Lift pin, lift pin apparatus, semiconductor processing system and method of manufacture

Abstract

A lift pin includes a lift pin body disposed along a lift pin axis, the lift pin body having an enlarged contact pad, a stem section extending axially from the contact pad, a neck section extending axially from the stem section and separated from the contact pad by the stem section of the lift pin body, and a base section extending axially from the neck section and separated from the stem section by the neck section. The base section of the lift pin body has a base section width, the neck section of the lift pin body has a neck section width, and the neck section width is less than the base section width to carry a lift pin counterweight by the lift pin body. Lift pin devices, semiconductor processing systems including the lift pin devices, and methods of manufacturing lift pin devices for semiconductor processing systems are also described.

Description

Technical Field

[0001] The present disclosure generally relates to depositing a material layer onto a substrate. More specifically, the present disclosure relates to positioning and removing a substrate on a substrate support before and after depositing a material layer onto the substrate, such as during deposition of the material layer during fabrication of a semiconductor device. Background Art

[0002] During the manufacture of semiconductor devices, such as logic and memory devices, material layers are typically deposited onto a substrate. Deposition is typically accomplished by positioning the substrate on a substrate support within a reaction chamber, heating the substrate to a desired deposition temperature, and exposing the substrate to a material layer precursor under selected ambient conditions to deposit the material layer onto the substrate. Once the material layer has developed the desired properties, exposure of the substrate to the material layer precursor is typically stopped, the substrate is removed from the substrate support, and the substrate is removed from the reaction chamber for further processing, as appropriate for the semiconductor device being manufactured. Positioning can be accomplished using lift pins, which are typically slidably received within the substrate and slide through the substrate to position the substrate on and remove it from the substrate support.

[0003] One challenge of using lift pins to place and remove substrates in a reaction chamber is the accumulation of material within the mechanical gap defined within the reaction chamber interior, such as between the lift pins and the substrate support. For example, during some material layer deposition operations, material may accumulate on the rods of the lift pins. During the movement of the lift pins through the substrate support, the accumulated material may be carried by the rods of the lift pins, potentially increasing the resistance of the lift pins to sliding through the substrate support and / or causing the lift pins to become bound within the substrate support. When mounted on the substrate, material may also accumulate on the tips of the lift pins, increasing the force that needs to be applied to the lift pins to initiate the lift pins to slide through the substrate support to remove the substrate from the substrate support once the deposition of the material layer is completed. In addition, static electricity and / or charge between the substrate support and the lift pins may prevent the lift pins from sliding through the substrate support.

[0004] Various countermeasures exist to limit lift pins from becoming stuck within the substrate support. For example, the lift pins may be maintained at a temperature different from that required for deposition of the material layer within the reaction chamber, limiting the tendency for material to build up on the lift pins. The lift pins may be separated from the material layer precursor used in the deposition process, such as by using bellows or providing a purge flow to the lift pins, also limiting the tendency for material to build up on the lift pins during deposition of the material layer onto the substrate. And the interior of the reaction chamber may be etched after the material layer is deposited onto the substrate to remove the built-up material before the build-up reaches a size sufficient to cause the lift pins to become stuck within the substrate support. While generally satisfactory for their intended purpose, such countermeasures may increase the complexity of the reaction chamber architecture and / or increase the cost of ownership of the reaction chamber due to increased use of consumables and / or reduced reaction chamber throughput.

[0005] Such systems and methods are generally satisfactory for their intended purposes. However, there remains a need for improved lift pins, lift pin arrangements, and semiconductor processing systems, as well as methods of making lift pin arrangements for semiconductor processing systems. The present solution provides a solution to this need. Summary of the invention

[0006] A lifting pin is provided. The lifting pin includes a lifting pin body arranged along a lifting pin axis. The lifting pin body has an enlarged contact pad, a rod section, a neck section, and a base section. The rod section of the lifting pin extends axially from the contact pad. The neck section of the lifting pin body extends axially from the rod section, is separated from the contact pad by the rod section of the lifting pin body, and has a neck section width. The base section of the lifting pin body extends axially from the neck section, is separated from the rod section by the neck section, and has a base section width. The base section width is greater than the neck section width so that the lifting pin body can carry a counterweight.

[0007] In addition to or in lieu of one or more of the features described above, further examples of lift pins may include the lift pin body being formed of a ceramic material.

[0008] In addition to or instead of one or more of the features described above, further examples of lift pins may include a contact pad having a contact pad width, a stem segment having a stem segment width, and the stem segment width being less than the contact pad width and greater than the neck segment width.

[0009] In addition to or in lieu of one or more of the above features, a further example of a lift pin may include a base section of a lift pin body having an annular seating surface and a hemispherical portion. The annular seating surface may extend around a neck section of the lift pin body and opposite a stem section of the lift pin body. The annular seating surface may be orthogonal relative to a lift pin axis.

[0010] In addition to or instead of one or more of the features described above, further examples of lift pins may include a base segment having a base segment height, a neck segment having a neck segment height greater than the base segment height, a contact pad having a contact pad height greater than the neck segment height, and a rod segment having a rod segment height greater than the contact pad height.

[0011] A lifting pin device is provided. The lifting pin device comprises a lifting pin as described above, a counterweight body and a cover member. The counterweight body is arranged on a base section of a lifting pin body and is axially fixed and radially free relative to the lifting pin body. The cover member is slidably received on the lifting pin body and extends circumferentially around the counterweight body. The cover member is further axially free and radially fixed relative to the lifting pin body.

[0012] In addition to or in lieu of one or more of the features described above, further examples of lift pin arrangements may include a lift pin body having a lift pin body center of gravity disposed along a lift pin axis, a counterweight having a counterweight center of gravity radially offset from the lift pin axis, and a cover member having a cover member center of gravity radially offset from the lift pin axis. The lift pin arrangement may have a lift pin arrangement center of gravity offset from the lift pin axis.

[0013] In addition to or in lieu of one or more of the features described above, a further example of a lift pin arrangement may include a counterweight having a counterweight width and a recess. The recess may have a recess depth that spans more than half of the counterweight width of the counterweight.

[0014] In addition to or in lieu of one or more of the features described above, further examples of lift pin devices may include a counterweight body defining an internal shoulder facet that is substantially orthogonal relative to the lift pin axis. The counterweight body may have a C-shaped upper surface and a C-shaped lower surface that is axially opposite the C-shaped upper surface and parallel to the internal shoulder facet. The internal shoulder facet may be axially spaced from the base segment of the lift pin body by a neck segment height.

[0015] In addition to or in lieu of one or more of the features described above, further examples of lift pin arrangements may include a cover member having an axially extending key portion slidably received within a recess in the counterweight body.

[0016] In addition to or in lieu of one or more of the features described above, further examples of lift pin arrangements may include the recess having a recess width, and the neck width being substantially equal to the recess width.

[0017] In addition to or as an alternative to one or more of the above features, a further example of a lift pin device may include a cover member having an annular upper surface and an annular lower surface. The annular upper surface of the cover body may extend circumferentially around the rod segment of the lift pin body and radially fix the cover member relative to the lift pin body. The annular lower surface of the cover member may extend around the counterweight body and radially fix the counterweight body relative to the cover member.

