A double-layer copper plate lamination process

Abstract

The present invention discloses a double-layer copper plate pressing process, which relates to the field of circuit board processing technology and includes the following steps: S1, cutting the bottom copper plate; S2, cutting the middle copper plate; S3, composite preparation and S4, forming processing. The double-layer copper plate pressing process uses a process pressing and stacking structure to press and paste two copper plates into a double-layer copper plate, etches a groove around the bottom copper plate, fills the groove with insulating glue, and pastes the bottom copper plate and the middle copper plate together through a high-conductivity adhesive insulating layer, which plays a role in heat absorption and electricity resistance, thereby improving product quality. Since the bottom copper and the middle copper plate are pasted together through the insulating layer of thermal conductive glue, the bottom copper and the middle copper plate can prevent short circuit under the action of the insulating conductive glue. Therefore, the improved process adds a groove by etching around the bottom copper plate to prevent short circuit between the bottom copper and the middle copper plate and to prevent the bottom and middle layers from conducting and dissipating heat energy.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, specifically a double-layer copper plate lamination process. Background Technology

[0002] Circuit boards generally refer to printed circuit boards. Based on the number of layers, circuit boards are broadly classified into three categories: single-sided boards, double-sided boards, and multilayer boards. Double-sided boards are an extension of single-sided boards; they are used when single-layer wiring cannot meet the needs of electronic products. Both sides have copper plating and traces, and vias can be used to connect the two layers, forming the required network connections.

[0003] In the existing double-layer board manufacturing process, traditional processes cannot avoid short circuits between the bottom copper plate and the middle layer, resulting in insufficient circuit board safety. To address this, we propose a double-layer copper plate lamination process. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a double-layer copper plate lamination process, which solves the existing problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention provides a double-layer copper plate lamination process, which includes the following specific steps:

[0006] S1, Bottom Copper Plate Cutting

[0007] S11. Drill holes in the bottom copper plate to form bottom positioning holes, and then perform grinding processing to make the surface of the bottom copper plate and the bottom positioning holes smooth.

[0008] S12. Next, apply circuit coating to the bottom copper plate to form a circuit pattern, and then perform pre-baking to align the grooved circuits for exposure and development.

[0009] S13. Use an image acquisition device to acquire visual information of the grooved line image, and then check the acquired grooved line image to ensure that the line is correct.

[0010] S14. Perform etching grooves according to the etching blind groove parameter requirements, and then perform browning processing on the bottom copper plate according to the browning process parameter requirements to form a grooved copper plate.

[0011] S15. Then, 150-micron PP is laminated in the groove of the grooved copper plate. The glue is filled in the groove to avoid burrs generated when the upper and lower copper layers are micro-cut by computer. After completion, wait for the upper copper layer to be stacked and pressed together for later use.

[0012] Furthermore, the double-layer copper plate lamination process also includes the following specific steps:

[0013] S2, Intermediate layer copper plate cutting

[0014] S21. Drill holes in the intermediate layer copper plate to form intermediate layer positioning holes, and then perform grinding processing to make the surface of the intermediate layer copper plate and the intermediate layer positioning holes smooth.

[0015] S22. Then, the intermediate copper plate is browned according to the browning process parameters to form a bright copper plate.

[0016] S23. After the browning process is completed, inspect the bright copper plate. If the inspection is correct, apply pure adhesive to the bright copper plate.

[0017] S24. Then, perform secondary drilling, check the secondary drilling, and then attach an insulating layer to the upper side of the copper plate.

[0018] Furthermore, the double-layer copper plate lamination process also includes the following specific steps:

[0019] S3, Composite Preparation

[0020] S31. A high-conductivity adhesive insulating layer is laminated on the upper side of the bottom grooved copper plate, and then pressed again according to the pressing process parameters to ensure that the two are tightly bonded.

[0021] S32. Then, the intermediate layer of bright copper plate is combined with the prepared bottom layer of grooved copper plate for secondary lamination. The lamination process is carried out according to the lamination process parameters, so that the bottom layer of grooved copper plate and the intermediate layer of bright copper plate are bonded together by a high-conductivity adhesive insulating layer.

[0022] Furthermore, the double-layer copper plate lamination process also includes the following specific steps:

[0023] S4, Molding Processing

[0024] S41. Conduct quality inspection on the two layers of copper plates after lamination. After the quality inspection is qualified, proceed with the shape processing.

[0025] S42. Finally, copper ornaments and decorative surfaces are sequentially covered on the upper surface of the insulating layer of the copper plate, so that the copper ornaments and decorative surfaces constitute the upper panel, thus forming a complete double-layer copper plate.

[0026] Furthermore, in step S1, during the process of cutting the bottom copper plate, when etching the groove, the groove width is 0.6 mm and the depth is 0.15 mm.

