Cold source integration device, heat dissipation system, controller and related methods

Abstract

The application discloses a cold source integrated device, a heat dissipation system, a controller and a heat dissipation control method, relates to the technical field of heat dissipation, and the cold source integrated device is connected with a wind-liquid heat exchange mode component through a liquid cooling pipeline, is connected with a liquid-liquid heat exchange mode component through the liquid cooling pipeline, and the wind-liquid heat exchange mode component and the liquid-liquid heat exchange mode component are connected through the liquid cooling pipeline. The cold source integrated device is used for providing cooling liquid through the liquid cooling pipeline, the cooling liquid sequentially passes through the wind-liquid heat exchange mode component for dissipating heat of a first device of equipment and the liquid-liquid heat exchange mode component for dissipating heat of a second device of equipment, and the cold source integrated device is also used for receiving the cooling liquid output after the second device is cooled. The device realizes the following effects: one cooling liquid supply line is provided, the temperature requirement of different liquid cooling modes is met, the number of cooling liquid supply lines, the number of cooling towers, the number of circulating pumps and the number of liquid cooling pipelines are reduced, and the system complexity is greatly reduced.

Description

[0001] This application is a divisional application, the original application number is 202311724720.8, the original application date is December 14, 2023, and the entire contents of the original application are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation technology, in particular to a cold source integrated device, a heat dissipation system, a controller and a heat dissipation control method. BACKGROUND

[0003] With the advent of the information age, a large amount of data has been generated, and data centers (DC) for storing a large amount of data have emerged. A data center is a specific device network that supports collaboration to deliver, accelerate, display, calculate and store data on network infrastructure. With the increase in chip computing power in the data center, the power consumption of the chip is also increasing. How to better utilize natural cold sources (such as water and wind) to reduce power consumption and improve device reliability has become an important issue.

[0004] Currently, the industry mainly uses full-liquid cooling mode to dissipate heat from the equipment in the data center. Taking the heat dissipation scheme of a server in the data center as an example. The heat dissipation scheme of the server includes liquid cooling plate heat dissipation and liquid cooling door heat dissipation. The liquid cooling plate heat dissipation circuit adopts a cooling distribution unit (CDU) or an embedded cooling unit (ECU), which transfers the heat of large heat generating devices such as chips to the primary side (i.e., the low temperature side) of the ECU through a liquid-liquid heat exchange mode (a mode in which a liquid is used as a heat transfer working medium to flow in the internal flow channel of the liquid cooling plate to achieve cooling through heat transfer), and then uses a circulating water pump to transport the heat to a closed cooling tower. The liquid cooling door heat dissipation circuit adopts a liquid cooling door (a typical example is a water cooling door), which transfers the heat of small heat generating devices such as memories and hard disks to the primary side of the liquid cooling door through an air-liquid heat exchange mode (a mode in which hot air generated by the server is exchanged with cooling liquid provided by the cooling tower), and then uses a circulating water pump to transport the heat to the closed cooling tower.

[0005] Considering that the liquid cooling plate and the liquid cooling door have different requirements for the water temperature at the inlet, the above-mentioned liquid cooling heat dissipation scheme usually needs one water circuit to supply water to the CDU, and corresponding cooling towers, circulating pumps and other components are configured to realize heat exchange processing of the liquid cooling plate. Another water circuit is used to supply water to the liquid cooling door, and correspondingly, the cooling towers, circulating pumps and other components in the water circuit also need to be configured to realize heat exchange processing of the liquid cooling door. The above-mentioned two water circuits form two circulating loops, and in the setting process, not only the requirements of the liquid cooling plate and the liquid cooling door for the water temperature need to be considered, but also the setting positions and space occupation of the components in the water circuit need to be considered, which leads to complex setting of the entire water circuit, and a large number of cooling towers, circulating pumps and other components are needed, increasing the cost. SUMMARY

[0006] To solve the above problems, the application provides a cold source integration device, a heat dissipation system, a controller, and a heat dissipation control method, which solve the problem of complex pipeline of the existing liquid cooling heat dissipation scheme, the need for more cooling towers, circulating pumps and other components, and the increase in cost.

[0007] In a first aspect, the application provides a cold source integration device. The cold source integration device connects a wind-liquid heat exchange mode component through a liquid cooling pipeline (a pipeline for conveying cooling liquid for liquid cooling heat dissipation, which can usually be a water cooling pipeline), and connects a liquid-liquid heat exchange mode component through the liquid cooling pipeline, and the wind-liquid heat exchange mode component and the liquid-liquid heat exchange mode component are connected through the liquid cooling pipeline. The wind-liquid heat exchange mode component refers to a component based on heat exchange between hot air generated by server work and cooling liquid provided by a cooling tower, including but not limited to a liquid cooling door. The liquid-liquid heat exchange mode component refers to a component that uses liquid as a heat transfer working medium to flow in the internal flow channel of a liquid cooling plate, and cools through heat transfer, including but not limited to a liquid cooling plate heat dissipation control unit, which can be a cooling distribution unit (CDU) or an embedded cooling unit (ECU).

[0008] Specifically, the cold source integration device is configured to provide cooling liquid through a liquid cooling pipeline, the cooling liquid flows through a wind-liquid heat exchange mode component for dissipating heat of a first device of an equipment and a liquid-liquid heat exchange mode component for dissipating heat of a second device of the equipment, and then the cold source integration device is further configured to receive the cooling liquid output by the liquid-liquid heat exchange mode component after dissipating heat of the second device.

[0009] The wind-liquid heat exchange mode component and the liquid-liquid heat exchange mode component have different temperature requirements for the cooling liquid. In general, the temperature of the liquid inlet of the wind-liquid heat exchange mode component is lower than the temperature of the liquid-liquid heat exchange mode component. Therefore, the cooling liquid first enters the wind-liquid heat exchange mode component, the wind-liquid heat exchange mode component dissipates heat of the first device based on the cooling liquid, and the cooling liquid can carry away the heat of the first device. At this time, the cooling liquid will be heated, but the heated cooling liquid can still meet the temperature requirements of the liquid-liquid heat exchange mode component and can enter the liquid-liquid heat exchange mode component again. The liquid-liquid heat exchange mode component dissipates heat of the second device based on the heated cooling liquid. In this way, the cold source integration device can meet the requirements of the wind-liquid heat exchange mode component and the liquid-liquid heat exchange mode component through one way of cooling liquid, simplifying the liquid cooling pipeline, reducing the number of cooling towers, circulating pumps and other components, and reducing the cost. Moreover, the above components can be integrated, reducing the floor area and shortening the construction period, and being easy to deploy and maintain. In addition, the scheme recycles the cooling liquid output by the wind-liquid heat exchange mode component, improving the energy utilization efficiency.

[0010] In some possible implementation manners, the cooling liquid flows through the air-liquid heat exchange mode component for dissipating heat of the first device of the equipment and the liquid-liquid heat exchange mode component for dissipating heat of the second device of the equipment in sequence.

[0011] In some possible implementation manners, the cold source integrated device is specifically configured to provide the mixed cooling liquid through the liquid cooling pipeline when the cold supplement condition is triggered, and a temperature of the mixed cooling liquid meets a temperature requirement of the air-liquid heat exchange mode component. The device can adopt a cold supplement design of the mixed cooling liquid (supplementing a cold load so that the temperature of the cooling liquid can meet the requirement), and can further simplify a system architecture and improve system energy efficiency.

[0012] In some possible implementation manners, the cold source integrated device includes a cooling tower, a circulating pump, a three-way valve, and a cold supplement chiller. The cooling tower and the circulating pump are connected through a liquid cooling pipeline, the circulating pump and the cold supplement chiller are connected through a liquid cooling pipeline, and the liquid cooling pipeline connected with the circulating pump and the cold supplement chiller is arranged with the three-way valve. The cold source integrated device is specifically configured to: when the cold supplement condition is triggered, adjust a state of the three-way valve to a three-way state, so that the cooling liquid provided by the cooling tower is divided into two routes after passing through the circulating pump, and the cooling liquid in one of the two routes is mixed with the cooling liquid in the other route after passing through the cold supplement chiller to obtain mixed cooling liquid.

[0013] The scheme adjusts the three-way valve to the three-way state, so that the cooling liquid is divided into two routes, one of which enters the cold supplement chiller and is then mixed with the other route. The circulating pump is multiplexed without being separately provided for the cold supplement pipeline, the system architecture is simplified, and the system energy efficiency is improved.

[0014] In some possible implementation manners, the circulating pump includes a primary circulating pump and a secondary circulating pump, and the three-way valve includes a first three-way valve and a second three-way valve. The cold source integrated device is specifically configured to: when the cold supplement condition is triggered, adjust a state of the first three-way valve to a three-way state, so that the cooling liquid of the cooling tower is divided into two routes after passing through the primary circulating pump, the cooling liquid in one of the two routes is mixed with the cooling liquid in the other route after passing through a condenser of the cold supplement chiller and a plate heat exchanger in front of the cooling tower, and adjust a state of the second three-way valve to a three-way state, so that the cooling liquid passing through the plate heat exchanger is divided into two routes after passing through the secondary circulating pump, and the cooling liquid in one of the two routes is mixed with the cooling liquid in the other route after passing through an evaporator of the cold supplement chiller to obtain mixed cooling liquid.

[0015] The scheme multiplexes the primary circulating pump through the first three-way valve and multiplexes the secondary circulating pump through the second three-way valve, thereby simplifying the system architecture, reducing the number of circulating pumps, and reducing the cost.

[0016] In some possible implementation manners, the supplementary cooling condition comprises that the supply liquid temperature is greater than or equal to a preset threshold. The cold source integrated device further comprises a controller, which is configured to control the state of the three-way valve to be the three-way state and start the supplementary cooling chiller when it is detected that the supply liquid temperature is greater than or equal to the preset threshold. In this way, the on-demand cooling can be realized and fine adjustment can be achieved through the automatic supplementary cooling control based on the temperature at the cold source end.

[0017] In some possible implementation manners, the controller is specifically configured to determine the bypass flow of the three-way valve according to the supply liquid temperature, the cooling temperature of the supplementary cooling chiller, the required temperature of the air-liquid heat exchange mode assembly and the flow required for heat dissipation, determine the valve opening ratio of the three-way valve according to the bypass flow, and adjust the state of the three-way valve to be the three-way state according to the valve opening ratio.

