Micro inclined hole machining method and device

Abstract

The invention relates to the technical field of tiny inclined hole machining, in particular to a tiny inclined hole machining method and device.The method comprises the steps that a laser is located at a first fixed position and emits laser to a punching position of a to-be-machined workpiece at a set angle, the to-be-machined workpiece is located at a second fixed position, and a blind hole is formed in the punching position through the laser; and the mechanical drill moves to the position of the blind hole, the axis of the mechanical drill coincides with the center line of the blind hole, the blind hole is drilled through through the mechanical drill, and therefore the inclined hole is formed. According to the technical scheme, the combined machining mode can avoid the problem of back damage to the back side structure of the micro inclined hole, the quality of the laser forming blind hole is better, the side wall of the laser forming blind hole has high perpendicularity, the probability of'cutter breakage 'of a mechanical drill bit can be reduced when the mechanical drill bit drills through the blind hole, and the machining efficiency is improved during repeated positioning. The axis of the mechanical drill and the center line of the blind hole are positioned, the positioning precision of the mechanical drill and the blind hole is higher, and the machining quality of the tiny inclined hole can be ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of micro-oblique hole processing, and in particular to a micro-oblique hole processing method and device. Background Art

[0002] Micro-slanted holes are a type of hole structure that is difficult to process. Currently, the processing methods for micro-slanted holes include mechanical drilling, electric spark drilling, laser drilling or electrolytic drilling. Among them, mechanical drilling has problems such as drill sticking and the presence of a metamorphic hardened layer, electric spark and laser processing have defects such as remelting layers, microcracks and heat effects, and electrolytic processing has problems such as low efficiency and long initial process preparation time.

[0003] The above processing method is a single processing method, which still has many defects. In addition, in a single processing operation, high precision control is required. If there is a deviation in the processing precision control, it is very easy to damage the structure after the hole to be processed.

[0004] In view of the above situation, a composite processing method can be adopted, that is, forming tiny inclined holes in steps. Although this method can effectively avoid the shortcomings of single processing, it also has problems such as complex methods and inaccurate repeated positioning. Summary of the invention

[0005] In order to solve at least the above technical problems existing in the prior art, the present invention provides a method and device for processing a micro-oblique hole.

[0006] On one hand, the present invention provides a method for processing a micro-oblique hole, the method comprising: a laser is located at a first fixed position and emits a laser at a set angle to a punching position of a workpiece to be processed, the workpiece to be processed is located at a second fixed position, the direction of the laser is adjusted by a galvanometer, so that the laser is located at the first fixed position and emits lasers at a set angle to multiple punching positions of the workpiece to be processed, and blind holes are formed at the punching positions by the laser; a mechanical drill bit moves to the blind hole position, and the axis of the mechanical drill bit coincides with the center line of the blind hole, and the blind hole is drilled through by the mechanical drill bit, thereby forming an oblique hole.

[0007] In some embodiments, the laser is a femtosecond laser transmitter, and the femtosecond laser is emitted to the punching position by the femtosecond laser transmitter to form a blind hole.

[0008] In some embodiments, after the blind hole is formed at the drilling position by the laser, the coordinate information of the blind hole is recorded; and the mechanical drill moves to the blind hole position according to the coordinate information.

[0009] On the other hand, the present invention also provides a micro-inclined hole processing device, comprising a laser and a mechanical drill; the laser is located at a first fixed position and is used to emit laser to a drilling position of a workpiece to be processed, so as to form a blind hole at the drilling position; the mechanical drill is used to move to the blind hole position, and drill through the blind hole by the mechanical drill, so as to form an inclined hole.

[0010] In some embodiments, the laser comprises a femtosecond laser.

[0011] In some embodiments, a galvanometer is further included, and the galvanometer is arranged on the laser path of the laser and is used to adjust the drilling position of the laser on the workpiece to be processed.