[0018] In addition to or in lieu of one or more of the above features, further examples of lift pin devices may include a lift pin body made of aluminum oxide (Al 2 O 3 ) and the lifting pin weight is made of aluminum oxide (Al 2 O 3 ) is formed, and the cover member is made of aluminum oxide (Al 2 O 3 )form.

[0019] In addition to or instead of one or more of the above features, a further example of a lift pin device may include a cover member having a cover member axial height, a counterweight having a counterweight axial height, and the cover member axial height being greater than the counterweight axial height.

[0020] In addition to or as an alternative to one or more of the above features, a further example of a lift pin device may include a cover member having a cover member inner width, a counterweight having a counterweight width, and the cover member inner width is greater than the counterweight width. The cover member inner width may be equal to the counterweight width.

[0021] A semiconductor processing system is provided. As described above, the semiconductor processing system includes a chamber body having an inlet port and an exhaust port, a showerhead, a substrate support, and a lift pin. The showerhead is fixed in the chamber body between the inlet port and the exhaust port. The substrate support is arranged in the chamber body between the showerhead and the exhaust port. The substrate support also defines a lift pin hole therein, and a rod segment of the lift pin body can be slidably received in the lift pin hole.

[0022] In addition to or as an alternative to one or more of the features described above, further examples of semiconductor processing systems may include a substrate support having a first position and a second position. The second position may separate the first position from the showerhead, and a substrate support actuator may be operably connected to the substrate support to move the substrate support between the first position and the second position.

[0023] In addition to or as an alternative to one or more of the above features, a further example of a semiconductor processing system may include a counterweight body and a cover member, wherein the counterweight body has a recess for receiving a neck segment of a lift pin body. The cover member may have a rod segment hole and a counterweight body hole, wherein the rod segment of the lift pin body is slidably received in the rod segment hole, and the counterweight body is slidably received in the counterweight body hole.

[0024] In addition to or in lieu of one or more of the features described above, further examples of semiconductor processing systems may include a recess having a first recess width and a second recess width, the second recess width being axially offset from the first recess width, and the first recess width being substantially equal to a shaft segment width of the lift pin body. The second recess width defined by the counterweight body may be substantially equal to a neck segment width defined by the neck segment of the lift pin body.

[0025] A method for manufacturing a lifting pin device for a semiconductor processing system is provided. The method includes, at the lifting pin as described above, aligning a cover member with the lifting pin axis, and translating the cover member in a first direction along the lifting pin axis so that the rod section of the lifting pin body can be slidably accommodated in the cover member. A counterweight body is arranged along the lifting pin axis, the counterweight body is rotated so that the recess faces the neck section of the lifting pin body, and the counterweight body is displaced relative to the lifting pin body so that the neck section of the lifting pin body can be slidably accommodated in the recess. Then, the cover member is translated along the lifting pin body in a second direction so that the cover member surrounds the counterweight body, and the lifting pin body thereby carries the counterweight body.

[0026] The present invention summary is provided to introduce some concepts in a simplified form. These concepts are further described in detail in the detailed description of the examples of the following disclosure. The present invention summary is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] These and other features, aspects and advantages of the present invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate rather than to limit the present invention.

[0028] Figure 1 is a schematic diagram of a semiconductor processing system including a chamber apparatus according to the present disclosure, showing a lift pin apparatus including a lift pin including a lift pin body and a weight body fixed to the lift pin by a cover member in the chamber apparatus;

[0029] Figure 2 According to the example of the present disclosure Figure 1 A schematic diagram of a chamber arrangement of claim 1, showing lift pins of a lift pin arrangement slidably received within a substrate support and lift pins with load-bearing counterweights suspended below the substrate support;

[0030] Figures 3 to 6 According to the example of the present disclosure Figure 1 Schematic diagram of a chamber device, sequentially showing a substrate support member that moves between a first position and a second position using a lift pin device to secure and remove a substrate;

[0031] Figure 7 According to the example of the present disclosure Figure 1 An exploded view of a lift pin device showing the cover member and the counterweight body exploded from the lift pin along a lift pin axis defined by the lift pin;

[0032] Figure 8 and Fig. 9 is an example according to the present disclosure including Figure 1A side view and a perspective view of a base section of a lift pin in a lift pin device of the present invention, showing a bearing surface and a hemispherical surface of the base section of the lift pin, respectively;

[0033] Fig.10 and Fig.11 is an example according to the present disclosure including Figure 1 A top view and a perspective view of a counterweight body in a lift pin assembly of FIG. 1 , showing a recess and a shoulder defined therein to axially secure the counterweight body to the lift pin body, respectively;

[0034] Fig.12 and Fig.13 is an example according to the present disclosure including Figure 1 A top view and a perspective view of a cover member in a lift pin assembly, showing the rod segment hole and the counterweight body hole, respectively, with the key portion axially located therebetween;

[0035] Fig.14 According to the example of the present disclosure Figure 1 A perspective view of a lift pin assembly showing a counterweight and a cover member assembled to a lift pin of the lift pin assembly;

[0036] Fig.15 is the lifting pin device and Figure 1 a cross-sectional side view of a portion of a semiconductor processing system of , showing lift pins slidably received within a substrate support and lift pin weights suspended from the substrate support;

[0037] Fig.16 According to the example of the present disclosure Figure 1 a cross-sectional side view of a portion of a lift pin assembly showing a neck section of a lift pin body and a key portion of a cover body received within a recess of a counterweight body;

[0038] Fig.17 According to the example of the present disclosure Figure 1 a cross-sectional top view of a lift pin arrangement of FIG. 1; showing a key portion received within a recess defined in a counterweight body such that the counterweight body is rotationally fixed relative to the cover member about the axis of rotation and is free to rotate relative to the lift pin about the axis of rotation; and

[0039] Fig.18 is a block diagram of a method of manufacturing a lift pin apparatus for a semiconductor processing system according to the present disclosure, illustrating the operation of the method according to a non-limiting example of the method.

[0040] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the relative sizes of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure. DETAILED DESCRIPTION

[0041] Reference will now be made to the drawings, wherein like reference numerals represent similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, a partial view of a lift pin according to the present invention is shown in FIG. Figure 1 , and is generally indicated by the reference numeral 100. Figures 2 to 18 Other examples of lift pins, lift pin devices, and semiconductor processing systems including lift pin devices, and methods of manufacturing lift pin devices for semiconductor processing systems, or aspects thereof, according to the present disclosure are provided, as will be described. The systems and methods of the present disclosure may be used to position and remove substrates within a chamber arrangement having a downflow architecture, such as in a semiconductor processing system that deposits material layers using plasma enhanced chemical vapor deposition and atomic layer deposition techniques, although the present disclosure is generally not limited to any particular chamber arrangement architecture or material layer deposition technique.

[0042] refer to Figure 1 , a semiconductor processing system 200 is shown. The semiconductor processing system 200 generally includes a precursor source 202, a chamber arrangement 204, an exhaust source 206, and a controller 208. The precursor source 202 is configured to provide a flow of a material layer precursor 10 to the chamber arrangement 204. The chamber arrangement 204 is connected to the precursor source 202, includes a lift pin arrangement 100, and is configured to expose the substrate 2 to the material layer precursor 10 under environmental conditions that cause the material layer 4 to be deposited onto the substrate 2. The exhaust source 206 is connected to the chamber arrangement 204 and is configured to convey a flow of residual precursor and / or reaction product 12 to an external environment 14 outside the semiconductor processing system 200. The controller 208 is operably connected to the semiconductor processing system 200, such as by a wired or wireless link 210, and is configured to control the operation of the semiconductor processing system 200.

