Electronic device and manufacturing method thereof

Abstract

The invention discloses a manufacturing method of an electronic device, which is characterized by comprising the following steps of: providing a first temporary panel which comprises a first carrier plate, a first substrate, a second substrate and a second carrier plate which are arranged in sequence; providing a second temporary panel, wherein the second temporary panel comprises a third carrier plate, a third substrate, a fourth substrate and a fourth carrier plate which are arranged in sequence; and removing the second carrier plate and the third carrier plate, and fixing the second substrate and the third substrate by an attachment. In addition, the invention also provides an electronic device manufactured by the manufacturing method.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing an electronic device and an electronic device manufactured using the method, and relates to an electronic device including a plurality of panels and a method for manufacturing the electronic device. Background Art

[0002] As the technology related to electronic devices continues to advance, electronic products are developing towards a direction of being thin and light. When an electronic device includes multiple panels, the overall thickness and weight will increase. Therefore, it is currently urgent to provide an electronic device and a manufacturing method thereof to optimize the electronic device and the manufacturing process to achieve a thin electronic device. Summary of the invention

[0003] The present disclosure provides a method for manufacturing an electronic device, characterized in that it includes the following steps: providing a first temporary panel, the first temporary panel includes a first carrier, a first substrate, a second substrate and a second carrier arranged in sequence; providing a second temporary panel, the second temporary panel includes a third carrier, a third substrate, a fourth substrate and a fourth carrier arranged in sequence; and removing the second carrier and the third carrier, and fixing the second substrate and the third substrate with an attachment.

[0004] The present disclosure also provides an electronic device, characterized in that it includes: a supporting component; a first panel disposed on the supporting component, wherein the first panel includes a first substrate, the first substrate having a display area and a peripheral circuit area; and a second panel disposed on the first panel, wherein the supporting component overlaps with the display area and at least a portion of the peripheral circuit area of ​​the first substrate, and the thickness of the supporting component is greater than the thickness of the first substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figures 1A to 1G is a schematic flow chart of a method for manufacturing an electronic device according to an embodiment of the present disclosure;

[0006] Figure 2A and Figure 2B Divided into Figure 1B-2 A partial enlarged view of

[0007] Figure 3 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0008] Figure 4 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0009] Figure 5A is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0010] Figure 5B for Figure 5A A partial enlarged view of

[0011] Figure 6 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0012] Figure 7 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0013] Reference numerals:

[0014] 1': first temporary panel;

[0015] 11': first mother carrier board;

[0016] 12': second mother carrier board;

[0017] 13': first mother substrate;

[0018] 13'-1: substrate;

[0019] 13'-2: conductive layer;

[0020] 13'-3: insulation layer;

[0021] 14': second mother substrate;

[0022] 1: first panel;

[0023] 11: first carrier board;

[0024] 12: second carrier board;

[0025] 13: first substrate;

[0026] 14: second substrate;

[0027] 141: side wall;

[0028] 15: first display layer;

[0029] 16: light shielding layer;

[0030] 17, 18: conductive layer;

[0031] 2': second temporary panel;

[0032] 2: Second panel;

[0033] 21: the third carrier board;

[0034] 22: fourth carrier board;

[0035] 23: third substrate;

[0036] 24: fourth substrate;

[0037] 25: second display layer;

[0038] 3': third temporary panel;

[0039] 3: third panel;

[0040] 31: fifth carrier board;

[0041] 32: sixth carrier board;

[0042] 33: fifth substrate;

[0043] 34: sixth substrate;

[0044] 35: the third display layer;

[0045] 4: Protect the substrate;

[0046] 41: shading pattern;

[0047] 5: Support components;

[0048] 61, 62, 63, 64, 65, 66: protective layer;

[0049] 7: fourth panel;

[0050] 8: Fifth panel;

[0051] 9: Panel 6;

[0052] 71, 81, 91: substrate;

[0053] 72, 82, 92: opposite substrate;

[0054] 73: fourth display layer;

[0055] 83: fifth display layer;

[0056] 93: sixth display layer;

[0057] AD1, AD2, AD3, AD4, AD5, AD6: attachments;

[0058] C: color filter unit;

[0059] C1, C2, C3: chips;

[0060] D: distance;

[0061] E1: first electronic component;

[0062] E11: first flexible substrate;

[0063] E21: second flexible substrate;

[0064] E31: the third flexible substrate;

[0065] E111: side wall;

[0066] E12: The first chip;

[0067] E2: second electronic component;

[0068] E22: second chip;

[0069] E3: The third electronic component;

[0070] E32: The third chip;

[0071] E4, E5, E6: electronic components;

[0072] G: groove;

[0073] P: pixel array;

[0074] P1: protection component;

[0075] R1: peripheral circuit area;

[0076] R2: display area;

[0077] S1, S2, S3: frame glue;

[0078] T1: first thickness;

[0079] T2: second thickness;

[0080] T3: third thickness;

[0081] T4, T5, T6, T7: thickness;

[0082] X: direction;

[0083] Z: Normal direction. DETAILED DESCRIPTION

[0084] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0085] The following is an explanation of the implementation of the present disclosure through specific embodiments. People skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways according to different viewpoints and applications without departing from the spirit of the present invention.

[0086] It should be noted that, in this document, unless otherwise specified, "having a" component is not limited to having a single component, but may have one or more components. In addition, the ordinal numbers used in the specification and claims, such as "first" and "second", to modify the components of the claims, do not themselves mean or represent any previous ordinal number of the claimed components, nor do they represent the order of one claimed component and another claimed component, or the order in the manufacturing method. The use of these ordinals is only used to make a claimed component with a certain name clearly distinguishable from another claimed component with the same name.

[0087] Certain words are used throughout the specification and the claims that follow to refer to specific components. It will be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, words such as "include", "contain", "have" are open-ended words, and therefore should be interpreted as "containing but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present disclosure, they specify the presence of corresponding features, areas, steps, operations and / or components, but do not exclude the presence of one or more corresponding features, areas, steps, operations and / or components.

[0088] In the text, the terms "about", "substantially", and "approximately" usually mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The term "range is between the first value and the second value" means that the range includes the first value, the second value, and other values ​​between them. In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0089] It should be understood that the following embodiments can replace, reorganize, and combine the features of several different embodiments to complete other embodiments without departing from the spirit of the present invention. The features of each embodiment can be combined and used in any combination as long as they do not violate the spirit of the invention or conflict with each other.

[0090] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present invention, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present invention.

[0091] In addition, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one component of the diagram to another component. It is understood that if the device of the diagram is turned over so that it is upside down, the component described on the "below" side will become the component on the "above" side. When a corresponding component (such as a film layer or area) is referred to as "on another component", it can be directly on the other component, or there can be other components between the two. On the other hand, when a component is referred to as "directly on another component", there is no component between the two. In addition, when a component is referred to as "on another component", the two have an up-and-down relationship in the top-down direction, and this component can be above or below the other component, and this up-and-down relationship depends on the orientation of the device.

