Double-layer air duct heat dissipation case based on honeycomb-like fins

Abstract

The embodiment of the invention relates to the technical field of structural design of airborne electronic equipment, and discloses a double-layer air duct heat dissipation case based on simulated honeycomb fins. Comprising imitation honeycomb fins, a front panel component, a box body framework, a high heating function module, a mother board, a rear panel component, a fan, an air cavity, a first layer of imitation honeycomb air duct, a second layer of imitation honeycomb air duct and an upper cover plate component, and an air outlet is formed in the upper cover plate component; the two honeycomb-like fins are installed on the left side and the right side of the box body framework respectively, the rear panel component is installed on the rear side of the box body framework, an air cavity is formed between the rear panel component and the mother board, the fan is installed on the rear panel component, and the first-layer honeycomb-like air duct, the second-layer honeycomb-like air duct and the upper cover plate component are sequentially installed on the top of the box body framework from bottom to top; the honeycomb-like fins are used for providing transverse heat dissipation; and the fan is used for blowing high-pressure air into the case, and the high-pressure air flows into the first-layer honeycomb-like air duct and the second-layer honeycomb-like air duct through the air cavity and then is exhausted from the air outlet.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of structural design of airborne electronic equipment, and in particular to a double-layer air duct heat dissipation chassis based on simulated honeycomb fins. Background Art

[0002] Airborne electronic equipment refers to various electronic equipment installed on aircraft, spacecraft, drones and other aircraft. With the continuous development of aerospace technology, airborne electronic equipment plays an increasingly important role in aircraft. Airborne electronic equipment can be divided into control equipment, navigation equipment, communication equipment, measurement equipment and detection equipment according to its function and purpose. Control equipment is used to control the attitude, speed, altitude and other parameters of the aircraft to ensure the safe flight of the aircraft. Navigation equipment is used to determine the position and direction of the aircraft so as to correctly navigate to the destination. Communication equipment is used to communicate with the ground control center and other aircraft. Measuring equipment is used to measure various physical parameters of the aircraft, such as air pressure, temperature, etc. Detection equipment is used to detect various status parameters of the aircraft, such as the remaining fuel, engine temperature, etc., so as to analyze and maintain the health status of the aircraft.

[0003] With the increase in the types and number of airborne recording devices, the working environment of airborne electronic equipment is becoming increasingly harsh, the power is getting higher and higher, and the heat dissipation problem is gradually becoming a bottleneck in its development.

[0004] Most of the current airborne electronic equipment chassis use ordinary straight fins as heat dissipation structures, but ordinary straight fins have low wind resistance, small heat dissipation area in limited space, small temperature difference between the air outlet temperature and the air inlet temperature, and can take away little heat, which is difficult to meet the heat dissipation requirements of high-heat modules in airborne electronic equipment. In addition, the current airborne electronic equipment chassis usually only has a single-layer air duct, and the heat dissipation capacity is limited. Summary of the invention

[0005] In view of this, the embodiment of the present application aims to provide a double-layer air duct heat dissipation chassis based on imitation honeycomb fins, which can greatly increase the heat dissipation area of ​​the air duct, enhance the structural strength of the chassis, increase the utilization efficiency of the cooling air, and achieve efficient heat dissipation for multiple high-heat generating functional modules inside the airborne electronic equipment.

[0006] To achieve the above-mentioned purpose, the embodiment of the present application proposes a double-layer air duct heat dissipation chassis based on imitation honeycomb fins, comprising: imitation honeycomb fins (1), a front panel component (2), a box frame (3), a high-heat-generating functional module (4), a motherboard (5), a rear panel component (6), a fan (7), an air cavity (8), a first-layer imitation honeycomb air duct (9), a second-layer imitation honeycomb air duct (10) and an upper cover component (11), wherein an air outlet (12) is provided on the upper cover component (11); the motherboard (5) is mounted inside the box frame (3), the high-heat-generating functional module (4) is mounted on the motherboard (5) and is also placed inside the box frame (3), two imitation honeycomb fins (1) are respectively mounted on the left and right sides of the box frame (3), and the front panel component (2) is mounted on the box frame (3). The rear panel component (6) is mounted on the front side of the box frame (3), a wind cavity (8) is formed between the motherboard (5) and the rear panel component (6), a fan (7) is mounted on the rear panel component (6), a first layer of imitation honeycomb wind duct (9), a second layer of imitation honeycomb wind duct (10) and an upper cover component (11) are sequentially mounted on the top of the box frame (3) from bottom to top, and an air outlet (12) provided on the upper cover component (11) faces the wind cavity (8); the imitation honeycomb fin (1) is used to provide lateral heat dissipation for the high-heat functional module (4); the fan (7) is used to blow high-pressure air into the box when the high-heat functional module (4) is working, and the high-pressure air flows into the first layer of imitation honeycomb wind duct (9) through the wind cavity (8), then enters the second layer of imitation honeycomb wind duct (10), and finally is discharged from the air outlet (12).