[0043] As used herein, the term "substrate" may refer to any one or more underlying materials, including any one or more underlying materials that may be modified or on which a device, circuit, or film may be formed. The substrate may be continuous or non-continuous; rigid or flexible; solid or porous; and combinations thereof. The substrate may be in any form, such as (but not limited to) a powder, a plate, or a workpiece. Plate-like substrates may include wafers of various shapes and sizes, including, for example, 300 mm wafers.

[0044] The substrate may be formed of a semiconductor material, including, for example, silicon (Si), silicon germanium (SiGe), silicon oxide (SiO 2), gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC). The substrate may include a pattern or may be a blanket substrate without a pattern. For example, a substrate in powder form may be used in drug manufacturing. The porous substrate may include one or more polymers. Examples of workpieces may include medical devices (such as stents and syringes), jewelry, tool equipment, components for battery manufacturing (such as anodes, cathodes, or separators), or components of photovoltaic cells, etc.

[0045] refer to Figure 2 , a chamber apparatus 204 according to an example of the present disclosure is shown. In the example shown, the chamber apparatus 204 has a downflow architecture, and in this regard includes a chamber body 212, a showerhead 214, a substrate support 216, and a bellows member 218. As shown and described herein, the chamber apparatus 204 also includes a substrate support actuator 220, a gate valve 222, a substrate transfer robot 224, and a lift pin apparatus 100. Although shown and described herein as including certain elements and having a particular arrangement (e.g., a downflow architecture), it should be understood and appreciated that the chamber apparatus includes additional elements and / or excludes certain elements shown and described herein, and / or has a different arrangement and is still within the scope of the present disclosure.

[0046] The chamber body 212 may be formed of a metal material 226 and has an inlet port 228 and an exhaust port 230. The inlet port 228 is connected to the precursor source 202 ( Figure 1 ), and is configured to receive a flow of the material layer precursor 10 therethrough. The exhaust port 230 is connected to the exhaust source 206 ( Figure 1 ), and is configured to provide a semiconductor processing system 200 ( Figure 1 ) external external environment 14 ( Figure 1 2 (shown in FIG. 2 ) provides a flow of residual precursor and / or reaction product 12 emitted by chamber device 204. In some examples, metal material 226 may include aluminum, such as an aluminum alloy with a low copper content. According to some examples, metal material 226 may include a stainless steel material, such as a stainless steel alloy with a low copper content.

[0047] The showerhead 214 is formed of a showerhead material 236, fixed within an interior 238 of the chamber body 212, and divides the interior 238 of the chamber body 212 into a distribution chamber 240 and a processing space 242. The showerhead 214 also defines a plurality of flow holes 244 therethrough, which fluidically couple the distribution chamber 240 to the processing space 242, thereby coupling the inlet port 228 to the exhaust port 230 to provide the material layer precursor 10 to the substrate 2. In some examples, the showerhead material 236 may include aluminum, such as an aluminum alloy with a low copper content. According to some examples, the showerhead material 236 may include a stainless steel material, such as a stainless steel material with a low copper content.

[0048] The substrate support 216 is disposed within the interior 238 of the chamber body 212 along a drive axis 246 and is movable between a first position 248 and a second position 250. The first position 248 is proximate to the showerhead 214, the second position 250 is axially separated from the showerhead 214 by the first position 248, and the substrate support actuator 220 is operably connected to the substrate support 216 to move the substrate support 216 between the first position 248 and the second position 250 along the drive axis 246. In this regard, the substrate support actuator 220 can be coupled to the substrate support 216 via a base member 252 extending into the interior 238 of the chamber body 212 and enclosed within the bellows member 218. In another aspect, the substrate support actuator 220 can be operably coupled to the controller 208 ( Figure 1 248 and a second position 250 along a drive axis 246 within the interior 238 of the chamber body 212 to place the substrate 2 on and remove the substrate 2 from the substrate support 216.

[0049] The lift pin arrangement 100 is slidably received within the substrate support 216 and is movable therein between a retracted position 254, in which the lift pin arrangement 100 is recessed within the upper surface 256 of the substrate support 216, and an extended position 258 (shown in FIG. A), in which the lift pin arrangement 100 protrudes above the upper surface 256 of the substrate support 216. In this regard, it is contemplated that the substrate support 216 defines a plurality of lift pin holes 260 therein, the lift pin arrangement 100 being one of a plurality of lift pin arrangements 100 included in the chamber arrangement 204, and each of the plurality of lift pin holes 260 slidably receives a respective one of the plurality of lift pin arrangements 100 therein to position a substrate, such as substrate 2, on and remove it from the substrate support 216. In the illustrated example, the substrate support 216 has three (3) lift pin holes circumferentially distributed about the drive axis 246. This is for purposes of illustration and description only and is not intended to be limiting. In view of the present disclosure, those skilled in the art will appreciate that fewer or additional lift pin arrangements may be included in a chamber arrangement and still be within the scope of the present disclosure.

[0050] refer to Figure 3-5 , showing the use of lift pin apparatus 100 to place a substrate 2 on and remove it from a substrate support 216. Figure 3 As shown, positioning is achieved by driving the substrate support 216 downwardly along the drive axis 246 within the interior 238 of the chamber body 212 using the substrate support actuator 220. Driving the substrate support 216 downwardly within the chamber body 212 causes the lift pin arrangement 100 to engage (e.g., abut) an interior surface 262 of the chamber body 212, and further downward translation 256 of the substrate support 216 toward the interior surface 262 of the chamber body 212 causes the lift pin arrangement 100 to protrude above an upper surface 256 of the substrate support 216 until the substrate support 216 reaches the second position 250 and the lift pin arrangement 100 is in the extended position 258. Once the substrate support 216 reaches the second position 250, and the lift pin arrangement 100 protrudes above the upper surface 256 of the substrate support 216 in the extended position 258. The gate valve 222 may then be opened, the end effector carrying the substrate 2 advanced into the interior 238 of the chamber body 212 , and the substrate 2 registered with the substrate support 216 within the chamber body 212 .

[0051] like Figure 4 As shown, once the substrate 2 is registered relative to the substrate support 216, the substrate 2 can be transferred to the lift pin device 100 and supported on the lift pin device 100. The transfer can be performed by using the substrate transfer robot 224 to perform the end effector 264 ( Figure 324. The downward stroke is completed by a downward stroke of 260 (as shown). It is contemplated that the downward stroke transfers the substrate 2 to the lift pin arrangement 100, after which the substrate transfer robot 224 withdraws the end effector 264 from the interior 238 of the chamber body 212, and the gate valve 222 is closed. Thereafter, the substrate support actuator 220 drives the substrate support 216 upward within the interior 238 of the chamber body 212, and along the drive axis 246 in a direction toward the showerhead 214.

