photovoltaic modules

By using through-wires to connect the solder ribbon and the grid lines of the solar cells in photovoltaic modules, the problem of solder ribbon and cell warping is solved, improving the reliability and yield of photovoltaic modules.

CN119486352BActive Publication Date: 2025-11-14JINKO SOLAR CO LTD +1
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Patent Information

Application Number
CN202411586827.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-07
Publication Date
2025-11-14
Estimated Expiration
2044-11-07

AI Technical Summary

Technical Problem

The different coefficients of thermal expansion between the solder ribbon and the solar cell make it easy for the solar cell to warp after welding with the solder ribbon, resulting in defects such as microcracks and broken cells, which affect the reliability and yield of photovoltaic modules.

Method used

Through-wires are used to connect the solder strip to the grid lines of the solar cell. The ends and middle parts of the solder strip are connected to different areas of the solar cell through through-wires, avoiding direct connection between the solder strip and the edge of the cell, and providing adequate room for movement to reduce warping and breakage problems.

Benefits of technology

This effectively avoids concentrated tension on the edges of the solar cells caused by the solder strips, reducing warping and breakage issues, and improving the reliability and yield of photovoltaic modules.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application relates to the field of photovoltaic technology and provides a photovoltaic module, including: a solar cell and a solder ribbon. The first surface of the solar cell has N first grid lines extending along a first direction, and the second surface of the solar cell has second grid lines. The first surface of the solar cell has a through-line, including a first through-line and a second through-line. The first through-line connects to the first grid lines arranged along a second direction up to the Ath first grid line; the second through-line connects to the Nth to the (N-B)th first grid lines arranged along the second direction. One end of the solder ribbon is connected to the Cth to the (N-D)th first grid lines arranged along the second direction, and the other end of the solder ribbon is connected to the second grid line of another solar cell. The photovoltaic module provided by this application at least helps to reduce the warpage problem of the solar cells in the photovoltaic module.
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Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a photovoltaic module. Background Technology

[0002] A solar cell is a device that directly converts light energy into electrical energy through the photoelectric effect or photochemical effect. A single solar cell cannot generate electricity directly. Several individual cells must be connected in series or parallel using solder strips and then tightly sealed to form a module before use. A solar cell module (also called a solar panel) is the core and most important component of a solar power generation system. The function of a solar cell module is to convert solar energy into electrical energy, which can then be either stored in batteries or used to power loads.

[0003] The connection between solar cells typically requires solder ribbons for current collection. In conventional welding, the solder ribbons are alloyed with the grid during the welding process. Due to the difference in thermal expansion coefficients and thermal conductivity between the solder ribbons and the solar cells, warping can easily occur after welding. Warping can lead to defects such as microcracks and broken cells, causing a decrease in reliability and yield during the final lamination of the solar modules. Summary of the Invention

[0004] This application provides a photovoltaic module that at least helps to reduce the warping problem of the solar cells in the photovoltaic module.

[0005] According to some embodiments of this application, one aspect of this application provides a photovoltaic module, including: a solar cell having a first side and a second side opposite to each other; the first side of the solar cell is provided with N first grid lines extending along a first direction, the first grid lines being spaced apart along a second direction; the second side of the solar cell is provided with second grid lines; the first side of the solar cell is provided with a through line, the through line including a first through line and a second through line, the first through line connecting the first grid lines to the Ath first grid lines arranged along the second direction, where A is a positive integer greater than or equal to 2; the second through line connecting the Nth first grid lines to the NBth first grid lines arranged along the second direction, where B is a positive integer greater than or equal to 1; a solder strip, one end of which is connected to the Cth first grid lines to the NDth first grid lines arranged along the second direction, where C is a positive integer greater than 1 and less than or equal to A, and D is a positive integer greater than or equal to 1 and less than or equal to B; the other end of which is connected to the second grid line of another solar cell.

[0006] In some embodiments, along the first direction, a portion of the solder strips are connected to the Cth first grid line via a first through-line, and another portion of the solder strips are directly connected to the Cth first grid line.

[0007] In some embodiments, the end of the solder strip connected to the Cth first grid line via a first through-line is further away from the first first grid line than the end of the solder strip directly connected to the Cth first grid line.

[0008] In some embodiments, the ratio of the width of the first through-line to the width of the solder strip along the first direction is 0.8 to 1.2.

[0009] In some embodiments, a pad is provided on a first gate line that is not connected to the first through line and the second through line, and the width of the pad is greater than the width of the first gate line along the second direction, and the solder strip is connected to the pad.

[0010] In some embodiments, the first grid line C has a welded portion, the width of which is greater than the width of the first grid line along the second direction, and the welded portion is connected to the solder strip; and / or, the first grid line ND has a welded portion, and the welded portion is connected to the solder strip.

