Supporting platform for data center, container and data center

Abstract

The embodiment of the invention provides a supporting platform for a data center, a container and the data center, the supporting platform comprises a frame structure and a supporting plate, the frame structure comprises a plurality of first supporting beams extending in the first direction and a plurality of second supporting beams extending in the second direction, a plurality of second supporting beams are connected between every two adjacent first supporting beams. The supporting plate is connected to the top of the frame structure, a bearing surface is defined by the upper side surface of the supporting plate, and the bearing surface is used for bearing at least one of a computing assembly, a power distribution cabinet and cooling equipment of the data center. Thus, the calculation assembly can be integrated on one supporting platform conveniently, or the calculation assembly, the power distribution cabinet and the cooling equipment can be integrated on one supporting platform conveniently, an integrated data center is formed, and transportation and delivery are facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of computing equipment, and in particular to a support platform, a container and a data center for a data center. Background Art

[0002] Data centers are usually equipped with multiple computing devices, cooling modules for dissipating heat from computing devices, and power distribution modules for supplying power to computing devices. Before the data center is delivered, each module is independent of each other and needs to be packaged separately, which results in high transportation costs. Moreover, after the data center is delivered, the placement of each module needs to be adjusted to match the site, and then assembled and tested, resulting in a long deployment cycle. Summary of the invention

[0003] The embodiments of the present application provide a support platform, a container and a data center for a data center to solve or alleviate one or more technical problems in the prior art.

[0004] As one aspect of an embodiment of the present application, an embodiment of the present application provides a support platform for a data center, including:

[0005] A frame structure, comprising a plurality of first support beams extending along a first direction and a plurality of second support beams extending along a second direction, a plurality of second support beams being connected between two adjacent first support beams, and the first direction intersects the second direction;

[0006] The support plate is connected to the top of the frame structure, and the upper surface of the support plate defines a bearing surface, which is used to bear at least one of a computing assembly, a power distribution cabinet and a cooling device of the data center.

[0007] In one embodiment, at least part of the second support beams are staggered in the second direction.

[0008] In one embodiment, the support plate includes a plurality of plate bodies that are spliced ​​and arranged with each other, and each plate body is connected to the frame structure through a corresponding fastener.

[0009] In one embodiment, a gap is defined between two adjacent plate bodies, and the gap is used to guide the liquid on the bearing surface to the lower side of the support plate.

[0010] In one embodiment, the width of the gap is 0.5 to 2 mm.

[0011] In one embodiment, a plurality of convex structures distributed at intervals are formed on the upper surface of the plate.

[0012] In one embodiment, the plurality of protrusion structures include a plurality of first protrusions and a plurality of second protrusions, the first protrusions intersect with the second protrusions in an extension direction of the horizontal plane, and the first protrusions and the second protrusions are alternately distributed in the second direction.

[0013] In one embodiment, the thickness of the plate is 2-4 mm.

[0014] In one embodiment, the frame structure has a first area and a second area arranged in a first direction, the support plate covers the first area, and the support plate is used to support the power distribution cabinet and the plurality of computing assemblies;

[0015] The support platform also includes a frame, which is arranged in the second area and extends upward from the second area. The interior of the frame is used to accommodate the liquid storage module of the cooling device, and the upper part of the frame is used to support the heat exchange module of the cooling device.

[0016] In one embodiment, a size of the first region in the first direction is greater than a size of the second region in the first direction.

[0017] In one embodiment, the cooling device includes a first pipeline group and a second pipeline group, the first pipeline group is connected to a first heat exchange flow path of the heat exchange module, and the second pipeline group is connected to a second heat exchange flow path of the heat exchange module;

[0018] Among them, the second area includes three sub-areas arranged in the second direction; the orthographic projection of the frame in the horizontal plane is located in the middle sub-area, and the bottom end of the frame is connected to the middle sub-area; at least part of the pipe section of the first pipeline group and the orthographic projection of the second pipeline group in the horizontal plane are respectively located in the two sub-areas on both sides.

[0019] In one embodiment, the support platform further includes: two third support beams, respectively connected to opposite sides of the frame structure in the second direction, and both extending along the first direction;

[0020] The support plate covers the top of the two third support beams and the frame structure. The support plate has two vertical portions extending downward on opposite sides of the second direction. The two vertical portions are respectively located on opposite sides of the two third support beams in the second direction.

[0021] In one embodiment, the support platform further comprises a plurality of footings, and the plurality of footings are arranged on the third support beam at intervals along the first direction;

[0022] The foot comprises a base and a screw rod connected to the base and extending vertically through the bottom wall of the third support beam, and the screw rod is used for cooperating with a nut to level the support platform.

[0023] In one embodiment, the vertical cross-sections of the first support beam, the second support beam, and the third support beam are all I-shaped or rectangular.

[0024] As another aspect of an embodiment of the present application, an embodiment of the present application provides a container, comprising: a box body, which defines a receiving cavity inside, and the receiving cavity is used to receive any of the aforementioned support platforms.

[0025] In one embodiment, the box body includes a frame, and the frame is protruded upward on one side of the bottom of the box body in the second direction;

[0026] The support platform is spaced apart from the frame at one side adjacent to the frame in the second direction to form a groove for draining liquid.

[0027] In one embodiment, the frame is formed with a plurality of drainage holes, and the plurality of drainage holes are distributed at intervals in the first direction.

[0028] As another aspect of an embodiment of the present application, an embodiment of the present application provides a data center, including:

[0029] A support platform as described in any of the preceding items and a container as described in any of the preceding items;

[0030] A power distribution cabinet and multiple computing assemblies are arranged in sequence along a first direction and supported on a support plate of a support platform; the computing assembly includes a cabinet and multiple computing devices, and the multiple computing devices are vertically arranged inside the cabinet.

[0031] In one embodiment, the data center further includes: cooling equipment, arranged in the second area of ​​the supporting platform, the cooling equipment being used to cool computing devices of the plurality of computing assemblies.

[0032] According to the support platform for a data center in an embodiment of the present application, at least one of a computing assembly, a power distribution cabinet, and a cooling device is arranged on the support platform to facilitate transportation and deployment.

[0033] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0035] Figure 1A A schematic diagram of a three-dimensional structure of a support platform according to an embodiment of the present application is shown;

[0036] Figure 1B A schematic diagram showing the exploded structure of a support platform according to an embodiment of the present application is shown;

[0037] Figure 2AA schematic diagram showing the structure of a support platform according to an embodiment of the present application at a viewing angle;

[0038] Figure 2B A schematic diagram showing the structure of the support platform according to an embodiment of the present application at another viewing angle;

[0039] Figure 3A A schematic diagram showing the cooling principle of a data center according to an embodiment of the present application is shown;

[0040] Figure 3B A schematic diagram of the structure of a data center according to an embodiment of the present application is shown.