[0052] like Figure 5 As shown, the substrate 2 is positioned on the substrate support 216 by driving the substrate support 216 upwardly along the drive axis 246 toward the showerhead 214 using the substrate support actuator 220. The upward translation of the substrate support 216 along the drive axis 246 causes the lift pin device 100 to slide through the substrate support 216 within one of the plurality of lift pin holes 260, which can slidably receive the lift pin device 100. When the substrate support 216 approaches the first position 248, the lift pin device 100 is located in the upper surface 256 of the substrate support 216. Once the lift pin device 100 is in the first position 248, the lift pin device 100 is suspended from the substrate support 216 and located above the inner surface 262 of the chamber body 212. The substrate 2 can then be exposed to the precursor source 202 ( Figure 1 The substrate 2 is heated to a predetermined material layer deposition temperature using one or more heating elements 266 and / or cooling circuits 268 arranged in the substrate support 216, and a material layer 4 is deposited onto the substrate 2 using the flow of the material layer precursor 10.

[0053] like Figure 6 As shown, once deposition of the material layer 4 is complete, the substrate 2 can be removed from the chamber body 212. Removal of the substrate 2 from the chamber body 212 can be accomplished by moving the substrate 2 from the substrate support 216 using the substrate support actuator 220 to drive the substrate support 216 from the first position 248 to the second position 250 along the drive axis 246. The movement from the first position 248 to the second position 250 causes the lift pin assembly 100 to engage (e.g., abut) the inner surface 262 of the chamber body 212, thereby lifting the pin assembly 100 from the retracted position 254 ( Figure 2222) slides upward to the extended position 258. The gate valve 222 can then be opened, the end effector 264 is again driven into the interior 238 of the chamber body 212 and positioned between the substrate 2 and the substrate support 216, and the substrate 2 is transferred to the end effector 264 in an upward stroke, and the substrate 2 is removed from the chamber body 212 by withdrawing the end effector 264 and the substrate 2 carried by the end effector 264 by operating the substrate transfer robot 224 via the gate valve 222. In view of this disclosure, those skilled in the art will understand that the aforementioned operations can thereafter be used to deposit a substrate material layer onto a subsequent substrate, such as in a serial processing mechanism, where a material layer is sequentially deposited onto a single substrate using a flow of material layer precursor 10 provided by the precursor source 202 to the chamber device 204.

[0054] As described above, during some deposition operations, material may build up on surfaces and structures located within the interior 238 of the chamber body 212, potentially degrading the performance of the semiconductor processing system 200 ( Figure 1 For example, Material 14 ( Figure 5 248 and 250) may accumulate on a stem portion of the lift pin that is slidably received within one or more lift pin holes 260 in which the lift pin is received, potentially causing the lift pin to bind within one of the plurality of lift pin holes 260 during movement of the substrate support 216 between the first position 248 and the second position 250. Material 16 ( Figure 5 248 and the second position 250. The material 18 ( Figure 5 248 and 250) may build up between the substrate support 216 and a portion of a lift pin received within the substrate support 216, increasing the resistance of the lift pin to sliding through the substrate support 216 and potentially causing the lift pin to bind within one of the plurality of lift pin holes 260 receiving the lift pin during movement between the first position 248 and the second position 250. In order to limit (or eliminate) the risk of such lift pin binding, a lift pin arrangement 100 is provided.

[0055] refer to Figure 7 , a lift pin device 100 is shown as an example of the present disclosure. In the example shown, the lift pin device 100 includes a lift pin 102, a counterweight body 104, and a cover member 106. The lift pin 102 is configured to carry a substrate 2 ( Figure 1 As shown) and the counterweight 104 is suspended on the chamber body 212 ( Figure 2 The inner surface 262 (shown) Figure 3 ) so that the mass of the counterweight 104 opposes the lifting pin 102 passing through the substrate support 216 ( Figure 2 resistance to sliding movement of the material 14-18 ( Figure 5 The counterweight 104 is configured to be fixed to the lift pin 102, such as such that the counterweight 104 is axially fixed relative to a lift pin axis 110 defined by the lift pin 102 and radially free relative to the lift pin axis 110 when located on the lift pin 102. The cover member 106 is configured to be slidably received on the lift pin 102, such that the cover member 106 is axially free and radially fixed relative to the lift pin 102, whereby the cover member 106 radially fixes the counterweight 104 relative to the lift pin axis 110 by capturing the counterweight 104, and the cover member 106 cooperates with the lift pin 102 to fix the counterweight 104 to the lift pin 102 without fasteners or threads.

[0056] The lift pin 102 includes a lift pin body 108. The lift pin body 108 defines a lift pin axis 110 (or is arranged along it) and has a contact pad 112, a stem segment 114, a neck segment 116, and a base segment 118. The contact pad 112 is configured to be moved when the substrate 2 is placed on the substrate support 216 ( Figure 1 ) and during removal from it, the carrier substrate 2 ( Figure 1 The lift pin body 108 may be radially enlarged relative to other sections of the lift pin body 108, extend about the lift pin axis 110, and have a contact pad width 120 and a contact pad height 122. In some examples, the contact pad 112 may have a cylindrical shape, in which case the contact pad width 120 is the contact pad diameter. In some examples, the lift pin body 108 may be formed of a ceramic material 124. Examples of suitable ceramic materials include alumina, aluminum oxide (Al 2 O 3 ) and silicon carbide (SiC). It is also contemplated that the lift pin body 108 may be formed of a carbonaceous material, such as glassy carbon as a non-limiting example, and still be within the scope of the present disclosure.

[0057] The rod section 114 of the lifting body 108 is configured to be slidably received in the substrate support 216 ( Figure 1 110 , and in this regard extends axially from the contact pad 112 along the lift pin axis 110. In another aspect, the stem segment 114 has a stem segment width 126 and a stem segment height 128. The stem segment width 126 is less than the contact pad width 120 of the contact pad 112. The stem segment height 128 is greater than the contact pad height 122 of the contact pad 112. The stem segment 114 may be cylindrical in shape, the stem segment 114 defining a circular cross-sectional area, and the stem segment width 126 is a diameter in such an example. The stem segment 114 and the contact pad 112 may also define a fillet therebetween that reduces stress within the lift pin body 108.

[0058] The neck section 116 of the lift pin body 108 is configured to axially secure the counterweight body 104 along the lift pin body 108, and in this regard extends axially from the shaft section 114 and is separated from the contact pad 112 by the shaft section 114 of the lift pin body 108. It is contemplated that the neck section 116 has a neck section width 130 and a neck section height 132. The neck section width 130 can be less than the shaft section width 126 of the shaft section 114. The neck section height 132 can be less than the shaft section height 128. It is also contemplated that the neck section height 132 can be less than the contact pad height 122 of the contact pad 112, and that the neck section 116 can be cylindrical. The neck section 116 can define a circular cross-sectional area, the neck section width 130 can be a diameter in such an example, and the neck section 116 and the shaft section 114 can also define a fillet therebetween. In light of this disclosure, those skilled in the art will appreciate that the rounded corners may further limit stresses within the lift pin body 108 , increasing the mass that the lift pin 102 may carry relative to examples without rounded corners.