[0011] In some embodiments, along the second direction, the length of the first through line is greater than or equal to the length of the second through line.

[0012] In some embodiments, the method further includes: adhesive dots located on the first surface, the solder ribbon being fixed to the first surface by a plurality of adhesive dots, and the end of the solder ribbon connected to the first through-line being fixed to the first through-line by adhesive dots.

[0013] In some embodiments, on any solder strip, the number of adhesive dots in the direction from the center of the first surface to the first through line is the first adhesive dot number, and the number of adhesive dots in the direction from the center of the first surface to the second through line is the second adhesive dot number, wherein the first adhesive dot number is greater than the second adhesive dot number.

[0014] In some embodiments, the adhesive dots that fix the end of the solder strip to the first through-line are located between the first first grid line and the Ath first grid line.

[0015] The technical solution provided in this application has at least the following advantages:

[0016] In the photovoltaic module provided in this application embodiment, a solder ribbon connects two adjacent solar cells to form a cell string. The first end of the solder ribbon is connected to a first grid line on a first surface of one solar cell, and the second end of the solder ribbon is connected to a second grid line on a second surface of another solar cell. On the first surface of one solar cell, A first grid lines near one edge of the solar cell are interconnected by a first through-line. The end of the solder ribbon is connected to the Cth grid line between the first and Ath first grid lines, so that the charge carriers on the first and Ath first grid lines can be transferred to the solder ribbon. Furthermore, the end of the solder ribbon is not connected to the first first grid line on one edge of the solar cell. This ensures that the initial connection position of the solder ribbon end to the solar cell is close to the center area of ​​the solar cell, so as to avoid large welding tension on the edge of the solar cell after the solder ribbon is welded, thereby avoiding the warping problem of the solar cell caused by the tension of the solder ribbon. Secondly, the B+ first grid lines near the other edge of the solar cell are interconnected by a second through line. The middle of the solder ribbon is connected to the ND first grid line between the Nth and NBth first grid lines, thus enabling the carriers on the Nth to NBth first grid lines to be transferred to the solder ribbon. Furthermore, the middle of the solder ribbon is not connected to the Nth first grid line at the other edge of the solar cell. This ensures that the connection point between the middle of the solder ribbon and the solar cell is close to the center of the solar cell. Since the part of the solder ribbon not connected to the solar cell extends from the first side of one solar cell to the second side of another solar cell, the connection point between the middle of the solder ribbon and the solar cell is close to the center of the solar cell, allowing the solder ribbon to have adequate movement space. When relative movement occurs between two adjacent solar cells, the part of the solder ribbon not connected to the solar cell can bear part of the tension. Compared to the solder ribbon being connected to the edge of the solar cell, this avoids the problem of solar cell fragmentation caused by concentrated tension between the solder ribbon and the edge of the solar cell. Attached Figure Description

[0017] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this application or in the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a photovoltaic module provided in an embodiment of this application;

[0019] Figure 2 A cross-sectional structural diagram of a photovoltaic module provided in an embodiment of this application;

[0020] Figure 3 This is a top view of the first side of a photovoltaic module provided in an embodiment of this application;

[0021] Figure 4 This is a top view of the second side of a photovoltaic module provided in an embodiment of this application;

[0022] Figure 5 This is a top view of the first side of another photovoltaic module provided in an embodiment of this application;

[0023] Figure 6 This is a top view of the first side of another photovoltaic module provided in an embodiment of this application. Detailed Implementation

[0024] In the description of the embodiments of this application, the technical terms "first", "second", etc. are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0025] In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0028] In the description of the embodiments of this application, technical terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0029] In the accompanying drawings corresponding to the embodiments of this application, the thickness and area of ​​the layers are enlarged for better understanding and ease of description. When describing a component on another component or on the surface of another component, the component may be "directly" located on the surface of the other component, or there may be a third component between the two components. Conversely, when describing a component on the surface of another component, or when another component is formed or disposed on the surface of a component, it indicates that there is no third component between the two components. Furthermore, when describing a component as being "generally" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a portion of the edge of the entire surface.

[0030] In the description of the embodiments of this application, when a component "includes" another component, other components are not excluded unless otherwise stated, and other components may be further included.

[0031] The terminology used in the description of the various embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various embodiments and the appended claims, the term "component" is also intended to include the plural form unless the context clearly indicates otherwise.

[0032] The embodiments of this application will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this application to facilitate a better understanding of the application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0033] Figure 1 This is a schematic diagram of the structure of a photovoltaic module provided in an embodiment of this application; Figure 2 A cross-sectional structural diagram of a photovoltaic module provided in an embodiment of this application; Figure 3 This is a top view of the first side of a photovoltaic module provided in an embodiment of this application; Figure 4 This is a top view of the second side of a photovoltaic module provided in an embodiment of this application. Figure 3 and Figure 4 For ease of explanation, the solder strip is shown in perspective, with the position of the solder strip corresponding to the dashed box as an example.