[0007] To achieve the above-mentioned purpose, an embodiment of the present application also proposes a chassis assembly method, which is suitable for assembling a double-layer duct heat dissipation chassis based on imitation honeycomb fins as described above, comprising the following steps: installing a flexible motherboard on the inside of the chassis frame by screws, inserting a high-heat-generating functional module on the motherboard and placing it on the inside of the chassis frame; brazing the first layer of imitation honeycomb duct, the second layer of imitation honeycomb duct and the upper cover component with an air outlet from bottom to top into one, and installing them on the top of the chassis frame by screws; installing two imitation honeycomb fins and the rear panel component on both sides and the rear side of the chassis frame respectively by screws, and then installing the fan on the rear panel component by screws; wherein, an air cavity is formed between the motherboard and the rear panel component, and the air outlet opened on the upper cover component faces the air cavity; installing the front panel component on the front side of the chassis frame by screws to complete the assembly of the chassis.

[0008] The embodiment of the present application proposes a double-layer air duct heat dissipation chassis based on imitation honeycomb fins. Two imitation honeycomb fins are installed on the left and right sides of the chassis frame, providing lateral heat dissipation conditions for high-heat function modules. Compared with ordinary straight-wing fins, the imitation honeycomb fins increase the heat dissipation area, increase the convective heat transfer coefficient, effectively improve the heat dissipation capacity of the chassis, and can also strengthen the strength of parts. The first layer of imitation honeycomb air duct and the second layer of imitation honeycomb air duct cooperate with the air cavity and the air outlet opened on the upper cover plate component to form a double-layer imitation honeycomb air duct. The fan is directly facing the high-heat function module, and blows high-pressure air into the chassis when the high-heat function module is working. The high-pressure air flows into the first layer of imitation honeycomb air duct through the air cavity, and then enters the second layer of imitation honeycomb air duct, and finally is discharged from the air outlet. Not only does it reduce the weight of the chassis to a certain extent, but it also improves the utilization efficiency of cold air as much as possible, and well realizes the efficient heat dissipation of high-heat function modules with high heat flux density, greatly improving the heat dissipation performance of airborne electronic equipment.

[0009] In some optional embodiments, the first layer of simulated honeycomb air duct (9), the second layer of simulated honeycomb air duct (10) and the upper cover plate component (11) are brazed into one body and installed as a whole on the top of the box frame (3), and together with the two simulated honeycomb fins (1), the front panel component (2), the box frame (3) and the rear panel component (6) form the box body of the chassis. The first layer of simulated honeycomb air duct, the second layer of simulated honeycomb air duct and the upper cover plate component brazed into one body are more convenient to disassemble and install, reducing the difficulty of assembling the chassis.

[0010] In some optional embodiments, the high heat generating functional module (4) is not only mounted on the motherboard (5), but also closely attached to the guide rail of the first layer of the simulated honeycomb air duct (9) through a cold plate, and the material of the cold plate is carbon structural steel. The design of the cold plate closely attached effectively reduces the temperature of the guide rail and prolongs the service life of the double-layer simulated honeycomb air duct.

[0011] In some optional embodiments, the upper, lower and middle parts of the front panel component (2) are all provided with openings to provide air inlets, the motherboard (5) is provided with an opening for high-pressure air to blow in, the rear panel component (6) is provided with a fan installation slot with an opening, and the fan (7) is installed in the installation slot of the rear panel component (6) and directly faces the opening on the installation slot. The front panel component, the motherboard and the rear panel component are all provided with openings for high-pressure air to pass through, which can quickly realize cold air circulation, further improve the utilization efficiency of cold air, and thus further improve the heat dissipation performance of the onboard electronic equipment.

