechanism 1021 can remove the crystal carrier 20 from the first flipping device 101 and perform subsequent processes.
[0051] To further illustrate, the plurality of process liquids are respectively disposed in the plurality of wet processing tanks 103, and the conveying device 102 sequentially immerses at least one wafer 30 carried by the wafer carrier cassette 20, for example, any number of wafers 30 ranging from one to twenty-five, in the plurality of wet processing tanks 103. In one embodiment, the plurality of process liquids may include one or more of an etching solution, a desiccant, and deionized water, and the number of the wet processing tanks 103 may be set according to requirements.
[0052] In one embodiment, different process liquids such as etching solution, deionized water, desiccant, etc. can be respectively set in different wet processing tanks 103, for example, the etching solution is set in the first wet processing tank 103, the deionized water is set in the second wet processing tank 103, and the desiccant is set in the third wet processing tank 103, and the wafer 30 can be immersed in the first to third wet processing tanks 103 in sequence.
[0053] Further, the etching solution may be a sulfuric acid solution, a hydrochloric acid solution, a hydrofluoric acid solution, an ammonia solution, an ammonia hydroxide solution, a silicon dioxide etching solution or other cleaning chemicals. If more than two etching solutions are selected, it is not limited to using only the above three wet processing tanks 103. For example, there may be two wet processing tanks 103 containing different etching solutions and wet processing tanks 103 containing deionized water and a desiccant respectively. In addition, the desiccant may be isopropyl alcohol (IPA), but is not limited thereto.
[0054] In addition, in one embodiment, the wafer wet processing and cleaning system 10 may further include a drying tank 110. Therefore, for some wafers 30 suitable for soaking in desiccant, they can also be dried in the drying tank 110 after soaking in deionized water. The drying tank 110 can dry the wafers 30 in batches by various dry methods such as heating and applying dry air. Therefore, in this embodiment, the wafer carrier 20 can be selectively transferred to the drying tank 110 by the transfer device 102 according to the type of wafer 30.
[0055] In one embodiment, in addition to the above-mentioned cleaning of a whole batch of wafers 30, the above-mentioned method cannot meet the cleaning or drying requirements for wafers 30 with complex structures or wafers 30 that are not suitable for batch drying methods such as IPA. Therefore, such wafers 30 can be soaked in deionized water according to the needs, and the conveying device 102 can selectively move the wafer carrier cassette 20 to the second flipping device 104. Then, the second flipping device 104 flips the wafer carrier cassette 20 90 degrees along the second direction opposite to the first direction (e.g., counterclockwise direction), and the wafer 30 is in a horizontal state.
[0056] It is worth mentioning that Figure 7 As shown, in order to prevent the wafer 30 from drying out during subsequent cleaning, resulting in water marks or other subsequent difficult cleaning situations, the wafer wet processing and cleaning system 10 may also include a moisturizing device 105. The moisturizing device 105 may be disposed on the second flipping device 104 to provide a moisturizing liquid, such as deionized water, to the second flipping device 104. Therefore, in one embodiment, the moisturizing device 105 may allow deionized water to be contained in the second flipping device 104 to soak the wafer 30, so as to prevent the wafer 30 from drying out and leaving water marks that are difficult to remove. In one embodiment, the moisturizing device 105 may include one or more of a water supply pipe, a spray unit, and a water mist generating unit.
[0057] In one embodiment, the wafer wet processing and cleaning system 10 may further include a drainage device 111 to drain the deionized water provided by the moisturizing device 105. The drainage device 111 may include one or more of a drainage hole and a pumping unit. For example, when the second flip device 104 does not need deionized water, the drainage device 111 may drain the deionized water so that the wafers 30 in the wafer carrier cassette 20 can be processed for the next process.