[0034] refer to Figures 1 to 4 The photovoltaic module includes: solar cells 100 and solder ribbons 200, each solder ribbon 200 connecting two adjacent solar cells 100. Each solar cell 100 has a first surface 101 and a second surface 102 facing each other. The solder ribbons 200 connect a first grid line 110 on the first surface 101 of one adjacent solar cell 100 to a second grid line 120 on the second surface 102 of the other solar cell 100. (Reference) Figure 3 The first surface 101 of the solar cell 100 has N first grid lines 110 extending along a first direction X, and the first grid lines 110 are spaced apart along a second direction Y. (Reference) Figure 4 The second surface 102 of the solar cell 100 is provided with M second grid lines 120 extending along the first direction X, and the second grid lines 120 are spaced apart along the second direction Y.

[0035] refer to Figure 3 The first surface 101 of the solar cell 100 is further provided with a through line 130, which includes a first through line 131 and a second through line 132. The first through line 131 connects the first first grid line 110 to the Ath first grid line 110 arranged along the second direction Y, where A is a positive integer greater than or equal to 2. Specifically, the first through line 131 connects the first first grid line 110 to the Ath first grid line 110 in the direction from the first edge 103 to the second edge 104 of the solar cell 100. The second through line 132 connects the Nth first grid line 110 to the NBth first grid line 110 arranged along the second direction Y, where B is a positive integer greater than or equal to 1. Specifically, the second through line 132 connects the first first grid line 110 to the B+1th first grid line 110 in the direction from the second edge 104 to the first edge 103 of the solar cell 100.

[0036] Reference Figures 1 to 4 The first end of the solder ribbon 200 is connected to the Cth first grid line 110 to the NDth first grid line 110 arranged along the second direction Y, where C is a positive integer greater than 1 and less than or equal to A, and D is a positive integer greater than or equal to 1 and less than or equal to B. The second end of the solder ribbon 200 is connected to the second grid line 120 of another solar cell 100.

[0037] In the photovoltaic module provided in this application embodiment, the solder ribbon 200 connects two adjacent solar cells 100 to form a cell string. The first end of the solder ribbon 200 is connected to the first grid line 110 on the first surface 101 of one solar cell 100, and the second end of the solder ribbon 200 is connected to the second grid line 120 on the second surface 102 of another solar cell 100. On the first surface 101 of a solar cell 100, A first grid lines 110 near one edge (i.e., the first edge 103) of the solar cell 100 are interconnected by a first through line 131. The end of the solder ribbon 200 is connected to the Cth grid line between the first grid line 110 and the Ath first grid line 110, so that the charge carriers on the first grid line 110 to the Ath first grid line 110 can be transferred to the solder ribbon 200. The end of the solder ribbon 200 is not connected to the first grid line 110 on one edge (i.e., the first edge 103) of the solar cell 100. Thus, the initial connection position of the end of the solder ribbon 200 to the solar cell 100 is close to the central region of the solar cell 100, so as to avoid the solder ribbon 200 causing a large welding pull on the edge of the solar cell 100 after welding, thereby avoiding the problem of warping of the solar cell 100 caused by the pull of the solder ribbon 200. Secondly, the B+1 first grid lines 110 near the other edge (i.e., the second edge 104) of the solar cell 100 are interconnected by the second through line 132. The middle part of the solder ribbon 200 is connected to the ND first grid line 110 between the Nth and NBth first grid lines 110, so that the charge carriers on the Nth to NBth first grid lines 110 can be transferred to the solder ribbon 200; and the middle part of the solder ribbon 200 is not connected to the Nth first grid line 110 at the other edge (i.e., the second edge 104) of the solar cell 100, so that the connection position between the middle part of the solder ribbon 200 and the solar cell 100 is close to the central region of the solar cell 100. The portion of the solder ribbon 200 that is not connected to the solar cell 100 extends from the first surface 101 of one solar cell 100 to the second surface 102 of another solar cell 100. The connection point between the middle portion of the solder ribbon 200 and the solar cell 100 is close to the central area of ​​the solar cell 100, which allows the solder ribbon 200 to have adequate room to move. When relative movement occurs between two adjacent solar cells 100, the portion of the solder ribbon 200 that is not connected to the solar cell 100 can bear part of the tensile force. Compared to the solder ribbon 200 being connected to the edge of the solar cell 100, this avoids the problem of fragmentation of the solar cell 100 due to the concentration of tensile force between the solder ribbon 200 and the edge of the solar cell 100.

