Semiconductor device post-packaging transfer equipment and semiconductor production line

Abstract

The present invention discloses a semiconductor device post-packaging transfer device and a semiconductor production line, which comprises a material taking and placing component and a moving component, wherein a material storage component and a tray component are installed at a moving end of the moving component; a mounting groove is provided in the tray component, and a sliding plate is slidably connected to the mounting groove, and the mounting groove is divided by the sliding plate to form a first groove and a second groove, and the first groove is closer to a taking and placing position than the second groove; an elastic unit is installed on a side of the sliding plate away from the taking and placing position of the tray component, and a damping component is installed on a side of the sliding plate close to the taking and placing position of the tray component; the moving end of the moving component is driven to accelerate in a direction close to the taking and placing position, so that the sliding plate moves in a direction close to the second groove, so that the volume of the first groove is increased, and at the same time, the tray component is moved to the taking and placing position, so that the material taking and placing component can put the semiconductor device into the first groove, and under the action of the damping component and the elastic unit, the sliding plate is gradually reset, so as to cooperate to realize the flexible placement of the semiconductor device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device transfer structures, and in particular to a semiconductor device post-packaging transfer device and a semiconductor production line. Background Art

[0002] Semiconductor device transfer refers to the process of transferring packaged devices from one process or equipment to another process or equipment, or loading them into storage units such as pallets and transport containers, during the semiconductor manufacturing process. It is an indispensable part of the entire production process and directly affects the quality of semiconductor devices, production efficiency, and the stability of subsequent processes. The semiconductor device transfer structure is a structure used to realize the process of semiconductor device transfer.

[0003] Although the current semiconductor device transfer structure has achieved a certain degree of automation, it still has many limitations in terms of flexibility and compactness. For example, most semiconductor device transfer structures use rigid robotic arms to complete the clamping and handling of semiconductor devices. At a time when the precision of semiconductor devices is constantly improving, if there is an error in the size of the semiconductor device, it is very easy to cause scratches or cracks to the semiconductor device when the rigid robotic arm places the semiconductor device into the rigid tray.

[0004] In this regard, in order to match semiconductor devices of different size offsets that appear in actual production, trays of different sizes can be prepared in advance. For example, if the size of the semiconductor device is relatively large, a large-sized tray can be used for transfer, and if the size of the semiconductor device is relatively small, a small-sized tray can be used for transfer. The above setting requires the preparation of trays of different sizes, which results in an overall volume that is too large, limiting the flexibility of the production line layout.

[0005] Therefore, it is necessary to develop a new semiconductor device transfer structure to avoid reduction in production accuracy of semiconductor devices of different sizes while ensuring layout flexibility. Summary of the invention

[0006] The object of the present invention is to provide a semiconductor device post-packaging transfer device and a semiconductor production line to solve the problem that the semiconductor device transfer structure in the prior art cannot simultaneously ensure layout flexibility and production accuracy.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A semiconductor device post-packaging transfer device, comprising:

[0009] A pick-and-place assembly, the pick-and-place assembly being used for picking up and placing semiconductor devices at a pick-and-place position;

[0010] A moving component, wherein a material storage component and a tray component are installed at a moving end of the moving component, the material storage component is used to receive upstream semiconductor devices, and the moving component is used to drive one of the material storage component and the tray component to move to the pick-and-place position;

[0011] The tray assembly is provided with a mounting groove, the mounting groove is slidably connected with a sliding plate, the mounting groove is divided by the sliding plate to form a first groove and a second groove, the first groove is closer to the pick-and-place position than the second groove; the tray assembly is provided with an elastic unit on a side of the sliding plate away from the pick-and-place position, and the tray assembly is provided with a damping assembly on a side of the sliding plate close to the pick-and-place position;

[0012] When the moving end accelerates and moves in a direction close to the pick-and-place position, the elastic unit is in a compressed state, so that the sliding plate moves in a direction close to the second slot, thereby increasing the volume of the first slot.

[0013] Optionally, a receiving groove is provided on a side of the tray assembly facing the moving end, and an avoidance groove is provided between the installation groove and the receiving groove.