[0018] The scheme determines the bypass flow of the three-way valve by using the law of conservation of energy, and then determines the valve opening ratio of the three-way valve based on the bypass flow, and adjusts the state of the three-way valve according to the valve opening ratio, so that the temperature of the mixed cooling liquid can be controlled more accurately, thereby meeting the temperature requirement of the air-liquid heat exchange mode assembly.

[0019] In some possible implementation manners, the controller is further configured to control the supply liquid temperature of the cooling tower according to the wet-bulb temperature and the approximation degree of the cooling tower, and then control the secondary side temperature of the plate heat exchanger according to the supply liquid temperature and the approximation degree of the plate heat exchanger. In this way, the supply liquid temperature (such as the secondary side temperature of the plate heat exchanger) of the integrated cold source device can be linked to the wet-bulb temperature in the environment, and when the wet-bulb temperature in the environment decreases, the supply liquid temperature of the integrated cold source device also decreases. On the side of the computer room, the outlet air temperature of the air-liquid heat exchange mode assembly decreases, and the temperature of the computer room decreases.

[0020] In some possible implementation manners, the controller is further configured to control the secondary side temperature of the plate heat exchanger according to the wet-bulb temperature and the approximation degree of the cooling tower and the approximation degree of the plate heat exchanger. In this scheme, the controller directly takes the secondary side temperature of the plate heat exchanger as an anchor point for temperature control, so that the supply liquid temperature (such as the secondary side temperature of the plate heat exchanger) of the integrated cold source device can be linked to the wet-bulb temperature in the environment.

[0021] In some possible implementation manners, the controller is further configured to detect that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode assembly and the liquid inlet of the air-liquid heat exchange mode assembly is lower than a set value, and reduce the opening degree of the electric valve arranged at the liquid inlet of the air-liquid heat exchange mode assembly. In this way, the flow can be reduced, the power consumption of the secondary circulating pump can be reduced, and energy-saving control can be realized.

[0022] In some possible implementation manners, the circulating pump comprises a primary circulating pump and a secondary circulating pump, and a plate heat exchanger is arranged between the primary circulating pump and the secondary circulating pump, and the controller is further configured to: detect that a temperature difference between a primary-side outlet and a primary-side inlet of the plate heat exchanger is lower than a set value, and control the primary circulating pump to operate in a variable frequency mode; or detect that a temperature difference between the primary-side outlet of the plate heat exchanger and a secondary-side inlet of the plate heat exchanger is lower than an approach degree of the plate heat exchanger, and control the primary circulating pump to operate in the variable frequency mode. In this way, the power consumption of the primary circulating pump can be saved, and energy-saving control can be achieved.

[0023] In a second aspect, the present application provides a heat dissipation system. The heat dissipation system comprises the cold source integrated device provided in the first aspect of the present application and a wind-liquid heat exchange mode component and a liquid-liquid heat exchange mode component. The cold source integrated device is configured to cooperate with the wind-liquid heat exchange mode component and the liquid-liquid heat exchange mode component to dissipate heat for a device.

[0024] In a third aspect, the present application provides a heat dissipation control method. The method is applied to a cold source integrated device, the cold source integrated device comprises a controller, a cooling tower, a circulating pump, a three-way valve and a subcooling refrigerator, the cooling tower and the circulating pump are connected through a liquid cooling pipeline, the circulating pump and the subcooling refrigerator are connected through a liquid cooling pipeline, and the liquid cooling pipeline connected with the circulating pump and the subcooling refrigerator is provided with the three-way valve. The method comprises the following steps:

[0025] The controller detects a supply liquid temperature.

[0026] When the supply liquid temperature is greater than or equal to a preset threshold value, the controller controls a state of the three-way valve to be a three-way state, and turns on the subcooling refrigerator to make the cooling liquid of the cooling tower pass through the circulating pump and be divided into two paths, and the cooling liquid in one of the two paths is mixed with the cooling liquid in the other path to obtain mixed cooling liquid.

[0027] In some possible implementation manners, the controller controls the state of the three-way valve to be the three-way state, including:

[0028] The controller determines a bypass flow of the three-way valve according to the supply liquid temperature, a cooling temperature of the subcooling refrigerator, a required temperature of the wind-liquid heat exchange mode component and a required flow for heat dissipation.

[0029] The controller determines an opening valve ratio of the three-way valve according to the bypass flow, and adjusts the state of the three-way valve to the three-way state according to the opening valve ratio.

[0030] In some possible implementation manners, the circulating pump comprises a primary circulating pump and a secondary circulating pump, and a plate heat exchanger is arranged between the primary circulating pump and the secondary circulating pump, and the method further comprises the following steps:

[0031] control the secondary side temperature of the plate heat exchanger according to the wet bulb temperature and the approach degree of the cooling tower and the approach degree of the plate heat exchanger; or

[0032] control the secondary side temperature of the plate heat exchanger according to the wet bulb temperature and the approach degree of the cooling tower and the approach degree of the plate heat exchanger.

[0033] In some possible implementation manners, the method further includes:

[0034] detecting that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode component and the liquid inlet of the air-liquid heat exchange mode component is lower than a set value, and reducing the opening degree of the electric valve arranged at the liquid inlet of the air-liquid heat exchange mode component.

[0035] In some possible implementation manners, the circulating pump includes a primary circulating pump and a secondary circulating pump, and a plate heat exchanger is arranged between the primary circulating pump and the secondary circulating pump, and the method further includes:

[0036] detecting that the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger is lower than a set value, and controlling the primary circulating pump to operate in a variable frequency mode; or

[0037] detecting that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger is lower than the approach degree of the plate heat exchanger, and controlling the primary circulating pump to operate in a variable frequency mode.

[0038] In a fourth aspect, the present application provides a controller. The controller includes a processor and an input and output unit, the input and output unit is configured to communicate with a three-way valve in a cold source integrated device, and the processor is configured to execute computer readable instructions, so that the controller performs the heat dissipation control method provided in any one of the implementation manners of the third aspect of the present application.

[0039] In some possible implementation manners, the controller further includes a memory, and the processor is specifically configured to:

[0040] load the computer readable instructions from the memory and execute the computer readable instructions.

[0041] On the basis of the implementation manners of the aspects provided in the present application, further combinations can be made to provide more implementation manners. BRIEF DESCRIPTION OF DRAWINGS

[0042] Figure 1 a schematic diagram of an architecture of a data center provided in the present application;

[0043] Figure 2 a schematic diagram of a liquid cooling pipeline of a cold source integrated device provided in the present application;

[0044] Figure 3 Another schematic diagram of an architecture of a data center is provided for the present application;

[0045] Figure 4 A schematic diagram of a circulating path of cooling liquid in a cold source integrated device or heat dissipation system in a non-cold-supplementing operation state is provided for the present application;

[0046] Figure 5 A schematic diagram of a circulating path of cooling liquid in a cold source integrated device or heat dissipation system in a cold-supplementing operation state is provided for the present application;

[0047] Figure 6 Another schematic diagram of an architecture of a data center is provided for the present application;

[0048] Figure 7 A schematic diagram of determining an opening ratio of a three-way valve is provided for the present application;

[0049] Figure 8 A schematic diagram of temperature control is provided for the present application;

[0050] Figure 9 A schematic diagram of energy-saving control of a circulating pump is provided for the present application;

[0051] Figure 10 A flowchart of a heat dissipation control method is provided for the present application. DETAILED DESCRIPTION

[0052] To solve the problems of complex pipeline, the need to configure multiple circulating pumps, cooling towers and other components, and high cost in the above-mentioned liquid cooling heat dissipation scheme, the present application provides a cold source integrated device and a heat dissipation system comprising the same. The cold source integrated device can be an integrated liquid cooling module. The heat dissipation system can comprise the cold source integrated device, an air-liquid heat exchange mode assembly (or air-liquid heat exchange device) and a liquid-liquid heat exchange mode assembly (or liquid-liquid heat exchange device). The cold source integrated device is connected to the air-liquid heat exchange mode assembly through a liquid cooling pipeline, and is connected to the liquid-liquid heat exchange mode assembly (such as an ECU or CDU liquid cooling plate heat dissipation control unit) through a liquid cooling pipeline. The air-liquid heat exchange mode assembly and the liquid-liquid heat exchange mode assembly are connected through a liquid cooling pipeline. The cold source integrated device is used to provide cooling liquid through the liquid cooling pipeline. The cooling liquid passes through the air-liquid heat exchange mode assembly for heat dissipation of the first device of the equipment and the liquid-liquid heat exchange mode assembly for heat dissipation of the second device of the equipment in sequence, and then the cold source integrated device receives the cooling liquid output after heat dissipation of the second device.

[0053] The temperature requirements of the cooling liquid for the air-cooled heat exchange mode component and the liquid-liquid heat exchange mode component are different. In general, the temperature of the liquid inlet of the air-cooled heat exchange mode component (such as a liquid cooling door) is lower than the temperature of the liquid-liquid heat exchange mode component (such as an ECU or a CDU). Therefore, the cooling liquid first enters the air-cooled heat exchange mode component, and the air-cooled heat exchange mode component dissipates heat from the first device based on the cooling liquid. At this time, the cooling liquid will be heated because it has taken away the heat of the first device. The heated cooling liquid can still meet the temperature requirements of the liquid-liquid heat exchange mode component and can enter the liquid-liquid heat exchange mode component. The liquid-liquid heat exchange mode component dissipates heat from the second device based on the heated cooling liquid. In this way, the heat source integrated device can meet the requirements of the air-cooled heat exchange mode component and the liquid-liquid heat exchange mode component through one cooling liquid, simplifying the liquid cooling pipeline, reducing the number of cooling towers, circulating pumps and other components, and reducing costs. Moreover, the above components can be integrated, reducing the floor area and shortening the construction period, and being easy to deploy and maintain.

[0054] For ease of understanding, first, the technical terms involved in the present application are introduced.

