A support column driving structure on a wafer support plate of a single wafer cleaning device

Abstract

The present application relates to a drive structure for support columns on a wafer support plate in a single-wafer cleaning device, belonging to the technical field of wafer production equipment. The outer ring of the rotating member of the drive structure for support columns on the wafer support plate in a single-wafer cleaning device has external teeth that mesh with both the support column drive gear and the counterweight. The counterweight dampens the rotation of the rotating member, and the direction of the damping action is consistent with the direction of rotation of the rotating member, thereby stabilizing the rotation of the rotating member, reducing vibration, and improving the safety of the support columns when clamping the wafer.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular relates to a support column driving structure on a wafer support plate of a single wafer cleaning device. Background Art

[0002] Chinese invention patent CN118099074A discloses an integrated wafer support plate structure for a single-wafer cleaning device. The structure comprises a plate, support columns, and a drive mechanism. The drive mechanism uses gears to drive drive gears at the bottom of the support columns, thereby rotating the support columns to clamp the wafers. Because the entire mechanism rotates rapidly, it generates significant vibration, which can easily damage the wafers during clamping. Summary of the Invention

[0003] The technical problem to be solved by the present invention is: to solve the deficiencies in the prior art, thereby providing a support column driving structure on a wafer support plate of a single-wafer cleaning device with damped rotation to improve wafer safety.

[0004] The technical solution adopted by the present invention to solve its technical problem is:

[0005] A support column driving structure on a wafer support plate of a single wafer cleaning device comprises:

[0006] The disk has an internal installation space;

[0007] The rotating member comprises an inner ring and an outer ring, wherein the inner ring has inner teeth and the outer ring has outer teeth;

[0008] a driving member, meshing with the internal teeth and used for driving the rotating member to rotate, so that the rotating member changes between an initial state and a clamped state;

[0009] an elastic member, used for applying elastic force to the rotating member to restore the rotating member to an initial state;

[0010] A counterweight body, comprising a rotating column and a protrusion disposed on the rotating column, wherein one end of the protrusion close to the rotating column has a counterweight body gear meshing with the external teeth, and the other end of the protrusion extends in a direction away from the rotating column and forms a weight end;

[0011] The support column driving gear is meshed with the external teeth, and the rotating member can drive the support column driving gear to swing when changing between the initial state and the clamping state.

[0012] Preferably, in the support column driving structure on the wafer support plate of the single-wafer cleaning device of the present invention, the counterweight gear is a sector gear.

[0013] Preferably, in the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention, the elastic member includes a spring, one end of the spring is connected to the fixed column located on the rotating member, and the other end is connected to the fixed member located on the disk surface.

[0014] Preferably, the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention has an arc groove on the rotating part, and the fixed part is connected to the disk surface through the arc groove, so that all the fixed columns and the connecting columns between the fixed part and the disk surface are located in the same circle.

[0015] Preferably, the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention is provided with a first pressing block and / or a second pressing block on the disk surface, the first pressing block is used to press the inner ring, and the second pressing block is used to press the outer ring.

[0016] Preferably, in the support column driving structure on the wafer support plate of the single-wafer cleaning device of the present invention, the inner sides of the inner ring and the outer ring have recessed steps, and the first pressing block and the second pressing block abut against the steps.

[0017] Preferably, in the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention, the first pressing block and the second pressing block are arc-shaped blocks, and the first pressing block and the second pressing block are connected to the disk surface by screws.

[0018] Preferably, the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention is further provided with a plurality of clamping wheels on the disk surface, and the clamping wheels are tightly attached to the inner wall of the outer ring.

[0019] The beneficial effects of the present invention are:

[0020] The support column driving structure on the wafer support plate of the single-wafer cleaning device of the present invention has external teeth on the outer ring of the rotating part, and the external teeth are engaged with the support column driving gear and the counterweight body at the same time. The counterweight body has a damping effect on the rotation of the rotating part. At the same time, the direction of the damping effect is consistent with the rotation direction of the rotating part, which can stabilize the rotation of the rotating part, reduce vibration, and improve the safety of the support column when clamping the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solution of the present application is further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 1 This is a front view of the support column driving structure on the wafer supporting plate of the single wafer cleaning device according to an embodiment of the present application;