[0012] In some embodiments, it also includes a first fixing device and a second fixing device; the laser is fixed on the first fixing device, and the first fixing device is located at the first fixing position; the workpiece to be processed is fixed on the second fixing device, and the second fixing device is located at the second fixing position.

[0013] In some embodiments, there is a set distance between the first fixture and the second fixture, so that there is a set distance between the laser and the workpiece to be processed.

[0014] The present invention provides a method and device for processing tiny inclined holes. For the processing of tiny inclined holes, a composite processing method combining laser and mechanical drill is adopted. During processing, a laser is used to form a blind hole on a workpiece to be processed, and then a mechanical drill is used to drill through the blind hole to form the tiny inclined hole. The quality of the blind hole formed by laser by the composite processing method is better, and the side wall thereof has a higher verticality. When the mechanical drill drills through the blind hole, the probability of interference between the mechanical drill and the side wall during mechanical drilling can be reduced, thereby reducing the probability of "breaking the tool" of the mechanical drill. In addition, during repeated positioning, the axis of the mechanical drill and the center line of the blind hole are positioned, and the positioning accuracy of the mechanical drill and the blind hole is higher, which can ensure the processing quality of the tiny inclined hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other objects, features and advantages of the exemplary embodiments of the present invention will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, in which:

[0016] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0017] Figure 1 A flowchart of a method for machining a micro-oblique hole provided by an embodiment of the present invention;

[0018] Figure 2A schematic diagram of the structure of a micro-oblique hole processing device provided in an embodiment of the present invention;

[0019] Figure 3 A schematic diagram of laser processing in a micro-oblique hole processing device provided by an embodiment of the present invention;

[0020] Figure 4 A schematic diagram of a mechanical drill bit during processing in a micro-oblique hole processing device provided in an embodiment of the present invention.

[0021] In the figure:

[0022] 10: laser; 20: mechanical drill; 30: workpiece to be processed; 40: galvanometer; 50: first fixing device; 60: second fixing device;

[0023] 31: blind hole; 32: oblique hole. DETAILED DESCRIPTION

[0024] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0025] like Figure 1 As shown, an embodiment of the present invention provides a method for processing a micro-slanted hole, which adopts a composite processing method to form a micro-slanted hole. The composite method is a combination of laser processing and mechanical processing, that is, the laser is processed to form a blind hole on the workpiece to be processed to avoid damaging the structure behind the workpiece to be processed, and then the blind hole is drilled through by a mechanical drill bit to form the blind hole.

[0026] Methods include:

[0027] Step S10: The laser is located at a first fixed position and emits laser at a set angle to a punching position of the workpiece to be processed, and the workpiece to be processed is located at a second fixed position, and a blind hole is formed at the punching position by laser;

[0028] When processing a micro-oblique hole, there is a set angle between the formed micro-oblique hole and the surface of the workpiece to be processed. Therefore, in the laser processing step, there is a set angle between the laser and the surface of the workpiece to be processed. This angle can be achieved by adjusting the angle of the laser, or by adjusting the angle of the workpiece to be processed, or by adjusting the laser and the workpiece to be processed at the same time.

[0029] Among them, after the processing position is determined, the positions of the laser and the workpiece to be processed remain fixed; it may be necessary to set multiple tiny inclined holes on the workpiece to be processed, so the position of the laser needs to be changed during the processing. Therefore, the angle of the laser is adjusted by galvanometer adjustment. Specifically: the direction of the laser can be adjusted by the galvanometer, so that the laser is located at the first fixed position and emits the laser to multiple drilling positions of the workpiece to be processed at a set angle.

[0030] In this method, the positions of the laser and the workpiece to be processed (processing station) are fixed, and there is no need to adjust their positions during the processing, thereby saving time for adjusting the laser and / or the workpiece to be processed, and reducing errors caused by adjusting the laser and / or the workpiece to be processed, making the processing accuracy of tiny inclined holes more precise.