[0055] Liquid cooling refers to a technology that uses liquid as a heat transfer medium to dissipate heat from devices in a computing system (such as a server in a data center) to the outside of the heat-generating device. Liquid cooling technology supports multiple heat dissipation modes, including but not limited to liquid-liquid heat exchange (such as water-water heat exchange) mode and air-liquid heat exchange mode. In general, the liquid-liquid heat exchange mode component includes a liquid cooling plate heat dissipation control unit. The liquid cooling plate heat dissipation circuit adopts a liquid cooling distribution unit (CDU) or an embedded cooling unit (ECU) and other liquid-liquid heat exchange mode components to dissipate heat from large heat-generating devices such as central processing units (CPUs) through liquid-liquid heat exchange mode. The air-liquid heat exchange mode component includes components such as in-cabinet liquid cooling doors and out-of-cabinet row-level air conditioners to achieve heat exchange between hot air generated by the server and the cooling liquid. For example, the liquid cooling door heat dissipation circuit adopts a liquid cooling door to dissipate heat from small heat-generating devices such as memories and hard drives through air-liquid heat exchange mode. Alternatively, when the air-liquid heat exchange mode component is a row-level air conditioner, the air-liquid heat exchange process can be achieved through the row-level air conditioner. For ease of description, the following embodiments take the liquid-liquid heat exchange mode component as a liquid cooling plate heat dissipation control unit and the air-liquid heat exchange mode component as a liquid cooling door as an example for description.

[0056] The liquid cooling distribution unit CDU is a control unit for liquid cooling in the machine room of the data center, which is used to adjust the refrigeration capacity, temperature and flow rate of the cooling liquid of a group of cabinets, etc.

[0057] The embedded liquid cooling unit ECU is built in the cabinet by pre-integration, as a component of the cabinet, for controlling the refrigerating capacity, temperature and flow rate of the cooling liquid of the cabinet.

[0058] The principle of the liquid cooling door heat dissipation route and the liquid cooling plate heat dissipation route will be described in detail below with reference to the drawings.

[0059] Figure 1 An architecture diagram of a data center is provided in the present application, which illustrates the heat dissipation of the cabinet in the data center by the liquid cooling heat dissipation mode. As shown in Figure 1 The data center 100 includes a liquid cooling cabinet 110 and a heat dissipation system 120.

[0060] The liquid cooling cabinet 110 includes a plurality of liquid cooling cabinets 111, which is an entity providing high-performance computing and dissipating heat from the servers in the cabinet based on the liquid cooling heat dissipation mode. For example, the liquid cooling cabinet 111 includes a plurality of server nodes. The server node can be a separate physical device.

[0061] The heat dissipation system 120 includes one or more heat dissipation subsystems, each of which is used to dissipate heat from the liquid cooling cabinet 111. In order to improve the heat dissipation efficiency, when there are multiple heat dissipation subsystems in the heat dissipation system 120, different heat dissipation subsystems can dissipate heat from the liquid cooling cabinet 111 through different heat dissipation lines. For example, the liquid cooling plate heat dissipation subsystem can dissipate heat from the liquid cooling cabinet 111 through the liquid cooling plate heat dissipation line, and the liquid cooling door heat dissipation subsystem can dissipate heat from the liquid cooling cabinet through the liquid cooling door heat dissipation line.

[0062] The liquid cooling plate heat dissipation subsystem includes a cooling tower 121, a circulating pump 123 (for example, a circulating water pump, referred to as a water pump) and a liquid cooling plate heat dissipation control unit 125 (for example, a CDU). The cooling tower 121 is used to use the liquid cooling medium (for example, water) as the circulating cooling medium (cooling liquid) to discharge heat to the atmosphere to reduce the temperature. The circulating pump 123 is used to provide power for transporting the cooling liquid, for example, suitable for transporting water or liquid cooling medium with physical and chemical properties in a high-pressure operating system. The cooling tower 121 can supply cooling liquid with lower temperature such as cold water, and the circulating pump 123 transports the cooling liquid to the CDU in the cabinet, and the CDU controls the refrigerating capacity, temperature and flow rate of the cooling liquid of the liquid cooling cabinet 111, thereby cooling the server nodes in the liquid cooling cabinet 111. The cooling liquid can take away the heat of the liquid cooling cabinet 111, and return to the cooling tower 121 through the CDU and the circulating pump 123 for heat exchange.

[0063] The liquid cooling door heat dissipation subsystem includes a cooling tower 122, a circulating pump 124, a plate heat exchanger 126 (referred to as a plate exchanger), and a liquid cooling door 128. The plate heat exchanger 126 is a new type of high-efficiency heat exchanger formed by stacking metal plates with a certain corrugated shape. The plate heat exchanger 126 includes gaskets, pressing plates (movable end plates and fixed end plates), and a frame (upper and lower guide rods and front support columns). The plates are sealed and flow-guided by the gaskets, and two fluid channels for cold and hot are separated. The cold and hot heat exchange media flow through the respective channels and exchange heat with the separated plates to achieve the required temperature of the user. The cooling tower 122 can supply cooling liquid with a relatively low temperature, such as cold water. The circulating pump 124 delivers the cooling liquid to the plate heat exchanger 126. When the temperature of the cooling liquid separated by the plate heat exchanger 126 is less than 28℃, the cooling liquid can be delivered to the liquid cooling door 128 to cool the servers in the liquid cooling cabinet 111. The cooling liquid can take away the heat of the liquid cooling cabinet 111 and return to the cooling tower 122 for heat exchange.

[0064] Compared with the liquid cooling plate heat dissipation subsystem, the liquid cooling door heat dissipation subsystem has a higher temperature requirement for the cooling liquid. When the ambient temperature is high, the liquid cooling door heat dissipation subsystem usually needs to supplement the cooling load (referred to as cold supplement) to make the cooling liquid meet the temperature requirement of the liquid cooling door heat dissipation subsystem. Specifically, the liquid cooling plate heat dissipation subsystem further includes a circulating pump 12A, a water chiller 12C, a circulating pump 12E, and a cooling tower 12G. Specifically, when the temperature of the cooling liquid separated by the plate heat exchanger 126 is greater than 28℃, the circulating pump 12A and the water chiller 12C (usually a large unit) are started to supplement the cooling of the cooling liquid separated by the plate heat exchanger 126, so that the temperature of the cooling liquid is less than 28℃, and then the cooling liquid is delivered to the liquid cooling door 128. In addition, the cooling liquid (such as cold water) used by the water chiller 12C for cold supplement can be provided by the cooling tower 12G. The cooling tower 12G can be an open cooling tower. The cooling tower 12G delivers the cooling liquid to the water chiller 12C through the circulating pump 12E. The water chiller 12 can further cool the cooling liquid delivered by the cooling tower through a refrigeration system, thereby providing cooling liquid with a temperature of 18℃. The water chiller 12C can take away heat through the cooling liquid with a temperature of 18℃ and return to the cooling tower 12G through the circulating pump 12E for heat exchange by the cooling tower 12G.

[0065] It should be noted that the cooling tower, the circulating pump, and other components for providing the cooling liquid for the liquid cooling plate heat dissipation control unit 125 and the liquid cooling door 128 can also be reused. The cooling tower, the circulating pump, and other components can be integrated to form a cold source integrated device.

[0066] Figure 2 A liquid cooling pipeline schematic diagram of a cold source integrated device provided in the present application is shown in FIG. 6. Figure 2As shown, the cold source integration device is configured to provide cooling liquid through the liquid cooling pipeline. The cooling liquid can sequentially pass through the liquid cooling door for dissipating heat of the first device of the equipment (e.g., small heat generating devices of the server in the data center, including but not limited to memory and hard disk) and the liquid cooling plate control unit for dissipating heat of the second device of the equipment (e.g., large heat generating devices of the server in the data center, including but not limited to CPU). The cold source integration device is also configured to receive the cooling liquid output by the liquid cooling plate control unit after dissipating heat of the second device.

[0067] Figure 1 、 Figure 2 The liquid cooling door and the liquid cooling plate control unit are taken as examples of the air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component. The liquid cooling door and other heat dissipation components can be arranged inside the liquid cooling cabinet (inside the cabinet where the server using liquid cooling is located, which can also be referred to as in-cabinet). Figure 1 、 Figure 2 The liquid cooling door is placed outside the liquid cooling cabinet in the figure to facilitate the display of the flow direction of the cooling liquid. When the air-liquid heat exchange mode component is a row-level air conditioner, the row-level air conditioner can be arranged outside the cabinet. The row-level air conditioner can perform air-liquid heat exchange on the cabinets arranged in rows in the computer room in units of rows, thereby achieving row-level refrigeration. In some examples, the air-liquid heat exchange mode component can also be a room-level air conditioner, which is usually arranged outside the cabinet and performs air-liquid heat exchange on multiple cabinets in the computer room, thereby achieving room-level refrigeration.

[0068] The technical solution can provide one path of cooling liquid to meet the needs of the liquid cooling door and the liquid cooling plate control unit. For example, the cold source integration device provides one path of cooling liquid, which first enters the liquid cooling door to dissipate heat of the first device of the equipment. The cooling liquid output from the liquid cooling door will be heated due to carrying heat. Since the temperature of the liquid inlet of the liquid cooling door is lower than that of the liquid inlet of the liquid cooling plate, the heated cooling liquid can still meet the temperature requirements of the liquid cooling plate control unit. Therefore, the heated cooling liquid can enter the ECU and other liquid cooling plate control units to dissipate heat of the second device of the equipment. The cooling liquid output by the liquid cooling plate control unit after dissipating heat of the second device is returned to the cold source integration device for heat exchange. The technical solution can reduce the number of cooling liquid supply lines, the number of cooling towers, the number of circulating pumps, and the number of liquid cooling pipelines, thereby reducing costs. Moreover, the technical solution can greatly reduce the system complexity, facilitate deployment and maintenance, and shorten the construction period. In addition, the technical solution can improve the power usage effectiveness (PUE) by reusing the cooling liquid output by the liquid cooling door, thereby meeting the business requirements.

[0069] Furthermore, this technical solution can use a mixed coolant method for supplementary cooling (such as chilled water mixing for supplementary cooling), which can reuse circulation pumps (such as reusing the primary circulation pump and the secondary circulation pump), further simplifying the system architecture and improving the system energy efficiency. In addition, this technical solution also supports an integrated controller, such as an integrated embedded programmable logic controller (PLC), to achieve the linkage of the cooling system, and then achieve on-demand cooling and fine-tuning.

