Semiconductor functional material heater based on new energy automobile

Abstract

The invention relates to the technical field of heaters, and provides a new energy automobile-based semiconductor functional material heater, which comprises a frame, a semiconductor heating plate fixedly connected to the inner side of the frame, side plates fixedly connected to the two sides of the frame, and a heat dissipation plate fixedly connected between the semiconductor heating plate and the frame, the surface of the frame is fixedly connected with a connector electrified with an automobile; an adjusting structure is arranged on the inner side of the frame and used for rapidly increasing heat when the heat is insufficient. A clamping structure is arranged on the surface of the frame and used for being clamped with an automobile component. The adjusting structure comprises a movable heating plate arranged on the inner side of the frame in a sliding mode, and the surface of the heat dissipation plate is provided with an opening hole allowing the opening hole to slide. By means of the technical scheme, the problems that an existing heater is either a heat pump, but the heat pump is large in power consumption, low in heating speed and high in maintenance cost, or the heating efficiency is low and the temperature increasing speed in a vehicle is low when a partition air conditioner is used are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heaters, and in particular to a heater based on semiconductor functional materials for new energy vehicles. Background Art

[0002] New energy vehicles have the advantages of energy saving and emission reduction or zero pollution, so they are gradually accepted by people. At present, the mainstream new energy vehicles on the market are plug-in hybrid and extended-range power, or hydrogen energy vehicles, solar energy vehicles, etc. Since new energy vehicles usually do not need to start the engine or have no engine, heat pumps are usually used to heat the interior of the car in cold winter or cold areas, that is, turn on the car's air conditioner; After searching, the authorization announcement number is CN217876440U, which is a heater based on semiconductor functional materials for new energy vehicles. The utility model uses a heater body, a shell and a heat exchange plate to form a heater, which is convenient to install on new energy vehicles to provide warm air. The guide plate on the inner wall of the shell improves the fluidity of the air. The overall structure is simpler, the technology is mature, and it can ensure the consistency of heating and improve the comfort of use. However, the above-mentioned existing heaters are either heat pumps, which have high power consumption and slow heating speed and high maintenance costs, or they have low heating efficiency when using zoned air conditioning and the temperature inside the car increases slowly. For this reason, we propose a heater based on semiconductor functional materials for new energy vehicles. Summary of the invention

[0003] The present invention proposes a heater based on semiconductor functional materials for new energy vehicles, which solves the problem mentioned in the background technology that the existing heaters are either heat pumps, but the heat pumps have high power consumption and slow heating speed, and high maintenance costs, or low heating efficiency when using zoned air conditioning, and the temperature in the car increases slowly.

[0004] The technical solution of the present invention is as follows: A heater based on semiconductor functional materials for new energy vehicles, comprising a frame, a semiconductor heating plate fixedly connected to the inner side of the frame, side plates fixedly connected to both sides of the frame, a heat sink fixedly connected between the semiconductor heating plate and the frame, and a connector for powering the vehicle fixedly connected to the surface of the frame; An adjustment structure is provided on the inner side of the frame, and the adjustment structure is used to quickly increase the heat when the heat is insufficient; The surface of the frame is provided with a snap-fit ​​structure, and the snap-fit ​​structure is used for snap-fitting with an automobile component.

[0005] As a further technical solution of the present invention, the adjustment structure includes a movable heating plate slidably arranged on the inner side of the frame, the surface of the heat dissipation plate is provided with an opening hole for the opening hole to slide, the surface of the movable heating plate is fixedly connected with a heat conducting plate, the inner side of the frame is fixedly connected with a fixed plate, a connecting spring is connected between the fixed plate and the movable heating plate, a sliding groove is provided on the inner surface of the frame corresponding to the movable heating plate, a conductive sheet is movably connected at the lower end of the sliding groove on the inner side of the frame, a pushing spring is connected between the conductive sheet and the frame, and electrical connectors are fixedly connected at both ends of the movable heating plate.

