A semiconductor multi-level heat dissipation packaging control method and system with adaptive thermal management

Abstract

The present invention discloses a semiconductor multi-level heat dissipation packaging control method and system with adaptive thermal management, belonging to the field of semiconductor heat dissipation technology, which specifically includes: using a thermistor through a temperature detection unit to monitor the core temperature of a semiconductor device in real time and transmit it to a control unit, after the control unit compares it with preset low temperature, medium temperature and high temperature thresholds, it sends different levels of heat dissipation control signals to a heat dissipation execution unit according to the results, and the heat dissipation execution unit starts the corresponding primary, intermediate, intermediate-advanced or advanced heat dissipation module and feeds back the operating status; during operation, the control unit continuously monitors the temperature to evaluate the heat dissipation effect and adjusts the heat dissipation level; when the semiconductor device stops or enters low-power standby, it sends a signal to the control unit to let the heat dissipation execution unit turn off the heat dissipation module; the method can adaptively control the heat dissipation according to the working status of the semiconductor, ensure the performance and stability of the device, improve the heat dissipation efficiency and save energy.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor heat dissipation, and specifically relates to a semiconductor multi-stage heat dissipation packaging control method and system for adaptive thermal management. Background Art

[0002] With the continuous development of semiconductor technology, the power density of semiconductor devices has been continuously increasing, and the heat dissipation problem has become a key factor restricting their performance and reliability. Traditional heat dissipation packaging methods often adopt fixed heat dissipation structures and strategies, and it is difficult to adapt to the changing heat dissipation requirements of semiconductor devices under different working conditions. Under high-load working conditions, the semiconductor device may overheat due to insufficient heat dissipation, affecting its performance and lifespan; while under low-load working conditions, excessive heat dissipation may cause energy waste. Therefore, a control method that can adaptively adjust heat dissipation according to the real-time working state of semiconductor devices is needed.

[0003] As disclosed in the Chinese patent with the authorization announcement number CN104600041B, a packaging structure and packaging method for a double-sided heat dissipation semiconductor are provided, including: from bottom to top, a lead frame wrapped in a colloid, a first bonding material, a chip, a second bonding material, and a heat sink are included in sequence, and the first bonding material and the second bonding material contain high-temperature-resistant equal-diameter balls. The packaging method for the double-sided heat dissipation semiconductor includes preparing a lead frame; welding the chip on the chip seat using the first bonding material; welding the heat sink and the chip using the second bonding material; directly sending the lead frame welded with the heat sink into an oven for baking; pasting a primary film on the back of the lead frame, and after forming, the bottom surface of the chip seat and the top surface of the heat sink are both exposed outside the colloid. The first bonding material and the second bonding material contain high-temperature-resistant equal-diameter balls, and the overall thickness of the lead frame, chip, and heat sink before packaging is precisely controlled.

[0004] The above existing technologies all have the following problems: there are limitations in heat dissipation performance; the packaging structure is complex; and there is a lack of a dynamic temperature control mechanism. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention proposes a control method and system for multi-level heat dissipation packaging of semiconductors with adaptive thermal management. The temperature detection unit uses a thermistor to continuously monitor the core temperature of the semiconductor device in real time and transmits it to the control unit. After comparing with the preset low-temperature, medium-temperature, and high-temperature thresholds, the control unit sends different levels of heat dissipation control signals to the heat dissipation execution unit according to the results. The heat dissipation execution unit activates the corresponding primary, intermediate, or high-level heat dissipation modules and feeds back the operating status. During operation, the control unit continuously monitors the temperature to evaluate the heat dissipation effect and adjusts the heat dissipation level. When the semiconductor device stops or enters low-power standby, it sends a signal to make the control unit let the heat dissipation execution unit turn off the heat dissipation module. This method can adaptively regulate heat dissipation according to the working state of the semiconductor, ensure the performance and stability of the device, improve the heat dissipation efficiency and save energy.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A control method for multi-level heat dissipation packaging of semiconductors with adaptive thermal management, comprising:

[0008] Step S1: The temperature detection unit continuously monitors the core temperature of the semiconductor device in real time through a thermistor, and transmits the core temperature data monitored in real time to the control unit;

[0009] Step S2: After receiving the core temperature data from the temperature detection unit, the control unit compares it with the preset temperature thresholds, and the preset temperature thresholds include a low-temperature threshold, a medium-temperature threshold, and a high-temperature threshold;

[0010] Step S3: According to the comparison result of Step S2, if the core temperature is lower than the low-temperature threshold, the control unit sends a first-level heat dissipation control signal to the heat dissipation execution unit. If the core temperature is between the medium-temperature threshold and the low-temperature threshold, the control unit sends a second-level heat dissipation control signal to the heat dissipation execution unit. If the core temperature is between the medium-temperature threshold and the high-temperature threshold, the control unit sends a third-level heat dissipation control signal to the heat dissipation execution unit. If the core temperature is higher than the high-temperature threshold, the control unit sends a fourth-level heat dissipation control signal to the heat dissipation execution unit;

[0011] Step S4: The heat dissipation execution unit respectively activates the primary, intermediate, mid-high, and high-level heat dissipation modules to dissipate heat from the semiconductor device according to the received heat dissipation control signal, and feeds back the operating status information of the heat dissipation module to the control unit;

[0012] Step S5: While the heat dissipation module is operating, the control unit monitors the real-time temperature data, dynamically evaluates the heat dissipation effect according to the monitored real-time temperature data, and adjusts the heat dissipation strategy according to the evaluation result. The heat dissipation strategy refers to the switching of the heat dissipation level;

[0013] Step S6: When the semiconductor device stops working or enters the low-power standby state, the semiconductor device itself sends a state switching signal to the control unit. After receiving the signal, the control unit sends a stop cooling signal to the cooling execution unit, and the cooling execution unit turns off the cooling module.