[0070] The following will结合附图详细说明本申请的集成冷源装置以及包括上述集成冷源装置的散热系统架构。

[0071] Refer to Figure 3 As shown in the schematic diagram of the architecture of a data center, the data center 300 includes a liquid-cooled computer room 310 and a cooling system 320. The liquid-cooled computer room 310 includes multiple liquid-cooled cabinets 311, and each liquid-cooled cabinet 311 includes one or more server nodes. The server node can be an independent physical device. The cooling system 320 includes a cold source integration device 322, a liquid-cooled door 324, and a liquid-cooled plate heat dissipation control unit 326. Among them, the liquid-cooled plate heat dissipation control unit 326 can be an ECU or a CDU. The cold source integration device 322 is connected to the liquid-cooled door 324 through a liquid-cooled pipeline, and is also connected to the liquid-cooled plate heat dissipation control unit 3 to the liquid-cooled plate heat dissipation control unit 326 through a liquid-cooled pipeline, and the liquid-cooled door 324 and the liquid-cooled plate heat dissipation control unit 326 are connected through a liquid-cooled pipeline. The cold source integration device 322, the liquid-cooled door 324, and the liquid-cooled plate heat dissipation control unit 326 cooperate to dissipate heat from the equipment.

[0072] In specific implementation, the cold source integration device 322 is used to provide a coolant through a liquid-cooled pipeline. The coolant can be a cooled liquid, such as cold water. Among them, the coolant sequentially passes through the liquid-cooled door 324 for dissipating heat from the first device of the equipment (such as server nodes) in the liquid-cooled computer room 310 and the liquid-cooled plate heat dissipation control unit 326 for dissipating heat from the second device of the equipment in the liquid-cooled computer room 310. The cold source integration device 322 is also used to receive the coolant (such as hot water) output after the liquid-cooled plate heat dissipation control unit 326 dissipates heat from the second device.

[0073] It should be noted that in the translation of "下面结合附图,对本申请的集成冷源装置、以及包括上述集成冷源装置的散热系统架构进行详细说明。 ", there is an unclear expression "结合附图详细说明", which is translated as "结合附图详细说明" for now. It may need to be adjusted according to the specific context and accurate meaning.In some possible implementation manners, the cold source integrated device 322 is specifically configured to provide the mixed cooling liquid through the liquid cooling pipeline to supplement cooling of the cooling liquid entering the liquid cooling door 324 when the cooling supplement condition is triggered. The temperature of the mixed cooling liquid meets the temperature requirement of the liquid cooling door 324. The temperature requirement of the liquid cooling door can be less than or equal to a target temperature, and the target temperature can be 28°C or 25°C. The target temperature can be different according to different application scenarios. The cooling supplement condition can be set according to business requirements, for example, the cooling supplement condition can be set as that the supply liquid temperature is greater than or equal to a preset threshold. The cold source integrated device 322 can realize the cooling supplement of the mixed cooling liquid by opening the three-way valve.

[0074] Specifically, the cold source integrated device 322 includes a cooling tower 3222, a circulating pump 3224, a three-way valve 3226 and a cooling supplement chiller 3228. The three-way valve 3226 and the cooling supplement chiller 3228 can be optional components. For example, in an area where the ambient temperature is maintained at a low level all year round, the cold source integrated device 322 does not need to be designed for cooling supplement, and thus can not include the three-way valve 3226 or the cooling supplement chiller 3228. The embodiment is exemplarily described in an area where the ambient temperature changes significantly with seasons. Because the weather is hot in summer, the ambient temperature is high, and in order to realize cooling supplement, the cold source integrated device 322 is configured with the three-way valve 3226 and the cooling supplement chiller 3228 for cooling supplement. The cooling tower 3222 and the circulating pump 3224 are connected through a liquid cooling pipeline, the circulating pump 3224 and the cooling supplement chiller 3228 are connected through a liquid cooling pipeline, and the liquid cooling pipeline connected with the circulating pump 3224 and the cooling supplement chiller 3228 is provided with the three-way valve 3226.

[0075] The cold source integrated device 322 is specifically configured to adjust the state of the three-way valve 3226 to a three-way state when the cooling supplement condition is triggered, so that the cooling liquid of the cooling tower 3222 is divided into two paths after passing through the circulating pump 3224. One of the two paths of the cooling liquid passes through the cooling supplement chiller 3228 and is mixed with the other path of the cooling liquid to obtain the mixed cooling liquid. The mixed cooling liquid can meet the temperature requirement of the liquid cooling door 324.

[0076] The circulating pump 3224 can include a primary circulating pump 3224A and a secondary circulating pump 3224B, and the three-way valve 3226 includes a first three-way valve 3226A and a second three-way valve 3226B. The primary circulating pump 3224A is connected to the first three-way valve 3226A, and the secondary circulating pump is connected to the second three-way valve 3226B. The cold source integrated device 322 is specifically configured to adjust the state of the first three-way valve 3226A to a three-way state when the cooling supplement condition is triggered, so that the cooling liquid of the cooling tower 3222 is divided into two paths after passing through the primary circulating pump 3224A, one path of the cooling liquid passes through the condenser of the cooling supplement chiller 3228, and the other path of the cooling liquid passes through the plate heat exchanger 3225 and then converges in front of the cooling tower 3222, and the state of the second three-way valve 3226B is adjusted to a three-way state, so that the cooling liquid passing through the plate heat exchanger 3225 is divided into two paths after passing through the secondary circulating pump 3224B, one path of the cooling liquid passes through the evaporator of the cooling supplement chiller 3228, and the other path of the cooling liquid is mixed to obtain mixed cooling liquid. The mixed cooling liquid can achieve cooling supplement and meet the temperature requirement of the liquid cooling door 324.

[0077] Considering that the cooling pump 3222 and the plate heat exchanger 3225 can output cooling liquid to supply cooling liquid to downstream equipment, the cold source integrated device 322 can determine whether to open the three-way valve 3224 to mix the cooling liquid based on the supply liquid temperature of the cooling pump 3222 and the plate heat exchanger 3225 or the final supply liquid temperature of the entire cold source integrated device 322, and perform cooling supplement on the cooling liquid entering the liquid cooling door 324. In other words, the supply liquid temperature in the cooling supplement condition can be the supply liquid temperature of the cooling tower 3222, the supply liquid temperature (such as the secondary side outlet liquid temperature) of the plate heat exchanger 3225, or the final supply liquid temperature of the entire cold source integrated device 322. Correspondingly, the preset threshold corresponding to the supply temperature of different points can be different, for example, the preset threshold corresponding to the supply liquid temperature of the cooling tower 3222 can be set to 32°C, and the preset threshold corresponding to the final supply liquid temperature of the entire cold source integrated device 322 can be set to 28°C.

[0078] It should be noted that the cooling tower 322 in the cold source integrated device 322 of the present application can be an open cooling tower or a closed cooling tower. The cooling liquid of the closed cooling tower flows in a closed pipeline and does not contact the outside air, and the heat is exchanged with the outside air, sprayed water, etc. through the heat exchanger pipe wall, so that the cooling liquid is not polluted, evaporated, or concentrated, and does not need to be supplemented or dosed, thereby ensuring the use performance and service life of the associated equipment. The cooling liquid of the open cooling tower circulates in an open system, the cooling liquid is concentrated due to evaporation, needs to be supplemented, and the cooling liquid directly contacts the air and is irradiated by sunlight, which is easy to be polluted, for example, algae and salt crystals are generated, so that the cooling liquid usually needs to be treated, for example, dosed, to prevent the growth of algae and salt crystals. Figure 3Taking the open cooling tower 322 as an example, the cooling source integrated device 322 also includes a cooling liquid treatment device 3223A for descaling, filtering, softening or sterilizing treatment of the cooling liquid. The cooling liquid treatment device 3223A and the plate heat exchanger 3225 can be connected by a three-way valve 3227. Similarly, the outlet of the liquid cooling cabinet 311 and the plate heat exchanger 3225 can also include a cooling liquid treatment device 3223B for descaling, filtering, softening or sterilizing treatment of the cooling liquid output after heat dissipation treatment of the liquid cooling cabinet 311. The cooling liquid treatment device 3223A or the cooling liquid treatment device 3223B can be an optional component. For example, when the cooling source integrated device 322 uses a closed cooling tower, the cooling liquid treatment device 3223A or the cooling liquid treatment device 3223B can not be included.

[0079] In some possible implementations, the cooling source integrated device 322 can also integrate a liquid supplementing device 3229. For example, the liquid supplementing device 3229 can be a constant pressure water supplementing device. The constant pressure water supplementing device includes a constant pressure tank, a water pump, a pressure switch, an intelligent control box, a safety valve, a base and a pipeline, and is used to reduce the start-up frequency of the circulating pump 3224, adjust the water pressure and water volume of the system, and easily realize automatic water supplementing. Similarly, the liquid supplementing device 3229 can be an optional component. When the cooling source integrated device 322 does not include the liquid supplementing device 3229, the pressure and flow rate can be manually adjusted.

[0080] Figure 3 The cooling source integrated device 322 or the heat dissipation system 320 including the cooling source integrated device 322 has multiple operating states. For example, the operating state of the cooling source integrated device 322 or the heat dissipation system 320 can be divided into a non-supplementing cooling operating state and a supplementing cooling operating state according to whether a supplementing cooling condition is triggered. The circulation path (such as the water circulation path) of the cooling liquid in different operating states of the cooling source integrated device 322 or the heat dissipation system 320 will be introduced below.