[0006] As a further technical solution of the present invention, the snap-fit ​​structure includes a fixed column fixedly connected to the surface of the frame, a snap-fit ​​column is connected through the surface of the fixed column, a movable plate is fixedly connected to the surface of the snap-fit ​​column, a return spring is connected inside the fixed column, and a pull ring is fixedly connected to one end of the snap-fit ​​column.

[0007] As a further technical solution of the present invention, the movable heating plate slides along the length direction of the heat sink, the heat conductive plate is a heat conductive material, the inner surface of the heat conductive plate is in contact with the heat sink, and the heat conductive plate is located on the outer surface of the movable heating plate close to the heat sink.

[0008] As a further technical solution of the present invention, the connecting spring is vertically arranged, and the upper and lower elastic ends of the connecting spring are respectively fixedly connected to the fixed plate and the movable heating plate, and the surface of the fixed plate has holes for heat to pass through.

[0009] As a further technical solution of the present invention, the connecting spring is a spring that expands when heated and contracts when pre-cooled. The upward and downward movement of the movable heating plate is achieved through the thermal expansion and contraction of the connecting spring. When the conductive sheet contacts the power connector, current will flow through the movable heating plate. The pushing spring is arranged horizontally, and the two end ends of the pushing spring are respectively in contact with the conductive sheet and the inner wall of the frame.

[0010] As a further technical solution of the present invention, the conductive sheet is pushed and kept stable by the pushing spring, the connecting spring and the pushing spring are both made of insulating materials, the number of the adjustment structures is several groups and each group of adjustment structures is arranged between two adjacent groups of semiconductor heating plates on the inner side of the frame.

[0011] As a further technical solution of the present invention, the fixed column is a hollow cylindrical structure, the locking column is a regular quadrangular prism structure, the locking column slides along the axial length direction of the fixed column, and the movable plate is arranged on the surface of the locking column corresponding to the internal cavity of the fixed column.

[0012] As a further technical solution of the present invention, the movable plate slides along the length direction of the internal cavity of the fixed column, and the sliding direction is the same as the sliding direction of the locking column. The return spring is arranged inside the cavity of the fixed column, and the return spring is used to push the movable plate together with the locking column to move outward.

[0013] As a further technical solution of the present invention, the pull ring is fixed to one end of the inner side of the locking column, the number of the locking structures is two groups and they are symmetrically distributed, and the locking structures are arranged in the middle positions of both sides of the frame surface.

[0014] The working principle and beneficial effects of the present invention are: In the present invention, by adjusting the structure, when the heat emitted by the semiconductor heating plate is insufficient, more heat can be quickly emitted through the adjusting structure, so that the internal heat of the car can quickly reach the required heat, especially when the zoned air conditioning is used in the car to quickly generate more heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0016] Figure 1 It is a structural schematic diagram of the heater of the present invention; Figure 2 For the present invention Figure 1 Schematic diagram of the local structure from another perspective; Figure 3 For the present invention Figure 2 A partial enlarged view of Figure 4 It is a schematic diagram of the partial structure of the disassembled regulating structure of the present invention; Figure 5 It is a schematic diagram of a partial structure of the slideway of the present invention; Figure 6 It is a schematic diagram of the partial structure of the clamping structure of the present invention.

[0017] In the figure: 1. frame; 2. semiconductor heating plate; 3. side plate; 4. joint; 5. adjustment structure; 51. movable heating plate; 52. opening hole; 53. heat conducting plate; 54. fixed plate; 55. connecting spring; 56. slide groove; 57. conductive sheet; 58. push spring; 59. electrical connector; 6. snap-fit ​​structure; 61. fixed column; 62. snap-fit ​​column; 63. movable plate; 64. reset spring; 65. pull ring; 7. heat sink. DETAILED DESCRIPTION