[0031] Furthermore, in the above processing method, the focal length of the laser can be made longer, which can avoid the interference between the laser and the workpiece to be processed due to the focal length being too short, thereby improving the laser processing quality of the blind hole.

[0032] For example, in an embodiment of the present invention, the laser is a femtosecond laser transmitter, which emits a femtosecond laser to the drilling position and forms a blind hole. For example, the parameter range of the femtosecond laser transmitter. When the femtosecond laser transmitter performs blind hole forming, its power is higher, so that the verticality of the side of the blind hole is higher, and when the side wall is vertical, the taper in the blind hole is reduced, which is beneficial to the drilling operation of the mechanical drill bit and reduces the probability of the mechanical drill bit "breaking the knife".

[0033] In an embodiment of the present invention, the method further includes:

[0034] Step S20: the mechanical drill bit moves to the blind hole position, and the axis of the mechanical drill bit coincides with the center line of the blind hole, and the blind hole is drilled through by the mechanical drill bit, thereby forming an inclined hole.

[0035] When using a composite processing method, repeated positioning issues are involved, and the mechanical drill bit needs to be precisely aligned with the blind hole (within the set error range). The mechanical drill bit can be extended and retracted linearly along the axis to drill through the blind hole.

[0036] The extension and contraction amount of the mechanical drill bit is controllable, and the blind hole can be drilled through by the mechanical drill bit. For example, the drilling angle of the mechanical drill bit is 135 degrees.

[0037] In the embodiment of the present invention, after a blind hole is formed at a drilling position by laser, coordinate information of the blind hole is recorded; and a mechanical drill moves to the position of the blind hole according to the coordinate information.

[0038] In the method of composite processing of micro-slanted holes, the requirement for repeated positioning is high to avoid the problem of deviation and "breakage" of the mechanical drill bit in the second part of the processing. In the embodiment of the present invention, when forming a blind hole, the position coordinate information of the formed blind hole is recorded, and then the mechanical drill bit uses the position coordinate information to move and drill through.

[0039] The same coordinate system is used when the blind hole is formed and when the mechanical drill is reprocessed. Under this coordinate system, the mechanical drill moves to the blind hole position to achieve the coincidence of the axis of the mechanical drill and the center line of the blind hole, effectively preventing the mechanical drill from contacting the surrounding structure of the blind hole or the side wall of the blind hole and causing "breakage of the drill".

[0040] For example, when adjusting the galvanometer, it is necessary to determine the drilling position of the laser, and then use the galvanometer to adjust the laser line to meet the blind hole processing at different drilling positions. Among them, when the galvanometer adjusts the line direction of the laser, the angle of the two reflectors can correspond to a coordinate value, that is, the coordinate information of the blind hole can be determined by the angle of the reflector. At this time, the coordinate information of the current drilling position can be determined and recorded through the change of the angle of the reflector. When the mechanical drill is processed, it can be moved to this position according to the coordinate information.

[0041] For example, the data information of the angle and coordinate value information of the reflector is pre-stored in a storage module. When in use, the data information is read and the coordinate information is finally determined after comparison.

[0042] Alternatively, for example, an auxiliary image acquisition device may be used to acquire the coordinate information of the blind hole. After the blind hole is formed, the image acquisition device is used to acquire the blind hole information, and the coordinate information of the blind hole is acquired through the image information.

[0043] For example, a coordinate system is established on the image information, and then the coordinate information of each blind hole in the coordinate system is determined, and the mechanical drill moves according to the coordinate information. In the embodiment of the present invention, the method for determining the coordinate information is not limited.

[0044] An embodiment of the present invention provides a micro-slanted hole processing device, including a laser and a mechanical drill. The laser emits laser, and uses the laser to form a blind hole on the workpiece to be processed, and uses a mechanical drill to drill through the blind hole. This composite processing method can avoid the back injury problem of the rear structure of the micro-slanted hole; and the processing operation of the micro-slanted hole is simple and fast, and the efficiency and accuracy are higher.