[0014] Specifically, the specific steps of step S2 include:

[0015] S2.1: The control unit enables the data reception port or the interrupt service program and waits for the temperature detection unit to transmit the core temperature data. When the core temperature data arrives, it stores the core temperature data in a predefined buffer area or variable. , and when the core temperature data arrives, store the core temperature data in a predefined buffer area or variable;

[0016] S2.2: Read the low temperature threshold, medium temperature threshold, and high temperature threshold from the memory area or configuration file storing the preset thresholds, compare the core temperature data with the preset thresholds, and store the temperature comparison result data in the form of an identification variable. 、medium temperature threshold and high temperature threshold , compare the core temperature data with the preset thresholds, and store the temperature comparison result data in the form of an identification variable ;

[0017] If , the core temperature of the semiconductor device is in the low temperature range, and ;

[0018] If , the core temperature of the semiconductor device is in the medium temperature range, and ;

[0019] If , the core temperature of the semiconductor device is in the medium-high temperature range, and ;

[0020] If , the core temperature of the semiconductor device is in the high temperature range, and .

[0021] Specifically, the specific steps of step S3 include:

[0022] S3.1: Obtain the temperature comparison result of step S2, generate a corresponding cooling control signal according to the value. If , generate a first-level cooling control signal. If , generate a second-level cooling control signal. If , generate a third-level cooling control signal. If , generate a fourth-level cooling control signal;

[0023] S3.2: Add a parity bit to the generated cooling control signal , generate a new heat dissipation control signal, where represents the new heat dissipation control signal formed by padding zeros with an (r - 1)-bit polynomial for the generated heat dissipation control signal, represents the generating polynomial of the cyclic redundancy check, and r represents the number of bits of the generating polynomial;

[0024] S3.3: Send the generated new heat dissipation control signal to the heat dissipation execution unit through the communication interface between the control unit and the heat dissipation execution unit.

[0025] Specifically, the specific steps of step S4 include:

[0026] S4.1: The heat dissipation execution unit receives the new heat dissipation control signal, decodes and performs multiple checks on the new heat dissipation control signal using the signal feature recognition method. The formula is: , if it satisfies , it means that the multiple checks pass. According to the signal check result, combined with the real-time ambient temperature and the semiconductor device workload data, generate an optimal heat dissipation strategy. The optimal heat dissipation strategy includes the startup combination of the heat dissipation modules and the setting of the initial operating parameters, where represents the multiple check result, represents the heat dissipation control signal formed by padding zeros with an (r - 1)-bit polynomial for the new heat dissipation control signal;

[0027] S4.2: According to the generated heat dissipation strategy, the heat dissipation execution unit intelligently selects and starts the primary, intermediate, mid - high - level or high - level heat dissipation modules;

[0028] S4.3: During the heat dissipation process, the heat dissipation execution unit uses sensors to continuously monitor the operating status of each level of heat dissipation module and the temperature change of the semiconductor device. Once an abnormality or poor heat dissipation effect is found, immediately adjust the heat dissipation strategy and feedback the real - time heat dissipation effect and module operating status information to the control unit to form a closed - loop control.

[0029] Specifically, the specific steps of S4.2 include:

[0030] S4.21: If it is determined to be a normal heat dissipation instruction and corresponding to the primary heat dissipation requirement, start the primary heat dissipation module and output the status information that the primary heat dissipation module has been started and the heat sink temperature distribution data during the initial operation;

[0031] S4.22: When the heat dissipation control signal indicates a medium-level heat dissipation requirement, use the status information of the activated primary heat dissipation module and the heat sink temperature distribution data at the initial operation as inputs. Employ the intelligent fan speed regulation algorithm to comprehensively calculate the optimal fan speed curve based on the real-time temperature change rate of the semiconductor device, the ambient temperature, and the current temperature distribution factor of the heat sink. According to the calculation results, activate the intermediate heat dissipation module. Meanwhile, output the operation status information of the intermediate heat dissipation module and the temperature data of the current overall heat dissipation system. If it is found that the fan operation status is abnormal, immediately send a warning message to the control unit and perform self-repair. The fan speed curve formula is:

[0032] ;

[0033] Among them, represents the discrete fan speed curve, a and b represent the fan performance curve coefficients, represents the semiconductor device performance coefficient, represents the real-time temperature of the semiconductor device at time t, represents the ambient temperature at time t, represents the real-time temperature change rate of the semiconductor device at time t, represents the heat conduction coefficient of the heat sink, represents the current temperature of the heat sink at time t;

[0034] S4.23: If the signal analysis result is a medium-high-level heat dissipation requirement, use the operation status information of the intermediate heat dissipation module and the temperature data of the current overall heat dissipation system as inputs, partially activate the liquid cooling subsystem in the high-level heat dissipation module, and real-time feedback the flow rate, pressure, and heat exchange efficiency information of the liquid cooling subsystem to the control unit to obtain the operation status information of the overall heat dissipation system after activating the liquid cooling subsystem;

[0035] S4.24: If the signal analysis result is a high-level heat dissipation requirement, use the operation status information of the overall heat dissipation system after activating the liquid cooling subsystem as an input, fully activate all functions of the liquid cooling system, and operate in conjunction with the primary and intermediate heat dissipation modules at the maximum power.