[0059] Reference Figure 8 and Fig. 9 The base section 118 of the lift pin body 108 is configured to position the lift pin 102 within the interior of the chamber body 212 ( Figure 2 The base section 118 of the lifting pin body 108 is further configured to carry the counterweight body 104 ( Figure 7 ), and thus the lift pin body 108 can respond to the lift pin 102 passing through the substrate support 216 ( Figure 1 In these aspects, the base segment 118 extends axially from the neck segment 116 along the lift pin axis 110, is separated from the shaft segment 114 of the lift pin body 108 by the neck segment 116 of the lift pin body 108, and has a base segment width 134 and a base segment height 136. The base segment width 134 can be greater than the neck segment width 130 of the neck segment 116, and can also be substantially equal to the shaft segment width 126 of the shaft segment 114. The base segment height 136 can be less than the neck segment height 132 of the neck segment 116, limiting the processing volume 242 ( Figure 2 242 is necessary for the counterweight body 104 and the lift pin body 108 to cooperate with each other in the interior 238 of the chamber body 212. It is contemplated that the base segment 118 may have a cylindrical portion 138 adjacent to the neck segment 116 and defining a base segment width 134, and a hemispherical portion 140 extending from the cylindrical portion 138 and separated from the neck segment 116 by the cylindrical portion 138 of the base segment 118. In some examples, the base segment 118 and the neck segment 116 may define a fillet therebetween to limit stresses within the lift pin body 108. According to some examples, the base segment 118 may connect to the neck segment 116 at an orthogonal interface to facilitate assembly of the counterweight body 104 to the lift pin 102 and limit tilt within the lift pin assembly 100.

[0060] In certain examples, the base segment 118 may have an annular seating surface 142. The annular seating surface 142 is configured to slidably receive the counterweight body 104 thereon and, in this regard, extends circumferentially about the neck segment 116 of the lift pin body 108, opposite the stem segment 114 of the lift pin body 108, and substantially orthogonal to the neck segment 116 of the lift pin body 108. It is contemplated that the annular seating surface 142 extends circumferentially about the lift pin axis 110 and is substantially orthogonal relative to the lift pin axis 110. It is also contemplated that the hemispherical portion 140 of the base segment 118 defines a stem 144 that is disposed along the lift pin axis 110 and is axially spaced from the neck segment 116 by the cylindrical portion 138 of the base segment 118 and the hemispherical portion 140 of the base segment 118 of the lift pin body 108.

[0061] Reference Fig.10 and 11 , showing the counterweight body 104. Fig. 9 As shown, the counterweight body 104 is formed of a counterweight body material 146, is generally cylindrical, and defines a recess 148. The counterweight body 104 also has a C-shaped upper surface 150 that defines an upper surface opening 152 leading to the recess 148, a C-shaped lower surface 154 that defines a lower surface opening 156 leading to the recess 148, and a side surface 158 with a side surface opening 160 leading to the recess 148. When the counterweight body 104 is assembled to the lifting pin body 108 ( Figure 7 148, and the like. When the counterweight body 104 is mounted on the counterweight body 104, the C-shaped upper surface 150 can be substantially orthogonal to the lift pin axis 110, extending circumferentially around the lift pin axis 110 in a generally circular shape interrupted by the recess 148, and defining a counterweight body width 162 that can radially span the counterweight body 104 and the recess 148. The C-shaped lower surface 154 is similar to the C-shaped upper surface 150, axially offset from the C-shaped upper surface 150 of the counterweight body 104 along the lift pin axis 110, and connected to the C-shaped upper surface 150 by a side surface 158 of the counterweight body 104. In some examples, the counterweight body material 146 can include a ceramic material, such as a bulk ceramic material. Examples of suitable ceramic materials include, by way of non-limiting example, alumina, aluminum oxide (Al2O3), and aluminum oxide (Al2O3). 2 O 3 ) and silicon carbide (SiC).

[0062] It is contemplated that the counterweight body 104 is configured to receive the lift pin body 108 ( Figure 7160 ). In this regard, it is contemplated that the recess 148 can extend radially inward from the side surface opening 160 and be defined by a first interior planar facet 164, a second interior planar facet 166, and an interior cylindrical facet 168. The first interior planar facet 164 extends chord-wise from the side surface opening 160 to the interior cylindrical facet 168. The interior cylindrical facet 168 is opposite the side surface opening 160 along the diameter of the counterweight body 104, is separated from the side surface opening 160 of the recess 148 by the lift pin axis 110, and is spaced apart from the side surface opening 160 by a radially extending recess depth 165. It is contemplated that the recess depth 165 is greater than half of the counterweight body width 162 defined by the counterweight body 104. For example, the recess depth 165 may be between about 60% and about 90% of the counterweight body width 162, or between about 60% and about 80% of the counterweight body width 162, or even between about 60% and about 70% of the counterweight body width 162. In view of this disclosure, one skilled in the art will appreciate that recess depths within these ranges enable the counterweight body 104 to be concentrically located on the lift pin body 108 and about the lift pin axis 110.

[0063] In some examples, the counterweight body 104 can be configured to receive the lift pin body 108 ( Figure 7 The neck section 116 (shown) Figure 7 shown) and rod segment 114 ( Figure 7 14 and 15. In this regard, the recess 148 can be further defined by an inner shoulder facet 170. When the counterweight body 104 is positioned on the lift pin body 108, the inner shoulder facet 170 can be substantially parallel to the C-shaped upper surface and / or the C-shaped lower surface 154 of the counterweight body 104, and can be substantially orthogonal relative to the lift pin axis 110. The inner shoulder facet 170 can extend radially inward from the side surface opening 160 into the counterweight body 104 to the inner cylindrical facet 168 and divide the first inner planar facet 164 into an upper first inner planar facet 172 and a lower first inner planar facet 174. The inner shoulder facet 170 can extend through the inner cylindrical facet 168 and divide the inner cylindrical facet 168 into an upper inner cylindrical facet 176 and a lower inner cylindrical facet 178. Internal shoulder facet 170 may extend through second internal planar facet 166 and divide second internal planar facet 166 into an upper second internal planar facet 180 and a lower second internal planar facet 182 .

[0064] It is contemplated that the inner shoulder facet 170 is separated from the C-shaped lower surface 154 by a shoulder facet height 184. The shoulder facet height 184 may be substantially equal to the height of the lift pin body 108 ( Figure 7 The neck height 132 (shown) Figure 7), the inner shoulder facet 170 thereby divides the recess 148 into a neck segment recess portion 186 and a shaft segment recess portion 188. The neck segment recess portion 186 can be defined by the lower first inner planar facet 174, the lower inner cylindrical facet 178, and the lower second inner planar facet 182, and is thus configured to receive the entire neck segment 116 (of the lift pin body 108) therein. Figure 6 The stem segment recess portion 188 may be defined by the upper first interior planar facet 172, the upper interior cylindrical facet 176, and the upper second interior planar facet 180, thereby being configured to receive the stem segment 114 of the lift pin body 108 therein ( Figure 6 shown).

[0065] In some examples, the neck segment recess portion 186 can define a first recess width 147 between the lower first interior planar facet 174 and the lower second interior planar facet 182, and the shaft segment recess portion 188 can define a second recess width 149 between the upper first interior planar facet 172 and the upper second interior planar facet 180. The first recess width 147 can be substantially equal to the neck segment width 130, and the second recess width 149 can be substantially equal to the shaft segment width 126. In view of this disclosure, those skilled in the art will appreciate that the internal shoulder facet 170 and the C-shaped lower surface 154 can cooperate with the neck segment 116 of the lift pin body 108 to axially secure the counterweight body 104 relative to the lift pin body 108 when the neck segment 116 is received within the recess 148.