[0038] It should be noted that, in Figure 3In this example, taking A as 3, B as 2, C as 2, and D as 1 as an example, this does not constitute a limitation on the values ​​of A, B, C, and D. The values ​​of A, B, C, and D can be adjusted according to the above relationship. For example, when A is 6, C can be 2, 3, 4, 5, or 6; when B is 7, D can be 1, 2, 3, 4, 5, 6, or 7. The total number N of the corresponding first gate lines 110 can be designed according to the actual situation.

[0039] In some embodiments, the solar cell 100 may be any one of a PERC cell (Passivated Emitter and Rear Cell), a PERT cell (Passivated Emitter and Rear Totally-diffused Cell), a TOPCon cell (Tunnel Oxide Passivated Contact Cell), or a HIT / HJT cell (Heterojunction Technology).

[0040] In some embodiments, the solar cell 100 can be a monocrystalline silicon solar cell, a polycrystalline silicon solar cell, an amorphous silicon solar cell, or a multi-component compound solar cell. Specifically, the multi-component compound solar cell can be a cadmium sulfide solar cell, a gallium arsenide solar cell, a copper indium selenide solar cell, or a perovskite solar cell.

[0041] refer to Figure 3 On the first surface 101, the first grid line 110, which is not connected to the first through line 131 and the second through line 132, may have a pad 111. Along the second direction Y, the width of the pad 111 is greater than the width of the first grid line 110. The solder ribbon 200 is electrically connected to the corresponding first grid line 110 through the pad 111. This can constitute a gridless solar cell 100. Reducing the laying of main grid lines can reduce the manufacturing cost of the solar cell 100, and the gridless design can shorten the carrier transport path and reduce the series resistance, thereby increasing the light-receiving area and improving the power of the photovoltaic module.

[0042] In some embodiments, reference Figure 3 Along the first direction X, the width of the pad 111 along the second direction Y first increases and then decreases. This can help increase the contact area between the pad 111 and the solder ribbon 200, improve the carrier transport efficiency, and at the same time help reduce the cost of the paste used in the pad 111.

[0043] In some embodiments, the Cth first gate line 110 has a weld portion 112, the width of which is greater than the width of the first gate line 110 along the second direction Y, and the weld portion 112 is connected to the end of the solder strip 200; and / or, the NDth first gate line 110 has a weld portion 112, the width of which is greater than the width of the first gate line 110, and the weld portion 112 is connected to the middle of the solder strip 200. The weld portion 112 can improve the welding pull and carrier transport efficiency between the Cth and / or NDth first gate lines 110 and the solder strip 200, so that the first to Ath first gate lines 110 and the Nth to NBth first gate lines 110 can all effectively conduct electrical transmission with the solder strip 200.

[0044] Along the first direction X, the width of the welded part 112 along the second direction Y first increases and then decreases. This can help increase the contact area between the welded part 112 and the welding strip 200, improve the carrier transport efficiency, and at the same time help reduce the cost of the slurry used in the welded part 112.

[0045] Figure 5 This is a top view of the first side of another photovoltaic module provided in an embodiment of this application.

[0046] refer to Figure 5 In some embodiments, along the first direction X, a portion of the solder ribbons 200 are connected to the Cth first gate line 110 via the first through-line 131, while another portion of the solder ribbons 200 are directly connected to the Cth first gate line 110. This reduces the number of first through-lines 131, thereby reducing the cost of the paste used for the first through-lines 131, and the connection between the first through-line 131 and the solder ribbons 200 helps to reduce the length of the carrier transport path and improve the efficiency of carrier transport.

[0047] In some embodiments, the end of the solder strip 200 connected to the Cth first grid line 110 via the first through line 131 may be located at the intersection of the Cth first grid line 110 and the first through line 131.

[0048] In other embodiments, the end of the solder ribbon 200 connected to the Cth first grid line 110 via the first through-line 131 is further away from the first first grid line 110 than the end of the solder ribbon 200 directly connected to the Cth first grid line 110. Thus, the end of a portion of the solder ribbon 200 can be further closer to the central region of the solar cell 100, thereby reducing the welding pull force exerted by the solder ribbon 200 on the edge of the solar cell 100 and reducing the warping problem of the solar cell 100.

[0049] In some embodiments, A can be equal to C, so that all the ends of the solder strips 200 can be connected to the first grid line 110 of the Ath (or the Cth)th through the first through line 131, so that all the ends of the solder strips 200 can be far away from the edge of the solar cell 100, so as to avoid the welding pull of the solder strips 200 on the edge of the solar cell 100 causing the solar cell 100 to warp.

[0050] When A equals C, along the second direction Y, the width of the Ath (or Cth) first gate line 110 can be greater than the width of the other first gate lines 110. Since the charge carriers on the first gate line 110 to the Ath (or Cth) first gate line 110 are all transmitted to the Ath (or Cth) first gate line 110 through the first through-line 131, and then transmitted to the solder strip 200 through the Ath (or Cth) first gate line 110, the Ath (or Cth) first gate line 110 needs to bear a larger amount of charge carriers. A larger width of the Ath (or Cth) first gate line 110 is beneficial to reduce internal resistance and improve charge carrier transmission efficiency.

