Method of cleaning a substrate

Abstract

The invention relates to a method for cleaning a bottom plate, which comprises the following steps of: filling a liquid material between a bonding bottom plate and at least one soldering lug on the bonding bottom plate, covering the liquid material on a substance to be cleaned on the bonding bottom plate, placing the bonding bottom plate containing the liquid material in a cavity, controlling the temperature of the cavity to be between 25 and 200 DEG C, and cleaning the bonding bottom plate with the liquid material. A pressure increasing and reducing device and / or a vacuum generator are / is used for generating oscillation type pressure increasing and reducing and / or oscillation type vacuum pumping on the gas in the cavity, the change of the liquid material is caused by the differential pressure change of the gas, and the differential pressure change comprises the differential pressure change under vacuum, the differential pressure change from high pressure to 1 atmospheric pressure or the differential pressure change from high pressure to vacuum. And by utilizing the pressure difference change of the gas, the liquid material is rubbed and scrubbed by the pressure difference change, so that the to-be-cleaned substance attached to the following bottom plate is taken away from the following bottom plate.

Description

Technical Field

[0001] The present invention relates to the technical field of bottom plate cleaning, and in particular to a method for cleaning bottom plates, which improves the cleaning efficiency of residues by driving the liquid material to rub or stir by the pressure difference change of air flow with oscillating pressure increase and decrease. Background Art

[0002] According to the advanced semiconductor device manufacturing, adhesives are often used for bonding between materials. Especially when bonding metals, some adhesives usually have high acid content and are corrosive to remove the tight oxide layer formed on the bonding surface. However, the corrosive nature of this adhesive seriously affects the performance of microelectronic components. Therefore, a cleaning step must be performed to remove the adhesive remaining on the bonding surface or the reaction residues of the adhesive and metal oxide. Some adhesives will also leave some organic matter and leave a layer of grease on the bonding surface after use. Such grease must also be cleaned again to avoid subsequent reliability problems for semiconductor components. However, when the circuits on the substrate are getting denser or the protrusions on the substrate for bonding are getting smaller or the gap between the substrate and the solder pad is getting narrower, the above residues are becoming more and more difficult to clean. If the corrosive adhesives remaining on the substrate or the joint are not completely removed, the reliability of the components will be greatly reduced. In addition, if the above residues are cleaned in the current common way of using cleaning solvents, they will have an impact on the environment if not handled properly.

[0003] Therefore, in view of the above-mentioned problems existing in the cleaning of conventional advanced semiconductor components, how to develop a method for cleaning the bottom plate that is further ideal, practical and economical is what consumers are eagerly looking forward to, and it is also the goal and direction that related industries must work hard to develop breakthroughs.

[0004] In view of this, the inventor, based on his many years of experience in manufacturing, developing and designing related products, has designed and carefully evaluated the above-mentioned goals and finally obtained a truly practical present invention. Summary of the invention

[0005] The main purpose of the present invention is to provide a method for cleaning a base plate, which utilizes a liquid material to cover the base plate to be cleaned, places it in a chamber, increases the temperature and applies an oscillating pressure difference change of the air flow to drive the liquid material to rub or stir, thereby improving the cleaning efficiency of the residue.

[0006] To achieve the above-mentioned purpose, the present invention provides a method for cleaning a base plate, which comprises: welding at least one welding sheet to a bonding base plate, filling a liquid material between the bonding base plate and the welding sheet to cover the surface of the base plate to be cleaned; placing the bonding base plate containing the liquid material in a chamber, controlling the chamber temperature to between 25 and 200° C., using a high-pressure pressure increasing and reducing device and / or a low-pressure vacuum generator to generate an oscillating pressure increasing and reducing and / or oscillating vacuuming on the gas in the chamber to generate a pressure difference changing airflow, and utilizing the pressure difference change of the gas in the chamber to cause the liquid material to flow. The pressure difference changes to produce a wave-like pressure difference change friction and rubbing cleaning effect, or accelerate the dissolution of the material to be cleaned in the liquid material, such as adding sugar to water and applying stirring to accelerate the dissolution of sugar, and the pressure difference change includes the pressure difference change under vacuum, the pressure difference change from high pressure to 1 atmosphere, or the pressure difference change from high pressure to vacuum, and the pressure difference change of gas is used to cause the change of liquid material, so that the liquid material in contact with the material to be cleaned generates friction and rubbing due to the greater energy brought by the pressure difference change, and the material to be cleaned attached to the connecting bottom plate is taken away from the connecting bottom plate and the liquid material. In addition, controlling the chamber temperature in the above-mentioned chamber to between 25 and 200°C will also cause the above-mentioned grease film or part of the material to be cleaned or the water vapor adsorbed inside the connecting bottom plate to volatilize and generate gas due to heat, and using the above-mentioned pressure difference change under vacuum, the pressure difference change from high pressure to 1 atmosphere, or the pressure difference change from high pressure to vacuum, the pressure difference change of gas is used to cause the change of liquid material, and the multiple gases can also be discharged from the liquid material.