[0014] The sliding plate includes a limiting portion disposed on the mounting groove, the limiting portion is connected to an extending portion passing through the avoidance groove, and an end portion of the extending portion extends into the accommodating groove;

[0015] The elastic unit and the damping assembly are both disposed in the accommodating groove, one end of the extending portion is connected to the elastic unit, and the other end of the extending portion is connected to the damping assembly.

[0016] Optionally, the number of the extension parts is two, and the avoidance grooves are arranged in one-to-one correspondence with the extension parts; in the accommodating groove, a support plate part is connected between the two extension parts; and a counterweight block is detachably connected to the end surface of the support plate part facing the installation groove.

[0017] Optionally, the number of the extension parts is at least two, the damping assembly comprises a pressure damper, the main body of the pressure damper is fixedly connected to the groove wall of the accommodating groove, a first damping block is installed at the damping end of the pressure damper, and the damping end can move along the acceleration direction of the moving end;

[0018] The first damping block is provided with a first damping groove at a position corresponding to each of the extension parts. When the movable end accelerates in a direction close to the pick-and-place position, the extension part separates from the first damping groove; when the movable end decreases or stops, the extension part enters the first damping groove in a direction close to the pick-and-place position.

[0019] Optionally, along a direction perpendicular to the accelerated moving direction, second damping grooves are provided on two groove side walls of the first damping groove; and a second damping block is installed in the second damping groove;

[0020] A movable groove is formed on the groove side wall of the second damping groove, a damping base is movably installed in the movable groove, the second damping block is fixedly connected to the damping base, and the damping base is connected to the second damping groove through a spring, so that the second damping block at least partially protrudes from the second damping groove and extends into the first damping groove.

[0021] Optionally, a guiding slope is formed on the end of the second damping block facing the elastic unit, and between two opposite second damping blocks, the guiding slopes on each of the second damping blocks form a guiding inlet channel.

[0022] Optionally, the first damping block is provided with a middle groove between the two first damping grooves, an electromagnet unit is embedded in the middle groove, and the damping base can be magnetically attracted by the electromagnet unit after power is supplied.

[0023] Optionally, the material taking and placing assembly comprises a lifting device, and a suction cup unit is installed at the lifting end of the lifting device;

[0024] The moving assembly comprises a first moving assembly, a second moving assembly is installed on the moving end of the first moving assembly, and the material storage assembly and the tray assembly are both installed on the moving end of the second moving assembly.

[0025] A semiconductor device transfer method, applied to the semiconductor device post-packaging transfer device as described above, comprising:

[0026] Move the stocking assembly to a pick-and-place position and take out the semiconductor device;

[0027] The moving end of the moving assembly is accelerated to move in a direction close to the pick-and-place position, and the tray assembly is moved to the pick-and-place position; during the acceleration process, the elastic unit is in a compressed state, so that the sliding plate moves in a direction close to the second slot, and the volume of the first slot increases;

[0028] Before the sliding plate is reset, the semiconductor device is placed in the first groove.

[0029] A semiconductor production line comprises an upstream device and a downstream device, wherein the semiconductor device post-packaging transfer device as described above is arranged between the upstream device and the downstream device.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The semiconductor device post-packaging transfer equipment and semiconductor production line provided by the present invention can realize the transfer of semiconductor devices from a material storage component to a tray component. During the transfer process, a semiconductor device is taken from a material storage component located at a pick-and-place position by using a material pick-and-place component. Then, a moving component is used to drive its moving end to accelerate in a direction close to the pick-and-place position, so that a sliding plate moves in a direction close to a second slot, so that the volume of the first slot increases, and at the same time, the tray component is moved to the pick-and-place position, so that the material pick-and-place component can place the semiconductor device in the first slot. During the process of deceleration and stopping of the moving end, a damping component slows down the resetting speed of the sliding plate, and reserves enough time for the semiconductor device to be placed in the first slot. Then, under the action of the damping component and the elastic unit, the sliding plate is gradually reset, so that the size of the first slot matches the semiconductor device, so that the semiconductor device can be flexibly placed, scratches or cracks on the semiconductor device are avoided, and the production accuracy of the semiconductor device is guaranteed. At the same time, the above-mentioned setting does not require the additional preparation of trays of different sizes, so that the overall volume is reduced, thereby improving the layout flexibility of the semiconductor production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0033] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0034] Figure 1 An overall schematic diagram of a semiconductor device post-packaging transfer device provided by an embodiment of the present invention;