[0058] In addition, the drainage device 111 may also include a drying unit to dry the second flipping device 104 according to the process requirements or settings. For example, if the wafers 30 do not need to be transferred to the single wafer processing device 106 for subsequent cleaning, and have been cleaned and dried, they can be transferred to the drying second flipping device 104, or transferred to the first flipping device 101 for flipping and then transferred to the wafer loading and unloading area 109.
[0059] For the wafer 30 with a complex structure, the wafer 30 in the wafer cassette 20 can be placed in the single wafer processing device 106 after the wafer cassette 20 is flipped by the second flipping device 104 for the subsequent cleaning and drying process. In one embodiment, the wafer wet processing and cleaning system 10 may further include a second horizontal transfer device 108. After the second flipping device 104 flips the wafer cassette 20 90 degrees along the second direction, the second horizontal transfer device 108 takes the wafer 30 in a horizontal state from the wafer loading and unloading area 109 to the single wafer processing device 106.
[0060] Further explanation, such as Figure 3 As shown, in one embodiment, the first horizontal conveyor 107 and the second horizontal conveyor 108 can be dual-finger type robotic arms. In addition, the first horizontal conveyor 107 and the second horizontal conveyor 108 can be integrated into the same device to save space, but the present invention is not limited thereto. For example, in other embodiments, the first horizontal conveyor 107 and the second horizontal conveyor 108 can be separately provided so that the first horizontal conveyor 107 is independent of the second horizontal conveyor 108.
[0061] like Figure 6 As shown, the second horizontal transfer device 108 may include a second telescopic arm 1081 and a second receiving portion 1082. The second receiving portion 1082 has an element that can attract or clamp the wafer 30, such as a clamp, a suction cup, an air extraction hole, etc., to clamp or attract the wafer 30. In one embodiment, the second horizontal transfer device 108 takes the wafer 30 in a horizontal state from the wafer carrier cassette 20 of the second flip device 104 of the wafer 30 wet processing and cleaning system 10 to the single wafer processing device 106. However, this is not limited to this. Under appropriate configuration, for example, when the cleanliness and dryness of the first horizontal transfer device 107 are ensured, the first horizontal transfer device 107 can also be used to take the wafer 30 in a horizontal state to the single wafer processing device 106, and the second horizontal transfer device 108 can be omitted.
[0062] In one embodiment, when the wafer 30 is taken out from the second flipping device 104, the operation flow can be as follows. First, the second flipping device 104 has substantially the same structure and components as the first flipping device 101, which can be referred to in the related Figure 4A , Figure 4BThe above description is not repeated here. After the wafer carrier cassette 20 is turned over, the wafer carrier cassette 20 is turned from a vertical state to a horizontal state. Subsequently, the limiting power unit 1014 (pneumatic cylinder) is used to make the driving element 1017 (pushing element) push the limiting components 1015 located on both sides of the wafer carrier cassette 20, thereby making the limiting components 1015 leave the wafer 30. At this time, the limiting components 1015 return to the release position so that the wafer 30 is no longer constrained. Then, the second horizontal transfer device 108 is used to take out the wafer 30 in the wafer carrier cassette 20 and transfer the wafer 30 in a horizontal state to the single wafer processing device 106.
[0063] In one embodiment, if Figure 8 As shown, the single wafer processing device 106 may include a rotating table 1061, a liquid supply device 1062 and a rotating shaft 1063. The rotating table 1061 is used to place the wafer 30, and the liquid supply device 1062 is disposed above the rotating table 1061 to apply at least one processing liquid to the wafer 30. In one embodiment, the processing liquid may include deionized water, etching liquid or other chemical agents to further clean the wafer 30 or perform other processes.
[0064] After cleaning, the rotating shaft 1063 can be used to drive the rotating table 1061 to rotate the wafer 30 placed on the rotating table 1061 at high speed. The wafer 30 after high-speed spin drying can be transferred to the wafer loading and unloading area 109 by a horizontal single wafer robot, such as the first horizontal transfer device 107, the second horizontal transfer device 108 or other similar transfer devices.