[0051] In some embodiments, the width of the first through line 131 along the first direction X is greater than the width of the first gate line 110 along the second direction Y. The first through line 131 is used to connect multiple first gate lines 110. The larger width of the first through line 131 is beneficial to reducing the internal resistance of the first through line 131 and improving the carrier transport efficiency.

[0052] In some embodiments, the ratio of the width of the first through-line 131 to the width of the solder strip 200 along the first direction X is 0.8 to 1.2, for example, it can be 0.8, 0.9, 1, 1.1, or 1.2. Thus, the width of the first through-line 131 is relatively close to the width of the solder strip 200, which helps to reduce the internal resistance of the first through-line 131 and improve the carrier transport efficiency, while avoiding the large size of the first through-line 131 from blocking sunlight, thereby preventing a decrease in the light conversion efficiency of the solar cell 100.

[0053] refer to Figure 5 In some embodiments, along the first direction X, a portion of the solder ribbons 200 are connected to the ND first gate line 110 via second through-wires 132, while another portion of the solder ribbons 200 are directly connected to the ND first gate line 110. This reduces the number of second through-wires 132, thereby reducing the cost of the paste used for the second through-wires 132. Furthermore, the connection between the second through-wires 132 and the solder ribbons 200 helps to reduce the length of the carrier transport path and improve the efficiency of carrier transport.

[0054] In some embodiments, the welding point corresponding to the solder strip 200 connected to the ND first grid line 110 via the second through line 132 is located at the intersection of the second through line 132 and the ND first grid line 110.

[0055] In other embodiments, the solder joints of the solder ribbon 200 connected to the Nth first grid line 110 via the second through-line 132 are further away from the Nth first grid line 110 than the solder joints of the solder ribbon 200 directly connected to the Nth first grid line 110. Thus, the connection point between the middle portion of a portion of the solder ribbon 200 and the solar cell 100 can be further moved closer to the central region of the solar cell 100, thereby reducing the welding pull force exerted by the solder ribbon 200 on the edges of the solar cell 100 and reducing the warping problem of the solar cell 100.

[0056] In some embodiments, B can be equal to D, so that the middle portion of all solder strips 200 can be connected to the first grid line 110 of the ND strip (or NB strip) through the second through line 132, so that the middle portion of all solder strips 200 can be far away from the edge of the solar cell 100, so as to avoid the welding pull of the solder strips 200 on the edge of the solar cell 100 causing the solar cell 100 to warp.

[0057] When B can be equal to D, the width of the first gate line 110 of the NDth (or NBth) strip along the second direction Y can be greater than the width of the other first gate lines 110. Since the charge carriers on the Nth first gate line 110 to the NDth (or NBth) first gate line 110 are all transmitted to the NDth (or NBth) first gate line 110 through the second through-line 132, and then transmitted to the solder strip 200 through the NDth (or NBth) first gate line 110, the amount of charge carriers that the NDth (or NBth) first gate line 110 needs to bear is relatively large. The larger width of the NDth (or NBth) first gate line 110 is beneficial to reducing internal resistance and improving charge carrier transmission efficiency.

[0058] In some embodiments, the width of the second through line 132 along the first direction X is greater than the width of the first gate line 110 along the second direction Y. The second through line 132 is used to connect multiple first gate lines 110. The larger width of the second through line 132 is beneficial to reducing the internal resistance of the second through line 132 and improving the carrier transport efficiency.

[0059] In some embodiments, the ratio of the width of the second through-line 132 to the width of the solder strip 200 along the first direction X is 0.8 to 1.2, for example, it can be 0.8, 0.9, 1, 1.1, or 1.2. Thus, the width of the second through-line 132 is relatively close to the width of the solder strip 200, which helps to reduce the internal resistance of the second through-line 132, improve the carrier transport efficiency, and at the same time avoid the large size of the second through-line 132 from blocking sunlight, thereby preventing a decrease in the light conversion efficiency of the solar cell 100.

[0060] In some embodiments, the length of the first through line 131 along the second direction Y is greater than or equal to the length of the second through line 132. Thus, compared to the ND first grid line connected to the middle of the solder ribbon 200, the C first grid line 110 connected to the end of the solder ribbon 200 can be closer to the central region of the solar cell 100. The end of the solder ribbon 200 is more prone to warping or desoldering problems due to thermal expansion and contraction compared to the middle. The greater distance between the end of the solder ribbon 200 and the edge of the solar cell 100 minimizes these problems.

[0061] Figure 6 This is a top view of the first side of another photovoltaic module provided in an embodiment of this application.