[0012] In some optional embodiments, the front panel component (2) is a quick-release component, and two handles are also provided on the front panel component (2) for quickly moving the chassis. The high-heat function module is inserted on the motherboard in the front-to-back direction, and the front panel component is also equipped with a handle quick-release component. Such a design makes it only necessary to remove the front panel component when replacing or taking out the high-heat function module, which greatly reduces the complexity of the operation.

[0013] In some optional embodiments, the two imitation honeycomb fins (1), the front panel component (2), the box frame (3), the rear panel component (6), the first layer of imitation honeycomb air duct (9), the second layer of imitation honeycomb air duct (10) and the upper cover component (11) are all made of titanium alloy. The titanium alloy material is strong and reliable, and can effectively protect the high-heat generating functional modules and motherboard in the chassis.

[0014] In some optional embodiments, the motherboard (5) is made of polyimide and / or polyester film as a substrate. The motherboard made of polyimide and / or polyester film as a substrate is highly flexible and durable, has a high wiring density, is light in weight, is shock-resistant, and is easy to bend, and is very suitable for use in airborne electronic equipment.

[0015] In some optional embodiments, each high-heat-generating functional module (4) is provided with a thermal conductive paste on its surface for rapid heat transfer, and the thermal conductive paste is made of silicone. The thermal conductive paste can better cooperate with the simulated honeycomb fins, the double-layer simulated honeycomb air duct and the fan to help the onboard electronic equipment dissipate heat.

[0016] In some optional embodiments, each high heat generating functional module (4) is also provided with a shock absorbing filling block on its surface for buffering the vibration inside the chassis, and the shock absorbing filling block is made of rubber. The shock absorbing filling block can fill the gap between each high heat generating functional module, thus providing good vibration buffering protection for each high heat generating functional module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] One or more embodiments are exemplarily described by the pictures in the corresponding drawings, and these exemplary descriptions do not constitute limitations on the embodiments.

[0018] Figure 1 It is an exploded view of a specific structure of a double-layer air duct heat dissipation chassis based on simulated honeycomb fins provided in one embodiment of the present application;

[0019] Figure 2 is a schematic structural diagram of an imitation honeycomb fin provided in one embodiment of the present application;

[0020] Figure 3 It is a flow chart of a chassis assembly method provided in another embodiment of the present application. DETAILED DESCRIPTION

[0021] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for the convenience of description, and the specific implementation of the present application should not be construed as any limitation, and the various embodiments can be combined and referenced with each other under the premise of no contradiction.

[0022] An embodiment of the present application proposes a double-layer duct heat dissipation chassis based on imitation honeycomb fins. The implementation details of the double-layer duct heat dissipation chassis based on imitation honeycomb fins proposed in this embodiment are specifically described below. The following content is only the implementation details provided for the convenience of understanding and is not necessary for the implementation of this solution.

[0023] The exploded diagram of the specific structure of a double-layer air duct heat dissipation chassis based on simulated honeycomb fins proposed in this embodiment can be shown as follows: Figure 1 As shown, it includes: an imitation honeycomb fin 1, a front panel component 2, a box frame 3, a high heat generating functional module 4, a motherboard 5, a rear panel component 6, a fan 7, an air cavity 8, a first layer of imitation honeycomb air duct 9, a second layer of imitation honeycomb air duct 10 and an upper cover component 11, and an air outlet 12 is provided on the upper cover component 11.

[0024] The motherboard 5 is installed inside the box frame 3, and multiple high-heat functional modules 4 are installed on the motherboard 5 and also placed inside the box frame 3. Two imitation honeycomb fins 1 are respectively installed on the left and right sides of the box frame 3, the front panel component 2 is installed on the front side of the box frame 3, and the rear panel component 6 is installed on the rear side of the box frame 3. An air cavity 8 is formed between the motherboard 5 and the rear panel component 6, and a fan 7 is installed on the rear panel component 6. The first layer of imitation honeycomb air duct 9, the second layer of imitation honeycomb air duct 10 and the upper cover component 11 are installed in sequence from bottom to top on the top of the box frame 3, and the air outlet 12 opened on the upper cover component 11 faces the air cavity 8.

