Multi-segment evaporation chamber

Abstract

The invention relates to a multi-section evaporation chamber. Systems, apparatus, articles, and methods related to a multi-segment evaporation chamber for an electronic device are disclosed. An example evaporation chamber includes a first panel, a second panel, and a wall extending between the first panel and the second panel to divide the evaporation chamber into a first section and a second section between the first panel and the second panel, the wall including a thermal insulator.

Description

Technical Field

[0001] The present disclosure relates generally to thermal solutions for electronic devices and, more particularly, to multi-zone evaporation chambers. Background Art

[0002] Electronic devices use thermal solutions to dissipate heat from heat-generating components. Multiple heat-generating components are often thermally coupled to a single thermal solution. Summary of the invention

[0003] According to an embodiment of the present disclosure, an evaporation chamber for an electronic device is provided, the evaporation chamber comprising: a first panel; a second panel; and a wall extending between the first panel and the second panel, for dividing the evaporation chamber into a first section and a second section between the first panel and the second panel, the wall comprising an insulator.

[0004] According to an embodiment of the present disclosure, there is provided an apparatus including: a first evaporation chamber; a second evaporation chamber; and an insulating fence coupling the first evaporation chamber to the second evaporation chamber.

[0005] According to an embodiment of the present disclosure, an electronic device is provided, comprising: a first heat-generating component; a second heat-generating component; and a multi-segment evaporation chamber, the multi-segment evaporation chamber comprising: a first segment coupled to the first heat-generating component; a second segment coupled to the second heat-generating component; and an insulating wall separating the first segment and the second segment. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a cross-sectional view of a portion of an example electronic device having an example multi-zone evaporation chamber.

[0007] Figure 2 yes Figure 1 A heat map of an example electronic device.

[0008] Figure 3 It can be used to implement Figure 1 Example of a multi-zone evaporation chamber. Illustration of a multi-zone evaporation chamber.

[0009] Figure 4 It can be used to implement Figure 1 Another example of a multi-zone evaporation chamber. Illustration of a multi-zone evaporation chamber.

[0010] Figure 5 is a perspective view of a portion of an example electronic device having an example fence between example evaporation chambers.

[0011] Figure 6 yes Figure 5 Top view of this part of the electronic device.

[0012] Figure 7 yes Figure 5 An exploded view of this portion of the electronic device.

[0013] Figure 8 It is along Figure 6 The AA line is obtained Figure 5 A cross section of this portion of the electronic device.

[0014] Fig. 9 yes Figure 5 Magnified view of the enclosed area B.

[0015] Fig.10 Shown by Figure 5 Example airflow for this portion of an electronic device.

[0016] Fig.11 yes Fig.10 Magnified view of the enclosed area C.

[0017] Fig.12 It is along Fig.10 The DD line is obtained Figure 5 A cross section of this portion of the electronic device.

[0018] Fig.13 is a flow chart representing example machine readable instructions and / or example operations that may be executed, instantiated, and / or performed by an example programmable circuit to form a multi-zone evaporation chamber.

[0019] Fig.14 is a block diagram of an example processing platform including programmable circuitry configured to execute, instantiate, and / or perform Fig.13 Example machine readable instructions and / or execution Fig.13 Example operation of .

[0020] In general, the same reference numerals will be used throughout the various drawings and the accompanying written description to refer to the same or similar components. The drawings are not necessarily to scale. Instead, the thickness of a layer or region may be exaggerated in the drawings. Although the drawings show layers and regions with clear lines and boundaries, some or all of these lines and / or boundaries may be idealized. In reality, boundaries and / or lines may be imperceptible, blended, and / or irregular. DETAILED DESCRIPTION

[0021] Electronic devices, such as laptop computers, include printed circuit boards (PCBs) that are loaded with multiple heat generating components, such as integrated circuits (ICs), central processing units (CPUs), memory, graphics processing units (GPUs), vision processing units (VPUs), voltage regulators (VRs), solid state drives (SSDs), etc. In some example electronic devices, these heat generating components are adjacent to each other. In some examples, these heat generating components emit different amounts of heat and have different temperature limits before their performance is affected.

[0022] In some electronic devices, many heat generating components are coupled to a single thermal solution. This is done to minimize board holes, reduce the number of parts, and simplify assembly and installation of components of the electronic device. The thermal solution may include, for example, an evaporation chamber, a heat sink, a heat spreader, a heat pipe, and / or a fan, among others.

[0023] When heat generating components are located very close to each other, there may be thermal crosstalk between the heat generating components. That is, when heat is diffused through a thermal solution, heat from one heat generating component may heat another heat generating component. This can cause components with lower temperature threshold limits to reach temperature limits faster and affect or reduce system performance. For example, consider a PCB including a graphics double data rate (GDDR) memory close to a GPU. In this example, the GDDR and the GPU are coupled through a vapor chamber (VC) as a thermal solution to dissipate the heat generated by the GDDR and the GPU. The GDDR may have a temperature limit of 80 degrees Celsius (°C), exceeding which the performance of the GDDR will degrade. The heat emitted from the GPU through the VC may cause the GDDR to exceed the GDDR temperature limit and, for example, reach 100°C. When the temperature limit is exceeded, the GDDR will operate under a stress workload. In order to reduce the temperature so that the GDDR can operate at or below the 80°C temperature limit, the GPU power may be throttled, which may cause the performance of the GPU to degrade. In another example, a voltage regulator (VR) with a temperature limit of 120°C that shares a thermal solution with a CPU may need to operate at a lower power level to cool the VC (eg, to 90°C) so that the CPU does not exceed its temperature limit.

[0024] The examples disclosed herein include thermal solutions that can bring better system performance compared to the traditional design where multiple heat generating components are coupled to a single undivided evaporation chamber. The examples disclosed herein include an evaporation chamber having multiple sections separated by insulating materials, which can be implemented as a network of walls. In some examples, each of the multiple sections of the evaporation chamber may contain different types of wick structures and / or different working fluids. In some examples, different sections of the evaporation chamber may provide different thermal cooling capacities or capabilities for different groups of heat generating components on a PCB based on the respective temperature limits of the heat generating components. In some examples, different wick structures and liquids allow high performance wicks and liquids to be reserved for areas with high power dissipation and lower temperature limits (e.g., at the CPU), rather than for the entire thermal solution. In addition, in some examples, the vacuum levels in different sections of the evaporation chamber may be set differently according to the properties of the working liquid. The differentiation and specialization of the wick structure, working fluid and / or vacuum level allow the cost and / or structural optimization of the evaporation chamber.