[0007] With regard to the technology, means and effects adopted by the present invention, a preferred embodiment is given herewith and described in detail with reference to the drawings. It is believed that the above-mentioned purpose, structure and features of the present invention can be understood in depth and concretely therefrom. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] [ Figure 1 ] is a method flow chart of one embodiment of the present invention.

[0009] [ Figure 2 ] is a method flow chart of another embodiment of the present invention.

[0010] [ Figure 3 ] is a method flow chart of another embodiment of the present invention.

[0011] [ Figure 4 ] is a method flow chart of another embodiment of the present invention.

[0012] Among them: 10a: welding welding piece; 20a: covering liquid material; 30a: placing in chamber; 40a: controlling chamber temperature; 50a: oscillating pressure difference change cleaning; 10b: welding welding piece; 20b: covering liquid material; 30b: placing in chamber; 40b: controlling chamber temperature; 50b: oscillating pressure difference change cleaning; 10c: welding welding piece; 20c: covering liquid material; 30c: placing in chamber; 40c: controlling chamber temperature; 50c: oscillating pressure difference change cleaning; 10d: welding welding piece; 20d: covering liquid material; 30d: placing in chamber; 40d: controlling chamber temperature; 50d: physical dissolution cleaning. DETAILED DESCRIPTION

[0013] The present invention provides a method for cleaning a base plate.

[0014] In order to enable you, the examiner, to have a further understanding and recognition of the purpose, features and effects of the present invention, the following detailed description is made in conjunction with the implementation methods and drawings:

[0015] See also Figure 1 As shown, the present invention provides a method for cleaning a base plate, the steps of which include:

[0016] (a) Welding welding sheet 10a: welding at least one welding sheet to a bonding substrate;

[0017] (b) Covering liquid material 20a: filling a liquid material between the bonding substrate and at least one of the solder sheets to cover a substance to be cleaned on the bonding substrate;

[0018] (c) placing in a chamber 30a: placing the substrate containing the liquid material in a chamber;

[0019] (d) Controlling the chamber temperature 40a: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature may be in accordance with the viscosity of the liquid material and be between 25° C. and 200° C., so as to increase the fluidity of the liquid material;

[0020] (e) Oscillating pressure change cleaning 50a: A vacuum generator is used to generate an oscillating low pressure control on the gas in the chamber, so that the gas molecules in the chamber produce a pressure change airflow, which is a pressure change under low pressure, ranging from a maximum value of no more than 1 atmosphere to a minimum value of 10 -5An oscillating pressure difference change is performed between the atmospheric pressure, and the vacuum generator is used to perform oscillating vacuum suction and release on the low-pressure gas in the chamber, thereby causing the gas change to cause the change of the liquid material. The liquid material existing in at least one of the welding sheets and the bonding base plate can be pulled by the capillary force between them and the surface tension of the liquid material so that the liquid material will not overflow even if a larger change is produced, and the liquid material in contact with the material to be cleaned will be rubbed and scrubbed by the friction caused by the greater energy generated by the pressure difference change, and the material to be cleaned attached to the bonding base plate will be more effectively removed from the bonding base plate and the liquid material, achieving an effect that traditional solution cleaning cannot achieve. The liquid material is pulled to change by the pressure difference change of the gas, which can reduce the direct energy transfer and reduce the damage to the object or the splashing of the liquid material caused by excessive changes.

[0021] In the method for cleaning a substrate, the substance to be cleaned may be soldering flux, soldering flux residue, oil ester, photoresist or products generated during the manufacturing process.

[0022] The method for cleaning the bottom plate, wherein the liquid material may be a base glue, and the base glue may contain hard particles. The hard particles roll as the base glue changes, and the friction and scrubbing effect is increased by the hard particles, thereby helping to clean the substances to be removed.