[0092] In the present disclosure, the distance and thickness can be measured by an optical microscope, and the distance and thickness can be measured by a cross-sectional image in an electron microscope, but the present disclosure is not limited thereto. In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0093] The embodiments of the present invention can be understood in conjunction with the accompanying drawings, and the accompanying drawings of the present invention are considered to be part of the invention description. It should be understood that the drawings of the present invention are not drawn to scale, and in fact, the size of the components may be arbitrarily enlarged or reduced to clearly show the features of the present invention.

[0094] In addition, when it is mentioned that a first material layer is located on or above a second material layer, it may include a situation where the first material layer is in direct contact with the second material layer or the first material layer may not be in direct contact with the second material layer, that is, there may be one or more other material layers between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer is in direct contact with the second material layer.

[0095] In some embodiments of the present invention, terms such as (connection) and (interconnection) related to bonding and connection, unless otherwise defined, may refer to two structures being in direct contact, or may refer to two structures not being in direct contact, wherein another structure is disposed between the two structures. Such terms such as (bonding and connection) may also include situations where both structures are movable, or both structures are fixed. In addition, the terms (electrically connected) or (coupled) include any direct and indirect electrical connection means.

[0096] It should be noted that the technical solutions provided in the following different embodiments can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present disclosure.

[0097] Figures 1A to 1G The figure is a flow chart of a method for manufacturing an electronic device according to an embodiment of the present disclosure, wherein the upper half of each figure is a three-dimensional schematic diagram, the lower half is a cross-sectional schematic diagram, and for the convenience of description, some components of the electronic device are omitted in the schematic diagram.

[0098] In one embodiment of the present disclosure, Figure 1A As shown, the manufacturing method of the electronic device may include: providing a first mother carrier 11' and a second mother carrier 12'. A first mother substrate 13' is disposed on the first mother carrier 11', and a second mother substrate 14' is disposed on the second mother carrier 12'. Then, a pixel array P is disposed on the first mother substrate 13', and a color filter unit C is disposed on the second mother substrate 14', but the present disclosure is not limited thereto. In other embodiments (not shown), both the pixel array P and the color filter unit C may be disposed on the first mother substrate 13'. Although not shown in the figure, in one embodiment, a peeling layer (not shown) may be selectively disposed between the first mother substrate 13' and the first mother carrier 11' or a peeling layer (not shown) may be selectively disposed between the second mother substrate 14' and the second mother carrier 12'. In this way, it may be beneficial to the subsequent separation step of the carrier and the substrate.

[0099] In one embodiment, the material of the first mother substrate 11' and / or the second mother substrate 12' may include glass, quartz, sapphire, ceramic, plastic, other suitable substrate materials or a combination of the above, but the present disclosure is not limited thereto. The materials of the first mother substrate 13' and the second mother substrate 14' may each include polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethyleneterephthalate (PET), polymethylmethacrylate (PMMA), other suitable materials or a combination of the above materials, but the present disclosure is not limited thereto. In one embodiment, the hardness and / or thickness of the first mother substrate 11' and / or the second mother substrate 12' are, for example, greater than the hardness and / or thickness of the first mother substrate 13' and / or the second mother substrate 14'. In some embodiments, the peeling layer (not shown) may include an adhesive, an epoxy resin, a die attach film (DAF), other similar materials or a combination of the above, but the present disclosure is not limited thereto.

[0100] In one embodiment, Figure 1B-1 As shown, the manufacturing method of the electronic device may further include: pre-cutting the first mother substrate 13' and the second mother substrate 14' to form a plurality of grooves G (which may be grooves dug through or not dug through) on the first mother substrate 13' and the second mother substrate 14' respectively. In this way, the risk of damage caused by the subsequent cutting step can be reduced. Next (not shown), a display layer (not shown, such as a liquid crystal layer, but not limited to this) is set on the first mother substrate 13' or the second mother substrate 14', and the display layer (not shown) is set, for example, by a One Drop Filling (ODF) process technology. Subsequently, the first mother carrier 11' and the first mother substrate 13' are paired with the second mother carrier 12' and the second mother substrate 14', for example, the first mother substrate 13' and the second mother substrate 14' are paired through a frame glue (not shown), and the frame glue (not shown) is, for example, set between the first mother substrate 13' and the second mother substrate 14' and surrounds the display layer (not shown). Then, the first mother carrier board 11' and the second mother carrier board 12' can be cut, for example, along Figure 1B-1 The first mother carrier 11' and the second mother carrier 12' are cut and separated by the dotted lines in the figure to form a plurality of first temporary panels 1'. The first temporary panel 1' may include a first carrier 11, a first substrate 13, a second substrate 14 and a second carrier 12 arranged in sequence.

[0101] In the present disclosure, the pre-cutting step and the cutting step may be performed by laser cutting, wheel cutting or a combination thereof.

[0102] In another embodiment, Figure 1B-2 As shown, after the steps of setting the pixel array P on the first mother substrate 13' and setting the color filter unit C on the second mother substrate 14', the pre-cutting step of the first mother substrate 13' and the second mother substrate 14' can be omitted (i.e., for example, the steps of Figure 1B-1 After the display layer (not shown) is disposed on the first mother substrate 13' or the second mother substrate 14', the first mother substrate 11' and the first mother substrate 13' are paired with the second mother substrate 12' and the second mother substrate 14'. Subsequently, the first mother substrate 11', the first mother substrate 13', the second mother substrate 14' and the second mother substrate 12' are cut, for example, along Figure 1B-2 The first mother carrier 11', the first mother substrate 13', the second mother substrate 14' and / or the second mother carrier 12' are cut by the dotted lines in the figure to form a plurality of first temporary panels 1'. The first temporary panel 1' comprises a first carrier 11, a first substrate 13, a second substrate 14 and a second carrier 12 arranged in sequence. The cutting of the first mother carrier 11', the first mother substrate 13', the second mother substrate 14' and the second mother carrier 12' can be completed in different cutting procedures, and the cutting method is not limited to wheel cutting or laser cutting.

[0103] In one embodiment of the present disclosure, Figure 1C As shown, the first substrate 13 has a peripheral circuit area R1. Before removing the second carrier 12, a step of disposing a first electronic component E1 on the peripheral circuit area R1 of the first substrate 13 may be further included. Therefore, the first temporary panel 1' may further include a first electronic component E1 disposed on the peripheral circuit area R1 of the first substrate 13. In more detail, as Figure 1C As shown, the first substrate 13 includes a peripheral circuit area R1 and a display area R2. In the normal direction Z (top view direction) of the electronic device, the area where the first substrate 13 and the second substrate 14 do not overlap is defined as the peripheral circuit area R1, and the area where the first substrate 13 and the second substrate 14 overlap is defined as the display area R2. In other embodiments, the display area R2 can be replaced by other active areas (such as detection areas, touch areas or other suitable areas). In one embodiment, if Figure 1C As shown, two first electronic components E1 can be arranged on the peripheral circuit region R1 of the first substrate 13 to transmit or receive gate line and data line signals respectively. The two first electronic components E1 can be arranged on different sides of the peripheral circuit region R1, but the present disclosure is not limited thereto. In other embodiments, the number of first electronic components E1 can be adjusted as needed. In one embodiment, after the step of arranging the first electronic components E1 on the peripheral circuit region R1 of the first substrate 13, a protective layer 61 (e.g., a subsequent Figure 3The protective layer 61 can be used to increase the reliability of the first electronic component E1, reduce the situation of the first electronic component E1 peeling, or block the entry of external air or moisture to reduce the risk of panel degradation.

