Full-automatic packaging processing equipment for integrated circuit chip

Abstract

The invention relates to the technical field of chip processing equipment, and discloses a full-automatic packaging processing device of an integrated circuit chip, which comprises a mounting frame, the top of the mounting frame is fixedly connected with a transmission belt, the transmission belt is used for transmitting a circuit chip, and an alignment mechanism is arranged outside the transmission belt. A mechanical arm is fixedly connected to one end of the top of the mounting frame, an alignment clamping jaw mechanism is arranged at the bottom end of the top of the mechanical arm, the alignment clamping jaw mechanism is used for being matched with the alignment mechanism to achieve clamping and alignment between a circuit chip and a packaging structure, and a cleaning mechanism is arranged in the mounting frame. And the cleaning mechanism is used for cleaning the chip before the chip is packaged. The dust on the chip can be blown away through spraying of the air spraying head, meanwhile, the dust suction head is started, and the blown dust is sucked into the dust collection box through the dust suction head, so that cleaning of the chip can be completed, the chip packaging cost is reduced, meanwhile, the conveying time is shortened, and then the chip packaging efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing equipment, in particular to a fully automatic packaging and processing equipment for integrated circuit chips. Background Art

[0002] An integrated circuit chip is a miniature electronic device that uses a specific manufacturing process to interconnect components such as transistors, capacitors, resistors, inductors, and wiring, and is manufactured on several semiconductor wafers or dielectric substrates and packaged in a tube shell to form a miniature electronic device with a certain circuit function. Integrated circuits are the foundation of modern electronic technology and are widely used in the fields of computers, communications, consumer electronics, etc.

[0003] Integrated circuit chip packaging is the process of laying out, fixing and connecting semiconductor components on a substrate and packaging them with an insulating medium to form a chip. The basic functions of packaging include protecting the chip from physical damage, providing electrical connections, enhancing heat dissipation, enabling communication between the chip and external circuits, and providing mechanical support and environmental protection. In the prior art, the packaging of integrated circuit chips requires the use of fully automatic packaging processing equipment.

[0004] Currently, integrated circuit chips need to be cleaned before packaging, but the fully automatic packaging and processing equipment in the existing technology does not have the cleaning function, so special cleaning equipment is needed to clean the chips, which not only increases the cost of chip packaging, but also increases the transportation time, thereby reducing the packaging efficiency. Summary of the invention

[0005] In view of the deficiencies of the prior art, the present invention provides a fully automatic packaging and processing equipment for integrated circuit chips, which solves the problems of high chip packaging cost and reduced packaging efficiency in the prior art.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a fully automatic packaging and processing equipment for integrated circuit chips, including an installation frame, a transmission belt is fixedly connected to the top of the installation frame, the transmission belt is used to transmit circuit chips, an alignment mechanism is arranged on the outside of the transmission belt, a mechanical arm is fixedly connected to one end of the top of the installation frame, an alignment clamping mechanism is arranged at the top bottom end of the mechanical arm, the alignment clamping mechanism is used to cooperate with the alignment mechanism to achieve clamping and alignment between the circuit chip and the packaging structure, a cleaning mechanism is arranged inside the installation frame, the cleaning mechanism is used to clean the chip before chip packaging, and a welding mechanical claw is fixedly connected to one side of the top of the installation frame, and the welding mechanical claw is used for welding between the chip and the packaging structure.

[0007] Furthermore, the alignment mechanism includes a mounting seat, and sliding grooves are provided on both sides of the top of the mounting seat, the inside of the sliding groove is slidably connected to a sliding clamping block, the bottom of the sliding clamping block is rotatably connected to a rotating arm, the inner bottom end of the mounting seat is fixedly connected to a stabilizing column, the outside of the stabilizing column is slidably connected to a mounting plate, the top of the mounting plate is fixedly connected to a sleeve rod, the top of the sleeve rod is fixedly connected to a placement plate, and the outside of the stabilizing column is sleeved with a reset spring.

