Optical module

Abstract

The optical module provided by the invention comprises a circuit board and a base. The circuit board surface is provided with a first gap part and a second gap part. A first light emitting component and a second light emitting component are arranged on the surface of the base. The first light emitting component and the second light emitting component are arranged on the same surface of the base, so that the area of the base is larger, and heat dissipation of the device is facilitated. As the circuit board is connected between the first gap part and the second gap part, the surface wiring of the circuit board between the first gap part and the second gap part can be fully utilized, and the wiring area is increased. And the first modulation driving chip is in routing connection with the surface of the circuit board between the first gap part and the second gap part. The surface of the circuit board is provided with a first light receiving part and a second light receiving part. The first light receiving component comprises a first refraction piece and a first light receiving chip. The first refraction piece and the first light receiving chip are respectively fixed on the surface of the first substrate with a small thermal expansion coefficient, so that the thermal deformation of the first substrate is small, and the stability of a light path can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules, as one of the key components in optical communication equipment, can realize the conversion of optical and electrical signals. In the development of optical communication technology, the data transmission rate of optical modules is required to be continuously improved. Summary of the invention

[0003] The embodiment of the present disclosure provides an optical module, which rationally deploys multiple light transmitting optical paths and multiple light receiving optical paths to improve the transmission rate.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] A circuit board has a first notch and a second notch, and a first substrate and a second substrate are provided on the surface of the circuit board;

[0006] A base, a surface of which is provided with a first light emitting component and a second light emitting component respectively;

[0007] The first light emitting component comprises:

[0008] a first laser, disposed on the surface of the base and located in the first notch, wherein the first laser is configured to output light that does not carry a signal;

[0009] a first optical modulation chip, located in the first notch, and configured to modulate the light not carrying a signal to generate an optical signal;

[0010] A first optical fiber array is located in the first notch and is coupled to the end face of the first optical modulation chip to transmit the optical signal;

[0011] A first modulation driving chip is electrically connected to the first optical modulation chip and is wire-bonded to the surface of the circuit board between the first notch and the second notch;

[0012] The second light emitting component comprises:

[0013] a second laser disposed on the surface of the base and located in the second notch, wherein the second laser is configured to output light that does not carry a signal;

[0014] a second optical modulation chip, located in the second notch, and configured to modulate the light not carrying a signal to generate an optical signal;

[0015] A second optical fiber array is located in the second notch and is coupled to the end face of the second optical modulation chip to transmit the optical signal;

[0016] A second modulation driving chip is electrically connected to the second optical modulation chip and is wire-bonded to the surface of the circuit board between the first notch and the second notch;

[0017] The first light receiving component is disposed on the surface of the circuit board and includes:

[0018] A first refracting element is provided on the surface of the first substrate, and a reflective end surface is formed on the end surface of the first refracting element; wherein the thermal expansion coefficient of the first substrate is smaller than the thermal expansion coefficient of the circuit board;

[0019] A first light receiving chip is disposed on the surface of the first substrate and is located on the reflection light path of the reflection end surface;

[0020] The second light receiving component is disposed on the surface of the circuit board and includes:

[0021] A second refracting member, the bottom end of which is fixed to the surface of the second substrate, and the end surface of the second refracting member is formed with a reflective end surface; wherein the thermal expansion coefficient of the second substrate is smaller than the thermal expansion coefficient of the circuit board;

[0022] The second light receiving chip is arranged on the surface of the second substrate and is located on the reflection light path of the reflection end surface.

[0023] The above technical solution has the following advantages or beneficial effects: the optical module includes a circuit board and a base. The surface of the circuit board has a first notch and a second notch. The surface of the base is provided with a first light emitting component and a second light emitting component respectively. If the first light emitting component and the second light emitting component are arranged on the same base surface, then compared with the first light emitting component and the second light emitting component being arranged on different bases, the base area will be larger at this time, which is more conducive to the heat dissipation of the first light emitting component and the second light emitting component. The first light emitting component includes a first laser, a first light modulation chip, a first optical fiber array, and a first modulation drive chip. The second light emitting component includes a second laser, a second light modulation chip, a second optical fiber array, and a second modulation drive chip. Among them, the first laser is arranged on the surface of the base and is located in the first notch, and the first laser is configured to output light that does not carry a signal. The first optical modulation chip is located in the first notch and is configured to modulate the light that does not carry a signal to generate an optical signal. The first optical fiber array is located in the first notch and is coupled to the end face of the first optical modulation chip to transmit the optical signal. The first modulation drive chip is electrically connected to the first optical modulation chip to provide a modulation drive signal to the first optical modulation chip. Since a circuit board is connected between the first notch portion and the second notch portion, the wiring space on the surface of the circuit board between the first notch portion and the second notch portion can be fully utilized to increase the wiring area. Among them, the first modulation drive chip is connected to the surface of the circuit board between the first notch portion and the second notch portion by wire bonding. The first light receiving component and the second light receiving component are respectively provided on the surface of the circuit board. The first light receiving component includes a first refractive element and a first light receiving chip. The second light receiving component includes a second refractive element and a second light receiving chip. The first refractive element and the first light receiving chip are respectively fixed to the surface of the first substrate, and the thermal expansion coefficient of the first substrate is smaller than the thermal expansion coefficient of the circuit board, so the first substrate is less deformed by heat, which can improve the optical path stability of the first light receiving component. The second refractive element and the second light receiving chip are respectively fixed to the surface of the second substrate, and the thermal expansion coefficient of the second substrate is smaller than the thermal expansion coefficient of the circuit board, so the second substrate is less deformed by heat, which can improve the optical path stability of the second light receiving component.

[0024] In some embodiments, a first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is provided on one side of the light entrance of the first optical modulation chip, and the light output by the first isolator is incident on the first optical modulation chip through the air;

[0025] An optical refractive index matching glue is provided between the first optical fiber array and the end face of the first optical modulation chip, and the optical signal modulated by the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching glue.

[0026] The above technical solution has the following advantages or beneficial effects: a first lens and a first isolator are provided between the first laser and the first optical modulator chip. The light emitted by the first laser is in a divergent state, and the first lens can collimate the divergent light emitted by the first laser, which is beneficial to improving the coupling efficiency. The light output by the first lens is coupled to the first isolator. The first isolator is arranged on one side of the light inlet of the first optical modulator chip, and the light output by the first isolator is coupled to the first optical modulator chip after being transmitted through the air for signal modulation. An optical refractive index matching glue is provided between the first optical fiber array and the first optical modulator chip to realize the coupling connection between the first optical fiber array and the end face of the first optical modulator chip. The optical signal generated by the modulation of the first optical modulator chip is coupled into the first optical fiber array through the optical refractive index matching glue. The two are coupled and connected by the refractive index matching glue, which is beneficial to improving the coupling efficiency.

[0027] In some embodiments, a first convex surface and a second convex surface are formed on the surface of the base; the first convex surface is embedded in the first notch portion to carry the first light emitting component; the second convex surface is embedded in the second notch portion to carry the second light emitting component;

[0028] The first optical fiber array comprises:

[0029] a first support portion;

[0030] A second supporting portion, sandwiching a plurality of optical fibers with the first supporting portion;

[0031] a fixing portion connected to the second supporting portion;

[0032] The first convex surface comprises:

[0033] A first supporting surface, used for carrying the first optical modulation chip;

[0034] The second supporting surface includes a first supporting surface and a second supporting surface, wherein the first supporting surface is used to support the first laser, and the second supporting surface is used to support the first optical fiber array.

[0035] The above technical solution has the following advantages or beneficial effects: the first optical fiber array includes a first supporting portion, a second supporting portion and a fixing portion. A plurality of optical fibers are clamped between the first supporting portion and the second supporting portion. The multi-channel optical signals modulated by the first optical modulation chip are transmitted through the plurality of optical fibers. The fixing portion fixes and buffers the optical fibers. A first boss surface and a second boss surface are formed on the surface of the base. The first boss surface is embedded in the first notch portion to carry the first light emitting component. The second boss surface is embedded in the second notch portion to carry the second light emitting component. The first boss surface includes a first supporting surface and a second supporting surface. The first supporting surface is used to carry the first optical modulation chip. The second supporting surface includes a first carrying surface and a second carrying surface, the first carrying surface is used to carry the first laser, and the second carrying surface is used to carry the second supporting portion.

[0036] In some embodiments, the first optical modulation chip is fixed to the first supporting surface by glue, the first laser is fixed to the first carrier surface by glue, and the first optical fiber array is fixed to the second carrier surface by glue;

[0037] The second loading surface is shorter than the first loading surface, so that the fixing portion is suspended relative to the second loading surface;

[0038] There is a certain gap between the first supporting surface and the second supporting surface to collect the glue;

[0039] There is a certain gap between the first carrying surface and the second carrying surface to collect the glue.

[0040] The above technical solution has the following advantages or beneficial effects: the first optical modulation chip is fixed to the first supporting surface by glue, the first laser is fixed to the first carrier surface by glue, and the first optical fiber array is fixed to the second carrier surface by glue. The length of the second carrier surface is smaller than that of the first carrier surface, so that the fixing part is suspended relative to the second carrier surface, thereby preventing adhesion between the fixing part and the glue attached to the second carrier surface, preventing the optical fiber from breaking free from the fixing part, and ensuring that the fixing part continues to wrap the optical fiber. There is a certain gap between the first supporting surface and the second supporting surface to collect the overflowed optical glue and avoid the excess optical glue from polluting the optical path. There is a certain gap between the first carrier surface and the second carrier surface to collect the overflowed optical glue and avoid the excess optical glue from polluting the optical path.

[0041] In some embodiments, the end surface of the first optical modulation chip is formed with a light input port and a plurality of light output ports, and the plurality of light output ports have the same output wavelength;

[0042] The light input port faces the first laser to receive a beam of light without a signal output by the first laser;

[0043] The light output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array;

[0044] The input light waveguide and the output light waveguide of the first light modulation chip are respectively non-perpendicular to the end face of the first light modulation chip;

[0045] The light incident end face of the first optical fiber array is set as an inclined surface, and the inclined surface is coupled and connected to the end face of the first optical modulation chip.

[0046] The above technical solution has the following advantages or beneficial effects: an input light port and multiple light output ports are formed on the end face of the first optical modulation chip, and the multiple light output ports have the same output wavelength, that is, the first optical modulation chip can modulate an input beam of light that does not carry a signal internally to generate multiple light signals with the same wavelength. Among them, the light input port is facing the first laser to receive a beam of light that does not carry a signal output by the first laser. The light output port is facing the first optical fiber array to couple the multiple light signals modulated by the first optical modulation chip to the first optical fiber array and output them through the first optical fiber array. The input waveguide and the output waveguide of the first optical modulation chip are respectively non-perpendicular to the end face of the first optical modulation chip, thereby preventing the optical signal from being reflected at the end face of the first optical modulation chip. The light input end face of the first optical fiber array is set as a slope, thereby preventing the optical signal from being reflected at the light input end face of the first optical fiber array.

[0047] In some embodiments, the first notch portion includes:

[0048] A first through hole portion, used for embedding the first laser and the first optical fiber array;

[0049] a second through hole portion connected to one end of the first through hole portion, the second through hole portion being used to embed the first optical modulation chip, and the second through hole portion being inclined relative to the first through hole portion;

[0050] The third through hole portion is connected to the other end of the first through hole portion, and the size of the third through hole portion is smaller than that of the first through hole portion; the first optical fiber array passes through the third through hole portion.

[0051] The above technical solution has the following advantages or beneficial effects: the first notch portion includes a first through-hole portion, a second through-hole portion, and a third through-hole portion. The second through-hole portion is connected to one end of the first through-hole portion, and the third through-hole portion is connected to the other end of the first through-hole portion. The first through-hole portion is used to embed the first laser and the first optical fiber array. The second through-hole portion is used to embed the first optical modulation chip, and the second through-hole portion is inclined relative to the first through-hole portion to adapt to the placement form inside the first optical modulation chip. Along the width direction of the third circuit board, the size of the third through-hole portion becomes smaller relative to the first through-hole portion to reduce the digging area. On the one hand, the third through-hole portion can provide bending space for the fiber output of the fixed portion, thereby avoiding fiber breakage. On the other hand, the fiber output of the fixed portion passes through the third through-hole portion, and the fiber output of the fixed portion is lifted upward by a certain amplitude with the tail of the fixed portion as the fulcrum. When the optical fiber falls on the surface of the circuit board, it can pass horizontally and buffered, thereby ensuring smooth horizontal fiber output.

[0052] In some embodiments, the surface of the first substrate includes a concave surface and a convex platform, the concave surface is used to carry the first light-refracting element, and the convex platform is used to carry the first light-receiving chip.

[0053] The above technical solution has the following advantages or beneficial effects: the first refractive element is located on the concave surface, and the first light receiving chip is located on the boss, then the surface where the first refractive element is located is recessed with the surface where the first light receiving chip is located, and the thickness of the second optical fiber support portion can extend downward, thereby increasing the thickness of the second optical fiber support portion, and increasing the upward supporting force of the second optical fiber support portion, thereby maintaining the stable transmission performance of the optical fiber clamped between the first optical fiber support portion and the second optical fiber support portion.

[0054] In some embodiments, the first light receiving component includes a first TIA, and the first TIA is located on the surface of the circuit board;

[0055] A groove portion is formed on the surface of the circuit board, and the first substrate and the second substrate are respectively arranged in the groove portion, so that the first light receiving chip is flush with the surface of the first TIA.

[0056] The above technical solution has the following advantages or beneficial effects: the first light receiving component includes a first TIA, the first TIA is located on the surface of the circuit board, and the photocurrent signal generated by the first light receiving chip can be converted into a photovoltage signal through the first TIA, and the photovoltage signal can be amplified. A groove portion is formed on the surface of the circuit board, and the first substrate and the second substrate are respectively arranged in the groove portion, so that the first substrate and the second substrate are sunken and arranged, ensuring that the first light receiving chip is flush with the surface of the first TIA, thereby shortening the wiring length between the first light receiving chip and the first TIA, and improving the high-frequency signal transmission performance between the two. In addition, the first substrate and the second substrate are arranged in the same groove portion, which can reduce the circuit board area occupied by the groove portion compared to arranging the first substrate and the second substrate in different groove portions, which is beneficial to the deployment of the first light receiving component and the second light receiving component.

[0057] In some embodiments, the first substrate and the second substrate may be connected together.

[0058] The above technical solution has the following advantages or beneficial effects: the first substrate and the second substrate can be connected together to form one substrate.

[0059] In some embodiments, an optical module is provided, comprising:

[0060] The circuit board has a first notch portion and a second notch portion;

[0061] A first substrate, located on the upper surface of the circuit board;

[0062] A second substrate, located on the upper surface or the lower surface of the circuit board;

[0063] The base has the following surfaces:

[0064] a first laser, disposed on the surface of the base and located in the first notch, wherein the first laser is configured to output light that does not carry a signal;

[0065] a first optical modulation chip, located in the first notch, and configured to modulate the light not carrying a signal to generate an optical signal;

[0066] A first optical fiber array is located in the first notch and is coupled to the end face of the first optical modulation chip to transmit the optical signal;

[0067] A first modulation driving chip is electrically connected to the first optical modulation chip and is wire-bonded to the surface of the circuit board between the first notch and the second notch;

[0068] a second laser disposed on the surface of the base and located in the second notch, wherein the second laser is configured to output light that does not carry a signal;

[0069] a second optical modulation chip, located in the second notch, and configured to modulate the light not carrying a signal to generate an optical signal;

[0070] A second optical fiber array is located in the second notch and is coupled to the end face of the second optical modulation chip to transmit the optical signal;

[0071] A second modulation driving chip is electrically connected to the second optical modulation chip and is wire-bonded to the surface of the circuit board between the first notch and the second notch;

[0072] A first refracting element is provided on the surface of the first substrate, and a reflective end surface is formed on the end surface of the first refracting element; wherein the thermal expansion coefficient of the first substrate is smaller than the thermal expansion coefficient of the circuit board;

[0073] A first light receiving chip is disposed on the surface of the first substrate and is located on the reflection light path of the reflection end surface;

[0074] A second refracting member, the bottom end of which is fixed to the surface of the second substrate, and the end surface of the second refracting member is formed with a reflective end surface; wherein the thermal expansion coefficient of the second substrate is smaller than the thermal expansion coefficient of the circuit board;

[0075] The second light receiving chip is arranged on the surface of the second substrate and is located on the reflection light path of the reflection end surface.