[0035] Figure 2 A schematic diagram of a first partial structure of a semiconductor device post-packaging transfer device provided by an embodiment of the present invention;

[0036] Figure 3 A schematic diagram of a first cross-sectional structure of a semiconductor device post-packaging transfer device provided by an embodiment of the present invention;

[0037] Figure 4 A second cross-sectional structural schematic diagram of a semiconductor device post-packaging transfer device provided by an embodiment of the present invention;

[0038] Figure 5 A second partial structural diagram of a semiconductor device post-packaging transfer device provided by an embodiment of the present invention;

[0039] Figure 6 for Figure 5 A schematic diagram of the local enlarged structure at point A;

[0040] Illustration: 100, material taking and placing assembly; 110, lifting device; 120, suction cup unit; 200, material storage assembly;

[0041] 300, tray assembly; 301, mounting slot; 3011, first slot; 3012, second slot; 302, accommodating slot; 303, avoidance slot; 310, sliding plate; 311, limiting portion; 312, extending portion; 313, supporting plate portion; 320, elastic unit; 321, first elastic seat; 322, second elastic seat;

[0042] 330, damping assembly; 331, pressure damper; 332, first damping block; 3321, first damping groove; 3322, second damping groove; 3323, movable groove; 3324, middle groove;

[0043] 333, second damping block; 3331, guide slope; 3332, guide inlet channel; 334, damping base; 335, electromagnet unit;

[0044] 400, mobile component; 410, first mobile component; 420, second mobile component. DETAILED DESCRIPTION

[0045] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0047] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0048] Embodiment 1:

[0049] The present embodiment provides a semiconductor device post-packaging transfer device, which is suitable for scenarios where semiconductor devices are transferred after packaging, for example, integrated circuit chips, sensor devices, MOSFETs, IGBTs and other semiconductor devices are transferred. The above-mentioned semiconductor devices can be flexibly placed in a tray, and the structure of the semiconductor device post-packaging transfer device is improved in consideration of the package size deviation of the semiconductor device, which can overcome the assembly problems caused by the package size deviation (for example, cracks appear after a semiconductor device with a larger package size is placed in a standard slot), thereby ensuring the production accuracy of the semiconductor device, and by optimizing the structure, the device can adapt to changes in device size without replacing the tray, thereby greatly improving the layout flexibility of the production line.

[0050] like Figure 1 and Figure 2 As shown, the semiconductor device post-packaging transfer equipment in this embodiment includes: a material picking and placing component 100 and a moving component 400; the material picking and placing component 100 is used to pick up and place semiconductor devices at a picking and placing position; the moving end of the moving component 400 is installed with a material storage component 200 and a tray component 300, the material storage component 200 is used to receive upstream semiconductor devices, and the moving component 400 is used to drive one of the material storage component 200 and the tray component 300 to move to the picking and placing position. Among them, the pick-and-place position can be set below the pick-and-place material assembly 100, so that the pick-and-place material assembly 100 can absorb or clamp the semiconductor device; the moving assembly 400 is used to move the storage assembly 200 loaded with semiconductor devices, such as a chip tray, to the pick-and-place position, and the pick-and-place material assembly 100 takes out a corresponding semiconductor device; then, the moving assembly 400 is used to move the tray assembly 300 to the pick-and-place position, and the pick-and-place material assembly 100 places the corresponding semiconductor device into the tray assembly 300; after multiple reciprocating movements, the tray assembly 300 is filled with semiconductor devices; then, the tray assembly 300 can be sent to downstream testing equipment, packaging equipment and other equipment to perform corresponding steps.

[0051] like Figures 2 to 6As shown, the tray assembly 300 is provided with a mounting groove 301, and the mounting groove 301 is slidably connected to a sliding plate 310, and the mounting groove 301 is divided by the sliding plate 310 to form a first groove 3011 and a second groove 3012, and the first groove 3011 is closer to the pick-and-place position than the second groove 3012; the tray assembly 300 is provided with an elastic unit 320 on the side of the sliding plate 310 away from the pick-and-place position, and the tray assembly 300 is provided with a damping assembly 330 on the side of the sliding plate 310 close to the pick-and-place position; when the moving end accelerates in a direction close to the pick-and-place position, the elastic unit 320 is in a compressed state, so that the sliding plate 310 moves in a direction close to the second groove 3012, and the volume of the first groove 3011 increases.