[0018] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example 1

[0019] like Figure 1~Figure 4 As shown, this embodiment proposes a heater based on semiconductor functional materials for new energy vehicles, including a frame 1, a semiconductor heating plate 2 is fixedly connected to the inner side of the frame 1, side plates 3 are fixedly connected to both sides of the frame 1, a heat sink 7 is fixedly connected between the semiconductor heating plate 2 and the frame 1, and a connector 4 for powering the vehicle is fixedly connected to the surface of the frame 1; An adjustment structure 5 is provided on the inner side of the frame 1, and the adjustment structure 5 is used to quickly increase the heat when the heat is insufficient; The surface of the frame 1 is provided with a snap-fit ​​structure 6, which is used to snap-fit ​​with a vehicle component.

[0020] The adjustment structure 5 includes a movable heating plate 51 slidably arranged on the inner side of the frame 1, an opening hole 52 is provided on the surface of the heat dissipation plate 7 for the opening hole 52 to slide, a heat conducting plate 53 is fixedly connected to the surface of the movable heating plate 51, a fixed plate 54 is fixedly connected to the inner side of the frame 1, a connecting spring 55 is connected between the fixed plate 54 and the movable heating plate 51, a slide groove 56 is provided on the inner surface of the frame 1 corresponding to the movable heating plate 51, a conductive sheet 57 is movably connected at the lower end of the slide groove 56 on the inner side of the frame 1, a pushing spring 58 is connected between the conductive sheet 57 and the frame 1, and electrical connectors 59 are fixedly connected at both ends of the movable heating plate 51.

[0021] The movable heating plate 51 slides along the length direction of the heat sink 7. The heat conducting plate 53 is a heat conducting material. The inner surface of the heat conducting plate 53 is in contact with the heat sink 7. The heat conducting plate 53 is located on the outer surface of the movable heating plate 51 near the heat sink 7. The connecting spring 55 is vertically arranged, and the upper and lower elastic ends of the connecting spring 55 are respectively fixedly connected to the fixed plate 54 and the movable heating plate 51. The surface of the fixed plate 54 has holes for heat to pass through. The connecting spring 55 is a spring that expands when heated and contracts when pre-cooled. The movable heating plate 51 is moved up and down by cold contraction. When the conductive sheet 57 contacts the power connector 59, current will flow into the movable heating plate 51. The pushing spring 58 is arranged horizontally, and the two end ends of the pushing spring 58 are respectively in contact with the conductive sheet 57 and the inner wall of the frame 1. The conductive sheet 57 is pushed and kept stable by the pushing spring 58. Both the connecting spring 55 and the pushing spring 58 are made of insulating materials. There are several groups of adjustment structures 5 and each group of adjustment structures 5 is arranged between two adjacent groups of semiconductor heating plates 2 on the inner side of the frame 1.

[0022] In this embodiment, when the heat emitted by the semiconductor heating plate 2 is insufficient, more heat can be quickly emitted by adjusting the structure 5 so that the internal heat of the car can quickly reach the required heat, especially when zoned air conditioning is used in the car to quickly generate more heat.