[0076] The above technical solution has the following advantages or beneficial effects: the optical module includes a circuit board, a first substrate, a second substrate, a base, a first refractive element, a first light receiving chip, a second refractive element, and a second light receiving chip. The first substrate is located on the upper surface of the circuit board, and the second substrate is located on the upper surface or the lower surface of the circuit board. Then the first substrate and the second substrate can be located on the same surface of the circuit board, or on different surfaces of the circuit board. The surface of the base is respectively provided with: a first laser, a first light modulation chip, a first optical fiber array, a first modulation drive chip, a second laser, a second light modulation chip, a second optical fiber array, and a second modulation drive chip. The circuit board has a first notch and a second notch. The first laser, the first light modulation chip, the first optical fiber array, and the first modulation drive chip are located in the first notch, and the second laser, the second light modulation chip, the second optical fiber array, and the second modulation drive chip are located in the second notch. The first laser, the first light modulation chip, the first optical fiber array, the first modulation drive chip, the second laser, the second light modulation chip, the second optical fiber array, and the second modulation drive chip are arranged on the same base surface. Compared with being arranged on different bases, the base area will be larger at this time, which is more conducive to heat dissipation. The first laser is arranged on the surface of the base and is located in the first notch portion. The first laser is configured to output light that does not carry a signal. The first optical modulation chip is located in the first notch portion and is configured to modulate the light that does not carry a signal to generate an optical signal. The first optical fiber array is located in the first notch portion and is coupled to the end face of the first optical modulation chip to transmit the optical signal. The first modulation drive chip is electrically connected to the first optical modulation chip to provide a modulation drive signal to the first optical modulation chip. Since a circuit board is connected between the first notch portion and the second notch portion, the wiring space on the surface of the circuit board between the first notch portion and the second notch portion can be fully utilized to increase the wiring area. The first modulation drive chip is connected to the surface of the circuit board between the first notch portion and the second notch portion by wire bonding. The first refraction member is arranged on the surface of the first substrate, and the end face of the first refraction member forms a first reflection end face. The first light receiving chip is arranged on the surface of the first substrate and is located on the reflection light path of the first reflection end face. If the thermal expansion coefficient of the first substrate is smaller than the thermal expansion coefficient of the circuit board, the thermal deformation is small, which is conducive to improving the optical path stability of the first refraction member and the first light receiving chip. The second refraction member is arranged on the surface of the second substrate, and the end surface of the second refraction member is formed with a second reflective end surface. The second light receiving chip is arranged on the surface of the second substrate, and is located on the reflective light path of the second reflective end surface. The thermal expansion coefficient of the second substrate is smaller than the thermal expansion coefficient of the circuit board, so the thermal deformation is smaller, which is conducive to improving the optical path stability of the second refraction member and the second light receiving chip. When the first substrate is located on the upper surface of the circuit board and the second substrate is located on the upper surface of the circuit board, the assembly consisting of the first refraction member and the first light receiving chip and the assembly consisting of the second refraction member and the second light receiving chip are located on the same surface of the circuit board.When the first substrate is located on the upper surface of the circuit board and the second substrate is located on the lower surface of the circuit board, the assembly consisting of the first refracting member and the first light receiving chip and the assembly consisting of the second refracting member and the second light receiving chip are located on different surfaces of the circuit board.

[0077] In some embodiments, a first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is provided on one side of the light entrance of the first optical modulation chip, and the light output by the first isolator is incident on the first optical modulation chip through the air;

[0078] An optical refractive index matching glue is provided between the first optical fiber array and the end face of the first optical modulation chip, and the optical signal modulated by the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching glue.

[0079] The above technical solution has the following advantages or beneficial effects: a first lens and a first isolator are provided between the first laser and the first optical modulator chip. The light emitted by the first laser is in a divergent state, and the first lens can collimate the divergent light emitted by the first laser, which is beneficial to improving the coupling efficiency. The light output by the first lens is coupled to the first isolator. The first isolator is arranged on one side of the light inlet of the first optical modulator chip, and the light output by the first isolator is coupled to the first optical modulator chip after being transmitted through the air for signal modulation. An optical refractive index matching glue is provided between the first optical fiber array and the first optical modulator chip to realize the coupling connection between the first optical fiber array and the end face of the first optical modulator chip. The optical signal generated by the modulation of the first optical modulator chip is coupled into the first optical fiber array through the optical refractive index matching glue. The two are coupled and connected by the refractive index matching glue, which is beneficial to improving the coupling efficiency.

[0080] In some embodiments, a first convex surface and a second convex surface are formed on the surface of the base; the first convex surface is embedded in the first notch portion to carry the first light emitting component; the second convex surface is embedded in the second notch portion to carry the second light emitting component;

[0081] The first optical fiber array comprises:

[0082] a first support portion;

[0083] A second supporting portion, sandwiching a plurality of optical fibers with the first supporting portion;

[0084] a fixing portion connected to the second supporting portion;

[0085] The first convex surface comprises:

[0086] A first supporting surface, used for carrying the first optical modulation chip;

[0087] The second supporting surface includes a first supporting surface and a second supporting surface, wherein the first supporting surface is used to support the first laser, and the second supporting surface is used to support the first optical fiber array.

[0088] The above technical solution has the following advantages or beneficial effects: the first optical fiber array includes a first supporting portion, a second supporting portion and a fixing portion. A plurality of optical fibers are clamped between the first supporting portion and the second supporting portion. The multi-channel optical signals modulated by the first optical modulation chip are transmitted through the plurality of optical fibers. The fixing portion fixes and buffers the optical fibers. A first boss surface and a second boss surface are formed on the surface of the base. The first boss surface is embedded in the first notch portion to carry the first light emitting component. The second boss surface is embedded in the second notch portion to carry the second light emitting component. The first boss surface includes a first supporting surface and a second supporting surface. The first supporting surface is used to carry the first optical modulation chip. The second supporting surface includes a first carrying surface and a second carrying surface, the first carrying surface is used to carry the first laser, and the second carrying surface is used to carry the second supporting portion.

[0089] In some embodiments, the first optical modulation chip is fixed to the first supporting surface by glue, the first laser is fixed to the first carrier surface by glue, and the first optical fiber array is fixed to the second carrier surface by glue;

[0090] The second loading surface is shorter than the first loading surface, so that the fixing portion is suspended relative to the second loading surface;

[0091] There is a certain gap between the first supporting surface and the second supporting surface to collect the glue;

[0092] There is a certain gap between the first carrying surface and the second carrying surface to collect the glue.

[0093] The above technical solution has the following advantages or beneficial effects: the first optical modulation chip is fixed to the first supporting surface by glue, the first laser is fixed to the first carrier surface by glue, and the first optical fiber array is fixed to the second carrier surface by glue. The length of the second carrier surface is smaller than that of the first carrier surface, so that the fixing part is suspended relative to the second carrier surface, thereby preventing adhesion between the fixing part and the glue attached to the second carrier surface, preventing the optical fiber from breaking free from the fixing part, and ensuring that the fixing part continues to wrap the optical fiber. There is a certain gap between the first supporting surface and the second supporting surface to collect the overflowed optical glue and avoid the excess optical glue from polluting the optical path. There is a certain gap between the first carrier surface and the second carrier surface to collect the overflowed optical glue and avoid the excess optical glue from polluting the optical path.

[0094] In some embodiments, the end surface of the first optical modulation chip is formed with a light input port and a plurality of light output ports, and the plurality of light output ports have the same output wavelength;

[0095] The light input port faces the first laser to receive a beam of light without a signal output by the first laser;

[0096] The light output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array;

[0097] The input light waveguide and the output light waveguide of the first light modulation chip are respectively non-perpendicular to the end face of the first light modulation chip;

[0098] The light incident end face of the first optical fiber array is set as an inclined surface, and the inclined surface is coupled and connected to the end face of the first optical modulation chip.

[0099] The above technical solution has the following advantages or beneficial effects: an input light port and multiple light output ports are formed on the end face of the first optical modulation chip, and the multiple light output ports have the same output wavelength, that is, the first optical modulation chip can modulate an input beam of light that does not carry a signal internally to generate multiple light signals with the same wavelength. Among them, the light input port is facing the first laser to receive a beam of light that does not carry a signal output by the first laser. The light output port is facing the first optical fiber array to couple the multiple light signals modulated by the first optical modulation chip to the first optical fiber array and output them through the first optical fiber array. The input waveguide and the output waveguide of the first optical modulation chip are respectively non-perpendicular to the end face of the first optical modulation chip, thereby preventing the optical signal from being reflected at the end face of the first optical modulation chip. The light input end face of the first optical fiber array is set as a slope, thereby preventing the optical signal from being reflected at the light input end face of the first optical fiber array.

[0100] In some embodiments, the first notch portion includes:

[0101] A first through hole portion, used for embedding the first laser and the first optical fiber array;

[0102] a second through hole portion connected to one end of the first through hole portion, the second through hole portion being used to embed the first optical modulation chip, and the second through hole portion being inclined relative to the first through hole portion;

[0103] The third through hole portion is connected to the other end of the first through hole portion, and the size of the third through hole portion is smaller than that of the first through hole portion; the first optical fiber array passes through the third through hole portion.

[0104] The above technical solution has the following advantages or beneficial effects: the first notch portion includes a first through-hole portion, a second through-hole portion, and a third through-hole portion. The second through-hole portion is connected to one end of the first through-hole portion, and the third through-hole portion is connected to the other end of the first through-hole portion. The first through-hole portion is used to embed the first laser and the first optical fiber array. The second through-hole portion is used to embed the first optical modulation chip, and the second through-hole portion is inclined relative to the first through-hole portion to adapt to the placement form inside the first optical modulation chip. Along the width direction of the third circuit board, the size of the third through-hole portion becomes smaller relative to the first through-hole portion to reduce the digging area. On the one hand, the third through-hole portion can provide bending space for the fiber output of the fixed portion, thereby avoiding fiber breakage. On the other hand, the fiber output of the fixed portion passes through the third through-hole portion, and the fiber output of the fixed portion is lifted upward by a certain amplitude with the tail of the fixed portion as the fulcrum. When the optical fiber falls on the surface of the circuit board, it can pass horizontally and buffered, thereby ensuring smooth horizontal fiber output.

[0105] In some embodiments, the surface of the first substrate includes a concave surface and a convex platform, the concave surface is used to carry the first light-refracting element, and the convex platform is used to carry the first light-receiving chip.

[0106] The above technical solution has the following advantages or beneficial effects: the first refractive element is located on the concave surface, and the first light receiving chip is located on the boss, then the surface where the first refractive element is located is recessed with the surface where the first light receiving chip is located, and the thickness of the second optical fiber support portion can extend downward, thereby increasing the thickness of the second optical fiber support portion, and increasing the upward supporting force of the second optical fiber support portion, thereby maintaining the stable transmission performance of the optical fiber clamped between the first optical fiber support portion and the second optical fiber support portion.

[0107] In some embodiments, the first light receiving component includes a first TIA, and the first TIA is located on the surface of the circuit board;

[0108] A groove portion is formed on the surface of the circuit board, and the first substrate and the second substrate are respectively arranged in the groove portion, so that the first light receiving chip is flush with the surface of the first TIA.

[0109] The above technical solution has the following advantages or beneficial effects: the first light receiving component includes a first TIA, the first TIA is located on the surface of the circuit board, and the photocurrent signal generated by the first light receiving chip can be converted into a photovoltage signal through the first TIA, and the photovoltage signal can be amplified. A groove portion is formed on the surface of the circuit board, and the first substrate and the second substrate are respectively arranged in the groove portion, so that the first substrate and the second substrate are sunken and arranged, ensuring that the first light receiving chip is flush with the surface of the first TIA, thereby shortening the wiring length between the first light receiving chip and the first TIA, and improving the high-frequency signal transmission performance between the two. In addition, the first substrate and the second substrate are arranged in the same groove portion, which can reduce the circuit board area occupied by the groove portion compared to arranging the first substrate and the second substrate in different groove portions, which is beneficial to the deployment of the first light receiving component and the second light receiving component.

[0110] In some embodiments, when the first substrate and the second substrate are respectively located on the same surface of the circuit board, the first substrate and the second substrate may be connected together.

[0111] The above technical solution has the following advantages or beneficial effects: when the first substrate and the second substrate are respectively located on the same surface of the circuit board, the first substrate and the second substrate can be connected together to form one substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0112] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0113] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0114] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0115] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0116] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0117] Figure 5 is a diagram of the internal structure of a coherent optical component according to some embodiments;

[0118] Figure 6a is a diagram of the internal structure of an optical module according to some embodiments;

[0119] Figure 6b An internal decomposition of an optical module according to some embodiments Figure 1 ;

[0120] Figure 7a is another internal structure diagram of an optical module according to some embodiments;

[0121] Figure 7b is an exploded view of another optical module according to some embodiments;

[0122] Figure 8a An internal decomposition of an optical module according to some embodiments Figure 2 ;

[0123] Figure 8b A refraction element structure according to some embodiments Figure 1 ;

[0124] Figure 8c is an exploded view of a refracting member according to some embodiments;

[0125] Figure 8d is a structural diagram of a light receiving component according to some embodiments;

[0126] Figure 8e A refraction element structure according to some embodiments Figure 2 ;

[0127] Figure 9a is a diagram of an assembly of a light emitting component and a circuit board according to some embodiments;

[0128] Figure 9b is an exploded view of a light emitting component according to some embodiments;

[0129] Fig.9c A cross-sectional view of an assembly of a light emitting component and a circuit board according to some embodiments;

[0130] Figure 9d is a partial structural diagram of a light emitting component according to some embodiments;

[0131] Fig.10a A cross-sectional structure of a light receiving component according to some embodiments Figure 1 ;

[0132] Fig.10b A cross-sectional structure of a light receiving component according to some embodiments Figure 2 ;

[0133] Fig.10cA cross-sectional structure of a light receiving component according to some embodiments Figure 1 ;

[0134] Fig.10d A cross-sectional structure of a light receiving component according to some embodiments Figure 2 ;

[0135] Fig.11a is another exploded structural diagram of a light receiving component according to some embodiments;

[0136] Fig.11b is a cross-sectional structural diagram of another light receiving component according to some embodiments;

[0137] Fig.12a Another internal structure of an optical module according to some embodiments Figure 1 ;

[0138] Figure 12b Another internal structure of an optical module according to some embodiments Figure 2 ;

[0139] Fig.13a Another internal structure of an optical module according to some embodiments Figure 2 ;

[0140] Fig.13b Another optical module assembly according to some embodiments is disassembled Figure 1 ;

[0141] Fig.13c Another optical module assembly according to some embodiments is disassembled Figure 2 ;

[0142] Fig.13d is a base and circuit board assembly diagram according to some embodiments;

[0143] Fig.13e Another optical module assembly according to some embodiments is disassembled Figure 3 ;

[0144] Fig.14a Another cross section of an optical module according to some embodiments is shown in FIG. Figure 1 ;

[0145] Fig.14b FIG. 1 is another cross-sectional diagram of an optical module according to some embodiments. Figure 1 ;

[0146] Fig.14c Another cross section of an optical module according to some embodiments is shown in FIG. Figure 1 ;

[0147] Fig.14d FIG. 1 is another cross-sectional diagram of an optical module according to some embodiments. Figure 1 ;

[0148] Fig.15 is another optical module layout structure diagram according to some embodiments;

[0149] Fig.16 is a side structural diagram of another optical module according to some embodiments;

[0150] Fig.17 is a cross-sectional structural diagram of another optical module according to some embodiments;

[0151] Fig.18 A circuit board upper surface structure according to some embodiments Figure 1 ;

[0152] Fig.19 A circuit board upper surface structure according to some embodiments Figure 2 ;

[0153] Fig. 20 A circuit board lower surface structure according to some embodiments Figure 1 ;

[0154] Fig.21 A circuit board lower and upper surface structure according to some embodiments Figure 2 ;

[0155] Fig. 22 is an exploded view of another optical module according to some embodiments;

[0156] Fig.23a A circuit board upper surface mounting structure diagram according to some embodiments;

[0157] Figure 23b An exploded view of a base and a light emitting component according to some embodiments;

[0158] Fig.23c is a structural diagram of a first light emitting component according to some embodiments;

[0159] Fig.24 An assembly diagram of the top and bottom surface structures of a base according to some embodiments;

[0160] Fig.25 A bottom surface assembly structure diagram of a base according to some embodiments;

[0161] Fig.26a A structural diagram of an assembly of a first refraction member and a first converging lens according to some embodiments;

[0162] Figure 26b is an exploded view of an assembly of a first refraction member and a first converging lens according to some embodiments;

[0163] Fig. 27 A bottom surface assembly structure diagram of a base according to some embodiments;

[0164] Fig.28 A cross-sectional view of a bottom surface assembly of a base according to some embodiments;

[0165] Fig.29 is a structural diagram of a bottom surface of a base according to some embodiments;

[0166] Fig.30 Another cross-sectional structure of an optical module according to some embodiments Figure 1 ;

[0167] Fig.31 Another cross-sectional structure of an optical module according to some embodiments Figure 2 ;

[0168] Fig.32 is a partial cross-sectional view of another optical module according to some embodiments. DETAILED DESCRIPTION

[0169] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0170] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0171] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0172] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0173] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0174] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0175] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0176] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0177] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0178] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0179] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0180] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0181] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, and the shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening, which is both an electrical port and an optical port.

[0182] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0183] The upper shell 201 and the lower shell 202 are combined to facilitate installation of the circuit board 300 and the like into the shell. The upper shell 201 and the lower shell 202 can encapsulate and protect the above components.

[0184] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200.

[0185] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0186] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0187] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed in the housing, and the circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). The chip may include a microcontroller unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (Limiting Amplifier, LA), a clock and data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.

[0188] In some embodiments, the circuit board includes a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0189] In some embodiments, the circuit board also includes a flexible circuit board, which can be used independently or in combination with a rigid circuit board.

[0190] In some embodiments, the circuit board further includes a gold finger formed on an end surface thereof, wherein the gold finger is composed of a plurality of pins that are independent of each other.

[0191] In some implementations, the gold finger 301 is disposed on a surface of one side of the circuit board 300 (eg Figure 4 In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to occasions where a large number of pins are required.

[0192] In some implementations, the gold finger of the circuit board extends from the opening 204 and is inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 is configured to establish an electrical connection with the host computer, and can realize electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0193] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0194] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0195] In some embodiments, the optical module includes a coherent optical component 302. The coherent optical component 302 is configured to perform modulation and demodulation of optical signals to achieve transmission and reception of optical signals.

[0196] In some embodiments, the optical module includes a tunable laser 303 .