[0052] Specifically, the semiconductor device post-packaging transfer device in this embodiment can realize the transfer of semiconductor devices from the stocking assembly 200 to the tray assembly 300. During the transfer process, the pick-and-place assembly 100 is used to take a semiconductor device from the stocking assembly 200 located at the pick-and-place position, and then the moving assembly 400 is used to drive its moving end to accelerate and move in a direction close to the pick-and-place position. Figure 3 and Figure 4 As shown, the sliding plate 310 is moved in a direction close to the second groove 3012, so that the volume of the first groove 3011 is increased, and the tray assembly 300 is moved to the pick-and-place position, so that the pick-and-place assembly 100 can place the semiconductor device into the first groove 3011; during the deceleration and stop process of the moving end, the damping assembly 330 slows down the reset speed of the sliding plate 310, and reserves enough time for the semiconductor device to be placed in the first groove 3011; then, under the action of the damping assembly 330 and the elastic unit 320, the sliding plate 310 is gradually reset, so that the size of the first groove 3011 matches the semiconductor device, so as to realize the flexible placement of the semiconductor device, avoid scratches or cracks on the semiconductor device, and ensure the production accuracy of the semiconductor device. At the same time, the above-mentioned setting does not require the additional preparation of trays of different sizes, so that the overall volume is reduced, thereby improving the layout flexibility of the semiconductor production line.

[0053] Furthermore, a receiving groove 302 is provided on one side of the tray assembly 300 facing the movable end, and an avoidance groove 303 is provided between the mounting groove 301 and the receiving groove 302 of the tray assembly 300; the sliding plate 310 includes a limiting portion 311 arranged in the mounting groove 301, the limiting portion 311 is connected to an extension portion 312 passing through the avoidance groove 303, and the end of the extension portion 312 extends into the receiving groove 302; the elastic unit 320 and the damping assembly 330 are both arranged in the receiving groove 302, one end of the extension portion 312 is connected to the elastic unit 320, and the other end of the extension portion 312 is connected to the damping assembly 330.

[0054] Among them, the elastic unit 320 includes a first elastic seat 321 and a second elastic seat 322, and a spring unit is installed between the first elastic seat 321 and the second elastic seat 322, one end of the spring unit is connected to the first elastic seat 321, and the other end of the spring unit is connected to the second elastic seat 322; the first elastic seat 321 is arranged on the first groove side wall of the accommodating groove 302, and the second elastic seat 322 is arranged on the sliding plate 310, and the first groove side wall is the groove wall of the accommodating groove 302 away from the picking and placing position.

[0055] With the above-mentioned structural arrangement, when the moving end of the moving assembly 400 accelerates in the direction close to the pick-and-place position, the sliding plate 310 slides relative to the tray assembly 300 in the direction of the second groove 3012, and the elastic unit 320 is compressed, thereby increasing the volume of the first groove 3011. At the same time, the extension portion 312 passes through the avoidance groove 303 and is linked with the elastic unit 320 and the damping assembly 330, further dispersing the impact force during the movement acceleration. The damping assembly 330 provides buffer damping during the gradual reset process of the sliding plate 310, slowing down the reset speed, ensuring the flexible placement of the semiconductor device, and making the overall structure of the tray assembly 300 more compact.

[0056] As an optional embodiment, there are two extensions 312, and the avoidance groove 303 and the extensions 312 are arranged one by one; in the accommodating groove 302, a support plate 313 is connected between the two extensions 312; and a counterweight (not shown) is detachably connected to the end surface of the support plate 313 facing the installation groove 301. With such a structural design, when the sliding plate 310 slides under the drive of the mobile end, the two extensions 312 and the support plate 313 play a synergistic role. The existence of the support plate 313 can stabilize the overall structure of the sliding plate 310, evenly disperse the pressure on the extensions 312, and further improve the balance and stability of the sliding plate 310 during acceleration or resetting. In addition, the detachable counterweight block on the support plate portion 313 makes it easy for the staff to make adjustments according to different types of semiconductor devices, thereby optimizing the inertial response of the sliding plate 310, ensuring that the sliding plate 310 can achieve more accurate buffering and resetting under the action of the elastic unit 320 and the damping assembly 330, further preventing damage to the semiconductor device during the transfer process, and improving the flexible adaptability of the equipment and the stability of device placement.