[0062] refer to Figure 6 In some embodiments, the photovoltaic module may include: adhesive dots 113 located on the first surface 101; solder ribbon 200 fixed to the first surface 101 by multiple adhesive dots 113; and the end of the solder ribbon 200 connected to the first through-line 131 fixed to the first through-line 131 by adhesive dots 113. When the solder ribbon 200 is a low-temperature solder ribbon, after fixing the solder ribbon 200 to the first surface 101 of the solar cell 100 by adhesive dots 113, the solder ribbon 200 can be welded to the first grid line 110 on the first surface 101 using a subsequent lamination process, thereby avoiding problems such as stress warping of the cell, resulting in microcracks or cell breakage that are easily caused by high-temperature welding processes.

[0063] The end of the solder ribbon 200 is fixed to the first through-line 131 via adhesive dots 113. That is, the adhesive dots 113 are located between the first through-line 131 and the solder ribbon 200. Because the adhesive dots 113 are fluid, the first through-line 131 can guide the flow of the adhesive dots 113, preventing them from flowing to other areas of the first surface 101 of the solar cell 100, thus improving the stability of the adhesive dots fixing the solder ribbon 200. Simultaneously, since the first through-line 131 connects multiple first grid lines 110, the solder ribbon 200 can still acquire the corresponding charge carriers from the first to the Ath first grid lines 110. Similarly, the middle portion of the solder ribbon 200 connected to the second through-line 132 can be fixed to the second through-line 132 via adhesive dots 113.

[0064] In some embodiments, on any solder ribbon 200, the number of adhesive dots 113 in the direction from the center of the first surface 101 to the first through-line 131 is the first number of adhesive dots, and the number of adhesive dots 113 in the direction from the center of the first surface 101 to the second through-line 132 is the second number of adhesive dots, where the first number of adhesive dots is greater than the second number of adhesive dots. Since the end of the solder ribbon 200 is located near the first through-line 131 and the middle part of the solder ribbon 200 is located near the second through-line 132, the middle part of the solder ribbon 200 is affected by the downward pressure of another solar cell 100 and the rigidity of the solder ribbon 200 itself, making it easier for the end of the solder ribbon 200 to detach from the adhesive dots 113. Providing more adhesive dots 113 on the side of the solder ribbon 200 near the end is beneficial to improving the stability of the solder ribbon 200.

[0065] In some embodiments, the adhesive dots 113 fixing the end of the solder ribbon 200 to the first through-line 131 are located between the first gate line 110 and the Ath first gate line 110. This allows the remaining portion of the solder ribbon 200 to contact the portion of the first through-line 131 not covered by the adhesive dots 113 after the end of the solder ribbon 200 is fixed to the first through-line 131, thereby increasing the carrier transport path and improving carrier transport efficiency. Similarly, the adhesive dots 113 fixing the middle portion of the solder ribbon 200 to the second through-line 132 are located between the Nth first gate line 110 and the NBth first gate line 110.

[0066] refer to Figure 4 The second surface 102 of the solar cell 100 is also provided with a through-line 130, which includes a third through-line 133 and a fourth through-line 134. The third through-line 133 connects the first second grid line 120 to the Eth second grid line 120 arranged along the second direction Y, where E is a positive integer greater than or equal to 2. Specifically, the third through-line 133 connects the first second grid line 120 to the Eth second grid line 120 in the direction from the first edge 103 to the second edge 104 of the solar cell 100. The fourth through-line 134 connects the Mth second grid line 120 to the MFth second grid line 120 arranged along the second direction Y, where F is a positive integer greater than or equal to 1. Specifically, the fourth through-line 134 connects the first second grid line 120 to the F+1th second grid line 120 in the direction from the second edge 104 to the first edge 103 of the solar cell 100. The second end of the solder strip 200 is connected to the Gth second gate line 120 to the MHth second gate line 120 arranged along the second direction Y, where G is a positive integer greater than 1 and less than or equal to E, and H is a positive integer greater than or equal to 1 and less than or equal to F.

