Power supply module and processing method

Abstract

The invention relates to the technical field of photoelectricity, and discloses a power supply module which comprises a module mechanism used for providing stable electric energy, completing power supply conversion and distribution and supporting load operation at the same time; the sealing mechanism is arranged in the middle of the module mechanism and used for providing secondary sealing for the module mechanism, and the influence of the outside on the interior of the module mechanism is prevented in a dynamic extrusion mode; the cooling mechanism is arranged at the top of the module mechanism and used for forming uniform airflow in the module mechanism, the invention further provides a processing method of the power supply module, and the processing method comprises the following steps: step 1, welding a PCB (Printed Circuit Board) into a semi-finished product, cleaning the semi-finished PCB, and after the PCB is dried, putting the PCB into a shell and enabling a pin to penetrate out of the shell. Through the dynamic sealing mechanism, the efficient heat dissipation structure and the modular connection design, high sealing performance, excellent heat dissipation performance and convenient assembly and disassembly operation of the power module are achieved, and the overall reliability is improved.

Description

Technical Field

[0001] The invention relates to the field of optoelectronic technology, and in particular to a power module and a processing method thereof. Background Art

[0002] With the rapid development of electronic technology and industrial equipment, power modules, as an important part of electronic equipment, undertake the functions of power conversion, distribution and stable output. Their performance directly affects the operating stability and service life of the equipment. At the same time, in order to adapt to the diverse application scenarios, the processing methods of power modules are gradually developing towards automation and high precision to meet the needs of high performance and high reliability.

[0003] At present, the existing power module and its processing method usually provide basic stable power output and component protection effects by integrating module mechanism, heat dissipation mechanism and fixing mechanism. The assembly and packaging of the module can meet the use requirements under general working conditions through traditional processing technology. Its processing method is relatively mature and can achieve high production efficiency and a certain degree of module reliability. It is suitable for application scenarios with low load and relatively stable environment.

[0004] However, the existing technology has many shortcomings when facing complex working conditions and long-term operating conditions. First, the sealing performance of the module is poor. Its sealing design mostly relies on static structural connections, which is difficult to cope with vibration, high humidity and temperature fluctuations in the environment, resulting in the module being susceptible to moisture, dust and other erosion. This will not only affect the normal operation of the circuit, but also accelerate the aging of components, thereby greatly shortening the service life of the module; in addition, the heat dissipation efficiency of the existing power module is insufficient, and it usually relies on a simple passive heat dissipation design. The airflow distribution is uneven, and it is difficult to quickly take away the heat generated during high-load operation. This uneven heat dissipation causes local overheating inside the module, accelerates the aging and performance degradation of key components, and limits the long-term operating reliability of the module and its applicability in high-power scenarios; at the same time, the disassembly and assembly process of the existing module is relatively cumbersome, and its structural design usually does not fully consider the convenience of maintenance and upgrading. Installation and disassembly often require more steps, which increases the complexity of the operation. Especially in industrial scenarios that require frequent maintenance, the complex disassembly and assembly process is easy to cause operators to operate incorrectly or damage the module structure, further reducing the overall reliability and maintenance efficiency of the module. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a power module and a processing method, which solve the problems that the existing power module has insufficient sealing performance under complex working conditions and is easily corroded by moisture and dust, affecting the operating stability; the heat dissipation efficiency is low, and uneven airflow distribution leads to local overheating, which accelerates the aging of components.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a power module, comprising: The module structure is used to provide stable power, complete power conversion and distribution, and support load operation; A sealing mechanism, which is arranged in the middle of the module mechanism and is used to provide secondary sealing for the module mechanism, and prevent the outside from affecting the inside of the module mechanism by dynamic extrusion; A cooling mechanism, which is arranged on the top of the module mechanism and is used to form a uniform airflow inside the module mechanism to reduce the heat of the module mechanism when in use; The connecting mechanism is arranged on the top of the module mechanism and is used to provide a simple operation for the assembly and disassembly between the cooling mechanism and the module mechanism.

[0007] Preferably, the module mechanism comprises a shell, a PCB board is installed inside the shell, a pin is fixedly connected to the bottom of the PCB board, the pin runs through the middle of the shell, and a cover plate is installed on the upper side of the shell.

[0008] Preferably, the sealing mechanism includes a compression spring, which is fixedly connected to the inside of the shell, and the other end of the compression spring is fixedly connected to a sealing block. A sealing groove is formed on one side of the cover plate close to the shell, and the sealing block and the sealing groove are plug-fitted.