[0025] In some examples, a network of insulating materials or a network of insulators is designed and implemented to create diffusion areas to match or supplement the temperature limits and power consumption of different heat generating components. The diffusion area is the area where the heat from the heat generating components dissipates across the evaporation chamber. In some examples, the insulator network is made of plastic material and is designed to create enough area to provide cooling for different sources while reducing thermal crosstalk and temperature effects between adjacent diffusion areas of adjacent sections of the evaporation chamber. In some examples, the insulator network lines extend to the edge of the evaporation chamber to isolate different diffusion areas.

[0026] In some examples disclosed herein, the evaporation chamber has a single configuration, with a top panel and a bottom panel, wherein a frame (e.g., an insulating mesh) is provided to provide a multi-segment evaporation chamber. The single configuration simplifies the assembly and installation of the evaporation chamber in an electronic device. In addition, the single configuration of the evaporation chamber has less impact on the board space of the PCB, because no additional holes are required to mount the complex structure to the PCB.

[0027] Figure 1 1 is a cross-sectional view of a portion of an example electronic device 100 having an example multi-segment evaporation chamber 102. The evaporation chamber 102 includes an example perimeter wall 104. The perimeter wall 104 includes an example first or top panel 106, an example second or bottom panel 108, and an example first side panel 110, and an example second side panel 112. The perimeter wall 104 wraps around or surrounds an example first evaporation chamber segment 114 and an example second evaporation chamber segment 116. The first evaporation chamber segment 114 and the second evaporation chamber segment 116 are separated by an example wall 118 enclosed within the perimeter wall 104. The perimeter wall 104 creates an integral structure containing the multi-segment evaporation chamber 102.

[0028] In the illustrated example, the wall 118 is an insulator. Thus, the wall 118 may be referred to as an insulating wall or thermal insulation law. In some examples, the wall 118 comprises plastic. In some examples, the wall 118 comprises an evacuated tube or vacuum tube. In some examples, the wall 118 is part of a network of walls that form an insulation network that divides the multi-segment evaporation chamber 102 into multiple segments.

[0029] In some examples, the dimensions of the multi-segment evaporation chamber 102 are 100 millimeters (mm) x 200 mm x 1 mm. In some examples, the thickness of the perimeter wall 104 is 0.1 mm. In some examples, the perimeter wall 104 includes a metal, such as pure copper. In some examples, the width of the wall 118 is 7 mm. In other examples, other values ​​and / or materials may be used for these components.

[0030] The first evaporation chamber section 114 includes an example first wicking structure, and the second evaporation chamber section 116 includes an example second wicking structure. The wicking structure includes, for example, a grid, a sintered powder, a groove, a capillary, and / or a fiber, etc. In some examples, the first wicking structure and the second wicking structure are the same type of wicking structure, while in other examples, the second wicking structure is different from the first wicking structure. In some examples, the first wicking structure and / or the second wicking structure includes a wicking structure with a power of 15 kW / m2 Kelvin (kW / m 2 K) Modeled core material.

[0031] In some examples, the first evaporation chamber section 114 includes an example first working fluid, and the second evaporation chamber section 116 includes an example second working fluid. The working fluids include, for example, water, methanol, propylene glycol, and different combinations thereof. In some examples, the first working fluid and the second working fluid are the same type of working fluid, while in other examples, the second working fluid is different from the first working fluid.

[0032] The multi-segment evaporation chamber 102 is coupled to an example first heat source or component 120 and an example second heat source or component 122. In some examples, the multi-segment evaporation chamber 102 is coupled to the example first heat generating component 120 and the second heat generating component 122 via respective example bases 126. In some examples, the bases include metal, such as copper. In some examples, the thickness of the bases is 0.5 mm. The first heat generating component 120 and the second heat generating component 122 are mounted to an example PCB 128.

[0033] The first heating component 120 and the second heating component 122 consume different amounts of power, generate different amounts of heat, and have different temperature threshold limits. For example, the first heating component 120 can operate at a temperature limit of 115°C at 25 watts (W). In this example, the second heating component 122 can operate at a temperature limit of 105°C at 5W. The wall 118 thermally separates or isolates the first evaporation chamber section 114 and the second evaporation chamber section 116. The first heating component 120 is thermally coupled to the first evaporation chamber section 114, and the second heating component 122 is thermally coupled to the second evaporation chamber section 116. Thus, the wall 118 also thermally separates or isolates the first heating component 120 and the second heating component 122.

[0034] Figure 2 yes Figure 1 2 is an example thermal map 200 of a portion of an electronic device 100 with a multi-segment evaporation chamber 102. The thermal map 200 shows that the first evaporation chamber segment 114 creates an example first diffusion region 202 through which heat from the first heat generating component 120 is dissipated. The second evaporation chamber segment 116 creates an example second diffusion region 204 through which heat from the second heat generating component 122 is dissipated. Continuing with the above example, the temperature in the first diffusion region 202 is 112°C, which is lower than the temperature limit of 115°C for the first heat generating component 120. In this example, the temperature in the second diffusion region 204 is 102°C, which is lower than the temperature limit of 105°C for the second heat generating component 122. In this example, the temperature in the boundary region 206 is approximately 105-106°C. The boundary region 206 corresponds to the location of the wall 118 in the multi-segment evaporation chamber 102.

[0035] The wall 118 prevents, inhibits or hinders the thermal crosstalk or heat exchange between the first heating component 120 and the second heating component 122. In other words, the wall 118 prevents the heat from the first heating component 120 from overheating the second heating component 122 and causes the second heating component 122 to exceed its temperature limit. In a conventional evaporation chamber, if there is no wall 118, the heat generated by the heating component will cause heat penetration on the evaporation chamber, which will result in a common temperature between the evaporation chamber and the heating component. In these conventional designs, if the common temperature is higher than the temperature limit of one of the heating components, the risk of failure of such heating components will be increased. In the example disclosed herein, the multi-segment evaporation chamber 102 maintains the first heating component 120 and the second heating component 122 within its temperature limit. Although heat conduction occurs through metal, even if the perimeter wall 104 is constructed of metal, the multi-segment evaporation chamber 102 still achieves this thermal separation.