[0027] This invention provides a double-layer copper plate lamination process with the following advantages: This double-layer copper plate lamination process involves cutting the bottom copper plate, cutting the middle copper plate, composite preparation, and forming. During the bottom copper plate cutting process, the grooved circuit image is coated and then inspected before etching, which avoids etching errors. Furthermore, browning the bottom and middle copper plates helps to ensure strong adhesion during the double-layer copper plate lamination. The two copper plates are then laminated together to form a double-layer copper plate through a lamination and bonding structure. A groove is etched around the bottom copper plate, and insulating adhesive is filled into the groove. The bottom and middle copper plates are bonded together through a highly conductive insulating layer, which absorbs heat and blocks electricity, thus improving product quality. Because the bottom and middle copper plates are bonded together through the insulating thermally conductive adhesive, short circuits are prevented between them due to the conductive adhesive. Therefore, the improved process adds a groove around the bottom copper plate to prevent short circuits between the bottom and middle copper plates and to prevent heat dissipation between the bottom and middle layers. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the process flow for a double-layer copper plate lamination process according to the present invention;

[0029] Figure 2 This is a schematic diagram of the groove structure in a double-layer copper plate lamination process according to the present invention. Implementation

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0031] A double-layer copper plate lamination process includes the following specific steps:

[0032] S1, Bottom Copper Plate Cutting

[0033] S11. Drill holes in the bottom copper plate to form bottom positioning holes, and then perform grinding processing to make the surface of the bottom copper plate and the bottom positioning holes smooth.

[0034] S12. Next, apply circuit coating to the bottom copper plate to form a circuit pattern, and then perform pre-baking to align the grooved circuits for exposure and development.

[0035] S13. Use an image acquisition device to acquire visual information of the grooved line image, and then check the acquired grooved line image to ensure that the line is correct.

[0036] S14. Perform etching grooves according to the etching blind groove parameter requirements, and then perform browning processing on the bottom copper plate according to the browning process parameter requirements to form a grooved copper plate.

[0037] S15. Then, 150-micron PP is laminated in the groove of the grooved copper plate. The glue is filled in the groove to avoid burrs generated when the upper and lower copper layers are micro-cut by computer. After completion, wait for the upper copper layer to be stacked and pressed together for later use.

[0038] The double-layer copper plate lamination process also includes the following specific steps:

[0039] S2, Intermediate layer copper plate cutting

[0040] S21. Drill holes in the intermediate layer copper plate to form intermediate layer positioning holes, and then perform grinding processing to make the surface of the intermediate layer copper plate and the intermediate layer positioning holes smooth.

[0041] S22. Then, the intermediate copper plate is browned according to the browning process parameters to form a bright copper plate.

[0042] S23. After the browning process is completed, inspect the bright copper plate. If the inspection is correct, apply pure adhesive to the bright copper plate.

[0043] S24. Then, perform secondary drilling, check the secondary drilling, and then attach an insulating layer to the upper side of the copper plate.

[0044] The double-layer copper plate lamination process also includes the following specific steps:

[0045] S3, Composite Preparation

[0046] S31. A high-conductivity adhesive insulating layer is laminated on the upper side of the bottom grooved copper plate, and then pressed again according to the pressing process parameters to ensure that the two are tightly bonded.

[0047] S32. Then, the intermediate layer of bright copper plate is combined with the prepared bottom layer of grooved copper plate for secondary lamination. The lamination process is carried out according to the lamination process parameters, so that the bottom layer of grooved copper plate and the intermediate layer of bright copper plate are bonded together by a high-conductivity adhesive insulating layer.

[0048] The double-layer copper plate lamination process also includes the following specific steps:

[0049] S4, Molding Processing

[0050] S41. Conduct quality inspection on the two layers of copper plates after lamination. After the quality inspection is qualified, proceed with the shape processing.

[0051] S42. Finally, copper ornaments and decorative surfaces are sequentially covered on the upper surface of the insulating layer of the copper plate, so that the copper ornaments and decorative surfaces constitute the upper panel, thus forming a complete double-layer copper plate.

[0052] In step S1, during the process of cutting the bottom copper plate, when etching the groove, the groove width is 0.6 mm and the depth is 0.15 mm.