[0023] Figure 2 This is a three-dimensional diagram of the support column driving structure on the wafer supporting plate of the single wafer cleaning device according to an embodiment of the present application;

[0024] Figure 3 This is a partial enlarged view of the driving structure of the support column on the wafer supporting plate of the single wafer cleaning device according to the embodiment of the present application;

[0025] The reference numerals in the figures are:

[0026] 1 board;

[0027] 2 rotating parts;

[0028] 21 inner ring;

[0029] 22 outer ring;

[0030] 23 steps;

[0031] 24 arc grooves;

[0032] 211 internal teeth;

[0033] 221 external teeth;

[0034] 3. Driving parts;

[0035] 41 first pressing block;

[0036] 42 second pressing block;

[0037] 5. Clamping wheel;

[0038] 6 elastic parts;

[0039] 61 spring;

[0040] 62 fixed column;

[0041] 63 fixings;

[0042] 7. Counterweight;

[0043] 71 Rotating Column;

[0044] 72 bumps;

[0045] 721 counterweight gear;

[0046] 722 Heavy End;

[0047] 8 Support column drive gear. DETAILED DESCRIPTION

[0048] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0049] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0050] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0051] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0052] Example

[0053] This embodiment provides a support column driving structure on a wafer support plate of a single wafer cleaning device, such as Figure 1 As shown, including:

[0054] The disk 1 has an internal installation space;

[0055] The rotating member 2 includes an inner ring 21 and an outer ring 22. The inner ring 21 has inner teeth 211, and the outer ring 22 has outer teeth 221. The inner ring 21 and the outer ring 22 are connected by a connecting portion, and the other parts except the connecting portion are hollow.

[0056] The driving member 3 is engaged with the inner teeth 211 and is used to drive the rotating member 2 to rotate, so that the rotating member 2 changes between the initial state and the clamping state;

[0057] The elastic member 6 is used to apply elastic force to the rotating member 2 to restore the rotating member 2 to its initial state;

[0058] The counterweight 7 includes a rotating column 71 and a protrusion 72 disposed on the rotating column 71. The protrusion 72 has a counterweight gear 721 meshing with the external teeth 221 at one end thereof close to the rotating column 71. The other end of the protrusion 72 extends away from the rotating column 71 and forms a weight end 722.

[0059] The support column driving gear 8 is engaged with the outer teeth 221 , and the rotating member 2 can drive the support column driving gear 8 to swing when changing from the initial state to the clamping state.

[0060] The support column driving structure on the wafer support plate of the single-wafer cleaning device of this embodiment has an outer tooth 221 on the outer ring 22 of the rotating part 2. The outer tooth 221 is engaged with the support column driving gear 8 and the counterweight body 7 at the same time. The counterweight body 7 has a damping effect on the rotation of the rotating part 2. At the same time, the direction of the damping effect is consistent with the rotation direction of the rotating part 2, which can stabilize the rotation of the rotating part 2, reduce vibration, and improve the safety of the support column when clamping the wafer.

[0061] The unenlarged end of the weight end 722 may also be a mounted weight block.

[0062] Furthermore, the counterweight gear 721 is a sector gear, that is, a gear having only one arc section. The sector gear can save materials and reduce the volume of the disc 1 at the same time.

[0063] Furthermore, the elastic member 6 constantly applies an elastic force to the rotating member 2. Once the driving member 3 no longer applies the driving force, the rotating member 2 can immediately return from the clamped state to the initial state. The elastic member 6 includes a spring 61, one end of which is connected to a fixing post 62 on the rotating member 2, and the other end is connected to a fixing member 63 on the disk surface 1.

[0064] Furthermore, the rotating member 2 is provided with an arcuate slot 24, through which the fixing member 63 passes to connect with the disk surface 1, so that all the fixing posts 62 and the connecting posts of the fixing member 63 and the disk surface 1 are located within the same circle. The cocircularity of all the fixing posts 62 and the connecting posts of the fixing member 63 and the disk surface 1 ensures that the elastic force is consistent with the rotational direction of the rotating member 2, allowing the elastic force to be efficiently converted into the force that drives the rotating member 2 (that is, the elastic force is basically distributed along the tangent direction of the arc, without having to be decomposed in the diameter direction of the circle, thereby reducing the driving efficiency of the elastic force). During the actual assembly process, the difference in the spring elastic coefficient will not cause the rotating member 2 to be subjected to force in one direction (the force in the diameter direction cannot be balanced).