[0036] Figure 3 It can be used to implement Figure 1 An example of a multi-zone evaporation chamber 102 is shown in FIG. 1 , and FIG. 2 is an illustration of a portion of a multi-zone evaporation chamber 300 . Figure 1 The multi-zone evaporation chamber 102 includes a wall 118 that is linear. Figure 3 The multi-zone evaporation chamber 300 includes an example wall mesh 302, which divides the multi-zone evaporation chamber 300 into a plurality of zones. Figure 3 In the example of the embodiment, the wall mesh 302 divides the multi-segment evaporation chamber 300 into an example first evaporation chamber segment 304, an example second evaporation chamber segment 306, and an example third evaporation chamber segment 308. The wall mesh 302 includes an arcuate wall and / or a combination of an arcuate wall and a straight wall. The wall mesh 302 can divide the multi-segment evaporation chamber 300 into a plurality of segments having different surface areas, different shapes, and / or different sizes. In the illustrated example, the wall mesh 302 includes two walls, while in other examples, there may be other numbers of walls, such as three, four, five, and so on. The position, shape, and length of the walls of the wall mesh 302 (thus, the respective sizes of the first evaporation chamber segment 304, the second evaporation chamber segment 306, and the third evaporation chamber segment 308) are based on the operating parameters and temperature limits of the heat generating components that are thermally coupled to or to be thermally coupled to the respective first evaporation chamber segments 304, the second evaporation chamber segments 306, and / or the third evaporation chamber segments 308.

[0037] Different ones of the first evaporation chamber section 304, the second evaporation chamber section 306, and / or the third evaporation chamber section 308 may include different types or amounts of wicking structures, different types or amounts of working fluids, and / or different vacuum parameters to provide different cooling capabilities for each of the first evaporation chamber section 304, the second evaporation chamber section 306, and / or the third evaporation chamber section 308. For example, the first evaporation chamber section 302 may include a first wicking structure and a first working fluid. In this example, the second evaporation chamber section 304 may include a first wicking structure or a second wicking structure, no working fluid (i.e., a dry wicking structure), and is in a vacuum state. In addition, in this example, the third evaporation chamber section 306 may be a solid metal (e.g., copper) and may not include a wicking structure or a working fluid. In some examples, the first evaporation chamber section 304 provides increased heat diffusion relative to the second evaporation chamber section 306 and the third evaporation chamber section 308. In some examples, the first evaporation chamber section 304 may be suitable for heat-generating components such as a CPU or a GPU. In some examples, the second evaporation chamber section 306 can provide heat spreading and perform a thermal insulation function. In some examples, the third evaporation chamber section 308 also provides heat spreading while also enhancing structural support.

[0038] Figure 4 It can be used to implement Figure 1 Another example of a multi-zone evaporation chamber 400 is shown in FIG. Figure 3Similar to the multi-segment evaporation chamber 300, the multi-segment evaporation chamber 400 includes an example wall mesh 402, which divides the multi-segment evaporation chamber 400 into a plurality of segments. Figure 4 In the example of , the wall mesh 402 divides the multi-segment evaporation chamber 400 into an example first evaporation chamber segment 404, an example second evaporation chamber segment 406, and an example third evaporation chamber segment 408. The wall mesh 402 divides the multi-segment evaporation chamber 400 into a plurality of segments having different surface areas, different shapes, and / or different sizes. In the illustrated example, the wall mesh 402 includes three walls, while in other examples, there may be other numbers of walls, such as two, four, five, and so on. The position, shape, and length of the walls of the wall mesh 402, and thus, the respective sizes of the first evaporation chamber segment 404, the second evaporation chamber segment 406, and the third evaporation chamber segment 408, are based on the operating parameters and temperature limits of the heat generating components that are thermally coupled to or to be thermally coupled to the respective first evaporation chamber segment 404, the second evaporation chamber segment 406, and / or the third evaporation chamber segment 408.

[0039] exist Figure 4 In an example of, the wall mesh 402 may include walls made of plastic, walls that are evacuated or vacuum plastic tubes, and / or walls made of metal (e.g., thin copper walls), which are spaced a certain distance apart so that there are gaps 410 between the walls, with nothing in between. The gaps 410 between the walls 402 may be in a vacuum state. The wall mesh 402 thermally separates the first evaporation chamber section 404, the second evaporation chamber section 406, and the third evaporation chamber section 408. The thickness of the walls in the wall mesh 402 and / or the width of the gaps 410 may be based on the operating power consumption and temperature limits of the heat generating components coupled to or to be coupled to each of the first evaporation chamber section 404, the second evaporation chamber section 406, and / or the third evaporation chamber section 408.

[0040] Different ones of the first evaporation chamber section 404, the second evaporation chamber section 406, and / or the third evaporation chamber section 408 may include different types or amounts of wicking structures, different types or amounts of working fluids, and / or different vacuum parameters to provide different cooling capabilities for each of the first evaporation chamber section 404, the second evaporation chamber section 406, and / or the third evaporation chamber section 408. For example, the first evaporation chamber section 402 may include a first wicking structure and a first working fluid. In this example, the second evaporation chamber section 404 may include a second structure and a second working fluid. In this example, the third evaporation chamber section 406 may include a third wicking structure and a third working fluid.

[0041] The multi-segment evaporation chamber 400 also includes an example suction point 412 for each of the first evaporation chamber segment 404, the second evaporation chamber segment 406, and / or the third evaporation chamber segment 408. The suction point 412 is used to control the working fluid in each of the first evaporation chamber segment 404, the second evaporation chamber segment 406, and / or the third evaporation chamber segment 408. The suction point 412 allows the working fluid to be added or removed, thereby allowing different filling ratios and different partial pressures. The filling ratio is the volume ratio of the working fluid to the entire internal space of the evaporation chamber (including the void space of any wicking structure). The partial pressure can also be used to control the phase transition of the working fluid based on the heat source of each evaporation chamber segment. Through the suction point 412, the filling ratio can be changed to adjust the thermal resistance of each evaporation chamber segment.

