A processing device and control method for flexible circuit board

Abstract

The present invention relates to a processing device and a control method for a flexible circuit board. The processing device includes a tooling plate, a first flow channel, a first inlet, a first outlet and a first generating component. A positioning groove is provided on the tooling plate. The positioning groove is connected to an opening. The side of the positioning groove facing away from the outlet is a first plane. The first flow channel is connected to the first inlet. The first inlet is used to receive gas and discharge the gas through the first outlet. The first outlet is provided at the first plane. The first generating component is connected to the first inlet. Gas is controlled to be introduced into the first inlet and is guided to the first outlet through the first flow channel so as to be discharged at the first outlet located at the first plane to form an air flow channel, thereby effectively eliminating the vacuum adsorption between the flexible circuit board and the bottom wall of the positioning groove to avoid the problem of circuit board damage caused by vacuum adsorption deformation when the flexible circuit board is separated from the positioning groove, thereby improving the transfer accuracy of the flexible circuit board and reducing the risk of deformation and damage.

Description

Technical Field

[0001] The invention relates to circuit board processing equipment, and in particular to processing equipment and a control method for a flexible circuit board. Background Art

[0002] In the manufacturing process of modern electronic products, flexible printed circuits (FPC) are widely used in various electronic devices as a key electronic component. Flexible printed circuits are thin, light, flexible, and bendable, and can achieve complex electrical connections in a limited space. Therefore, they are widely used in smart phones, tablet computers, automotive electronics, and wearable devices. In the manufacturing and assembly process of flexible printed circuits, precise positioning and fixation are key steps to ensure their processing accuracy and assembly quality.

[0003] During the processing and assembly of flexible circuit boards, it is usually necessary to accurately fix them in a predetermined position. This process mainly relies on positioning tools. Existing positioning tools usually include a tooling plate, one side of which is a plane, and a positioning groove matching the shape of the flexible circuit board is provided on the tooling plate. The shape and size of the positioning groove are adapted to the flexible circuit board, and the flexible circuit board is positioned by being placed in the positioning groove. During this process, one side of the circuit board contacts the inner bottom wall of the positioning groove, thereby preventing the circuit board from being displaced during processing by constraining the thickness direction of the flexible circuit board by the inner bottom wall of the positioning groove and the plane direction of the circuit board by the inner side wall of the positioning groove.

[0004] However, there are still some problems in the prior art, especially during the positioning process, after the flexible circuit board contacts the inner bottom wall of the positioning groove, the air in the groove is discharged, and a local vacuum cavity is easily formed between the circuit board and the inner bottom wall. The formation of these vacuum cavities causes the flexible circuit board to be adsorbed on the inner bottom wall of the positioning groove, making it difficult to separate the circuit board from the positioning groove. Especially in the process of transferring the flexible circuit board using a clamp such as a vacuum suction cup, the flexible circuit board is forced to deform, which is likely to cause damage to the circuit board or components of the circuit. Therefore, it is urgent to propose a processing device for flexible circuit boards to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a processing device which can release the vacuum adsorption effect between a flexible circuit board and the bottom wall of a positioning groove by introducing airflow.

[0006] The technical solution adopted by the present invention to solve the above problem is: a processing device for a flexible circuit board, comprising:

[0007] A tooling plate includes a positioning groove and an opening connected to the positioning groove, the side of the positioning groove away from the opening is a first plane, the tooling plate also includes a first flow channel, a first inlet connected to the first flow channel and a first outlet connected to the first flow channel, and the first outlet is opened at the first plane.

[0008] The first generating component is connected to the first inlet so as to introduce gas into the first inlet, and the first generating component operates in a controlled manner.

[0009] Preferably, the processing equipment further comprises:

[0010] A cover plate is arranged at the opening, and the cover plate is detachably connected to the tooling plate.

[0011] Preferably, the processing equipment further comprises:

[0012] The buffer mechanism comprises a buffer medium, wherein the buffer medium is arranged between the first plane and the cover plate, and the buffer medium is configured to apply a damping force to the flexible circuit board when the flexible circuit board moves toward a direction close to the cover plate.

[0013] Preferably, the buffer mechanism comprises an abutment member connected to the cover plate, the abutment member being configured to be embedded in the positioning groove when the cover plate is disposed at the opening, and the buffer medium is disposed on a side of the abutment member facing the first plane.

[0014] Preferably, the buffer mechanism further comprises:

[0015] A second inlet and a second outlet communicating with the second inlet, wherein the second outlet is configured to be located between the cover plate and the first plane and communicate with the positioning groove when the cover plate is disposed at the opening.

[0016] The second generating component is controlled to operate, and the second generating component is connected to the second inlet so as to introduce the buffer medium into the second inlet.

[0017] Preferably, the buffer mechanism further comprises:

[0018] The second flow channel is opened in the cover plate, the second inlet is connected with the second outlet through the second flow channel, and the second outlet is configured to be opened toward the positioning groove and connected with the positioning groove when the cover plate is set at the opening.