[0041] Description of reference numerals:

[0042] 400-support platform, 410-frame structure, 410a-first area, 410b-second area, 410b1-sub-area, 411-first support beam, 412-second support beam, 413-third support beam, 420-support plate, 421-plate body, 422-gap, 423-protrusion structure, 4231-first protrusion, 4232-second protrusion, 424-vertical portion, 430-frame body, 431-vertical frame, 432-horizontal frame, 440-foot, 441-base, 442-screw;

[0043] 1000-computing assembly, 100-cabinet, 200-cooling device, 10-heat exchange module, 10a-first heat exchange flow path, 10b-second heat exchange flow path, 210-medium flow path, 215-cooling pipeline, 230-computing device;

[0044] 20-first pipeline group, 21-first liquid supply pipeline, 211-first liquid supply sub-pipeline, 212-second liquid supply sub-pipeline, 213-liquid inlet pipeline, 22-first liquid return pipeline, 221-first liquid return section, 226-liquid outlet pipeline, 30-second pipeline group, 31-second liquid supply pipeline, 32-second liquid return pipeline;

[0045] 40 - first power device, 50 - second power device, 60 - first pressure stabilizing tank, 70 - second pressure stabilizing tank, 80 - first liquid storage tank, 90 - second liquid storage tank;

[0046] 300-top frame, 500-cold source equipment, 600-power distribution cabinet, 700-box, 701-frame, 702-drain hole;

[0047] L1-first direction, L2-second direction. DETAILED DESCRIPTION

[0048] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0049] Figure 1A FIG. 4 is a schematic diagram showing a three-dimensional structure of a support platform 400 according to an embodiment of the present application. Figure 1B FIG. 4 is a schematic diagram showing an exploded structure of a support platform 400 according to an embodiment of the present application. Figure 2A A schematic diagram showing the structure of the support platform 400 according to an embodiment of the present application at a viewing angle is shown. Figure 2B A schematic structural diagram of the support platform 400 according to an embodiment of the present application is shown at another viewing angle.

[0050] Reference Figures 1A to 2B The support platform 400 for the data center of this embodiment includes a frame structure 410 and a support plate 420. The frame structure 410 includes a plurality of first support beams 411 extending along a first direction L1 and a plurality of second support beams 412 extending along a second direction L2. A plurality of second support beams 412 are connected between two adjacent first support beams 411. The support plate 420 is connected to the top of the frame structure 410. The upper surface of the support plate 420 defines a bearing surface, which is used to bear at least one of the computing assembly, power distribution cabinet and cooling equipment of the data center. In this way, it is convenient to integrate the computing assembly into a support platform 400 or to integrate the computing assembly, power distribution cabinet and cooling equipment into a support platform 400, so as to form an integrated data center, which is convenient for transportation and delivery.

[0051] The first direction L1 intersects with the second direction L2. In some examples, the first direction L1 and the second direction L2 are two horizontal directions perpendicular to each other.

[0052] In some examples, the first support beam 411 and the second support beam 412 are fixedly connected by welding.

[0053] In other examples, the first support beam 411 and the second support beam 412 are fixedly connected by fasteners.

[0054] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the first support beam 411 and the second support beam 412 can be connected in many other ways, such as riveting, latch connection or snap connection, to achieve a fixed connection between the first support beam 411 and the second support beam 412, but are not limited to this.

[0055] Exemplarily, the material of the first support beam 411 and the second support beam 412 may be metal, and the shapes of the first support beam 411 and the second support beam 412 are regular shapes.

[0056] In some examples, the material of the first support beam 411 and the second support beam 412 may be steel, and the vertical cross-sections of the first support beam 411 and the second support beam 412 are both I-shaped.

[0057] In other examples, the material of the first support beam 411 and the second support beam 412 may be an aluminum alloy, and the vertical cross-sections of the first support beam 411 and the second support beam 412 may both be rectangular.

[0058] It should be noted that the shape and material of the first support beam 411 and the second support beam 412 are not limited to the above examples, and their cross-sectional shapes can also be H-shaped, T-shaped, C-shaped, circular or Z-shaped, etc., and their materials can also be copper, carbon steel, alloy steel, etc. or other composite materials with higher strength and support, etc., but are not limited to these.

[0059] For example, the plurality of second support beams 412 connected between two adjacent first support beams 411 and distributed in the second direction L2 may be relatively distributed and / or staggered. Figure 1B As shown, at least part of the second support beams 412 are staggered in the second direction L2 to optimize load distribution, avoid local stress concentration, and improve the structural stability and rigidity of the support platform 400.

[0060] Illustratively, the support plate 420 includes a plurality of plate bodies 421 that are spliced ​​and arranged with each other.

[0061] In some examples, each plate body 421 is connected to the frame structure 410 by corresponding fasteners. Exemplarily, screw holes are formed at the relative positions of the support plate 420, the first support beam 411 and / or the second support beam 412 of the frame structure 410, and the support plate 420 is fixed to the frame structure 410 by sequentially passing through the corresponding screw holes of the plate body 421 and the first support beam 411 and / or the second support beam 412.

[0062] In some other examples, the plate body 421 is welded and fixedly connected to the frame structure 410. Exemplarily, the plate body 421 is welded and fixedly connected to the first support beam 411 and / or the second support beam 412 of the frame structure 410, respectively.

[0063] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the connection between the plate body 421 and the frame structure 410 can also be in many other ways, such as riveting, latch connection or snap connection, etc. These connection methods can achieve a fixed connection between the plate body 421 and the frame structure 410. This is also only an example, and the connection between the plate body 421 and the frame structure 410 is not limited to this.

[0064] Exemplarily, the support platform 400 of this embodiment has a defensive design for draining liquid. Specifically, a gap 422 is defined between two adjacent plates 421, and the gap 422 is used to guide the liquid on the bearing surface to the lower side of the support plate 420 to prevent the liquid from being deposited on the support plate 420.

[0065] It can be understood that the liquid in this embodiment refers to the cooling medium for cooling the computing device in the computing assembly and / or the heat exchange medium that exchanges heat with the cooling medium to cool the cooling medium. For example, the cooling medium and the heat exchange medium can be selected from fluid media with good thermal conductivity and stability, such as cooling water, refrigerant, etc., and this embodiment of the application does not specifically limit this.

[0066] Exemplarily, the width of the gap 422 between two adjacent plates 421 can be 0.5 to 2 mm, for example, 0.5 mm, 0.8 mm, 1 mm, 1.5 mm or 2 mm, etc. A gap 422 of such size can ensure smooth discharge of liquid while having almost no effect on the supporting strength and rigidity of the supporting platform 400.

[0067] Exemplarily, the thickness of the plate body 421 may be 2-4 mm, thereby ensuring the structural strength of the support plate 420 and controlling the overall weight of the support plate 420 .

[0068] In one embodiment, the upper surface of the plate body 421 is formed with spaced-apart raised structures 423 , which are used to prevent slipping, thereby preventing workers from slipping when stepping on the support plate 420 . At the same time, the raised structures 423 can also improve the structural strength and toughness of the support plate 420 .

[0069] Exemplarily, the plurality of protrusion structures 423 are evenly distributed on the entire upper surface of the plate body 421 .

[0070] In one embodiment, the multiple protrusion structures 423 include multiple first protrusions 4231 and multiple second protrusions 4232, the first protrusions 4231 and the second protrusions 4232 intersect in the extension direction of the horizontal plane, and the first protrusions 4231 and the second protrusions 4232 are alternately distributed in the second direction L2 to increase the anti-slip effect and structural strength of the support plate 420.