[0042] Figure 5 is a perspective view of a portion of an example electronic device 500. Figure 6 yes Figure 5 A top view of this part of the electronic device, Figure 7 yes Figure 5 an exploded view of the portion of the electronic device, and Figure 8 It is along Figure 6 The AA line is obtained Figure 5 A cross section of this portion of the electronic device. Figure 5 The portion of the electronic device 500 shown is a thermal solution that includes an example first fan 502, an example second fan 504, and an example evaporation chamber cluster that forms an example multi-segment evaporation chamber 506. In the illustrated example, the multi-segment evaporation chamber 506 includes an example first evaporation chamber that forms an example first evaporation chamber segment 508, an example second evaporation chamber that forms an example second evaporation chamber segment 510, and an example third evaporation chamber that forms an example third evaporation chamber segment 512. In other examples, the multi-segment evaporation chamber 506 may include other numbers of evaporation chambers that form evaporation chamber segments, such as two, four, five, etc. In some examples, one or more of the first evaporation chamber segment 508, the second evaporation chamber segment 510, and the third evaporation chamber segment 512 may themselves be multi-segment evaporation chambers, such as one of the multi-segment evaporation chambers 102, 300, 400 disclosed above.

[0043] like Figure 5-Figure 8 As shown, the first evaporation chamber section 508, the second evaporation chamber section 510, and the third evaporation chamber section 512 have different shapes, surface areas, thicknesses, wicking structures, working fluids, and / or vacuum parameters. Different thicknesses may result in different heights of the heat generating components coupled to or to be coupled to each of the first evaporation chamber section 508, the second evaporation chamber section 510, and / or the third evaporation chamber section 512.

[0044] In some examples, the first evaporation chamber section 508 has a thickness of about 2.5 mm and is used to cool heat generating components such as video RAM (VRAM). In some examples, the second evaporation chamber section 510 has a thickness of about 1.5 mm and is used to cool heat generating components such as CPU, GPU, etc. In some examples, the third evaporation chamber section 512 has a thickness of about 1.2 mm and is used to cool heat generating components such as inductors, metal-oxide-semiconductor field-effect transistors (MOSFETs), etc. In this example, the thickness of the first evaporation chamber section 508 is greater than the thickness of the second evaporation chamber section 510 because the surface area of ​​the first evaporation chamber section 508 is smaller than the surface area of ​​the second evaporation chamber section 510. Thus, there is a greater maximum power (e.g., the maximum power of the VRAM) on a smaller area of ​​the first evaporation chamber section 508 compared to the large surface area of ​​the second evaporation chamber section 510.

[0045] The multi-segment evaporation chamber 506 includes an example first insulating fence 514 coupling the first evaporation chamber segment 508 and the second evaporation chamber segment 510. The multi-segment evaporation chamber 506 also includes an example second insulating fence 516 coupling the second evaporation chamber segment 510 and the third evaporation chamber segment 512. The first insulating fence 514 and the second insulating fence 516 thermally separate or isolate the first evaporation chamber segment 508, the second evaporation chamber segment 510, and the third evaporation chamber segment 512 to reduce, prevent, inhibit and / or hinder heat penetration or crosstalk between them. In some examples, the first insulating fence 514 and the second insulating fence 516 are created by insert molding on the sealing surface of each of the first evaporation chamber segment 508, the second evaporation chamber segment 510, and / or the third evaporation chamber segment 512.

[0046] The sealing surface is positioned upward or downward so that the overall thickness of the multi-segment evaporation chamber 506 is not increased. Figure 8 As shown, the example first sealing surface 802 of the first evaporation chamber segment 508 faces downward. In this example, the example second sealing surface 804 of the second evaporation chamber segment 510 also faces downward. In addition, in this example, the example third sealing surface 806 of the third evaporation chamber segment 512 faces upward.

[0047] The modularity of the multi-segment evaporation chamber 506 is flexible based on insert-molded insulating fences (first insulating fence 514 and second insulating fence 516) and evaporation chamber clusters (forming first evaporation chamber segment 508, second evaporation chamber segment 510, and third evaporation chamber segment 512). Different combinations of fences and / or evaporation chamber segments can be combined based on the power consumption and temperature limits of the heat-generating components.

[0048] In addition, the thermal solution of the electronic device 500 may be enhanced by perforating the first thermal insulation fence 514 and / or the second thermal insulation fence 516. Fig. 9 (This picture is Figure 5 As shown in FIG. 1 (a magnified view of the enclosed area B of FIG. 1 ), the second insulation fence includes a plurality of apertures 902. The apertures 902 act as air ducts and allow air from the first fan 502 and / or the second fan 504 to flow above and below the third evaporation chamber section 512. In some example systems such as high air pressure designs, flow impedance within the electronic device can affect skin temperature. Increasing flow impedance can increase skin temperature. The apertures 902 reduce flow impedance, thereby improving (e.g., reducing) skin temperature.

[0049] The airflow through the electronic device 500 is Figure 10-12 Shown in. Fig.10 Shown by Figure 5 1002 represents the airflow over the top of the multi-segment evaporation chamber 506. Arrow 1004 represents the airflow through the bottom of the multi-segment evaporation chamber 506. Fig.11 As shown, the figure is Fig.10 , the airflow (arrow 1004) passing through the bottom of the multi-segment evaporation chamber 506 flows through the second insulation fence 516 and flows out from the aperture 902 above the third evaporation chamber segment 512. In this example, the third evaporation chamber segment 512 is thinned (e.g., 1.2 mm) to further reduce the flow impedance. In addition, in some examples, the third evaporation chamber segment 512 is at a different height from the second evaporation chamber segment 510 to further reduce the flow impedance. In other words, the third evaporation chamber segment 512 is at a first height, and the second evaporation chamber segment 510 is at a second height, which is different from the first height.

[0050] Fig.12 It is along Fig.10 The DD line is obtained Figure 5 The airflow (arrow 1004) passing through the bottom of the multi-segment evaporation chamber 506 flows between the multi-segment evaporation chamber 506 and the PCB 128, over the heat generating component 122 (e.g., CPU), and through the aperture 902. Thus, the airflow can flow between the layers of the electronic device 500 to help effectively cool the electronic device 500.

[0051] Fig.131300 is a flow chart representing example operations that may be performed and / or executed to form a multi-zone evaporation chamber, such as one or more of the multi-zone evaporation chambers 102, 300, 400 disclosed herein. In some examples, the example operations 1300 include example machine-readable instructions that may be executed, instantiated, and / or executed by example programmable circuits, such as those described below. Fig.14 The example processor circuit 1412 shown in the example processor platform 1400 discussed above performs, instantiates, and / or performs the operations 1300. In other words, in some examples, the processor circuit 1412 performs the operations 1300 by executing machine-readable instructions, thereby causing one or more actuators, robots, and / or other devices to implement the operations 1300. In some examples, the machine-readable instructions cause the operations, tasks, and / or the like to be performed and / or executed in an automated manner in the real world. As used herein, "automated" means without human involvement.