[0023] When the maximum temperature of the semiconductor heating plate 2 cannot meet the demand for rapid heating, the semiconductor heating plate 2 can be allowed to generate maximum heat. At this time, the heat generated by the semiconductor heating plate 2 is blown to the interior of the car by the automobile's air blowing mechanism. At the same time, the semiconductor heating plate 2 continuously generates heat and transfers the heat to the connecting spring 55. At the same time, the holes in the fixing plate 54 also transfer the heat to the connecting spring 55. The connecting spring 55 expands due to the heat, and the expanded connecting spring 55 pushes the fixing plate 54 downward to move. During the movement of the movable heating plate 51, the heat conducting plate 53 moves synchronously, and the heat conducting plate 53 always keeps in contact with the heat dissipation plate 7. The heat generated by the movable heating plate 51 can be transferred to the heat dissipation plate 7 through the cooperation of the heat conducting plate 53, and finally the heat is blown to the interior of the car by the automobile's air blowing mechanism. At the same time, when the connecting spring 55 expands to the maximum, the movable heating plate 51 moves downward to the maximum distance. At this time, the connecting head 59 contacts the conductive sheet 57, and the movable heating plate 51 is energized to generate heat. At the same time, the pushing action of the pushing spring 58 can make the conductive sheet 57 and the connecting head 59 closely contact each other, so that the heat generated by the entire heater is more, which can play a good role when the heat inside the car needs more, especially when the zone air conditioning is turned on, by blowing in more wind, the temperature can be quickly uniformed, and the temperature inside the car can be quickly made to reach the set temperature. After the temperature inside the car reaches the set temperature, the heating of the semiconductor heating plate 2 can be reduced or even stopped. At this time, under the reaction force of the connecting spring 55, the movable heating plate 51 can be moved upward together with the connecting head 59, and the connecting head 59 is immediately separated from the conductive sheet 57. At this time, the movable heating plate 51 will not be passed with current, and the heat generation is reduced; it should be noted that due to the characteristics of the car itself, the maximum heat emitted by a plurality of groups of semiconductor heating plates 2 and the adjustment structure 5 should not exceed the maximum set temperature of the air conditioning temperature inside the vehicle.

[0024] The snap-fit ​​structure 6 includes a fixed column 61 fixedly connected to the surface of the frame 1, a snap-fit ​​column 62 is connected through the surface of the fixed column 61, a movable plate 63 is fixedly connected to the surface of the snap-fit ​​column 62, a return spring 64 is connected inside the fixed column 61, and a pull ring 65 is fixedly connected to one end of the snap-fit ​​column 62.

[0025] The fixed column 61 is a hollow cylindrical structure, the locking column 62 is a regular quadrangular prism structure, the locking column 62 slides along the axial length direction of the fixed column 61, and the movable plate 63 is arranged on the surface of the locking column 62 corresponding to the internal cavity of the fixed column 61; the movable plate 63 slides along the length direction of the internal cavity of the fixed column 61, and the sliding direction is the same as the sliding direction of the locking column 62, the reset spring 64 is arranged inside the cavity of the fixed column 61, and the reset spring 64 is used to push the movable plate 63 together with the locking column 62 to move outward; the pull ring 65 is fixed to one end of the inner side of the locking column 62, the number of the locking structures 6 is two groups and they are symmetrically distributed, and the locking structures 6 are arranged in the middle position of both sides of the surface of the frame 1.

[0026] In this embodiment, when installing or removing the heater, the heater can be conveniently installed at a corresponding position on the car, thereby facilitating the installation process and also facilitating the removal and maintenance of the heater.

[0027] During installation, the user can put the locking column 62 on one side of the frame 1 into the corresponding notch on the car, and then pull the other group of pull rings 65 to the side away from the locking column 62, so that the locking column 62 drives the movable plate 63 to move. At this time, the return spring 64 is squeezed and contracted until one end of the locking column 62 is flush with the surface of the frame 1, and then the frame 1 is put into the corresponding notch position on the car. Under the reaction force of the return spring 64, one end of the locking column 62 can be locked in the corresponding notch on the car, and the installation of the heater inside the car can be completed. In this state, the installation of the heater inside the car can be completed obliquely; similarly, the user can stretch the pull ring 65 with both hands at the same time, so that the outer ends of the two groups of locking columns 62 are respectively flush with the surface of the frame 1, and the heater can be pushed into the notch as a whole, and then the pull ring 65 is released to complete the locking of the heater in the car. In this state, the heater can be locked in the interior of the car in a horizontal state.