[0036] Specifically, the signal feature recognition method in S4.1 is to convert the received new heat dissipation control signal into sampling points according to the byte stream and perform a fast Fourier transform to obtain the frequency spectrum information of the new heat dissipation control signal. Then, analyze whether there are specific frequency peaks or frequency distribution patterns in the frequency spectrum.

[0037] Specifically, the primary heat dissipation module is a small heat sink; the intermediate heat dissipation module is a fan heat dissipation device; the medium-high-level heat dissipation module and the high-level heat dissipation module are liquid cooling systems; the heat dissipation execution unit is connected to the primary, intermediate, and high-level heat dissipation modules through a power drive circuit.

[0038] An adaptive thermal management semiconductor multi - level heat dissipation packaging control system, comprising: a temperature detection module, a control module, and a heat dissipation execution module;

[0039] The temperature detection module is used to monitor the core temperature of the semiconductor device in real time and transmit the temperature data to the control unit;

[0040] The control module is used to receive the temperature data transmitted by the temperature detection unit, compare it with a preset temperature threshold, send a corresponding heat dissipation control signal to the heat dissipation execution unit according to the comparison result, monitor the temperature data during the heat dissipation process to dynamically evaluate the heat dissipation effect and adjust the heat dissipation strategy. At the same time, receive the state switching signal of the semiconductor device and send a stop heat dissipation signal to the heat dissipation execution unit;

[0041] The heat dissipation execution module is used to start the corresponding primary, intermediate, mid - high - level, and high - level heat dissipation modules to dissipate heat from the semiconductor device according to the heat dissipation control signal sent by the control unit, and feedback the operation state information of the heat dissipation module to the control unit. At the same time, receive the stop heat dissipation signal from the control unit and turn off the heat dissipation module.

[0042] Specifically, the control module includes: a data receiving unit, a threshold comparison unit, a strategy adjustment unit, and a signal sending unit;

[0043] The data receiving unit is used to receive the temperature data transmitted by the temperature detection unit;

[0044] The threshold comparison unit is used to compare the received temperature data with the preset low - temperature threshold, medium - temperature threshold, and high - temperature threshold, judge the temperature range, and thus determine the heat dissipation level to be adopted;

[0045] The strategy adjustment unit is used to evaluate the heat dissipation effect according to the real - time temperature data during the heat dissipation process and determine whether to switch the heat dissipation level according to the evaluation result;

[0046] The signal sending unit is used to send the heat dissipation control signal to the heat dissipation execution unit and send the stop heat dissipation signal to the heat dissipation execution unit.

[0047] Specifically, the heat dissipation execution module includes: a signal receiving unit, a heat dissipation module driving unit, and a state feedback unit;

[0048] The signal receiving unit is used to receive the heat dissipation control signal and the stop heat dissipation signal sent by the control unit;

[0049] The heat dissipation module driving unit is used to drive the primary heat dissipation module, intermediate heat dissipation module, mid - high - level heat dissipation module, and high - level heat dissipation module to start, stop, and adjust the power operation according to the received heat dissipation control signal;

[0050] The state feedback unit is used to feedback the operating state information of the heat dissipation module to the control unit.

[0051] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0052] 1. The present invention provides a control method for semiconductor multi-level heat dissipation packaging with adaptive thermal management. By real-time monitoring the core temperature of semiconductor devices and dynamically adjusting the heat dissipation strategy according to preset temperature thresholds, precise control and efficient management of heat dissipation are achieved. Different heat dissipation levels are flexibly switched according to the actual workload and temperature changes of semiconductor devices, thereby maximizing the heat dissipation efficiency and reducing energy consumption while ensuring the stability of the devices.

[0053] 2. The control method for semiconductor multi-level heat dissipation packaging with adaptive thermal management proposed by the present invention also has the ability of intelligent response and automatic adjustment. When the semiconductor device stops working or enters the low-power standby state, it can automatically turn off the heat dissipation module, avoiding unnecessary energy waste. At the same time, during the operation of the heat dissipation module, the control unit can continuously monitor the real-time temperature data and dynamically adjust the heat dissipation strategy according to the heat dissipation effect, ensuring the stability and reliability of the heat dissipation system. Description of the Drawings

[0054] Figure 1 It is a framework diagram of a control method for semiconductor multi-level heat dissipation packaging with adaptive thermal management according to the present invention;

[0055] Figure 2 It is an overall implementation flowchart of a control method for semiconductor multi-level heat dissipation packaging with adaptive thermal management according to the present invention;

[0056] Figure 3 It is an architecture diagram of a control system for semiconductor multi-level heat dissipation packaging with adaptive thermal management according to the present invention. Detailed Embodiments

[0057] Embodiment 1

[0058] Please refer to Figure 1 and Figure 2 A control method for semiconductor multi-level heat dissipation packaging with adaptive thermal management provided by the present invention includes the following steps:

[0059] Step S1: The temperature detection unit real-time monitors the core temperature of the semiconductor device through a thermistor and transmits the real-time monitored temperature data to the control unit;

[0060] Among them, the thermistor utilizes the characteristic that the resistance value of the thermistor changes with temperature to convert the temperature change into an electrical signal change, so as to accurately sense and collect the core temperature of the semiconductor device, and then transmit it to the control unit for subsequent processing.