[0052] Example operation 1300 may be embodied as instructions (e.g., software and / or firmware) stored on one or more non-transitory computer-readable and / or machine-readable storage media, such as cache memory, magnetic storage devices or disks (e.g., floppy disks, hard disk drives (HDD), etc.), optical storage devices or disks (e.g., Blu-ray disks, compact disks (CD), digital versatile disks (DVD), etc.), redundant arrays of independent disks (RAID), registers, ROM, solid-state drives (SSD), SSD memory, non-volatile memory (e.g., electrically erasable programmable read-only memory (EEPROM), flash memory, etc.), volatile memory (e.g., any type of random access memory (RAM), etc.), and / or any other storage device or storage disk. The instructions of the non-transitory computer-readable and / or machine-readable medium may be programmed and / or executed by programmable circuits located in one or more hardware devices, but the entire program and / or portions thereof may also be executed and / or instantiated by one or more hardware devices other than programmable circuits, and / or embodied in dedicated hardware. The machine-readable instructions may be distributed across multiple hardware devices and / or executed by two or more hardware devices (e.g., a server and a client hardware device). For example, a client hardware device may be implemented by an endpoint client hardware device (e.g., a hardware device associated with a human and / or machine user) or an intermediate client hardware device gateway (e.g., a radio access network (RAN)) that facilitates communication between a server and an endpoint client hardware device. Similarly, a non-transitory computer-readable storage medium may include one or more media. In addition, although reference is made to Fig.13The flowcharts shown in the foregoing are used to describe the example procedures, but many other methods of forming one or more of the multi-zone evaporation chambers 102, 300, 400 may alternatively be used. For example, the order of execution of the blocks of the (one or more) flowcharts may be changed, and / or some of the described blocks may be changed, eliminated, or combined. Additionally or alternatively, any or all of the blocks of the flowcharts may be implemented by one or more hardware circuits (e.g., processor circuits, discrete and / or integrated analog and / or digital circuits, FPGAs, application specific circuits (ASICs), comparators, operational amplifiers (op-amps), logic circuits, etc.) that are constructed to perform the corresponding operations without executing software or firmware. The programmable circuits may be distributed in different network locations and / or local to one or more hardware devices (e.g., single-core processors (e.g., single-core CPUs), multi-core processors (e.g., multi-core CPUs, XPUs, etc.)). For example, the programmable circuit may be a CPU and / or FPGA located in the same package (e.g., the same integrated circuit (IC) package or two or more separate housings), one or more processors in a single machine, multiple processors distributed across multiple servers in a server rack, multiple processors distributed across one or more server racks, etc., and / or any combination (one or more) of these.

[0053] The machine-readable instructions described herein may be stored in one or more of a compressed format, an encrypted format, a segmented format, a compiled format, an executable format, a packaged format, and the like. The machine-readable instructions as described herein may be stored as data (e.g., computer-readable data, machine-readable data, one or more bits (e.g., one or more computer-readable bits, one or more machine-readable bits, and the like), a bitstream (e.g., a computer-readable bitstream, a machine-readable bitstream, and the like), and the like) or a data structure (e.g., as part(s) of instructions, code, code representation, and the like) that may be utilized to create, manufacture, and / or generate machine-executable instructions. For example, the machine-readable instructions may be segmented and stored on one or more storage devices, disks, and / or computing devices (e.g., servers) located at the same or different locations of a network or collection of networks (e.g., in the cloud, in an edge device, and the like). The machine-readable instructions may require one or more of installation, modification, adaptation, updating, combination, supplementation, configuration, decryption, decompression, unpacking, distribution, reassignment, compilation, and the like, so that they may be directly readable, interpretable, and / or executable by a computing device and / or other machine. For example, machine-readable instructions may be stored as multiple parts that are individually compressed, encrypted, and / or stored on separate computing devices, where the parts, when decrypted, decompressed, and / or combined, form a set of computer-executable and / or machine-executable instructions that implement one or more functions and / or operations that may together form a program, such as that described herein.

[0054] In another example, machine-readable instructions may be stored in a state in which they can be read by programmable circuitry, but require the addition of a library (e.g., a dynamic link library (DLL)), a software development kit (SDK), an application programming interface (API), etc., in order to execute the machine-readable instructions on a particular computing device or other device. In another example, the machine-readable instructions and / or corresponding program(s) may need to be configured (e.g., to store settings, input data, record network addresses, etc.) before the machine-readable instructions and / or corresponding program(s) can be executed in whole or in part. Thus, as used herein, a machine-readable, computer-readable, and / or machine-readable medium may include instructions and / or program(s) regardless of the specific format or state of the machine-readable instructions and / or program(s).

[0055] The machine-readable instructions described herein may be represented by any past, current, or future instruction language, scripting language, programming language, etc. For example, the machine-readable instructions may be represented by any of the following languages: C, C++, Java, C#, Perl, Python, JavaScript, Hypertext Markup Language (HTML), Structured Query Language (SQL), Swift, etc.

[0056] As mentioned above, Fig.13 The example operations of can be implemented using executable instructions (e.g., computer-readable and / or machine-readable instructions) stored on one or more non-transient computer-readable and / or machine-readable media. As used herein, the terms non-transient computer-readable medium, non-transient computer-readable storage medium, non-transient machine-readable medium, and / or non-transient machine-readable storage medium are explicitly defined to include any type of computer-readable storage device and / or storage disk, and exclude propagation signals and exclude transmission media. Examples of such non-transient computer-readable media, non-transient computer-readable storage media, non-transient machine-readable media, and / or non-transient machine-readable storage media include optical storage devices, magnetic storage devices, HDDs, flash memory, read-only memory (ROM), CDs, DVDs, caches, any type of RAM, registers, and / or any other storage device or storage disk in which information can be stored for any duration (e.g., storage for a longer period of time, permanent storage, short-term storage, for temporary buffering, and / or for caching of information). As used herein, the terms "non-transitory computer-readable storage device" and "non-transitory machine-readable storage device" are defined to include any physical (mechanical, magnetic, and / or electrical) hardware that retains information over a period of time, but excludes propagating signals and excludes transmission media. Examples of non-transitory computer-readable storage devices and / or non-transitory machine-readable storage devices include any type of random access memory, any type of read-only memory, solid-state memory, flash memory, optical disks, magnetic disks, disk drives, and / or redundant arrays of independent disks (RAID) systems. As used herein, the term "device" refers to a physical structure, such as a mechanical and / or electrical device, hardware, and / or circuit, which may or may not be configured with computer-readable instructions, machine-readable instructions, etc., and / or manufactured to execute computer-readable instructions, machine-readable instructions, etc.