[0025] The two imitation honeycomb fins 1 are used to provide lateral heat dissipation for the high-heat-generating functional module 4. The fan 7 is used to blow high-pressure air into the interior of the chassis when the high-heat-generating functional module 4 is working, and flows into the first-layer imitation honeycomb air duct 9 through the air cavity 8, and then enters the second-layer imitation honeycomb air duct 10, and is finally discharged from the air outlet 12, thereby taking the heat out of the chassis.

[0026] In one example, the structure of the simulated honeycomb fin is as follows Figure 2As shown, the hollow imitation honeycomb structure increases the heat dissipation area and the convection heat transfer coefficient compared to ordinary straight-wing fins, effectively improving the heat dissipation capacity of the chassis. At the same time, it can also enhance the strength of parts and provide protection for high-heat generating functional modules inside the chassis.

[0027] In one example, the first layer of imitation honeycomb air duct 9, the second layer of imitation honeycomb air duct 10 and the upper cover plate component 11 are brazed together and installed as a whole on the top of the box frame 3, and together with the two imitation honeycomb fins 1, the front panel component 2, the box frame 3 and the rear panel component 6 form the box body of the chassis.

[0028] It can be understood that the integrally brazed first-layer simulated honeycomb air duct, second-layer simulated honeycomb air duct and upper cover plate components are more convenient to disassemble and install, which effectively reduces the difficulty of assembling the chassis.

[0029] In one example, in addition to being mounted on the motherboard 5, the high-heat-generating functional module 4 is also attached to the guide rail of the first layer of the simulated honeycomb air duct 9 through a cold plate, and the cold plate is made of carbon structural steel. The design of the cold plate being attached to the guide rail effectively reduces the temperature of the guide rail and prolongs the service life of the double-layer simulated honeycomb air duct.

[0030] In one example, openings are provided at the upper, lower and middle parts of the panel component 2 to provide wind inlets, an opening is provided on the motherboard 5 for blowing in high-pressure wind, a fan mounting slot with an opening is provided on the rear panel component 6, and the fan 7 is installed in the mounting slot of the rear panel component 6 and facing the opening on the mounting slot.

[0031] The front panel components, motherboard and rear panel components are all provided with openings for high-pressure air to pass through, which can quickly realize cold air circulation and further improve the utilization efficiency of cold air, thereby further improving the heat dissipation performance of onboard electronic equipment.

[0032] In one example, the front panel component 2 is a quick-release component, and two handles are provided on the front panel component 2 for quickly moving the chassis.

[0033] It can be understood that the high-heat-generating functional module is inserted into the motherboard front to back, and the front panel component is equipped with a handle quick-release part. This design makes it only necessary to remove the front panel component when replacing or removing the high-heat-generating functional module, which greatly reduces the complexity of the operation.

[0034] In one example, the two imitation honeycomb fins 1, the front panel component 2, the box frame 3, the rear panel component 6, the first layer of imitation honeycomb air duct 9, the second layer of imitation honeycomb air duct 10 and the upper cover component 11 are all made of titanium alloy. Titanium alloy is strong and reliable, and can effectively protect the high-heat functional modules and motherboard in the chassis.

[0035] In one example, the motherboard 5 is made of polyimide and / or polyester film as a substrate. The motherboard made of polyimide and / or polyester film as a substrate is highly flexible and durable, has a high wiring density, is light in weight, is impact-resistant, and is easy to bend, and is very suitable for airborne electronic equipment.

[0036] In one example, each high-heat functional module 4 is provided with a thermal conductive paste on its surface for rapid heat transfer, and the thermal conductive paste is made of silicone material. The thermal conductive paste can better cooperate with the simulated honeycomb fins, double-layer simulated honeycomb air ducts and fans to help the onboard electronic equipment dissipate heat.

[0037] In one example, each high-heat functional module 4 is also provided with a shock-absorbing filling block on its surface to buffer the vibration inside the chassis, and the shock-absorbing filling block is made of rubber. The shock-absorbing filling block can well fill the gaps between the high-heat functional modules, providing good vibration buffering protection for the high-heat functional modules.

