Semiconductor machine and wafer drying method

CN119480678APending Publication Date: 2025-02-18WUHAN CHUXING TECH CO LTD
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Patent Information

Application Number
CN202311014701.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-08-11
Publication Date
2025-02-18

AI Technical Summary

Technical Problem

During semiconductor manufacturing, when the wafer is transferred to the drying chamber after cleaning, the rod pusher is prone to push into the wafer cutout, resulting in abnormal wafer stations, which may form a watermark and risk of chip loss and breakage.

Method used

A semiconductor machine is designed, including a cleaning chamber, a drying chamber, an identification device, a transmission device, a rod pusher and a control device. The identification device is used to identify the position of the wafer cutout, the transmission device is fixedly transmitted to the drying chamber from the cleaning chamber, and the rod pusher includes at least four contact heads whose curved profile is the same as the wafer edge profile. , make sure that at least three contact heads contact the edge of the wafer and secure their position.

Benefits of technology

It effectively avoids the incision of the pole pusher into the wafer, reduces the risk of watermark formation and wafer drop and chips, and improves product quality.

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Abstract

According to the semiconductor machine table and the wafer drying method, the control device is electrically connected with the identification device, the transmission device and the ejector rod pusher, and control over the identification device, the transmission device and the ejector rod pusher is achieved. The identification device is located on the side wall of the cleaning cavity and used for identifying the position of the wafer notch and preventing the ejector rod pusher from being ejected into the notch. The transmission equipment is positioned between the cleaning chamber and the drying chamber and is used for fixedly transmitting the wafer from the cleaning chamber to the drying chamber; and keeping the wafer cut away from the ejector rod pusher to be conveyed to the drying chamber. The ejector rod pusher is located in the drying cavity and comprises at least four contact heads, and the curve contour formed by the top ends of the contact heads is the same as the edge contour of the wafer. Even if the ejector rod pusher is abraded and one contact head tends to be ejected into the notch, the other at least three contact heads are in contact with the edge of the wafer, so that the position of the wafer can be fixed, and the problem of wafer station deviation caused by the fact that the ejector rod pusher is ejected into the notch of the wafer is avoided.
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