[0045] The following is a detailed description of the various structures of a micro-oblique hole processing device provided by an embodiment of the present invention, as well as the positional relationship and connection relationship between the various structures, in conjunction with the accompanying drawings.

[0046] like Figures 2 to 4As shown, in the embodiment of the present invention, the laser 10 is located at a first fixed position for emitting laser to the drilling position of the workpiece 30 to be processed, so as to form a blind hole 31 at the drilling position; the mechanical drill bit 20 is used to move to the position of the blind hole 31, and drill through the blind hole 31 by the mechanical drill bit 20, so as to form an inclined hole 32.

[0047] For example, in an embodiment of the present invention, the laser 10 includes a femtosecond laser 10, so that the femtosecond laser 10 emits laser to the workpiece 30 to be processed, and forms a blind hole 31 on the workpiece 30 to be processed. The wavelength range of the laser emitted by the femtosecond laser 10 is 1030±3mm, the output power is greater than 100W, and the single pulse energy is greater than 1mJ. The side wall of the blind hole 31 formed by the femtosecond laser emitted by the femtosecond laser 10 has a high verticality, that is, there is no slope or tends to be no slope. When the mechanical drill bit 20 is processed, the probability of the mechanical drill bit 20 contacting the side wall and causing "breakage" is reduced.

[0048] The micro-slanted hole 32 processing device includes two fixing devices, namely a first fixing device 50 and a second fixing device 60. The first fixing device 50 is located at a first fixing position, and the second fixing device 60 is located at a second fixing position. The laser 10 is fixed on the first fixing device 50, and the workpiece 30 to be processed is fixed on the second fixing device 60, thereby fixing the positions of the laser 10 and the workpiece 30 to be processed. For example, there is a set distance between the first fixing device 50 and the second fixing device 60, so that the laser 10 and the workpiece 30 to be processed have a set distance.

[0049] The embodiment of the present invention does not limit the specific structure of the first fixing device 50 and the second fixing device 60. For example, the fixing device may be a fixing bracket, a fixing fixture, or a fixing manipulator, etc. The laser 10 and the workpiece 30 to be processed may be kept at a set position by the first fixing device 50 and the second fixing device 60, or the laser 10 and the workpiece 30 to be processed may be moved and kept at the specified position again after reaching the specified position.

[0050] In the embodiment of the present invention, the positions of the laser 10 and the workpiece 30 to be processed are fixed, and the positions of the two are fixed after the pre-design is completed. It can be seen that in the composite processing process of the small inclined hole 32, only one position variable is repeatedly positioned twice, so after the repeated positioning is accurately controlled, the accuracy of the mechanical drill 20 during processing can be ensured.

[0051] For example, after the blind hole 31 is formed by laser, the coordinate information of the blind hole 31 is recorded, and the movement of the mechanical drill 20 is based on the coordinate information. That is, according to the coordinate information, the mechanical drill 20 moves to the position of the blind hole 31, at which time, the axis of the mechanical drill 20 coincides with the center line of the blind hole 31, and then the mechanical drill 20 extends, penetrates into the blind hole 31 and drills through the blind hole 31.

[0052] For example, the processing device of the micro-oblique hole 32 includes an image information acquisition device. After the blind hole 31 is processed, the position information of the blind hole 31 is acquired by using the image information acquisition device.

[0053] Continue to refer Figures 2 to 4 As shown, in the embodiment of the present invention, the micro-oblique hole 32 processing device further includes a galvanometer 40, which is disposed on the laser path of the laser 10 and is used to adjust the drilling position of the laser on the workpiece 30 to be processed.

[0054] If multiple tiny inclined holes 32 are to be processed on the workpiece 30 to be processed, it is necessary to change the relative position of the laser and the surface of the workpiece 30 to be processed. When the positions of the laser emitter and the workpiece 30 to be processed are fixed, it is necessary to introduce a galvanometer 40 to change the position of the laser. The change logic of the galvanometer 40 is designed in advance, and the laser path is changed by the galvanometer 40 to complete the processing of the blind holes 31 one by one.