[0019] Preferably, the buffer mechanism further comprises:

[0020] A second flow channel, wherein the second flow channel is disposed in the tooling plate and is independent of the first flow channel, the second inlet is connected to the second outlet through the second flow channel, the second outlet is disposed between the opening and the first plane and is connected to the positioning groove.

[0021] Preferably, the processing equipment further comprises:

[0022] A cover plate is arranged at the opening, and the cover plate is detachably connected to the tooling plate.

[0023] A buffer mechanism, the buffer mechanism comprising:

[0024] The buffer medium is disposed between the first plane and the cover plate, and the buffer medium is configured to apply a damping force to the flexible circuit board when the flexible circuit board moves toward a direction close to the cover plate.

[0025] A second inlet and a second outlet communicating with the second inlet, wherein the second outlet is configured to be located between the cover plate and the first plane and communicate with the positioning groove when the cover plate is disposed at the opening.

[0026] The second generating component is controlled to operate, and the second generating component is connected to the second inlet so as to introduce the buffer medium into the second inlet.

[0027] In particular, a control method for the above processing equipment includes:

[0028] The cover plate is arranged on the side of the tooling plate where the opening is provided, so as to close the opening.

[0029] A buffer medium is introduced into the positioning groove through the second generating assembly, so that the buffer medium is located between the cover plate and the first plane, and the volume of the buffer medium introduced into the positioning groove is within a preset range.

[0030] Gas having a pressure of a first preset value is introduced into the first inlet through the first generating assembly, so that the flexible circuit board located at the first plane is separated from the first plane.

[0031] Preferably, a control method for a processing device further comprises:

[0032] The cover plate is separated from the tooling plate.

[0033] Gas having a pressure of a second preset value is introduced into the first inlet through the first generating assembly.

[0034] The beneficial effects of each embodiment of the present invention are as follows:

[0035] 1. Due to the design of the first flow channel, the first inlet and the first outlet, gas is introduced into the first inlet through the first generating component, and the gas is discharged at the first plane of the positioning groove, and an air flow channel is formed between the flexible circuit board and the first plane, so as to achieve the purpose of eliminating the vacuum adsorption effect between the flexible circuit board and the bottom wall of the positioning groove, thereby effectively avoiding the problem of damage to the circuit board caused by the deformation of the flexible circuit board due to vacuum adsorption when the flexible circuit board is separated from the positioning groove.

[0036] 2. Due to the use of a detachable cover design, the positioning tooling can be easily maintained and adjusted, while ensuring that during the positioning process of the flexible circuit board, the cover can effectively cover the opening of the positioning slot to avoid the influence of external interference on the positioning accuracy. Furthermore, the design of adding a buffer mechanism and a buffer medium can guide the flow of the buffer medium through the second inlet and the second outlet, providing buffer protection between the flexible circuit board and the tooling plate after being lifted by the airflow, reducing the possibility of damage to the circuit board due to collision. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic structural diagram of a processing device in one embodiment of the present invention.

[0038] Figure 2 is a schematic side sectional view of a processing device in one embodiment of the present invention.

[0039] Figure 3 The present invention Figure 2 Enlarged view of point A in the middle.

[0040] Figure 4 It is a schematic structural diagram of a tooling plate in one embodiment of the present invention.

[0041] Figure 5 It is a schematic side sectional view of a tooling plate in one embodiment of the present invention.

[0042] Among them: 10, processing equipment; 110, tooling plate; 111, positioning groove; 1111, first plane; 112, opening; 113, first flow channel; 114, first inlet; 115, first outlet; 120, cover plate; 130, buffer mechanism; 131, abutment member; 20, flexible circuit board. DETAILED DESCRIPTION

[0043] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0044] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description created by the present application, unless otherwise specified, "multiple" means two or more.

[0045] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0046] like Figure 1 As shown, a preferred embodiment of the present application provides a processing device 10 for processing a flexible circuit board 20. The processing device 10 can provide a positioning space for the flexible circuit board 20, limit the flexible circuit board 20 at a target position, and cooperate with other circuit board manufacturing equipment during the processing, so as to achieve the purpose of fine processing of the flexible circuit board 20 at the target position.

[0047] The processing equipment 10 includes a tooling plate 110 and a first generating assembly, wherein the tooling plate 110 includes a positioning groove 111 and an opening 112 communicating with the positioning groove 111 , and a side of the positioning groove 111 away from the opening 112 is a first plane 1111 .

[0048] Specifically, the tooling plate 110 is the main structure of the processing device, and in this embodiment, provides support and placement for the flexible circuit board 20. The positioning groove 111 is opened on one side of the tooling plate 110, and the notch between the positioning groove 111 and the surface of the tooling plate 110 is the opening 112. Further, in order to facilitate the placement of the flexible circuit board 20 during the loading and unloading process, the opening direction of the positioning groove 111 should be along a straight line, and the straight line direction is perpendicular to the first plane 1111, so as to facilitate the placement of the flexible circuit board 20, and in order to better realize the positioning of the flexible circuit board 20, the shape of the first plane 1111 should be the same as the shape of the flexible circuit board 20, and the size of the first plane 1111 should be slightly larger than the flexible circuit board 20, so that there is a slight gap between the edge side of the flexible circuit board 20 and the inner side wall of the positioning groove 111 that does not affect the positioning accuracy. The size of the gap should be between 5 threads and 10 threads. The tooling plate 110 can be embodied as a circular plate, a square plate or a rectangular plate in a specific manner. Taking a rectangular plate as an example, if Figures 2 to 5 shown.