[0197] In some embodiments, the tunable laser 303 is used as an external light source, and the light beam emitted is split into a first light beam and a second light beam. The first light beam is transmitted to the inside of the coherent optical component 302 as the light to be modulated. The coherent optical component 302 modulates the light to be modulated through the built-in optical chip to generate an optical signal. The second light beam is transmitted to the inside of the coherent optical component 302 as the local oscillator light. The coherent optical component 302 performs coherent demodulation on the received optical signal according to the second light beam, and demodulates to generate an electrical signal.

[0198] In some embodiments, the coherent optical assembly 302 includes a cover plate 3021. The cover plate 3021 is located on the top.

[0199] Figure 5 FIG. 1 is a diagram showing the internal structure of a coherent optical component according to some embodiments. Figure 5 As shown, in some embodiments, the coherent optical component 302 may include an optical modulation and demodulation chip 3022. The optical modulation and demodulation chip 3022 performs modulation and demodulation of optical signals internally, thereby realizing transmission and reception of optical signals.

[0200] In some embodiments, the optical modulation and demodulation chip 3022 may be a silicon photonic chip. The transmission and reception of optical signals are both implemented inside the silicon photonic chip. Silicon material is easy to etch, and functional devices can be integrated inside the silicon photonic chip.

[0201] In some embodiments, when the optical modem chip 3022 is a silicon photonic chip, since silicon is an indirect bandgap material, spontaneous photon radiation cannot be achieved and the light source cannot be realized in the silicon photonic chip. Therefore, a tunable laser 303 can be used to provide a light source for the optical modem chip 3022 .

[0202] In some embodiments, the optical modulation and demodulation chip 3022 can be a thin-film lithium niobate chip. The emission and reception of optical signals are both realized inside the thin-film lithium niobate chip. Thin-film lithium niobate has a linear electro-optic effect, and an external electric field causes a linear change in the refractive index in the corresponding direction, so that the light wave transmitted in the medium has adjustable intensity, phase and other information. Therefore, thin-film lithium niobate can be selected as the material of the optical modulator to achieve a higher modulation rate, etc.

[0203] In some embodiments, the optical modulation and demodulation chip 3022 can be a III-V / Si hybrid integrated optical chip. The emission and reception of optical signals are both realized inside the III-V / Si hybrid integrated optical chip. In the III-V / Si hybrid integrated optical chip, the growth material system of the optical modulator is a III-V semiconductor material. The III-V is a direct bandgap semiconductor material with a strong quantum well-confined Stark effect. By controlling the change of the external electric field, the carrier changes and the refractive index changes are caused to achieve optical signal modulation.

[0204] In some embodiments, the optical modulation and demodulation chip 3022 can be a thin-film lithium niobate / Si hybrid integrated optical chip. The transmission and reception of optical signals are both realized inside the thin-film lithium niobate / Si hybrid integrated optical chip. Compared with the III-V group / Si hybrid integrated optical chip, the optical modulator in the thin-film lithium niobate / Si hybrid integrated optical chip is a thin-film lithium niobate-based optical modulator.

[0205] In some embodiments, the coherent optical component 302 may include a driver chip 3023. The driver chip 3023 is located at one side of the optical modulation and demodulation chip 3022. The driver chip 3023 provides a driving signal for the modulation of the optical modulation and demodulation chip 3022.

[0206] In some embodiments, the coherent optical component 302 may include a TIA 3024. The TIA 3024 is located on one side of the optical modulation and demodulation chip 3022. The electrical signal generated after demodulation by the optical modulation and demodulation chip 3022 is amplified and processed by the TIA 3024 before being transmitted at a later stage.

[0207] In some embodiments, the coherent optical component 302 may include an optical fiber array 3025 .

[0208] In some embodiments, the tunable laser 900 is used as an external light source, and the light beam emitted is split into a first light beam and a second light beam. The first light beam and the second light beam are coupled and transmitted to the optical modulation and demodulation chip 3022 through the optical fiber array 3025 respectively.

[0209] In some embodiments, the optical signal modulated and generated by the optical modem chip 3022 is transmitted to the outside via the optical fiber array 3025 .

[0210] In some embodiments, the optical modulation and demodulation chip 3022 is internally integrated with a Mach-Zehnder (MZ) modulator to modulate the optical signal. The MZ modulator has a high modulation bandwidth, so it can handle high-speed data transmission. The MZ modulator has a low insertion loss and can maintain signal integrity. The MZ modulator has low power consumption and a fast response speed.

[0211] In some embodiments, modulation and demodulation of optical signals are performed in the coherent optical component 302, and there will be crosstalk between signals. In some embodiments, the demodulation of optical signals is separated from the coherent optical component 302 to reduce the crosstalk between signals. At this time, the optical modulation and demodulation chip 3022 is converted into an optical modulation chip to realize the modulation function of the optical signal. The demodulation of the optical signal can adopt other packaging structures, such as micro-optical packaging structure, COB (chip on board) packaging, etc.

[0212] Figure 6a is a diagram of the internal structure of an optical module according to some embodiments, Figure 6bAn internal decomposition of an optical module according to some embodiments Figure 1 .like Figure 6a-6b As shown, in some embodiments, a signal processing chip 304 is disposed on the surface of the circuit board 300. The signal processing chip 304 processes the electrical signals input / output inside the optical module and is electrically connected to the gold finger 301. The signal processing chip 304 may be a DSP chip.

[0213] In some embodiments, the optical module includes a light emitting component 400 a. The light emitting component 400 a is configured to transmit an optical signal. The light emitting component 400 a may be located on one side of the signal processing chip 304 .

[0214] In some embodiments, the optical module includes a light receiving component 500a. The light receiving component 500a is configured to receive an optical signal. The light receiving component 500a can be located side by side with the light emitting component 400a on one side of the signal processing chip 304.

[0215] In some embodiments, the optical transmitting component 400a includes an optical modulation chip to modulate and generate an optical signal to transmit the optical signal. The optical receiving component 500a adopts a micro-optical packaging solution to receive the optical signal.

[0216] In some embodiments, the light emitting component 400a may include a laser 401a. In some embodiments, the light emitting component 400a may include an optical modulation chip 404a. In some embodiments, the light emitting component 400a may include an optical fiber array 405a. The light emitted by the laser 401a is transmitted to the inside of the optical modulation chip 404a, where it is modulated to generate an optical signal, and then the optical signal is output from the optical modulation chip 404a and transmitted through the optical fiber array 405a. The optical modulation chip 404a may be a silicon-based chip or a thin-film lithium niobate-based chip.

[0217] In some embodiments, the optical receiving component 500a includes an optical fiber 513, and the optical fiber 513 extends toward the optical receiving chip until the end is exposed above the optical receiving chip. A reflective end face 514 is formed at the end of the optical fiber 513, and the reflective end face 514 is exposed above the optical receiving chip. The reflective end face 514 is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513, so as to reflect the optical signal transmitted by the optical fiber 513 to the optical receiving chip, thereby realizing the turning of the optical path.

[0218] Figure 7a is another internal structure diagram of an optical module according to some embodiments, Figure 7b FIG. 2 is another exploded view of an optical module according to some embodiments. Figure 7a , 7bAs shown, in some embodiments, a signal processing chip 304 is disposed on the surface of the circuit board 300. The signal processing chip 304 processes the electrical signals input / output inside the optical module and is electrically connected to the gold finger 301. The signal processing chip 304 may be a DSP chip.

[0219] In some embodiments, the optical module includes a light emitting component 400 a. The light emitting component 400 a is configured to transmit an optical signal. The light emitting component 400 a may be located on one side of the signal processing chip 304 .

[0220] In some embodiments, the optical module includes a light receiving component 500 b. The light receiving component 500 b is configured to receive an optical signal. The light receiving component 500 b may be located side by side with the light emitting component 400 a on one side of the signal processing chip 304 .

[0221] In some embodiments, the optical transmitting component 400a includes an optical modulation chip to modulate and generate an optical signal to transmit the optical signal. The optical receiving component 500b adopts a COB packaging solution to receive the optical signal.

[0222] In some embodiments, Figure 7a The light emitting component 400a may be Figure 6b The light emitting component 400a has the same structure as the light emitting component 400a. That is, the light emitting component 400a with the same structural features can be combined with the light receiving component 500a or the light receiving component 500b.

[0223] In some embodiments, the light receiving component 500b includes a lens assembly 510, and the lens assembly 510 is covered on the surface of the circuit board 300. The light receiving chip is located on the surface of the circuit board 300, and the lens assembly 510 is covered above the light receiving chip. A reflective surface 511 is formed on the surface of the lens assembly 510, and the reflective surface 511 is formed above the light receiving chip. The light path can be turned toward the surface of the light receiving chip through the reflective surface 511, so that the optical signal is coupled into the light receiving chip.

[0224] For example Figure 6b As shown, in some embodiments, the optical module includes a cover plate 305. The cover plate 305 covers the surface of the light emitting component 400a and the light receiving component 500a, thereby protecting the light emitting component 400a and the light receiving component 500a.

[0225] In some embodiments, limiting holes 306 are formed on both sides of the surface of the circuit board 300. Limiting portions 3051 are formed on both sides of the bottom surface of the cover plate 305. The limiting portions 3051 are embedded in the limiting holes 306, thereby fixing the cover plate 305 to the circuit board 300 and facilitating the plugging and unplugging of the cover plate 305.

[0226] In some embodiments, when there is a trace on the inner layer of the circuit board 300 at the position where the limiting hole 306 is located, the limiting hole 306 is a blind hole. When there is no trace on the inner layer of the circuit board 300 at the position where the limiting hole 306 is located, the limiting hole 306 is a through hole.

[0227] In some embodiments, the optical module may include a base 700a for supporting and carrying the light emitting component 400a.

[0228] In some embodiments, a notch 307 is formed on the surface of the circuit board 300 to embed the base 700 a .

[0229] In some embodiments, the light emitting component 400a may include a laser 401a. The laser 401a is located on the surface of the base 700a. The laser 401a may emit light along the side without modulating the light signal, so that the light emitted by the laser 401a does not carry the light signal. Exemplarily, the laser 401a is a DFB laser.

[0230] In some embodiments, the light emitting component 400a may include a lens 402a. The lens 402a is located on the surface of the base 700a.

[0231] In some embodiments, lens 402a is located on the light path of laser 401a. Lens 402a is a converging lens for converging the light emitted by laser 401a.

[0232] In some embodiments, the light emitting component 400a may include an isolator 403a. The isolator 403a is located on the surface of the base 700a. The isolator 403a is located on the light output path of the lens 402a to prevent the light emitted by the laser 401a from returning to the laser 401a.

[0233] In some embodiments, the light emitting component 400a may include an optical modulation chip 404a. The optical modulation chip 404a is located on the surface of the base 700a. The optical modulation chip 404a is located on the light output path of the isolator 403a and receives the light output from the isolator 403a. The optical modulation chip 404a performs signal phase modulation on the light output from the isolator 403a to generate an optical signal.

[0234] In some embodiments, the optical modulation chip 404a integrates an MZ modulator to modulate optical signals and transmit optical signals. For example, the optical modulation chip 404a can be a silicon photonic chip, a thin-film lithium niobate chip, or a III-V group chip.

[0235] In some embodiments, the optical path corresponding to the light reception is separated from the optical modulation and demodulation chip by the optical receiving component 500a, so the laser 401a does not need to provide the local oscillator optical signal for the optical receiving component 500a, but only needs to provide the light source to be modulated for the optical transmitting component 400a, so the laser 401a is set on the light input path of the optical modulation chip 404a. Different from the tunable laser 900: the tunable laser 900 needs to provide both the light source to be modulated for the optical transmitting end and the local oscillator optical signal for the optical receiving end.

[0236] In some embodiments, the light emitting component 400a may include an optical fiber array 405a. The optical fiber array 405a is located on the surface of the base 700a. The optical fiber array 405a is end-face coupled to the optical modulation chip 404a. The optical fiber array 405a is located on the light output path of the optical modulation chip 404a to transmit the optical signal modulated by the optical modulation chip 404a to the outside.

[0237] In some embodiments, the light emitted by the laser 401a is transmitted to the optical modulation chip 404a, where it is modulated to generate an optical signal, which is then output from the optical modulation chip 404a and transmitted via the optical fiber array 405a.

[0238] In some embodiments, the laser 401a, the lens 402a, and the isolator 403a are located on the light path of the optical modulation chip 404a, and provide the light source to be modulated to the optical modulation chip 404a. The optical fiber array 405a is coupled to the light output port of the optical modulation chip 404a. The light input port and the light output port of the optical modulation chip 404a are formed on the same side, and the laser 401a, the lens 402a, the isolator 403a, and the optical fiber array 405a are located on the same side of the optical modulation chip 404a.

[0239] In some embodiments, the optical modulation chip 404a is electrically connected to the signal processing chip 304, and the modulation driving signal required by the optical modulation chip 404a can be provided by the signal processing chip 304. Alternatively, the modulation signal required by the optical modulation chip 404a can be provided by an independently provided driving chip.

[0240] Figure 8a An internal decomposition of an optical module according to some embodiments Figure 2 .like Figure 8a As shown, in some embodiments, a notch portion 307 is formed on the surface of the circuit board 300 to embed the base 700a. The notch portion 307 is set as a through hole.

[0241] In some embodiments, the light receiving part 500a may include a light folding member 510a.

[0242] In some embodiments, the light receiving part 500 a may include a light receiving chip 520 a .

[0243] In some embodiments, the light receiving component 500 a may include a TIA 530 a .

[0244] In some embodiments, the light-bending member 510a includes an optical fiber 513, the optical fiber 513 extends toward the light-receiving chip 520a, and the end of the optical fiber 513 is exposed above the light-receiving chip 520a. A reflective end face 514 is formed at the end of the optical fiber 513, and the reflective end face 514 is exposed above the light-receiving chip 520a. The reflective end face 514 is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513, so as to reflect the optical signal transmitted by the optical fiber 513 to the light-receiving chip 520a, thereby realizing the turning of the optical path.

[0245] In some embodiments, the TIA 530 a is located on the surface of the circuit board 300 and on one side of the light receiving chip 520 a. The light receiving chip 520 a converts the received light signal into a photocurrent signal, and the TIA 530 a converts the photocurrent signal into a photovoltage signal, amplifies the photovoltage signal, and then transmits it to the signal processing chip 304.

[0246] Figure 8b A refraction element structure according to some embodiments Figure 1 , Figure 8c FIG. 1 is an exploded view of a refracting member according to some embodiments. Figure 8b , 8c As shown, in some embodiments, the light-bending member 510a may include a first fiber support portion 511 and a second fiber support portion 512. The first fiber support portion 511 and the second fiber support portion 512 are disposed opposite to each other up and down, and a plurality of optical fibers 513 are sandwiched therebetween. The plurality of optical fibers 513 form an optical fiber array. A V-shaped groove 517 is formed on the bottom surface of the first fiber support portion 511 to embed the optical fiber 513.

[0247] In some embodiments, the light-bending member 510a may include an optical fiber fixing portion 515. The optical fiber fixing portion 515 is located at the tail of the second optical fiber supporting portion 512 to fix the optical fiber 513. The optical fiber fixing portion 515 protects and buffers the optical fiber 513, thereby preventing the fiber from being broken. Exemplarily, the optical fiber fixing portion 515 is a soft glue, which protects and buffers the optical fiber 513.

[0248] In some embodiments, the length of the first fiber supporting portion 511 is longer than that of the second fiber supporting portion 512 , and there is space between the second fiber supporting portion 512 and the end of the first fiber supporting portion 511 , reserving coating space for the fiber fixing portion 515 .

[0249] In some embodiments, a reflective end face 514 is formed at the end of the optical fiber 513, and the reflective end face 514 is located above the optical receiving chip 520a. The reflective end face 514 is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513 to reflect the optical signal transmitted by the optical fiber 513 to the optical receiving chip 520a.

[0250] In some embodiments, the reflective end surface 514 is an inclined surface, and the received optical signal transmitted by the optical fiber 513 is totally reflected at the reflective end surface 514. Exemplarily, the inclination angle of the reflective end surface 514 is 46-50°, such as 48°.

[0251] In some embodiments, the optical fiber 513 passes through one end of the first optical fiber supporting portion 511 and extends to the outside of the other end of the first optical fiber supporting portion 511, so that the reflective end surface 514 is located outside the other end of the first optical fiber supporting portion 511. One end of the optical fiber fixing portion 515 is connected to one end of the second optical fiber supporting portion 512, and the other end of the optical fiber fixing portion 515 is fixedly connected to the end of the optical fiber 513 to support the end of the optical fiber 513.

[0252] In some embodiments, the end surface of the first optical fiber support portion 511 is formed with a protective surface 516, and the protective surface 516 surrounds the side of the reflective end surface 514 to protect the reflective end surface 514. Exemplarily, the protective surface 516 is an inclined surface, and the inclination angle of the protective surface 516 is 46-50°, such as the inclination angle of the protective surface 516 is 48°.

[0253] In some embodiments, the reflective end face 514 and the protective surface 516 are formed by grinding and polishing. The end face of the optical fiber 513 is ground to a certain tilt angle to form the reflective end face 514. The optical fiber 513 is cylindrical, and the cross section of the reflective end face 514 after grinding is elliptical, so the bottom of the optical fiber 513 is exposed relative to the first optical fiber support portion 511.

[0254] Figure 8d FIG. 1 is a structural diagram of a light receiving component according to some embodiments. Figure 8d As shown, in some embodiments, a certain gap is left between the optical fiber fixing portion 515 and the surface of the circuit board 300 to prevent the optical fiber fixing portion 515 from adhering to the optical glue on the surface of the circuit board 300 for fixing the second optical fiber supporting portion 512, thereby maintaining the binding force of the optical fiber fixing portion 515 on the optical fiber 513.