[0071] like Figure 1A As shown, the extension direction of the first protrusion 4231 is approximately perpendicular to the extension direction of the second protrusion 4232, and the plate body 421 has multiple rows of first protrusions 4231 and multiple rows of second protrusions 4232 in the second direction L2, each row of first protrusions 4231 includes multiple first protrusions 4231 spaced apart in the first direction L1, each row of second protrusions 4232 includes multiple second protrusions 4232 spaced apart in the first direction L1, and each row of first protrusions 4231 and each row of second protrusions 4232 are alternately distributed in the second direction L2.

[0072] In one embodiment, the frame structure 410 has a first area 410a and a second area 410b arranged in a first direction L1, and a support plate 420 covers the first area 410a, and the support plate 420 is used to support a power distribution cabinet and a plurality of computing assemblies. The support platform 400 also includes a frame 430, which is disposed in the second area 410b and extends upward from the second area 410b. The interior of the frame 430 is used to accommodate a liquid storage module of a cooling device, and the upper part of the frame 430 is used to support a heat exchange module of the cooling device. In this way, a power distribution cabinet, a plurality of computing assemblies, and a liquid storage module and a heat exchange module of a cooling device are integrated through a support platform 400 to form an integrated data center, which is convenient for large-scale transportation and delivery; and reduces the maintenance cost of the data center.

[0073] The support platform 400 of this embodiment provides a layout location for a power distribution cabinet and multiple computing assemblies through the first area 410a and the support plate 420 covering the first area 410a, and provides a layout location for cooling equipment through the second area 410b. The power distribution cabinet and the cooling equipment are physically isolated by using multiple computing assemblies to increase the distance between the two, thereby improving the overall reliability of the data center.

[0074] Moreover, due to the frame structure of the second area 410b, any leakage that may occur in the cooling equipment can be discharged to the outside of the support platform 400 through the second area 410b and will not be deposited on the support platform 400, and will not flow from the second area 410b to the support plate 420 at the first area 410a, thereby avoiding the problem of contact leakage in the distribution cabinet.

[0075] In addition, the support platform 400 elevates the power distribution cabinet so that it does not contact the placement surface of the data center, thereby preventing leakage of the cooling equipment from causing water on the placement surface and affecting the power distribution cabinet. The support platform 400 can also guide possible leakage of the cooling equipment to the outside of the support platform 400, completely isolating water and electricity, and further improving the safety of the data center.

[0076] Furthermore, the support platform 400 integrates the power distribution cabinet, computing assembly and cooling equipment, which improves the integration of the data center while ensuring that water and electricity can be completely isolated. It not only effectively utilizes the vertical and horizontal space, reduces the physical footprint, and facilitates overall transportation and delivery; it can also simplify the monitoring and management process, making it easier for operation and maintenance personnel to operate and maintain. Furthermore, the integrated design can reduce the distance and time of power and signal transmission, improve the response speed of the data center, and enhance the overall reliability of the data center.

[0077] In some examples, the frame 430 is welded to the first region 210 of the frame structure 410 .

[0078] In other examples, the frame 430 may be connected to the first region 410a of the frame structure 410 by fasteners, rivets, latches, or snaps. This is just an example, and the connection between the frame 430 and the frame structure 410 is not limited thereto.

[0079] Exemplarily, the frame 430 includes a vertical frame 431 and a horizontal frame 432 . The bottom end of the vertical frame 431 is connected to the first area 210 , and the horizontal frame 432 is connected to the top end of the vertical frame 431 .

[0080] In some examples, the size of the first area 410a in the first direction L1 is larger than the size of the second area 410b in the first direction L1. It can be understood that the size occupied by the power distribution cabinet and multiple computing assemblies in the first direction L1 is larger, and the first area 410a provides sufficient carrying space for the power distribution cabinet and multiple computing assemblies.

[0081] In some examples, a size of the first region 410 a in the second direction L2 is substantially equal to a size of the second region 410 b in the second direction L2.

[0082] It should be noted that the sizes of the first area 410a and the second area 410b can be flexibly set according to actual conditions to provide carrying space for the computing assembly, power distribution cabinet and cooling equipment, ensuring that the computing assembly, power distribution cabinet and cooling equipment are distributed in different areas on the support platform 400.

[0083] In one embodiment, the cooling device includes a first pipeline group and a second pipeline group, the first pipeline group is connected to the first heat exchange flow path of the heat exchange module, and the second pipeline group is connected to the second heat exchange flow path of the heat exchange module; wherein the second area 410b includes three sub-areas 410b1 arranged in the second direction L2; the orthographic projection of the frame 430 in the horizontal plane is located in the middle sub-area 410b1, and the bottom end of the frame 430 is connected to the middle sub-area 410b1; at least part of the pipe section of the first pipeline group and the orthographic projection of the second pipeline group in the horizontal plane are respectively located in the two sub-areas 410b1 on both sides.

[0084] As mentioned above, the three sub-areas 410b1 of the second area 410b provide layout space for the first pipeline group and the second pipeline group of the cooling equipment. The frame 430 located directly above the middle sub-area 410b1 provides a support structure for the liquid storage module and the heat exchange module of the cooling equipment, so that the positions of the various components in the cooling equipment are more concentrated, reducing the space occupied by the cooling equipment, which is conducive to controlling the overall size of the data center.

[0085] In one embodiment, the frame structure 410 is connected to two third support beams 413 on opposite sides of the second direction L2, and the third support beams 413 extend along the first direction L1. The support plate 420 covers the top of the two third support beams 413 and the frame structure 410, and the support plate 420 has two vertical portions 424 extending downward on opposite sides of the second direction L2, and the two vertical portions 424 are respectively located on opposite sides of the two third support beams 413 in the second direction L2. In this embodiment, the support plate 420 is supported by the frame structure 410 located in the middle and the two third support beams 413 located on both sides, thereby improving the support strength. In addition, the two vertical portions 424 of the support plate 420 on opposite sides of the second direction L2 can play a positioning role in the assembly of the support plate 420 and the frame structure 410, so as to facilitate the placement of the support plate 420.

[0086] In some examples, the support plate 420 is fixedly connected to the third support beam 413 by welding.

[0087] In other examples, the support plate 420 is fixedly connected to the third support beam 413 by fasteners.

[0088] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the support plate 420 and the third support beam 413 may be connected in many other ways, such as riveting, latching or snap-fitting, but are not limited thereto.

[0089] In one embodiment, the third support beam 413 may be provided with a plurality of feet 440 arranged at intervals along the first direction L1, the feet 440 including a base 441 and a screw 442 connected to the base 441 and extending vertically through the bottom wall of the third support beam 413, the screw 442 being used to cooperate with a nut to level the support platform 400. In this way, the influence of the unevenness of the surface to be placed, such as the ground or the bottom wall of the container, on the stability of the support platform 400 can be overcome, and the overall stability of the support platform 400 can be ensured.

[0090] Exemplarily, a rubber pad is provided at the bottom of the base 441 to increase friction and prevent sliding.

[0091] In some examples, the third support beam 413 is fixedly connected to the first support beam 411 of the frame structure 410 by welding.