[0061] Step S2: After the control unit receives the core temperature data from the temperature detection unit, it compares it with the preset temperature thresholds, and the preset temperature thresholds include a low temperature threshold, a medium temperature threshold, and a high temperature threshold;

[0062] Step S3: According to the comparison result in Step S2, if the core temperature is lower than the low temperature threshold, the control unit sends a first-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the low temperature threshold, the control unit sends a second-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the high temperature threshold, the control unit sends a third-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is higher than the high temperature threshold, the control unit sends a fourth-level heat dissipation control signal to the heat dissipation execution unit;

[0063] Step S4: The heat dissipation execution unit starts the primary, intermediate, mid-high and high-level heat dissipation modules to dissipate heat from the semiconductor device according to the received heat dissipation control signal, and feeds back the operation status information of the heat dissipation module to the control unit;

[0064] Step S5: While the heat dissipation module is running, the control unit monitors the real-time temperature data, dynamically evaluates the heat dissipation effect according to the monitored real-time temperature data, and adjusts the heat dissipation strategy according to the evaluation result, and the heat dissipation strategy refers to the switching of the heat dissipation level;

[0065] Further, the specific steps of Step S5 include:

[0066] (1) The control unit reads the real-time temperature data of the semiconductor device at an interval of every 100 milliseconds through the communication connection with the temperature detection unit, and stores these data in an array or buffer;

[0067] Exemplarily, assume the array for storing temperature data is , and the temperature value read each time is , then will be sequentially stored into .

[0068] (2) Calculate the temperature change rate: By The temperature change rate is obtained by performing differential calculation on the data in the figure, wherein the differential formula is the prior art content in this field and is not the inventive solution of the present application, and will not be described in detail here. At the same time, the temperature change rate reflects the control ability of the heat dissipation system on the temperature rise or fall of the semiconductor device. If the temperature change rate is close to zero or negative, it means that the heat dissipation effect is good; if the temperature change rate is large and positive, it means that the heat dissipation is insufficient;

[0069] (3) Calculate the average temperature deviation: Calculate All temperature values ​​in are consistent with the ideal operating temperature of semiconductor devices The average value of the deviation. The smaller the average temperature deviation, the better the heat dissipation system can maintain the temperature of the semiconductor device near the ideal operating temperature, and the better the heat dissipation effect. The average calculation formula is the existing technical content in this field, which is not the inventive solution of this application and will not be elaborated here;

[0070] (4) Formulate cooling strategy adjustment rules based on the calculated temperature change rate and average temperature deviation. For example, if the temperature change rate is greater than a preset change rate threshold and the average temperature deviation is greater than a preset average temperature deviation threshold, it is considered that the cooling effect is poor and the cooling level needs to be increased; if the temperature change rate is less than zero and the average temperature deviation is less than the preset average temperature deviation threshold, consider lowering the cooling level to save energy;

[0071] (5) When deciding to adjust the heat dissipation level, the control unit generates a corresponding heat dissipation control signal, such as upgrading the current level 2 heat dissipation control signal to a level 3 heat dissipation control signal or reducing it to a level 1 heat dissipation control signal.

[0072] Step S6: When the semiconductor device stops working or enters a low-power standby state, the semiconductor device itself sends a state switching signal to the control unit. After receiving the signal, the control unit sends a stop heat dissipation signal to the heat dissipation execution unit, and the heat dissipation execution unit turns off the heat dissipation module.

[0073] It should be understood that when the heat dissipation execution unit turns off the heat dissipation module, in the current operation cycle of the semiconductor device, that is, from working to stopping or standby, the main control process directly related to heat dissipation has been completed, so it can be used as the end point of a relatively complete heat dissipation packaging control process. After the semiconductor device stops working or enters a low-power standby state, no heat is generated or very little heat is generated, and the heat dissipation system does not need to run continuously. At this time, turning off the heat dissipation module can save energy and avoid unnecessary equipment wear. Therefore, for the heat dissipation management control during the operation of semiconductor devices, turning off the heat dissipation module is a relatively complete end link, which covers the key processes from temperature monitoring and judgment to the implementation of heat dissipation strategies and finally stopping heat dissipation.

[0074] The specific steps of step S2 include:

[0075] S2.1: The control unit activates the data reception port or the interrupt service program and waits for the core temperature data transmitted by the temperature detection unit. When the core temperature data arrives, store the core temperature data in a predefined buffer area or variable.

[0076] S2.2: Read the low temperature threshold, medium temperature threshold and high temperature threshold from the memory area or configuration file storing the preset thresholds, and compare the core temperature data with the preset thresholds, and store the temperature comparison result data in the form of an identification variable .

[0077] If , the core temperature of the semiconductor device is in the low temperature range, and ;

[0078] If , the core temperature of the semiconductor device is in the medium temperature range, and ;

[0079] If , the core temperature of the semiconductor device is in the medium-high temperature range, and ;

[0080] If , the core temperature of the semiconductor device is in the high temperature range, and .