[0255] In some embodiments, the light receiving chip 520 is located on the surface of the circuit board 300. When the light receiving chip 520 has a fixed model and a fixed thickness, the distance from its photosensitive surface to the surface of the circuit board 300 is fixed.

[0256] In some embodiments, the preset distance between the reflective end face 514 and the light receiving chip 520a is relatively small to ensure that the optical signal reflected by the reflective end face 514 can be transmitted to the photosensitive surface of the light receiving chip 520a, and then received by the light receiving chip 520a. The second optical fiber support portion 512 has a relatively small thickness to ensure that the distance from the reflective end face 514 to the light receiving chip 520a meets the preset distance. Exemplarily, the thickness of the second optical fiber support portion 512 is less than that of the first optical fiber support portion 511 to ensure that the distance from the reflective end face 514 to the light receiving chip 520a meets the preset distance.

[0257] In some embodiments, the length of the second optical fiber support portion 512 does not extend below the reflective end face 514, leaving space for the light receiving chip 520a. In this way, under the premise of ensuring that the distance from the reflective end face 514 to the light receiving chip 520a meets the preset distance, the thickness of the second optical fiber support portion 512 can be appropriately increased to increase the support force of the second optical fiber support portion 512 on the optical fiber 513 and ensure the stability of the optical path. Exemplarily, the thickness of the second optical fiber support portion 512 is greater than the distance from the reflective end face 514 to the light receiving chip 520a, and the bottom surface of the second optical fiber support portion 512 is below the top surface of the light receiving chip 520a.

[0258] In some embodiments, the optical receiving chip 520 is located on the surface of the circuit board 300. A groove is formed on the surface of the circuit board 300 where the second optical fiber support portion 512 is located, so that the second optical fiber support portion 512 extends downward and increases the thickness of the second optical fiber support portion 512.

[0259] In some embodiments, the length of the second optical fiber support portion 512 extends below the reflective end surface 514, so that the second optical fiber support portion 512 can protect the end of the optical fiber 513. At this time, a groove is formed on the surface of the circuit board where the optical receiving chip 520a is located to sink the optical receiving chip 520a, thereby ensuring that the distance from the reflective end surface 514 to the optical receiving chip 520a meets the preset distance. Exemplarily, the bottom surface of the second optical fiber support portion 512 is above the top surface of the optical receiving chip 520a.

[0260] In some embodiments, when the thickness of the second optical fiber supporting portion 512 is relatively small and its material can ensure sufficient supporting force, the length of the second optical fiber supporting portion 512 can be extended to below the reflective end surface 514 .

[0261] Figure 8e A refraction element structure according to some embodiments Figure 2 .like Figure 8e As shown, in some embodiments, the second optical fiber support portion 512 is extended to below the reflective end surface 514 so that the second optical fiber support portion 512 can protect the end of the optical fiber 513. At this time, the optical receiving chip 520a is located on the surface of the circuit board 300.

[0262] like Figure 8b As shown, the bottom of the reflective end surface 514 of the optical fiber 513 is exposed relative to the first optical fiber support portion 511, and the second optical fiber support portion 512 does not extend to the bottom of the reflective end surface 514, so the bottom of the reflective end surface 514 cannot be protected. When the second optical fiber support portion 512 is extended to below the reflective end surface 514, the second optical fiber support portion 512 can protect the end of the optical fiber 513.

[0263] In some embodiments, when the length of the second optical fiber support portion 512 extends to below the reflective end face 514, the bottom surface of the second optical fiber support portion 512 is above the top surface of the light receiving chip 520a, and the distance between the reflective end face 514 and the light receiving chip 520a increases. In order to ensure that the optical signal reflected from the reflective end face 514 can fall on the photosensitive surface of the light receiving chip 520a, the length of the second optical fiber support portion 512 is extended until it extends to below the second optical fiber support portion 512 to carry the convergence lens 518. The convergence lens 518 is located between the reflective end face 514 and the light receiving chip 520a, and the convergence lens 518 can converge the optical signal reflected from the reflective end face 514, so that the optical signal reflected from the reflective end face 514 can fall on the photosensitive surface of the light receiving chip 520a.

[0264] Figure 9a is a diagram of an assembly of a light emitting component and a circuit board according to some embodiments, Figure 9b is an exploded view of a light emitting component according to some embodiments, Fig.9c FIG. 1 is a cross-sectional view of an assembly of a light emitting component and a circuit board according to some embodiments. Figure 9a-9c As shown, in some embodiments, the surface of the base 700a carries a laser 401a, a lens 402a, an isolator 403a, an optical modulation chip 404a, and an optical fiber array 405a.

[0265] In some embodiments, the heat dissipation of the laser 401a, the light modulation chip 404a, etc. is relatively large. The base 700a can provide a large heat dissipation surface and has good heat dissipation performance, so that the heat generated by the laser 401a and the light modulation chip 404a can be dissipated through the base 700a. Exemplarily, the base 700a can be a metal base. In addition, the base 700a has a small thermal deformation, so that the stability of the optical path can be ensured.

[0266] In some embodiments, a notch 307 is formed on the surface of the circuit board 300 to embed the base 700a. The notch 307 can accommodate the laser 401a, the lens 402a, the isolator 403a, the optical modulation chip 404a, and the optical fiber array 405a.

[0267] In some embodiments, a receiving portion 701 is formed at one end of the base 700 a to receive the circuit board 300 .

[0268] In some embodiments, the optical modulation chip 404 a is electrically connected to the signal processing chip 304 , and the signal processing chip 304 can provide a driving signal for the optical signal modulation of the optical modulation chip 404 a .

[0269] In some embodiments, the signal processing chip 304 can be flipped on the surface of the circuit board 300. Exemplarily, the solder bumps on the bottom surface of the signal processing chip 304 are connected downward to the surface of the circuit board 300. In some embodiments, after the solder bumps of the signal processing chip 304 are connected to the pads on the surface of the circuit board 300 by heating and pressurizing, the viscous filler is filled in both directions along the edge of the signal processing chip 304, and the gap between the signal processing chip 304 and the circuit board 300 has a capillary siphon effect, and the filled viscous filler is sucked and flows toward the center, thereby filling the gap between the signal processing chip 304 and the circuit board 300, and realizing stable bonding between the signal processing chip 304 and the circuit board 300.

[0270] In some embodiments, one end of the signal processing chip 304 is electrically connected to the gold finger 301 through a trace on the surface of the circuit board 300 from a solder bump.

[0271] In some embodiments, the optical modulation chip 404a is wired to the surface of the circuit board 300 through surface pads, and then electrically connected to the solder bumps of the signal processing chip 304 through the traces on the surface of the circuit board 300 to achieve electrical connection between the optical modulation chip 404a and the signal processing chip 304.

[0272] In some embodiments, a convex surface 703 is formed on the surface of the base 700a. The surface of the convex surface 703 protrudes from the surface of the receiving portion 701. For some types of optical modulation chips 404a, their thickness is less than the thickness of the circuit board 300. The convex surface 703 can compensate for the thickness difference between the optical modulation chip 404a and the circuit board 300, so that the surface of the optical modulation chip 404a is closer to the surface of the circuit board 300, shorten the wire bonding length between the optical modulation chip 404a and the circuit board 300, and optimize the high-frequency signal transmission performance.

[0273] In some embodiments, the convex table 703 may include surfaces of different heights to match the optical axis heights between the laser 401a and the optical modulation chip 404a, and between the optical modulation chip 404a and the optical fiber array 405a. In some embodiments, in order to be compatible with various optical devices of different models, the convex table 703 may also be a table with a uniform height to improve the applicability of the base 700a.

[0274] In some embodiments, the light modulation chip 404a is fixed to the convex surface 703 by optical glue, and the optical fiber array 405a is also fixed to the convex surface 703 by optical glue. A recessed portion 704 is formed between the light modulation chip 404a and the convex surface where the optical fiber array 405a is located to collect the overflowed optical glue and reduce the glue connection phenomenon.

[0275] In some embodiments, the boss surface 703 includes a loading surface 7031 . The optical fiber array 405 a is located on the loading surface 7031 .

[0276] In some embodiments, the optical fiber array 405a may include a first support portion 415 and a second support portion 425. The optical fiber is clamped between the first support portion 415 and the second support portion 425 to support and fix the optical fiber. In some embodiments, the second support portion 425 is fixedly connected to the carrier surface 7031 by applying optical glue.

[0277] In some embodiments, the optical fiber array 405a may include a fixing portion 435. The fixing portion 435 is connected to the end of the second support portion 425. The fixing portion 435 protects and buffers the optical fiber, thereby preventing the fiber from being broken. Exemplarily, the fixing portion 435 may be a soft glue, which protects and buffers the optical fiber 513.

[0278] In some embodiments, the length of the first support portion 415 is longer than that of the second support portion 425 , and there is space between the second support portion 425 and the end of the first support portion 415 , which reserves a coating space for the fixing portion 435 .

[0279] In some embodiments, the two ends of the second support portion 425 are exposed to a certain length relative to the carrier surface 7031, so that the two ends of the second support portion 425 are not coated with optical glue, thereby preventing the two ends of the second support portion 425 from being stressed and broken. In some embodiments, the first support portion 415 and the second support portion 425 can be made of glass, which is fragile.

[0280] In some embodiments, the carrier surface 7031 does not provide support for the fixing portion 435, and the fixing portion 435 is suspended relative to the carrier surface 7031. This prevents the fixing portion 435 from being optically adhered to the surface of the carrier surface 7031, thereby ensuring that the fixing portion 435 continues to wrap the optical fiber.

[0281] In some embodiments, the optical fiber should pass horizontally along the surface of the circuit board 300, so as to avoid the optical fiber being subjected to stress and breaking when in contact with the circuit board 300. In some embodiments, the fiber outlet of the fixing portion 435 can be lifted upward by a certain amount, so that the optical fiber can pass horizontally and buffered when it falls on the surface of the circuit board 300, reducing interference with the surface of the circuit board 300 and ensuring smooth horizontal fiber outlet.

[0282] In some embodiments, the optical fiber segment covered by the fixing portion 435 is fixed inside, and the optical fiber segment exposed outside the fixing portion 435 is movable. Then, the tail of the fixing portion 435 can be used as a fulcrum to lift the fiber outlet of the fixing portion 435 upward to a certain extent, and the optical fiber can pass horizontally and buffered when it falls on the surface of the circuit board 300.

[0283] In some embodiments, there is a distance between the end of the fixing portion 435 and the circuit board 300, and the fixing portion 435 is suspended relative to the surface of the base 700a. When the fixing portion 435 is lifted upward to output the fiber, this distance can provide bending space for the optical fiber, and the optical fiber is not subjected to stress in the bending space, thereby protecting the optical fiber.

[0284] In some embodiments, the base 700a may include an extension portion 702. The surface of the extension portion 702 is lower than the surface of the carrier surface 7031. The fixed portion 435 and the fiber outlet are located above the extension portion 702. There is a certain gap between the fixed portion 435 and the surface of the extension portion 702 in the longitudinal direction, which provides a bending space for the fiber outlet of the fixed portion 435 to avoid fiber breakage. The fiber outlet of the fixed portion 435 passes along the top of the extension portion 702, and the fiber outlet of the fixed portion 435 is lifted upward by a certain amplitude with the tail of the fixed portion 435 as a fulcrum. When the optical fiber falls on the surface of the circuit board 300, it can pass horizontally and buffered, thereby ensuring smooth horizontal fiber outlet.

[0285] Figure 9d FIG. 1 is a partial structural diagram of a light emitting component according to some embodiments. Figure 9d As shown, in some embodiments, the optical modulation chip 404a is coupled to the end face of the optical fiber array 405a. The optical modulation chip 404a has a built-in MZ modulator, which loads the signal onto the light wave emitted by the laser 401a and modulates it to generate an optical signal. The optical fiber array 405a transmits the optical signal modulated by the optical modulation chip 404a.

[0286] In some embodiments, the end face of the optical modulation chip 404a includes an optical input port 414 and an optical output port 424. The optical input port 414 faces the isolator 403a. The optical output port 424 faces the optical fiber array 405a. Taking the 400G transmission rate and the single-wavelength 100G transmission rate as an example, the end face of the optical modulation chip 404a is formed with four optical output ports 424 to output four optical carrier signals.

[0287] In some embodiments, the angle between the input waveguide corresponding to the input port 414 and the end face of the optical modulation chip 404a can be acute, so the input waveguide is not arranged perpendicular to the end face, thereby reducing end face reflection. The output waveguide corresponding to the output port 424 adopts the same arrangement to reduce end face reflection.

[0288] In some embodiments, the light-entering end face of the optical fiber array 405a is set as a bevel, and the light-entering end face of the internal optical fiber is also set as a bevel to prevent the optical signal incident into the optical fiber array 405a from returning to the optical modulation chip 404a, thereby increasing the return loss and allowing more light to be transmitted in the optical fiber. Exemplarily, the light-entering end face of the optical fiber array 405a is polished into a bevel with an angle of 8°.

[0289] In some embodiments, in combination Figure 9a , the optical modulation chip 404a is tilted, that is, the input and output light end faces of the optical modulation chip 404a are not vertically arranged relative to the long side direction of the circuit board 300. The optical modulation chip 404a is tilted to the input and output light waveguides are arranged parallel to the long side direction of the circuit board 300, and the laser 401a and the optical fiber array 405a can be arranged parallel to the surface of the circuit board 300, so that the digging area of ​​the notch 307 on the surface of the circuit board 300 can be reduced, and the signal transmission performance of the circuit board 300 can be guaranteed as much as possible.

[0290] In some embodiments, the shape of the notch 307 is adapted to the structural features of the light emitting component 400a. The notch 307 can be set as a through hole, and the base 700a supports the circuit board 300 from the bottom surface of the circuit board 300 upward, and the bearing surface of the base 700a faces the upper surface of the circuit board 300, so that the laser 401a, the lens 402a, the isolator 403a, the optical modulation chip 404a, and the optical fiber array 405a are supported toward the upper surface of the circuit board 300, and each device is electrically connected to the upper surface of the circuit board 300.

[0291] In some embodiments, the notch portion 307 may include a first through hole portion 3071. The laser 401a, the lens 402a, the isolator 403a, and the optical fiber array 405a are embedded in the first through hole portion 3071. Since the laser 401a, the lens 402a, the isolator 403a, and the optical fiber array 405a are arranged parallel to the surface of the circuit board 300, the first through hole portion 3071 is also arranged parallel to the surface of the circuit board 300.

[0292] In some embodiments, the notch portion 307 may include a second through hole portion 3072. The light modulation chip 404a is embedded in the second through hole portion 3072. The second through hole portion 3072 is connected to one end of the first through hole portion 3071. Figure 9a In the orientation shown, the second through hole portion 3072 is tilted downward relative to the first through hole portion 3071 to adapt to the configuration of the optical modulation chip 404a.

[0293] In some embodiments, the notch portion 307 may include a third through hole portion 3073. The third through hole portion 3073 is connected to the other end of the first through hole portion 3071. Along the width direction of the circuit board 300, the third through hole portion 3073 is smaller in size relative to the first through hole portion 3071 to reduce the hole digging area. The optical fiber array 405a passes through the third through hole portion 3073. As mentioned above, the third through hole portion 3073 provides a bending space for the fixed portion 435 to output the fiber to avoid fiber breakage. The fixed portion 435 outputs the fiber through the third through hole portion 3073, and the tail of the fixed portion 435 is used as a fulcrum to lift the output of the fixed portion 435 upward by a certain amplitude. When the optical fiber falls on the surface of the circuit board 300, it can pass horizontally and buffered, thereby ensuring smooth horizontal output.

[0294] Fig.10a A cross-sectional structure of a light receiving component according to some embodiments Figure 1 , Fig.10b A cross-sectional structure of a light receiving component according to some embodiments Figure 2 .like Fig.10a , 10b As shown, in some embodiments, the light receiving component 500a may include a light folding member 510a.

[0295] In some embodiments, the light-bending element 510a includes an optical fiber 513, and the optical fiber 513 extends toward the light receiving chip 520a. A reflective end surface 514 is formed at the end of the optical fiber 513, and the reflective end surface 514 is formed above the light receiving chip 520a. The reflective end surface 514 is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513, so as to reflect the optical signal transmitted by the optical fiber 513 to the light receiving chip 520a, thereby realizing the turning of the optical path.

[0296] In some embodiments, the light receiving chip 520a is located on the surface of the circuit board 300. The TIA 530a is located on the surface of the circuit board 300. The light receiving chip 520a and the TIA 530a are connected by wire bonding, so as to transmit the photocurrent signal converted by the light receiving chip 520a to the TIA 530a.

[0297] In some embodiments, the circuit board 300 has a relatively large thermal expansion coefficient and relatively poor surface optical path stability.

[0298] In some embodiments, a groove portion 308a is formed on the surface of the circuit board 300, and a substrate 540a is provided on the surface of the groove portion 308a. The surface of the substrate 540a carries the refracting member 510a and the light receiving chip 520a. The thermal expansion coefficient of the substrate 540a is relatively smaller than the thermal expansion coefficient of the circuit board 300, so that the stability of the light receiving optical path can be ensured. The refracting member 510a and the light receiving chip 520a can be fixed to the surface of the substrate 540a by optical glue.

[0299] In some embodiments, there is a preset distance between the reflective end surface 514 and the light receiving chip 520 a , so that the optical signal output by the reflective end surface 514 can reach the photosensitive surface of the light receiving chip 520 a .