[0067] Reference Figures 1 to 4In two adjacent solar cells 100, when the first edge 103 of one solar cell 100 is adjacent to the second edge 104 of the other solar cell 100, the solder ribbon 200 extends from the first surface 101 of one solar cell 100 to the second surface 102 of the other solar cell 100. On the second surface 102 of the solar cell 100, E second grid lines 120 near one side edge (i.e., the first edge 103) of the connected other solar cell 100 are interconnected by a third through line 133. The middle part of the solder ribbon 200 is connected to the Gth second grid line 120 between the first second grid line 120 and the Eth second grid line 120, so that the charge carriers on the first second grid line 120 to the Eth second grid line 120 can be transferred to the solder ribbon 200; and the middle part of the solder ribbon 200 is not connected to the first second grid line 120 at the edge position (i.e., the first edge 103) of the solar cell 100, so that the middle part of the solder ribbon 200 is connected to the solar cell 100. The connection point of the battery 100 is close to the middle area of ​​the solar cell 100. The part of the solder ribbon 200 that is not connected to the solar cell 100 extends from the first surface 101 of the solar cell 100 to the second surface 102 of the solar cell 100. The middle part of the solder ribbon 200 can have adequate space for movement. When relative movement occurs between two adjacent solar cells 100, the part of the solder ribbon 200 that is not connected to the solar cell 100 can bear part of the tensile force. Compared with the solder ribbon 200 being connected at the edge of the solar cell 100, this can avoid the problem of the solar cell 100 breaking due to the concentrated tensile force between the solder ribbon 200 and the edge of the solar cell 100. Multiple second grid lines 120 on one side edge (i.e., second edge 104) away from the connected other solar cell 100 are interconnected by a fourth through line 134. The end of the solder ribbon 200 is connected to the MH second grid line 120 between the Mth second grid line 120 and the MFth second grid line 120, so that the charge carriers on the Mth second grid line 120 to the MFth second grid line 120 can be transferred to the solder ribbon 200. The end of the solder ribbon 200 is not connected to the Mth second grid line 120 at the edge position (i.e., second edge 104) of the solar cell 100. Thus, the final connection position of the end of the solder ribbon 200 is close to the middle region of the solar cell 100, so as to avoid the solder ribbon 200 causing a large welding pull on the edge position of the solar cell 100 after welding, thereby avoiding the warping problem of the solar cell 100 caused by the pull of the solder ribbon 200.

[0068] It should be noted that, in Figure 4In this example, using E as 3, F as 2, G as 2, and H as 1 does not constitute a limitation on the values ​​of E, F, G, and H. The values ​​of E, F, G, and H can be adjusted according to the above relationships. For example, when E is 6, G can be 2, 3, 4, 5, or 6; when F is 7, H can be 1, 2, 3, 4, 5, 6, or 7. The total number M of the corresponding second gate lines 120 can be designed according to the actual situation.

[0069] The portion of the second gate line 120 that is the same as or corresponding to the first gate line 110 in the aforementioned embodiment can be referred to the foregoing content.

[0070] Since both the third through-line 133 and the second through-line 132 are located in the middle of the solder strip 200, the design of the third through-line 133 can refer to the design of the second through-line 132 in the aforementioned embodiment. Since both the fourth through-line 134 and the first through-line 131 are located at the ends of the solder strip 200, the design of the fourth through-line 134 can refer to the design of the first through-line 131 in the aforementioned embodiment.

[0071] In some embodiments, adhesive dots 113 may also be provided on the second surface 102, and the method of setting adhesive dots 113 can refer to the method of setting adhesive dots 113 on the first surface 101.

[0072] refer to Figure 2 In some embodiments, the photovoltaic module further includes an encapsulation layer 300, which covers the surface of the solar cell 100. The material of the encapsulation layer 300 may be an organic encapsulation film such as ethylene-vinyl acetate copolymer (EVA) film, polyvinyl octene coelastomer (POE) film, or polyvinyl butyral (PVB) film.

[0073] refer to Figure 2 In some embodiments, the photovoltaic module further includes a cover plate 400, which includes a first cover plate 401 and a second cover plate 402. The first cover plate 401 covers the surface of the encapsulation layer 300 away from the first side 101 of the solar cell 100, and the second cover plate 402 covers the surface of the encapsulation layer 300 away from the second side 102 of the solar cell 100. The cover plate 400 can be a glass cover plate, a plastic cover plate, or other cover plate with light-transmitting function. In some embodiments, the surfaces of the first cover plate 401 and / or the second cover plate 402 facing the encapsulation layer 300 can be uneven surfaces, thereby increasing the utilization rate of incident light.

[0074] In the photovoltaic module provided in this application embodiment, a solder ribbon 200 connects two adjacent solar cells 100 to form a cell string. The first end of the solder ribbon 200 connects to a first grid line 110 on a first surface 101 of one solar cell 100, and the second end connects to a second grid line 120 on a second surface 102 of another solar cell 100. On the first surface 101 of one solar cell 100, A first grid lines 110 near one edge (i.e., the first edge 103) are interconnected by a first through-line 131. The end of the solder ribbon 200 connects to the Cth grid line between the first first grid line 110 and the Ath first grid line 110, thus enabling the charge carriers on the first first grid line 110 to all be able to...