[0081] The specific steps of step S3 include:

[0082] S3.1: Obtain the temperature comparison result of step S2, generate a corresponding heat dissipation control signal according to the value. If , generate a first-level heat dissipation control signal. If , generate a second-level heat dissipation control signal. If , generate a third-level heat dissipation control signal. If , generate a fourth-level heat dissipation control signal;

[0083] S3.2: Add a parity bit to the generated heat dissipation control signal to generate a new heat dissipation control signal, where represents the new heat dissipation control signal formed by padding the generated heat dissipation control signal with r - 1 bits of polynomials, represents the generating polynomial for cyclic redundancy check, and r represents the number of bits of the generating polynomial;

[0084] S3.3: Send the newly generated heat dissipation control signal to the heat dissipation execution unit through the communication interface between the control unit and the heat dissipation execution unit.

[0085] The specific steps of step S4 include:

[0086] S4.1: The heat dissipation execution unit receives the new heat dissipation control signal, decodes and performs multiple checks on the new heat dissipation control signal using the signal feature recognition method. The formula is: , if it satisfies , it means that the multiple checks pass. According to the signal check result, combined with the real-time ambient temperature and the semiconductor device workload data, an optimal heat dissipation strategy is generated. The optimal heat dissipation strategy includes the startup combination of the heat dissipation modules and the setting of the initial operating parameters. Among them, represents the multiple check result, represents the heat dissipation control signal formed after padding r - 1 bits of polynomial zeros to the new heat dissipation control signal;

[0087] S4.2: According to the generated heat dissipation strategy, the heat dissipation execution unit intelligently selects and starts the primary, intermediate, mid - high - level or high - level heat dissipation modules;

[0088] S4.3: During the heat dissipation process, the heat dissipation execution unit uses sensors to continuously monitor the operating status of each level of heat dissipation modules and the temperature change of the semiconductor device. Once an abnormality or poor heat dissipation effect is found, the heat dissipation strategy is immediately adjusted, and the real - time heat dissipation effect and module operating status information are fed back to the control unit to form a closed - loop control.

[0089] The specific steps of S4.2 include:

[0090] S4.21: If it is determined to be a normal heat dissipation instruction and corresponding to the primary heat dissipation requirement, start the primary heat dissipation module, and output the status information that the primary heat dissipation module has been started and the heat sink temperature distribution data during the initial operation;

[0091] S4.22: If the heat dissipation control signal indicates an intermediate heat dissipation requirement, use the status information that the primary heat dissipation module has been started and the heat sink temperature distribution data during the initial operation as inputs, and use the intelligent wind speed adjustment algorithm to comprehensively calculate the optimal fan speed curve according to the real - time temperature change rate of the semiconductor device, the ambient temperature and the current temperature distribution factors of the heat sink. According to the calculation result, start the intermediate heat dissipation module. At the same time, output the operating status information of the intermediate heat dissipation module and the temperature data of the current overall heat dissipation system , if it is found that the fan operating status is abnormal, immediately send a warning message to the control unit and perform self - repair. The fan speed curve formula is:

[0092] ;

[0093] Among them, represents the discrete fan speed curve, and a and b represent the performance curve coefficients of the fan. represents the performance coefficient of the semiconductor device. represents the real-time temperature of the semiconductor device at time t. represents the ambient temperature at time t. represents the real-time temperature change rate of the semiconductor device at time t. represents the heat conduction coefficient of the heat sink. represents the current temperature of the heat sink at time t. represents the actual speed of the fan. represents the current of the fan. represents the desired heat dissipation power. represents the temperature of the semiconductor device. represents the temperature distribution of the heat sink. represents the ambient temperature;

[0094] Furthermore, the set current range for the normal operation of the fan is , and the speed range is , where , respectively represent the minimum and maximum values of the current when the fan is operating normally. , respectively represent the minimum and maximum values of the speed when the fan is operating normally;

[0095] If , or , it is considered that the fan is operating abnormally;

[0096] If , or , it is also considered that the fan is operating abnormally;

[0097] When an abnormality is detected, a warning message is sent to the control unit. Among them, the warning message is a data packet with an abnormality code. For example, 1 represents abnormal speed, and 2 represents abnormal current, and it is sent to the control unit through the communication interface.

[0098] Furthermore, when it is found that the fan speed is abnormal, such as when the speed is too low, the driving voltage of the fan is adjusted to restore the speed;

[0099] Exemplarily, assuming that there is a relationship between the fan speed and the driving voltage , if , the driving voltage can be increased, where represents the voltage-speed coefficient, represents the voltage after the increase in driving. Indicates the voltage adjustment increment.

[0100] S4.23: If the signal parsing result is a medium - high - level heat dissipation requirement, use the operating status information of the medium - level heat dissipation module and the temperature data of the current overall heat dissipation system as inputs, partially activate the liquid cooling subsystem in the high - level heat dissipation module, and real - time feedback the flow rate, pressure, and heat exchange efficiency information of the liquid cooling subsystem to the control unit to obtain the operating status information of the overall heat dissipation system after the activation of the liquid cooling subsystem;

[0101] Furthermore, the specific steps of S4.23 include:

[0102] (1) Obtain the operating status information of the medium - level heat dissipation module and the temperature data of the current overall heat dissipation system ;

[0103] (2) Calculate the coolant flow distribution ratio coefficient of the liquid cooling subsystem according to the operating status of the medium - level heat dissipation module and the overall temperature data , and determine the initial pressure setting value of the liquid cooling subsystem according to the difference between the core temperature and the ambient temperature of the semiconductor device , where, and represent the liquid cooling system coefficient, represents the temperature difference, represents the fin temperature of the i - th area, represents the average value of the fin temperature distribution, and M represents the number of fin areas;