[0092] In other examples, the third support beam 413 is fixedly connected to the first support beam 411 via fasteners.

[0093] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will appreciate that there may be other ways to connect the third support beam 413 to the first support beam 411, such as riveting, latch connection, or snap connection, as long as the third support beam 413 and the first support beam 411 can be fixedly connected, and are not limited thereto.

[0094] Exemplarily, the third support beam 413 has a regular shape, and the material of the third support beam 413 is metal.

[0095] In some examples, the vertical cross-section of the third support beam 413 is an I-shape, and the material of the third support beam 413 may be steel.

[0096] In other examples, the vertical cross-section of the third support beam 413 may be rectangular, and the material of the third support beam 413 may be aluminum alloy.

[0097] It should be noted that the shape and material of the third support beam 413 are not limited to the above examples, and its cross-sectional shape can also be H-shaped, T-shaped, C-shaped, circular or Z-shaped, and its material can also be copper, carbon steel, alloy steel, etc. or other composite materials with higher strength and support, etc., but is not limited to these.

[0098] Figure 3A A schematic diagram showing the cooling principle of a data center according to an embodiment of the present application is shown. Figure 3B A schematic diagram of the structure of a data center according to an embodiment of the present application is shown.

[0099] like Figure 3B As shown, this embodiment further provides a container, including a box body 700 defining a receiving cavity therein and a support platform 400 for receiving any one of the aforementioned embodiments, so as to facilitate transportation, deployment and delivery.

[0100] In some examples, the support platform 400 can be placed directly inside the box 700. To ensure the stability of the support platform 400 during container handling, the internal dimensions of the box 700 can be matched with the dimensions of the support platform 400 to prevent it from moving; or a buffer protection layer can be added between the support platform 400 and the box 700 to provide additional protection to prevent it from moving.

[0101] In other examples, the support platform 400 can be fixed inside the box 700. For example, the support platform 400 can be fixed to the bottom wall of the box 700 by fasteners. This not only reinforces the support platform 400, but also significantly improves its stability during transportation.

[0102] It should be noted that the above is only an example and does not constitute a limitation to the present application.

[0103] Those skilled in the art can understand that the arrangement of the support platform 400 relative to the box 700 can also be in other forms. For example, an anti-skid pad can be added to the bottom of the box 700, or a shock-absorbing pad or shock absorber can be used between the support platform 400 and the box 700 for isolation to reduce the vibration and impact of the box 700 during transportation. In addition, a clamp or buckle can be set inside the box 700, or the support platform 400 can be fixed by magnetic attraction or vacuum adsorption. This is only for example, and the arrangement of the support platform 400 relative to the box 700 is not limited to the above examples.

[0104] In one embodiment, the box body 700 includes a frame 701, which is protruding upward on one side of the bottom of the box body 700 in the second direction L2. The support platform 400 is spaced apart from the frame 701 on one side adjacent to the frame 701 in the second direction L2 to form a groove for liquid drainage. That is, when the support platform 400 is arranged at the bottom of the box body 700, it needs to maintain a certain distance from the frame of the box body 700 to reserve a channel for liquid discharge, so as to facilitate timely discharge of liquid.

[0105] The frame 701 may be formed with a plurality of drainage holes 702 spaced apart in the first direction L1 , and the liquid in the groove is discharged to the outside of the box body 700 through the drainage holes 702 , so as to avoid water accumulation at the bottom of the box body 700 .

[0106] Exemplarily, there are two drainage holes 702. The two drainage holes 702 can together form a forklift hole, which is convenient for a forklift to carry the container.

[0107] like Figure 3A and 3BAs shown, this embodiment also provides a data center, including a support platform 400 of any of the aforementioned embodiments and a container of any of the aforementioned embodiments, as well as a power distribution cabinet 600 and a plurality of computing assemblies 1000. The power distribution cabinet 600 and the plurality of computing assemblies 1000 are arranged in sequence along the first direction L1 and supported on the support plate 420 of the support platform 400; the computing assembly 1000 includes a cabinet 100 and a plurality of computing devices 230, and the plurality of computing devices 230 are vertically arranged inside the cabinet 100. In this way, a container-type data center is formed, which is convenient for transportation, deployment and delivery. In addition, compared with traditional data centers, container-type data centers have lower construction and maintenance costs, and can be pre-assembled and tested. On-site, it only needs to simply connect the power supply and network to be put into use, saving time.

[0108] In one embodiment, the cabinet 100 has a first accommodating space and a second accommodating space arranged in a first direction L1, a plurality of computing devices 230 are vertically arranged in the first accommodating space, and the computing assembly 1000 includes a plurality of power distribution units (not shown), and the plurality of power distribution units are vertically arranged in the second accommodating space.

[0109] The power distribution unit is connected to the power distribution cabinet 600 via a power supply cable, and the power distribution unit is connected to the computing device 230 in the cabinet 100 to improve the convenience of power supply to the computing device 230 .

[0110] The top of the cabinet 100 may be provided with a top connection plate, which is provided on one side of the top of the cabinet body 110 in the first direction L1, and is used to connect with adjacent cabinets 100 arranged in the first direction L1. That is, two adjacent cabinets 100 arranged in the first direction L1 can be connected together through the top connection plate, which is convenient for constructing a plurality of cabinets 100 arranged and connected in sequence, thereby forming a stable integrated plurality of cabinets 100, which is convenient for transportation and delivery.

[0111] Exemplarily, a top connecting plate may be disposed at an edge of the top of the cabinet body 110 in the first direction L1, the top connecting plate having a connecting hole, the top of another adjacent cabinet 100 having another connecting hole corresponding to the connecting hole, and the two adjacent cabinets 100 being connected by fasteners that pass through the connecting hole and the other connecting hole in sequence.

[0112] The cabinet 100 can be connected to the support platform 400 through the bottom connection plate, which extends downward from the bottom of the cabinet body 110 on the outside of the second direction L2 to form a stable triangular structure of the bottom connection plate, thereby improving the stability of the connection between the cabinet 100 and the support platform 400. It can be understood that the bottom connection plate is formed with connection holes for connecting with the cabinet 100 and the support platform 400, and the bottom connection plate is fixed to the cabinet 100 and the support platform respectively by fasteners passing through the corresponding connection holes.

[0113] Exemplarily, bottom connecting plates are respectively provided on two outer sides of the bottom of the cabinet 100 in the second direction L2 to enhance the stability of the connection between the cabinet 100 and the supporting platform 400 .

[0114] See also Figure 3A The computing assembly 1000 further includes a medium flow path 210 corresponding to the plurality of computing devices 230, and the medium flow path 210 is used to allow a cooling medium to flow through the plurality of computing devices 230. Specifically, the medium flow path 210 may include a cooling pipeline 215, a liquid inlet distribution pipeline 150, and a liquid return distribution pipeline 140. The cooling pipeline 215 is disposed inside the computing device 230 and is in thermal contact with the heat generating components of the computing device 230 to cool the heat generating components.

[0115] Exemplarily, the cooling circuit 215 may be attached to or embedded in key heat-generating components of the computing device 230 , such as a central processing unit, a graphics processing unit, a memory module, and other heat-generating electronic components.