[0081] In the non-supplemental cooling operation state of the cold source integration device 322 or the heat dissipation system 320, the cooling liquid does not need to be supplemented with cooling, and thus does not pass through the supplemental cooling chiller, but circulates in the primary side and the secondary side of the plate heat exchanger 3225 respectively. The cooling liquid provided by the cooling tower 3222 is transported to the plate heat exchanger 3225 through the primary circulating pump 3224A for heat exchange. The primary side of the plate heat exchanger 3225 can output the cooling liquid with a temperature rise, which is returned to the cooling tower 3222 after being processed by the cooling liquid processing device 3223A, thereby realizing the primary circulation. The cooling liquid with a reduced temperature obtained by the plate heat exchanger 3225 can be output from the secondary side of the plate heat exchanger 3225. The cooling liquid output from the secondary side outlet of the plate heat exchanger 3225 is transported to the liquid cooling door 324 through the secondary circulating pump 3224B. The liquid cooling door 324 dissipates heat from the first device according to the cooling liquid, and then the cooling liquid is output from the liquid outlet of the liquid cooling door 324 and enters the liquid cooling plate heat dissipation control unit 326. The liquid cooling plate heat dissipation control unit 326 dissipates heat from the second device, and the cooling liquid output from the liquid outlet of the liquid cooling plate heat dissipation control unit 326 is processed by the cooling liquid processing device 3223B and then reaches the secondary side inlet of the plate heat exchanger 3225, thereby realizing the secondary circulation.

[0082] For ease of understanding, the circulation path of the cooling liquid is also introduced in combination with the accompanying drawings.

[0083] Referring to Figure 4 the cooling liquid circulation path schematic diagram in the non-supplemental cooling operation state, the cold source integration device 322 or the heat dissipation system 320 includes primary circulation and secondary circulation.

[0084] In the primary circulation, the circulation path of the cooling liquid is 1->2->3->4->5->6->7, and the three-way valves between 2->3 and 5->6 are in two-way state. In other words, the cooling liquid of the cooling tower 3222 passes through the primary circulating pump 3224A, reaches the first three-way valve 3224A, is output from one passage of the first three-way valve 3224A, reaches the plate heat exchanger 3225, for example, reaches the primary side inlet of the plate heat exchanger 3225, and the plate heat exchanger 3225 (for example, through the primary side outlet) transports the cooling liquid to the three-way valve 3227. The three-way valve 3227 transports the cooling liquid to the cooling liquid processing device 3223A for processing, and then returns to the cooling tower 3222.

[0085] In the secondary circulation, the circulation path of the cooling liquid is 8->9->10->11->12->13, and the three-way valve between 9->10 is in a two-way state at this time. In other words, the cooling liquid of the open cooling tower 3222, after heat exchange through the plate heat exchanger 3225, is transported to the secondary circulation pump 3224B through the secondary side outlet of the plate heat exchanger 3225, and the secondary circulation pump 3224B transports the cooling liquid to the second three-way valve 3224B. Since the second three-way valve 3224B is in a two-way state, the cooling liquid is output from one passage (normally closed passage) of the second three-way valve 3224B to the liquid cooling machine room 310. The cooling liquid first enters the liquid cooling door 324 to cool the small heat generating devices such as memory and hard disk in the server node of the liquid cooling cabinet 311. The cooling of the memory and hard disk by the cooling liquid can cause the temperature of the cooling liquid to rise. The heated cooling liquid can enter the liquid cooling plate heat dissipation control unit 326 (such as ECU) to cool the large heat generating devices such as CPU in the server node of the liquid cooling cabinet 311. The cooling of the CPU by the cooling liquid can cause the temperature of the cooling liquid to further rise. The heated cooling liquid can be processed by the cooling liquid processing device 3223B and then enter the plate heat exchanger 3225 (for example, the secondary side inlet of the plate heat exchanger 3225). The plate heat exchanger 3225 can heat exchange and recycle the heated cooling liquid.

[0086] In the cold supplement running state, the cooling liquid needs to be cooled to meet the temperature requirement of the liquid cooling door 324. In other words, in the cold supplement running state, the cooling liquid also needs to enter the cold supplement chiller 3228. Specifically, when the cooling liquid circulates in the primary side and the secondary side of the plate heat exchanger 3225, it also flows into the cold supplement chiller 3228. The cooling tower 3222 provides cooling liquid which is delivered to the first three-way valve 3226A by the primary circulation pump 3224A. The first three-way valve 3226A divides the cooling liquid into two paths which are delivered to the plate heat exchanger 3225 and the cold supplement chiller 3228 respectively for heat exchange. The cooling liquid output from the primary side outlet of the plate heat exchanger 3225 and the cooling liquid output from the condenser of the cold supplement chiller 3228 are processed by the cooling liquid processing device 3223A and then combined before the cooling tower 3222, thereby realizing the primary circulation. The cooling liquid with reduced temperature obtained by the plate heat exchanger 3225 can be output from the secondary side of the plate heat exchanger 3225. The cooling liquid output from the secondary side outlet of the plate heat exchanger 3225 is delivered to the second three-way valve 3226B by the secondary circulation pump 3224B. The second three-way valve 3226B divides the cooling liquid into two paths, one of which enters the evaporator of the cold supplement chiller 3228 for heat exchange, and the other of which mixes with the cooling liquid output from the evaporator to form mixed cooling liquid. The mixed cooling liquid first enters the liquid cooling door 324 and then enters the liquid cooling plate heat dissipation control unit 326. The cooling liquid output from the outlet of the liquid cooling plate heat dissipation control unit 326 is processed by the cooling liquid processing device 3223B and then reaches the secondary side inlet of the plate heat exchanger 3225, thereby realizing the secondary circulation.

[0087] For ease of understanding, the circulation path of the cooling liquid is also introduced in combination with the accompanying drawings.

[0088] Referring to Figure 5 the cooling liquid circulation path in the cold supplement running state, the cold source integrated device 322 or the heat dissipation system 320 includes a primary circulation and a secondary circulation.

[0089] In the primary circulation, the circulation path of the cooling liquid can be 1->2->4->5->7->8 and 1->2->3->6->7->8. Among them, the three-way valve between 2->3 and 5->7 is in a three-way state. The cooling liquid output from point 2 is branched by the three-way valve, and a part of it enters the condenser of the supplemental cooling chiller 3228, and then converges at the three-way valve before the cooling tower 3222 through point 6. In other words, the cooling liquid of the cooling tower 3222 passes through the primary circulation pump 3224A to reach the first three-way valve 3224A. Since the first three-way valve 3224A is in a three-way state, the cooling liquid is divided into two paths. One path passes through the plate heat exchanger 3225 and reaches the cooling liquid treatment device 3223A through one passage of the three-way valve 3227. The other path passes through the condenser of the supplemental cooling chiller 3228 for condensation and then reaches the cooling liquid treatment device 3223A through another passage of the three-way valve 3227. The cooling liquid treatment device 3223A performs descaling, filtering, softening or sterilization treatment on the above-mentioned two paths of cooling liquid and then converges before the cooling tower.

[0090] In the secondary circulation, the circulation path of the cooling liquid can be 9->10->12->14->15->16 and 9->10->11->13->14->15->16. Among them, the three-way valve between 10->12 is in a three-way state. The cooling liquid output from point 12 is mixed with the cooling liquid at point 12 after passing through point 11 and being cooled by the evaporator of the supplemental cooling chiller 3228 to become a cooling source meeting the cooling temperature requirements of the server nodes. In other words, the cooling liquid of the cooling tower 3222 is heated by the plate heat exchanger 3225 and then delivered to the secondary circulation pump 3224B. The secondary circulation pump 3224B delivers the cooling liquid to the second three-way valve 3224B. Since the second three-way valve 3224B is in a three-way state, the cooling liquid is output from the two passages of the second three-way valve 3224B. One path of the cooling liquid reaches the evaporator of the supplemental cooling chiller 3228 for evaporation and cooling, and then mixes with the other path of the cooling liquid. The temperature of the mixed cooling liquid can meet the temperature requirements of the liquid cooling door 324, and the mixed cooling liquid can be input into the liquid cooling door 324. The liquid cooling door 324 cools the small heat generating devices in the equipment based on the mixed cooling liquid. The heat carried away by the cooling liquid from the small heat generating devices can cause the temperature of the cooling liquid to rise. The heated cooling liquid can enter the liquid cooling plate heat dissipation control unit 326 (such as ECU). The ECU can control the flow rate of the cooling liquid to cool the large heat generating devices in the server nodes of the liquid cooling cabinet 311. The heated cooling liquid is treated by the cooling liquid treatment device 3223B and then reaches the plate heat exchanger 3225. The plate heat exchanger 3225 can heat and recycle the heated cooling liquid.

[0091] It should be noted that, Figure 4 , Figure 5 The same point number in the above description can indicate different points, for exampleFigure 4 Midpoint position number 3 and Figure 5 Midpoint position number 3 respectively indicates different passages of the three-way valve.

[0092] In the above scheme, the cold source end can be integrated, for example, the circulating pump 3224 (such as the primary circulating pump 3224A and the secondary circulating pump 3224B), the plate heat exchanger 3225, the three-way valve 3226 (the first three-way valve 3226A and the second three-way valve 3226B) and the supplemental cooling chiller 3228 can be integrated in the container, and then the container is integrated with the cooling tower 3222 to form a cold source integrated device 322. In this device, the supplemental cooling design according to the mixed cooling liquid scheme of the multiplex primary circulating pump and the secondary circulating pump greatly simplifies the system architecture and improves the system energy efficiency.

[0093] Further, referring to Figure 6 , the cold source integrated device 322 can also integrate a controller 3221. The controller 3221 is used to realize the linkage control based on the liquid temperature, and then realize the on-demand cooling to form a normal temperature machine room. The controller 3221 can be realized by a PLC control board. Specifically, the controller 3221 can detect whether the supplemental cooling condition is triggered. For example, the controller 3221 can detect whether the supply liquid temperature (when the cooling liquid is cold water, also called the supply water temperature) is greater than or equal to a preset threshold. Specifically, the cold source integrated device 322 can deploy a temperature sensor at the set point position, and the temperature sensor can detect the temperature of the cooling liquid at the set point position. The temperature sensor is in communication connection with the controller 3221, and the temperature sensor can report the detection result to the controller 3221, so that the controller 3221 can obtain the supply liquid temperature.

[0094] When the supply liquid temperature is greater than or equal to the preset threshold, it indicates that the supplemental cooling condition is triggered, and the controller can control the state of the three-way valve 3224 to be a three-way state, and start the supplemental cooling chiller 3228, thereby realizing the supplemental cooling control.