[0065] In summary, the wafer wet processing and cleaning method disclosed herein may include the following steps:
[0066] Taking at least one wafer 30 to the wafer carrier cassette 20 disposed in the first flip device 101, for example, taking the wafer 30 in a horizontal state from the wafer loading and unloading area 109 of the wafer 30 wet processing and cleaning system 10 to the wafer carrier cassette 20 by the first horizontal conveyor 107;
[0067] The wafer carrier cassette 20 is flipped 90 degrees along a first direction by the first flipping device 101;
[0068] The wafer carrier cassette 20 is received and moved to the top of the wet processing tank 103 by the conveying device 102. A plurality of process liquids are respectively disposed in the plurality of wet processing tanks 103. In addition, different process liquids are respectively disposed in different wet processing tanks 103.
[0069] The wafer 30 carried by the wafer carrier cassette 20 is sequentially immersed in a plurality of wet treatment tanks 103 by the conveying device 102;
[0070] The wafer carrier cassette 20 can be selectively moved to the second turning device 104 by using the conveying device 102;
[0071] The wafer carrier cassette 20 is flipped 90 degrees along a second direction opposite to the first direction by a second flipping device 104;
[0072] Using the moisturizing device 105 disposed on the second flipping device 104 to provide moisturizing liquid to the second flipping device 104, the wafer 30 is kept moist; and
[0073] The wafer 30 in the wafer cassette 20 flipped by the second flipping device 104 is placed in the single wafer processing device 106 .
[0074] After the single wafer processing device 106 cleans the wafer 30, the rotating shaft 1063 can drive the rotating table 1061 to rotate the wafer 30 placed on the rotating table 1061 at a high speed. The wafer 30 after high-speed spin drying can be transferred to the wafer loading and unloading area 109 by a horizontal single wafer robot arm, such as the first horizontal transfer device 107, the second horizontal transfer device 108 or other similar transfer devices.
[0075] To further illustrate, the wafer wet processing and cleaning system 10 disclosed herein can process wafers 30 with various cleaning requirements. For example, for wafers 30 suitable for batch processing, these wafers 30 can be immersed in the wet processing tank 103 and transferred to the drying tank 110 or dried with the desiccant in the wet processing tank 103 as appropriate. After drying, the wafers can be turned back to a horizontal state by the first flipping device 101 or the second flipping device 104 in a dry state and transferred to the wafer loading and unloading area 109 for subsequent processes.
[0076] For wafers 30 with complex surface structures, such as wafers for three-dimensional integrated circuit (3D-IC) packaging, it is suitable to use a single wafer processing device 106 for subsequent cleaning and drying. In other words, the conveying device 102 can convey the wafer carrier 20 loaded with the wafer 30 to the appropriate position for processing at an appropriate time according to the process required by the wafer 30.
[0077] In this case, since the wet bench equipment (including the conveying device 102, the wet processing tank 103, etc.), the single wafer processing device 106, and the wafer carrier cassette flipping device are integrated with each other, the wafers that need to be processed by the single wafer processing device 106 can be processed and cleaned in the wafer wet processing and cleaning 10, which can increase the manufacturing efficiency of the product.
[0078] In addition, the present disclosure provides a wafer wet processing and cleaning system and method, which can prevent the deionized water from failing to completely clean and remove wafer particles, or the wafer from being not dried, resulting in water marks remaining. Therefore, after the wafer undergoes a batch immersion etching or cleaning tank process, the advantages of a single wafer processing device can be used for subsequent processing, such as spraying deionized water to clean the wafer surface, high-speed rotation to dry the wafer, etc. Therefore, the problem of being unable to effectively clean and dry complex structure wafers using a Quick Dump Rinse (QDR) tank and using an IPA tank for drying is solved.
[0079] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made thereto without departing from the spirit and scope of the present disclosure should be included in the claims.