[0028] In summary, the use principle of the present invention is as follows: During installation, the user can put the locking column 62 on one side of the frame 1 into the corresponding notch on the car, and then pull the other group of pull rings 65 to the side away from the locking column 62, so that the locking column 62 drives the movable plate 63 to move. At this time, the return spring 64 is squeezed and contracted until one end of the locking column 62 is flush with the surface of the frame 1, and then the frame 1 is put into the corresponding notch position on the car. Under the reaction force of the return spring 64, one end of the locking column 62 can be locked in the corresponding notch on the car, and the installation of the heater inside the car can be completed. In this state, the installation of the heater inside the car can be completed obliquely; similarly, the user can stretch the pull ring 65 with both hands at the same time, so that the outer ends of the two groups of locking columns 62 are respectively flush with the surface of the frame 1, and the heater can be pushed into the notch as a whole, and then the pull ring 65 is released to complete the locking of the heater in the car. In this state, the heater can be locked in the interior of the car in a horizontal state.

[0029] During use, when the maximum temperature of the semiconductor heating plate 2 cannot meet the demand for rapid heating, the semiconductor heating plate 2 can be allowed to generate maximum heat. At this time, the heat generated by the semiconductor heating plate 2 is blown to the interior of the car by the automobile's air blowing mechanism. At the same time, the semiconductor heating plate 2 continuously generates heat and transfers the heat to the connecting spring 55. At the same time, the holes in the fixing plate 54 also transfer the heat to the connecting spring 55. The connecting spring 55 expands due to the heat, and the expanded connecting spring 55 pushes the fixing plate 54 downward to move. During the movement of the movable heating plate 51, the heat conducting plate 53 moves synchronously, and the heat conducting plate 53 always keeps in contact with the heat dissipation plate 7. The heat generated by the movable heating plate 51 can be transferred to the heat dissipation plate 7 through the cooperation of the heat conducting plate 53, and finally the heat is blown to the interior of the car by the automobile's air blowing mechanism. At the same time, when the connecting spring 55 expands to the maximum, the movable heating plate 51 moves downward to the maximum distance. At this time, the connecting head 59 contacts the conductive sheet 57, and the movable heating plate 51 is energized to generate heat. At the same time, the pushing action of the pushing spring 58 can make the conductive sheet 57 and the connecting head 59 closely contact each other, so that the heat generated by the entire heater is more, which can play a good role when the heat inside the car needs more, especially when the zone air conditioning is turned on, by blowing in more wind, the temperature can be quickly uniformed, and the temperature inside the car can be quickly made to reach the set temperature. After the temperature inside the car reaches the set temperature, the heating of the semiconductor heating plate 2 can be reduced or even stopped. At this time, under the reaction force of the connecting spring 55, the movable heating plate 51 can be moved upward together with the connecting head 59, and the connecting head 59 is immediately separated from the conductive sheet 57. At this time, the movable heating plate 51 will not be passed with current, and the heat generation is reduced; it should be noted that due to the characteristics of the car itself, the maximum heat emitted by a plurality of groups of semiconductor heating plates 2 and the adjustment structure 5 should not exceed the maximum set temperature of the air conditioning temperature inside the vehicle.

[0030] It should be noted that a notch matching one end of the locking column 62 should be reserved at the heating installation location of the automobile, so as to facilitate the installation, disassembly and replacement of the entire heater.

[0031] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heater based on semiconductor functional materials for new energy vehicles, characterized in that: It comprises a frame (1), a semiconductor heating plate (2) is fixedly connected to the inner side of the frame (1), side plates (3) are fixedly connected to both sides of the frame (1), a heat sink (7) is fixedly connected between the semiconductor heating plate (2) and the frame (1), and a connector (4) for powering a car is fixedly connected to the surface of the frame (1); An adjustment structure (5) is provided on the inner side of the frame (1), and the adjustment structure (5) is used to quickly increase the heat when the heat is insufficient; A snap-fit ​​structure (6) is provided on the surface of the frame (1), and the snap-fit ​​structure (6) is used to snap-fit ​​with an automobile component.