[0057] Furthermore, the number of extensions 312 is at least two, and the damping assembly 330 includes a pressure damper 331, which can be pneumatic or hydraulic, and the main body of the pressure damper 331 is fixedly connected to the groove wall of the accommodating groove 302, and the damping end of the pressure damper 331 is installed with a first damping block 332, and the damping end can move along the acceleration direction of the moving end; the first damping block 332 is respectively provided with a first damping groove 3321 corresponding to the position of each extension part 312, and when the moving end accelerates in the direction close to the pick-up and placement position, the extension part 312 is separated from the first damping groove 3321; when the moving end decreases or stops, the extension part 312 enters the first damping groove 3321 in the direction close to the pick-up and placement position.

[0058] It can be understood that when the moving end decelerates or stops, the extension portion 312 gradually enters the first damping groove 3321, and the pressure damper 331 applies a damping force to the extension portion 312 through the first damping block 332. The multiple first damping grooves 3321 can disperse energy, effectively reduce the impact force, and ensure flexible buffering during the placement of the semiconductor device.

[0059] Furthermore, along the direction perpendicular to the acceleration moving direction, the two groove side walls of the first damping groove 3321 are provided with second damping grooves 3322; the second damping block 333 is installed in the second damping groove 3322; the groove side wall of the second damping groove 3322 is provided with a movable groove 3323, and a damping base 334 is movably installed in the movable groove 3323, the second damping block 333 is fixedly connected to the damping base 334, and the damping base 334 is connected to the second damping groove 3322 through a spring, so that the second damping block 333 at least partially protrudes from the second damping groove 3322 and extends into the first damping groove 3321. Among them, for the extension part 312, the two second damping blocks 333 are equivalent to playing the role of pre-braking, which can effectively disperse energy and reduce impact.

[0060] It is understandable that when the extension 312 enters the first damping groove 3321, the partially protruding structure of the second damping block 333 can produce a multi-point damping effect, further resetting the residual kinetic energy during the process. The damping base 334 is connected to the second damping groove 3322 by a spring, so that the second damping block 333 can still move flexibly while providing additional damping to avoid energy accumulation or impact damage. In addition, the mobility of the second damping block 333 and the elastic recovery ability provided by the spring enable the structure to automatically adjust and maintain the consistency of the damping effect during repeated actions. At the same time, through the linkage of the second damping groove 3322 and the first damping groove 3321, the overall structure is compact and the functional integration is high, which effectively reduces the overall occupied space, while improving the buffering effect and movement smoothness, thereby ensuring the flexible placement of semiconductor devices and the long-term stable operation of the production line.

[0061] As an optional embodiment, a guiding slope 3331 is formed on the end of the second damping block 333 facing the elastic unit 320 , and between two opposite second damping blocks 333 , the guiding slopes 3331 on each second damping block 333 form a guiding inlet channel 3332 .

[0062] On the basis of the above embodiment, the first damping block 332 is provided with a middle groove 3324 between the two first damping grooves 3321, and an electromagnet unit 335 is embedded in the middle groove 3324, and the damping base 334 can be magnetically attracted by the electromagnet unit 335 after being energized. The arrangement of the electromagnet unit 335, on the one hand, can magnetically attract the corresponding damping base 334, so that the distance between the two second damping blocks 333 is increased, and the sliding plate 310 can be quickly released during the acceleration process. On the other hand, for the mounting groove 301 that has been equipped with a semiconductor device, the current of the electromagnet unit 335 can be appropriately reduced, and under the action of the spring, the distance between the second damping blocks 333 is reduced, thereby clamping the extension 312 and ensuring that the contour of the first groove 3011 is maintained. In other words, the electromagnet unit 335 plays a role in controlling whether the sliding plate 310 slips during the acceleration process, and can also play a role in controlling the distance between the second damping blocks 333, so as to adjust the damping effect of the second damping blocks 333 on the extension 312.