[0023] See also Figure 2 As shown, the present invention provides another method for cleaning a base plate, the steps of which include:

[0024] (a) Welding welding sheet 10b: welding at least one welding sheet to a bonding substrate;

[0025] (b) Covering liquid material 20b: filling a liquid material between the bonding substrate and at least one of the solder sheets to cover a substance to be cleaned on the bonding substrate;

[0026] (c) placing in a chamber 30b: placing the substrate containing the liquid material in a chamber;

[0027] (d) Controlling the chamber temperature 40b: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is in accordance with the viscosity of the liquid material and is between 25° C. and 200° C., so as to increase the fluidity of the liquid material;

[0028] (e) Oscillating pressure difference cleaning 50b: A pressure increasing and decreasing device and a vacuum generator are used to generate an oscillating high pressure pressure increasing and decreasing and an oscillating low pressure vacuuming on the gas in the chamber, so that the gas molecules in the chamber generate a pressure difference changing airflow, which is the pressure difference change of the gas molecules generated by the oscillating high pressure of the pressure increasing and decreasing device and the oscillating low pressure of the vacuum generator, ranging from a maximum of 50 atmospheres to a minimum of 10 -5 An oscillating pressure difference change is carried out between the atmospheric pressure, and the high pressure of the pressure increasing and reducing device and the low pressure of the vacuum generator are used to cause the pressure difference change of the gas molecules to cause the change of the liquid material. The liquid material existing in at least one of the welding sheets and the bonding substrate can be pulled by the capillary force between them and the surface tension of the liquid material so that the liquid material will not overflow even if a larger change is produced. The liquid material in contact with the material to be cleaned will be rubbed and scrubbed by the friction caused by the greater energy generated by the pressure difference change, and the material to be cleaned attached to the bonding substrate and the liquid material will be more effectively removed from the bonding substrate and the liquid material, achieving an effect that traditional solution cleaning cannot achieve. The liquid material is pulled to change by the pressure difference change of the gas, which can reduce the direct energy transfer and reduce the damage to the object or the splashing of the liquid material caused by excessive changes.

[0029] In the method for cleaning a substrate, the substance to be cleaned may be soldering flux, soldering flux residue, oil ester, photoresist or products generated during the manufacturing process.

[0030] The method for cleaning the bottom plate, wherein the liquid material may be a base glue, and the base glue may contain hard particles. The hard particles roll as the base glue changes, and the friction and scrubbing effect is increased by the hard particles, thereby helping to clean the substances to be removed.

[0031] See also Figure 3 As shown, the present invention provides another method for cleaning a base plate, the steps of which include:

[0032] (a) Welding welding sheet 10c: welding at least one welding sheet to a bonding substrate;

[0033] (b) Covering liquid material 20c: filling a liquid material between the bonding substrate and at least one of the soldering sheets to cover a substance to be cleaned on the bonding substrate;

[0034] (c) placing in a chamber 30c: placing the substrate containing the liquid material in a chamber;

[0035] (d) Controlling the chamber temperature 40c: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is in accordance with the viscosity of the liquid material and is between 25° C. and 200° C., so as to increase the fluidity of the liquid material;

[0036] (e) Oscillating pressure difference change cleaning 50c: An increasing / decreasing pressure device is used to produce an oscillating pressure increase / decrease on the gas in the chamber, so that the gas molecules in the chamber produce a pressure difference change airflow, which is a pressure difference change from high pressure to 1 atmosphere, and the range is between a maximum of 50 atmospheres and a minimum of 1 atmosphere for oscillating pressure difference change. The increasing / decreasing pressure device is used to produce an oscillating pressure difference change on the high pressure gas to cause the liquid material to change. The liquid material present in at least one of the welding sheets and the bonding substrate can be pulled by the capillary force between them and the surface tension of the liquid material so that the liquid material will not overflow even when a larger change occurs. The liquid material in contact with the material to be cleaned is rubbed and scrubbed by the friction caused by the greater energy generated by the pressure difference change, and the material to be cleaned attached to the bonding substrate and the liquid material is more effectively removed from the bonding substrate and the liquid material, achieving an effect that cannot be achieved by traditional solution cleaning. The liquid material is pulled to change by the pressure difference change of the gas, which can reduce the direct energy transfer and reduce the damage to the object or the splashing of the liquid material caused by excessive change.

[0037] In the method for cleaning a substrate, the substance to be cleaned may be soldering flux, soldering flux residue, oil ester, photoresist or products generated during the manufacturing process.

[0038] The method for cleaning the bottom plate, wherein the liquid material may be a base glue, and the base glue may contain hard particles. The hard particles roll as the base glue changes, and the friction and scrubbing effect is increased by the hard particles, thereby helping to clean the substances to be removed.