2. The heater based on semiconductor functional materials for new energy vehicles according to claim 1, characterized in that: The regulating structure (5) comprises a movable heating plate (51) slidably arranged on the inner side of the frame (1); an opening hole (52) is provided on the surface of the heat dissipation plate (7) for the opening hole (52) to slide; a heat conducting plate (53) is fixedly connected to the surface of the movable heating plate (51); a fixing plate (54) is fixedly connected to the inner side of the frame (1); a connecting spring (55) is connected between the fixing plate (54) and the movable heating plate (51); a sliding groove (56) is provided on the inner side surface of the frame (1) corresponding to the movable heating plate (51); a conductive sheet (57) is movably connected to the lower end of the sliding groove (56) on the inner side of the frame (1); a push spring (58) is connected between the conductive sheet (57) and the frame (1); and electrical connectors (59) are fixedly connected to both ends of the movable heating plate (51).

3. The heater based on semiconductor functional materials for new energy vehicles according to claim 1, characterized in that: The snap-fit ​​structure (6) comprises a fixing column (61) fixedly connected to the surface of the frame (1); a snap-fit ​​column (62) is connected through the surface of the fixing column (61); a movable plate (63) is fixedly connected to the surface of the snap-fit ​​column (62); a return spring (64) is connected inside the fixing column (61); and a pull ring (65) is fixedly connected to one end of the snap-fit ​​column (62).

4. The heater based on semiconductor functional materials for new energy vehicles according to claim 2, characterized in that: The movable heating plate (51) slides along the length direction of the heat dissipation plate (7); the heat conduction plate (53) is made of heat-conducting material; the inner surface of the heat conduction plate (53) is in contact with the heat dissipation plate (7); and the heat conduction plate (53) is located on the outer surface of the movable heating plate (51) close to the heat dissipation plate (7).

5. The heater based on semiconductor functional materials for new energy vehicles according to claim 4, characterized in that: The connecting spring (55) is arranged vertically, and the upper and lower elastic ends of the connecting spring (55) are respectively fixedly connected to the fixed plate (54) and the movable heating plate (51), and the surface of the fixed plate (54) has holes for heat to pass through.

6. The heater based on semiconductor functional materials for new energy vehicles according to claim 5, characterized in that: The connecting spring (55) is a spring that expands when heated and contracts when pre-cooled. The upward and downward movement of the movable heating plate (51) is achieved by the thermal expansion and contraction of the connecting spring (55). When the conductive sheet (57) contacts the electrical connector (59), current flows into the movable heating plate (51). The push spring (58) is arranged horizontally, and the two end ends of the push spring (58) are in contact with the conductive sheet (57) and the inner wall of the frame (1), respectively.

7. The heater based on semiconductor functional materials for new energy vehicles according to claim 6, characterized in that: The conductive sheet (57) is pushed by the push spring (58) to maintain stability; the connection spring (55) and the push spring (58) are both made of materials with insulating properties; the number of the adjustment structures (5) is a plurality of groups, and each group of the adjustment structures (5) is arranged between two adjacent groups of semiconductor heating plates (2) on the inner side of the frame (1).

8. The heater based on semiconductor functional materials for new energy vehicles according to claim 3, characterized in that: The fixed column (61) is a hollow cylindrical structure, the engaging column (62) is a regular quadrangular prism structure, the engaging column (62) slides along the axial length direction of the fixed column (61), and the movable plate (63) is arranged on the surface of the engaging column (62) corresponding to the internal cavity of the fixed column (61).

9. The heater based on semiconductor functional materials for new energy vehicles according to claim 8, characterized in that: The movable plate (63) slides along the length direction of the inner cavity of the fixed column (61), and the sliding direction is the same as the sliding direction of the locking column (62). The return spring (64) is arranged inside the cavity of the fixed column (61), and the return spring (64) is used to push the movable plate (63) together with the locking column (62) to move outward.

10. The heater based on semiconductor functional materials for new energy vehicles according to claim 9, characterized in that: The pull ring (65) is fixed to one end of the inner side of the locking column (62), the locking structures (6) are provided in two groups and are symmetrically distributed, and the locking structures (6) are arranged at the middle positions of both sides of the surface of the frame (1).

Images