[0055] In the embodiment of the present invention, the specific structure of the galvanometer 40 is not limited, and it only needs to meet the punching requirements of multiple punching positions.

[0056] It should be noted that the description of the micro-slanted hole 32 processing device in the embodiment of the present invention is similar to the description of the micro-slanted hole 32 processing method embodiment described above, and has similar beneficial effects as the method embodiment, so it is not repeated here. Figure 1 The present invention will be understood by referring to the description of the accompanying drawings.

[0057] The present invention provides a method and device for processing a micro-slanted hole. For processing the micro-slanted hole 32, a composite processing method combining laser and mechanical drill 20 is adopted. During processing, a blind hole 31 is formed on a workpiece 30 to be processed by a laser, and then the blind hole 31 is drilled through by the mechanical drill 20 to form the micro-slanted hole 32. The quality of the blind hole 31 formed by laser by the composite processing method is better, and its side wall has a higher verticality. When the mechanical drill 20 drills through the blind hole 31, the probability of "breaking" of the mechanical drill 20 can be reduced. In addition, when repeated positioning, the axis of the mechanical drill 20 and the center line of the blind hole 31 are positioned, and the positioning accuracy of the mechanical drill 20 and the blind hole 31 is higher, which can ensure the processing quality of the micro-slanted hole 32.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0059] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0060] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for machining a micro-oblique hole, characterized in that: The method comprises: The laser is located at a first fixed position and emits laser at a set angle to a punching position of a workpiece to be processed, and the workpiece to be processed is located at a second fixed position; Adjusting the direction of the laser by means of a galvanometer, so that the laser is located at a first fixed position and emits the laser at a set angle to the plurality of punching positions of the workpiece to be processed, and forming blind holes at the punching positions by means of the laser; The mechanical drill bit moves to the position of the blind hole, and the axis of the mechanical drill bit coincides with the center line of the blind hole. The mechanical drill bit drills through the blind hole, thereby forming an inclined hole.

2. The micro-oblique hole machining method according to claim 1, characterized in that: The laser is a femtosecond laser transmitter, which emits a femtosecond laser to the punching position and forms the blind hole.

3. The micro-oblique hole machining method according to claim 1, characterized in that: After forming the blind hole at the punching position by the laser, recording the coordinate information of the blind hole; The mechanical drill bit moves to the blind hole position according to the coordinate information.

4. A micro-oblique hole processing device, characterized in that: It comprises a laser (10) and a mechanical drill (20); The laser (10) is located at a first fixed position and is used to emit laser light to a punching position of a workpiece (30) to be processed, so as to form a blind hole (31) at the punching position; The mechanical drill bit (20) is used to move to the position of the blind hole (31), and drill through the blind hole (31) through the mechanical drill bit (20), thereby forming an inclined hole (32).

5. The micro-oblique hole processing device according to claim 4, characterized in that: The laser (10) comprises a femtosecond laser.

6. The micro-oblique hole processing device according to claim 4, characterized in that: It also comprises a galvanometer (40), which is arranged on the laser path of the laser (10) and is used to adjust the drilling position of the laser on the workpiece (30) to be processed.

7. The micro-oblique hole processing device according to claim 4, characterized in that: Also includes a first fixing device (50) and a second fixing device (60); The laser (10) is fixed on the first fixing device (50), and the first fixing device (50) is located at the first fixing position; The workpiece (30) to be processed is fixed on the second fixing device (60), and the second fixing device (60) is located at a second fixed position.

8. The micro-oblique hole processing device according to claim 7, characterized in that: There is a set distance between the first fixing device (50) and the second fixing device (60), so that there is a set distance between the laser (10) and the workpiece (30) to be processed.

Images