[0049] In the prior art, after the flexible circuit board 20 contacts the first plane 1111, the air between the two is squeezed out of the gap, so that a local vacuum is easily formed between the flexible circuit board 20 and the first plane 1111, so that the flexible circuit board 20 is adsorbed on the first plane 1111, making it particularly difficult to separate the flexible circuit board 20 from the positioning groove 111. Specifically, in the process of transferring the flexible circuit board 20 using a clamp such as a vacuum suction cup, the flexible circuit board 20 will be deformed to a large extent, which is likely to cause damage to the circuit board or components of the circuit.

[0050] Different from the prior art, in order to release the adsorption of the flexible circuit board 20 and the inner bottom wall of the positioning groove 111, the processing equipment 10 further includes a first generating assembly (not shown in the figure), and the tooling plate 110 further includes a first flow channel 113, a first inlet 114 communicating with the first flow channel 113, and a first outlet 115 communicating with the first flow channel 113, and the first outlet 115 is opened at the first plane 1111. The first generating assembly is connected to the first inlet 114 to pass gas into the first inlet 114, and the first generating assembly operates in a controlled manner. This technical solution adopts the design of the first flow channel 113, the first inlet 114 and the first outlet 115, and introduces gas into the first inlet 114 through the first generating component, and then discharges the gas at the first plane 1111 of the positioning groove 111, so as to form an air flow channel between the flexible circuit board 20 and the first plane 1111, so as to eliminate the vacuum adsorption effect between the flexible circuit board 20 and the inner bottom wall of the positioning groove 111, and effectively avoid the problem of circuit board damage caused by the vacuum cavity when the flexible circuit board 20 is separated from the positioning groove 111.

[0051] Specifically, the first flow channel 113 should be a channel for gas flow, and there is no requirement for its shape and structure. It is only necessary to ensure that the first flow channel 113 does not leak when transmitting gas and is not connected to the positioning groove 111, and that the gas can be introduced from the first inlet 114 and exported from the first outlet 115. The first inlet 114 is usually opened on the side of the tooling plate 110 so as to be connected to the pipeline to achieve communication with the first generating component. The specific position of the first outlet 115 at the first plane 1111 should meet the requirement that when the flexible circuit board 20 is attached to the first plane 1111, the first outlet 115 is covered by the flexible circuit board 20, and in some embodiments, the number of the first outlets 115 is several, which can be distributed at positions corresponding to the center and four corners of the flexible circuit board 20 to ensure that the vacuum is fully broken.

[0052] The first generating component can be a gas generating device or an air pump system, which is used to continuously supply gas to the first inlet 114. In specific forms, it can be embodied as an air pump and a compressed air system or a gas generator or a gas flow control device. In this embodiment, the first generating component mainly solves the adsorption problem caused by the negative vacuum effect, and can reduce the risk of deformation and damage of the flexible circuit board 20 during transfer.

[0053] During the vacuum breaking process, in order to prevent the flexible circuit board 20 from being ejected out of the positioning groove 111 by the airflow ejected from the first outlet 115 , the processing equipment 10 further includes a cover plate 120 , which is opened at the opening 112 and is detachably connected to the tooling plate 110 .

[0054] Specifically, the cover plate 120 should include a surface that fits with the side of the tooling plate 110 with the opening 112, so as to ensure that after the cover plate 120 is placed on the tooling plate 110, there is good sealing between the two. The cover plate 120 is embodied in a specific manner as a circular plate, a square plate, or a rectangular plate. For example, a rectangular plate, such as Figure 1 As shown, the rectangular cover plate 120 cooperates with the aforementioned rectangular plate 110. The detachable connection between the cover plate 120 and the plate 110 includes a snap connection, a lock connection, or a fastener connection, etc. This connection method is a prior art and will not be described in detail here.

[0055] In some embodiments, a sealing gasket layer (not shown in the figure) is installed on the cover plate 120 to fill the gap between the cover plate 120 and the tooling plate 110 after they are covered.

[0056] In order to prevent the flexible circuit board 20 at the first plane 1111 from being pushed out by the airflow of the first outlet 115 and then colliding with the cover plate 120 and being damaged, the processing equipment 10 also includes a buffer mechanism 130, and the buffer mechanism 130 includes a buffer medium, which is arranged between the first plane 1111 and the cover plate 120, and the buffer medium is configured to apply a damping force to the flexible circuit board 20 when the flexible circuit board 20 moves toward the cover plate 120.