Claims
1. A wafer wet processing and cleaning system, characterized in that: include: A first flipping device is used to flip the wafer carrier cassette 90 degrees along a first direction; A conveying device, used for receiving and moving the wafer carrier cassette; A plurality of wet processing tanks, a plurality of process liquids are respectively disposed in the plurality of wet processing tanks, and the conveying device sequentially immerses at least one wafer carried by the wafer carrier cassette in the plurality of wet processing tanks; A second flipping device, wherein the conveying device can selectively move the wafer carrier cassette to the second flipping device, and the second flipping device flips the wafer carrier cassette 90 degrees along a second direction opposite to the first direction; a moisturizing device, disposed on the second turning device, for providing moisturizing liquid to the second turning device; as well as At least one single wafer processing device, wherein the wafer in the wafer carrier cassette flipped by the second flipping device is placed in the single wafer processing device.
2. The wafer wet processing and cleaning system according to claim 1, characterized in that: The transmission device comprises: A carrying mechanism, used for receiving and carrying the wafer carrier; A translation mechanism, connected to the supporting mechanism, for driving the supporting mechanism to move in a horizontal direction; and The lifting mechanism is connected with the translation mechanism and is used to drive the bearing mechanism to move in a vertical direction.
3. The wafer wet processing and cleaning system according to claim 1, characterized in that: It also includes a first horizontal conveying device, which takes the wafer in a horizontal state from the wafer loading and unloading area of the wafer wet processing and cleaning system to the wafer carrier cassette.
4. The wafer wet processing and cleaning system as described in claim 3 further includes a second horizontal transfer device, and after the second flipping device flips the wafer carrier cassette 90 degrees along the second direction, the second horizontal transfer device takes the wafer in the horizontal state from the wafer carrier cassette to the single wafer processing device.
5. The wafer wet processing and cleaning system according to claim 1, characterized in that: The single wafer processing device comprises: a rotating table for placing the wafer; and A liquid supply device is arranged above the rotating table and is used for applying at least one processing liquid to the wafer.
6. The wafer wet processing and cleaning system as claimed in claim 5, wherein the processing liquid comprises deionized water or etching solution.
7. The wafer wet processing and cleaning system according to claim 1, characterized in that: The plurality of process liquids include one or more of an etching solution, a desiccant, and deionized water.
8. The wafer wet processing and cleaning system as claimed in claim 7, wherein different ones of the plurality of process liquids are respectively disposed in different ones of the plurality of wet processing tanks.
9. The wafer wet processing and cleaning system as described in claim 1, further comprising at least one drying tank, and the wafer carrier cassette can be selectively transferred to the drying tank by the transfer device.
10. A wafer wet processing and cleaning method, characterized in that: include: Taking at least one wafer to a wafer carrier cassette disposed on a first flipping device; Using the first flipping device to flip the wafer carrier cassette 90 degrees along a first direction; Using a conveying device to receive and move the wafer carrier cassette to a plurality of wet processing tanks, wherein a plurality of process liquids are respectively disposed in the plurality of wet processing tanks; Using the conveying device to sequentially immerse the wafers carried by the wafer carrier cassette in the plurality of wet processing tanks; The conveying device can selectively move the wafer carrier cassette to the second turning device; Using the second flipping device to flip the wafer carrier cassette 90 degrees along a second direction opposite to the first direction; Using a moisturizing device disposed on the second flipping device to provide moisturizing liquid to the second flipping device, the wafer is kept moist; as well as The wafer in the wafer carrier cassette flipped by the second flipping device is placed in a single wafer processing device.
11. The wafer wet processing and cleaning method according to claim 10, characterized in that: Also includes: Applying at least one processing liquid to the wafer by a liquid supply device of the single wafer processing device; as well as The wafer is rotated by a rotating table of the single wafer processing device.
12. The wafer wet processing and cleaning method according to claim 10, characterized in that: Also includes: providing at least one drying tank; as well as The wafer carrier cassette is transported to the drying tank or the second turning device by the transport device.