[0066] refer to Fig.12 and 13 , a cover member 106 is shown. The cover member 106 is formed of a cover member material 186 and has an annular upper surface 190, an annular lower surface 192, and an annular cover member body 194. The annular upper surface 190 extends circumferentially around the rod hole 196. The annular lower surface 192 extends circumferentially around the counterweight body hole 198. The annular cover member body 194 extends circumferentially around the hollow interior 101 of the cover member 106, and the hollow interior 101 connects the rod hole 196 defined by the annular upper surface 190 to the counterweight body hole 198 of the annular lower surface 192 of the cover member 106. In some examples, the cover member material 186 forming the cover member 106 may include a ceramic material, such as a bulk ceramic material. As non-limiting examples, examples of suitable ceramic materials include alumina, aluminum oxide (Al2O3), ... 2 O 3 ) and silicon carbide (SiC).

[0067] It is contemplated that the cover member 106 is configured to slidably receive the lift pin body 108 ( Figure 7 shown) and counterweight body 104 ( Figure 7 In this regard, the rod hole 196 may have a substantially equal diameter to the rod segment 114 ( Figure 7The width of the rod section is 126 ( Figure 7 ) and can have a shape substantially the same as the cross-sectional area of ​​the rod section 114 of the lifting pin body 108. On the other hand, the counterweight body hole 198 can have a shape substantially equal to the counterweight body width 162 ( Fig.10 The counterweight body hole width 105 shown in FIG. 104 and the annular cover member body 194 may have a counterweight body height 109 ( Fig.11 The inner height 107 (shown) of the cover member Fig.16 In view of the present disclosure, those skilled in the art will appreciate that the rod hole width 103 is sized to be substantially equal to the rod segment width 126 and has substantially the same shape so that the cover member 106 can slidably accommodate the rod segment 114 of the lift pin body 108 therethrough. In view of the present disclosure, those skilled in the art will also appreciate that the counterweight body hole width 105 is sized to be substantially equal to the counterweight body width 162 and the cover member interior height 107 is sized to be substantially equal to the counterweight body height 109 so that the cover member 106 can be slidably accommodate the rod segment 114 of the lift pin body 108 therethrough. Figure 1 The counterweight body 104 is captured and thereby radially secured around the lift pin body 108 during assembly of the assembly (shown).

[0068] It is also contemplated that the cover member 106 defines a key portion 113. The key portion 113 can be configured to be relative to the counterweight body 104 ( Figure 7 106 about the lifting pin axis 110. In this regard, the key portion 113 can radially protrude from the cover member inner surface 119 that defines the hollow interior 101 of the cover member 106 into the hollow interior 101 of the cover member 106. The key portion 113 can have a key portion width 121 ( Fig.17 ), the width may be substantially equal to the concave portion 148 ( Fig.10 The lower first inner plane 174 facet (shown) Fig.11 ) and the lower second inner planar facet 182 ( Fig.11 The width of the recess 147 (shown) between Fig.11). On the other hand, the key portion 113 can have a radial extent 125 that is less than half of the counterweight body width 162, so that when the counterweight body 104 is captured within the cover member 106, the key portion 113 of the cover member 106 can abut the neck section 116 of the lift pin body 108. In some examples, the key portion 113 can be substantially flat along the cover member interior height 107, and the key portion 113 is spaced apart from at least one of the upper first interior planar facet 172 and the upper second interior planar facet 180 to simplify the manufacture of the cover member 106. According to some examples, the cover member 106 and the counterweight body 104 are rotationally fixed to each other and are free to rotate together relative to the lift pin body 108 about the lift pin axis 110. In view of this disclosure, those skilled in the art will appreciate that this can simplify the chamber device 204 ( Figure 1 ) by providing the maintainer with a tactile indication (e.g., a rough reality check type manual inspection) of whether the accumulated material occupies the lift pin device 100 ( Figure 1 ), potentially resulting in mechanical clearance within the semiconductor processing system 200 ( Figure 1 risk of contamination during operation).

[0069] It is contemplated that the cover member 106 has a cover member axial height 145 ( Fig.14 As shown), the counterweight body 104 has a counterweight body axial height 109 ( Fig.11 109 ), and the cover member axial height 145 is greater than the counterweight body axial height 109. For example, the cover member axial height 127 may be greater than or equal to the counterweight body axial height 109 plus the axial thickness 133 of the annular upper surface 190 of the cover member 106. In view of this disclosure, those skilled in the art will understand that this enables the cover member 106 to surround the counterweight body 104 when the counterweight body 104 and the cover member 106 are assembled to the lift pin body 108. It is also contemplated that the cover member 106 may have a cover member inner width 137, and the cover member inner width 137 may be substantially equal to the counterweight body width 143. In view of this disclosure, those skilled in the art will also understand that this tilts the cover member 106 relative to the lift pin axis 110 through the counterweight body 104.

[0070] refer to Figure 14-17 , showing the assembly of the lift pin device 100 and the arrangement of the lift pin device 100 after assembly. Fig.14 As shown, the lift pin assembly 100 is assembled by placing the lift pins 102 in a plurality of lift pin holes 260 ( Figure 2 ) so that a portion of the rod segment 114, the neck segment 116, and the base segment 118 are each suspended from the substrate support 216 ( Figure 2 shown) below and chamber body 212 ( Figure 2238 (shown) Figure 2 108). Next, the cover member 106 is registered with the lift pin body 108 in situ (e.g., within the chamber body 212) such that the base segment 118 of the lift pin body 108 is axially located between the cover member 106 and the neck segment 116 of the lift pin body 108, and the rod hole 196 defined in the annular upper surface 190 of the cover member 106 and the lift pin body 108 are coaxial with each other. Thereafter, the cover member 106 is translated along the lift pin axis 110 in the first direction A toward the contact pad 112 of the lift pin body 108, whereby the rod segment 114 of the lift pin body 108 is slidably received within the rod hole 196 of the cover member 106. It is contemplated that the cover member 106 is translated along the lift pin axis 110 such that the annular lower surface 192 of the cover member 106 axially overlaps the rod segment 114 of the lift pin body 108, clearing the axial length of the lift pin body 108 occupied by the counterweight body 104 when assembled to the lift pin body 108.

[0071] The assembly of the counterweight body 104 to the lift pin body 108 is accomplished by axially aligning the counterweight body 104 relative to the lift pin body 108 such that the recessed portion 148 of the counterweight body 104 is opposite the neck section 116 of the lift pin body 108 and the C-shaped lower surface 154 is axially aligned with the annular seating surface 142 of the base section 118 of the lift pin body 108. Once so aligned, the counterweight body 104 can be displaced B (e.g., radially advanced) toward the lift pin body 108 such that the C-shaped lower surface 154 slides over the annular seating surface 142 of the base section 118 of the lift pin body 108. It is contemplated that the C-shaped lower surface 154 slides over the annular seating surface 142 of the base section 118 until the lower inner cylindrical facet 178 ( Fig.10 The upper inner cylindrical facet 176 abuts the lower extent (e.g., lower portion) of the rod segment 114. In view of this disclosure, those skilled in the art will appreciate that, when so positioned, the counterweight body 104 is axially fixed relative to the lift pin body 108 along the neck segment 116 by the cooperation of the base segment 118 of the lift pin body 108 and the rod segment 114.