[0057] Specifically, the buffer medium can provide a damping force to the flexible circuit board 20 when it is lifted by the airflow ejected from the first outlet 115, so as to reduce the moving speed of the flexible circuit board 20 or provide a buffer for the flexible circuit board 20, thereby avoiding a direct collision between the flexible circuit board 20 and the cover plate 120. Therefore, based on the requirements of buffering and protecting the flexible circuit board 20, the texture of the buffer medium needs to be soft enough, which can be embodied in a specific way as a flexible material (such as highly elastic silicone or rubber, etc.) or a fluid.

[0058] In one embodiment, Figure 3 As shown, the buffer mechanism includes abutment 131, which is connected to the cover plate 120, and is configured to be embedded in the positioning groove 111 when the cover plate 120 is covered at the opening 112, and the buffer medium is provided on the side of the abutment 131 facing the first plane 1111.

[0059] Specifically, the abutment member 131 is a solid structure, which is installed on one side of the cover plate 120, and when the cover plate 120 is covered on the side of the tooling plate 110 where the opening 112 is provided, the solid structure is embedded in the opening 112, and a buffer medium is provided on the side of the solid structure embedded in the opening 112 away from the cover plate 120. At this time, the buffer medium is specifically embodied as a flexible material, such as highly elastic silicone or rubber.

[0060] In another embodiment, the buffer mechanism 130 further includes a second inlet, a second outlet communicated with the second inlet, and a second generating assembly (not shown in the figure), wherein the second outlet is configured to be located between the cover plate 120 and the first plane 1111 when the cover plate 120 is covered at the opening 112, and is communicated with the positioning groove 111. The second generating assembly is connected to the second inlet to allow the buffer medium to flow into the second inlet, and the second generating assembly operates in a controlled manner.

[0061] Specifically, in the present embodiment, the buffer medium may be selected as gas, and the specific gas type may be selected according to the actual situation of the flexible circuit board 20. The second inlet is the inlet of the buffer medium (gas), which is connected to the second generating component and is used to introduce the gas into the buffer system. The second outlet is located between the cover plate 120 and the first plane 1111, and is connected to the positioning groove 111. Through the outlet, the buffer medium (gas) is introduced into the positioning groove 111, which hinders the movement of the flexible circuit board 20 when it moves, and achieves the damping effect by providing the necessary airflow.

[0062] The second generating component is responsible for introducing the buffer medium into the second inlet and controlling the flow rate and pressure of the airflow. The second generating component can be an air pump or a compression device, which adjusts the inflow and output pressure of the gas depending on the actual working requirements. Moreover, the buffer medium in this embodiment is gas. After the second generating component introduces gas into the second inlet, the gas enters the positioning groove 111 through the second outlet to enhance the pressure in the area between the cover plate 120 and the flexible circuit board 20 in the positioning groove 111, thereby achieving the effect of providing damping force for the flexible circuit board 20.

[0063] When the cover plate 120 is placed on the side of the tooling plate 110 where the opening 112 is opened, the second generating component introduces a buffer medium (gas) into the second inlet, and transports the gas to the second outlet through the pipeline system. The second generating component controls the gas flow rate, and the gas flows through the second outlet into the positioning groove 111 to accumulate in the area between the flexible circuit board 20 and the cover plate 120 in the positioning groove 111, and applies pressure directed to the first plane 1111 to the flexible circuit board 20, thereby increasing the pressure in the area between the cover plate 120 and the first plane 1111, thereby effectively limiting the movement of the flexible circuit board 20. At this time, the damping force provided by the gas can alleviate the mechanical impact that the circuit board may encounter during the separation process from the first plane 1111, and avoid the circuit board from being damaged by the airflow.

[0064] It is understandable that the second generating component can adjust the gas flow and pressure according to processing requirements, and ensure the uniform distribution of airflow in the positioning groove 111 by real-time regulation of the gas entering the system, and maintain a certain stability and accuracy during the circuit board processing.

[0065] In this embodiment, the buffer mechanism 130 is mainly composed of a second inlet, a second outlet, and a second generating assembly (not shown in the figure). Its main function is to provide effective damping force for the flexible circuit board 20 by introducing a buffer medium (such as gas) into the second inlet and allowing it to enter the positioning groove 111 through the second outlet, thereby preventing the flexible circuit board 20 from violently displacing in the positioning groove 111.

[0066] Furthermore, the buffer medium may be other forms of fluids, such as liquids, in addition to gases. For special occasions, a more suitable type of buffer medium may be selected, such as compressed air, nitrogen, etc., and the damping effect may be adjusted as required.

[0067] This embodiment enhances the airflow pressure and provides damping force through the design of the buffer mechanism 130, especially the introduction and precise control of gas, thereby avoiding severe collision or deformation of the circuit board during processing and reducing the risk of damage to the circuit board or components. In addition, through flexible buffer media and airflow control, it can adapt to different production needs and adjust system parameters according to specific processing tasks, with strong adaptability.