[0009] Preferably, the cooling mechanism includes a shell, which is arranged in the middle of the cover plate, and a support block is fixedly connected to the inside of the shell, and a motor is fixedly connected to the other side of the support block, and a fan blade is fixedly connected to the output end of the motor, and a diverter plate is fixedly installed on the side of the shell close to the cover plate.

[0010] Preferably, the connecting mechanism includes an installation component and a disassembly component, both of which are arranged on the top of the cover plate, wherein the installation component includes a fixed block, the fixed block is fixedly connected to the top of the cover plate, a slot is provided in the middle of the fixed block, a return spring is fixedly connected to the inside of the shell, the other end of the return spring is fixedly connected to a block, and the block and the slot are plugged into each other.

[0011] Preferably, the disassembly assembly includes a rotating rod, which is rotatably connected to the middle part of the casing, and one end of the rotating rod close to the casing is fixedly connected to a wire wheel, and a pull rope is fixedly connected to the outer side of the wire wheel, and the other end of the pull rope is fixedly connected to a side of the block close to the return spring.

[0012] Preferably, one end of the rotating rod away from the casing is fixedly connected to a handle, and an anti-slip groove is provided on the outer side of the handle.

[0013] Preferably, a partition is slidably connected inside the housing, and the partition is fixedly connected between the return spring and the block.

[0014] Preferably, a connecting rod is fixedly connected to the upper side of the cover plate, and the fixing block is fixedly connected to an end of the connecting rod away from the cover plate.

[0015] The present invention also provides a method for processing a power module, comprising the following steps: Step 1: Weld the PCB board into a semi-finished product, clean the semi-finished PCB board, and remove any contamination from the surface. After it is dry, put the PCB board into the housing and let the pins pass through the housing. After installation, use a glue gun to wrap the PCB board with colloid and place it at room temperature for curing. After curing, install the cover plate. Step 2: When the cover is installed, the sealing block is pressed downward by the shell to compress the compression spring. After the shell and the cover are connected, the compression spring can keep the sealing block and the cover in contact, thereby maintaining the sealing of the power module. Step three: weld the connecting rod and the fixed block from the top of the cover plate in sequence, and after welding, rotate the rotating rod so that the block compresses the reset spring. At this time, insert the housing into the fixed block and the cover plate in sequence. When the block moves to be parallel to the fixed block, rotate the rotating rod in the opposite direction to reset it, and make the reset spring squeeze the block. When the block moves to be parallel to the slot, the reset spring can squeeze the block to bounce it in, thereby installing the cooling mechanism. The cooling mechanism can be removed by rotating and pulling the rotating rod.

[0016] The present invention provides a power module and a processing method thereof. The present invention provides the following beneficial effects: 1. The present invention provides dynamic sealing protection through a sealing mechanism, and utilizes the elastic action of a compression spring and a sealing block to isolate the inside of the module from the external environment, effectively preventing the intrusion of moisture, dust and pollutants, ensuring the stable operation of the module under complex working conditions such as high humidity and high temperature, and extending the service life of the module and its internal components.

[0017] 2. The cooling mechanism drives the fan blades through the motor to form a uniform airflow, and combines the casing and the diverter plate to optimize the airflow path, significantly improve the heat dissipation efficiency, reduce the temperature fluctuation during module operation, and at the same time slow down the aging speed of components and improve the reliability and adaptability of the module.

[0018] 3. The connection mechanism adopts a modular design. Through the synergistic effect of installing and disassembling components, the cooling mechanism can be quickly installed and unloaded. The operation is simple and reliable, which reduces the risk of human error operation, facilitates the maintenance and function upgrade of the module, and enhances the stability of the overall structure and long-term working performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A perspective view of the present invention; Figure 2 It is a structural schematic diagram of a PCB board of the present invention; Figure 3 It is a structural schematic diagram of the sealing mechanism of the present invention; Figure 4 It is a structural schematic diagram of the cooling mechanism of the present invention; Figure 5 It is a structural schematic diagram of the connecting mechanism of the present invention.