[0104] In this disclosure, Figure 1C As shown, the first electronic component E1 may include a chip on film (COF) or a flexible print circuit (FPC). The first electronic component E1 includes a flexible substrate (e.g., a first flexible substrate E11) and a chip (e.g., a first chip E12) disposed on the flexible substrate, and the chip includes, for example, an integrated circuit (IC), but is not limited thereto.

[0105] Then, if Figure 1D As shown, the manufacturing method of the electronic device may further include: repeating the above Figures 1A to 1C to form a second temporary panel 2'. The second temporary panel 2' includes a third carrier 21, a third substrate 23, a fourth substrate 24 and a fourth carrier 22 which are sequentially arranged. Then, the second carrier 12 and the third carrier 21 are removed, and the second substrate 14 and the third substrate 23 are fixed with an attachment AD1. In one embodiment of the present disclosure, the third substrate 23 has a peripheral circuit area R1, and before the step of removing the third carrier 21, a step of setting a second electronic component E2 on the peripheral circuit area R1 of the third substrate 23 may be further included. Therefore, in one embodiment of the present disclosure, the second temporary panel 2' may further include a second electronic component E2, which is set on the peripheral circuit area R1 of the third substrate 23. The second electronic component E2 is similar to the first electronic component E1 and will not be repeated here. The number of second electronic components E2 may be the same as or different from the number of first electronic components E1. In summary, in the present disclosure, Figure 1D As shown, the manufacturing method of the electronic device may include the following steps: providing a first temporary panel 1', the first temporary panel 1' includes a first carrier 11, a first substrate 13, a second substrate 14 and a second carrier 12 arranged in sequence; providing a second temporary panel 2', the second temporary panel 2' includes a third carrier 21, a third substrate 23, a fourth substrate 24 and a fourth carrier 22 arranged in sequence; and removing the second carrier 12 and the third carrier 21, and fixing the second substrate 14 and the third substrate 23 with an attachment AD1.

[0106] In the present disclosure, laser lift off (LLO) or non-laser lift off technology can be used to remove the second carrier 12 and the third carrier 21, but the present disclosure is not limited thereto. The laser lift off technology can, for example, laser irradiate the surface of the second carrier 12 away from the second substrate 14, so that a peelable interface is formed between the second carrier 12 and the second substrate 14, so as to achieve the effect of separating the second carrier 12 from the second substrate 14. The non-laser lift off technology can, for example, achieve the effect of separating the second carrier 12 from the second substrate 14 by etching a peeling layer (not shown) disposed between the second substrate 14 and the second carrier 12, but the present disclosure is not limited thereto. In the present disclosure, the attachment AD1 can include glass glue, optical glue, silicone, adhesive tape, hot melt glue, AB glue, two-component adhesive, polymer glue or a combination thereof, but the present disclosure is not limited thereto. In one embodiment, the attachment AD1 can be, for example, first disposed on the second substrate 14 by lamination, and then the second substrate 14 and the third substrate 23 are bonded by lamination, but the present disclosure is not limited thereto. In another embodiment (not shown), the attachment AD1 may also be firstly disposed on the third substrate 23 by lamination, and then the third substrate 23 and the second substrate 14 are laminated to achieve the purpose of fixing the second substrate 14 and the third substrate 23 .

[0107] Then, if Figure 1E As shown, when the electronic device includes three panels, the manufacturing method of the electronic device may further include: repeating the above Figures 1A to 1C The third temporary panel 3' comprises a fifth carrier 31, a fifth substrate 33, a sixth substrate 34 and a sixth carrier 32 which are arranged in sequence. Figure 1D The steps shown are similar, the fourth carrier 22 and the fifth carrier 31 are removed, and the fourth substrate 24 and the fifth substrate 33 are fixed with the attachment AD2. In one embodiment, before the step of removing the fifth carrier 31, a step of disposing the third electronic component E3 on the peripheral circuit area R1 of the fifth substrate 33 may be further included. Therefore, in one embodiment, the third temporary panel 3' may further include the third electronic component E3, which is disposed on the peripheral circuit area R1 of the fifth substrate 33.

[0108] In the present disclosure, the attachment AD2 is similar to the attachment AD1, for example, the material or thickness is similar; the third electronic component E3 is similar to the first electronic component E1 or the second electronic component E2, and will not be repeated here. In addition, the method of removing the fourth carrier 22 and the fifth carrier 31, and the method of setting the attachment AD2 can also be as described above, and will not be repeated here. In some embodiments, in the normal direction Z (top-down direction) of the electronic device, the first electronic component E1, the second electronic component E2 and / or the third electronic component E3 may, for example, overlap with each other, and the above overlap may include at least partial overlap or complete overlap. In some embodiments, in the normal direction Z (top-down direction) of the electronic device, the attachment AD1 and the attachment AD2, for example, overlap with each other. In some embodiments, the attachment AD1 and the attachment AD2 may respectively include filter particles of different colors, but the present disclosure is not limited to this.

[0109] Afterwards, if Figure 1F As shown, the manufacturing method of the electronic device may further include: removing the sixth carrier 32, fixing the protection substrate 4 and the sixth substrate 34 with an attachment AD3. Here, the attachment AD3 is similar to the attachment AD1, and will not be described in detail here. In addition, the method of removing the sixth carrier 32 and the method of setting the attachment AD3 can also be as described above, and will not be described in detail here.

[0110] Then, if Figure 1G As shown, the manufacturing method of the electronic device may further include: removing the first carrier plate 11, and placing the first panel 13 on the support assembly 5, so as to complete the electronic device of one embodiment of the present disclosure. In other words, the support assembly 5 is placed under the first panel 13. In some embodiments, the support assembly 5 and the display area R2 of the first substrate 13 of the first panel 13 (see the following Figure 3 ) and at least a portion of the peripheral circuit area R1 (see the following Figure 3 ) overlap, and the thickness of the support assembly 5 is greater than the thickness of the first substrate 13, which will be described in detail in Figure 3 Here, the method of removing the first carrier plate 11 can be as described above, and will not be repeated here. In some embodiments, the area of ​​the support assembly 5 is, for example, less than or equal to the first panel 1 (such as Figure 3 In some embodiments, the width of the support assembly 5 in the X direction is, for example, less than or equal to the first panel 1 (as shown in FIG. Figure 3 In some embodiments (not shown), the width of the support assembly 5 in the Y direction is, for example, less than or equal to the width of the first panel 1 (as shown). Figure 3 In some embodiments (not shown), the area of ​​the support element 5 is, for example, greater than or equal to the first panel 1 (as shown). Figure 3In some embodiments, the width of the support assembly 5 in the X direction is, for example, greater than or equal to the first panel 1 (as shown). Figure 3 In some embodiments (not shown), the width of the support assembly 5 in the Y direction is, for example, greater than or equal to the width of the first panel 1 (as shown). Figure 3 The width of the first substrate 13 in the Y direction (as shown).