[0095] Specifically, when the supplemental cooling condition is triggered, the controller 3221 can adjust the state of the first three-way valve 3224A to be a three-way state, so that the cooling liquid of the cooling tower 3222 is divided into two paths after passing through the primary circulating pump 3224A, one path of the cooling liquid passes through the condenser of the supplemental cooling chiller 3228 and the other path of the cooling liquid passes through the plate heat exchanger 3225 and then converges in front of the cooling tower, and adjust the state of the second three-way valve 3224B to be a three-way state, so that the cooling liquid passing through the plate heat exchanger 3225 is divided into two paths after passing through the secondary circulating pump 3224B, one path of the cooling liquid passes through the evaporator of the supplemental cooling chiller 3228 and then mixes with the other path of the cooling liquid to obtain the mixed cooling liquid. The mixed cooling liquid meets the temperature requirement of the liquid cooling door 324.

[0096] When the controller 3221 performs the supplementary cooling control, the controller 3221 can determine the bypass flow of the three-way valve 3224 according to the supply liquid temperature, the cooling temperature of the supplementary cooling chiller 3228, the required temperature of the liquid cooling door, and the flow required for heat dissipation, determine the opening ratio of the three-way valve 3224 according to the bypass flow, and adjust the state of the three-way valve 3224 to the three-way state according to the opening ratio.

[0097] Further, the controller 3221 can also control the supply liquid temperature to be linked with the ambient temperature to reduce the overall power consumption and achieve energy-saving control. Similarly, the controller 3221 can also perform energy-saving control on the primary circulating pump 3224A and the secondary circulating pump 3224B to improve the energy efficiency of the system.

[0098] Still taking Figure 6 as an example, the linkage control of the controller 3221 is described in detail.

[0099] The control points of the controller 3221 include but are not limited to the fan frequency of the cooling tower 3222, the frequency of the primary circulating pump 3224A, the opening degree of the electric valve (including the three-way valve and the two-way valve), the operating parameters of the supplementary cooling chiller 3228, the operating parameters of the liquid supplementing device 3229, the operating parameters of the cooling liquid treatment device 3223, and the operating parameters of the liquid cooling plate heat dissipation control unit 326 (such as an ECU). The operating parameters of the supplementary cooling chiller 3228 include the input frequency of the variable frequency compressor and the liquid outlet temperature. The operating parameters of the liquid supplementing device 3229 can include the start-stop state of the liquid pump (such as a water pump). The operating parameters of the cooling liquid treatment device 3223 include the start-stop state of the cooling liquid treatment device 3223. The operating parameters of the liquid cooling plate heat dissipation control unit 326 include the opening degree of the primary-side proportional valve (such as the reused V5 and V6 or a separate proportional valve), the secondary-side supply liquid temperature, and the liquid pump frequency.

[0100] The controller 3221 can collect data and then analyze the collected data to control the above-mentioned control points based on the analysis result. The data collected by the controller 3221 can include one or more of the operating parameters of the cooling tower 3222, the ambient temperature, the operating parameters of the primary circulating pump 3224A, the opening degree of the electric valve (including the three-way valve and the two-way valve, for example, V1 to V7 in the figure), the temperature collected by the temperature sensor, the pressure collected by the pressure sensor, the operating parameters of the liquid supplementing device 3229, the operating parameters of the cooling liquid treatment device 3223, the operating parameters of the supplementary cooling chiller 3228, the parameters of the flow meter, and the operating parameters of the liquid cooling plate heat dissipation control unit 326.

[0101] The operating parameters of the cooling tower 3222 collected by the controller 3221 include one or more of the fan frequency, power consumption, outlet liquid temperature, and inlet liquid temperature. The environmental temperature collected by the controller 3221 includes the dry-bulb temperature and the wet-bulb temperature. The dry-bulb temperature is the actual temperature of the air in contact with the surface of the bulb, and the wet-bulb temperature is the temperature of the bulb after the water evaporates and takes away heat when the water is attached to the surface of the bulb. The amount of water evaporation is related to the humidity of the air. The greater the humidity of the air, the smaller the amount of water evaporation, the less heat taken away by evaporation, and the smaller the difference between the dry-bulb temperature and the wet-bulb temperature. The smaller the humidity of the air, the greater the amount of water evaporation, the greater the heat taken away by evaporation, and the greater the difference between the dry-bulb temperature and the wet-bulb temperature. Therefore, the current air humidity condition can be reflected by the change rule of the difference between the dry-bulb temperature and the wet-bulb temperature. Based on this, the wet-bulb temperature can also be determined by the dry-bulb temperature and the relative humidity. The operating parameters of the primary circulating pump 3224A collected by the controller 3221 include one or more of the operating frequency, power consumption, inlet pressure, and outlet pressure. The operating parameters of the liquid supplementing device 3229 collected by the controller 3221 can include the start-stop state of the liquid supplementing device 3229, and the operating parameters of the cooling liquid treatment device 3223 collected by the controller 3221 can include the start-stop state of the cooling liquid treatment device 3223. The operating parameters of the subcooling chiller 3228 collected by the controller 3221 include the input frequency of the variable frequency compressor and the outlet liquid temperature. The operating parameters of the liquid cooling plate heat dissipation control unit 326 collected by the controller 3221 can include the opening of the primary side proportional valve, the secondary side liquid supply temperature, and the liquid pump frequency.

[0102] When the controller 3221 detects that the liquid supply temperature is greater than or equal to a preset threshold value, for example, the liquid supply temperature of the integrated cold source device 322 is greater than 32 degrees Celsius for three consecutive times, the controller 3221 can control the state of the first three-way valve 3224A and the second three-way valve 3224B (for example, V1 and V4 in Figure 6 to be a three-way state, and start the subcooling chiller 3228. The three-way valve generally includes a normally open path and a normally closed path. In the example of Figure 6 , the normally open path is also provided with an electric valve (for example, two-way valves V2 and V3 in Figure 6 ), and therefore the controller 3221 can also control the state of V2 and V3 to be an open valve state, so that the normally open path is closed.

[0103] The controller 3221 is configured to determine the bypass flow of the three-way valve according to the liquid supply temperature, the cooling temperature of the subcooling chiller 3228, the required temperature of the liquid cooling door 324, and the required flow for heat dissipation, and then determine the opening ratio of the three-way valve (such as V1 and V4) according to the bypass flow, and adjust the state of the three-way valve to a three-way state according to the opening ratio.

[0104] The following takes V4 as an example to illustrate the process of determining the opening valve ratio. Specifically, the opening valve ratio (opening degree) of the V4 valve corresponds to the flow rate, and the opening valve ratio (also known as bypass opening degree) of the V4 can be determined by calculating the required bypass flow rate. The bypass flow rate can be calculated according to the law of conservation of energy. As shown in Figure 7 the temperature of the cooling liquid flowing into V4 is denoted as T1, and the flow rate of the cooling liquid flowing into V4 is the required flow rate for heat dissipation (for example, the required flow rate for server heat dissipation in the liquid cooling cabinet 311), denoted as Q3. The cooling liquid is divided into two paths when passing through V4, and the temperatures of the two paths of cooling liquid remain unchanged, still T1, and the flow rates of the two paths of cooling liquid are Q1 and Q2, respectively. The cooling liquid with a flow rate of Q2 passes through the supplemental cooling unit 3228, and the temperature decreases to T2, and then merges with the cooling liquid with a flow rate of Q1.

[0105] Based on the law of conservation of energy, the following model can be established:

[0106] Q1*T1+Q2*T2=Q3*T3 (1)

[0107] Q3=Q1+Q2 (2)

[0108] wherein Q3 is the required flow rate for server heat dissipation, Q3 can be obtained by using a sensor, and T1 can be obtained according to the wet bulb temperature and the approach of the cooling tower 3222. The approach of the cooling tower 3221 can be the difference between the temperature of the cooling liquid (such as water temperature) after cooling by the cooling tower 3221 and the wet bulb temperature, which is used to represent the degree to which the temperature of the cooling liquid after cooling by the cooling tower 3221 approaches the wet bulb temperature. Generally, the approach of the cooling tower 3221 can be 3-4℃. T2 can be set, for example, T2 can be set to 15℃, and similarly, T3 can be set to 32℃. Based on the formula in the above model, Q1 and Q2 (bypass flow rate) can be solved.

[0109] After the controller 3221 determines the opening valve ratio based on the above bypass flow rate, the controller 3221 can issue the opening valve ratio to the corresponding three-way valve, so as to control the state of the three-way valve to be the three-way state according to the opening valve ratio.

[0110] Similarly, when the controller 3221 starts the supplemental cooling unit 3228, the controller 3221 can also issue a start instruction to the supplemental cooling unit, and the supplemental cooling unit 3228 can start cooling after receiving the start instruction.

[0111] Further, in order to avoid the disadvantages of high-temperature computer rooms, improve the reliability of information technology (IT) equipment, reduce the power consumption of IT equipment, and achieve global optimization, the integrated cold source device 322 can also perform global linkage control based on the temperature of the cooling liquid.

[0112] One control mode can be that the controller 3221 controls the supply liquid temperature of the cooling tower according to the wet bulb temperature and the approximation degree of the cooling tower, and then controls the secondary side temperature of the plate heat exchanger 3225 according to the supply liquid temperature and the approximation degree of the plate heat exchanger 3225.

[0113] Specifically, referring to Figure 8 a schematic diagram of temperature control shown in the figure, the cooling tower 3222 controls the supply liquid temperature (when the cooling liquid is water, specifically the outlet water temperature) of the cooling tower 3222 according to the wet bulb temperature and the approximation degree of the cooling tower 3222, and then the secondary side temperature of the plate heat exchanger 3225 is controlled according to the supply liquid temperature of the cooling tower 3222 and the approximation degree of the plate heat exchanger 3225, in other words, when controlling the secondary side temperature of the plate heat exchanger 3225, it can be controlled through two anchor points. In this way, the supply liquid temperature of the integrated integrated cold source device 322 realizes linkage with the wet bulb temperature, when the wet bulb temperature of the external environment decreases, the supply liquid temperature of the integrated cold source device 322 also decreases. Embodied on the liquid cooling room 310 side, the liquid cooling door outlet air temperature decreases, and the liquid cooling room 310 temperature decreases.

[0114] The controller 3221 can also simultaneously control the ECU and other liquid cooling plate heat dissipation control units 326, and the secondary side temperature can be set to the primary side temperature + approximation degree, at this time, the supply liquid temperature of the liquid cooling plate heat dissipation control unit 326 realizes the change with the change of the wet bulb temperature of the external environment, under the same business model, the temperature of the server node in the liquid cooling cabinet 311 decreases, and the IT power consumption decreases.