[0116] The liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 are arranged on one side of the cabinet 100. The liquid inlet distribution pipeline 150 has a liquid inlet and a plurality of liquid delivery ports. The liquid inlet is connected to the liquid supply outlet of the first pipeline group 20. The plurality of liquid delivery ports correspond one-to-one to the cooling pipelines 215 of the plurality of computing devices 230 and are respectively connected to the input ends of the cooling pipelines 215 of the plurality of computing devices 230. The liquid return distribution pipeline 140 has a plurality of liquid return ports and liquid outlets. The plurality of liquid return ports correspond one-to-one to the cooling pipelines 215 of the plurality of computing devices 230 and are respectively connected to the output ends of the cooling pipelines 215 of the plurality of computing devices 230. The liquid outlet is connected to the liquid return inlet of the first pipeline group 20.

[0117] In the computing assembly 1000 of this embodiment, the cabinet 100 realizes cooling of each computing device 230 while carrying each computing device 230, and has a compact structure and small space occupation, thereby facilitating maintenance and reducing costs. In addition, liquid delivery distribution and liquid return distribution to multiple computing devices 230 are realized through a liquid inlet distribution pipeline 150 and a liquid return distribution pipeline 140, reducing the number of components of the computing assembly 1000 and simplifying the overall structure of the cabinet 100. It is also convenient for centralized management, which is conducive to more effective temperature control and reduced energy consumption.

[0118] Exemplarily, the inlet liquid distribution pipeline 150 and the return liquid distribution pipeline 140 are respectively arranged vertically on one side of the cabinet 100 adjacent to the first pipeline group 20 in the second direction L2, and a plurality of liquid delivery ports and a plurality of return liquid ports are respectively arranged at intervals along the vertical direction. On the one hand, it is convenient for the liquid inlet of the inlet liquid distribution pipeline 150 and the liquid outlet of the return liquid distribution pipeline 140 to be connected to the liquid supply outlet and the return liquid inlet of the first pipeline group 20 respectively; on the other hand, the arrangement direction of each liquid delivery port and the arrangement direction of each return liquid port are consistent with the arrangement direction of each computing device 230, so that each liquid delivery port and each return liquid port are conveniently connected to the cooling pipeline 215 inside each computing device 230.

[0119] In one embodiment, the projections of the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 on the vertical plane are respectively located on both sides of the projections of the multiple computing devices 230 on the vertical plane; the multiple liquid delivery ports and the multiple liquid return ports are distributed facing each other in the first direction L1, and the multiple liquid delivery ports are adjacent to one side of the multiple computing devices 230 in the first direction L1, and the multiple liquid return ports are adjacent to the other side of the multiple computing devices 230 in the first direction L1. In this way, the arrangement of the liquid delivery hose between each liquid delivery port and the input end of each cooling pipeline 215 and the arrangement of the liquid return hose between each liquid return port and the output end of each cooling pipeline 215 can be simplified, thereby shortening the length of the liquid delivery hose and the liquid return hose.

[0120] In one embodiment, the liquid inlet is formed on one side of the liquid inlet distribution pipeline 150 adjacent to the first pipeline group 20 in the second direction L2, and adjacent to the top of the liquid inlet distribution pipeline 150; the liquid outlet is formed on one side of the liquid return distribution pipeline 140 adjacent to the first pipeline group 20 in the second direction L2, and adjacent to the top of the liquid return distribution pipeline 140. In this way, the distance between the liquid inlet of the liquid inlet distribution pipeline 150 and the liquid outlet of the liquid return distribution pipeline 140 and the first pipeline group 20 is shortened, and the liquid inlet and the liquid outlet are conveniently connected to the liquid supply inlet and the liquid return inlet of the first pipeline group 20, respectively.

[0121] The cooling equipment 200 of the data center can be arranged in the second area 410b of the supporting platform 400, which can not only facilitate the heat dissipation of each computing device 230, but also greatly reduce the space occupied by the data center, facilitate the maintenance of the data center, and reduce the construction cost and maintenance cost of the data center.

[0122] Exemplarily, the cooling device 200 includes a liquid storage module and a heat exchange module 10 , the interior of the frame 430 is used to accommodate the liquid storage module, and the upper part of the frame 430 is used to support the heat exchange module 10 .

[0123] Exemplarily, the cooling device 200 also includes a first pipeline group 20 and a second pipeline group 30, the first pipeline group 20 is connected to the first heat exchange flow path 10a of the heat exchange module 10, and the second pipeline group 30 is connected to the second heat exchange flow path 10b of the heat exchange module 10; the second area 410b includes three sub-areas 410b1 arranged in the second direction L2; the orthographic projection of the frame 430 in the horizontal plane is located in the middle sub-area 410b1, and the bottom end of the frame 430 is connected to the middle sub-area 410b1; at least part of the first pipeline group 20 and the orthographic projection of the second pipeline group 30 in the horizontal plane are respectively located in the two sub-areas 410b1 on both sides.

[0124] The first pipeline group 20 is connected between the heat exchange module 10 and the medium flow path 210 of multiple computing assemblies 1000, and is used to transport the low-temperature cooling medium cooled by the heat exchange module 10 to the medium flow path 210 of the computing assembly 1000, and then transport the high-temperature cooling medium after flowing through the computing assembly 1000 from the medium flow path 210 of the computing assembly 1000 back to the heat exchange module 10, thereby realizing the circulation of the cooling medium between the heat exchange module 10 and the medium flow path 210 of the computing assembly 1000, thereby circulating cooling of each computing device 230 of the computing assembly 1000.

[0125] The second pipeline group 30 is connected between the heat exchange module 10 and the cold source device 500, and is used to transport the heat exchange medium that has been heated by absorbing the heat of the cooling medium through the heat exchange module 10 to the cold source device 500, and then transport the heat exchange medium that has been cooled by the cold source device 500 back to the heat exchange module 10, so as to realize the circulation of the heat exchange medium between the heat exchange module 10 and the cold source device 500, thereby circulating and cooling the cooling medium.

[0126] The first heat exchange flow path 10a can be used for the flow of cooling medium, and the second heat exchange flow path 10b can be used for the flow of heat exchange medium. The cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium.

[0127] The first pipeline group 20 may include a first liquid supply pipeline 21 and a first liquid return pipeline 22. The first liquid supply pipeline 21 may be connected to the output end of the first heat exchange flow path 10a, and the first liquid supply pipeline 21 may be connected to the liquid inlet of the medium flow path 210 of the computing assembly 1000; the first liquid return pipeline 22 may be connected to the input end of the first heat exchange flow path 10a, and the first liquid return pipeline 22 may be connected to the liquid outlet of the medium flow path 210 of the computing assembly 1000.

[0128] The second pipeline group 30 may include a second liquid supply pipeline 31 and a second liquid return pipeline 32; the second liquid supply pipeline 31 may be connected to the input end of the second heat exchange flow path 10b, and the second liquid supply pipeline 31 may be connected to the medium output end of the cold source device 500; the second liquid return pipeline 32 may be connected to the output end of the second heat exchange flow path 10b, and the second liquid return pipeline 32 may be connected to the medium return end of the cold source device 500; wherein, the first pipeline group 20 and the second pipeline group 30 may be respectively arranged on opposite sides of the heat exchange module 10. On the one hand, it is conducive to improving the convenience of pipeline connection between the cooling device 200 and the computing assembly 1000 and the cold source device 500, and on the other hand, it can make full use of the space on both sides of the heat exchange module 10, so that the first pipeline group 20 and the second pipeline group 30 do not interfere with each other, and can also improve the utilization rate of the space, thereby improving the structural compactness of the data center.