[0039] See also Figure 4 As shown, the present invention provides a method for cleaning a base plate, the steps of which include:

[0040] (a) Welding welding sheet 10d: Welding at least one welding sheet to a bonding substrate;

[0041] (b) Covering liquid material 20d: filling a liquid material between the bonding substrate and at least one of the soldering sheets to cover a substance to be cleaned on the bonding substrate;

[0042] (c) placing in a chamber 30d: placing the substrate containing the liquid material in a chamber;

[0043] (d) Controlling the chamber temperature 40d: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature may be in accordance with the viscosity of the liquid material and be between 25° C. and 200° C., so as to increase the fluidity of the liquid material;

[0044] (e) Physical dissolution cleaning 50d: A booster device is used to generate a predetermined air pressure in the chamber within a range of at least a maximum of 50 atmospheres to a minimum of 1 atmosphere, and the physical dissolution generated by the contact between the filled liquid material and the substance to be cleaned is used to dissolve the substance to be cleaned attached to the substrate in the liquid material, and the diffusion force generated by the predetermined temperature and the concentration gradient after dissolution is used to remove the substance to be cleaned attached to the substrate from the substrate and the liquid material, thereby achieving an effect that cannot be achieved by traditional solution cleaning.

[0045] In the method for cleaning a substrate, the substance to be cleaned may be soldering flux, soldering flux residue, oil ester, photoresist or products generated during the manufacturing process.

[0046] The present invention places the bonding substrate containing the substance to be cleaned in a chamber, covers it with a liquid material, and uses the pressure difference change of the gas to cause the change of the liquid material, so that the liquid material in contact with the substance to be cleaned generates greater energy through the pressure difference change to cause friction and scrubbing, and removes the substance to be cleaned attached to the bonding substrate and the liquid material, achieving an effect that traditional solution cleaning cannot achieve. In addition, the pressurized environment increases the number of gas molecules, increases the gas density, increases the flow viscosity of the gas, and increases the internal pressure of the liquid material, which can make the cleaning effect of the substance better, and can also slow down the shock wave injected into the gas, or the gravitational wave extracted from the gas, reducing adverse effects.

[0047] From the above, it can be seen that the method for cleaning the substrate of the present invention is indeed the first in the industry and meets the novelty requirements of the invention patent, and its comprehensive innovative design meets the advancement requirements of the invention patent. It uses liquid material to fill the space between the soldering sheet and the substrate and covers the material to be cleaned on the substrate, and is placed in a chamber. The surface tension of the liquid material itself and the capillary force between the substrate and the soldering sheet on the substrate are used to increase the temperature and apply oscillating pressure increase and decrease or oscillating vacuum air flow pressure difference changes to drive the liquid material to rub or stir, thereby improving the residue cleaning efficiency, which meets better industrial applicability.

[0048] The foregoing is a specific description of the technical features of the present invention with respect to the preferred embodiments of the present invention; however, persons familiar with this technology may make changes and modifications to the present invention without departing from the spirit and principles of the present invention, and the multiple changes and modifications should all be included in the scope defined by the following patent application scope.

[0049] In summary, the present invention provides a method for cleaning a base plate, which has indeed achieved all the purposes of the present invention. In addition, the spatial form of its combined structure has not been seen in similar products and has not been disclosed before the application. It complies with the provisions of the Patent Law, and the application is filed in accordance with the law.

Claims

1. A method for cleaning a base plate, characterized in that the steps include: (a) Welding welding sheet: welding at least one welding sheet to a bonding substrate; (b) Covering with liquid material: filling a liquid material between the bonding substrate and at least one of the soldering sheets to cover a substance to be cleaned on the bonding substrate; (c) placing in a chamber: placing the bonding substrate containing the liquid material in a chamber; (d) controlling the chamber temperature: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is in accordance with the viscosity of the liquid material and is between 25° C. and 200° C.; (e) Oscillating pressure change cleaning: A vacuum generator is used to generate an oscillating low pressure control on the gas in the chamber, so that the gas molecules in the chamber produce a pressure change airflow, which is a pressure change under low pressure, ranging from a maximum value of no more than 1 atmosphere to a minimum value of 10 -5 The pressure difference between the atmosphere and the pressure is changed in an oscillating manner, and the low-pressure change of the gas vacuum suction and release force causes the change of the liquid material, so that the liquid material in contact with the material to be cleaned is rubbed and scrubbed by the pressure difference change, and the material to be cleaned attached to the bonding bottom plate is removed from the bonding bottom plate and the liquid material.

2. The method for cleaning a base plate according to claim 1, characterized in that: The substances to be cleaned may be soldering flux, soldering flux residue, oil ester, photoresist or products generated during the manufacturing process.