[0068] When the buffer medium is gas, the buffer mechanism 130 also includes a second flow channel (not shown in the figure). In some embodiments, the second flow channel is opened in the cover plate 120, and the second inlet is connected with the second outlet through the second flow channel. The second outlet is configured to be opened toward the positioning groove 111 and connected with the positioning groove 111 when the cover plate 120 is covered at the opening 112 of the tooling plate 110.

[0069] In this embodiment, the buffer mechanism 130 uses a fluid as a buffer medium. In order to guide the flow of the fluid, the buffer mechanism 130 also includes a second flow channel (not shown in the figure). In some embodiments, the second flow channel is opened in the cover plate 120, and the second inlet is connected to the second outlet through the second flow channel. The second outlet is configured so that when the cover plate 120 is covered at the opening 112, the outlet faces the positioning groove 111 and is connected to the positioning groove 111. This design allows the fluid to effectively flow into the positioning groove 111 through the second flow channel, thereby providing the necessary damping effect for the flexible circuit board 20.

[0070] Specifically, the second flow channel is provided in the cover plate 120, and its function is to guide the fluid from the second inlet to the second outlet. The flow channel design improves the flow efficiency of the fluid by optimizing the airflow path, ensures that the fluid can evenly enter the positioning groove 111, and forms the required damping force between the circuit board and the cover plate 120.

[0071] The second inlet is connected to the second outlet through the second flow channel, so that the buffer medium (such as gas) can enter the flow channel through the inlet and then flow into the positioning groove 111 through the outlet. The configuration of the second outlet ensures that the gas can accurately flow into the area between the flexible circuit board 20 and the cover plate 120, thereby increasing the pressure in the area and providing accurate damping force for the flexible circuit board 20.

[0072] When the cover plate 120 covers the opening 112 of the tooling plate 110, the second outlet is opened toward the positioning groove 111, ensuring that the fluid can flow into the positioning groove 111 and contact the flexible circuit board 20. In this way, the gas provides a buffering effect, avoiding collision caused by violent displacement of the flexible circuit board 20 when it is separated from the first plane 1111.

[0073] During operation, the second generating component introduces fluid (such as gas) into the second inlet, and the gas is guided to the second outlet through the second flow channel. The fluid flows into the positioning groove 111 from the second outlet, and this process increases the pressure in the area between the cover plate 120 and the first plane 1111, and provides damping force for the flexible circuit board 20 in the positioning groove 111, providing the necessary buffering force for the flexible circuit board 20. When the fluid enters the positioning groove 111, it forms an air film or a liquid film between the circuit board and the cover plate 120, which increases the stability of the flexible circuit board 20 and prevents it from being damaged by collision.

[0074] Furthermore, the second flow channel can adopt different forms of flow channel design, and even multiple flow channel systems can be used to further improve the accuracy and uniformity of fluid distribution, especially in application scenarios that require precise control of flow rate and flow direction. The control method of the second generating component can be flexibly selected, such as using a more advanced pump control system to achieve real-time adjustment and optimization of fluid flow, pressure and flow direction.

[0075] In this embodiment, through precise control of the second flow channel and the fluid, a stable and effective damping force can be provided for the flexible circuit board 20, thereby preventing collision damage during the processing, ensuring production quality, avoiding rework and repairs due to circuit board damage, reducing the cost of equipment maintenance and material loss, and improving production efficiency.

[0076] When the buffer medium is a fluid, the buffer mechanism 130 also includes a second flow channel (not shown in the figure). In other embodiments, the second flow channel is opened in the tooling plate 110, and the second flow channel is independent of the first flow channel 113. The second inlet is connected to the second outlet through the second flow channel. The second outlet is opened between the opening 112 and the first plane 1111, and is connected to the positioning groove 111.

[0077] In this embodiment, when the buffer medium is a fluid, the buffer mechanism 130 further includes a second flow channel for independently guiding the flow of the fluid. Specifically, the second flow channel is opened in the tooling plate 110, and the flow channel is independently separated from the first flow channel 113 to ensure that the fluid channels between the two do not interfere with each other. The second inlet is connected to the second outlet through the second flow channel, and the position of the second outlet is opened between the opening 112 of the tooling plate 110 and the first plane 1111, and is connected to the positioning groove 111.

[0078] Specifically, the independence of the second flow channel ensures that when the second inlet enters the fluid through the flow channel, it will not be affected by the flow of the fluid in the first flow channel 113, thereby improving the stability of the system and the accuracy of fluid distribution. This design also avoids interference between the first flow channel 113 and the second flow channel, so that the two can independently adjust the flow and pressure of the fluid.

[0079] The second inlet guides the fluid to the second outlet through the second flow channel, and the second outlet is arranged between the opening 112 and the first plane 1111, and the second outlet is connected with the positioning groove 111. In this process, after the fluid flows into the second outlet through the second flow channel, it directly flows into the positioning groove 111 and enters the space between the flexible circuit board 20 and the cover plate 120. This flow path ensures that the fluid can evenly cover the area, thereby forming a damping effect between the flexible circuit board 20 and the cover plate 120, and providing appropriate buffering force for the flexible circuit board 20.