[0300] In some embodiments, the depth of the recessed groove 308a and the thickness of the substrate 540a cooperate with each other to meet the preset distance between the reflective end surface 514 and the light receiving chip 520a. At the same time, the light receiving chip 520a and the TIA530a surface are flush, shortening the wire bonding distance between the two, which is conducive to high-frequency signal transmission between the two.

[0301] In some embodiments, the light-bending member 510a may include a first fiber support portion 511 and a second fiber support portion 512, between which an optical fiber 513 is clamped. The first fiber support portion 511 is thicker to facilitate clamping when the light-bending member 510a is coupled. Since the preset distance between the reflective end face 514 and the light receiving chip 520a is usually small, the second fiber support portion 512 is thinner, and thus it is difficult to support the first fiber support portion 511, resulting in the fragmentation of the second fiber support portion 512.

[0302] In some embodiments, the surface of the substrate 540a used to support the refractive element 510a is recessed downward to form a concave surface 541, so that the thickness of the second optical fiber support portion 512 can extend downward, thereby increasing the thickness of the second optical fiber support portion 512 and increasing the upward supporting force of the second optical fiber support portion 512, thereby maintaining the stable transmission performance of the optical fiber supported between the first optical fiber support portion 511 and the second optical fiber support portion 512.

[0303] In some embodiments, the concave surface 541 is arranged so that the surface of the substrate 540a used to carry the light receiving chip 520a is relatively convex, forming a boss 542. The light receiving chip 520a is located on the surface of the boss 542. The height of the surface where the boss 542 is located satisfies that: the distance between the reflective end surface 514 and the light receiving chip 520a meets the preset distance. At the same time, the light receiving chip 520a is flush with the surface of the TIA530a.

[0304] In some embodiments, the concave surface 541 and the convex platform 542 may also be configured as two independent structures, that is, the convex platform 542 is located on the surface of the concave surface 541 .

[0305] In some embodiments, a hard material may be selected for the second optical fiber supporting portion 512 to increase the supporting strength, and in this case, there is no need to form the concave surface 541 .

[0306] Fig.10c A cross-sectional structure of a light receiving component according to some embodiments Figure 1 , Fig.10d A cross-sectional structure of a light receiving component according to some embodiments Figure 2 .like Fig.10c , 10d As shown, in some embodiments, the light-bending member 510a may include an optical fiber fixing portion 515. The optical fiber fixing portion 515 protects and buffers the optical fiber 513, thereby preventing the fiber from being broken. Exemplarily, the optical fiber fixing portion 515 is a soft glue that can protect and buffer.

[0307] In some embodiments, the optical fiber fixing part 515 is not disposed on the surface of the substrate 540a. The substrate 540a does not provide support for the optical fiber fixing part 515, and the optical fiber fixing part 515 is suspended relative to the substrate 540a. This can prevent the optical fiber fixing part 515 from being adhered to the optical glue on the surface of the substrate 540a used to fix the second optical fiber supporting part 512, prevent the optical fiber from escaping from the optical fiber fixing part 515, and thus ensure that the fixing part 435 continues to wrap the optical fiber.

[0308] In some embodiments, one end of the groove portion 308a extends to a position close to the TIA 530a, and the other end extends to a certain distance from the end of the substrate 540a, so that the optical fiber fixing portion 515 can reach the surface of the circuit board 300 after the optical fiber fixing portion 515 is released for a certain distance. In some embodiments, the tail of the optical fiber fixing portion 515 can be used as a fulcrum to lift the optical fiber of the optical fiber fixing portion 515 upward by a certain amplitude, and the optical fiber can pass horizontally and buffered when it falls on the surface of the circuit board 300, thereby ensuring smooth horizontal release of the optical fiber.

[0309] In some embodiments, the fiber outlet of the optical fiber fixing portion 515 is suspended relative to the groove portion 308a. When the fiber outlet of the optical fiber fixing portion 515 is lifted upward, a bending space can be provided for the optical fiber. The optical fiber is not subjected to stress in the bending space, thereby preventing fiber breakage.

[0310] Fig.11a is another exploded structural diagram of a light receiving component according to some embodiments, Fig.11b FIG. 2 is a cross-sectional structural diagram of another light receiving component according to some embodiments. Fig.11a , 11b As shown, in some embodiments, the light receiving component 500b is located on the surface of the circuit board 300. The light receiving component 500b can be located side by side with the light emitting component 400a on one side of the signal processing chip 304.

[0311] In some embodiments, the structure of the light emitting component 400a may refer to the structure of the light emitting component 400a, and will not be described in detail.

[0312] In some embodiments, the light receiving component 500b may include a lens assembly 510, and the lens assembly 510 is buckled on the surface of the circuit board 300. A receiving cavity is formed between the inner wall of the lens assembly 510 and the surface of the circuit board 300. A reflecting surface 511 is formed on the outer wall of the lens assembly 510. The reflecting surface 511 is tilted, and its light incident surface faces the optical fiber 540b, and the optical fiber 540b transmits the optical signal from the outside to the reflecting surface 511. The light emitting surface of the reflecting surface 511 faces the surface of the circuit board 300.

[0313] In some embodiments, the light receiving component 500b may include a light receiving chip 520b. The light receiving chip 520b is located in a receiving cavity formed between the inner wall of the lens assembly 510 and the circuit board 300. The light receiving chip 520b is located on the surface of the circuit board 300.

[0314] In some embodiments, the lens assembly 510 is disposed above the light receiving chip 520b. A reflective surface 511 is formed above the light receiving chip 520b. The reflective surface 511 can be used to turn the light path toward the surface of the light receiving chip 520b, thereby coupling the optical signal into the light receiving chip 520b.

[0315] In some embodiments, the light receiving component 500b may include a TIA 530b. The TIA 530b is located in a receiving cavity formed between the inner wall of the lens assembly 510 and the circuit board 300. The TIA 530b is located on the surface of the circuit board 300. The TIA 530b is located on one side of the light receiving chip 520b.

[0316] In some embodiments, the light receiving chip 520b and the TIA530b are electrically connected by wire bonding, so that the photocurrent signal generated by the light receiving chip 520b is transmitted to the TIA530b, and the TIA530b converts the photocurrent signal into a photovoltage signal and amplifies the photovoltage signal. The TIA530b is electrically connected to the signal processing chip 304 through the wiring on the surface of the circuit board 300, and transmits the amplified photovoltage signal to the signal processing chip 304.

[0317] Fig.12a Another internal structure of an optical module according to some embodiments Figure 1 .like Fig.12a As shown, in some embodiments, two groups of light emitting components are provided on the surface of the circuit board 300: a first light emitting component 400b and a second light emitting component 400c. Two groups of light receiving components are provided on the surface of the circuit board 300: a first light receiving component 500c and a second light receiving component 500d. Compared with the transmission rate of the combination structure of the light emitting component 400a and the light receiving component 500a, the transmission rate is doubled.

[0318] In some embodiments, the first light emitting component 400b and the second light emitting component 400c are disposed side by side on the same surface of the circuit board 300. In some embodiments, the first light receiving component 500c and the second light receiving component 500d are disposed side by side on the same surface of the circuit board 300.

[0319] In some embodiments, the first light emitting component 400 b , the second light emitting component 400 c , the first light receiving component 500 c and the second light receiving component 500 d are designed in a planar manner and are located on the same surface of the circuit board 300 .

[0320] In some embodiments, the first light emitting component 400b and the second light emitting component 400c can have the same structure as the light emitting component 400a. The first light receiving component 500c and the second light receiving component 500d can have the same structure as the light receiving component 500a.

[0321] Figure 12b Another internal structure of an optical module according to some embodiments Figure 2 .like Figure 12b As shown, in some embodiments, two groups of light emitting components are provided on the surface of the circuit board 300: a first light emitting component 400b and a second light emitting component 400c. Two groups of light receiving components are provided on the surface of the circuit board 300: a first light receiving component 500e and a second light receiving component 500f. Compared with the transmission rate of the combination structure of the light emitting component 400a and the light receiving component 500a, the transmission rate is doubled.

[0322] In some embodiments, the first light emitting component 400b and the second light emitting component 400c are disposed side by side on the same surface of the circuit board 300. In some embodiments, the first light receiving component 500e and the second light receiving component 500f are disposed side by side on the same surface of the circuit board 300.

[0323] In some embodiments, the first light emitting component 400 b , the second light emitting component 400 c , the first light receiving component 500 e and the second light receiving component 500 f are designed in a planar manner and are all located on the same surface of the circuit board 300 .

[0324] In some embodiments, the first light emitting component 400b and the second light emitting component 400c may have the same structure as the light emitting component 400a. The first light receiving component 500e and the second light receiving component 500f may have the same structure as the light receiving component 500b.

[0325] In some embodiments, the first light emitting component 400b and the second light emitting component 400c serve as a dual emitting structure, which can be combined with a dual receiving structure consisting of a first light receiving component 500c and a second light receiving component 500d, or with a dual receiving structure consisting of a first light receiving component 500e and a second light receiving component 500f.

[0326] Fig.13a Another internal structure of an optical module according to some embodiments Figure 2 , Fig.13b Another optical module assembly according to some embodiments is disassembled Figure 1 .like Fig.13a , 13b As shown, in some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500e and the second light receiving component 500f are all located on the same surface of the circuit board 300. If the space of the circuit board 300 is limited, a reasonable design is required to deploy them together on the same surface of the circuit board 300.

[0327] In some embodiments, a groove portion 308b is formed on the surface of the circuit board 300. The groove portion 308b is arranged near an edge of the circuit board 300. The surface of the groove portion 308b is provided with a first light receiving component 500c and a second light receiving component 500d. Compared with respectively arranging the first light receiving component 500c and the second light receiving component 500d on the surfaces of two independent groove portions, arranging the first light receiving component 500c and the second light receiving component 500d together on the surface of the same groove portion 308b can reduce the area dug by the groove portion 308b, thereby reducing the occupied circuit board area, and reserving more circuit board space for the first light emitting component 400b and the second light emitting component 400c.

[0328] In some embodiments, the first light receiving component 500c and the second light receiving component 500d may also be disposed on the surfaces of two independent groove portions. In this case, the groove walls of the two groove portions have a certain thickness, and the two groove portions are spaced a certain distance apart to avoid damaging the groove walls of the groove portions that have been milled during the current milling of the groove. The thickness of the adjacent groove walls of the two groove portions and the distance between the adjacent groove walls increase the occupied circuit board surface.

[0329] In some embodiments, the structural features of the first light receiving component 500c may be the same as those of the light receiving component 500a, and will not be described in detail. The structural features of the second light receiving component 500d may be the same as those of the light receiving component 500a, and will not be described in detail. The function of the groove portion 308b is the same as that of the groove portion 308a, and is intended to set a substrate with a smaller thermal expansion coefficient.

[0330] In some embodiments, when the first light receiving component 500c and the second light receiving component 500d are disposed on the same surface of the groove portion 308b, the interval between the first light receiving component 500c and the second light receiving component 500d is small, and the TIA530c in the first light receiving component 500c and the TIA530d in the second light receiving component 500d can share a pad on the surface of the circuit board 300, and the pad is located between the TIA530c and the TIA530d. The pad is close to the TIA530c or the TIA530d, thereby shortening the bonding distance between the pad and the TIA530c or the TIA530d.

[0331] In some embodiments, the surface of the groove portion 308b is provided with a first substrate 540c and a second substrate 540d. The first substrate 540c is used to carry the first light-receiving member 510c and the first light-receiving chip 520c in the first light-receiving component 500c. The second substrate 540d is used to carry the second light-receiving member 510d and the second light-receiving chip 520d in the second light-receiving component 500d. The thermal expansion coefficients of the first substrate 540c and the second substrate 540d are both smaller than the thermal expansion coefficient of the circuit board 300.

[0332] In some embodiments, the first substrate 540c and the second substrate 540d may be connected together to form one substrate.

[0333] In some embodiments, the bottom end of the first folding member 510c is fixed to the surface of the first substrate 540c. The first light receiving chip 520c is disposed at the end of the first substrate 540c. Similarly, the bottom end of the second folding member 510d is fixed to the surface of the second substrate 540d. The second light receiving chip 520d is disposed at the end of the second substrate 540d.

[0334] In some embodiments, a substrate is disposed on the surface of the groove portion 308b, and a partial area of ​​the substrate is used to support the refracting element 510c and the light receiving chip 520c in the first light receiving component 500c, and a partial area of ​​the substrate is used to support the refracting element 510d and the light receiving chip 520d in the second light receiving component 500d.

[0335] In some embodiments, the width of the end of the groove portion 308b through which the optical fiber passes is relatively reduced, so as to reserve space for the first light emitting component 400b and the second light emitting component 400c.

[0336] In some embodiments, the first substrate 540c is located on the upper surface of the circuit board 300, and the second substrate 540d is located on the upper surface or lower surface of the circuit board 300. The first substrate 540c and the second substrate 540d can be located on the same surface of the circuit board 300, or on different surfaces of the circuit board 300.

[0337] In some embodiments, the optical module may include a base 700b. The surface of the base 700b carries the first light emitting component 400b and the second light emitting component 400c, that is, the first light emitting component 400b and the second light emitting component 400c are located on the same base.

[0338] In some embodiments, a first boss surface 703a and a second boss surface 703b are formed on the surface of the base 700b. The first boss surface 703a and the second boss surface 703b are separated. The first boss surface 703a carries the first light emitting component 400b. The second boss surface 703b carries the second light emitting component 400c. In some embodiments, the first light emitting component 400b is fixed to the first boss surface 703a by optical glue. The second light emitting component 400c is fixed to the second boss surface 703b by optical glue.

[0339] In some embodiments, a first notch portion 307a and a second notch portion 307b are formed on the surface of the circuit board 300. The first notch portion 307a and the second notch portion 307b are separated from each other and are not connected together.

[0340] In some embodiments, the base 700b is embedded and connected to the circuit board 300. In the base 700b, the first boss surface 703a extends into the first notch portion 307a, and the second boss surface 703b extends into the second notch portion 307b, so that the base 700a is embedded in the surface of the circuit board 300.

[0341] In some embodiments, the excavation areas of the first notch portion 307 a and the second notch portion 307 b are minimized so that the first light emitting component 400 b and the second light emitting component 400 c can be disposed in a limited space.

[0342] In some embodiments, the first light emitting component 400b may include a first laser 401b. The second light emitting component 400c may include a second laser 401c.

[0343] In some embodiments, the first light emitting component 400b may include a first light modulation chip 404b and a first optical fiber array 405b. The second light emitting component 400c may include a second light modulation chip 404c and a second optical fiber array 405c. As mentioned above, the structural features of the first light modulation chip 404b and the second light modulation chip 404c are the same as those of the light modulation chip 404a, and the internal input light waveguide and the output light waveguide are arranged tilted relative to the end face.

[0344] In some embodiments, the end face of the first optical modulation chip 404b is formed with an input light port and multiple light output ports, and the multiple light output ports have the same output wavelength, that is, the first optical modulation chip 404b can modulate a beam of light that does not carry a signal input internally to generate multiple light signals with the same wavelength. Among them, the light input port faces the first laser 401b to receive a beam of light that does not carry a signal output by the first laser 401b. The light output port faces the first optical fiber array 405b to couple the multiple light signals modulated by the first optical modulation chip to the first optical fiber array 405b and output them through the first optical fiber array 405b. The input light waveguide and the output light waveguide of the first optical modulation chip 404b are respectively non-perpendicular to the end face of the first optical modulation chip 404b of the first optical modulation chip, thereby preventing the optical signal from being reflected at the end face of the first optical modulation chip 404b. The light input end face of the first optical fiber array 405b is set as an inclined surface, thereby preventing the optical signal from being reflected at the light input end face of the first optical fiber array 405b.

[0345] In some embodiments, based on the long length of the first optical fiber array 405b and the second optical fiber array 405c, the first optical modulation chip 404b and the second optical modulation chip 404c are tilted relative to the surface of the circuit board 300, and the first laser 401b and the first optical fiber array 405b can be arranged parallel to the surface of the circuit board 300, thereby reducing the digging area of ​​the first notch 307a. Similarly, the second laser 401c and the second optical fiber array 405c can also be arranged parallel to the surface of the circuit board 300, thereby also reducing the digging area of ​​the second notch 307b.

[0346] In some embodiments, the first optical emission component 400b may include a first modulation driver chip 406b. The first modulation driver chip 406b is located on one side of the first optical modulation chip 404b. The first modulation driver chip 406b is electrically connected to the first optical modulation chip 404b, thereby providing a modulation drive signal to the first optical modulation chip 404b to drive the first optical modulation chip 404b to perform optical signal modulation.

[0347] In some embodiments, the second optical emitting component 400c may include a second modulation driver chip 406c. The second modulation driver chip 406c is located on one side of the second optical modulation chip 404c. The second modulation driver chip 406c is electrically connected to the second optical modulation chip 404c, thereby providing a modulation drive signal to the second optical modulation chip 404c to drive the second optical modulation chip 404c to modulate the optical signal.

[0348] In some embodiments, the first boss surface 703 a and the second boss surface 703 b present the same structure, and the first boss surface 703 a is taken as an example to illustrate its structural features.

[0349] In some embodiments, the first boss surface 703 a may include a first supporting surface 713 to support the first light modulation chip 404 b .

[0350] In some embodiments, the first boss surface 703a may include a second supporting surface 723. The second supporting surface 723 includes a first supporting surface 733 and a second supporting surface 743. The first supporting surface 733 is used to support the first laser 401b. The second supporting surface 743 is used to support the first optical fiber array 405b.

