Filter processing method for reducing mounting area

Abstract

The invention discloses a filter processing method for reducing a surface mounting area, the filter is a body made of a solid dielectric material, the surface of the body is coated with a conductive layer, an input and output isolation groove is formed in the side edge direction of the filter, a conductive layer is formed in the input and output isolation groove, and the conductive layer is formed in the conductive layer. An input and output signal bonding pad or a leading-out signal pin is formed inside the input and output isolation groove in the side edge direction of the filter. According to the invention, side-standing installation is adopted, so that the mounting area can be greatly reduced.

Description

Technical Field

[0001] The present application belongs to the field of filters, and in particular relates to a filter processing method for reducing mounting area. Background Art

[0002] Existing filter manufacturing is increasingly moving towards miniaturization, requiring filters that occupy a small space. Summary of the invention

[0003] The object of the present invention is to provide a filter processing method with reduced mounting area, which can significantly reduce the mounting area by adopting side-mounting installation.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] The embodiment of the present application discloses a filter processing method for reducing the mounting area. The filter is a body made of solid dielectric material, the surface of the body is covered with a conductive layer, an input-output isolation groove is formed in the side direction of the filter, a de-conductive layer is formed in the input-output isolation groove, and input-output signal pads or lead-out signal pins are formed inside the input-output isolation groove in the side direction of the filter.

[0006] Preferably, in the filter processing method for reducing the mounting area, the lead-out signal needle is directly led out from the side of the filter.

[0007] Preferably, in the filter processing method for reducing the mounting area, the input and output signal pads are led out from the front or back side of the filter.

[0008] Compared with the prior art, the present invention has the advantage of overcoming the problem that the existing waveguide filter has a large installation area and the connection equipment takes up space, and is conducive to use in large-scale integrated systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0010] Figure 1 Shown is a front view of the filter in Comparative Example 1;

[0011] Figure 2 Shown is a short side view of the filter in Example 1;

[0012] Figure 3Shown is a short side view of the filter in Example 2;

[0013] Figure 4 Shown is a front or back view of the filter in Example 2;

[0014] Figure 5 Shown is a front view of the filter in Comparative Example 2;

[0015] Figure 6 Shown is a long side view of the filter in Example 3;

[0016] Figure 7 Shown is a long side view of the filter in Example 4;

[0017] Figure 8 Shown is a front or back view of the filter in Example 4. DETAILED DESCRIPTION

[0018] The following will describe the technical solutions in the embodiments of the present invention in detail in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Figure 1-8 In the figure, the filter 100 is a body made of solid dielectric material, the surface of the body is covered with a conductive layer, the filter 100 is formed with an input-output isolation groove 101, a de-conductive layer is formed inside the input-output isolation groove 101, and input-output signal pads 103 or lead-out signal pins 102 are formed inside the input-output isolation groove 101.

[0020] Comparative Example 1 Figure 1 As shown, the isolation grooves 101 are opened on the front side and extend along the short side direction;

[0021] Example 1 Figure 2 As shown, the isolation slot 101 is opened on the short side surface and is formed with a lead-out signal pin 102 .

[0022] Implementation 2 Figure 3-4 As shown, the isolation slot 101 is opened on the short side surface, and the input and output signal pads 103 are led out from the front side or the back side.

[0023] Comparative Example 2 Figure 5 As shown, the isolation grooves 101 are opened on the front side and extend along the long side direction;

[0024] Implementation 3 Figure 6 As shown, the isolation slot 101 is opened on the long side and is formed with a lead-out signal pin 102 .

[0025] Example 4 Figure 7-8 As shown, the isolation groove 101 is opened on the long side, and the input and output signal pads 103 are led out from the front side or the back side.

[0026] That is, the processing method of the filter 100 with reduced mounting area of ​​the present invention, the filter 100 is a body made of solid dielectric material, the surface of the body is coated with a conductive layer, an input-output isolation groove 101 is formed in the side direction of the filter 100, a de-conductive layer is formed in the input-output isolation groove 101, and an input-output signal pad 102 or a lead-out signal needle 103 is formed in the input-output isolation groove 101 in the side direction of the filter 100. The lead-out signal needle 103 is directly led out from the side of the filter 100. The input-output signal pad 102 is led out from the front or back of the filter 100.

[0027] This implementation overcomes the problem that the existing waveguide filter has a large installation area and uses connecting equipment that takes up space, and is conducive to use in large-scale integrated systems.

[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0029] The above is only a specific implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A filter processing method for reducing mounting area, characterized in that: The filter is a body made of solid dielectric material, the surface of the body is covered with a conductive layer, an input-output isolation groove is formed in the side direction of the filter, a deconductive layer is formed in the input-output isolation groove, and input-output signal pads or lead-out signal pins are formed inside the input-output isolation groove in the side direction of the filter.

2. The filter processing method for reducing mounting area according to claim 1, characterized in that: The lead-out signal needle is directly led out from the side of the filter.

3. The filter processing method for reducing mounting area according to claim 1, characterized in that: The input and output signal pads are led out from the front side or the back side of the filter.

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