[0104] (3) Start components such as pumps and valves in the liquid cooling subsystem according to the calculated flow ratio coefficient and pressure setting value, and use flow sensors, pressure sensors, and temperature sensors installed in the liquid cooling subsystem to respectively monitor the flow rate, pressure, and temperature difference between the inlet and outlet of the coolant in real - time;

[0105] (4) Calculate the heat exchange efficiency according to the flow rate, pressure, and temperature difference of the coolant , where, represents the specific heat capacity of the coolant, represents the real - time monitored flow rate of the coolant, represents the heating power of the semiconductor device;

[0106] (5) Package the flow rate, pressure, heat exchange efficiency, and sensor status information of the liquid cooling subsystem into a data frame according to the pre - set communication protocol format, and send it to the control unit through the communication interface between the heat dissipation execution unit and the control unit;

[0107] Integrate the operation information of the liquid cooling subsystem with the operation status information of the intermediate heat dissipation module and the overall temperature data to form the operation status information of the overall heat dissipation system after the activation of the liquid cooling subsystem.

[0108] S4.24: If the signal parsing result is a high-level heat dissipation requirement, use the operation status information of the overall heat dissipation system after the activation of the liquid cooling subsystem as the input, fully activate all functions of the liquid cooling system, and cooperate with the primary and intermediate heat dissipation modules to operate at the maximum power.

[0109] The signal feature recognition method in S4.1 is to convert the received new heat dissipation control signal into sampling points according to the byte stream, perform a fast Fourier transform to obtain the frequency spectrum information of the new heat dissipation control signal, and then analyze whether there are specific frequency peaks or frequency distribution patterns in the frequency spectrum.

[0110] The primary heat dissipation module is a small heat sink; the intermediate heat dissipation module is a fan heat dissipation device; the medium-high and high-level heat dissipation modules are liquid cooling systems; the heat dissipation execution unit is connected to the primary, intermediate, and high-level heat dissipation modules through a power drive circuit.

[0111] Embodiment 2

[0112] Please refer to Figure 3 , another embodiment provided by the present invention: A semiconductor multi-level heat dissipation packaging control system for adaptive thermal management, including:

[0113] A temperature detection module, a control module, and a heat dissipation execution module;

[0114] The temperature detection module is used to monitor the core temperature of the semiconductor device in real time and transmit the temperature data to the control unit, providing a key temperature information basis for the entire heat dissipation control process;

[0115] The control module is used to receive the temperature data transmitted by the temperature detection unit, compare it with the preset temperature threshold, send a corresponding heat dissipation control signal to the heat dissipation execution unit according to the comparison result, continuously monitor the temperature data during the heat dissipation process to dynamically evaluate the heat dissipation effect and adjust the heat dissipation strategy, and is also responsible for receiving the state switching signal of the semiconductor device and sending a stop heat dissipation signal to the heat dissipation execution unit;

[0116] The heat dissipation execution module is used to start the corresponding primary, intermediate, medium-high, and high-level heat dissipation modules to dissipate heat from the semiconductor device according to the heat dissipation control signal sent by the control unit, feedback the operation status information of the heat dissipation module to the control unit, and at the same time receive the stop heat dissipation signal from the control unit and turn off the heat dissipation module.

[0117] The control module includes: a data receiving unit, a threshold comparison unit, a strategy adjustment unit, and a signal sending unit;

[0118] A data receiving unit, which is used to receive the temperature data transmitted by the temperature detection unit to ensure the accurate acquisition and transmission of the data;

[0119] A threshold comparison unit, which is used to compare the received temperature data with preset low-temperature thresholds, medium-temperature thresholds, and high-temperature thresholds to determine the temperature range and thus determine the cooling level to be adopted;

[0120] A strategy adjustment unit, which is used to evaluate the cooling effect based on the real-time temperature data during the cooling process, such as calculating indicators like the temperature drop rate, and determine whether to switch the cooling level according to the evaluation results, such as increasing or decreasing the operating power of the cooling module, etc., and generate corresponding adjustment signals;

[0121] A signal sending unit, which is used to send cooling control signals and stop cooling signals to the cooling execution unit to achieve precise control of the cooling execution unit.

[0122] The cooling execution module includes: a signal receiving unit, a cooling module driving unit, and a status feedback unit;

[0123] A signal receiving unit, which is used to receive the cooling control signals and stop cooling signals sent by the control unit to make correct response actions;

[0124] A cooling module driving unit, which is used to drive the primary cooling module, intermediate cooling module, mid-high cooling module, and high-level cooling module to start, stop, and adjust power operation according to the received cooling control signals to ensure that the cooling module operates as required;

[0125] A status feedback unit, which is used to feedback the operating status information of the cooling module, such as whether the cooling module is operating normally, the current operating power, etc. to the control unit so that the control unit can comprehensively understand the operation of the cooling system and make more precise control decisions.

[0126] Those skilled in the art should understand that the embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present invention can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0127] The present invention is described with reference to the flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present invention. It should be understood that each flow and / or block in the flowchart and / or block diagram, and the combination of flows and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing device to produce a machine, such that the instructions executed by the processor of the computer or other programmable data processing device generate means for implementing the specified functions in one flow Figure 1 one flow or multiple flows and / or blocks Figure 1 or means for implementing the specified functions in one block or multiple blocks.