[0038] In this embodiment, two imitation honeycomb fins are installed on the left and right sides of the box frame, providing the high-heat functional module with lateral heat dissipation conditions. Compared with ordinary straight-wing fins, the imitation honeycomb fins increase the heat dissipation area, increase the convective heat transfer coefficient, effectively improve the heat dissipation capacity of the chassis, and can also strengthen the strength of the parts. The first layer of imitation honeycomb air duct and the second layer of imitation honeycomb air duct cooperate with the air cavity and the air outlet opened on the upper cover plate component to form a double-layer imitation honeycomb air duct. The fan is directly facing the high-heat functional module and blows high-pressure air into the chassis when the high-heat functional module is working. The high-pressure air flows into the first layer of imitation honeycomb air duct through the air cavity, and then enters the second layer of imitation honeycomb air duct, and finally is discharged from the air outlet. It not only reduces the weight of the chassis to a certain extent, but also improves the utilization efficiency of cold air as much as possible, and well realizes the efficient heat dissipation of the high-heat functional module with high heat flux density, greatly improving the heat dissipation performance of airborne electronic equipment.

[0039] Another embodiment of the present application proposes a chassis assembly method, which is suitable for assembling a double-layer air duct heat dissipation chassis based on imitation honeycomb fins as described in the above embodiment. The implementation details of the chassis assembly method proposed in this embodiment are specifically described below. The following content is only for the convenience of understanding the implementation details provided, and is not necessary for the implementation of this solution. The specific process of the chassis assembly method proposed in this embodiment can be as follows Figure 3 As shown, including:

[0040] S1, install the flexible motherboard inside the box frame by screws, insert the high heat function module on the motherboard and place it inside the box frame.

[0041] S2, brazing the first layer of the simulated honeycomb air duct, the second layer of the simulated honeycomb air duct and the upper cover plate component with the air outlet from bottom to top into one, and installing them on the top of the box frame by screws.

[0042] S3, install the two imitation honeycomb fins and the rear panel component on the two sides and the rear side of the box frame respectively by screws, and then install the fan on the rear panel component by screws, wherein an air cavity is formed between the motherboard and the rear panel component, and the air outlet opened on the upper cover component faces the air cavity.

[0043] S4. Install the front panel assembly on the front side of the chassis frame with screws to complete the assembly of the chassis.

[0044] The step division of the above methods is only for clear description. When implemented, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this application; adding insignificant modifications to the algorithm or process or introducing insignificant designs without changing the core design of the algorithm and process are all within the scope of protection of this application.

[0045] It is not difficult to find that this embodiment is an assembly method embodiment corresponding to the above embodiment, and this embodiment can be implemented in conjunction with the above embodiment. The relevant technical details and technical effects mentioned in the above embodiment are still valid in this embodiment, and in order to reduce repetition, they are not repeated here. Accordingly, the relevant technical details mentioned in this embodiment can also be applied in the above embodiment.

[0046] Another embodiment of the present application provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it can implement a chassis assembly method described in the above method embodiment.

[0047] That is, those skilled in the art can understand that all or part of the steps in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a program, and the program is stored in a storage medium, including a number of instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as: ROM), random access memory (Random Access Memory, referred to as: RAM), disk or optical disk and other media that can store program codes.

[0048] Those skilled in the art will appreciate that the above embodiments are specific embodiments for implementing the present application, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.

Claims

1. A double-layer air duct heat dissipation chassis based on simulated honeycomb fins, characterized in that: include: Imitation honeycomb fins (1), a front panel component (2), a box frame (3), a high-heat-generating functional module (4), a motherboard (5), a rear panel component (6), a fan (7), an air cavity (8), a first-layer imitation honeycomb air duct (9), a second-layer imitation honeycomb air duct (10) and an upper cover component (11), wherein an air outlet (12) is provided on the upper cover component (11); The motherboard (5) is mounted inside the box frame (3), the high heat function module (4) is mounted on the motherboard (5) and is also placed inside the box frame (3), two imitation honeycomb fins (1) are respectively mounted on the left and right sides of the box frame (3), the front panel component (2) is mounted on the front side of the box frame (3), the rear panel component (6) is mounted on the rear side of the box frame (3), an air cavity (8) is formed between the motherboard (5) and the rear panel component (6), the fan (7) is mounted on the rear panel component (6), the first layer of imitation honeycomb air duct (9), the second layer of imitation honeycomb air duct (10) and the upper cover component (11) are sequentially mounted on the top of the box frame (3) from bottom to top, and the air outlet (12) provided on the upper cover component (11) faces the air cavity (8); The simulated honeycomb fins (1) are used to provide lateral heat dissipation for the high heat generating functional module (4); The fan (7) is used to blow high-pressure air into the interior of the chassis when the high-heat functional module (4) is working, and the high-pressure air flows into the first-layer simulated honeycomb air duct (9) through the air cavity (8), then enters the second-layer simulated honeycomb air duct (10), and finally is discharged from the air outlet (12).