[0008] Furthermore, the alignment clamping claw mechanism includes a fixed plate, both ends of the fixed plate are rotatably connected with rotating clamping claws, the bottom of the rotating clamping claw is rotatably connected with a rotating column, the outside of the rotating column is rotatably connected with a rotating block, the outside of the rotating column is provided with a torsion spring, one end of the torsion spring is fixedly connected to the outside of the rotating column, the other end of the torsion spring is fixedly connected to the inside of the rotating block, the end of the rotating block away from the rotating clamping claw is fixedly connected to the clamping alignment plate, the middle part of the fixed plate is fixedly connected with a hydraulic cylinder, the output end of the hydraulic cylinder is fixedly connected with a mounting top plate, both ends of the mounting top plate are rotatably connected with push-pull rods, the bottom of the push-pull rod is rotatably connected to the middle part of the rotating clamping claw, and the top of the mounting top plate is fixedly connected to the top bottom end of the mechanical arm.

[0009] Further, the cleaning mechanism includes an outer cylinder, the outer portion of the outer cylinder is fixedly connected to the outer portion of the transmission belt, the inner portion of the outer cylinder is slidably connected to a limit ring, the limit ring is fixedly connected to an inner cylinder at one end away from the alignment clamp mechanism, a one-way valve is fixedly connected to the outer side of the outer cylinder, a pulling bent rod is rotatably connected to the side of the outer cylinder away from the outer cylinder, an eccentric wheel is fixedly connected to the driving shaft of the transmission belt, and the pulling bent rod is rotatably connected to the outside of the eccentric wheel at one side away from the outer cylinder; Furthermore, the one-way valve one is fixedly connected to a ventilation tube on the side away from the outer cylinder, the interior of the mounting frame is fixedly connected to a gas tank, the bottom of the ventilation tube is fixedly connected to the outside of the gas tank, the outside of the gas tank is fixedly connected to a ventilation hose, the top of the ventilation hose is fixedly connected to a nozzle, the outside of the nozzle head is fixedly connected to one side of the top of the mechanical arm, the inner cylinder is fixedly connected to a one-way valve two on the side away from the outer cylinder, the one-way valve two is fixedly connected to a connecting hose on the side away from the outer cylinder, the interior of the mounting frame is fixedly connected to a dust collecting box, the bottom of the connecting hose is fixedly connected to the outside of the dust collecting box, the outside of the dust collecting box is fixedly connected to a dust suction hose, the top of the dust suction hose is fixedly connected to a dust suction head, the top of the dust suction head is fixedly connected to the other side of the top of the mechanical arm, a pressure relief mechanism is provided at one end of the gas tank, and a suction mechanism is provided at the top of the dust collecting box.

[0010] Furthermore, the pressure relief mechanism includes a fixed tube, one end of the fixed tube close to the mounting frame is fixedly connected to an external end of the gas tank, the end of the fixed tube away from the gas tank is fixedly connected to a limiting ring, a plurality of vent holes are provided inside the limiting ring, a sliding sleeve is slidably connected to the outside of the limiting ring, a plurality of air relief holes are provided on the outside of the sliding sleeve, and a tension spring is fixedly connected between the inside of the sliding sleeve and the side of the limiting ring away from the fixed tube.

[0011] Furthermore, the air suction mechanism includes a fixed hollow column, the bottom of which is fixedly connected to the top of the dust box, the top of which is fixedly connected to a limiting sliding ring, the outside of the limiting sliding ring is slidingly connected to a sliding cap, a thrust spring is fixedly connected between the inside of the sliding cap and the top of the limiting sliding ring, a plurality of air inlet holes are opened on the outside of the sliding cap, and a plurality of air suction holes are opened on the outside of the fixed hollow column.

[0012] Furthermore, the stabilizing column is slidably connected to the inside of the sleeve rod, the outside of the sleeve rod is slidably connected to the middle part of the mounting seat, one end of the return spring is fixedly connected to the bottom of the mounting plate, the other end of the return spring is fixedly connected to the inner bottom end of the mounting seat, two universal wheels are fixedly connected to both sides of the mounting frame, a threaded cover is threadedly connected to one side of the dust box, an anti-slip pad is arranged on the top of the placement plate, and a protective pad is arranged between the sliding clamping blocks.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention drives the inner cylinder to move through the movement of the transmission belt, so that the inside of the gas tank can be inflated, and the gas is sprayed out through the nozzle to blow away the dust on the chip. At the same time, the dust suction head is started, and the dust blown out is sucked into the dust collection box by the dust suction head, so that the chip can be cleaned. Therefore, there is no need to add cleaning equipment, which reduces the cost of chip packaging and also reduces the transmission time, thereby improving the efficiency of chip packaging.