[0057] "Include" and "comprising" (and all forms and tenses thereof) are used as opening terms herein. Thus, whenever a claim employs any form of "include" or "comprising" (e.g., includes, comprises, has, etc.) as a preamble or used in any type of claim recitation, it is to be understood that additional elements, terms, etc. may be present without falling outside the scope of the corresponding claim or recitation. As used herein, when the phrase "at least" is used as a transitional term, such as in the preamble of a claim, it is opening in the same manner as the terms "include" and "comprising" are opening. The term "and / or" when used, for example, in a form such as A, B, and / or C, refers to any combination or subset of A, B, and C, such as (1) A alone, (2) B alone, (3) C alone, (4) A and B, (5) A and C, (6) B and C, or (7) A and B and C. As used herein in the context of describing structures, components, items, C, and / or things, the phrase “at least one of A and B” is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used herein in the context of describing structures, components, items, objects, and / or things, the phrase “at least one of A or B” is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. As used herein in the context of describing the execution or operation of processes, instructions, acts, activities, and / or steps, the phrase “at least one of A and B” is intended to refer to implementations that include any of the following:

[0058] (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used herein in the context of describing the execution or operation of processes, instructions, actions, activities, and / or steps, the phrase "at least one of A or B" is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B.

[0059] As used herein, singular references (e.g., "a," "a," "a first," "a second," etc.) do not exclude a plurality. As used herein, the term "a" or "an" object refers to one or more of that object. The terms "a," "one or more," and "at least one" are used interchangeably herein. Furthermore, although listed separately, a plurality of means, elements, or actions may be implemented by, for example, the same entity or object. Furthermore, although individual features may be included in different examples or claims, they may be combined, and inclusion in different examples or claims does not imply that a combination of features is not feasible and / or not advantageous.

[0060] Fig.13 The example operation 1300 includes making a cavity in a substrate of an evaporation chamber (block 1302). For example, walls for vacuum isolation can be created that can have different thicknesses and gap widths. These walls can correspond to walls 118 and / or wall meshes 302, 402, for example. In some examples, making the cavity includes inserting and / or forming an evacuated or vacuumed tube in the wall of the wall mesh.

[0061] Operation 1300 also includes cleaning the segments (e.g., segments 114, 116, 304, 306, 308, 404, 406, 408) and walls (e.g., 118) and / or wall screens (e.g., 302, 402) of the evaporation chamber (e.g., 102, 300, 400) (block 1304). The segments of the evaporation chamber are formed by sintering, for example, copper powder (block 1306) and diffusion bonding to connect metal components (block 1308).

[0062] Operation 1300 includes performing a leak test (block 1310) to verify that the sections and walls are not leaking. The chamber (e.g., a section of the evaporation chamber) is evacuated (block 1312). The walls of the isolation chamber are also evacuated (block 1314). The chamber (e.g., a section of the evaporation chamber) is filled with a working fluid (block 1316). For example, the chamber is filled via the suction point 412. The walls are sealed (block 1318), and the example operation 1300 ends.

[0063] Fig.14 is a block diagram of an example programmable circuit platform 1400 that is configured to execute and / or instantiate Fig.13 The programmable circuit platform 1400 may be, for example, a server, a personal computer, a workstation, a self-learning machine (e.g., a neural network), a mobile device (e.g., a cellular phone, a smart phone, an iPad, etc.). TM tablet devices such as ), Internet appliances, or any other type of computing and / or electronic device.

[0064] The programmable circuit platform 1400 of the illustrated example includes a programmable circuit 1412. The programmable circuit 1412 of the illustrated example is hardware. For example, the programmable circuit 1412 may be implemented by one or more integrated circuits, logic circuits, FPGAs, microprocessors, CPUs, GPUs, digital signal processors (DSPs), and / or microcontrollers from any desired family or manufacturer. The programmable circuit 1412 may be implemented by one or more semiconductor-based (e.g., silicon-based) devices.

[0065] The programmable circuit 1412 of the illustrated example includes a local memory 1413 (e.g., cache, register, etc.). The programmable circuit 1412 of the illustrated example communicates with a main memory 1414, 1416 including a volatile memory 1414 and a non-volatile memory 1416 via a bus 1418. The volatile memory 1414 may be a synchronous dynamic random access memory (SDRAM), a dynamic random access memory (DRAM), Dynamic Random Access Memory (DRAM) DynamicRandom Access Memory, ) and / or any other type of RAM device. The non-volatile memory 1416 can be implemented by flash memory and / or any other desired type of memory device. Access to the main memory 1414, 1416 of the illustrated example is controlled by a memory controller 1417. In some examples, the memory controller 1417 can be implemented by one or more integrated circuits, logic circuits, microcontrollers from any desired family or manufacturer, or any other type of circuit to manage the flow of data into and out of the main memory 1414, 1416.

[0066] The programmable circuit platform 1400 of the illustrated example further includes an interface circuit 1420. The interface circuit 1420 may be implemented by hardware according to any type of interface standard, such as an Ethernet interface, a universal serial bus (USB) interface, interface, a near field communication (NFC) interface, a peripheral component interconnect (PCI) interface, and / or a peripheral component interconnect Express (PCIe) interface.

[0067] In the illustrated example, one or more input devices 1422 are connected to the interface circuit 1420. The input device(s) 1422 allow a user (e.g., a human user, a machine user, etc.) to input data and / or commands into the programmable circuit 1412. The input device(s) 1422 may be implemented by, for example, an audio sensor, a microphone, a camera (still or video), a keyboard, buttons, a mouse, a touch screen, a trackpad, a trackball, an isopoint device, and / or a voice recognition system.

[0068] One or more output devices 1424 are also connected to the interface circuit 1420 of the illustrated example. The output device(s) 1424 may be implemented, for example, by a display device (e.g., a light emitting diode (LED), an organic light emitting diode (OLED), a liquid crystal display (LCD), a cathode ray tube (CRT) display, an in-place switching (IPS) display, a touch screen, etc.), a tactile output device, a printer, and / or a speaker. The interface circuit 1420 of the illustrated example thus typically includes a graphics driver card, a graphics driver chip, and / or a graphics processor circuit, such as a GPU.