[0129] In one embodiment, the cooling device 200 may also include a first power device 40 and a second power device 50, the first power device 40 is connected to the first pipeline group 20, and is used to provide power for the flow of the cooling medium; the second power device 50 is connected to the second pipeline group 30, and is used to provide power for the flow of the heat exchange medium.

[0130] For example, the first power device 40 and the second power device 50 may be fluid power pumps for driving the cooling medium to flow in the pipeline. The first power device 40 and the second power device 50 may be respectively disposed in two sub-areas on both sides of the support platform 400 .

[0131] The liquid storage module of the cooling device 200 may include a first liquid storage tank 80 and a second liquid storage tank 90. ​​The first liquid storage tank 80 is in communication with the first pipeline group 20, and the first liquid storage tank 80 is used to contain cooling medium and to replenish cooling medium to the first pipeline group 20. The second liquid storage tank 90 is in communication with the second pipeline group 30, and the second liquid storage tank 90 is used to contain cooling medium and to replenish heat exchange medium to the second pipeline group 30.

[0132] The first liquid storage tank 80 and the second liquid storage tank 90 can be arranged inside the frame 430 of the support platform 400, and are arranged side by side and adjacent to each other in the second direction L2. That is, the first liquid storage tank 80 and the second liquid storage tank 90 are both located below the heat exchange module 10, so as to make full use of the space below the heat exchange module 10, reduce the space occupied by the first liquid storage tank 80 and the second liquid storage tank 90 in the horizontal direction, and further improve the structural compactness of the cooling device 200.

[0133] In one embodiment, the cooling device 200 also includes a first pressure-stabilizing tank 60 and a second pressure-stabilizing tank 70. The first pressure-stabilizing tank 60 is connected to the first pipeline group 20 to stabilize the pressure of the first pipeline group 20. The second pressure-stabilizing tank 70 is connected to the second pipeline group 30 to stabilize the pressure of the second pipeline group 30. When the pressure in the cooling medium circulation system of the cooling device 200 is too high, the excess cooling medium in the first pipeline group 20 will enter the first pressure-stabilizing tank 60; when the pressure of the system is too low, the cooling medium in the first pressure-stabilizing tank 60 will flow back to the system to keep the pressure stable. This improves the stability, reliability and heat dissipation exchange efficiency of the cooling device 200. Similarly, when the pressure in the heat exchange medium circulation system of the cooling device 200 is too high or too low, it is adjusted by the second pressure-stabilizing tank 70 to keep the pressure stable.

[0134] The first pressure stabilizing tank 60 and the second pressure stabilizing tank 70 can be arranged inside the frame of the supporting platform 400, fixed in the middle sub-area of ​​the supporting platform 400, and arranged side by side and adjacent to each other in the second direction L2, so as to further utilize the space under the heat exchange module 10, improve the structural compactness of the cooling device 200, and reduce the space occupied by the cooling device 200 in the horizontal direction.

[0135] In one embodiment, the first liquid supply pipeline 21 may include a first liquid supply sub-pipeline 211 and a second liquid supply sub-pipeline 212 connected to each other. The first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 may extend along the first direction L1, respectively, and are arranged side by side and spaced apart in the second direction L2. The first liquid supply sub-pipeline 211 has a liquid supply inlet at one end adjacent to the heat exchange module 10, and the liquid supply inlet is connected to the output end of the first heat exchange flow path 10a. The second liquid supply sub-pipeline 212 is connected to the end of the first liquid supply sub-pipeline 211 away from the heat exchange module 10, and the second liquid supply sub-pipeline 212 has a liquid supply outlet, and the liquid supply outlet is connected to the liquid inlet of the medium flow path 210. The first liquid return pipeline 22 may include a first liquid return section 221, the first liquid return section 221 extends along the first direction L1, and the first liquid return section 221 may be provided with a liquid return inlet, and the liquid return inlet is connected to the liquid outlet of the medium flow path 210.

[0136] This embodiment arranges two liquid supply sub-pipelines side by side at intervals. On the one hand, it can evenly distribute the flow of the medium to prevent a single pipeline from being subjected to excessively high flow velocity and pressure, thereby reducing the pressure loss of the fluid flow and reducing the local resistance of the fluid when entering and leaving the pipeline. On the other hand, by independently arranging each liquid supply sub-pipeline, it can reduce the thermal interference of the cooling fluid between the pipelines and improve the overall heat exchange efficiency of the cooling device 200.

[0137] In one embodiment, the second liquid supply sub-pipeline 212 may be provided with a plurality of liquid supply outlets, and the plurality of liquid supply outlets may be arranged at intervals along the first direction L1 and correspond one-to-one to the liquid inlets of the medium flow paths 210 of the plurality of computing assemblies 1000, and each liquid supply outlet may be connected to the liquid inlet of the medium flow path 210 of the corresponding computing assembly 1000.

[0138] Exemplarily, each liquid supply outlet can be connected to the liquid inlet of the medium flow path 210 of the corresponding computing assembly 1000 through the liquid inlet pipeline 213. The liquid supply outlet can be opened at the bottom of the tube wall of the second liquid supply sub-pipeline 212. That is, the multiple liquid supply outlets of the second liquid supply sub-pipeline 212 are respectively connected to the liquid inlets of the liquid inlet distribution pipelines 150 of the multiple computing assemblies 1000 in a one-to-one correspondence.

[0139] In one embodiment, the first liquid return section 221 may be provided with a plurality of liquid return inlets, which may be arranged at intervals along the first direction L1 and correspond one-to-one to the liquid outlets of the medium flow paths 210 of the plurality of computing assemblies 1000, and each liquid return inlet may be connected to the liquid outlet of the medium flow path 210 of the corresponding computing assembly 1000. That is, the plurality of liquid return inlets of the first liquid return section 221 are respectively connected one-to-one to the liquid outlets of the liquid return distribution pipelines 140 of the plurality of computing assemblies 1000.

[0140] Exemplarily, each liquid return inlet may be connected to the liquid outlet of the medium flow path 210 of the corresponding computing assembly 1000 through the liquid outlet pipeline 226. The high-temperature cooling medium in the medium flow path 210 of each computing assembly 1000 enters the first liquid return pipeline 22 through the liquid return inlet, and then flows back to the first heat exchange flow path 10a of the heat exchange module 10 through the first liquid return pipeline 22.

[0141] In some examples, at least one of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 is a hose to adapt to space limitations and facilitate installation and removal.

[0142] In other examples, at least one of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 is a hard pipe to improve the structural strength of the pipeline.