[0020] Among them, 10, module mechanism; 101, shell; 102, PCB board; 103, pin; 104, cover plate; 20, sealing mechanism; 201, compression spring; 202, sealing block; 203, sealing groove; 30, cooling mechanism; 301, casing; 302, support block; 303, motor; 304, fan blade; 305, diverter plate; 40, connecting mechanism; 401, fixing block; 402, slot; 403, reset spring; 404, block; 405, rotating rod; 406, reel; 407, pull rope; 50, handle; 60, connecting rod. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the specification of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Please refer to the attached Figure 1 -Attached Figure 5 , an embodiment of the present invention provides a power module, including: The module mechanism 10 is used to provide stable electric energy, complete power conversion and distribution, and support load operation; The module mechanism 10 ensures the stability and reliability of electric energy and is applicable to different types of load devices. Meanwhile, the module mechanism 10 is a prior art and will not be described in detail in this article. The sealing mechanism 20 is arranged in the middle of the module mechanism 10 and is used to provide secondary sealing for the module mechanism 10, and prevent the outside from affecting the inside of the module mechanism 10 by dynamic extrusion; The sealing mechanism 20 keeps the inside of the module isolated from the external environment through the dynamic action of squeezing, effectively preventing moisture, dust and other pollutants from affecting the circuit, extending the service life of the module, and improving the applicability of the module, especially in applications in harsh environments; A cooling mechanism 30, which is disposed on the top of the module mechanism 10 and is used to form a uniform airflow inside the module mechanism 10 to reduce the heat of the module mechanism 10 when in use; The cooling mechanism 30 uses a uniform airflow to quickly reduce the heat generated by the module during operation, ensuring long-term stable operation of the module. Its design not only improves the heat dissipation efficiency, but also reduces the temperature fluctuation inside the module, thereby extending the life of components. The connecting mechanism 40 is arranged on the top of the module mechanism 10 and is used to provide a simple operation for the assembly and disassembly between the cooling mechanism 30 and the module mechanism 10; The connecting mechanism 40 enables quick and efficient installation and disassembly of the cooling mechanism 30 , facilitates maintenance and functional upgrades of the cooling mechanism 30 , and reduces the risk of human error during assembly and disassembly.

[0023] Please refer to the attached Figure 1 -Attached Figure 3 In a preferred embodiment of the present invention, the module mechanism 10 includes a shell 101, which provides reliable mechanical support and protection to prevent external impact, vibration or temperature and humidity changes from affecting internal components, thereby extending the service life of the module. A PCB board 102 is installed inside the shell 101. The PCB board 102 adopts a multi-layer structure design, and the signal layer, the ground layer and the power layer are separated to reduce coupling interference between signals; at the same time, the wiring layout is optimized to reduce the influence of parasitic capacitance and parasitic inductance, and the PCB board 102 is a prior art, which will not be described in detail in this article. A pin 103 is fixedly connected to the bottom of the PCB board 102, and the pin 103 runs through the middle of the shell 101. The pin 103 is used to realize the electrical connection of the power module, runs through the shell 101 to provide an input and output interface, and plays a conductive role. A cover plate 104 is installed on the upper side of the shell 101. The cover plate 104 can provide a protective effect when connected to the shell 101 through a sealing design, and can prevent external dust, moisture, etc. from entering the module, further improving the reliability of the power module.

[0024] Please refer to the attached Figure 1 -Attached Figure 3 In a preferred embodiment of the present invention, the sealing mechanism 20 includes a compression spring 201, which is fixedly connected to the inside of the shell 101. The other end of the compression spring 201 is fixedly connected to a sealing block 202. A sealing groove 203 is provided on the side of the cover plate 104 close to the shell 101. The sealing block 202 and the sealing groove 203 are plugged together. The compression spring 201 provides dynamic elastic force so that the sealing block 202 always keeps the module mechanism 10 closed after there is no pressure, thereby ensuring the long-term stable operation of the module, especially under complex working conditions such as vibration, high temperature, and high humidity, and further enhancing the reliability of the seal.

[0025] Please refer to the attached Figure 1 -Attached Figure 4In a preferred embodiment of the present invention, the cooling mechanism 30 includes a casing 301, which is arranged in the middle of the cover plate 104. A support block 302 is fixedly connected to the inside of the casing 301, and a motor 303 is fixedly connected to the other side of the support block 302. The output end of the motor 303 is fixedly connected to the fan blade 304. A diverter plate 305 is fixedly installed on the side of the casing 301 close to the cover plate 104. The support of the support block 302 can enable the motor 303 to be fixed in the casing 301. The motor 303 serves as a driving source of the cooling mechanism 30. When it is driven, the fan blade 304 can rotate and drive the airflow to circulate evenly in the shell 101 after being diverted by the diverter plate 305, thereby cooling the module mechanism 10 and improving the service life of the module.