[0128] The embodiments of the present invention have been described above in conjunction with the accompanying drawings. However, the present invention is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present invention, those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments without departing from the spirit and scope of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A semiconductor multi-level heat dissipation packaging control method with adaptive thermal management, characterized in that: include: Step S1: The temperature detection unit monitors the core temperature of the semiconductor device in real time through the thermistor, and transmits the real-time monitored core temperature data to the control unit; Step S2: After receiving the core temperature data from the temperature detection unit, the control unit compares the data with a preset temperature threshold, wherein the preset temperature threshold includes a low temperature threshold, a medium temperature threshold and a high temperature threshold; Step S3: According to the comparison result of step S2, if the core temperature is lower than the low temperature threshold, the control unit sends a first-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the low temperature threshold, the control unit sends a second-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is between the medium temperature threshold and the high temperature threshold, the control unit sends a third-level heat dissipation control signal to the heat dissipation execution unit; if the core temperature is higher than the high temperature threshold, the control unit sends a fourth-level heat dissipation control signal to the heat dissipation execution unit; Step S4: the heat dissipation execution unit respectively starts the primary, intermediate, intermediate-advanced and advanced heat dissipation modules to dissipate heat for the semiconductor device according to the received heat dissipation control signal, and feeds back the operation status information of the heat dissipation modules to the control unit; Step S5: while the heat dissipation module is running, the control unit monitors the real-time temperature data, and dynamically evaluates the heat dissipation effect according to the monitored real-time temperature data, and adjusts the heat dissipation strategy according to the evaluation result, wherein the heat dissipation strategy refers to the switching of the heat dissipation level; Step S6: When the semiconductor device stops working or enters a low-power standby state, the semiconductor device itself sends a state switching signal to the control unit. After receiving the signal, the control unit sends a stop heat dissipation signal to the heat dissipation execution unit, and the heat dissipation execution unit turns off the heat dissipation module. The specific steps of step S2 include: S2.1: The control unit opens the data receiving port or interrupt service routine and waits for the temperature detection unit to transmit the core temperature data T data , when the core temperature data arrives, the core temperature data is stored in a predefined cache area or variable; S2.2: Read the low temperature threshold T from the memory area or configuration file storing the preset threshold low , Medium temperature threshold T mid and high temperature threshold T high , the core temperature data T data Compare with the preset threshold value and use the temperature comparison result data to identify variable B status Store in the form of; If T data <T low , the core temperature of the semiconductor device is in the low temperature range, and B status =0; If T low ≤T data <T mid , the core temperature of the semiconductor device is in the medium temperature range, and B status =1; If T mid ≤T data <T high , the core temperature of the semiconductor device is in the medium-high temperature range, and B status =2; If T data ≥T high , the core temperature of the semiconductor device is in the high temperature range, and B status =3; The specific steps of step S3 include: S3.1: Obtain the temperature comparison result of step S2, according to B status The corresponding heat dissipation control signal is generated by the value. If B status = 0, a first-level heat dissipation control signal is generated. If B status =1, a secondary cooling control signal is generated. If B status =2, a three-level heat dissipation control signal is generated. If B status =3, a four-level heat dissipation control signal is generated; S3.2: Adding a check bit to the generated heat dissipation control signal Generate a new heat dissipation control signal, where S data,r-1 represents a new heat dissipation control signal formed by padding the generated heat dissipation control signal with r-1 bits of polynomial zeros, G(x) represents a generating polynomial of a cyclic redundancy check, and r represents the number of bits of the generating polynomial; S3.3: Sending the generated new heat dissipation control signal to the heat dissipation execution unit through the communication interface between the control unit and the heat dissipation execution unit.

2. The semiconductor multi-level heat dissipation packaging control method of adaptive thermal management according to claim 1, characterized in that: The specific steps of step S4 include: S4.1: The heat dissipation execution unit receives a new heat dissipation control signal, and uses a signal feature recognition method to decode and perform multiple checks on the new heat dissipation control signal. The formula is: If C is satisfied calculated = C, it means that multiple checks have passed. According to the signal check result, combined with the real-time ambient temperature and semiconductor device workload data, an optimal heat dissipation strategy is generated. The optimal heat dissipation strategy includes the setting of the heat dissipation module startup combination and the preliminary operation parameters. Among them, C calculated Represents the multiple verification results, S′ data,r-1 represents a heat dissipation control signal formed by performing zero padding of an r-1-bit polynomial on the new heat dissipation control signal; S4.2: According to the generated cooling strategy, the cooling execution unit intelligently selects and starts the primary, intermediate, intermediate-advanced or advanced cooling module; S4.3: During the heat dissipation process, the heat dissipation execution unit uses sensors to monitor the operating status of each level of heat dissipation modules and the temperature changes of semiconductor devices in real time. Once an abnormality or poor heat dissipation effect is found, the heat dissipation strategy is adjusted immediately, and the real-time heat dissipation effect and module operating status information are fed back to the control unit to form a closed-loop control.