[0143] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the hoses used in the liquid inlet pipeline 213 and the liquid outlet pipeline 226 can be bendable and elastic pipes such as plastic pipes and corrugated pipes, and the hard pipes can be metal pipes with greater hardness such as copper pipes, aluminum pipes, stainless steel pipes, or plastic pipes with greater hardness and support, or hard pipes made of plastic, metal or composite materials with a certain hardness and bending ability.

[0144] The materials of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 are not limited to the above examples, and can also be any combination of the above materials, such as soft and hard combined pipelines, all hoses or all hard pipes, etc., but are not limited thereto.

[0145] According to the above embodiment, by providing a plurality of liquid return inlets arranged at intervals along the first direction L1, the return path of the cooling medium is evenly distributed, and the space utilization is optimized. At the same time, the modular design of the liquid supply outlet and the liquid return inlet corresponding to the calculation assembly 1000 is conducive to the overall expansion and maintenance of the cooling device 200. When it is necessary to increase or decrease the calculation assembly 1000, it is only necessary to adjust the position and number of the corresponding liquid supply outlet and liquid return inlet, thereby improving the flexibility and maintenance efficiency of the cooling device 200.

[0146] Exemplarily, the ends of the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 away from the heat exchange module 10 are connected to each other, and the first liquid return section 221 can be arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 in the second direction L2, thereby making full use of the space between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212.

[0147] In one embodiment, the first liquid return pipeline 22 further includes a second liquid return section and a third liquid return section connected to each other, and the second liquid return section and the third liquid return section extend vertically respectively. The first liquid return section is closed and arranged at one end away from the heat exchange module 10, and one end of the first liquid return section 221 adjacent to the heat exchange module 10 is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path 10a.

[0148] Exemplarily, the orthographic projections of the second liquid return section and the third liquid return section in the horizontal plane are located in a sub-area 410b1 of the frame structure 410 of the bottom support platform 400. Specifically, the second liquid return section and the third liquid return section are both located in a sub-area 410b1 on a side adjacent to the first liquid supply pipeline 21, which fully utilizes the space above the support platform 400 and facilitates the connection of the third liquid return section with the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0149] In one embodiment, the projections of the second liquid supply pipeline 31 and the second liquid return pipeline 32 on the horizontal plane are located in a sub-area 410b1 on the side of the support platform 400 away from the first liquid supply pipeline 21, that is, the second liquid supply pipeline 31 and the second liquid return pipeline 32 of the second pipeline group 30 and the second liquid return section and the third liquid return section of the first pipeline group 20 are distributed on opposite sides of the heat exchange module 10 in the first direction L1. In this way, the pipelines of the cooling device 200 are further centrally arranged to improve the structural compactness of the cooling device 200.

[0150] like Figure 3B As shown, the data center may also include a top frame 300, which is fixed to the top of multiple computing assemblies 1000. The top frame 300 may include multiple cross beams and multiple longitudinal beams, which extend along the first direction L1 and are arranged side by side and at intervals in the second direction L2, and the multiple cross beams are fixedly connected to the tops of multiple computing assemblies 1000. The multiple longitudinal beams extend along the second direction L2 so that the cross beams and the longitudinal beams intersect; wherein, multiple longitudinal beams are fixedly connected between two adjacent cross beams; and part of the pipe sections of the first pipeline group 20 may be supported by the multiple longitudinal beams. In this way, the tops of multiple computing assemblies 1000 are fixed to prevent the computing assemblies 1000 from shaking and colliding with each other due to bumps during the transportation of the data center.

[0151] In addition, by providing a longitudinal beam that intersects and connects with the cross beam, the stability of the top frame 300 is increased, and at the same time, a supporting and fixing structure is provided for a partial pipe section of the first pipeline group 20 of the cooling equipment 200. This not only facilitates the connection between the first pipeline group 20 and the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 of the computing assembly 1000, but also eliminates the need for an additional fixing structure to fix the first pipeline group 20, which is beneficial to improving the compactness of the structure and space utilization.

[0152] In some examples, the longitudinal beam and the transverse beam may be fixedly connected by means of clamping, welding, or the like.

[0153] In other examples, the longitudinal beam and the cross beam may be connected by fasteners, rivets, bolt connections, etc. This is only an example, and the connection method between the longitudinal beam and the cross beam is not limited to this.

[0154] In one embodiment, the first liquid supply sub-pipeline 211, the second liquid supply sub-pipeline 212 and the first liquid return section 221 of the first pipeline group 20 can be supported on multiple longitudinal beams of the top frame 300, and the first liquid return section 221 is arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212, so that this part of the pipeline section of the first pipeline group 20 is concentrated on the top frame 300, thereby improving the compactness of the arrangement of the first pipeline group 20 and the computing assembly 1000, facilitating the connection between the liquid supply outlet of the first pipeline group 20 and the liquid inlet of the liquid inlet distribution pipeline 150 of the computing assembly 1000, and facilitating the connection between the liquid return inlet of the first pipeline group 20 and the liquid outlet of the liquid return distribution pipeline 140 of the computing assembly 1000.

[0155] In one embodiment, the plurality of cross beams include a first beam body and a second beam body, and the first beam body and the second beam body are fixedly connected to the top of at least one computing assembly 1000. The longitudinal beam includes a first section and a second section connected to each other, the first section is connected between the first beam body and the second beam body, and the second section is located on a side of the second beam body away from the first beam body and extends to the outside of the computing assembly 1000 in the second direction L2, wherein the second section provides support for the first liquid supply sub-pipeline 211, the second liquid supply sub-pipeline 212, and the first liquid return section 221 of the first pipeline group 20.

[0156] In the present embodiment, the second section of the longitudinal beam extends from the top of the computing assembly 1000 to the outside of the computing assembly 1000 in the second direction L2, so that the first liquid supply sub-pipeline 211, the second liquid supply sub-pipeline 212 and the first liquid return section 221 supported by the second section 322 are located on the outside of the computing assembly 1000 in the second direction L2, rather than directly above the top of the computing assembly 1000. Therefore, when the first pipeline group 20 leaks, the liquid will drip to the outside of the computing assembly 1000 instead of dripping to the top of the computing assembly 1000, thereby avoiding affecting the computing assembly 1000; moreover, the first pipeline group 20 is located on the outside of the computing assembly 1000 in the second direction, thereby reserving a reasonable position for arranging the space for the connecting pipelines between the liquid inlet distribution pipeline 150, the liquid return distribution pipeline 140 of the computing assembly 1000 and the first pipeline group 20, thereby facilitating the connection between the pipelines.

[0157] Exemplarily, the projection of the first section of the longitudinal beam in the horizontal plane is within the range of the projection of the computing assembly 1000 in the horizontal plane, and the projection of the second section of the longitudinal beam in the horizontal plane is outside the range of the projection of the computing assembly 1000 in the horizontal plane, that is, the second section as a whole is located on the outside of the computing assembly 1000 in the second direction L2, so that the first liquid supply sub-pipeline 211, the second liquid supply sub-pipeline 212 and the first liquid return section 221 supported by the second section are all located on the outside of the computing assembly 1000 in the second direction L2, which facilitates the connection between the liquid inlet distribution pipeline 150, the liquid return distribution pipeline 140 and the first pipeline group 20 of the computing assembly 1000, while allowing the first pipeline group 20 to completely avoid the top of the computing assembly 1000, avoiding the impact on the computing assembly 1000 when the first pipeline group 20 leaks, thereby improving the safety of the data center.