[0351] In some embodiments, the length of the second loading surface 743 is smaller than that of the first loading surface 733, so that the optical fiber fixing portion in the first optical fiber array 405b is suspended relative to the second loading surface 743, preventing the optical fiber fixing portion from being optically adhered to the surface of the second loading surface 743, thereby ensuring that the optical fiber fixing portion continues to wrap the optical fiber.

[0352] In some embodiments, there is a certain gap between the first supporting surface 713 and the second supporting surface 723 to collect the optical glue overflowed when the first light modulation chip 404b is coupled to the end face of the first optical fiber array 405b. In some embodiments, there is a certain gap between the first carrier surface 733 and the second carrier surface 743 to collect the optical glue overflowed when the first laser 401b and the first optical fiber array 405b are attached.

[0353] In some embodiments, the gold finger 301 can be electrically connected to TIA530c and TIA530d respectively, and can also be electrically connected to the first modulation driver chip 406b and the second modulation driver chip 406c respectively, so that a signal processing chip, such as a DSP chip, can be omitted. That is, a linear drive pluggable optical module (Linear-drive Pluggable Optics, LPO) is used to reduce the power consumption of the optical module. Among them, the LPO optical module removes the DSP / CDR chip in the optical module and integrates the relevant functions into the ASIC switching chip on the device side.

[0354] Fig.13c Another optical module assembly according to some embodiments is disassembled Figure 2 .like Fig.13c As shown, in some embodiments, the base 700b supports the first light emitting component 400b and the second light emitting component 400c at the same time, the base 700b has a larger extension surface and a larger heat dissipation area, more heat can be conducted through the base 700b, and the heat dissipation efficiency is improved, which is more conducive to the heat dissipation of the first light emitting component 400b and the second light emitting component 400c.

[0355] In some embodiments, the first modulation driving chip 406b is located on the surface of the circuit board 300. The first modulation driving chip 406b is located outside the first notch 307a.

[0356] In some embodiments, the second modulation driving chip 406 c is located on the surface of the circuit board 300 , and the second modulation driving chip 406 c is located outside the second notch 307 b .

[0357] In some embodiments, the surface of the base 700b is provided with: a first laser 401b, a first light modulation chip 404b, a first optical fiber array 405b, a first modulation driver chip 406b, a second laser 401c, a second light modulation chip 404c, a second optical fiber array 405c, and a second modulation driver chip 406c. The first laser 401b, the first light modulation chip 404b, and the first optical fiber array 405b are located in the first notch. The second laser 401c, the second light modulation chip 404c, and the second optical fiber array 405c are located in the second notch.

[0358] Fig.13d is a base and circuit board assembly diagram according to some embodiments, Fig.13e Another optical module assembly according to some embodiments is disassembled Figure 3 .like Fig.13d and Fig.13e As shown, in some embodiments, the surface of the base 700b for supporting the first light emitting component 400b and the second light emitting component 400c faces the lower surface of the circuit board, that is, the back of the circuit board, and the back of the circuit board faces the lower housing 202. The bottom surface of the base 700b faces the upper surface of the circuit board, that is, the front of the circuit board, and the front of the circuit board faces the upper housing 201.

[0359] In some embodiments, the upper housing 201 of the optical module can form a heat dissipation duct with the cage 106 of the host computer 100, so the upper housing 201 has a better heat dissipation effect than the lower housing 202. When the bottom surface of the base 700b faces the upper surface of the circuit board, the heat generated by the first light emitting component 400b and the second light emitting component 400c carried by the surface of the base 700b is conducted upward to the base 700b, and then conducted upward to the upper housing 201 through the base 700b, and the heat is conducted to the outside through the heat dissipation duct. It can be seen that the heat dissipation path of the first light emitting component 400b and the second light emitting component 400c is all the way upward, which is relatively smooth, and the heat dissipation duct of the upper housing can be fully utilized, thereby providing a better heat dissipation method.

[0360] Fig.14a Another cross section of an optical module according to some embodiments is shown in FIG. Figure 1 , Fig.14b FIG. 1 is another cross-sectional diagram of an optical module according to some embodiments. Figure 1 .like Fig.14a , 14bAs shown, in some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c and the second light receiving component 500d are disposed in a plane on the same surface of the circuit board 300. Exemplarily, they are disposed in a plane on the lower surface of the circuit board 300.

[0361] In some embodiments, the first laser 401b, the first light modulation chip 404b, and the first optical fiber array 405b are supported by the base 700b and embedded in the first notch 307a, which is more conducive to the heat dissipation of the first laser 401b, the first light modulation chip 404b, and the first optical fiber array 405b, and ensures the stability of the optical path.

[0362] In some embodiments, the second laser 401c, the second light modulation chip 404c, and the second optical fiber array 405c are supported by the base 700b and embedded in the second notch 307b. Similarly, this is more conducive to the heat dissipation of the second laser 401c, the second light modulation chip 404c, and the second optical fiber array 405c, and ensures the stability of the optical path.

[0363] In some embodiments, the position of the gold finger 301 extends along the length direction of the circuit board 300 as the routing direction of the high-frequency signal line. The first optical modulation chip 404b is connected to the first modulation driver chip 406b by wire bonding, and the first modulation driver chip 406b is wired to the surface of the circuit board 300 in the direction toward the gold finger 301, so as to realize high-frequency signal transmission between the first modulation driver chip 406b and the circuit board 300.

[0364] In some embodiments, the first optical modulation chip 404b is wired to the surface of the circuit board 300 along the width direction of the circuit board 300 to achieve low-frequency signal transmission between the first optical modulation chip 404b and the circuit board 300. The first modulation driver chip 406b is wired to the surface of the circuit board 300 along the width direction of the circuit board 300 to achieve low-frequency signal transmission between the first modulation driver chip 406b and the circuit board 300.

[0365] In some embodiments, the area of ​​the circuit board 300 between the first optical modulation chip 404b and the second optical modulation chip 404c is a common bonding area. The first optical modulation chip 404b and the second optical modulation chip 404c are respectively bonded to the common bonding area to achieve electrical connection with the circuit board 300.

[0366] In some embodiments, the area of ​​the circuit board 300 between the first modulation driver chip 406b and the second modulation driver chip 406c is a common bonding area. The first modulation driver chip 406b and the second modulation driver chip 406c are respectively bonded to the common bonding area to achieve electrical connection with the circuit board 300.

[0367] In some embodiments, from the perspective of heat dissipation, the first modulation driver chip 406b can be supported by the base 700b and embedded in the first notch 307a, and the heat generated by the first modulation driver chip 406b is conducted through the base 700b, which is more conducive to the heat dissipation of the first modulation driver chip 406b. The second modulation driver chip 406c is arranged in the same way.

[0368] In some embodiments, the first modulation driver chip 406b is wired in four directions. The first modulation driver chip 406b is wired to the first optical modulation chip 404b to achieve electrical connection, and the remaining three directions are wired to the surface of the circuit board 300. Exemplarily, the first modulation driver chip 406b is wired to the surface of the circuit board between the first notch 307a and the second notch 307b. Similarly, the second modulation driver chip 406c is wired to the surface of the circuit board between the first notch 307a and the second notch 307b.

[0369] In some embodiments, when the first modulation driving chip 406b and the second modulation driving chip 406c are respectively embedded in the first notch portion 307a and the second notch portion 307b, the surface of the circuit board 300 where the first modulation driving chip 406b and the second modulation driving chip 406c are located is hollowed out, and the inner layer wiring area of ​​the circuit board 300 is reduced.

[0370] In some embodiments, when the first modulation drive chip 406b and the second modulation drive chip 406c are respectively embedded in the first notch portion 307a and the second notch portion 307b, the area in the first notch portion 307a and the second notch portion 307b for embedding the first modulation drive chip 406b and the second modulation drive chip 406c will have a hole-digging range that is expanded outward compared to the chip size of the first modulation drive chip 406b and the second modulation drive chip 406c to avoid mounting interference with the first modulation drive chip 406b and the second modulation drive chip 406c. When the hole-digging range of the first notch portion 307a and the second notch portion 307b is expanded outward, the common wire bonding area between the first modulation drive chip 406b and the second modulation drive chip 406c will inevitably be reduced, and wiring cannot be performed. In addition, when the hole-digging range of the second notch portion 307b is expanded outward, it may exceed the edge of the circuit board 300.

[0371] In some embodiments, the first modulation driver chip 406b is located on the surface of the circuit board 300, and the first modulation driver chip 406b is located outside the first notch 307a. The second modulation driver chip 406c is located on the surface of the circuit board 300, and the second modulation driver chip 406c is located outside the second notch 307b. The inner layer of the circuit board 300 where the first modulation driver chip 406b and the second modulation driver chip 406c are located can be used for routing, which is more suitable for scenarios when the space of the circuit board 300 is limited. At the same time, in the limited space of the circuit board 300, the hole digging range of the first notch 307a and the second notch 307b enables the common area for wiring between the first optical modulation chip 404b and the second optical modulation chip 404c, and the common area for wiring between the first modulation driver chip 406b and the second modulation driver chip 406c to meet the wiring requirements.

[0372] In some embodiments, when the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500e and the second light receiving component 500f are all disposed on the surface of the circuit board 300, the first modulation driving chip 406b can be selected to be located on the surface of the circuit board 300, and the first modulation driving chip 406b is located outside the first notch 307a. Similarly, the second modulation driving chip 406c is located on the surface of the circuit board 300, and the second modulation driving chip 406c is located outside the second notch 307b.

[0373] In some embodiments, the first modulation drive chip 406b is located on the surface of the circuit board 300, and the second modulation drive chip 406c is located on the surface of the circuit board 300. The circuit board 300 is arranged between the first modulation drive chip 406b and the base 700b. The supporting area corresponding to the first modulation drive chip 406b in the base 700b is large, so as to facilitate the heat dissipation of the first modulation drive chip 406b. The heat dissipation path of the first modulation drive chip 406b is: the first modulation drive chip 406b, the circuit board 300, and the base 700b.

[0374] In some embodiments, the first optical modulation chip 404b is located on the surface of the base 700b, and the first modulation driver chip 406b is located on the surface of the circuit board 300. The first optical modulation chip 404b is embedded in the first notch 307a, so that the surface of the first optical modulation chip 404b is flush with the surface of the first modulation driver chip 406b, shortening the bonding length between the surface of the first optical modulation chip 404b and the surface of the first modulation driver chip 406b, which is beneficial to high-frequency signal transmission.

[0375] Fig.14c Another cross section of an optical module according to some embodiments is shown in FIG. Figure 1 , Fig.14d FIG. 1 is another cross-sectional diagram of an optical module according to some embodiments. Figure 1 .like Fig.14c, 14d As shown, in some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c and the second light receiving component 500d are disposed in a plane on the same surface of the circuit board 300. Exemplarily, they are disposed in a plane on the lower surface of the circuit board 300.

[0376] In some embodiments, the base 700b supports the first laser 401b, the first optical modulator chip 404b, and the first optical fiber array 405b in the first optical emitting component 400b, and also supports the second laser 401c, the second optical modulator chip 404c, and the second optical fiber array 405c in the second optical emitting component 400c.

[0377] In some embodiments, the first notch portion 307a is separated from the second notch portion 307b by the circuit board 300, and the first notch portion 307a is not connected to the second notch portion 307b, so as to reserve the circuit board area between the first notch portion 307a and the second notch portion 307b, reserve the common wiring area between the first optical modulation chip 404b and the second optical modulation chip 404c, and reserve the common wiring area between the first modulation driver chip 406b and the second modulation driver chip 406c, so as to facilitate the deployment of wiring, so that the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c and the second light receiving component 500d can be deployed in a plane on the same surface of the circuit board 300.

[0378] In some embodiments, the first notch portion 307a is connected to the second notch portion 307b, that is, the two constitute a notch portion. This is applicable to the scenario where there is no need for a common area for wire bonding between the first optical modulation chip 404b and the second optical modulation chip 404c, and there is no need for a common area for wire bonding between the first modulation driver chip 406b and the second modulation driver chip 406c. Exemplarily, the wire bonding pads for low-frequency signal transmission in the first optical modulation chip 404b and the second optical modulation chip 404c are mirror-imaged, the first optical modulation chip 404b is wired toward one edge of the circuit board 300, and the second optical modulation chip 404c is wired toward the other edge of the circuit board 300. The first modulation driver chip 406b is designed in the same way as the second modulation driver chip 406c.

[0379] Fig.15 FIG. 1 is another optical module layout structure diagram according to some embodiments. Fig.15 As shown, in some embodiments, a first light receiving component 500e and a second light receiving component 500f are disposed on the surface of the circuit board 300. In some embodiments, the first light receiving component 500e and the second light receiving component 500f can adopt the structure of the light receiving component 500b.

[0380] In some embodiments, the first light receiving component 500e may include a first lens assembly 510e. The first lens assembly 510e is projected onto the surface of the circuit board 300, and a first reflective surface is formed on the surface of the first lens assembly 510e. The first light receiving component 500e may include a first light receiving chip, which is located on the surface of the circuit board and on the reflected light path of the first reflective surface. For specific details, refer to the structure of the light receiving component 500b.

[0381] In some embodiments, the second light receiving component 500f may include a second lens assembly 510f.

[0382] In some embodiments, the first lens assembly 510e and the second lens assembly 510f are relatively large in size, and it may not be suitable to arrange them side by side along the width direction of the circuit board 300. In some embodiments, the first lens assembly 510e and the second lens assembly 510f are staggered and arranged on the same surface of the circuit board 300, which can fully utilize the space of the circuit board 300 to arrange the two at the same time and prevent the optical fiber array connected to the first lens assembly 510e from passing through the second lens assembly 510f.

[0383] In some embodiments, the second lens assembly 510f is buckled on the surface of the circuit board 300 to form a wrapping cavity with the surface of the circuit board 300. A second reflective surface is formed on the surface of the second lens assembly 510f.

[0384] In some embodiments, the second light receiving component 500f may include a light receiving chip 520f. The light receiving chip 520f is located in the encapsulated cavity surrounded by the second lens assembly 510f and the circuit board 300. The light receiving chip 520f is located on the surface of the circuit board 300 and is covered by the second lens assembly 510f. The light receiving chip 520f is located on the reflection light path of the second reflection surface.

[0385] In some embodiments, the second light receiving component 500f may include a TIA530f. The TIA530f is located on one side of the light receiving chip 520f. The TIA530f is located in a packaged cavity surrounded by the second lens assembly 510f and the circuit board 300. The TIA530f is located on the surface of the circuit board 300 and is covered by the second lens assembly 510f.

[0386] In some embodiments, a reflective surface 511f is formed on the surface of the second lens assembly 510f. The reflective surface 511f is formed above the light receiving chip 520f. The light route can be turned toward the surface of the light receiving chip 520f along the surface parallel to the circuit board 300 through the reflective surface 511f, thereby coupling the optical signal into the light receiving chip.

[0387] In some embodiments, the circuit board 300 has a large thermal expansion coefficient and a relatively poor surface optical path stability. A groove 309 is formed on the surface of the circuit board 300, and a substrate 521 is provided on the surface of the groove 309. The surface of the substrate 521 carries the light receiving chip 520f. The thermal expansion coefficient of the substrate 521 is relatively smaller than the thermal expansion coefficient of the circuit board 300, thereby ensuring the stability of the optical path transmission of the light receiving chip 520f.

[0388] In some embodiments, the thickness of the substrate 521 allows the light receiving chip 520 f to be flush with the surface of the TIA 530 f , thereby shortening the wire bonding length between the substrate 521 and the TIA 530 f .

[0389] In some embodiments, the first light receiving component 500e may adopt the same structure as the second light receiving component 500f.

[0390] Fig.16 FIG. 2 is a side view of another optical module according to some embodiments. Fig.16 As shown, in some embodiments, the first light emitting component 400d and the second light emitting component 400e are arranged toward one surface of the circuit board, and the first light receiving component 500g and the second light receiving component 500h are arranged toward the other surface of the circuit board. The upper and lower three-dimensional deployment can fully utilize the packaging space of the upper and lower surfaces of the circuit board 300.

[0391] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are disposed toward the upper surface of the circuit board, and the first light receiving component 500g and the second light receiving component 500h are disposed toward the lower surface of the circuit board.

[0392] In some embodiments, the first light emitting component 400 d and the second light emitting component 400 e are located in a cavity formed by the circuit board 300 and the upper housing 201 .

[0393] In some embodiments, the first light receiving component 500 g and the second light receiving component 500 h are located in a cavity formed by the circuit board 300 and the lower housing 202 .

[0394] In some embodiments, the surfaces of the first light emitting component 400d and the second light emitting component 400e are covered with a protective cover 400f to protect the first light emitting component 400d and the second light emitting component 400e.

[0395] Fig.17 FIG. 2 is a cross-sectional structural diagram of another optical module according to some embodiments. Fig.17 As shown, in some embodiments, the optical module may include a base 800 . The base 800 is embedded in the circuit board 300 , and the base 800 is fixed on the circuit board 300 .

[0396] In some embodiments, a surface of the base 800 faces the upper housing 201 , and the surface is used to support the first light emitting component 400 d and the second light emitting component 400 e . Exemplarily, the surface is the top surface of the base 800 .

[0397] In some embodiments, another surface of the base 800 faces the lower housing 202 , and the surface is used to support the first light receiving component 500g and the second light receiving component 500h . Exemplarily, the surface is the bottom surface of the base 800 .

[0398] Fig.18 A circuit board upper surface structure according to some embodiments Figure 1 , Fig.19 A circuit board upper surface structure according to some embodiments Figure 2 .like Fig.18 and Fig.19 As shown, in some embodiments, the first light emitting component 400d and the second light emitting component 400e are disposed toward the upper surface of the circuit board 300. The surfaces of the first light emitting component 400d and the second light emitting component 400e are covered with a protective cover 400f.