[0026] Please refer to the attached Figure 3 -Attached Figure 5 In a preferred embodiment of the present invention, the connecting mechanism 40 includes an installation component and a disassembly component, both of which are arranged on the top of the cover plate 104, wherein the installation component includes a fixing block 401, the fixing block 401 is fixedly connected to the top of the cover plate 104, a card slot 402 is provided in the middle of the fixing block 401, a reset spring 403 is fixedly connected to the inside of the casing 301, and the other end of the reset spring 403 is fixedly connected to the card block 404, the card block 404 and the card slot 402 are plugged and matched, and the casing 301 is limited by the fixing block 401, so that the casing 301 vertically enters the cover plate 104; the disassembly component includes a rotating rod 405, the rotating rod 405 is rotatably connected to the middle of the casing 301, and the rotating rod 405 is connected to the casing 301. One end of the rod 405 close to the casing 301 is fixedly connected to a wire wheel 406, and the outer side of the wire wheel 406 is fixedly connected to a pull rope 407, and the other end of the pull rope 407 is fixedly connected to a side of the block 404 close to the reset spring 403. When the casing 301 enters, the pull rope 407 is reeled in by rotating the rotating rod 405. When the pull rope 407 is reeled in, the block 404 can be moved and the reset spring 403 can be compressed, so that the block 404 can enter the fixed block 401. At this time, the rotating rod 405 is rotated in the opposite direction to reset the casing 301 and continue to move downward. When the block 404 moves to a position parallel to the slot 402, the elastic force of the reset spring 403 can bounce the block 404 into the slot 402.

[0027] Please refer to the attached Figure 3 -Attached Figure 5 In a preferred embodiment of the present invention, one end of the rotating rod 405 away from the sleeve shell 301 is fixedly connected to a handle 50, and an anti-slip groove is provided on the outer side of the handle 50. Through the handle 50 and the set anti-slip groove, the operator can operate with one hand and can quickly complete the action of assembling and disassembling the cooling mechanism 30, thereby improving the safety and reliability of wet hand operation.

[0028] Please refer to the attached Figure 3 -Attached Figure 5 In a preferred embodiment of the present invention, a partition is slidably connected inside the shell 301, and the partition is fixedly connected between the reset spring 403 and the block 404. The partition can enable the block 404 to move only in parallel, thereby improving the stability and durability of the overall operation, while avoiding the problem of deformation and damage of the reset spring 403 caused by the tilted extrusion of the block 404, thereby increasing the service life of the reset spring 403.

[0029] Please refer to the attached Figure 1 and attached Figure 3 In a preferred embodiment of the present invention, a connecting rod 60 is fixedly connected to the upper side of the cover plate 104, and a fixing block 401 is fixedly connected to an end of the connecting rod 60 away from the cover plate 104. The fixing block 401 can be supported by the connecting rod 60, and the installation height of the fixing block 401 is provided, and the cooling mechanism 30 can be firmly connected during operation, and can adapt to a long-term working environment. The processing method of a power module described below can correspond to the power module described above.

[0030] Please refer to the attached Figure 1 -Attached Figure 5 The present invention also provides a method for processing a power module, comprising the following steps: Step 1: Solder the PCB board 102 into a semi-finished product, and clean the semi-finished PCB board 102 to remove any contamination from the surface. After drying, put the PCB board 102 into the housing 101 and let the pins 103 pass through the housing 101. After installation, use a glue gun to wrap the PCB board 102 with glue and place it at room temperature for curing. After curing, install the cover plate 104. Step 2: When the cover plate 104 is installed, the sealing block 202 is pressed downward by the housing 101 to compress the compression spring 201. After the housing 101 and the cover plate 104 are connected, the compression spring 201 can keep the sealing block 202 and the cover plate 104 in contact with each other, thereby maintaining the sealing of the power module; Step three: weld the connecting rod 60 and the fixed block 401 from the top of the cover plate 104 in sequence, and rotate the rotating rod 405 after welding so that the block 404 compresses the reset spring 403. At this time, insert the shell 301 into the fixed block 401 and the cover plate 104 in sequence. When the block 404 moves to be parallel to the fixed block 401, rotate the rotating rod 405 in the opposite direction to reset it, and make the reset spring 403 squeeze the block 404. When the block 404 moves to be parallel to the slot 402, the block 404 can be ejected by the squeezing of the reset spring 403, thereby installing the cooling mechanism 30. The cooling mechanism 30 can be removed by rotating the rotating rod 405 and pulling the rotating rod 405.