[0111] In some embodiments, the material of the support component 5 may include polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethyleneterephthalate (PET), polymethylmethacrylate (PMMA), other suitable materials or combinations of the above materials, but the present disclosure is not limited thereto. In one embodiment, the support component 5 may include a shading substrate or the support component 5 may include a shading material, such as a black organic material, a black inorganic material, black ink, a black tape, other suitable materials or combinations of the above materials, but the present disclosure is not limited thereto. When the support component 5 includes a shading material, its transmittance may be, for example, less than 50% or less than 70%, or even less than 80%.

[0112] In one embodiment of the present disclosure, Figure 1F and Figure 1G As shown, the protective substrate 4 is disposed first and then the supporting assembly 5 is disposed, but the present disclosure is not limited thereto, and the disposition sequence of the supporting assembly 5 and the protective substrate 4 can be adjusted according to requirements.

[0113] In the present disclosure, through the above-mentioned manufacturing method, for example, Figures 3 to 7 The electronic device shown can make the electronic device flexible or thinner.

[0114] Figure 2A and Figure 2B Divided into Figure 1B-2 More specifically, Figure 2A and Figure 2B Divided into Figure 1B-2 An enlarged view of the dotted box. Part of the components are omitted in the schematic diagram for the convenience of explanation.

[0115] In one embodiment of the present disclosure, when Figure 1B-2When manufacturing an electronic device in the steps shown in the figure, the pre-cutting step of the first mother substrate 13' and the second mother substrate 14' can be omitted. In the subsequent cutting step, in order to reduce the damage of the circuit layer (not shown) or components on the first mother substrate 13' and / or the second mother substrate 14', in one embodiment, Figure 2A and Figure 2B As shown, in the case where the scribe line (eg Figure 1B-2 The dashed line or Figure 2A and Figure 2B A protection component P1 is disposed at a position (as indicated by the arrow in FIG. 1 ), and the protection component P1 is, for example, located in the first mother substrate 13' to reduce the risk of damaging the circuit layer (not shown) or components on the first mother substrate 13' during the cutting step.

[0116] More specifically, in one embodiment, if Figure 2A As shown, the first mother substrate 13' may include a substrate 13'-1; a conductive layer 13'-2 (which may be equivalent to a part of the above-mentioned circuit layer), which is disposed on the substrate 13'-1; a protection component P1, which is disposed on the conductive layer 13'-2 and is disposed approximately corresponding to the position of the cutting path; and an insulating layer 13'-3, which is disposed on the conductive layer 13'-2 and the protection component P1. The protection component P1 may, for example, contact the conductive layer 13'-2, but the present disclosure is not limited thereto. In the normal direction Z (top view direction) of the electronic device, the thickness (not indicated) of the protection component P1 is, for example, less than the thickness (not indicated) of the insulating layer 13'-3, and the insulating layer 13'-3, for example, covers the protection component P1. In one embodiment, the second mother substrate 14' is disposed corresponding to the first mother substrate 13'. The components on the second mother substrate 14' are omitted here. The second mother substrate 14' may be similar to the first mother substrate 13', including components such as a conductive layer (not shown) and an insulating layer (not shown), and will not be repeated here.

[0117] In another embodiment, Figure 2BAs shown, the first mother substrate 13' may include a substrate 13'-1; a conductive layer 13'-2, which is disposed on the substrate 13'-1; an insulating layer 13'-3, which is disposed on the conductive layer 13'-2; and a protective component P1. In one embodiment, the second mother substrate 14' is disposed corresponding to the first mother substrate 13'. The protective component P1, for example, does not contact the conductive layer 13'-2. The protective component P1, for example, is adjacent to or in contact with the second mother substrate 14', but the present disclosure is not limited thereto. In the normal direction Z (top view direction) of the electronic device, the thickness (not indicated) of the protective component P1 is, for example, less than the thickness (not indicated) of the insulating layer 13'-3. The components on the second mother substrate 14' are omitted here. The second mother substrate 14' may be similar to the first mother substrate 13', including components such as a conductive layer (not shown) and an insulating layer (not shown), and will not be described in detail here. In the present disclosure, the material of the above-mentioned protective component P1, for example, includes a metal material or a light-shielding material. The metal material includes, for example, silver, copper, other suitable materials, or a combination thereof, but the present disclosure is not limited thereto. The light shielding material includes (black) photoresist, black insulating material (such as organic material or inorganic material), and the like.

[0118] Figure 3 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0119] In one embodiment, if Figure 3As shown, the electronic device may include: a support component 5; a first panel 1, disposed on the support component 5; a second panel 2, disposed on the first panel 1; a third panel 3, disposed on the second panel 2; and a protective substrate 4, disposed on the third panel 3. In more detail, the first panel 1 includes: a first substrate 13, having a display area R2 and a peripheral circuit area R1; a second substrate 14, disposed on the first substrate 13; and a first display layer 15, disposed between the first substrate 13 and the second substrate 14; the support component 5 overlaps with the display area R2 of the first substrate 13 and at least a portion of the peripheral circuit area R1, and the thickness T4 of the support component 5 is greater than the thickness T5 of the first substrate 13. The second panel 2 includes: a third substrate 23 having a display area R2 and a peripheral circuit area R1; a fourth substrate 24 disposed on the third substrate 23; and a second display layer 25 disposed between the third substrate 23 and the fourth substrate 24; wherein the support component 5 overlaps with the display area R2 and at least a portion of the peripheral circuit area R1 of the third substrate 23, and the thickness T4 of the support component 5 is greater than the thickness of the third substrate 23 (not indicated). The third panel 3 includes: a fifth substrate 33 having a display area R2 and a peripheral circuit area R1; a sixth substrate 34 disposed on the fifth substrate 33; and a third display layer 35 disposed between the fifth substrate 33 and the sixth substrate 34; wherein the support component 5 overlaps with the display area R2 and at least a portion of the peripheral circuit area R1 of the fifth substrate 33, and the thickness T5 of the support component 5 is greater than the thickness of the fifth substrate 33 (not indicated). In the present disclosure, Figure 3 As shown, in the normal direction Z (top view direction) of the electronic device, the display area R2 of the first substrate 13 substantially overlaps the display area R2 of the third substrate 23, and the display area R2 of the third substrate 23 substantially overlaps the display area R2 of the fifth substrate 33. Figure 3 As shown, in the normal direction Z (top view direction) of the electronic device, the peripheral circuit area R1 of the first substrate 13 substantially overlaps the peripheral circuit area R1 of the third substrate 23, and the peripheral circuit area R1 of the third substrate 23 substantially overlaps the peripheral circuit area R1 of the fifth substrate 33. A light shielding pattern 41 may be provided on the protective substrate 4, and in the normal direction Z (top view direction) of the electronic device, the light shielding pattern 41 overlaps the peripheral circuit area R1 of the first substrate 13, the peripheral circuit area R1 of the third substrate 23, and / or the peripheral circuit area R1 of the fifth substrate 33. By overlapping the support component 5 with the display area R2 of the first substrate 13 and at least a portion of the peripheral circuit area R1, the reliability of the electronic device can be improved.