3. The method for cleaning a base plate according to claim 1, characterized in that: The liquid material may be a base glue, and the base glue may contain hard particles. The hard particles roll as the base glue changes, thereby increasing the friction and scrubbing effect.

4. A method for cleaning a base plate, characterized in that the steps include: (a) Welding welding sheet: welding at least one welding sheet to a bonding substrate; (b) Covering with liquid material: filling a liquid material between the bonding substrate and at least one of the soldering sheets to cover a substance to be cleaned on the bonding substrate; (c) placing in a chamber: placing the bonding substrate containing the liquid material in a chamber; (d) controlling the chamber temperature: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is in accordance with the viscosity of the liquid material and is between 25° C. and 200° C.; (e) Oscillating pressure difference cleaning: A pressure increase / decrease device and a vacuum generator are used to generate an oscillating high pressure pressure increase / decrease and an oscillating low pressure vacuum to the gas in the chamber, so that the gas molecules in the chamber generate a pressure difference change airflow, which is an oscillating pressure difference change of gas molecules between the oscillating high pressure and the oscillating low pressure, ranging from a maximum of 50 atmospheres to a minimum of 10 -5 An oscillating pressure difference change is performed between the atmospheric pressure, and the high pressure of the pressure increasing and reducing device and the low pressure of the vacuum generator are used to perform an oscillating pressure difference change of gas molecules to cause the change of the liquid material, so that the liquid material in contact with the material to be cleaned is rubbed and scrubbed by the pressure difference change, and the material to be cleaned attached to the bonding base is removed from the bonding base and the liquid material.

5. The method for cleaning a base plate according to claim 4, characterized in that: The substances to be cleaned may be soldering flux, soldering flux residue, oil ester, photoresist or products generated during the manufacturing process.

6. The method for cleaning a base plate according to claim 4, characterized in that: The liquid material may be a base glue, and the base glue may contain hard particles. The hard particles roll as the base glue changes, thereby increasing the friction and scrubbing effect.

7. A method for cleaning a base plate, characterized in that the steps include: (a) Welding welding sheet: welding at least one welding sheet to a bonding substrate; (b) Covering with liquid material: filling a liquid material between the bonding substrate and at least one of the soldering sheets to cover a substance to be cleaned on the bonding substrate; (c) placing in a chamber: placing the bonding substrate containing the liquid material in a chamber; (d) controlling the chamber temperature: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is in accordance with the viscosity of the liquid material and is between 25° C. and 200° C.; (e) Oscillating pressure difference cleaning: An increasing / decreasing pressure device is used to produce an oscillating pressure increase / decrease in pressure in the chamber, so that the gas molecules in the chamber produce a pressure difference changing airflow, which is a pressure difference change from high pressure to 1 atmosphere, and the range is between a maximum of 50 atmospheres and a minimum of 1 atmosphere. The high-pressure gas is subjected to an oscillating pressure difference change by the increasing / decreasing pressure device to cause a change in the liquid material, so that the liquid material in contact with the material to be cleaned is rubbed and scrubbed by the pressure difference change, and the material to be cleaned attached to the bonding bottom plate is removed from the bonding bottom plate and the liquid material.

8. A method for cleaning a base plate, characterized in that the steps include: (a) Welding welding sheet: welding at least one welding sheet to a bonding substrate; (b) Covering with liquid material: filling a liquid material between the bonding substrate and at least one of the soldering sheets to cover a substance to be cleaned on the bonding substrate; (c) placing in a chamber: placing the bonding substrate containing the liquid material in a chamber; (d) controlling the chamber temperature: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature is in accordance with the viscosity of the liquid material and is between 25° C. and 200° C.; (e) Physical dissolution cleaning: A booster device is used to generate a predetermined pressure in the chamber within a range of at least a maximum of 50 atmospheres and a minimum of 1 atmosphere, and the physical dissolution generated by the contact between the filled liquid material and the material to be cleaned is used to dissolve the material to be cleaned attached to the substrate in the liquid material, and the predetermined temperature and concentration gradient after the dissolution are used to dissolve the material to be cleaned. The generated diffusion force brings the to-be-cleaned material attached to the bonding substrate away from the bonding substrate and the liquid material.

9. The method for cleaning a base plate according to claim 7 or 8, characterized in that: The substances to be cleaned may be soldering flux, soldering flux residue, oil ester, photoresist or products generated during the manufacturing process.

10. The method for cleaning a base plate according to claim 7, characterized in that: The liquid material may be a base glue, and the base glue may contain hard particles. The hard particles roll as the base glue changes, thereby increasing the friction and scrubbing effect.

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