[0031] The method of this embodiment can be used to execute the above-mentioned device embodiment. Its principle and technical effect are similar and will not be described in detail here.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A power module, characterized in that: include: The module mechanism (10) is used to provide stable electric energy, complete power conversion and distribution, and support load operation; A sealing mechanism (20) disposed in the middle of the module mechanism (10) and used to provide secondary sealing for the module mechanism (10) and to prevent the outside from affecting the interior of the module mechanism (10) by means of dynamic extrusion; A cooling mechanism (30) disposed on the top of the module mechanism (10) and used to form a uniform airflow inside the module mechanism (10) to reduce the heat of the module mechanism (10) when in use; A connecting mechanism (40) disposed on the top of the module mechanism (10) and used to provide a simple operation for assembly and disassembly between the cooling mechanism (30) and the module mechanism (10); The module mechanism (10) comprises a housing (101), a PCB board (102) is installed inside the housing (101), a pin (103) is fixedly connected to the bottom of the PCB board (102), the pin (103) runs through the middle of the housing (101), and a cover plate (104) is installed on the upper side of the housing (101); The sealing mechanism (20) comprises a compression spring (201), the compression spring (201) being fixedly connected to the inside of the housing (101), the other end of the compression spring (201) being fixedly connected to a sealing block (202), a sealing groove (203) being formed on a side of the cover plate (104) close to the housing (101), the sealing block (202) and the sealing groove (203) being plug-fitted; The cooling mechanism (30) comprises a casing (301), the casing (301) being arranged in the middle of the cover plate (104), a support block (302) being fixedly connected inside the casing (301), a motor (303) being fixedly connected to the other side of the support block (302), a fan blade (304) being fixedly connected to the output end of the motor (303), and a diverter plate (305) being fixedly installed on one side of the casing (301) close to the cover plate (104); The connecting mechanism (40) comprises an installation component and a disassembly component, both of which are arranged on the top of the cover plate (104), wherein the installation component comprises a fixing block (401), the fixing block (401) is fixedly connected to the top of the cover plate (104), a slot (402) is provided in the middle of the fixing block (401), a return spring (403) is fixedly connected to the inside of the sleeve (301), the other end of the return spring (403) is fixedly connected to the block (404), and the block (404) and the slot (402) are plug-fitted.

2. A power module according to claim 1, characterized in that: The disassembly assembly comprises a rotating rod (405), the rotating rod (405) being rotatably connected to the middle part of the casing (301), one end of the rotating rod (405) close to the casing (301) being fixedly connected to a wire wheel (406), the outer side of the wire wheel (406) being fixedly connected to a pull rope (407), and the other end of the pull rope (407) being fixedly connected to a side of the clamping block (404) close to the return spring (403).

3. A power module according to claim 2, characterized in that: One end of the rotating rod (405) away from the casing (301) is fixedly connected to a handle (50), and an anti-slip groove is provided on the outer side of the handle (50).

4. A power module according to claim 2, characterized in that: A partition is slidably connected inside the casing (301), and the partition is fixedly connected between the return spring (403) and the clamping block (404).

5. A power module according to claim 2, characterized in that: A connecting rod (60) is fixedly connected to the upper side of the cover plate (104), and the fixing block (401) is fixedly connected to an end of the connecting rod (60) away from the cover plate (104).

6. A method for processing a power module, characterized in that: Using a power module according to any one of claims 2 to 5 comprises the following steps: Step 1: welding the PCB board (102) into a semi-finished product, and cleaning the semi-finished PCB board (102) to remove contamination from the surface. After drying, the PCB board (102) is placed in the housing (101) and the pins (103) are passed through the housing (101). After installation, the PCB board (102) is wrapped with colloid using a glue gun and then placed at room temperature for curing. After curing, the cover plate (104) is installed. Step 2: When the cover plate (104) is installed, the sealing block (202) is pressed downward by the housing (101) to compress the compression spring (201); after the housing (101) and the cover plate (104) are connected, the sealing block (202) and the cover plate (104) are continuously in contact with each other through the compression spring (201), thereby maintaining the sealing of the power module; Step 3: Weld the connecting rod (60) and the fixing block (401) from the top of the cover plate (104) in sequence, and after welding, rotate the rotating rod (405) so that the block (404) compresses the return spring (403). At this time, insert the housing (301) into the fixing block (401) and the cover plate (104) in sequence. When the block (404) moves to be parallel to the fixing block (401), rotate the rotating rod (405) in the opposite direction to reset it, and make the return spring (403) squeeze the block (404). When the block (404) moves to be parallel to the slot (402), the block (404) can be pushed in by the return spring (403), thereby installing the cooling mechanism (30). The cooling mechanism (30) can be removed by rotating the rotating rod (405) and pulling the rotating rod (405).

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