[0399] In some embodiments, the first light emitting component 400 d and the second light emitting component 400 e are located on a surface of the base 800 facing the upper housing 201 .

[0400] In some embodiments, a first signal processing chip 304a is disposed on one side of the first light emitting component 400d, and a second signal processing chip 304b is disposed on one side of the second light emitting component 400e, so as to prevent high-frequency signal crosstalk between the first light emitting component 400d and the second light emitting component 400e.

[0401] Fig. 20 A circuit board lower surface structure according to some embodiments Figure 1 .like Fig. 20 As shown, in some embodiments, the first light receiving component 500g and the second light receiving component 500h are disposed toward the lower surface of the circuit board 300. The surfaces of the first light receiving component 500g and the second light receiving component 500h are covered with a cover plate 305a.

[0402] In some embodiments, the first light receiving component 500 g and the second light receiving component 500 h are located on a surface of the base 800 facing the lower housing 202 .

[0403] Fig.21 A circuit board lower and upper surface structure according to some embodiments Figure 2 .like Fig.21 As shown, in some embodiments, the first light receiving component 500i and the second light receiving component 500j are disposed toward the lower surface of the circuit board 300.

[0404] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located in the cavity formed by the circuit board 300 and the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located in the cavity formed by the circuit board 300 and the lower housing 201.

[0405] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500g and the second light receiving component 500h are located on the surface of the base 800 facing the lower housing 202. Exemplarily, the first light receiving component 500g and the second light receiving component 500h adopt a micro-optical packaging solution.

[0406] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board 300. Exemplarily, the first light receiving component 500i and the second light receiving component 500j adopt a COB packaging solution.

[0407] In some embodiments, the optical fiber ribbons in the first light receiving component 500 i and the second light receiving component 500 j shuttle through the surface of the base 800 toward the lower housing 202 .

[0408] Fig. 22 FIG. 2 is another exploded view of an optical module according to some embodiments. Fig. 22 As shown, in some embodiments, a first notch 307c and a second notch 307d are formed on the surface of the circuit board 300. A first signal processing chip 304a is disposed on one side of the first notch 307c, and a second signal processing chip 304b is disposed on one side of the second notch 307d.

[0409] In some embodiments, the first notch portion 307c and the second notch portion 307d are independent of each other and are not connected to each other, so as to reserve a wiring space on the surface of the circuit board 300 between the first notch portion 307c and the second notch portion 307d.

[0410] In some embodiments, a first boss surface 810 and a second boss surface 820 are formed on the top surface of the base 800. The first boss surface 810 extends into the first notch portion 307c, and the second boss surface 820 extends into the second notch portion 307d, so that the base 800 is embedded on the circuit board 300.

[0411] In some embodiments, the surface of the first boss 810 is used to support the first light emitting component 400d, and the second boss 820 is used to support the second light emitting component 400e. The first boss 810 extends into the first notch 307c, so that the first light emitting component 400d is disposed toward the upper surface of the circuit board 300. The second boss 820 extends into the second notch 307d, so that the second light emitting component 400e is disposed toward the upper surface of the circuit board 300. The base 800 has excellent heat dissipation characteristics, and the base 800 can conduct the heat generated by the first light emitting component 400d and the second light emitting component 400e.

[0412] Fig.23a is a circuit board upper surface mounting structure diagram according to some embodiments, Figure 23b FIG. 1 is an exploded view of a base and a light emitting component according to some embodiments. Fig.23a and Figure 23b As shown, in some embodiments, the first light emitting component 400d is embedded in the first notch portion 307c by the base 800, and the second light emitting component 400e is embedded in the second notch portion 307d by the base 800.

[0413] In some embodiments, the first light emitting component 400d may include a first laser 401d. The first light emitting component 400d may include a first lens 402d. The first light emitting component 400d may include a first isolator 403d. The first light emitting component 400d may include a first optical modulation chip 404d. The first light emitting component 400d may include a first optical fiber array 405d. The first light emitting component 400d may include a first modulation driver chip 406d. The optical path principle may refer to the first light emitting component 400b.

[0414] In some embodiments, the second light emitting component 400e may include a second laser 401e. The second light emitting component 400e may include a second lens 402e. The second light emitting component 400e may include a second isolator 403e. The second light emitting component 400e may include a second optical modulation chip 404e. The second light emitting component 400e may include a second optical fiber array 405e. The second light emitting component 400e may include a second modulation driver chip 406e. The optical path principle may refer to the first light emitting component 400b.

[0415] In some embodiments, the first isolator 403d is disposed at one side of the light entrance of the first optical modulation chip 404d, and the light output by the first isolator 403d is incident on the first optical modulation chip 404d through the air.

[0416] In some embodiments, an optical refractive index matching glue is provided between the first optical fiber array 405d and the end face of the first optical modulation chip 404d, and the optical signal modulated by the first optical modulation chip 404d is coupled into the first optical fiber array 405d through the optical refractive index matching glue.

[0417] In some embodiments, the first modulation driver chip 406d is wired in four directions. The first modulation driver chip 406d is wired to the first optical modulation chip 404d, and the remaining three directions are wired to the circuit board 300. Exemplarily, the circuit board 300 surface between the first notch 307c and the second notch 307d is wired. Similarly, the second modulation driver chip 406e is wired to the circuit board 300 surface between the first notch 307c and the second notch 307d, so the first light emitting component 400d is embedded in the first notch 307c, and the second light emitting component 400e is embedded in the second notch 307d.

[0418] In some embodiments, the second boss surface 820 may include a first supporting surface 821. The first supporting surface 821 supports the second laser 401e, the second lens 402e, the second isolator 403e and the second optical fiber array 405e.

[0419] In some embodiments, the second boss surface 820 may include a second supporting surface 822. The second supporting surface 822 supports the second light modulation chip 404e.

[0420] In some embodiments, the second boss surface 820 may include a third supporting surface 823. The third supporting surface 823 supports the second modulation driving chip 406e.

[0421] Fig.23c FIG. 1 is a structural diagram of a first light emitting component according to some embodiments. Fig.23c As shown, in some embodiments, the first optical modulation chip 404d is coupled to the end face of the first optical fiber array 405d.

[0422] In some embodiments, the light input and output end face of the first optical modulation chip 404d includes a light input port 414d and a light output port 424d. The light input port 414d and the light output port 424d are located on the same end face. The light input port 414d faces the first isolator 403d. The light output port 424d faces the first optical fiber array 405d.

[0423] In some embodiments, the light input waveguide corresponding to the light input port 414d is vertically arranged relative to the light input end face of the first optical modulation chip 404d, and the light output waveguide corresponding to the light output port 424d is tilted relative to the light output end face of the first optical modulation chip 404d.

[0424] In some embodiments, the light input and output end surface of the first optical modulation chip 404 d is arranged perpendicularly to the long side of the circuit board 300 .

[0425] In some embodiments, the first laser 401d, the first lens 402d, and the first isolator 403d are arranged vertically relative to the light incident end face of the first optical modulation chip 404d, so that the light output axis of the first laser 401d is consistent with the light incident axis of the first optical modulation chip 404d, so as to improve the efficiency of coupling the light source emitted by the first laser 401d to the light incident waveguide.

[0426] In some embodiments, the first optical fiber array 405d is tilted relative to the light output end face of the first optical modulation chip 404d so that the light input axis of the first optical fiber array 405d is consistent with the light output axis of the first optical modulation chip 404d to improve the coupling efficiency between the first optical modulation chip 404d and the first laser 401d.

[0427] In some embodiments, the light-entering end face of the first optical fiber array 405d is set as a bevel, and the light-entering end face of the internal optical fiber is also set as a bevel to prevent the optical signal incident into the first optical fiber array 405d from returning to the first optical modulation chip 404d, thereby improving the return loss and allowing more light to be transmitted in the optical fiber. Exemplarily, the light-entering end face of the optical fiber array 405a is polished into a bevel with an angle of 8°.

[0428] In some embodiments, the first optical fiber array 405d is relatively long and is tilted relative to the light-emitting end face of the first optical modulation chip 404d. The first notch 307c has a larger hole area to accommodate the tilted placement of the first optical fiber array 405d. Similarly, the second notch 307d has a larger hole area to accommodate the tilted placement of the second optical fiber array 405e. This results in a reduction in the available space on the upper surface of the circuit board 300, making it impossible to deploy the first light receiving component 500g and the second light receiving component 500h on the upper surface of the circuit board 300.

[0429] Fig.24 FIG. 1 is a diagram of a top and bottom surface structure of a base according to some embodiments. Fig.24 As shown, in some embodiments, the two ends of the top surface of the base 800 support the circuit board 300 , and the circuit board 300 is embedded in the base 800 .

[0430] In some embodiments, the second boss surface 820 is used to support the second light emitting component 400 e . The second boss surface 820 extends into the second notch portion 307 d , so that the second light emitting component 400 e is disposed toward the upper surface of the circuit board 300 .

[0431] In some embodiments, since the first light receiving component 500g and the second light receiving component 500h are located in the cavity formed by the circuit board 300 and the lower shell 201, the upper surface of the circuit board 300 has a larger hole area for the first notch portion 307c and the second notch portion 307d, so that the first modulation drive chip 406d can be set on the surface of the base 800 and embedded in the first notch portion 307c, and the second modulation drive chip 406e is set on the surface of the base 800 and embedded in the second notch portion 307d, which is beneficial to the heat dissipation of the first modulation drive chip 406d and the second modulation drive chip 406e.

[0432] In some embodiments, the second optical fiber array 405e is located on the surface of the first supporting surface 821 , the second optical modulation chip 404e is located on the surface of the second supporting surface 822 , and the second modulation driving chip 406e is located on the surface of the third supporting surface 823 .

[0433] In some embodiments, the height of the third supporting surface 823 makes the surface of the second modulation driver chip 406e flush with the surface of the circuit board 300, or as close as possible to the surface of the circuit board 300, so as to shorten the bonding length between the second modulation driver chip 406e and the surface of the circuit board 300. The second modulation driver chip 406e is electrically connected to the second signal processing chip through the wiring on the surface of the circuit board 300.

[0434] In some embodiments, the height difference between the third supporting surface 823 and the second supporting surface 822 makes the optical axes of the second modulation driver chip 406e and the second optical modulation chip 404e consistent. The height difference between the second supporting surface 822 and the first supporting surface 821 makes the optical axes of the second optical modulation chip 404e and the second optical fiber array 405e consistent.

[0435] In some embodiments, the second optical fiber array 405e is glued to the surface of the first supporting surface 821. The second optical modulation chip 404e is glued to the surface of the second supporting surface 822. A groove 824 is formed between the first supporting surface 821 and the second supporting surface 822 to collect the glue overflowing from the surface of the first supporting surface 821 and the surface of the second supporting surface 822, and the glue overflowing when the second optical fiber array 405e is coupled with the end face of the second optical modulation chip 404e.

[0436] In some embodiments, the top surface of the base 800 is used to carry the first light emitting component 400d and the second light emitting component 400e. The bottom surface of the base 800 is used to carry the first light refracting member in the first light receiving component 500g and the second light refracting member in the second light receiving component 500h. The top and bottom surfaces of the base 800 are fully utilized to achieve three-dimensional deployment and integrated deployment, which is more conducive to wiring and more conducive to reducing the occupied circuit board space.

[0437] In some embodiments, a first light emitting component may also be disposed on the top surface of the base 800. A first light receiving component may be disposed on the bottom surface of the base 800. For specific structures, the top surface of the base 800 is used to carry the first light emitting component and the second light emitting component. The bottom surface of the base 800 is used to carry the first refraction member in the first light receiving component and the second refraction member in the second light receiving component. The packaging structures can be mutually referenced and will not be described in detail.

[0438] Fig.25 FIG. 1 is a diagram of a bottom surface assembly structure of a base according to some embodiments. Fig.25 As shown, in some embodiments, the bottom surface of the base 800 carries optical devices, so that both the top and bottom surfaces of the base 800 carry optical devices, thereby fully utilizing the base 800.

[0439] In some embodiments, the first light receiving component 500g may include a first folding member 510g. The first light receiving component 500g may include a first converging lens 520g. The first light receiving component 500g may include a first light receiving chip array 530g. The first light receiving component 500g may include a first TIA 540g.

[0440] In some embodiments, the second light receiving component 500h may include a second folding member 510h. The second light receiving component 500g may include a second converging lens 520h. The second light receiving component 500h may include a second light receiving chip array 530h. The second light receiving component 500h may include a second TIA 540h.

[0441] In some embodiments, the first light folding member 510g and the second light folding member 510h are located on the bottom surface of the base 800. The first TIA 540g and the second TIA 540h are located on the surface of the circuit board 300.

[0442] In some embodiments, as the communication rate increases, the overall power consumption of the optical module increases, and the heat dissipation demand increases accordingly. At present, air cooling, liquid cooling and other methods can be used for heat dissipation. According to the heat exchange method, the liquid cooling method includes immersion, spraying and the like. The immersion and spraying liquid cooling systems are achieved by direct contact between the cooling medium and the heat dissipation device. The immersion liquid cooling system directly immerses the host computer and the optical module in the cooling medium. The cooling medium absorbs the heat generated by the heat dissipation device and transfers the heat to the water in the heat exchange, and then transfers the heat to the heat dissipation device through the water circulation. Exemplarily, the cooling medium is a refrigerant, such as a fluorinated liquid.

[0443] In some embodiments, the surfaces of the first light receiving component 500g and the second light receiving component 500h are covered with a cover plate 305a.

[0444] In some embodiments, the cover plate 305a may extend along the surface of the first light receiving component 500g and the second light receiving component 500h and bend toward the surface of the circuit board 300 to cover and wrap the first light receiving component 500g and the second light receiving component 500h to prevent the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical paths.

[0445] In some embodiments, when liquid cooling is used to dissipate heat from the optical module, the cooling medium used in the liquid cooling may affect the optical path. To this end, a protective cover 400f is formed on the surface of the first light emitting component 400d and the second light emitting component 400e, thereby wrapping the first light emitting component 400d and the second light emitting component 400e to prevent the cooling medium from entering the interior and affecting the optical path.

[0446] In some embodiments, in order to protect the first light receiving component 500g and the second light receiving component 500h, the base 800 includes an enclosure 830. A cover plate 305a is provided above the first light receiving component 500g and the second light receiving component 500h, one end of the cover plate 305a is provided on the surface of the base 800 body, and the other end is provided on the surface of the enclosure 830. The first light receiving component 500g and the second light receiving component 500h are located in the package cavity formed by the cover plate 305a and the enclosure 830, so as to prevent the cooling medium from entering the first light receiving component and the second light receiving component during liquid cooling and heat dissipation, thereby affecting their optical paths.

[0447] In some embodiments, the enclosure 830 is placed on the surface of the circuit board 300 and exposes the surface of the circuit board 300 surrounded by the enclosure 830 , so that the first light receiving chip array and the second light receiving chip array are located on the surface of the circuit board surrounded by the enclosure 830 .

[0448] In some embodiments, the enclosure 830 is formed on one side of the first light receiving component 500g and the second light receiving component 500h. The enclosure 830 can be a C-shaped frame. The enclosure 830 encloses the first light receiving component 500g and the second light receiving component 500h to support the cover plate 305a, so that the cover plate 305a is covered on the surface of the first light receiving component 500g and the second light receiving component 500h to prevent the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical paths.

[0449] In some embodiments, the cover plate 305a is covered on the bottom surface of the main structure of the base 800 and the bottom surface of the enclosure 830, thereby covering the surface of the first light receiving component 500g and the second light receiving component 500h.

[0450] In some embodiments, one end of the cover plate 305a is covered on the bottom surface of the main structure of the base 800, and the other end is covered on the bottom surface of the enclosure 830, so as to shield the first light receiving component 500g and the second light receiving component 500h. The first light receiving component 500g and the second light receiving component 500h are located in the package cavity formed by the cover plate 305a and the enclosure 830, so as to prevent the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical paths.

[0451] In some embodiments, an embedding groove 850 is formed along the bottom surface of the base 800 main structure and the bottom surface of the enclosure 830 to embed the cover 305a in the surface of the base 800 main structure and the surface of the enclosure 830, thereby fixing the cover 305a to the bottom surface of the base 800.

[0452] In some embodiments, the shape of the embedding groove 850 is adapted to the cover plate 305 a so as to fix the cover plate 305 a on the base 800 . Fig.26a is a structural diagram of an assembly of a first refraction member and a first converging lens according to some embodiments, Figure 26b FIG. 1 is an exploded view of an assembly of a first refraction member and a first converging lens according to some embodiments. Fig.26a and Figure 26b As shown, in some embodiments, the first folding member 510g is fixedly connected to the first converging lens 520g.

[0453] In some embodiments, the first light-bending member 510g may include a first fiber support portion 511g and a second fiber support portion 512g. An optical fiber 513g is clamped between the first fiber support portion 511g and the second fiber support portion 512g. The first fiber support portion 511g is relatively thick to facilitate clamping and coupling of the first light-bending member 510g.

[0454] In some embodiments, a reflective end face 514g is formed at the end of the optical fiber 513g, and the reflective end face 514g is located above the first light receiving chip array 530g. The reflective end face 514g is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513g, so as to reflect the optical signal transmitted in the optical fiber 513g to the first light receiving chip array 530g. Exemplarily, the reflective end face 514g is an inclined surface, and the received optical signal transmitted by the optical fiber 513g is totally reflected at the reflective end face 514g. Exemplarily, the inclination angle of the reflective end face 514g is 46-50°, such as the inclination angle is 48°, etc.