[0065] The support column driving gear 8 is connected to the support column. The support column is located on the top surface of the disk 1. The support column can swing to clamp or loosen the wafer.

[0066] Furthermore, a first pressing block 41 and / or a second pressing block 42 are provided on the disk surface 1 . The first pressing block 41 is used to press the inner ring 21 , and the second pressing block 42 is used to press the outer ring 22 .

[0067] Furthermore, the inner sides of the inner ring 21 and the outer ring 22 have inwardly recessed steps 23 , and the first pressing block 41 and the second pressing block 42 abut against the steps 23 .

[0068] Furthermore, the first pressing block 41 and the second pressing block 42 are arc-shaped blocks, and the first pressing block 41 and the second pressing block 42 are connected to the disk surface 1 by screws.

[0069] Furthermore, a plurality of clamping wheels 5 are provided on the disk surface 1 , and the clamping wheels 5 are tightly attached to the inner wall of the outer ring 22 .

[0070] Based on the above-mentioned ideal embodiments of this application, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the scope of the technical concept of this application. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A support column driving structure on a wafer support plate of a single wafer cleaning device, characterized in that: include: A disk (1) having an installation space therein; The rotating member (2) comprises an inner ring (21) and an outer ring (22), wherein the inner ring (21) has inner teeth (211) and the outer ring (22) has outer teeth (221); A driving member (3) meshing with the inner teeth (211) and used for driving the rotating member (2) to rotate, so that the rotating member (2) changes between an initial state and a clamping state; an elastic member (6) for applying elastic force to the rotating member (2) to restore the rotating member (2) to an initial state; A counterweight body (7) comprises a rotating column (71) and a protrusion (72) arranged on the rotating column (71), wherein one end of the protrusion (72) close to the rotating column (71) comprises a counterweight body gear (721) meshing with the external teeth (221), and the other end of the protrusion (72) extends in a direction away from the rotating column (71) and forms a weight end (722), wherein the weight end (722) is an enlarged end or a weight block is installed; The support column driving gear (8) is meshed with the outer teeth (221), and the rotating member (2) can drive the support column driving gear (8) to swing when changing between the initial state and the clamping state.

2. The driving structure for the support column on the wafer support plate of the single wafer cleaning device according to claim 1, characterized in that: The counterweight gear (721) is a sector gear.

3. The driving structure for the support column on the wafer supporting plate of the single wafer cleaning device according to claim 1, characterized in that: The elastic member (6) comprises a spring (61), one end of the spring (61) is connected to a fixed column (62) located on the rotating member (2), and the other end is connected to a fixed member (63) located on the disk surface (1).

4. The driving structure for the support column on the wafer supporting plate of the single wafer cleaning device according to claim 3, characterized in that: The rotating member (2) is provided with an arc groove (24), and the fixing member (63) passes through the arc groove (24) and is connected to the disk surface (1), so that all the fixing columns (62) and the connecting columns of the fixing member (63) and the disk surface (1) are located in the same circle.

5. The driving structure for the support column on the wafer support plate of the single wafer cleaning device according to claim 4, characterized in that: A first pressing block (41) and / or a second pressing block (42) are provided on the disk surface (1), the first pressing block (41) is used to press the inner ring (21), and the second pressing block (42) is used to press the outer ring (22).

6. The driving structure for the support column on the wafer support plate of the single wafer cleaning device according to claim 5, characterized in that: The inner sides of the inner ring (21) and the outer ring (22) are provided with inwardly recessed steps (23), and the first pressing block (41) and the second pressing block (42) are pressed against the steps (23).

7. The driving structure for the support column on the wafer supporting plate of the single wafer cleaning device according to claim 5, characterized in that: The first pressing block (41) and the second pressing block (42) are arc-shaped blocks, and the first pressing block (41) and the second pressing block (42) are connected to the disk surface (1) by screws.

8. The driving structure for the support column on the wafer supporting plate of the single wafer cleaning device according to claim 1, characterized in that: A plurality of clamping wheels (5) are also provided on the disk surface (1), and the clamping wheels (5) are tightly attached to the inner wall of the outer ring (22).

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