2. A double-layer air duct heat dissipation chassis based on simulated honeycomb fins according to claim 1, characterized in that: The first layer of the simulated honeycomb air duct (9), the second layer of the simulated honeycomb air duct (10) and the upper cover plate component (11) are brazed together and installed as a whole on the top of the box frame (3), and together with the two simulated honeycomb fins (1), the front panel component (2), the box frame (3) and the rear panel component (6) form the box body of the chassis.

3. A double-layer air duct heat dissipation chassis based on simulated honeycomb fins according to claim 2, characterized in that: In addition to being mounted on the motherboard (5), the high heat generating functional module (4) is also closely attached to the guide rail of the first layer of the simulated honeycomb air duct (9) through a cold plate, and the cold plate is made of carbon structural steel.

4. The double-layer air duct heat dissipation chassis based on simulated honeycomb fins according to claim 1 is characterized in that: The front panel component (2) is provided with openings at the top, bottom and middle parts to provide an air inlet, the motherboard (5) is provided with an opening for high-pressure air to blow in, the rear panel component (6) is provided with a fan installation slot with an opening, and the fan (7) is installed in the installation slot of the rear panel component (6) and is directly opposite to the opening on the installation slot.

5. A double-layer air duct heat dissipation chassis based on simulated honeycomb fins according to claim 4, characterized in that: The front panel component (2) is a quick-release component, and two handles are also provided on the front panel component (2) for quickly moving the chassis.

6. A double-layer air duct heat dissipation chassis based on simulated honeycomb fins according to any one of claims 1 to 5, characterized in that: The two imitation honeycomb fins (1), the front panel component (2), the box frame (3), the rear panel component (6), the first layer of imitation honeycomb air duct (9), the second layer of imitation honeycomb air duct (10) and the upper cover component (11) are all made of titanium alloy.

7. A double-layer air duct heat dissipation chassis based on simulated honeycomb fins according to any one of claims 1 to 5, characterized in that: The motherboard (5) is made of polyimide and / or polyester film as a base material.

8. A double-layer air duct heat dissipation chassis based on simulated honeycomb fins according to any one of claims 1 to 5, characterized in that: The surface of each high-heat-generating functional module (4) is provided with a thermal conductive paste for rapidly transferring heat, and the thermal conductive paste is made of a silicone material.

9. A double-layer air duct heat dissipation chassis based on simulated honeycomb fins according to claim 8, characterized in that: The surface of each high-heat-generating functional module (4) is also provided with a shock-absorbing filling block for buffering the vibration inside the chassis, and the material of the shock-absorbing filling block is rubber material.

10. A chassis assembly method, characterized in that: A double-layer air duct heat dissipation chassis based on simulated honeycomb fins suitable for assembling as claimed in any one of claims 1 to 9, comprising: The flexible motherboard is mounted inside the box frame by screws, and the high-heat-generating functional module is inserted on the motherboard and placed inside the box frame; The first layer of the simulated honeycomb air duct, the second layer of the simulated honeycomb air duct and the upper cover plate component with the air outlet are brazed together from bottom to top, and are installed on the top of the box frame by screws; The two imitation honeycomb fins and the rear panel component are respectively installed on the two sides and the rear side of the box frame by screws, and the fan is then installed on the rear panel component by screws; wherein a wind cavity is formed between the motherboard and the rear panel component, and the air outlet opened on the upper cover component faces the wind cavity; Install the front panel assembly on the front side of the chassis frame using screws to complete the assembly of the chassis.

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