[0075] JKS-20240594&0595-241689CN-CH-I is transmitted to the solder ribbon 200; and the end of the solder ribbon 200 is not connected to the first grid line 110 of one side edge (i.e., the first edge 103) of the solar cell 100. In this way, the initial connection position of the end of the solder ribbon 200 to the solar cell 100 is close to the central area of ​​the solar cell 100, so as to avoid the solder ribbon 200 causing a large welding pull on the edge of the solar cell 100 after welding, thereby avoiding the problem of warping of the solar cell 100 caused by the pull of the solder ribbon 200. Secondly, the B+1 first grid lines 110 near the other edge (i.e., the second edge 104) of the solar cell 100 are interconnected by the second through line 132. The middle part of the solder ribbon 200 is connected to the ND first grid line 110 between the Nth and NBth first grid lines 110, so that the charge carriers on the Nth to NBth first grid lines 110 can be transferred to the solder ribbon 200; and the middle part of the solder ribbon 200 is not connected to the Nth first grid line 110 at the other edge (i.e., the second edge 104) of the solar cell 100, so that the connection position between the middle part of the solder ribbon 200 and the solar cell 100 is close to the central region of the solar cell 100. The portion of the solder ribbon 200 that is not connected to the solar cell 100 extends from the first surface 101 of one solar cell 100 to the second surface 102 of another solar cell 100. The connection point between the middle portion of the solder ribbon 200 and the solar cell 100 is close to the central area of ​​the solar cell 100, which allows the solder ribbon 200 to have adequate room to move. When relative movement occurs between two adjacent solar cells 100, the portion of the solder ribbon 200 that is not connected to the solar cell 100 can bear part of the tensile force. Compared to the solder ribbon 200 being connected to the edge of the solar cell 100, this avoids the problem of fragmentation of the solar cell 100 due to the concentration of tensile force between the solder ribbon 200 and the edge of the solar cell 100.

[0076] Those skilled in the art will understand that the above embodiments are specific examples of implementing this application, and in practical applications, various changes in form and detail can be made without departing from the spirit and scope of this application. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this application; therefore, the scope of protection of this application should be determined by the scope defined in the claims.

Claims

1. A photovoltaic module, characterized in that, include: A solar cell has a first side and a second side facing each other. The first side of the solar cell has N first grid lines extending along a first direction, and the first grid lines are spaced apart along a second direction. The second side of the solar cell has second grid lines. The first side of the solar cell has a through-line, which includes a first through-line and a second through-line. The first through-line connects the first grid lines arranged along the second direction from the first grid line to the Ath first grid line, where A is a positive integer greater than or equal to 2. The second through-line connects the Nth grid lines arranged along the second direction to the NBth first grid lines, where B is a positive integer greater than or equal to 1. A solder strip, one end of which is connected to the Cth to the NDth first grid lines arranged along the second direction, where C is a positive integer greater than 1 and less than or equal to A, and D is a positive integer greater than or equal to 1 and less than or equal to B, and the other end of which is connected to the second grid line of another solar cell. The adhesive dots are located on the first surface. The solder ribbon is fixed to the first surface by a plurality of adhesive dots. The end of the solder ribbon connected to the first through-line is fixed to the first through-line by the adhesive dots. On any solder ribbon, the number of adhesive dots in the direction from the center of the first surface to the first through-line is the first number of adhesive dots, and the number of adhesive dots in the direction from the center of the first surface to the second through-line is the second number of adhesive dots. The first number of adhesive dots is greater than the second number of adhesive dots.

2. The photovoltaic module according to claim 1, characterized in that, Along the first direction, a portion of the solder strips are connected to the Cth first grid line via the first through-line, while another portion of the solder strips are directly connected to the Cth first grid line.

3. The photovoltaic module according to claim 2, characterized in that, Compared to the end of the solder strip that is directly connected to the first grid line C, the end of the solder strip that is connected to the first grid line C via the first through-line is further away from the first grid line.

4. The photovoltaic module according to claim 1, characterized in that, Along the first direction, the ratio of the width of the first through line to the width of the weld strip is 0.8 to 1.

2.

5. The photovoltaic module according to claim 1, characterized in that, The first gate line, which is not connected to the first through line and the second through line, has a pad. Along the second direction, the width of the pad is greater than the width of the first gate line, and the solder strip is connected to the pad.

6. The photovoltaic module according to claim 5, characterized in that, Article C: The first grid line has a welded portion, the width of which is greater than the width of the first grid line along the second direction, and the welded portion is connected to the solder strip; and / or, Article ND: The first grid line has the welded portion, and the welded portion is connected to the solder strip.

7. The photovoltaic module according to claim 1, characterized in that, Along the second direction, the length of the first through line is greater than or equal to the length of the second through line.

8. The photovoltaic module according to claim 1, characterized in that, The adhesive dot that fixes the end of the solder strip to the first through-line is located between the first first grid line and the Ath first grid line.

Citation Information

Patent Citations

  • Battery string and photovoltaic module

    CN117117017A

  • Photovoltaic module

    CN217719627U