[0080] The independent second flow channel design ensures that the fluid can be precisely controlled and avoids mutual interference between different flow channels, thereby improving the stability of the system.

[0081] Furthermore, because the second flow channel is not provided in the cover plate 120 but is provided in the tooling plate 110, this design, first of all, avoids the complication of the cover plate 120. Because if the second flow channel is provided in the cover plate 120, the structure of the cover plate 120 will become more complicated. The cover plate 120 is generally designed to prevent airflow or liquid leakage, ensure positioning and stability, and other functions. If a second flow channel is designed on the cover plate 120, it will not only increase the manufacturing complexity of the cover plate 120, but may also affect the strength and structural integrity of the cover plate 120. By designing the second flow channel in the tooling plate 110, the simplicity and structural stability of the cover plate 120 can be maintained, and unnecessary complication can be avoided.

[0082] Secondly, the second flow channel is opened in the tooling plate 110, and the design and operation of the second flow channel are relatively independent of the function of the cover plate 120. This ensures that the flow of the fluid in the second flow channel is not affected by the shape, structure or installation error of the cover plate 120. The cover plate 120 can focus on its own positioning and sealing functions, while the second flow channel can be adjusted and optimized separately to ensure that the flow path and flow rate of the fluid are more accurately regulated.

[0083] In order to make the above processing equipment 10 operate better, in some embodiments, a control method for the above processing equipment 10 is proposed, comprising the following steps:

[0084] The cover plate 120 covers the side of the tooling plate 110 where the opening 112 is formed.

[0085] A buffer medium is introduced into the positioning groove 111 through the second generating assembly. The buffer medium is located between the cover plate 120 and the first plane 1111 , and the volume of the buffer medium introduced into the positioning groove 111 is within a preset range.

[0086] Gas with a pressure of a first preset value is introduced into the first inlet 114 through the first generating assembly, so that the flexible circuit board 20 located on the first plane 1111 is separated from the first plane 1111 .

[0087] The buffer medium is the same as the substance introduced into the first inlet 114 by the first generating assembly, both of which are gas. There is a correlation between the "preset range" in "the volume of the buffer medium introduced into the positioning groove 111 is within the preset range" and the "first preset value" in "the gas having a pressure of the first preset value is introduced into the first inlet 114 through the first generating assembly". The correlation between the two determines whether the separation process of the flexible circuit board 20 is carried out smoothly and will not cause damage or excessive pressure to the circuit board.

[0088] The buffer medium is the same as the gas ejected from the first outlet 115. In this case, the buffer medium and the ejected gas should be the same gas (usually air). The main function of the buffer medium is to provide a damping force in the positioning groove 111 through the gas, limit the rapid movement of the flexible circuit board 20, and prevent the flexible circuit board 20 from colliding with the cover plate 120 after being separated from the first plane 1111. At the same time, the ejected gas (from the first outlet 115) is used to release the vacuum adsorption between the flexible circuit board 20 and the first plane 1111, so that the circuit board can be smoothly separated from the groove.

[0089] The correlation between the preset range and the first preset value is reflected in the matching between the volume of the gas (i.e., the volume of the buffer medium) and the pressure of the gas (i.e., the first preset value). The pressure determines the flow rate of the gas and the impact force of the airflow, while the gas volume determines the accumulation and persistence of the airflow within a certain period of time. The two need to be coordinated to eliminate the vacuum effect and ensure that the circuit board moves smoothly without being pushed out by the airflow or subjected to excessive impact.

[0090] In order to determine the correlation between the "preset range" of the buffer medium volume and the "first preset value" of the gas pressure, the following key factors should be considered:

[0091] When the gas enters the positioning groove 111 through the first inlet 114, the pressure and flow of the gas flow have an important influence on the separation process of the circuit board. The pressure (first preset value) directly determines the flow rate of the gas, and a too fast flow rate may cause the circuit board to be forcibly pushed up by the gas flow, or even collide with the cover plate 120.

[0092] The volume of the buffer medium needs to match the pressure of the gas. Too much buffer medium (e.g., too large a volume of gas) may cause excessive pressure in the positioning groove 111, thereby affecting the normal separation of the circuit board. On the contrary, too small a volume may not provide sufficient damping force to prevent the circuit board from moving violently.

[0093] The factors that need to be considered for the flexible circuit board 20 include:

[0094] Heavier or larger boards require higher airflow pressures and more buffer media volume to ensure smooth separation and prevent board damage or displacement due to insufficient airflow.

[0095] The flexible circuit board 20 itself is relatively weak, and excessive airflow or inappropriate pressure may cause the circuit board to deform or be damaged. Therefore, the volume of the buffer medium needs to be controlled within a range to provide sufficient buffering without causing excessive pressure.

[0096] Gas flow and pressure regulation. Through experiments or calculations, the volume of the buffer medium can be determined by adjusting the gas flow and pressure. In practical applications, the gas flow and pressure can be monitored in real time, and the amount of gas flow and the volume of the buffer medium can be adjusted based on the feedback.