[0063] On the basis of the above embodiment, the material taking and placing assembly 100 includes a lifting device 110, and a suction cup unit 120 is installed at the lifting end of the lifting device 110; the moving assembly 400 includes a first moving assembly 410, and a second moving assembly 420 is installed on the moving end of the first moving assembly 410, and the material storage assembly 200 and the tray assembly 300 are both installed on the moving end of the second moving assembly 420. The lifting device 110 and the moving assembly 400 can be selected from structures such as linear motors, servo motors configured with screw modules, etc., without limitation.

[0064] Embodiment 2:

[0065] The semiconductor device transfer method provided in this embodiment is applied to the semiconductor device post-packaging transfer equipment of the first embodiment, and includes:

[0066] S11, moving the material storage assembly 200 to a pick-and-place position, and taking out the semiconductor device;

[0067] S12, accelerating the moving end of the moving assembly 400 in a direction close to the pick-and-place position, and moving the tray assembly 300 to the pick-and-place position; during the acceleration process, the elastic unit 320 is in a compressed state, so that the sliding plate 310 moves in a direction close to the second slot 3012, and the volume of the first slot 3011 increases;

[0068] S13 , before the sliding plate 310 is reset, the semiconductor device is placed into the first groove 3011 .

[0069] As a supplementary embodiment, the semiconductor device transfer method includes:

[0070] S21, moving the material storage component 200 to a pick-and-place position, and taking out the semiconductor device;

[0071] S22, selecting a mounting slot 301 where a semiconductor device needs to be placed, and increasing the current of the corresponding electromagnet unit 335, so that the distance between the two second damping blocks 333 increases;

[0072] S23, accelerating the moving end of the moving assembly 400 in a direction close to the pick-and-place position, and moving the tray assembly 300 to the pick-and-place position; during the acceleration process, the elastic unit 320 is in a compressed state, so that the sliding plate 310 moves in a direction close to the second slot 3012, and the volume of the first slot 3011 increases;

[0073] S24, before deceleration or stopping, reducing the current of the electromagnet unit 335, so that the distance between the two second damping blocks 333 is reduced; so that the extension portion 312 can slowly enter between the two second damping blocks 333 along the guide slope 3331;

[0074] S25 , before the sliding plate 310 is reset, place the semiconductor device into the first groove 3011 .

[0075] Embodiment three:

[0076] This embodiment also provides a semiconductor production line, including upstream equipment and downstream equipment, wherein a semiconductor device post-packaging transfer device as in Embodiment 1 is arranged between the upstream equipment and the downstream equipment. The upstream equipment includes but is not limited to packaging equipment, and the downstream equipment includes but is not limited to packaging equipment, testing equipment, etc.

[0077] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor device post-packaging transfer device, characterized in that: include: A material picking and placing assembly (100), the material picking and placing assembly (100) being used for picking and placing semiconductor devices at a picking and placing position; A moving component (400), wherein a material storage component (200) and a tray component (300) are installed at a moving end of the moving component (400), the material storage component (200) is used to receive upstream semiconductor devices, and the moving component (400) is used to drive one of the material storage component (200) and the tray component (300) to move to the pick-and-place position; The tray assembly (300) is provided with a mounting groove (301), the mounting groove (301) is slidably connected to a sliding plate (310), the mounting groove (301) is divided by the sliding plate (310) to form a first groove (3011) and a second groove (3012), the first groove (3011) being closer to the pick-and-place position than the second groove (3012); the tray assembly (300) is provided with an elastic unit (320) on a side of the sliding plate (310) away from the pick-and-place position, and the tray assembly (300) is provided with a damping assembly (330) on a side of the sliding plate (310) close to the pick-and-place position; When the moving end accelerates in a direction approaching the pick-and-place position, the elastic unit (320) is in a compressed state, causing the sliding plate (310) to move in a direction approaching the second groove (3012), thereby increasing the volume of the first groove (3011); The tray assembly (300) is provided with a receiving groove (302) on a side facing the moving end, and the tray assembly (300) is provided with an avoidance groove (303) between the installation groove (301) and the receiving groove (302); The sliding plate (310) comprises a limiting portion (311) arranged on the installation groove (301), the limiting portion (311) is connected to an extension portion (312) passing through the avoidance groove (303), and an end portion of the extension portion (312) extends into the accommodating groove (302); The elastic unit (320) and the damping assembly (330) are both arranged in the accommodating groove (302), one end of the extension portion (312) is connected to the elastic unit (320), and the other end of the extension portion (312) is connected to the damping assembly (330).