[0014] 2. The present invention can automatically align the chip and the substrate by setting an alignment mechanism in cooperation with an alignment clamping mechanism, without the need to use a more complicated identification system. The structure is simple, convenient for maintenance and replacement, and the maintenance and replacement cost is low, thereby reducing the maintenance and replacement cost and improving the maintenance and replacement efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The overall structure of the present invention is three-dimensional Figure 1 ; Figure 2 The overall structure of the present invention is three-dimensional Figure 2 ; Figure 3It is a structural schematic diagram of the chute in the present invention; Figure 4 It is a structural schematic diagram of the mounting plate in the present invention; Figure 5 It is a schematic diagram of the structure of the stabilizing column in the present invention; Figure 6 It is a structural schematic diagram of the alignment clamp mechanism in the present invention; Figure 7 It is a schematic diagram of the structure of the torsion spring in the present invention; Figure 8 It is a schematic diagram of the structure of the limiting ring in the present invention; Fig. 9 It is a schematic diagram of the pressure relief mechanism in the present invention; Fig.10 It is a structural schematic diagram of the air suction mechanism in the present invention.

[0016] 1. Mounting frame; 2. Drive belt; 3. Alignment mechanism; 301. Mounting seat; 302. Slide groove; 303. Sliding clamping block; 304. Rotating arm; 305. Stabilizing column; 306. Mounting plate; 307. Sleeve rod; 308. Placement plate; 4. Mechanical arm; 5. Alignment clamping claw mechanism; 501. Fixed plate; 502. Rotating clamping claw; 503. Rotating column; 504. Rotating block; 505. Torsion spring; 506. Clamping alignment plate; 507. Hydraulic cylinder; 508. Push-pull rod; 509. Mounting top plate; 6. Cleaning mechanism; 601. Outer cylinder; 602. Limiting ring; 603. Inner cylinder; 604. One-way valve 1; 605. Pull Bending rod; 606, eccentric wheel; 607, ventilation tube; 608, gas tank; 609, ventilation hose; 610, nozzle; 611, one-way valve 2; 612, connecting hose; 613, dust collecting box; 614, dust suction hose; 615, dust suction head; 616, threaded cover; 7, pressure relief mechanism; 701, fixed tube; 702, limit ring; 703, vent hole; 704, sliding sleeve; 705, air leakage hole; 706, tension spring; 8, suction mechanism; 801, fixed hollow column; 802, suction hole; 803, limit sliding ring; 804, thrust spring; 805, sliding cap; 806, air inlet; 9, welding mechanical claw; 10, universal wheel. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Example: Figure 1-Figure 10As shown, a fully automatic packaging and processing equipment for integrated circuit chips includes an installation frame 1, which provides an installation position. A transmission belt 2 is fixedly connected to the top of the installation frame 1. The transmission belt 2 plays a role in conveying chips. The transmission belt 2 is used to convey circuit chips. An alignment mechanism 3 is arranged on the outside of the transmission belt 2. A mechanical arm 4 is fixedly connected to one end of the top of the installation frame 1. An alignment clamping mechanism 5 is arranged at the top bottom end of the mechanical arm 4. The alignment clamping mechanism 5 is used to cooperate with the alignment mechanism 3 to achieve clamping and alignment between the circuit chip and the packaging structure. A cleaning mechanism 6 is arranged inside the installation frame 1. The cleaning mechanism 6 is used to clean the chip before chip packaging. A welding mechanical claw 9 is fixedly connected to one side of the top of the installation frame 1. The welding mechanical claw 9 is used for welding between the chip and the packaging structure.