[0097] Generally speaking, the flow rate and pressure of the gas can be precisely controlled by adjusting the output of the gas pump or gas generator. When setting the "first preset value", it can be adjusted through the flow meter and pressure sensor, and the appropriate parameters can be set according to the actual needs of the circuit board.

[0098] The relationship between gas volume and pressure can generally be described by the following formula:

[0099] .

[0100] in:

[0101] For pressure.

[0102] is the gas volume.

[0103] The amount of substance of the gas.

[0104] is the gas constant.

[0105] For temperature.

[0106] In practical applications, changes in gas flow rate and pressure will directly affect the separation process of the flexible circuit board 20. Specifically, the ratio of gas volume and pressure can be adjusted to determine how to adjust the gas flow rate and pressure without causing damage to the flexible circuit board 20.

[0107] Further, the correlation between the “preset range” of the buffer medium volume and the “first preset value” of the gas pressure can be determined by the following practical steps:

[0108] In practical applications, the effects of different gas volumes and pressures on the separation of the flexible circuit board 20 can be determined through experiments. First, an initial set of gas flow and pressure (e.g., a first preset value) is set to observe the separation effect of the flexible circuit board 20. Then, the gas volume or pressure is gradually adjusted according to the feedback until the optimal parameter combination is found.

[0109] Furthermore, in actual operation, the airflow pressure and the volume of the buffer medium can be adjusted in real time through sensors and control systems. For example, if it is detected that the separation process of the flexible circuit board 20 is not smooth or a collision occurs, the airflow pressure can be reduced, or the volume of the buffer medium can be appropriately increased to increase the damping effect of the airflow. In addition, a feedback control mechanism can also be used to monitor the pressure in the positioning groove 111 and the displacement of the flexible circuit board 20 in real time using a pressure sensor, an airflow meter, and a displacement sensor to adjust the amount of gas and buffer medium to ensure smooth separation of the flexible circuit board 20.

[0110] In summary, through reasonable airflow control and adjustment of the buffer medium, the flexible circuit board 20 can be smoothly separated from the positioning groove 111 to avoid deformation or damage of the flexible circuit board 20 due to vacuum adsorption and airflow impact. In practical applications, the correlation between the "preset range" and the "first preset value" is continuously adjusted through experiments and feedback control mechanisms to ensure that the equipment can operate stably and meet production needs.

[0111] In the process of transferring the flexible circuit board 20 located at the first plane 1111 by using a vacuum clamp (not shown in the figure), when the vacuum clamp adsorbs the flexible circuit board 20, in order to ensure the adsorption effect, the vacuum suction cup will move toward the direction close to the first plane 1111. At this time, the flexible circuit board 20 has been separated from the first plane 1111 in the above-mentioned operation steps. Once the flexible circuit board 20 is squeezed by the vacuum suction cup, it is likely to be adsorbed on the first plane 1111 again. In order to solve this problem, a new control method is further proposed on the basis of the above control method, which specifically includes:

[0112] The cover plate 120 is separated from the tooling plate 110 .

[0113] Gas with a pressure of a second preset value is introduced into the first inlet 114 through the first generating assembly, so that a gap appears between the flexible circuit board 20 located at the first plane 1111 and the first plane 1111 .

[0114] Among them, the second preset value is an important factor to prevent the flexible circuit board 20 from being re-adsorbed to the first plane 1111. In the process of using the vacuum suction cup, the suction cup usually fits one side of the flexible circuit board 20 and attracts the flexible circuit board 20 to the surface of the vacuum suction cup through the adsorption force. In this process, the thrust applied by the vacuum suction cup to the flexible circuit board 20 will cause it to move toward the first plane 1111, which may cause the other side of the flexible circuit board 20 to re-contact the first plane 1111 to form a new adsorption.

[0115] Therefore, in this case, it is necessary to calculate the gas pressure of the second preset value according to the thrust to ensure that the gas with the second preset pressure can effectively prevent the flexible circuit board 20 from being re-adsorbed onto the first plane 1111 without pushing up the flexible circuit board 20.

[0116] The thrust of the vacuum chuck is applied by the chuck's motion mechanism. Assume that the thrust of the chuck is , whose magnitude depends on the design of the control mechanism. The thrust can be assumed to be known or determined by actual testing.

[0117] The gas pressure of the second preset value needs to be large enough to overcome the thrust of the suction cup and prevent the flexible circuit board 20 from re-contacting the first plane 1111. However, at the same time, the gas pressure cannot be too high to avoid lifting the circuit board from the positioning groove 111. Therefore, it is necessary to ensure that the gas pressure is only enough to generate a tiny airflow gap.

[0118] The force exerted by the gas can be calculated by multiplying the pressure by the contact area. Assume that the pressure of the gas is The contact area is (i.e. the area where the flexible circuit board 20 contacts the first plane 1111), then the force exerted by the gas on the circuit board is for:

[0119] .