2. The semiconductor device post-packaging transfer equipment according to claim 1, characterized in that: The number of the extension parts (312) is two, and the avoidance grooves (303) and the extension parts (312) are arranged in one-to-one correspondence; in the accommodating groove (302), a support plate part (313) is connected between the two extension parts (312); and a counterweight block is detachably connected to the end surface of the support plate part (313) facing the installation groove (301).

3. The semiconductor device post-packaging transfer equipment according to claim 1, characterized in that: The number of the extension parts (312) is at least two, the damping assembly (330) comprises a pressure damper (331), the main body of the pressure damper (331) is fixedly connected to the groove wall of the accommodating groove (302), the damping end of the pressure damper (331) is installed with a first damping block (332), and the damping end can move along the acceleration direction of the moving end; The first damping block (332) is provided with a first damping groove (3321) at a position corresponding to each of the extension parts (312); when the movable end accelerates and moves in a direction close to the pick-and-place position, the extension part (312) separates from the first damping groove (3321); when the movable end decreases or stops, the extension part (312) enters the first damping groove (3321) in a direction close to the pick-and-place position.

4. The semiconductor device post-packaging transfer equipment according to claim 3, characterized in that: Along a direction perpendicular to the accelerated moving direction, two groove side walls of the first damping groove (3321) are provided with second damping grooves (3322); a second damping block (333) is installed in the second damping groove (3322); A movable groove (3323) is provided on a groove side wall of the second damping groove (3322), a damping base (334) is movably installed in the movable groove (3323), the second damping block (333) is fixedly connected to the damping base (334), and the damping base (334) is connected to the second damping groove (3322) via a spring, so that the second damping block (333) at least partially protrudes from the second damping groove (3322) and extends into the first damping groove (3321).

5. The semiconductor device post-packaging transfer equipment according to claim 4, characterized in that: A guiding inclined surface (3331) is formed on the end of the second damping block (333) facing the elastic unit (320), and between two opposite second damping blocks (333), the guiding inclined surfaces (3331) on each of the second damping blocks (333) form a guiding inlet channel (3332).

6. The semiconductor device post-packaging transfer equipment according to claim 4, characterized in that: The first damping block (332) is provided with a middle groove (3324) between the two first damping grooves (3321), an electromagnet unit (335) is embedded in the middle groove (3324), and the damping base (334) can be magnetically attracted by the electromagnet unit (335) after power is supplied.

7. A semiconductor device post-packaging transfer device according to any one of claims 1 to 6, characterized in that: The material picking and placing assembly (100) comprises a lifting device (110), and a suction cup unit (120) is installed at the lifting end of the lifting device (110); The moving assembly (400) comprises a first moving assembly (410), a second moving assembly (420) being mounted on a moving end of the first moving assembly (410), and the material storage assembly (200) and the tray assembly (300) being mounted on a moving end of the second moving assembly (420).

8. A semiconductor device transfer method, characterized in that: Applicable to a semiconductor device post-packaging transfer device as claimed in any one of claims 1 to 7, comprising: Move the stocking assembly to a pick-and-place position and take out the semiconductor device; The moving end of the moving assembly is accelerated to move in a direction close to the pick-and-place position, and the tray assembly is moved to the pick-and-place position; during the acceleration process, the elastic unit is in a compressed state, so that the sliding plate moves in a direction close to the second slot, and the volume of the first slot increases; Before the sliding plate is reset, the semiconductor device is placed in the first groove.

9. A semiconductor production line, characterized in that: The invention comprises an upstream device and a downstream device, wherein a semiconductor device post-packaging transfer device as claimed in any one of claims 1 to 7 is arranged between the upstream device and the downstream device.

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