[0120] In the present disclosure, the material of the support component 5 is as described above and will not be repeated here. In the present disclosure, the thickness T5 of the support component 5 may be 50 micrometers (μm) to 200 micrometers (μm) (50 micrometers (μm) ≦ T5 ≦ 200 micrometers (μm)), for example, 80 micrometers (μm) to 150 micrometers (μm) (80 micrometers (μm) ≦ T5 ≦ 150 micrometers (μm)), 80 micrometers (μm) to 120 micrometers (μm) (80 micrometers (μm) ≦ T5 ≦ 120 micrometers (μm)), but the present disclosure is not limited thereto. When the thickness T5 of the support component 5 is greater than the thickness T4 of the first substrate 13, the reliability of the electronic device can be improved. In one embodiment, the ratio between the thickness T5 of the support component 5 and the thickness T4 of the first substrate 13 may be greater than or equal to 3 and less than or equal to 15. In one embodiment, the ratio between the thickness T5 of the support component 5 and the thickness T4 of the first substrate 13 may be greater than or equal to 3 and less than or equal to 10. In one embodiment, the ratio between the thickness T5 of the support component 5 and the thickness T4 of the first substrate 13 may be greater than or equal to 3 and less than or equal to 8. In one embodiment, the ratio between the thickness T5 of the support component 5 and the thickness T4 of the first substrate 13 may be greater than or equal to 3 and less than or equal to 5. When the ratio between the thickness T5 of the support component 5 and the thickness T4 of the first substrate 13 meets the above relationship, the support property of the support component 5 can be maintained, and the overall thickness of the electronic device can be taken into account.

[0121] In the present disclosure, the thickness T5 of the support assembly 5 is, for example, less than or equal to the thickness (not indicated) of the protective substrate 4. In the present disclosure, the width (not indicated) of the support assembly 5 in the X direction is, for example, less than or equal to the width (not indicated) of the protective substrate 4 in the X direction. In the present disclosure, the width (not indicated) of the support assembly 5 in the Y direction is, for example, less than or equal to the width (not indicated) of the protective substrate 4 in the Y direction.

[0122] In one embodiment, the materials of the first substrate 13, the second substrate 14, the third substrate 23, the fourth substrate 24, the fifth substrate 33 and the sixth substrate 34 may each include polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA), other suitable materials or combinations of the above materials, but the present disclosure is not limited thereto. The materials of the first substrate 13, the second substrate 14, the third substrate 23, the fourth substrate 24, the fifth substrate 33 and the sixth substrate 34 may be the same or different. The thickness of the first substrate 13, the second substrate 14, the third substrate 23, the fourth substrate 24, the fifth substrate 33 and the sixth substrate 34 may each be 10 micrometers (μm) to 50 micrometers (μm) (10 micrometers (μm) ≦ thickness ≦ 50 micrometers (μm)), but the present disclosure is not limited thereto. The thickness of the first substrate 13, the second substrate 14, the third substrate 23, the fourth substrate 24, the fifth substrate 33 and the sixth substrate 34 may each be 15 micrometers (μm) to 40 micrometers (μm) (15 micrometers (μm) ≦ thickness ≦ 40 micrometers (μm)). The thickness of the first substrate 13, the second substrate 14, the third substrate 23, the fourth substrate 24, the fifth substrate 33 and the sixth substrate 34 may each be 20 micrometers (μm) to 30 micrometers (μm) (20 micrometers (μm) ≦ thickness ≦ 30 micrometers (μm)). The thickness of the first substrate 13, the second substrate 14, the third substrate 23, the fourth substrate 24, the fifth substrate 33 and the sixth substrate 34 may each be 10 micrometers (μm) to 20 micrometers (μm) (10 micrometers (μm) ≦ thickness ≦ 20 micrometers (μm)). In one embodiment, the material of the protective substrate 4 may include quartz, glass, wafer, sapphire, ceramic material, polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET) or other plastic materials, but the present disclosure is not limited thereto. In one embodiment, the material of the shading pattern 41 may include shading (black) organic material, shading (black) inorganic material, shading (black) ink, shading (black) tape, other suitable materials or a combination of the above materials, but the present disclosure is not limited thereto. The shading pattern 41 may be formed, for example, by spraying, screen printing or other suitable methods. In one embodiment, in the normal direction Z (top view direction) of the electronic device, the shading pattern 41 may overlap with the peripheral circuit area R1, for example. In one embodiment, in the normal direction Z (top view direction) of the electronic device, the shading pattern 41 may overlap with a portion of the display area R2, for example.

[0123] In the present disclosure, the first display layer 15, the second display layer 25 and the third display layer 35 may each include a guest host type liquid crystal (GHLC), a dye liquid crystal, a twisted nematic liquid crystal (TN LC), a super twisted nematic liquid crystal (STN LC), a polymer dispersed liquid crystal (PDLC), a polymer network liquid crystal (PNLC), a cholesterol liquid crystal (cholesteric texture liquid crystal), a polymer-stabilized cholesterol liquid crystal (PSCT LC), a suspended particle material (SPD), an electrochromic material (electrochromic materials), etc., or a combination thereof, but the present disclosure is not limited thereto. In one embodiment of the present disclosure, the first display layer 15, the second display layer 25, and the third display layer 35 may each include a cholesterol liquid crystal, for example, the first display layer 15 is a cholesterol liquid crystal that reflects red light, the second display layer 25 is a cholesterol liquid crystal that reflects green light, and the third display layer 35 is a cholesterol liquid crystal that reflects blue light, but the present disclosure is not limited thereto, and the above display layers may selectively reflect light of different colors. When the first display layer 15, the second display layer 25, and the third display layer 35 conform to the above design, the reflection efficiency of the incident light can be improved, thereby improving the display quality of the electronic device.

[0124] In one embodiment of the present disclosure, Figure 3 As shown, the electronic device may further include a sealant S1, a sealant S2, and a sealant S3, wherein the sealant S1 is disposed between the first substrate 13 and the second substrate 14 and surrounds the first display layer 15, the sealant S2 is disposed between the third substrate 23 and the fourth substrate 24 and surrounds the second display layer 25, and the sealant S3 is disposed between the fifth substrate 33 and the sixth substrate 34 and surrounds the third display layer 35. In one embodiment of the present disclosure, as Figure 3As shown, the electronic device may further include an attachment AD1, an attachment AD2, and an attachment AD3, wherein the attachment AD1 is disposed between the first panel 1 and the second panel 2, the attachment AD2 is disposed between the second panel 2 and the third panel 3, and the attachment AD3 is disposed between the third panel 3 and the protective substrate 4, but is not limited thereto. In one embodiment, in the normal direction Z (top view direction) of the electronic device, the light shielding pattern 41 may overlap with the sealant S1, the sealant S2, and / or the sealant S3, for example.