3. The semiconductor multi-level heat dissipation packaging control method with adaptive thermal management as claimed in claim 2, characterized in that: The specific steps of S4.2 include: S4.21: If it is determined to be a normal heat dissipation instruction and corresponds to the primary heat dissipation demand, the primary heat dissipation module is started, and the status information of the primary heat dissipation module being started and the heat sink temperature distribution data during the initial operation are output; S4.22: If the heat dissipation control signal indicates that there is an intermediate heat dissipation demand, the status information of the primary heat dissipation module being started and the temperature distribution data of the heat sink during initial operation are used as input, and the intelligent wind speed adjustment algorithm is used to comprehensively calculate the optimal fan speed curve based on the real-time temperature change rate of the semiconductor device, the ambient temperature and the current temperature distribution factors of the heat sink. Based on the calculation results, the intermediate heat dissipation module is started. At the same time, the operating status information of the intermediate heat dissipation module and the temperature data of the current overall heat dissipation system are output. If the fan operating status is found to be abnormal, an early warning message is immediately sent to the control unit and self-repair is performed. The fan speed curve formula is: Where n(t) represents the discrete fan speed curve, a and b represent the fan performance curve coefficients, and C th Represents the performance coefficient of semiconductor devices, T device,t Represents the real-time temperature of the semiconductor device at time t, T environ,t represents the ambient temperature at time t, represents the real-time temperature change rate of the semiconductor device at time t, k sink Indicates the heat transfer coefficient of the heat sink, T sink,t Indicates the current temperature of the heat sink at time t; S4.23: If the signal analysis result is a medium or high-level heat dissipation demand, the operation status information of the medium-level heat dissipation module and the temperature data of the current overall heat dissipation system are used as input, the liquid cooling subsystem in the advanced heat dissipation module is partially activated, and the flow rate, pressure and heat exchange efficiency information of the liquid cooling subsystem are fed back to the control unit in real time, so as to obtain the operation status information of the overall heat dissipation system after the liquid cooling subsystem is activated; S4.24: If the signal analysis result is a high-level heat dissipation requirement, the overall heat dissipation system operation status information after the liquid cooling subsystem is activated is used as input, all functions of the liquid cooling system are fully enabled, and the primary and intermediate heat dissipation modules are coordinated to operate at maximum power.

4. The semiconductor multi-level heat dissipation packaging control method of adaptive thermal management as claimed in claim 3, characterized in that: The signal feature recognition method in S4.1 is to convert the received new heat dissipation control signal into sampling points according to the byte stream, and perform fast Fourier transform to obtain the spectrum information of the new heat dissipation control signal, and then analyze whether there is a specific frequency peak or frequency distribution pattern in the spectrum.

5. The semiconductor multi-level heat dissipation packaging control method of adaptive thermal management as claimed in claim 4, characterized in that: The primary heat dissipation module is a small heat sink; the intermediate heat dissipation module is a fan heat dissipation device; the intermediate and advanced heat dissipation modules and the advanced heat dissipation module are liquid cooling systems; the heat dissipation execution unit is connected to the primary, intermediate and advanced heat dissipation modules through a power driving circuit.

6. An adaptive thermal management semiconductor multi-stage heat dissipation package control system, which is used to implement an adaptive thermal management semiconductor multi-stage heat dissipation package control method according to any one of claims 1 to 5, characterized in that: include: Temperature detection module, control module, heat dissipation execution module; The temperature detection module is used to monitor the core temperature of the semiconductor device in real time and transmit the temperature data to the control unit; The control module is used to receive the temperature data transmitted by the temperature detection unit, and compare it with the preset temperature threshold, and send a corresponding heat dissipation control signal to the heat dissipation execution unit according to the comparison result, monitor the temperature data during the heat dissipation process to dynamically evaluate the heat dissipation effect and adjust the heat dissipation strategy, and at the same time, receive the state switching signal of the semiconductor device and send a stop heat dissipation signal to the heat dissipation execution unit; The heat dissipation execution module is used to start the corresponding primary, intermediate, intermediate-advanced and advanced heat dissipation modules to dissipate heat for semiconductor devices according to the heat dissipation control signal sent by the control unit, and to feed back the operating status information of the heat dissipation module to the control unit, and at the same time receive the heat dissipation stop signal from the control unit and shut down the heat dissipation module.

7. The semiconductor multi-level heat dissipation packaging control system with adaptive thermal management as claimed in claim 6, characterized in that: The control module includes: a data receiving unit, a threshold comparison unit, a strategy adjustment unit, and a signal sending unit; The data receiving unit is used to receive the temperature data transmitted by the temperature detection unit; The threshold comparison unit is used to compare the received temperature data with the preset low temperature threshold, medium temperature threshold and high temperature threshold to determine the temperature range, thereby determining the heat dissipation level to be adopted; The strategy adjustment unit is used to evaluate the heat dissipation effect according to the real-time temperature data during the heat dissipation process, and determine whether the heat dissipation level needs to be switched according to the evaluation result; The signal sending unit is used to send a heat dissipation control signal to the heat dissipation execution unit, and send a heat dissipation stop signal to the heat dissipation execution unit.

8. The semiconductor multi-level heat dissipation packaging control system with adaptive thermal management as claimed in claim 7, characterized in that: The heat dissipation execution module includes: a signal receiving unit, a heat dissipation module driving unit, and a state feedback unit; The signal receiving unit is used to receive the heat dissipation control signal and the heat dissipation stop signal sent by the control unit; The heat dissipation module driving unit is used to drive the primary heat dissipation module, the intermediate heat dissipation module, the intermediate and advanced heat dissipation module and the advanced heat dissipation module to start, stop and adjust the power operation according to the received heat dissipation control signal; The state feedback unit is used to feed back the operating state information of the heat dissipation module to the control unit.

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