[0072] Once the counterweight body 104 is seated on the annular seating surface 142 of the base section 118 of the lift pin body 108 and around the rod section 114, the cover member 106 can then be rotated D about the lift pin body 108 relative to the counterweight body 104, or vice versa, so that the key portion 113 ( Fig.12150 ) axially covers the recess 148 defined by the side surface 158 of the counterweight body 104. The cover member 106 can then be translated along the lift pin axis 110 in a second direction B opposite to the first direction A (e.g., in a direction opposite to the contact pad 112 and toward the base segment 118) so that the key portion 113 of the cover member 106 is received in the recess 148 defined in the side surface 158 of the counterweight body 104. It is contemplated that the cover member 106 is further translated along the lift pin body 108 so that the annular upper surface 190 of the cover member 106 abuts the C-shaped upper surface 150 of the counterweight body 104. In view of this disclosure, those skilled in the art will appreciate that this radially fixes the counterweight body 104 within the cover member 106 relative to the lift pin body 108, and the counterweight body 104 and the cover member 106 are thereby secured when the lift pin body 108 is in the chamber body 212 ( Figure 2 238 (shown) Figure 2 The lift pin body 108 is loaded axially in tension when suspended from the substrate support 216 in the inner portion of the substrate support 216 (shown). In view of this disclosure, those skilled in the art will also understand that once assembled, the lift pin device 100 slides through a plurality of lift pin holes 260 (shown) that can slidably receive the lift pin body 108. Figure 2 ) and / or during a period on the substrate support 216 ( Figure 2 ) increases the force applied to the lift pin body 108 during upward movement within the chamber body 212, limiting (or eliminating) the risk of accumulated material causing the lift pin 102 to bind within the substrate support 216. Advantageously, in certain examples described herein, assembly of the lift pin apparatus 100 can be accomplished within fasteners and tools, simplifying assembly and / or maintenance of the chamber apparatus 204, and thereby simplifying assembly and / or maintenance of the semiconductor processing system 200 including the lift pin apparatus 100.

[0073] In some examples, the lift pin arrangement 100 may have a lift pin arrangement center of gravity 131 ( Fig.17 In this regard, it is contemplated that: (a) the lift pin body 108 has a centered lift pin body center of gravity 135 ( Fig.17 ), that is, placed along the lifting pin axis 110, (b) the counterweight body 104 has a counterweight center of gravity 139 radially offset from the lifting pin axis 110 ( Fig.17 ), and (c) the cover member 106 has a cover member center of gravity 141 ( Fig.17141 ), which is radially offset from the lift pin axis 110 in a direction radially opposite to the counterweight center of gravity 139. It is contemplated that the volume and configuration of the counterweight body 104 and the cover member 106 are such that the counterweight center of gravity 139 and the cover member center of gravity 141 cooperate to position the lift pin assembly center of gravity 131 on the side of the lift pin axis 110 opposite the key portion 113. Advantageously, when the substrate support 216 is in the first position 248 ( Figure 2 shown) and a second position 250 ( Figure 2 During movement between the lift pin assembly 100 and the substrate support 216, the lift pin assembly center of gravity 131 can introduce an off-axis force component into the lift pin assembly 100, promoting deflection of the lift pin assembly 100, and promoting the breaking of accumulated material that may exist in the gap between the lift pin assembly and the substrate support 216. In view of this disclosure, those skilled in the art will appreciate that this can further limit the tendency of such accumulated material to cause the lift pin assembly 100 to bind within the substrate support 216.

[0074] refer to Fig.18 , showing the manufacture of a lift pin assembly such as lift pin assembly 100 ( Figure 1 The method 300 includes: at a lifting pin, for example, a lifting pin 102 ( Figure 6 ), aligning the cover member to the lift pin body along the lift pin axis, for example, along the lift pin axis 110 ( Figure 6 As shown) the cover member 106 ( Figure 6 ) is aligned to the lifting pin body 108 ( Figure 6 The cover member is then translated along the lift pin axis so that the rod segment of the lift pin body can be slidably received in the cover member, such as the rod segment 114 ( Figure 6 ) is slidably received in the rod hole 196 (shown in FIG. A) of the cover member, as shown in frame 320. Then, a counterweight body, such as the counterweight body 104 ( Figure 6 ), and rotating the counterweight so that the recess of the counterweight and the neck section of the lift pin body occupy a common axial position along the lift pin axis, for example, rotating the counterweight so that the recess 148 (shown in FIG. A) faces (opposite to) the neck section 116 ( Figure 6 ), as shown in box 330 and box 340.

[0075] Next, the counterweight body is assembled to the lift pin body by displacing the counterweight body toward the lift pin body (e.g., radially driving the counterweight body toward the lift pin body) such that the neck section of the lift pin body is slidably received within the recess of the counterweight body, as shown in block 350. The cover member is then rotated about the lift pin body such that a key portion extending radially inward from an inner surface of the cover member axially overlaps the recess of the counterweight body, e.g., a key portion 113 (shown in FIG. A) extending radially inward from an inner surface 119 (shown in FIG. A) of the cover member into the hollow interior 101 (shown in FIG. A) axially overlaps a recess defined within a side surface of the counterweight body, as shown in block 360. The cover member is then translated along the lift pin body in a second direction axially opposite to the first direction such that the cover member substantially surrounds the counterweight body, as shown in block 370. It is contemplated that translating 320 the cover body radially along the lift pin body in the first direction fixes the cover member relative to the lift pin body while leaving the cover axially free relative to the lift pin body, as shown in block 372. It is also contemplated that translating the cover member in the second direction relative to the lift pin body axially constrains the cover member and radially secures the counterweight relative to the lift pin body, as shown in block 374 .

[0076] For example, lift pins may be used to position a substrate on a substrate support prior to depositing a material layer onto the substrate using plasma enhanced chemical vapor deposition and plasma enhanced atomic layer deposition techniques. While generally satisfactory for their intended purpose, in some deposition techniques, material may accumulate onto the lift pins and / or within the mechanical gap defined between the lift pins and the substrate support, potentially limiting the reliability of semiconductor processing systems used for material layer deposition operations. While various countermeasures exist to limit such material layer accumulation, such as by temperature control and / or removing accumulated material between material layer deposition events, there remains a need for improved lift pins, lift pin devices, and semiconductor processing systems including lift pin devices, as well as methods of manufacturing lift pin devices for semiconductor processing systems.

[0077] In the examples described herein, a lift pin arrangement is provided that includes a counterweight carried by a lift pin that increases the force that the lift pin can apply to resist sliding resistance within a substrate support that slidably accommodates the lift pin. In some examples, the lift pin arrangement can include a cover member to fix the counterweight carried by the lift pin relative to the lift pin, limiting (or eliminating) the need for fasteners and / or tools to assemble the lift pin arrangement, simplifying the assembly of the lift pin arrangement. According to some examples, the lift pin counterweight and the cover member can be rotationally fixed relative to each other and freely rotate relative to the lift pin, providing a tactile indication of the accumulation of a material layer within the lift pin arrangement, simplifying the inspection and maintenance of the lift pin arrangement. It is also contemplated that the cover member can move the center of gravity of the lift pin arrangement away from the lift pin axis of the lift pin member, promote the deflection of the lift pin within the lift pin hole, and promote the breaking of the accumulated material at the beginning of the sliding of the lift pin arrangement during the removal of the substrate after the material layer is deposited on the substrate on the substrate support.