[0115] Another control mode can be that the controller 3221 controls the secondary side temperature of the plate heat exchanger 3225 according to the wet bulb temperature and the approximation degree of the cooling tower 3222, and the approximation degree of the plate heat exchanger 3225. In other words, the controller 3221 directly takes the secondary side temperature of the plate heat exchanger 3225 as the anchor point for temperature control.

[0116] In some possible implementations, the controller 3221 can also control the energy saving of the circulating pump 3224, for example, the primary circulating pump 3224A and the secondary circulating pump 3224B. The plate heat exchanger 3225 is arranged between the primary circulating pump 3224A and the secondary circulating pump 3224B. The controller 3221 can control the energy saving of the circulating pump 3224 in combination with the outlet liquid temperature or the inlet liquid temperature of the plate heat exchanger 3225.

[0117] For the primary circulation pump 3224A, the controller 3221 can deploy temperature sensors at the primary side inlet and outlet of the plate heat exchanger 3225 after the primary circulation pump 3224A. The controller 3221 is configured to detect the temperature of the primary side outlet and the primary side inlet of the plate heat exchanger 3225 after the primary circulation pump 3224A, for example, by receiving the temperature of the primary side outlet and the primary side inlet reported by the temperature sensors. When the temperature difference between the primary side outlet and the primary side inlet of the plate heat exchanger 3225 is less than a set value (for example, 9°C), the controller 3221 is configured to control the primary circulation pump 3224A to operate at a variable frequency, so as to save power consumption. Similarly, the controller 3221 can also control the primary circulation pump 3224A based on the approach degree of the plate heat exchanger 3225, so as to save power consumption. In a specific implementation, the controller 3221 can deploy temperature sensors at the primary side outlet and the secondary side inlet of the plate heat exchanger 3225. When the temperature difference between the primary side outlet and the secondary side inlet of the plate heat exchanger 3225 is less than the approach degree of the plate heat exchanger 3225 (for example, 1°C to 1.5°C), the primary circulation pump 3224A is controlled to operate at a variable frequency.

[0118] For the secondary circulation pump 3224B, referring to Figure 9 , the controller 3221 can deploy temperature sensors at the outlet of the liquid cooling plate heat dissipation control unit 326 and the inlet of the liquid cooling door 324. In addition, the controller 3221 can also deploy an electric valve at the inlet of the liquid cooling door 324. The controller 3221 is configured to detect the temperature T1 of the inlet of the liquid cooling door 324 and the temperature T2 of the outlet of the liquid cooling plate heat dissipation control unit 326. When the temperature difference (T2-T1) between the outlet of the liquid cooling plate heat dissipation control unit 326 and the inlet of the liquid cooling door 324 is less than a set value (for example, 9°C), the controller 3221 is also configured to reduce the opening degree of the electric valve deployed at the inlet of the liquid cooling door 324. In this way, the flow rate can be reduced, and the power consumption of the secondary circulation pump 3224B can be reduced.

[0119] Based on the foregoing embodiments of the cold source integrated device 322 and the heat dissipation system 320, the present application also provides a heat dissipation control method.

[0120] The heat dissipation control method disclosed in the present application will be described in detail below with reference to the accompanying drawings.

[0121] Referring to Figure 10A flow chart of a heat dissipation control method is shown, which is applied to a cold source integrated device 322, the cold source integrated device 322 including a controller 3221, a cooling tower 3222, a circulating pump 3224, a three-way valve 3226 and a supplemental chiller 3228. The cooling tower 3222 and the circulating pump 3224 are connected through a liquid cooling pipeline, and the circulating pump 3224 and the supplemental chiller 3228 are connected through a liquid cooling pipeline. The liquid cooling pipeline connecting the circulating pump 3224 and the supplemental chiller 3228 is provided with the three-way valve 3224. The method includes the following steps:

[0122] S1002, the controller 3221 detects the supply liquid temperature. When the supply liquid temperature is greater than or equal to a preset threshold, S1004 is performed.

[0123] Specifically, the controller 3221 can deploy a temperature sensor at the liquid outlet of the cooling tower 3222, through which the supply liquid temperature (for example, the outlet water temperature) of the cooling tower 3222 can be detected. In some examples, the controller 3221 can also deploy a temperature sensor at the liquid outlet (such as the secondary side liquid outlet) of the plate heat exchanger 3225, or at the end (output end) of the entire cold source integrated device 322, through which the supply liquid temperature of the plate heat exchanger 3225 or the final supply liquid temperature of the entire cold source integrated device 322 can be detected.

[0124] When the supply liquid temperature is greater than or equal to the preset threshold, it indicates that the supplemental cooling condition is triggered, and the controller 3221 can perform supplemental cooling control. The controller 3221 can control the three-way valve 3224 to be in a three-way state to mix the cooling liquids of different passages for supplemental cooling.

[0125] S1004, the controller 3221 determines the bypass flow of the three-way valve 3224 according to the supply liquid temperature, the cooling temperature of the supplemental chiller 3228, the required temperature of the liquid cooling door and the required flow for heat dissipation.

[0126] The flow of the cooling liquid entering the three-way valve 3224 is equal to the sum of the flows of different output passages of the three-way valve. The sum of the energies of the cooling liquids of different passages is equal to the energy of the mixed cooling liquid. Based on this, the controller 3221 can model based on the energy conservation law based on the supply liquid temperature, the cooling temperature of the supplemental chiller 3228, the required temperature of the liquid cooling door and the required flow for heat dissipation, thereby establishing a model as shown. Figure 7 The controller 3221 determines the bypass flow of the three-way valve 3224 by solving the model.

[0127] In some possible implementations, the circulating pump 3224 includes a primary circulating pump 3224A and a secondary circulating pump 3224B, and the three-way valve 3226 includes a first three-way valve 3226A and a second three-way valve 3226B. Accordingly, the controller 3221 determines the bypass flow of the second three-way valve 3226B according to the supply temperature, the cooling temperature of the supplemental cooling chiller 3228, the required temperature of the liquid cooling door 324, and the required flow for heat dissipation, and the controller 3221 can also determine the bypass flow of the first three-way valve 3224A in a similar manner.

[0128] S1006. The controller 3221 determines the opening ratio of the three-way valve 3224 according to the bypass flow, and adjusts the state of the three-way valve 3224 to the three-way state according to the opening ratio.

[0129] The bypass flow of the three-way valve 3224 has a corresponding relationship with the opening ratio of the three-way valve 3224, and the controller 3221 can determine the opening ratio of the three-way valve 3224 according to the bypass flow. Then the controller 3221 can issue the opening ratio to the three-way valve 3224, so as to adjust the state of the three-way valve 3224 to the three-way state according to the opening ratio.

[0130] When the three-way valve 3226 includes the first three-way valve 3226A and the second three-way valve 3226B, the controller 3221 can determine the opening ratio of the first three-way valve 3226A according to the bypass flow of the first three-way valve 3226A, and determine the opening ratio of the second three-way valve 3226B according to the bypass flow of the second three-way valve 3226B.

[0131] The controller 3221 can adjust the state of the first three-way valve 3226A to the three-way state according to the opening ratio of the first three-way valve 3226A, so that the cooling liquid of the cooling tower 3222 is divided into two paths after passing through the primary circulating pump 3224A, and one path of the cooling liquid passes through the condenser of the supplemental cooling chiller 3228 and the other path of the cooling liquid passes through the plate heat exchanger 3225 before converging in front of the cooling tower 3222.

[0132] The controller 3221 can adjust the state of the second three-way valve 3226B to the three-way state according to the opening ratio of the second three-way valve 3226B, so that the cooling liquid passing through the plate heat exchanger 3225 is divided into two paths after passing through the secondary circulating pump 3224B, and one path of the cooling liquid passes through the evaporator of the supplemental cooling chiller 3228 and mixes with the other path of the cooling liquid to obtain the mixed cooling liquid.

[0133] It should be noted that the above S1004, S1006 is one specific implementation of the controller 3221 controlling the state of the three-way valve 3224 to be a three-way state. In other possible implementations of the embodiments of the present application, the controller 3221 can also control the state of the three-way valve 3224 to be a three-way state according to a pre-set opening valve ratio (for example, a default opening valve ratio).

[0134] S1008, the controller 3221 opens the cold supplement chiller 3228 to make the cooling liquid of the cooling tower 3222 pass through the circulating pump 3224 and then be divided into two paths. One path of the cooling liquid passes through the cold supplement chiller 3228 and then mixes with the other path of the cooling liquid to obtain mixed cold supplement liquid.

[0135] Specifically, the controller 3221 can issue an opening instruction under the cold supplement chiller 3228 to open the cold supplement chiller 3228.

[0136] It should be noted that the above S1004, S1006 can be executed in parallel with S1008, or executed in sequence. The embodiments of the present application do not limit this.

[0137] In some possible implementations, the controller 3221 can also perform global temperature control or energy-saving control on the circulating pump 3224.

[0138] When performing global temperature control, the controller 3221 can control the supply liquid temperature of the cooling tower according to the wet-bulb temperature and the approximation degree of the cooling tower, and then control the secondary side temperature of the plate heat exchanger 3225 according to the supply liquid temperature and the approximation degree of the plate heat exchanger 3225, so as to realize the linkage of the supply liquid temperature of the integrated cold source device 322 with the wet-bulb temperature. The controller 3221 can also control the secondary side temperature of the plate heat exchanger 3225 according to the wet-bulb temperature and the approximation degree of the cooling tower 3222 and the approximation degree of the plate heat exchanger 3225, so as to realize the linkage of the supply liquid temperature of the integrated cold source device 322 with the wet-bulb temperature.