[0125] In the present disclosure, the attachment AD1, the attachment AD2 and the attachment AD3 may each include glass glue, optical glue, silicone, tape, hot melt glue, AB glue, two-component adhesive, polymer glue or a combination thereof, but the present disclosure is not limited thereto. The thickness of the attachment AD1, the attachment AD2 and the attachment AD3 may each be 50 microns (μm) to 1000 microns (μm) (50 microns ≦ thickness ≦ 1000 microns), but the present disclosure is not limited thereto. The thickness of the attachment AD1, the attachment AD2 and the attachment AD3 may each be 50 microns (μm) to 500 microns (μm) (50 microns ≦ thickness ≦ 500 microns), but the present disclosure is not limited thereto. The thickness of the attachment AD1, the attachment AD2 and the attachment AD3 may each be 50 microns (μm) to 350 microns (μm) (50 microns ≦ thickness ≦ 350 microns), but the present disclosure is not limited thereto. The thickness of the attachment AD1, the attachment AD2, and the attachment AD3 may each be 150 micrometers (μm) to 250 micrometers (μm) (150 micrometers ≦ thickness ≦ 250 micrometers), but the present disclosure is not limited thereto. The thickness of the attachment AD1, the attachment AD2, and the attachment AD3 may each be 170 micrometers (μm) to 230 micrometers (μm) (170 micrometers ≦ thickness ≦ 230 micrometers), but the present disclosure is not limited thereto. In some embodiments, the thickness T7 of the attachment AD3 may be greater than or equal to the thickness of the attachment AD1 or the attachment AD2. In some embodiments, the ratio of the thickness T6 of the light shielding pattern 41 to the thickness T7 of the attachment AD3 may be between 0.003 and 0.6, but is not limited thereto. In some embodiments, the ratio of the thickness T6 of the light shielding pattern 41 to the thickness T7 of the attachment AD3 may be between 0.005 and 0.4, but is not limited thereto. In some embodiments, the ratio of the thickness T6 of the light shielding pattern 41 to the thickness T7 of the attachment AD3 may be between 0.008 and 0.3, but is not limited thereto. In some embodiments, the ratio of the thickness T6 of the light shielding pattern 41 to the thickness T7 of the attachment AD3 may be between 0.01 and 0.2, but is not limited thereto. In some embodiments, the ratio of the thickness T6 of the light shielding pattern 41 to the thickness T7 of the attachment AD3 may be between 0.01 and 0.1, but is not limited thereto. In some embodiments, the ratio of the thickness T6 of the light shielding pattern 41 to the thickness T7 of the attachment AD3 may be between 0.015 and 0.1, but is not limited thereto.

[0126] In one embodiment of the present disclosure, Figure 3 As shown, the electronic device may further include: a first electronic component E1, which is disposed on the peripheral circuit area R1 of the first substrate 13; a second electronic component E2, which is disposed on the peripheral circuit area R1 of the third substrate 23; and a third electronic component E3, which is disposed on the peripheral circuit area R1 of the fifth substrate 33. In one embodiment, in the normal direction Z (top view direction) of the electronic device, the first electronic component E1 may overlap with the second electronic component E2, and the second electronic component E2 (or the first electronic component E1) may overlap with the third electronic component E3, but the present disclosure is not limited thereto. In one embodiment, in the normal direction Z (top view direction) of the electronic device, the light shielding pattern 41 may, for example, overlap with the first electronic component E1, the second electronic component E2 and / or the third electronic component E3.

[0127] In the present disclosure, the first electronic component E1, the second electronic component E2 and the third electronic component E3 may each include a chip on film (COF) or a flexible printed circuit (FPC), but the present disclosure is not limited thereto. The chip on film includes a flexible substrate (e.g., a first flexible substrate E11, a second flexible substrate E21 and a third flexible substrate E31) and a chip (e.g., a first chip E12, a second chip E22 and a third chip E32) disposed on the flexible substrate. The chip may be, for example, an integrated circuit (IC). In one embodiment of the present disclosure, the first electronic component E1, the second electronic component E2 and the third electronic component E3 may each be a chip on film, and therefore, the first electronic component E1 may include: a first flexible substrate E11; and a first chip E12, disposed on the first flexible substrate E11. The second electronic component E2 may include: a second flexible substrate E21; and a second chip E22, disposed on the second flexible substrate E21. The third electronic component E3 may include: a third flexible substrate E31; and a third chip E32, which is disposed on the third flexible substrate E31. In some embodiments, the thickness of the first flexible substrate E11, the second flexible substrate E21, and the third flexible substrate E31 may each be 20 micrometers (μm) to 100 micrometers (μm) (20 micrometers ≦ thickness ≦ 100 micrometers). In some embodiments, the thickness of the first flexible substrate E11, the second flexible substrate E21, and the third flexible substrate E31 may each be 30 micrometers (μm) to 80 micrometers (μm) (30 micrometers ≦ thickness ≦ 80 micrometers). In some embodiments, the thickness of the first flexible substrate E11, the second flexible substrate E21, and the third flexible substrate E31 may each be 40 micrometers (μm) to 70 micrometers (μm) (40 micrometers ≦ thickness ≦ 70 micrometers). In some embodiments, the thickness of the first flexible substrate E11 , the second flexible substrate E21 , and the third flexible substrate E31 may each be 45 μm to 65 μm (45 μm≦thickness≦65 μm).

[0128] In this disclosure, Figure 3 As shown, the attachment AD1 has a first thickness T1, the second substrate 14 has a second thickness T2, and the first flexible substrate E11 of the first electronic component E1 has a third thickness T3, wherein the first thickness T1, the second thickness T2 and the third thickness T3 can satisfy the following formula (1): 1.5≦(T1+T2) / T3≦7.5(1).

[0129] When the thickness relationship of the above components conforms to the relationship of formula (1), damage to the electronic device can be reduced or the electronic device can be made thinner. More specifically, when the thickness relationship of the above components is greater than or equal to 1.5 (i.e., (T1+T2) / T3≧1.5), the collision or extrusion of the first electronic component E1 and the third substrate 23 of the second panel 2 or the second electronic component E2 can be reduced, thereby improving the yield of the electronic device. If the thickness relationship of the above components is greater than 7.5 (i.e., (T1+T2) / T3>7.5), the overall thickness of the electronic device will increase, which is not conducive to thin design. In other embodiments of the present disclosure, the thickness relationship between the attachment AD2, the fourth substrate 24 and the second flexible substrate E21 of the second electronic component E2 is also the same as the thickness relationship between the attachment AD1, the second substrate 14 and the first flexible substrate E11 of the first electronic component E1, and will not be repeated here.