[0053] In summary, the double-layer copper plate lamination process includes the following specific steps:

[0054] S1. Bottom Copper Plate Cutting: Drill holes in the bottom copper plate to form bottom positioning holes, then perform grinding to smooth the surface of the bottom copper plate and its positioning holes; then apply circuit coating to the bottom copper plate to form circuit patterns, followed by pre-baking to ensure the grooved circuits are aligned and exposed for development; use an image acquisition device to acquire visual information of the grooved circuit images, and then check the acquired images to ensure the circuits are correct; etch grooves with a width of 0.6 mm and a depth of 0.15 mm according to the etching blind groove parameters; then perform browning processing on the bottom copper plate according to the browning process parameters to form the grooved copper plate; then stack 150-micron PP in the grooves of the grooved copper plate, and fill the grooves with adhesive to avoid burrs generated during the micro-cutting of the upper and lower copper layers; after completion, wait for the upper copper layer to be stacked and pressed together for later use;

[0055] S2. Intermediate Layer Copper Plate Cutting: Drill holes in the intermediate layer copper plate to form intermediate layer positioning holes, then perform grinding processing to make the surfaces of the intermediate layer copper plate and intermediate layer positioning holes smooth; then perform browning processing on the intermediate layer copper plate according to the browning process parameters to form a bright copper plate; after the browning processing is completed, inspect the bright copper plate, and after the inspection is correct, apply pure adhesive to the bright copper plate; then perform secondary drilling, and inspect the secondary drilling again; finally, apply an insulating layer to the upper side of the bright copper plate.

[0056] S3. Composite preparation: A high-conductivity adhesive insulating layer is laminated on the upper side of the bottom grooved copper plate, and then a second lamination is performed according to the lamination process parameters to ensure that the two are tightly bonded; then the middle layer of bright copper plate is combined with the bottom grooved copper plate that has been prepared and laminated a second time according to the lamination process parameters to ensure that the bottom grooved copper plate and the middle layer of bright copper plate are bonded together by the high-conductivity adhesive insulating layer.

[0057] S4. Molding and processing: After pressing the two layers of copper plates, quality inspection is carried out. After passing the quality inspection, the shape processing is carried out. Finally, copper ornaments and decorative surfaces are successively covered on the upper surface of the insulating layer of the bare copper plate, so that the copper ornaments and decorative surfaces constitute the upper panel, thus forming a complete double-layer copper plate.

[0058] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A double-layer copper plate lamination process, characterized in that, The double-layer copper plate lamination process includes the following specific steps: S1, Bottom Copper Plate Cutting S11. Drill holes in the bottom copper plate to form bottom positioning holes, and then perform grinding processing to make the surface of the bottom copper plate and the bottom positioning holes smooth. S12. Next, apply circuit coating to the bottom copper plate to form a circuit pattern, and then perform pre-baking to align the grooved circuits for exposure and development. S13. Use an image acquisition device to acquire visual information of the grooved line image, and then check the acquired grooved line image to ensure that the line is correct. S14. Perform etching grooves according to the etching blind groove parameter requirements, and then perform browning processing on the bottom copper plate according to the browning process parameter requirements to form a grooved copper plate. S15. Then, 150-micron PP is laminated in the groove of the grooved copper plate. The glue is filled in the groove to avoid burrs generated when the upper and lower copper layers are micro-cut by computer. After completion, wait for the upper copper layer to be stacked and pressed together for later use. The double-layer copper plate lamination process also includes the following specific steps: S2, Intermediate layer copper plate cutting S21. Drill holes in the intermediate layer copper plate to form intermediate layer positioning holes, and then perform grinding processing to make the surface of the intermediate layer copper plate and the intermediate layer positioning holes smooth. S22. Then, the intermediate copper plate is browned according to the browning process parameters to form a bright copper plate. S23. After the browning process is completed, inspect the bright copper plate. If the inspection is correct, apply pure adhesive to the bright copper plate. S24. Then, perform secondary drilling, check the secondary drilling, and then attach an insulating layer to the upper side of the copper plate. The double-layer copper plate lamination process also includes the following specific steps: S3, Composite Preparation S31. A high-conductivity adhesive insulating layer is laminated on the upper side of the bottom grooved copper plate, and then pressed again according to the pressing process parameters to ensure that the two are tightly bonded. S32. Then, the intermediate layer of bright copper plate is combined with the prepared bottom layer of grooved copper plate for secondary lamination. The lamination process is carried out according to the lamination process parameters, so that the bottom layer of grooved copper plate and the intermediate layer of bright copper plate are bonded together through a high-conductivity adhesive insulating layer. The double-layer copper plate lamination process also includes the following specific steps: S4, Molding Processing S41. Conduct quality inspection on the two layers of copper plates after lamination. After the quality inspection is qualified, proceed with the shape processing. S42. Finally, copper ornaments and decorative surfaces are sequentially covered on the upper surface of the insulating layer of the copper plate, so that the copper ornaments and decorative surfaces constitute the upper panel, thus forming a complete double-layer copper plate.

2. The double-layer copper plate lamination process according to claim 1, characterized in that: In step S1, during the process of cutting the bottom copper plate, when etching the groove, the groove width is 0.6mm and the depth is 0.15mm.

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