[0069] The interface circuitry 1420 of the illustrated example also includes communication devices, such as transmitters, receivers, transceivers, modems, residential gateways, wireless access points, and / or network interfaces, to facilitate data exchange with external machines (e.g., any kind of computing device) over the network 1426. Communications may be made through, for example, an Ethernet connection, a digital subscriber line (DSL) connection, a telephone line connection, a coaxial cable system, a satellite system, a super line-to-line wireless system, a line-to-line wireless system, a cellular telephone system, an optical connection, and the like.

[0070] The programmable circuit platform 1400 of the illustrated example also includes one or more mass storage disks or devices 1428 to store firmware, software and / or data. Examples of such mass storage disks or devices 1428 include magnetic storage devices (e.g., floppy disks, drives, HDDs, etc.), optical storage devices (e.g., Blu-ray disks, CDs, DVDs, etc.), RAID systems, and / or solid-state storage disks or devices (e.g., flash memory devices and / or SSDs).

[0071] can be Fig.13 The machine-readable instructions 1432 implemented by the machine-readable instructions may be stored in the mass storage device 1428, in the volatile memory 1414, in the non-volatile memory 1416, and / or on at least one removable non-transitory computer-readable storage medium such as a CD or DVD.

[0072] From the foregoing, it will be apparent that example systems, devices, apparatuses, articles, and methods for cooling electronic devices have been disclosed. The disclosed systems, devices, articles, and methods improve the efficiency of using computing devices by enabling different heat generating components to function at optimal performance and preventing system performance degradation. The disclosed systems, devices, articles, and methods are therefore directed to one or more improvements in the operation of machines such as computers or other electronic and / or mechanical devices.

[0073] The examples disclosed herein present many benefits in the design, assembly and operation of electronic devices. Isolating the heat generating components from the thermal crosstalk optimizes the thermal capacity of the evaporation chamber and the entire electronic device. The use of different types of wicks (e.g., advanced or simple) in different sections of the evaporation chamber allows for cost optimization of the evaporation chamber, because the different wick structures in different sections enable the use of less complex wick structures in some sections, rather than using complex advanced wick structures throughout the entire evaporation chamber. The thermal optimization of the evaporation chamber results in lower airflow from the fan. Lower airflow from the fan reduces noise, thereby benefiting end users from higher isoacoustic performance. In addition, some sections of the evaporation chamber may have only vacuum insulation above the thermal components to reduce the skin temperature of the electronic device. In addition, some sections of the evaporation chamber may have solid materials to achieve simple (single-phase) heat diffusion.

[0074] Unless otherwise specifically stated, descriptors such as "first," "second," "third," and the like are used herein without importing or otherwise indicating any priority, physical order, arrangement in a list, and / or meaning of being ordered in any manner, but are merely used as labels and / or arbitrary names to distinguish elements so that the disclosed examples are easily understood. In some examples, the descriptor "first" may be used to refer to an element in the detailed description, while the same element may be referred to in the claims with a different descriptor, such as "second" or "third." In this case, it should be understood that such descriptors are only used to clearly identify these elements within the context of the discussion (e.g., within the claims), otherwise these elements may, for example, share the same name in such a discussion.

[0075] As used herein, "approximately" and "about" modify the subject matter / value thereof to recognize that there may be variations in real-world applications. For example, "approximately" and "approximately" may modify a dimension that may not be exact due to manufacturing tolerances and / or other real-world imperfections that would be understood by one of ordinary skill in the art. For example, "approximately" and "about" may indicate that such a dimension may be within a tolerance range of + / - 10%, unless otherwise indicated in the following description.

[0076] As used herein, the phrase "communicating with..." - including variations thereof - encompasses direct communication and / or indirect communication through one or more intermediate components, without requiring direct physical (e.g., wired) communication and / or constant communication, but also includes selective communication at periodic intervals, scheduled intervals, non-periodic intervals and / or one-time events.

[0077] As used herein, "programmable circuitry" is defined to include (i) one or more special-purpose electrical circuits (e.g., ASICs) that are constructed to perform (one or more) specific operations and include one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors), and / or (ii) one or more general-purpose semiconductor-based electrical circuits that are programmable with instructions to perform (one or more) specific functions and / or operations and include one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors). Examples of programmable circuitry include a programmable microprocessor, such as a CPU, that can execute a first instruction to perform one or more operations and / or functions; an FPGA that can be programmed with a second instruction so that the FPGA is configured and / or constructed to instantiate one or more operations and / or functions corresponding to the first instruction; a GPU that can execute a first instruction to perform one or more operations and / or functions; a DSP that can execute a first instruction to perform one or more operations and / or functions; an XPU; a Network Processing Unit (NPU); one or more microcontrollers that can execute a first instruction to perform one or more operations and / or functions; and / or an integrated circuit, such as an ASIC. For example, an XPU may be implemented by a heterogeneous computing system that includes multiple types of programmable circuits (e.g., one or more FPGAs, one or more CPUs, one or more GPUs, one or more DSPs, one or more DSPs, etc., and / or any (one or more) combinations of these), and coordination techniques (e.g., (one or more) application programming interfaces (APIs)) that may assign (one or more) computing tasks to any one (or more) of the multiple types of programmable circuits that is best suited and available to perform the (one or more) computing tasks.

[0078] As used herein, an integrated circuit / circuitry is defined as one or more semiconductor packages containing one or more circuit elements, such as transistors, capacitors, inductors, resistors, current paths, diodes, etc. For example, an integrated circuit may be implemented as one or more of an ASIC, an FPGA, a chip, a microchip, a programmable circuit, a semiconductor substrate coupling multiple circuit elements, a system on chip (SoC), and the like.

[0079] Example systems, devices, articles, and methods related to a multi-segment evaporation chamber for an electronic device are disclosed. Example 1 is an evaporation chamber comprising a first panel; a second panel; and a wall extending between the first panel and the second panel for dividing the evaporation chamber into a first segment and a second segment between the first panel and the second panel, the wall comprising an insulator.

[0080] Example 2 includes the evaporation chamber of Example 1, wherein the insulation comprises an evacuated tube.

[0081] Example 3 includes the evaporation chamber of any of Examples 1 or 2, wherein the first section has a first wicking structure and the second section has a second wicking structure different from the first wicking structure.