[0019] The alignment mechanism 3 includes a mounting seat 301, which provides a mounting position. Slide grooves 302 are provided on both sides of the top of the mounting seat 301. The slide grooves 302 provide space for sliding and mounting. The slide grooves 302 are slidably connected to the inside of the slide grooves 302. The slide clamping block 303 can align the two sides of the chip and the substrate by clamping force toward the middle. The bottom of the slide clamping block 303 is rotatably connected to a rotating arm 304. The inner bottom end of the mounting seat 301 is fixedly connected to a stabilizing column 305. The outside of the stabilizing column 305 is slidably connected to a mounting plate 306. The mounting plate 306 can drive the rotating arm 304 to rotate when moving downward, thereby driving the sliding clamping block 303 to move toward the middle, and then the two sides of the substrate and the chip can be aligned. The top of the mounting plate 306 is fixedly connected to a sleeve rod 307, and the sleeve rod 307 slides on the outside of the stabilizing column 305, so as to maintain the sliding stability of the sleeve rod 307. The top of the sleeve rod 307 is fixedly connected with a placement plate 308, and the placement plate 308 provides a placement space. The outer sleeve of the stabilizing column 305 is provided with a reset spring, and the reset spring can provide a reset power. The stabilizing column 305 is slidably connected to the inside of the sleeve rod 307, and the outer side of the sleeve rod 307 is slidably connected to the middle of the mounting seat 301. One end of the reset spring is fixedly connected to the bottom of the mounting plate 306, and the other end of the reset spring is fixedly connected to the inner bottom end of the mounting seat 301. An anti-slip pad is provided on the top of the placement plate 308, and a protective pad is provided between the sliding clamping blocks 303; During the specific setting, when the chip is placed on the substrate of the placement plate 308 and the chip is pushed downward, the placement plate 308 moves downward, thereby driving the sleeve rod 307 to move downward. After the placement plate 308 moves downward, it can drive the mounting plate 306 to move downward, thereby compressing the reset spring. When the mounting plate 306 moves downward, it can drive the bottom of the rotating arm 304 to move downward. At this time, the top of the rotating arm 304 moves toward the middle, and then it can drive the sliding clamping block 303 to move toward the middle, so that the chip can be aligned with both sides of the substrate. At this time, the alignment clamping mechanism 5 is used to clamp the other two sides of the chip and the substrate, so that the chip and the substrate can be aligned. At this time, the welding mechanical claw 9 is started to weld the chip and the substrate.

[0020] The alignment clamp mechanism 5 includes a fixed plate 501, which can provide an installation position. The two ends of the fixed plate 501 are rotatably connected with rotating clamping claws 502, which can provide clamping conditions. The bottom of the rotating clamping claw 502 is rotatably connected with a rotating column 503, which can provide an installation position. The outside of the rotating column 503 is rotatably connected with a rotating block 504, which rotates at the bottom of the rotating clamping claw 502 and can provide an installation position. The outside of the rotating column 503 is provided with a torsion spring 505, one end of the torsion spring 505 is fixedly connected to the outside of the rotating column 503, and the other end of the torsion spring 505 is fixedly connected to the inside of the rotating block 504. The end of the rotating block 504 away from the rotating clamping claw 502 is fixedly connected with a clamping alignment plate 506, and the torsion spring 505 can use its own elastic force to maintain the position of the clamping alignment plate 506. A hydraulic cylinder 507 is fixedly connected to the middle of the fixed plate 501, and the hydraulic cylinder 507 provides power for the fixed plate 501 to move up and down. The output end of the hydraulic cylinder 507 is fixedly connected to a mounting top plate 509, and the mounting top plate 509 provides mounting conditions. Push-pull rods 508 are rotatably connected to both ends of the mounting top plate 509, and the push-pull rods 508 provide thrust and pull. The bottom of the push-pull rod 508 is rotatably connected to the middle of the rotating clamping claw 502, and the top of the mounting top plate 509 is fixedly connected to the top bottom end of the mechanical arm 4. During the specific setting, the hydraulic cylinder 507 is started, and the output end of the hydraulic cylinder 507 is extended, thereby driving the fixed plate 501 to move downward. Since the top of the push-pull rod 508 is stationary, when the fixed plate 501 moves downward, the rotating clamping claw 502 can be pulled outward by the push-pull rod 508, thereby driving the clamping alignment plate 506 to open. When clamping the chip, the hydraulic cylinder 507 is started again, and the output end of the hydraulic cylinder 507 is retracted, thereby driving the fixed plate 501 to move upward, and then under the push of the push-pull rod 508, the bottom of the rotating clamping claw 502 is driven to move toward the middle, and then the clamping alignment plate 506 is driven to move toward the middle, clamping the chip, and using the robot arm 4 to place the chip on the substrate of the alignment mechanism 3.