[0120] In order to prevent the flexible circuit board 20 from being re-adsorbed onto the first plane 1111, the force exerted by the gas Should be at least equal to or slightly greater than the thrust applied by the vacuum cup ,Right now:

[0121] .

[0122] From this we can get:

[0123] .

[0124] From this we can calculate the gas pressure:

[0125] .

[0126] This formula shows that by properly designing the gas pressure, it can be ensured that the force of the airflow is sufficient to counteract the thrust of the suction cup and prevent the circuit board from being re-adsorbed.

[0127] At the same time, it is also necessary to ensure that the pressure is not too high, so as not to cause the airflow to be too strong and push up the circuit board. Generally speaking, a safe pressure range can be set so that the airflow is sufficient to maintain a small gap but does not exert too much thrust on the circuit board. The specific pressure range can be determined through experiments.

[0128] After that, after the gas pressure is initially set, actual operation is performed to observe whether the flexible circuit board 20 is pushed up or re-adsorbed to the first plane 1111. If a problem occurs, the gas pressure is appropriately adjusted according to the experimental situation.

[0129] The gas pressure is gradually increased during the experiment until it is confirmed that the gas pressure is sufficient to generate effective airflow and prevent the circuit board from being adsorbed back to the first plane 1111 .

[0130] In summary, in order to prevent the flexible circuit board 20 from being re-adsorbed onto the first plane 1111 when the vacuum suction cup moves, it is necessary to generate a sufficient reverse force by adjusting the gas pressure of the second preset value. The method for calculating the gas pressure is as follows:

[0131] Analyze the thrust of the vacuum chuck based on its movement control mechanism.

[0132] The required gas pressure is calculated by the ratio of the thrust to the contact area of ​​the circuit board.

[0133] Based on the preliminary calculation, experiments are conducted to adjust the gas pressure to ensure that the airflow is large enough to prevent re-adsorption, but not so large as to lift the circuit board off, so as to determine the second preset value.

[0134] Finally, by precisely controlling the gas pressure, it can be ensured that during the vacuum suction cup adsorption process, the circuit board can avoid being re-adsorbed onto the first plane 1111 while maintaining an appropriate gap.

[0135] It should be noted that those skilled in the art can make various modifications or additions to the specific embodiments described or replace them in a similar manner, as long as they do not deviate from the contents of the description of the present invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

Claims

1. A processing device for a flexible circuit board, characterized in that: include: A tooling plate, comprising a positioning groove and an opening connected to the positioning groove, wherein a side of the positioning groove away from the opening is a first plane, and the tooling plate further comprises a first flow channel, a first inlet connected to the first flow channel, and a first outlet connected to the first flow channel, wherein the first outlet is opened at the first plane; A first generating component is connected to the first inlet so as to introduce gas into the first inlet, and the first generating component operates in a controlled manner; A cover plate, which is arranged at the opening and is detachably connected to the tooling plate; A buffer mechanism, the buffer mechanism comprising: A buffer medium, the buffer medium is disposed between the first plane and the cover plate, and the buffer medium is configured to apply a damping force to the flexible circuit board when the flexible circuit board moves in a direction close to the cover plate; a second inlet and a second outlet communicating with the second inlet, wherein the second outlet is configured to be located between the cover plate and the first plane and communicate with the positioning groove when the cover plate is disposed at the opening; The second generating component is controlled to operate, and the second generating component is connected to the second inlet so as to introduce the buffer medium into the second inlet.

2. A processing device for a flexible circuit board according to claim 1, characterized in that: The buffer mechanism includes an abutment member connected to the cover plate. The abutment member is configured to be embedded in the positioning groove when the cover plate is arranged at the opening, and the buffer medium is arranged on a side of the abutment member facing the first plane.

3. The processing equipment for flexible circuit board according to claim 1, characterized in that: The buffer mechanism also includes: The second flow channel is opened in the cover plate, the second inlet is connected with the second outlet through the second flow channel, and the second outlet is configured to be opened toward the positioning groove and connected with the positioning groove when the cover plate is set at the opening.

4. The processing equipment for flexible circuit board according to claim 1, characterized in that: The buffer mechanism also includes: A second flow channel, wherein the second flow channel is disposed in the tooling plate and is independent of the first flow channel, the second inlet is connected to the second outlet through the second flow channel, the second outlet is disposed between the opening and the first plane and is connected to the positioning groove.

5. A control method for the processing equipment as claimed in claim 1, characterized in that: include: The cover plate is arranged on a side of the tooling plate where the opening is provided, so as to close the opening; A buffer medium is introduced into the positioning groove through the second generating assembly, so that the buffer medium is located between the cover plate and the first plane, and the volume of the buffer medium introduced into the positioning groove is within a preset range; Gas having a pressure of a first preset value is introduced into the first inlet through the first generating assembly, so that the flexible circuit board located at the first plane is separated from the first plane.

6. The control method of processing equipment according to claim 5, characterized in that: Also includes: Separating the cover plate from the tooling plate; Gas having a pressure of a second preset value is introduced into the first inlet through the first generating assembly.

Images