[0455] In some embodiments, the end surface of the first optical fiber support portion 511g is formed with a protective surface 516g, which surrounds the side of the reflective end surface 514g and is used to protect the reflective end surface 514g. Exemplarily, the protective surface 516g is an inclined surface, and the inclination angle of the protective surface 516g is 46-50°, such as 48°.

[0456] In some embodiments, the reflective end face 514g and the protective face 516g are formed by grinding and polishing. The end face of the optical fiber 513g is ground to a certain tilt angle to form the reflective end face 514g. The optical fiber 513g is cylindrical, and the cross section of the reflective end face 514g after grinding is elliptical, so the bottom of the optical fiber 513g is exposed relative to the first optical fiber support part 511g. The optical fiber 513g is soft, and the optical fiber segment exposed relative to the first optical fiber support part 511 may be broken when it is not protected.

[0457] In some embodiments, the first folding member 510g may include an optical fiber fixing portion 515g. The optical fiber fixing portion 515g is located below the first optical fiber supporting portion 511g and in a space enclosed by the end of the second optical fiber supporting portion 512g. The optical fiber fixing portion 515g protects and buffers the optical fiber 513g. The optical fiber fixing portion 515g may be a soft rubber to protect and buffer the optical fiber 513g.

[0458] In some embodiments, the reflective end surface 514g has a preset distance from the first light receiving chip array 530g, such as a first preset value, to ensure that the light signal reflected by the reflective end surface 514g falls within the photosensitive surface range of the light receiving chip in the first light receiving chip array 530g. Exemplarily, the first preset value is relatively small, such as 0.02 mm.

[0459] In some embodiments, since the top and bottom surfaces of the base 800 both support optical devices, the base 800 is required to have a strong supporting force to ensure the stability of the optical path.

[0460] In some embodiments, the first converging lens 520g is fixed on the surface of the second optical fiber support portion 512g facing the first light receiving chip array 530g. The second optical fiber support portion 512g extends to below the reflective end surface 514g, so that the first converging lens 520g is located between the reflective end surface 514g and the first light receiving chip array 530g, and the light emitting surface of the first converging lens 520g faces the first light receiving chip array 530g. The first converging lens 520g performs converging processing on the optical signal reflected from the reflective end surface 514g, so that the optical signal reflected from the reflective end surface 514g falls within the photosensitive surface range of the optical receiving chip in the first light receiving chip array 530g. In this way, the reflective end surface 514g can be moved away from the surface of the circuit board 300, and the distance between the reflective end surface 514g and the first light receiving chip array 530g can be increased, thereby increasing the thickness between the top and bottom surfaces of the base 800, increasing the support of the base 800 for the optical device, and ensuring the stability of the optical path.

[0461] In some embodiments, the first converging lens 520g converges the light signal reflected from the reflective end surface 514g to compensate for the optical path difference from the reflective end surface 514g to the first light receiving chip array 530g caused by the increased thickness of the base 800, so that the light signal reflected from the reflective end surface 514g falls within the photosensitive surface range of the light receiving chip in the first light receiving chip array 530g.

[0462] In some embodiments, the thickness of the base 800 can ensure that the first converging lens 520g is disposed between the reflective end surface 514g and the first light receiving chip array 530g, and can ensure the focal length from the first converging lens 520g to the first light receiving chip array 530g.

[0463] In some embodiments, the second optical fiber supporting portion 512g extends below the reflective end surface 514g to wrap the reflective end surface 514g to prevent fiber breakage.

[0464] In some embodiments, the protective surface 516g, the reflective end surface 514g, and the end surface of the second optical fiber support portion 512g have the same inclination. The protective surface 516g and the second optical fiber support portion 512g are adapted to the inclination of the reflective end surface 514g.

[0465] In some embodiments, the first light receiving chip array 530g may be located on the surface of the first TIA540g, so that the first light receiving chip array 530g is at a certain distance from the surface of the circuit board 300, and the reflection end surface 514g may be further away from the surface of the circuit board 300, further increasing the distance between the reflection end surface 514g and the first light receiving chip array 530g, thereby increasing the thickness between the top and bottom surfaces of the base 800, and increasing the support of the base 800 for the optical device. At the same time, the distance between the first light receiving chip array 530g and the first converging lens 520g can be shortened to increase the coupling efficiency. At the same time, it is also beneficial to the high-frequency signal transmission performance between the first light receiving chip array 530g and the first TIA540g.

[0466] Fig. 27 This is a bottom surface assembly structure diagram of a base according to some embodiments. Fig.28 is a cross-sectional view of a bottom surface assembly of a base according to some embodiments, Fig.29 FIG. 1 is a structural diagram of the bottom surface of a base according to some embodiments. Figure 27-29 As shown, in some embodiments, the bottom surface of the base 800 carries a first folding member 510g and a second folding member 510h.

[0467] In some embodiments, the surface where the second optical fiber supporting portion 512g is located is recessed from the surface through which the optical fiber 513g passes, thereby providing bending space for the optical fiber 513g to avoid fiber breakage.

[0468] In some embodiments, the optical fiber 513g passes through the inside of the optical fiber fixing portion 515g. The second optical fiber supporting portion 512g is fixed to the surface of the base 800 by gluing.

[0469] In some embodiments, a groove 840 is formed on one side of the surface where the second optical fiber supporting portion 512g is located. The optical fiber fixing portion 515g is extended from the position of the groove 840. The groove 840 can make the surface where the optical fiber fixing portion 515g is located lower than the surface where the second optical fiber supporting portion 512g is located, thereby preventing the optical fiber fixing portion 515g from being glued to the surface where the second optical fiber supporting portion 512g is located, and maintaining the wrapping force of the optical fiber fixing portion 515g on the optical fiber 513g.

[0470] In some embodiments, a spacer 860 is formed on the bottom surface of the base 800. The spacer 860 can be located in the middle position, dividing the surface through which the optical fiber 513g passes into a first channel 870 and a second channel 880, so as to provide shuttle channels for the optical fiber ribbons of the first light receiving component 500g and the second light receiving component 500h, respectively, to avoid fiber winding.

[0471] Fig.30 Another cross-sectional structure of an optical module according to some embodiments Figure 1 , Fig.31Another cross-sectional structure of an optical module according to some embodiments Figure 2 , Fig.32 FIG. 1 is a partial cross-sectional view of another optical module according to some embodiments. Figure 30-32 As shown, in some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board 300.

[0472] In some embodiments, the first light receiving component 500i may include a first lens assembly 510i. The first lens assembly 510i is located on one side of the base 800. The first lens assembly 510i is buckled to the lower surface of the circuit board 300.

[0473] In some embodiments, the second light receiving component 500j may include a second lens assembly 510j. The second lens assembly 510j is located at one side of the base 800. The second lens assembly 510j is buckled to the lower surface of the circuit board 300.

[0474] In some embodiments, the optical fiber ribbons in the first light receiving component 500 i and the second light receiving component 500 j shuttle through the surface of the base 800 toward the lower housing 202 .

[0475] In some embodiments, the first light receiving component 500i and the second light receiving component 500j may have the same structure. In some embodiments, the two structures may adopt the same structure as the light receiving component 500b. In some embodiments, the two structures may adopt the same structure as the second light receiving component 500f. No further description will be given.

[0476] In some embodiments, the top surface of the base 800 is used to carry the first light emitting component 400d and the second light emitting component 400e. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board, realizing three-dimensional and integrated deployment, which is more conducive to wiring and reducing the occupied circuit board space.

[0477] In some embodiments, a first light emitting component 400d may also be provided on the top surface of the base 800. The first light receiving component 500i is located on the lower surface of the circuit board. For specific structures, the top surface of the base 800 is used to carry the first light emitting component 400d and the second light emitting component 400e. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board. The packaging structures can be mutually referenced and will not be described in detail.

[0478] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An optical module, characterized in that: include: A circuit board has a first notch portion and a second notch portion, and a first substrate and a second substrate are provided on the surface of the circuit board; A base, a surface of which is provided with a first light emitting component and a second light emitting component respectively; The first light emitting component comprises: a first laser, disposed on the surface of the base and located in the first notch, wherein the first laser is configured to output light that does not carry a signal; a first optical modulation chip, located in the first notch, and configured to modulate the light not carrying a signal to generate an optical signal; A first optical fiber array is located in the first notch and is coupled to the end face of the first optical modulation chip to transmit the optical signal; A first modulation driving chip is electrically connected to the first optical modulation chip and is wire-bonded to the surface of the circuit board between the first notch and the second notch; The second light emitting component comprises: a second laser disposed on the surface of the base and located in the second notch, wherein the second laser is configured to output light that does not carry a signal; a second optical modulation chip, located in the second notch, and configured to modulate the light not carrying a signal to generate an optical signal; A second optical fiber array is located in the second notch and is coupled to the end face of the second optical modulation chip to transmit the optical signal; A second modulation driving chip is electrically connected to the second optical modulation chip and is wire-bonded to the surface of the circuit board between the first notch and the second notch; The first light receiving component is disposed on the surface of the circuit board and includes: A first refracting element is provided on the surface of the first substrate, and a first reflective end surface is formed on the end surface of the first refracting element; wherein the thermal expansion coefficient of the first substrate is smaller than the thermal expansion coefficient of the circuit board; A first light receiving chip is disposed on the surface of the first substrate and is located on the reflection light path of the first reflection end surface; a second light receiving component is disposed on the surface of the circuit board, comprising: A second refracting member, the bottom end of which is fixed to the surface of the second substrate, and the end surface of the second refracting member is formed with a second reflective end surface; wherein the thermal expansion coefficient of the second substrate is smaller than the thermal expansion coefficient of the circuit board; The second light receiving chip is arranged on the surface of the second substrate and is located on the reflection light path of the second reflection end surface.

2. The optical module according to claim 1, characterized in that: A first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is provided on one side of the light entrance of the first optical modulation chip, and the light output by the first isolator is incident on the first optical modulation chip through the air; An optical refractive index matching glue is provided between the first optical fiber array and the end face of the first optical modulation chip, and the optical signal modulated by the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching glue.

3. The optical module according to claim 1, characterized in that: The surface of the base is formed with a first convex surface and a second convex surface; the first convex surface is embedded in the first notch portion to carry the first light emitting component; The second boss surface is embedded in the second notch portion to carry the second light emitting component; The first optical fiber array comprises: a first support portion; A second supporting portion, sandwiching a plurality of optical fibers with the first supporting portion; a fixing portion connected to the second supporting portion; The first convex surface comprises: A first supporting surface, used for carrying the first optical modulation chip; The second supporting surface includes a first supporting surface and a second supporting surface, wherein the first supporting surface is used to support the first laser, and the second supporting surface is used to support the first optical fiber array.

4. The optical module according to claim 3, characterized in that: The first optical modulation chip is fixed to the first supporting surface by glue, the first laser is fixed to the first carrying surface by glue, and the first optical fiber array is fixed to the second carrying surface by glue; The second loading surface is shorter than the first loading surface, so that the fixing portion is suspended relative to the second loading surface; There is a certain gap between the first supporting surface and the second supporting surface to collect the glue; There is a certain gap between the first carrying surface and the second carrying surface to collect the glue.

5. The optical module according to claim 1, characterized in that: The end surface of the first optical modulation chip is formed with a light input port and a plurality of light output ports, and the plurality of light output ports have the same output wavelength; The light input port faces the first laser to receive a beam of light without a signal output by the first laser; The light output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array; The input light waveguide and the output light waveguide of the first light modulation chip are respectively non-perpendicular to the end face of the first light modulation chip; The light incident end face of the first optical fiber array is set as an inclined surface, and the inclined surface is coupled and connected to the end face of the first optical modulation chip.

6. The optical module according to claim 5, characterized in that: The first notch portion comprises: A first through hole portion, used for embedding the first laser and the first optical fiber array; a second through hole portion connected to one end of the first through hole portion, the second through hole portion being used to embed the first optical modulation chip, and the second through hole portion being inclined relative to the first through hole portion; The third through hole portion is connected to the other end of the first through hole portion, and the size of the third through hole portion is smaller than that of the first through hole portion; the first optical fiber array passes through the third through hole portion.

7. The optical module according to claim 1, characterized in that: The surface of the first substrate includes a concave surface and a convex platform, the concave surface is used to carry the first light refracting element, and the convex platform is used to carry the first light receiving chip.

8. The optical module according to claim 1, characterized in that: The first light receiving component includes a first TIA, and the first TIA is located on the surface of the circuit board; A groove portion is formed on the surface of the circuit board, and the first substrate and the second substrate are respectively arranged in the groove portion, so that the first light receiving chip is flush with the surface of the first TIA.

9. The optical module according to claim 1, characterized in that: The first substrate and the second substrate may be connected together.

10. An optical module, characterized in that: include: The circuit board has a first notch portion and a second notch portion; A first substrate, located on the upper surface of the circuit board; A second substrate, located on the upper surface or the lower surface of the circuit board; The base has the following surfaces: a first laser, disposed on the surface of the base and located in the first notch, wherein the first laser is configured to output light that does not carry a signal; a first optical modulation chip, located in the first notch, and configured to modulate the light not carrying a signal to generate an optical signal; A first optical fiber array is located in the first notch and is coupled to the end face of the first optical modulation chip to transmit the optical signal; A first modulation driving chip is electrically connected to the first optical modulation chip and is wire-bonded to the surface of the circuit board between the first notch and the second notch; a second laser disposed on the surface of the base and located in the second notch, wherein the second laser is configured to output light that does not carry a signal; a second optical modulation chip, located in the second notch, and configured to modulate the light not carrying a signal to generate an optical signal; A second optical fiber array is located in the second notch and is coupled to the end face of the second optical modulation chip to transmit the optical signal; A second modulation driving chip is electrically connected to the second optical modulation chip and is wire-bonded to the surface of the circuit board between the first notch and the second notch; A first refracting element is provided on the surface of the first substrate, and a reflective end surface is formed on the end surface of the first refracting element; wherein the thermal expansion coefficient of the first substrate is smaller than the thermal expansion coefficient of the circuit board; A first light receiving chip is disposed on the surface of the first substrate and is located on the reflection light path of the reflection end surface; A second refracting member, the bottom end of which is fixed to the surface of the second substrate, and the end surface of the second refracting member is formed with a reflective end surface; wherein the thermal expansion coefficient of the second substrate is smaller than the thermal expansion coefficient of the circuit board; The second light receiving chip is arranged on the surface of the second substrate and is located on the reflection light path of the reflection end surface.

11. The optical module according to claim 10, characterized in that: A first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is provided on one side of the light entrance of the first optical modulation chip, and the light output by the first isolator is incident on the first optical modulation chip through the air; An optical refractive index matching glue is provided between the first optical fiber array and the end face of the first optical modulation chip, and the optical signal modulated by the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching glue.

12. The optical module according to claim 10, characterized in that: The surface of the base is formed with a first convex surface and a second convex surface; the first convex surface is embedded in the first notch portion to carry the first light emitting component; The second boss surface is embedded in the second notch portion to carry the second light emitting component; The first optical fiber array comprises: a first support portion; A second supporting portion, sandwiching a plurality of optical fibers with the first supporting portion; a fixing portion connected to the second supporting portion; The first convex surface comprises: A first supporting surface, used for carrying the first optical modulation chip; The second supporting surface includes a first supporting surface and a second supporting surface, wherein the first supporting surface is used to support the first laser, and the second supporting surface is used to support the first optical fiber array.

13. The optical module according to claim 12, characterized in that: The first optical modulation chip is fixed to the first supporting surface by glue, the first laser is fixed to the first carrying surface by glue, and the first optical fiber array is fixed to the second carrying surface by glue; The second loading surface is shorter than the first loading surface, so that the fixing portion is suspended relative to the second loading surface; There is a certain gap between the first supporting surface and the second supporting surface to collect the glue; There is a certain gap between the first carrying surface and the second carrying surface to collect the glue.

14. The optical module according to claim 10, characterized in that: The end surface of the first optical modulation chip is formed with a light input port and a plurality of light output ports, and the plurality of light output ports have the same output wavelength; The light input port faces the first laser to receive a beam of light without a signal output by the first laser; The light output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array; The input light waveguide and the output light waveguide of the first light modulation chip are respectively non-perpendicular to the end face of the first light modulation chip; The light incident end face of the first optical fiber array is set as an inclined surface, and the inclined surface is coupled and connected to the end face of the first optical modulation chip.

15. The optical module according to claim 14, characterized in that: The first notch portion comprises: A first through hole portion, used for embedding the first laser and the first optical fiber array; a second through hole portion connected to one end of the first through hole portion, the second through hole portion being used to embed the first optical modulation chip, and the second through hole portion being inclined relative to the first through hole portion; The third through hole portion is connected to the other end of the first through hole portion, and the size of the third through hole portion is smaller than that of the first through hole portion; the first optical fiber array passes through the third through hole portion.

16. The optical module according to claim 10, characterized in that: The surface of the first substrate includes a concave surface and a convex platform, the concave surface is used to carry the first light refracting element, and the convex platform is used to carry the first light receiving chip.

17. The optical module according to claim 10, characterized in that: The first light receiving component includes a first TIA, and the first TIA is located on the surface of the circuit board; A groove portion is formed on the surface of the circuit board, and the first substrate and the second substrate are respectively arranged in the groove portion, so that the first light receiving chip is flush with the surface of the first TIA.

18. The optical module according to claim 10, characterized in that: When the first substrate and the second substrate are respectively located on the same surface of the circuit board, the first substrate and the second substrate may be connected together.

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