[0082] Example 4 includes the evaporation chamber of any of Examples 1-3, wherein the first section has a first working fluid and the second section has a second working fluid different from the first working fluid.

[0083] Example 5 includes the evaporation chamber of any of Examples 1-4, wherein the first panel and the second panel are metal and the wall is plastic.

[0084] Example 6 includes the evaporation chamber of any of Examples 1-5, wherein the first section has a first wicking structure and a working fluid, and the second section has a dry second wicking structure.

[0085] Example 7 includes the evaporation chamber of Example 6, wherein the first wicking structure and the second wicking structure are different types of wicking structures.

[0086] Example 8 includes the evaporation chamber of any of Examples 6 or 7, wherein the first section provides a first thermal cooling capacity and the second section provides a second thermal cooling capacity that is different from the first thermal cooling capacity.

[0087] Example 9 includes an evaporation chamber as described in any one of Examples 1-8, wherein the wall is a first wall, the evaporation chamber further includes a second wall coupled to the first wall, the second wall includes the insulator, and the first wall and the second wall divide the evaporation chamber into the first section, the second section, and a third section.

[0088] Example 10 includes the evaporation chamber of any of Examples 1-9, wherein the first section has a first surface area and the second section has a second surface area different from the first surface area.

[0089] Example 11 is an apparatus that includes a first evaporation chamber; a second evaporation chamber; and an insulating fence coupling the first evaporation chamber to the second evaporation chamber.

[0090] Example 12 includes the apparatus of Example 11, wherein the first evaporation chamber is at a first height and the second evaporation chamber is at a second height different from the first height.

[0091] Example 13 includes the apparatus of Example 12, wherein the insulating fence includes a plurality of apertures to allow airflow from below the first evaporation chamber to above the second evaporation chamber.

[0092] Example 14 includes the apparatus of any of Examples 11-13, wherein the insulating fence suppresses thermal crosstalk between the first evaporation chamber and the second evaporation chamber.

[0093] Example 15 includes the apparatus of any of Examples 11-14, wherein the first evaporation chamber has a first thickness and the second evaporation chamber has a second thickness different from the first thickness.

[0094] Example 16 is an electronic device, which includes a first heat-generating component; a second heat-generating component; and a multi-segment evaporation chamber, which includes: a first segment coupled to the first heat-generating component; a second segment coupled to the second heat-generating component; and an insulating wall separating the first segment and the second segment.

[0095] Example 17 includes the electronic device of Example 16, wherein the first section has a first cooling capacity and the second section has a second cooling capacity different from the first cooling capacity.

[0096] Example 18 includes an electronic device as described in any of Examples 16 or 17, wherein the first heat generating component consumes a first amount of power and the second heat generating component consumes a second amount of power different from the first amount of power.

[0097] Example 19 includes an electronic device as described in any of Examples 16-18, wherein the first heat generating component has a first temperature limit and the second heat generating component has a second temperature limit different from the first temperature limit.

[0098] Example 20 includes the electronic device of any of Examples 16-19, wherein the insulating wall hinders heat exchange between the first section and the second section.

[0099] The attached claims are hereby incorporated into this Detailed Description section by this reference. Although certain example systems, devices, articles, and methods are disclosed herein, the scope of coverage of this patent is not limited thereto. On the contrary, this patent covers all systems, devices, articles, and methods that fairly fall within the scope of the claims of this patent.

Claims

1. An evaporation chamber for an electronic device, the evaporation chamber comprising: First panel; Second panel; as well as A wall extending between the first panel and the second panel is used to divide the evaporation chamber into a first section and a second section between the first panel and the second panel, and the wall includes an insulator.

2. The evaporation chamber according to claim 1, wherein: The insulation comprises an evacuated tube.

3. The evaporation chamber according to claim 1, wherein: The first section has a first wicking structure, and the second section has a second wicking structure different from the first wicking structure.

4. The evaporation chamber according to claim 1, wherein: The first section has a first working fluid, and the second section has a second working fluid different from the first working fluid.

5. The evaporation chamber according to claim 1, wherein: The first panel and the second panel are metal and the wall is plastic.

6. The evaporation chamber according to claim 1, wherein: The first section has a first wicking structure and a working fluid, and the second section has a dry second wicking structure.

7. The evaporation chamber according to claim 6, wherein: The first wicking structure and the second wicking structure are different types of wicking structures.

8. The evaporation chamber according to claim 1, wherein: The first section provides a first thermal cooling capacity, and the second section provides a second thermal cooling capacity that is different from the first thermal cooling capacity.

9. The evaporation chamber according to claim 1, wherein: The wall is a first wall, the evaporation chamber further includes a second wall coupled to the first wall, the second wall includes the insulator, and the first wall and the second wall divide the evaporation chamber into the first section, the second section, and a third section.

10. The evaporation chamber according to any one of claims 1 to 9, wherein: The first segment has a first surface area, and the second segment has a second surface area different from the first surface area.

11. An apparatus comprising: a first evaporation chamber; A second evaporation chamber; as well as An insulating fence couples the first evaporation chamber to the second evaporation chamber.

12. The device of claim 11, wherein: The first evaporation chamber is at a first height, and the second evaporation chamber is at a second height different from the first height.

13. The device of claim 12, wherein: The insulating fence includes a plurality of apertures to allow airflow from below the first evaporation chamber to above the second evaporation chamber.

14. The device of claim 11, wherein: The insulating fence suppresses thermal crosstalk between the first evaporation chamber and the second evaporation chamber.

15. The device according to any one of claims 11 to 14, wherein: The first evaporation chamber has a first thickness, and the second evaporation chamber has a second thickness different from the first thickness.

16. An electronic device, comprising: a first heating component; a second heating component; as well as A multi-segment evaporation chamber, the multi-segment evaporation chamber comprising: a first section coupled to the first heat generating component; a second section coupled to the second heat generating component; and An insulating wall separates the first section and the second section.

17. The electronic device according to claim 16, wherein: The first section has a first cooling capacity, and the second section has a second cooling capacity different from the first cooling capacity.

18. The electronic device according to claim 16, wherein: The first heat generating component consumes a first amount of power, and the second heat generating component consumes a second amount of power different from the first amount of power.

19. The electronic device according to claim 16, wherein: The first heat generating component has a first temperature limit, and the second heat generating component has a second temperature limit different from the first temperature limit.

20. The electronic device according to any one of claims 16 to 19, wherein: The insulating wall hinders heat exchange between the first section and the second section.

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