[0130] In one embodiment of the present disclosure, Figure 3 As shown, in the direction perpendicular to the normal direction Z of the electronic device (e.g., the X direction), the first chip E12 is spaced a distance D from the third substrate 23 of the second panel 2, so that the collision or extrusion between the first electronic component E1 and the third substrate 23 of the second panel 2 can be reduced, thereby improving the yield of the electronic device, but the invention is not limited thereto. In other embodiments of the present disclosure, in the direction perpendicular to the normal direction Z of the electronic device (e.g., the X direction), the second chip E22 and the fifth substrate 33 of the third panel 3 can also be spaced another distance (not shown), which will not be described in detail here.

[0131] In one embodiment, if Figure 3 As shown, the first electronic component E1 is disposed on the peripheral circuit region R1 of the first substrate 13, and the electronic device may include a protective layer 61 disposed between the second panel 2 and the first electronic component E1. More specifically, the protective layer 61 is disposed between the second panel 2 and the first flexible substrate E11 of the first electronic component E1, and the protective layer 61 may at least cover a side wall E111 of the first flexible substrate E11. The protective layer 61 contacts a portion of the flexible substrate E11. The protective layer 61 may be used to increase the reliability of the first electronic component E1 and reduce the possibility of the first electronic component E1 peeling off. In addition, as Figure 3As shown, the protective layer 61 may be in contact with a side wall 141 of the second substrate 14, which may reduce the entry of outside air or moisture and reduce the risk of degradation of the first panel 1. Similarly, the electronic device may further include a protective layer 62 and a protective layer 63, and the protective layer 62 and the protective layer 63 may have a similar design to the protective layer 61, so as to increase the reliability of the electronic device or reduce the risk of degradation, which will not be repeated here. In the present disclosure, the materials of the protective layer 61, the protective layer 62 and the protective layer 63 may each include glass glue, optical glue, silicone, tape, hot melt glue, AB glue, two-component adhesive, light-curing glue, polymer glue, resin or a combination thereof, but the present disclosure is not limited thereto.

[0132] In one embodiment of the present disclosure, Figure 3 As shown, the electronic device may not include a backlight module, and utilizes display layers (such as the first display layer 15, the second display layer 25 and the third display layer 35) to reflect different color lights (such as Figure 3 The purpose of displaying images is achieved by using the electronic device as shown by the arrow, thereby enabling the electronic device to achieve power saving or thinness.

[0133] Figure 4 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 4 Electronic devices can be used Figures 1A to 1G The method of manufacturing the Figure 4 Electronic devices and Figure 1G and Figure 3 The electronics shown are similar except for the following differences.

[0134] In one embodiment of the present disclosure, Figure 4 As shown, the first electronic component E1, the second electronic component E2 and the third electronic component E3 may be staggered. More specifically, in the normal direction Z (top view direction) of the electronic device, the first electronic component E1 and the second electronic component E2 do not overlap, and the second electronic component E2 and the third electronic component E3 do not overlap. In this way, the collision or compression of the first electronic component E1 and the second electronic component E2 can be reduced, or the collision or compression of the second electronic component E2 and the third electronic component E3 can be reduced, thereby improving the yield of the electronic device. In other embodiments (not shown), in the normal direction Z (top view direction) of the electronic device, at least two of the first electronic component E1, the second electronic component E2 and the third electronic component E3 may not overlap or partially overlap with each other. In other embodiments (not shown), in the normal direction Z (top view direction) of the electronic device, the chips contained in each of the first electronic component E1, the second electronic component E2 and the third electronic component E3 may not overlap with each other.

[0135] Figure 5A FIG. 4 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 5B for Figure 5A Partially enlarged view. Figure 5A Electronic devices and Figure 3 The electronics are similar except for the following differences.

[0136] In one embodiment, the support component 5 may not include a light shielding material, and the electronic device may include a light shielding layer 16, which may be disposed on the first substrate 13. More specifically, Figure 5A and Figure 5B As shown, the first panel 1 may include a first substrate 13; a second substrate 14 disposed on the first substrate 13; a light shielding layer 16 disposed on the first substrate 13; a conductive layer 17 disposed on the light shielding layer 16; a conductive layer 18 disposed between the second substrate 14 and the first substrate 13; and a first display layer 15 disposed between the conductive layer 17 and the conductive layer 18. The light shielding layer 16 may be used to absorb light to improve the display quality of the electronic device.

[0137] In the present disclosure, the material of the light shielding layer 16 may include, for example, a black organic material, a black inorganic material, a black ink, other suitable materials, or a combination of the above materials, but the present disclosure is not limited thereto. In the present disclosure, the materials of the conductive layer 17 and the conductive layer 18 may each include a transparent conductive material, such as indium zinc oxide (IZO), indium tin oxide (ITO), indium tin zinc oxide (ITZO), indium gallium zinc oxide (IGZO), aluminum zinc oxide (AZO), or a combination thereof, but the present disclosure is not limited thereto. In the present disclosure, the light shielding layer 16 may be provided using a suitable coating method, such as a spray coating method, a spin coating method, or an evaporation method, but the present disclosure is not limited thereto.

[0138] Figure 6 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 6 Electronic devices and Figure 3 The electronics are similar except for the following differences.

[0139] In one embodiment, if Figure 6 As shown, the electronic device may further include: a fourth panel 7, disposed between the third panel 3 and the protective substrate 4; a fifth panel 8, disposed between the fourth panel 7 and the protective substrate 4; and a sixth panel 9, disposed between the fifth panel 8 and the protective substrate 4. An attachment AD4, an attachment AD5, and an attachment AD6 are respectively included between each panel (e.g., the fourth panel 7, the fifth panel 8, and the sixth panel 9) and the protective substrate 4, for example, the attachment AD4 is disposed between the fourth panel 7 and the fifth panel 8, the attachment AD5 is disposed between the fifth panel 8 and the sixth panel 9, and the attachment AD6 is disposed between the sixth panel 9 and the protective substrate 4, so that each panel is fixed to each other.

[0140] In one embodiment, if Figure 6As shown, the electronic device may further include: a protective layer 64, which is disposed between the fifth panel 8 and the electronic component E4, and can be used to increase the reliability of the electronic component E4, reduce the situation of the electronic component E4 peeling, or reduce the entry of external air or moisture, and reduce the risk of degradation of the fourth panel 7. In addition, the electronic device may further include a protective layer 65 and an attachment 66, and the protective layer 65 and the attachment 66 may have a similar design to the protective layer 64, so as to increase the reliability of the electronic device or reduce the risk of degradation, which will not be repeated here.

[0141] In one embodiment, the fourth panel 7 includes: a substrate 71 having a display area R2 and a peripheral circuit area R1; an opposite substrate 72 disposed corresponding to the substrate 71; a fourth display layer 73 disposed between the substrate 71 and the opposite substrate 72; and an electronic component E4 disposed on the peripheral circuit area R1 of the substrate 71. The fifth panel 8 includes: a substrate 81 having a display area R2 and a peripheral circuit area R1; an opposite substrate 82 disposed corresponding to the substrate 81; a fifth display layer 83 disposed between the substrate 81 and the opposite substrate 82; and an electronic component E5 disposed on the peripheral circuit area R1 of the substrate 81. The sixth panel 9 includes: a substrate 91 having a display area R2 and a peripheral circuit area R1; an opposite substrate 92 disposed corresponding to the substrate 91; a sixth display layer 93 disposed between the substrate 91 and the opposite substrate 92; and an electronic component E6 disposed on the peripheral circuit area R1 of the substrate 91.