[0139] In the energy-saving control of the circulating pump 3224, the controller 3221 can detect the temperature difference between the primary side outlet and the primary side inlet of the plate heat exchanger 3225 after the circulating pump (e.g., the primary circulating pump 3224A). When the temperature difference between the primary side outlet and the primary side inlet of the plate heat exchanger 3225 is lower than a set value, the controller 3221 controls the frequency conversion operation of the circulating pump (e.g., the primary circulating pump 3224A), so as to save the power consumption of the primary circulating pump 3224A. In some examples, the controller 3221 also supports the energy-saving control of the primary circulating pump 3224A based on the approach degree of the plate heat exchanger 3225. Specifically, when the temperature difference between the primary side outlet and the secondary side inlet of the plate heat exchanger 3225 is lower than the approach degree of the plate heat exchanger 3225, the controller 3221 controls the frequency conversion operation of the primary circulating pump 3224A, so as to reduce the power consumption of the primary circulating pump 3224A.

[0140] The controller 3221 can also detect the temperature difference between the outlet of the liquid cooling plate heat dissipation control unit 326 (e.g., an ECU) and the inlet of the liquid cooling door 324. When the temperature difference between the outlet of the liquid cooling plate heat dissipation control unit 326 and the inlet of the liquid cooling door 324 is lower than a set value, the controller 3221 reduces the opening degree of the electric valve arranged at the inlet of the liquid cooling door 324, so as to reduce the power consumption of the secondary circulating pump 3224B.

[0141] Based on the foregoing heat dissipation control method, the embodiment of the present application further provides a controller 3221. The controller 3221 can be a PLC control board, which is a digital electronic device with a microprocessor, a digital logic controller for automatic control. The PLC control board can execute control instructions (computer readable instructions), so as to execute the foregoing heat dissipation control method.

[0142] Specifically, the controller 3221 includes a processor and an input / output module. The processor can be a CPU or a microprocessor. The input / output module can be a network card or a transceiver. The input / output module can communicate with the circulating pump 3224 and the three-way valve 3226 in the cold source integrated device 322. For example, the input / output module can receive (input) and send (output) various types of electrical or electronic signals, and use them to control or supervise almost all kinds of mechanical and electrical systems. The processor can execute computer readable instructions, so as to make the controller 3221 execute the foregoing heat dissipation control method.

[0143] Further, the controller 3221 can also include a memory, which can store computer readable instructions. Accordingly, the processor is specifically configured to load the computer readable instructions from the memory and execute the computer readable instructions, so as to make the controller 3221 execute the foregoing heat dissipation control method.

[0144] It should be understood that in the present application, "at least one" refers to one or more, and "multiple" refers to two or more. "And / or" is used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, "A and / or B" can represent three cases: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally represents that the associated objects before and after are in an "or" relationship. "At least one of the following" or similar expressions means any combination of these items, including any combination of single or multiple items. For example, at least one of a, b or c can mean a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0145] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit it; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the protection scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid-cooled cabinet, characterized by, The liquid cooling cabinet comprises a liquid-air heat exchange mode assembly and a liquid-liquid heat exchange mode assembly, and the liquid-liquid heat exchange mode assembly and the liquid-air heat exchange mode assembly are connected through a liquid cooling pipeline; The cooling liquid sequentially passes through the liquid-air heat exchange mode assembly and the liquid-liquid heat exchange mode assembly, and is used for heat dissipation of equipment in the liquid cooling cabinet, the liquid inlet temperature of the liquid-air heat exchange mode assembly is lower than the liquid inlet temperature of the liquid-liquid heat exchange mode assembly, and the temperature of the cooling liquid output from the liquid-air heat exchange mode assembly meets the temperature requirement of the liquid-liquid heat exchange mode assembly. The cooling liquid is provided by a cold source integrated device, the cold source integrated device comprises a three-way valve and a supplemental cooling chiller, the cooling liquid is divided into two paths through the three-way valve, one path of the cooling liquid is mixed with the other path of the cooling liquid after passing through the evaporator of the supplemental cooling chiller to obtain mixed cooling liquid, and the temperature of the mixed cooling liquid meets the temperature requirement of the liquid-air heat exchange mode assembly.

2. The liquid-cooled cabinet of claim 1, wherein, The liquid-air heat exchange mode assembly comprises a liquid cooling door.

3. The liquid-cooled cabinet of claim 1, wherein, The liquid-liquid heat exchange mode assembly comprises a liquid cooling distribution unit CDU and / or an embedded liquid cooling unit CDU.

4. The liquid-cooled cabinet according to any of claims 1-3, characterized in that, The cooling liquid is used for heat dissipation of equipment in the liquid cooling cabinet, comprising: The cooling liquid sequentially passes through the liquid-air heat exchange mode assembly for heat dissipation of a first device of the equipment and the liquid-liquid heat exchange mode assembly for heat dissipation of a second device of the equipment, and the heat generation of the second device is greater than that of the first device.

5. The liquid-cooled cabinet according to any of claims 1-3, characterized in that, The cold source integrated device further comprises a cooling tower and a circulating pump, and the cold source integrated device connects the liquid-air heat exchange mode assembly and the liquid-liquid heat exchange mode assembly through the liquid cooling pipeline.

6. The liquid-cooled cabinet of claim 5, wherein, The cold source integrated device is specifically used for: When the supplemental cooling condition is triggered, the mixed cooling liquid is provided through the liquid cooling pipeline.

7. A data center, characterized by, The data center comprises the liquid cooling cabinet of any one of claims 1-6.

8. A heat dissipation system characterized by, The heat dissipation system comprises the liquid cooling cabinet of any one of claims 1-6 and a cold source integrated device, the cold source integrated device connects the liquid cooling cabinet through a liquid cooling pipeline, the cold source integrated device provides cooling liquid for the liquid cooling cabinet through the liquid cooling pipeline, the cooling liquid is used for sequentially flowing through the liquid-air heat exchange mode assembly and the liquid-liquid heat exchange mode assembly, the liquid inlet temperature of the liquid-air heat exchange mode assembly is lower than the liquid inlet temperature of the liquid-liquid heat exchange mode assembly, and the temperature of the cooling liquid output from the liquid-air heat exchange mode assembly meets the temperature requirement of the liquid-liquid heat exchange mode assembly. The cold source integrated device comprises a three-way valve and a supplemental cooling chiller, the cooling liquid is divided into two paths through the three-way valve, one path of the cooling liquid is mixed with the other path of the cooling liquid after passing through the evaporator of the supplemental cooling chiller to obtain mixed cooling liquid, and the temperature of the mixed cooling liquid meets the temperature requirement of the liquid-air heat exchange mode assembly.

9. The heat dissipation system of claim 8, wherein, The cold source integrated device is specifically used for: When the supplemental cooling condition is triggered, the mixed cooling liquid is provided through the liquid cooling pipeline.

10. The heat dissipation system of claim 9, wherein, The cold source integrated device further comprises a cooling tower and a circulating pump, the cooling tower and the circulating pump are connected through a liquid cooling pipeline, the circulating pump and the cold supplementing chiller are connected through a liquid cooling pipeline, and the liquid cooling pipeline connected with the circulating pump and the cold supplementing chiller is provided with the three-way valve; The cold source integrated device is particularly used for: When the cold supplementing condition is triggered, the state of the three-way valve is adjusted to a three-way state, so that the cooling liquid provided by the cooling tower is divided into two paths after passing through the circulating pump, and the cooling liquid in one of the two paths is mixed with the cooling liquid in the other path after passing through the cold supplementing chiller to obtain mixed cooling liquid.

11. The heat dissipation system of claim 10, wherein, The circulating pump comprises a primary circulating pump and a secondary circulating pump, and the three-way valve comprises a first three-way valve and a second three-way valve; The cold source integrated device is particularly used for: When the cold supplementing condition is triggered, the state of the first three-way valve is adjusted to a three-way state, so that the cooling liquid of the cooling tower is divided into two paths after passing through the primary circulating pump, the cooling liquid in one of the two paths passes through the condenser of the cold supplementing chiller and is mixed with the cooling liquid in the other path after passing through the plate heat exchanger before the cooling tower, and the state of the second three-way valve is adjusted to a three-way state, so that the cooling liquid passing through the plate heat exchanger is divided into two paths after passing through the secondary circulating pump, the cooling liquid in one of the two paths passes through the evaporator of the cold supplementing chiller and is mixed with the cooling liquid in the other path to obtain mixed cooling liquid.

12. The heat dissipation system of claim 10, wherein, The cold supplementing condition comprises that the supply liquid temperature is greater than or equal to a preset threshold value, and the cold source integrated device further comprises a controller, and the controller is used for: When it is detected that the supply liquid temperature is greater than or equal to the preset threshold value, the state of the three-way valve is controlled to be a three-way state, and the cold supplementing chiller is started.

13. The heat dissipation system of claim 12, wherein, The controller is particularly used for: According to the supply liquid temperature, the cooling temperature of the cold supplementing chiller, the required temperature of the air-liquid heat exchange mode assembly and the required flow for heat dissipation, the bypass flow of the three-way valve is determined; According to the bypass flow, the opening valve ratio of the three-way valve is determined, and the state of the three-way valve is adjusted to a three-way state according to the opening valve ratio.

14. The heat dissipation system of claim 12, wherein, The controller is further used for: According to the wet bulb temperature and the approximation degree of the cooling tower, the supply liquid temperature of the cooling tower is controlled, and then according to the supply liquid temperature and the approximation degree of the plate heat exchanger, the secondary side temperature of the plate heat exchanger is controlled.

15. The heat dissipation system of claim 12, wherein, The controller is further used for: According to the wet bulb temperature and the approximation degree of the cooling tower and the approximation degree of the plate heat exchanger, the secondary side temperature of the plate heat exchanger is controlled.

16. The heat dissipation system according to any one of claims 12 to 15, wherein, The controller is further used for: When it is detected that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode assembly and the liquid inlet of the air-liquid heat exchange mode assembly is lower than a set value, the opening degree of the electric valve arranged at the liquid inlet of the air-liquid heat exchange mode assembly is reduced.

17. The heat dissipation system of any one of claims 12 to 15, wherein, The circulating pump comprises a primary circulating pump and a secondary circulating pump, a plate heat exchanger is arranged between the primary circulating pump and the secondary circulating pump, and the controller is further used for: When it is detected that the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger is lower than a set value, the primary circulating pump is controlled to operate at variable frequency; or, If the temperature difference between the primary side outlet and the secondary side inlet of the plate heat exchanger is lower than the approach of the plate heat exchanger, the primary circulation pump is controlled to run at variable frequency.

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