[0021] The cleaning mechanism 6 includes an outer cylinder 601, which provides the basic conditions for inflation and suction. The outer part of the outer cylinder 601 is fixedly connected to the outside of the transmission belt 2, and the inner part of the outer cylinder 601 is slidably connected to a limit ring 602, which provides a limit condition. The limit ring 602 is fixedly connected to an inner cylinder 603 at one end away from the alignment clamp mechanism 5. The inner cylinder 603 cooperates with the outer cylinder 601 to perform air extraction and suction. A one-way valve 604 is fixedly connected to the outer side of the outer cylinder 601, and the one-way valve 604 can be ventilated in one direction. The outer side of the inner cylinder 603 is rotatably connected to a pulling bent rod 605 at one side away from the outer cylinder 601. The driving shaft of the transmission belt 2 is fixedly connected with an eccentric wheel 606, and the side of the pulling bending rod 605 away from the outer cylinder 601 is rotatably connected to the outside of the eccentric wheel 606. The side of the one-way valve 604 away from the outer cylinder 601 is fixedly connected with a ventilation hard pipe 607, and the inside of the mounting frame 1 is fixedly connected with a gas tank 608, and the bottom of the ventilation hard pipe 607 is fixedly connected to the outside of the gas tank 608. The outside of the gas tank 608 is fixedly connected with a ventilation hose 609, and the top of the ventilation hose 609 is fixedly connected with a nozzle 610. The outside of the nozzle 610 is fixedly connected to one side of the top of the robot arm 4. The inner cylinder 60 A one-way valve 611 is fixedly connected to the side away from the outer cylinder 601, and a connecting hose 612 is fixedly connected to the side away from the outer cylinder 601 of the one-way valve 611. A dust collecting box 613 is fixedly connected to the inside of the installation frame 1. The bottom of the connecting hose 612 is fixedly connected to the outside of the dust collecting box 613. A dust collecting hose 614 is fixedly connected to the outside of the dust collecting box 613. The dust collecting hose 614 plays a connecting role. A dust collecting head 615 is fixedly connected to the top of the dust collecting hose 614. The dust collecting head 615 can be used for dust collection. The top of the dust collecting head 615 is fixedly connected to the other side of the top of the robot arm 4. A pressure relief mechanism 7 is provided at one end of the gas tank 608, an air suction mechanism 8 is provided at the top of the dust box 613, two universal wheels 10 are fixedly connected to both sides of the mounting frame 1, and a threaded cover 616 is threadedly connected to one side of the dust box 613. The rotation of the transmission belt 2 can drive the eccentric wheel 606 to rotate, and when the eccentric wheel 606 rotates, it drives the pulling rod 605 to move back and forth, thereby driving the inner cylinder 603 to move back and forth. When the inner cylinder 603 moves toward the inside of the outer cylinder 601, the one-way valve 1 604 is opened, and the one-way valve 2 611 is closed. At this time, the air in the outer cylinder 601 and the inner cylinder 603 will pass through the one-way valve A tube 604 enters the interior of the ventilation tube 607, and then enters the interior of the gas tank 608 through the ventilation tube 607, so that air can be filled in the gas tank 608. Before welding the substrate and the chip, the nozzle 610 is turned on. After the nozzle 610 is turned on, gas will be sprayed to blow away impurities on the chip and the substrate, and the dust head 615 is started at the same time. At this time, the suction force is transmitted to the dust head 615 through the dust hose 614, and then the blown dust can be sucked into the interior of the dust box 613. At the same time, the smoke generated during welding can also be sucked away by the dust head 615, which keeps the chip and substrate clean, and also keeps the production environment clean.

[0022] The pressure relief mechanism 7 includes a fixed tube 701, which can play a role in installation. One end of the fixed tube 701 close to the installation frame 1 is fixedly connected to the outer end of the gas tank 608, and the end of the fixed tube 701 away from the gas tank 608 is fixedly connected to the limiting ring 702. The limiting ring 702 plays a role in limiting. A plurality of vent holes 703 are provided inside the limiting ring 702. A sliding sleeve 704 is slidably connected to the outside of the limiting ring 702. A plurality of air leakage holes 705 are provided on the outside of the sliding sleeve 704. After the air leakage holes 705 and the air holes 703 are aligned, exhaust can be facilitated. The inside of the sliding sleeve 704 is fixedly connected to the limiting ring 702 away from the limiting ring 702. A tension spring 706 is fixedly connected between one side of the fixed pipe 701. When the gas pressure inside the gas tank 608 is too high, the high-pressure gas will move the sliding sleeve 704 away from the gas tank 608 through the fixed pipe 701. When the air leakage hole 705 on the sliding sleeve 704 moves to the vent hole 703, the gas inside the gas tank 608 can be discharged through the vent hole 703 and the air leakage hole 705. When the pressure drops, the sliding sleeve 704 can be moved towards the direction close to the gas tank 608 under the action of the tension spring 706, and then the air leakage hole 705 and the vent hole 703 can be staggered, and the gas discharge is stopped at this time.