[0158] There may be multiple longitudinal beams, and the multiple longitudinal beams correspond to the multiple computing assemblies 1000 one by one. The longitudinal beams are located at the top of the corresponding computing assemblies 1000, that is, a longitudinal beam extending along the second direction L2 is arranged at the top of each computing assembly 1000, and correspondingly, the cross beams connect the multiple computing assemblies 1000. On the one hand, the load distribution on the longitudinal beams is optimized to avoid local stress concentration, improve the structural stability and strength of the top frame 300, and ensure stable support for the first pipeline group 20; on the other hand, the top of each computing assembly 1000 is limited by the longitudinal beams and cross beams, so as to improve the stability of the top connection of the multiple computing assemblies 1000.

[0159] In some examples, the shape and size of the box 700 can be set accordingly with reference to a standard container of 40 feet, and the overall dimensions are 12.192m*2.438m*2.438m. Thus, after the skid structure formed by integrating the power distribution cabinet 600, multiple computing assemblies 1000, and cooling equipment 200 on the support platform 400 is deployed in the accommodation cavity of the box 700, the data center can be directly packaged and transported by sea or land transportation or other means, and no secondary assembly is required after the transportation is completed, thereby improving the convenience of transportation and delivery.

[0160] The above is only a specific example and does not constitute a limitation of the present application. It will be appreciated by those skilled in the art that the shape and size of the box 700 can be arbitrarily set according to actual conditions. For ease of transportation, the shape and size of the box 700 can be set accordingly with reference to a standard container, for example, the same shape and size as a standard container of 20 feet, 40 feet or 45 feet can be adopted, but it is not limited thereto.

[0161] The shape and size of the box 700 may also have other different designs. For example, a compact design may be adopted to make the internal shape and internal size of the box 700 close to the shape and size of the skid structure, etc., to reduce the redundant space and prevent the skid structure from moving inside the box 700; or, a redundant space design may be adopted to reserve a certain buffer space around the inside of the box 700 to facilitate the placement of fillers or buffer materials to provide additional protection. This is only an example, and the shape and size of the box 700 are not limited to the above examples.

[0162] In the description of this specification, it should be understood that the terms "length", "up", "down", "front", "back", "left", "right", "vertical", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0163] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0164] In this application, unless otherwise clearly specified and limited, the terms "connected" and "connection" can refer to electrical connection or communication; can refer to direct connection or indirect connection through an intermediate medium; can refer to the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0165] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0166] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0167] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A support platform for a data center, characterized in that: include: A frame structure, comprising a plurality of first support beams extending along a first direction and a plurality of second support beams extending along a second direction, wherein a plurality of the second support beams are connected between two adjacent first support beams; A support plate is connected to the top of the frame structure, and the upper surface of the support plate defines a bearing surface, which is used to bear at least one of the computing assembly, the power distribution cabinet and the cooling equipment of the data center.

2. The support platform according to claim 1, characterized in that: At least part of the second support beams are staggered in the second direction.

3. The support platform according to claim 1, characterized in that: The support plate includes a plurality of plate bodies which are spliced ​​and arranged with each other, and each of the plate bodies is connected to the frame structure through a corresponding fastener.

4. The support platform according to claim 3, characterized in that: A gap is defined between two adjacent plate bodies, and the gap is used to guide the liquid on the bearing surface to the lower side of the support plate.

5. The support platform according to claim 4, characterized in that: The width of the gap is 0.5 to 2 mm.

6. The support platform according to claim 3, characterized in that: A plurality of convex structures distributed at intervals are formed on the upper surface of the plate body.

7. The support platform according to claim 6, characterized in that: The plurality of protrusion structures include a plurality of first protrusions and a plurality of second protrusions, the first protrusions intersect with the second protrusions in an extension direction of a horizontal plane, and the first protrusions and the second protrusions are alternately distributed in the second direction.

8. The support platform according to claim 3, characterized in that: The thickness of the plate is 2-4 mm.

9. The support platform according to claim 1, characterized in that: The frame structure has a first area and a second area arranged in the first direction, the support plate covers the first area, and the support plate is used to support the power distribution cabinet and the plurality of computing assemblies; The support platform also includes a frame, which is arranged in the second area and extends upward from the second area. The interior of the frame is used to accommodate a liquid storage module of a cooling device, and the upper part of the frame is used to support a heat exchange module of the cooling device.

10. The support platform according to claim 9, characterized in that: A size of the first region in the first direction is greater than a size of the second region in the first direction.

11. The support platform according to claim 9, characterized in that: The cooling device comprises a first pipeline group and a second pipeline group, the first pipeline group is connected to the first heat exchange flow path of the heat exchange module, and the second pipeline group is connected to the second heat exchange flow path of the heat exchange module; Among them, the second area includes three sub-areas arranged in the second direction; the orthographic projection of the frame in the horizontal plane is located in the middle sub-area, and the bottom end of the frame is connected to the middle sub-area; at least part of the pipe sections of the first pipeline group and the orthographic projection of the second pipeline group in the horizontal plane are respectively located in the two sub-areas on both sides.

12. The support platform according to claim 1, characterized in that: Also includes: Two third support beams, respectively connected to opposite sides of the frame structure in the second direction, and both extending along the first direction; The support plate covers the two third support beams and the top of the frame structure, and the support plate has two vertical portions extending downward on opposite sides of the second direction, and the two vertical portions are respectively located on opposite sides of the two third support beams in the second direction.

13. The support platform according to claim 12, characterized in that: It also includes a plurality of footings, wherein the plurality of footings are arranged at intervals along the first direction and are disposed on the third support beam; The foot comprises a base and a screw rod connected to the base and extending vertically through the bottom wall of the third support beam, wherein the screw rod is used to cooperate with a nut to level the support platform.

14. The support platform according to claim 12, characterized in that: The vertical cross-sections of the first support beam, the second support beam, and the third support beam are all I-shaped or rectangular.

15. A container, characterized in that: include: The box body defines a receiving cavity inside, and the receiving cavity is used to receive the supporting platform according to any one of claims 1 to 14.

16. The container according to claim 15, characterized in that: The box body comprises a frame, and the frame is protruded upward on one side of the bottom of the box body in the second direction; The support platform is spaced apart from the frame at one side adjacent to the frame in the second direction to form a groove for draining liquid.

17. The container according to claim 16, characterized in that: The frame is formed with a plurality of drainage holes, and the plurality of drainage holes are distributed at intervals in the first direction.

18. A data center, characterized in that: include: The support platform according to any one of claims 1 to 14 and the container according to any one of claims 15 to 17; A power distribution cabinet and a plurality of computing assemblies, wherein the power distribution cabinet and the plurality of computing assemblies are arranged in sequence along a first direction and supported on a support plate of the support platform; the computing assembly comprises a cabinet and a plurality of computing devices, wherein the plurality of computing devices are arranged vertically inside the cabinet.

19. The data center according to claim 18, characterized in that: Also includes: A cooling device is arranged in the second area of ​​the support platform, and is used to cool the computing devices of the plurality of computing assemblies.

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