[0078] Although the present disclosure has been provided in the context of certain embodiments and examples, those skilled in the art will understand that the present disclosure extends to other alternative embodiments and / or uses of embodiments beyond the specifically described embodiments and obvious modifications and equivalents thereof. In addition, although various variations of the embodiments of the present disclosure have been shown and described in detail, other modifications within the scope of the present disclosure will be apparent to those skilled in the art based on the present disclosure. It is also contemplated that various combinations or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that the various features and aspects of the disclosed embodiments may be combined or replaced with one another in order to form different modes of embodiments of the present disclosure. Therefore, the scope of the present disclosure should not be limited by the specific embodiments described above.

[0079] The headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein.

Claims

1. A lifting pin, comprising: A lift pin body arranged along a lift pin axis, the lift pin body having: enlarged contact pads; a rod segment extending axially from the contact pad; a neck section extending axially from the stem section and separating the stem section and the contact pad through the lift pin body; and a base section extending axially from the neck section and separated from the shaft section by the neck section, The base section has a base section width, the neck section has a neck section width, and the neck section width is smaller than the base section width so that the lift pin counterweight is carried by the lift pin body.

2. The lifting pin according to claim 1, wherein: The lift pin body is formed of a ceramic material.

3. The lifting pin according to claim 1, wherein: The contact pad has a contact pad width, wherein the stem segment has a stem segment width, and wherein the stem segment width is less than the contact pad width and greater than the neck segment width.

4. The lifting pin according to claim 1, wherein: The base section has an annular seating surface and a hemispherical portion, wherein the annular seating surface extends around the neck section and is opposite the stem section of the lift pin body, and wherein the annular seating surface is orthogonal relative to the lift pin axis.

5. The lift pin according to claim 1, wherein: The base segment has a base segment height, wherein the neck segment has a neck segment height greater than the base segment height, wherein the contact pad has a contact pad height greater than the neck segment height, and wherein the stem segment has a stem segment height greater than the contact pad height.

6. A lifting pin device, comprising: The lifting pin as claimed in claim 1; a counterweight body disposed on a base section of the lift pin body, the counterweight body being axially fixed and radially free relative to the lift pin body; as well as A cover member is slidably received on the lift pin body and extends circumferentially around the counterweight body, wherein the cover member is axially free and radially fixed relative to the lift pin body.

7. The lift pin device according to claim 6, wherein: The lifting pin body has a lifting pin body center of gravity arranged along the lifting pin axis, wherein the counterweight body has a counterweight center of gravity radially offset from the lifting pin axis, wherein the cover member has a cover member center of gravity radially offset from the lifting pin axis, and wherein the lifting pin device has a lifting pin device center of gravity offset from the lifting pin axis.

8. The lift pin device according to claim 6, wherein: The counterweight body has a counterweight body width and a recess, and wherein the recess has a recess depth that spans more than half of the counterweight body width.

9. The lift pin device according to claim 8, wherein: The counterweight body defines an internal shoulder facet that is substantially orthogonal relative to the lift pin axis, the counterweight body having a C-shaped upper surface and a C-shaped lower surface, the C-shaped lower surface being axially opposite to the C-shaped upper surface and parallel to the internal shoulder facet, the internal shoulder facet being axially spaced apart from the base section of the lift pin body by the neck section height of the neck section.

10. The lift pin device according to claim 8, wherein: The cover member has an axially extending key portion, and the key portion is slidably received in the recess of the weight body.

11. The lift pin device according to claim 6, wherein: The recess has a recess width, and wherein the neck width is substantially equal to the recess width.

12. The lift pin device of claim 6, wherein: The cover member has an annular upper surface and an annular lower surface. The annular upper surface extends circumferentially around the rod segment of the lift pin body and radially fixes the cover member relative to the lift pin body. The annular lower surface extends around the counterweight body and radially fixes the counterweight body relative to the cover member.

13. The lift pin device of claim 6, wherein: The lift pin body is formed of alumina (Al2O3), wherein the lift pin weight is formed of alumina (Al2O3), and wherein the cover member is formed of alumina (Al2O3).

14. The lift pin device of claim 6, wherein: The cover member has a cover member axial height, wherein the counterweight body has a counterweight body axial height, and wherein the cover member axial height is greater than the counterweight body axial height.

15. The lift pin device of claim 6, wherein: The cover member has a cover member inner width, wherein the counterweight body has a counterweight body width, wherein the cover member inner width is greater than the counterweight body width, and wherein the cover member inner width is equal to the counterweight body width.

16. A semiconductor processing system comprising: a chamber body having an inlet port and an exhaust port; a showerhead secured within the chamber body between the inlet port and the discharge port; a substrate support disposed within the chamber body between the showerhead and the exhaust port, the substrate support defining lift pin holes therein; as well as The lift pin of claim 1, wherein the stem section of the lift pin body is slidably received within the lift pin bore.

17. The semiconductor processing system of claim 16, wherein: The substrate support has a first position and a second position separating the first position from the showerhead, the semiconductor processing system further comprising a substrate support actuator operably connected to the substrate support to move the substrate support between the first position and the second position.

18. The semiconductor processing system of claim 16, further comprising: a counterweight body having a recessed portion for receiving the neck section of the lift pin body; as well as The cover member has a rod segment hole and a counterweight body hole, wherein the rod segment of the lifting pin body is slidably accommodated in the rod segment hole, and the counterweight body is slidably accommodated in the counterweight body hole.

19. The semiconductor processing system of claim 18, wherein: The recess has a first recess width and a second recess width, wherein the second recess width is axially offset from the first recess width, wherein the first recess width is substantially equal to a shaft segment width of the lift pin body, and wherein the second recess width is substantially equal to a neck segment width defined by a neck segment of the lift pin body.

20. A method of manufacturing a lift pin apparatus for a semiconductor processing system, the method comprising: At the lift pin, the lift pin includes a lift pin body arranged along the lift pin axis, the lift pin body having an enlarged contact pad, a rod section axially extending from the contact pad, a neck section axially extending from the rod section and separated from the contact pad by the rod section of the lift pin body, and a base section axially extending from the neck section and separated from the rod section by the neck section, the base section having a base section width, the neck section having a neck section width, and the neck section width is smaller than the base section width, aligning the cover member with the lift pin axis; translating the cover member in a first direction along the lift pin axis so that the rod segment of the lift pin body is slidably received in the cover member; Arrange a counterweight along the lifting pin axis; rotating the counterweight body so that the recessed portion faces the neck section of the lift pin body; displacing the counterweight relative to the lift pin body so that the neck section of the lift pin body is slidably received within the recess; as well as The cover member is translated in a second direction along the lift pin body so that the cover member surrounds the counterweight body, whereby the lift pin body carries the counterweight body.

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