[0023] The suction mechanism 8 includes a fixed hollow column 801, which provides an installation foundation. The bottom of the fixed hollow column 801 is fixedly connected to the top of the dust box 613. The top of the fixed hollow column 801 is fixedly connected to a limited sliding ring 803. The limited sliding ring 803 provides a limiting function. The outside of the limited sliding ring 803 is slidably connected with a sliding cap 805. A thrust spring 804 is fixedly connected between the inside of the sliding cap 805 and the top of the limited sliding ring 803. The outside of the sliding cap 805 is provided with a plurality of air inlet holes 806. The outside of the fixed hollow column 801 is provided with a plurality of air suction holes 802. After the air suction holes 802 are aligned with the air inlet holes 806, air suction can be facilitated. In the specific setting, when the air pressure inside the dust box 613 is too low, suction is generated in the fixed hollow column 801 to move the sliding cap 805 toward the dust box 613, thereby compressing the thrust spring 804. At this time, the air inlet hole 806 on the sliding cap 805 moves toward the air suction hole 802. When the air suction hole 802 is aligned with the air inlet hole 806, air can be inhaled from the outside. When the air pressure inside the dust box 613 increases, the sliding cap 805 is driven to move upward under the action of the thrust spring 804, so that the air inlet hole 806 and the air suction hole 802 can be staggered, and air is no longer inhaled from the outside.

[0024] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

[0025] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0026] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A fully automatic packaging and processing device for integrated circuit chips, comprising a mounting frame (1), characterized in that: The top of the installation frame (1) is fixedly connected to a transmission belt (2), the transmission belt (2) is used to transmit the circuit chip, the outside of the transmission belt (2) is provided with an alignment mechanism (3), one end of the top of the installation frame (1) is fixedly connected to a mechanical arm (4), the top bottom of the mechanical arm (4) is provided with an alignment clamping mechanism (5), the alignment clamping mechanism (5) is used to cooperate with the alignment mechanism (3) to achieve clamping and alignment between the circuit chip and the packaging structure, the inside of the installation frame (1) is provided with a cleaning mechanism (6), the cleaning mechanism (6) is used to clean the chip before chip packaging, and one side of the top of the installation frame (1) is fixedly connected to a welding mechanical claw (9), the welding mechanical claw (9) is used for welding between the chip and the packaging structure.

2. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 1, characterized in that: The alignment mechanism (3) comprises a mounting seat (301), wherein both sides of the top of the mounting seat (301) are provided with sliding grooves (302), the inside of the sliding groove (302) is slidably connected to a sliding clamping block (303), the bottom of the sliding clamping block (303) is rotatably connected to a rotating arm (304), the bottom end of the inside of the mounting seat (301) is fixedly connected to a stabilizing column (305), the outside of the stabilizing column (305) is slidably connected to a mounting plate (306), the top of the mounting plate (306) is fixedly connected to a sleeve rod (307), the top of the sleeve rod (307) is fixedly connected to a placement plate (308), and the outside of the stabilizing column (305) is sleeved with a reset spring.

3. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 1, characterized in that: The alignment clamping jaw mechanism (5) comprises a fixed plate (501), both ends of the fixed plate (501) are rotatably connected to rotating clamping jaws (502), the bottom of the rotating clamping jaw (502) is rotatably connected to a rotating column (503), the outside of the rotating column (503) is rotatably connected to a rotating block (504), the outside of the rotating column (503) is sleeved with a torsion spring (505), one end of the torsion spring (505) is fixedly connected to the outside of the rotating column (503), the other end of the torsion spring (505) is fixedly connected to the inside of the rotating block (504), and the end of the rotating block (504) away from the rotating clamping jaw (502) is fixedly connected to a clamping alignment plate (506).

4. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 3, characterized in that: A hydraulic cylinder (507) is fixedly connected to the middle of the fixed plate (501), and an output end of the hydraulic cylinder (507) is fixedly connected to a mounting top plate (509). Both ends of the mounting top plate (509) are rotatably connected to push-pull rods (508), and the bottom of the push-pull rod (508) is rotatably connected to the middle of the rotating clamping claw (502), and the top of the mounting top plate (509) is fixedly connected to the bottom end of the top of the mechanical arm (4).

5. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 1, characterized in that: The cleaning mechanism (6) comprises an outer cylinder (601), the outer portion of the outer cylinder (601) is fixedly connected to the outside of the transmission belt (2), the inner portion of the outer cylinder (601) is slidably connected to a limit ring (602), one end of the limit ring (602) away from the alignment clamp mechanism (5) is fixedly connected to an inner cylinder (603), and the outer side of the outer cylinder (601) is fixedly connected to a one-way valve 1 (604).

6. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 5, characterized in that: The side of the inner cylinder (603) away from the outer cylinder (601) is rotatably connected to a pulling bent rod (605), the driving shaft of the transmission belt (2) is fixedly connected to an eccentric wheel (606), and the side of the pulling bent rod (605) away from the outer cylinder (601) is rotatably connected to the outside of the eccentric wheel (606).

7. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 5, characterized in that: A ventilation tube (607) is fixedly connected to the side of the one-way valve 1 (604) away from the outer cylinder (601); a gas tank (608) is fixedly connected to the interior of the installation frame (1); the bottom of the ventilation tube (607) is fixedly connected to the outside of the gas tank (608); the outside of the gas tank (608) is fixedly connected to a ventilation hose (609); and the top of the ventilation hose (609) is fixedly connected to a nozzle (610); The outside of the jet head (610) is fixedly connected to one side of the top of the robot arm (4); a side of the inner cylinder (603) away from the outer cylinder (601) is fixedly connected to a second one-way valve (611); a side of the second one-way valve (611) away from the outer cylinder (601) is fixedly connected to a connecting hose (612); a dust collecting box (613) is fixedly connected to the inside of the installation frame (1); the bottom of the connecting hose (612) is fixedly connected to the outside of the dust collecting box (613); a dust suction hose (614) is fixedly connected to the outside of the dust collecting box (613); a dust suction head (615) is fixedly connected to the top of the dust suction hose (614); a top of the dust suction head (615) is fixedly connected to the other side of the top of the robot arm (4); a pressure relief mechanism (7) is provided at one end of the gas tank (608); and a suction mechanism (8) is provided at the top of the dust collecting box (613).

8. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 7, characterized in that: The pressure relief mechanism (7) comprises a fixed tube (701), one end of the fixed tube (701) close to the mounting frame (1) is fixedly connected to an external end of the gas tank (608), one end of the fixed tube (701) away from the gas tank (608) is fixedly connected to a limiting ring (702), a plurality of vent holes (703) are provided inside the limiting ring (702), a sliding sleeve (704) is slidably connected to the outside of the limiting ring (702), a plurality of air relief holes (705) are provided on the outside of the sliding sleeve (704), and a tension spring (706) is fixedly connected between the inside of the sliding sleeve (704) and a side of the limiting ring (702) away from the fixed tube (701).

9. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 7, characterized in that: The air suction mechanism (8) comprises a fixed hollow column (801), the bottom of the fixed hollow column (801) is fixedly connected to the top of the dust box (613), the top of the fixed hollow column (801) is fixedly connected to a limit sliding ring (803), the outside of the limit sliding ring (803) is slidably connected to a sliding cap (805), a thrust spring (804) is fixedly connected between the inside of the sliding cap (805) and the top of the limit sliding ring (803), a plurality of air inlet holes (806) are provided on the outside of the sliding cap (805), and a plurality of air suction holes (802) are provided on the outside of the fixed hollow column (801).

10. The fully automatic packaging and processing equipment for integrated circuit chips according to claim 7, characterized in that: The stabilizing column (305) is slidably connected to the inside of the sleeve rod (307), the outside of the sleeve rod (307) is slidably connected to the middle of the mounting seat (301), one end of the return spring is fixedly connected to the bottom of the mounting plate (306), and the other end of the return spring is fixedly connected to the inner bottom end of the mounting seat (301), two universal wheels (10) are fixedly connected to both sides of the mounting frame (1), a threaded cover (616) is threadedly connected to one side of the dust box (613), an anti-slip pad is arranged on the top of the placement plate (308), and a protective pad is arranged between the sliding clamping blocks (303).

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