[0142] In the present disclosure, the materials of substrate 71, substrate 81, substrate 91 and opposite substrate 72, opposite substrate 82, opposite substrate 92 may each be similar to the first substrate 13; the electronic component E4, electronic component E5, electronic component E6 may each be similar to the first electronic component E1; the materials of protective layer 64, protective layer 65 and protective layer 66 may each be similar to the protective layer 61, which will not be repeated here.

[0143] In one embodiment, if Figure 6As shown, the first display layer 15, the second display layer 25, the third display layer 35, the fourth display layer 73, the fifth display layer 83 and the sixth display layer 93 may each include a cholesterol liquid crystal, for example, the first display layer 15 and the second display layer 25 may be a cholesterol liquid crystal reflecting red light, the third display layer 35 and the fourth display layer 73 may be a cholesterol liquid crystal reflecting green light, and the fifth display layer 83 and the sixth display layer 93 may be a cholesterol liquid crystal reflecting blue light, wherein the first display layer 15 and the second display layer 25 have different optical rotations (for example, one is left-handed and the other is right-handed), the third display layer 35 and the fourth display layer 73 have different optical rotations (for example, one is left-handed and the other is right-handed), and the fifth display layer 83 and the sixth display layer 93 have different optical rotations (for example, one is left-handed and the other is right-handed), but the present disclosure is not limited thereto. When the first display layer 15, the second display layer 25, the third display layer 35, the fourth display layer 73, the fifth display layer 83 and the sixth display layer 93 conform to the above design, the reflection efficiency of the incident light can be improved, thereby improving the display quality of the electronic device. In other embodiments (not shown), the above panels can be partially removed as needed.

[0144] Figure 7 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 7 Electronic devices and Figure 3 The electronics are similar except for the following differences.

[0145] In one embodiment of the present disclosure, Figure 7As shown, the first electronic component E1, the second electronic component E2 and the third electronic component E3 of the electronic device are respectively flexible circuit boards, and are respectively disposed on the peripheral circuit area R1 of the first substrate 13, the third substrate 23 and the fifth substrate 33. In addition, the first panel 1 further includes a chip C1, which is disposed on the peripheral circuit area R1 of the first substrate 13; the second panel 2 further includes a chip C2, which is disposed on the peripheral circuit area R1 of the third substrate 23; and the third panel 3 further includes a chip C3, which is disposed on the peripheral circuit area R1 of the fifth substrate 33. In one embodiment of the present disclosure, in the normal direction Z (top view direction) of the electronic device, the chip C1 and the third substrate 23 of the second panel 2 are, for example, spaced apart by a distance (not indicated), that is, the chip C1 and the third substrate 23 of the second panel 2 are, for example, not in contact. Similarly, in the normal direction Z (top view direction) of the electronic device, the chip C2 and the fifth substrate 33 of the third panel 3 are, for example, spaced apart by a distance (not indicated), that is, the chip C2 and the fifth substrate 33 of the third panel 3 are, for example, not in contact. In the present disclosure, the electronic device may include a display device, an antenna device, a sensing device or a splicing device, but the present disclosure is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device. The antenna device may be a liquid crystal type antenna device. The sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but the present disclosure is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but the present disclosure is not limited thereto. In the present disclosure, the electronic device may be applied to electronic devices that do not require a backlight module, such as displays, music players, e-books, handwriting tablets, or billboards, but the present disclosure is not limited thereto.

[0146] The above specific embodiments are to be construed as merely illustrative, and not limitative of the remainder of the disclosure in any way whatsoever.

Claims

1. A method for manufacturing an electronic device, characterized in that: The following steps are involved: Providing a first temporary panel, the first temporary panel comprising a first carrier, a first substrate, a second substrate and a second carrier arranged in sequence; Providing a second temporary panel, the second temporary panel comprising a third carrier, a third substrate, a fourth substrate and a fourth carrier arranged in sequence; and The second carrier plate and the third carrier plate are removed, and the second substrate and the third substrate are fixed by an attachment.

2. The method for manufacturing an electronic device according to claim 1, wherein: The first substrate has a first peripheral circuit area. Before the step of removing the second carrier, the method further includes the step of disposing a first electronic component on the first peripheral circuit area.

3. The method for manufacturing an electronic device according to claim 2, wherein: The first electronic component includes a chip-on-film or a flexible circuit board.

4. The method for manufacturing an electronic device according to claim 3, wherein: The attachment has a first thickness, the second substrate has a second thickness, the first electronic component includes a flexible substrate, and the flexible substrate has a third thickness, wherein the first thickness, the second thickness and the third thickness satisfy the following formula (1): 1.5≦(T1+T2) / T3≦7.5(1) Wherein, T1 is the first thickness, T2 is the second thickness, and T3 is the third thickness.

5. The method for manufacturing an electronic device according to claim 1, wherein: The third substrate has a second peripheral circuit area. Before the step of removing the third carrier, the method further includes the step of disposing a second electronic component on the second peripheral circuit area.

6. An electronic device, characterized in that Include: a support assembly; a first panel disposed on the supporting assembly, wherein the first panel comprises a first substrate having a display area and a peripheral circuit area; and a second panel, disposed on the first panel, The support component overlaps with the display area and at least a portion of the peripheral circuit area of ​​the first substrate, and the thickness of the support component is greater than the thickness of the first substrate.

7. The electronic device according to claim 6, characterized in that: The support assembly includes light-shielding material.

8. The electronic device according to claim 6, characterized in that: The ratio of the thickness of the supporting component to the thickness of the first substrate is greater than or equal to 3 and less than or equal to 15.

9. The electronic device according to claim 6, characterized in that: Also includes an attachment member, disposed between the first panel and the second panel, wherein the first panel further includes: a first electronic component disposed on the peripheral circuit region of the first substrate; and a second substrate, disposed on the first substrate, The attachment has a first thickness, the second substrate has a second thickness, the first electronic component includes a flexible substrate, and the flexible substrate has a third thickness, wherein the first thickness, the second thickness and the third thickness satisfy the following formula (1): 1.5≦(T1+T2) / T3≦7.5(1) Wherein, T1 is the first thickness, T2 is the second thickness, and T3 is the third thickness.

10. The electronic device according to claim 6, characterized in that: The first panel also includes a first electronic component disposed on the peripheral circuit area of ​​the first substrate, and the first electronic component includes a chip, wherein the chip is spaced a distance from a third substrate of the second panel in a direction perpendicular to the normal direction of the electronic device.

11. The electronic device according to claim 6, characterized in that: The first panel further comprises: a first electronic component disposed on the peripheral circuit region of the first substrate; and A protection layer is disposed between the second panel and the first electronic component.

Images