Wafer cleaning equipment

Abstract

The invention relates to wafer cleaning equipment, which is used for cleaning a plurality of crystal grains which are separated from one another after cutting and objects to be cleaned among the plurality of crystal grains. The wafer cleaning equipment can comprise a driving device, a turntable, an adsorption device and a cleaning device, and the turntable can be connected with a driving device and is driven by the driving device to rotate. And the adsorption device can be arranged in the turntable. The cleaning device can be arranged towards the rotating disc. The plurality of crystal grains can be fixed on the wafer frame, the adsorption device adsorbs at least one of the wafer frame or the plurality of crystal grains in the direction opposite to the gravity, and the cleaning device sprays at least one cleaning liquid towards the plurality of crystal grains.

Description

Technical Field

[0001] The present disclosure relates to a wafer cleaning device, and in particular to a wafer cleaning device for cleaning a plurality of wafers spaced apart from each other after being cut. Background Art

[0002] In semiconductor manufacturing, the wafer cleaning process is an important process. The reason is that if the contamination caused by processes such as cutting or etching is not cleaned, it will seriously affect the subsequent processes, and ultimately lead to product abnormalities and a decrease in yield.

[0003] In order to ensure that each wafer can be cleaned, a single wafer cleaning device can be used to clean each wafer. Figure 1 As shown, in the conventional technology, a single wafer is usually cleaned by placing the surface of the die 71 of the wafer to be cleaned facing upward, and using a conventional cleaning device 50 to clean the object 60 between the grooves 72 of each die 71 .

[0004] However, the above cleaning methods cannot completely clean today's wafer products (such as wafer products manufactured with a process after 14 nanometers), or it takes a very long time to clean the wafer products. The reason is that with the evolution of semiconductor processes, the structure of the chip has become increasingly complex, the circuits have become increasingly fine, the surface structure has become more three-dimensional, and the aspect ratio has been greatly improved. Therefore, both the width of the groove cut on the wafer surface and the gap generated by the surface structure are very small.

[0005] Under such circumstances, if the wafer is cleaned only by conventional methods or equipment, the contaminants inside the grooves will not be easily removed. Furthermore, the cleaning liquid, such as deionized water, falling from above will easily cause the contaminants to splash due to the uneven surface of the wafer, thereby causing cross contamination. Therefore, a wafer cleaning device is needed to solve the above conventional problems. Summary of the invention

[0006] Based on the above purpose, the present disclosure provides a wafer cleaning device for cleaning a plurality of grains spaced apart from each other after cutting and objects to be cleaned between the plurality of grains. The wafer cleaning device may include a driving device, a turntable, an adsorption device, and a cleaning device. The turntable may be connected to the driving device and driven to rotate by the driving device. The adsorption device may be disposed in the turntable. The cleaning device may be disposed toward the turntable. A plurality of grains may be fixed on a wafer frame, the adsorption device adsorbs at least one of the wafer frame or the plurality of grains in a direction opposite to gravity, and the cleaning device sprays at least one cleaning liquid toward the plurality of grains.

[0007] Preferably, the wafer cleaning equipment disclosed herein further comprises a plurality of fixing devices, which are arranged on the turntable and are used to fix the wafer frame at a fixed position or release the wafer frame at a release position.

[0008] Preferably, each of the plurality of fixing devices comprises a pushing unit, a pushing portion, a rotating shaft and a fixing portion, the pushing portion is connected to the pushing unit, the rotating shaft is arranged at the edge of the turntable, and the rotating shaft is located between the pushing portion and the fixing portion.

[0009] Preferably, the pushing unit is an elastic member, and the pushing unit applies a force toward the first direction to the pushing portion, and the fixed parts of each of the plurality of fixing devices are at a fixed position.

[0010] Preferably, the wafer cleaning equipment disclosed herein further comprises at least one release mechanism, the release mechanism applies a force toward the second direction to the pushing portion, and the first direction is opposite to the second direction, and the fixed portion is in a release position.

[0011] Preferably, the release mechanism is a ring mechanism.

[0012] Preferably, the pushing unit includes one or more of a pneumatic cylinder, a hydraulic lever, a motor, and a screw rod, and the pushing unit pushes or pulls the pushing portion to make the fixed portion in a fixed position or a released position.

[0013] Preferably, each of the multiple fixing devices includes a first end, a rotating shaft and a second end, the first end, the rotating shaft and the second end form a lever mechanism, the rotating shaft is located between the first end and the second end, the first end is closer to the center of the turntable than the second end, and the weight of the first end is greater than the weight of the second end.

[0014] Preferably, the cleaning device comprises a nozzle cantilever and at least one nozzle, the nozzle is arranged on the nozzle cantilever, and the nozzle is driven by the nozzle cantilever to move within the cleaning range.

[0015] Preferably, the adsorption device includes a plurality of adsorption units, and the plurality of adsorption units are arranged corresponding to the positions of the plurality of dies and the wafer frame.

[0016] The present disclosure provides a wafer cleaning device. In the present disclosure, a single wafer is arranged in a wafer frame to form a frame wafer (Frame Wafer), so as to facilitate the subsequent process and avoid wafer damage. Further explanation, the single frame wafer is adsorbed by a spin chuck, so that the cleaned surface of the frame wafer faces downward, and the frame wafer is rotated and cleaned in a manner that the spin chuck faces the ground (Spin Chuck Face Down). In addition, since the frame wafer is fixed under the turntable, a fixing device can be further used to fix the frame wafer on the turntable to prevent the frame wafer from sliding. The cleaning nozzle is located at the bottom of the equipment, and a cleaning liquid, such as deionized water or other liquid medicine, is applied to the upper frame wafer. Therefore, during cleaning, contaminants can flow down from the grooves between the grains in the frame wafer by gravity. This can prevent the use of conventional technology to clean a single wafer by using a turntable rotating upward, which causes the liquid medicine at the groove to splash and cause cross contamination. Therefore, the present disclosure can overcome the problem of difficult cleaning of the groove of the frame wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Non-limiting examples of the embodiments disclosed herein are described below with reference to the drawings listed after this paragraph.Description The drawings and the description are intended to illustrate and clarify the embodiments disclosed herein and should not be considered limiting in any way.

[0018] Figure 1 Schematic diagram of cleaning a single wafer in conventional technology.

[0019] Figure 2 FIG. 1 is a first schematic diagram of wafer cutting according to an embodiment of the present disclosure.

[0020] Figure 3 FIG. 4 is a second schematic diagram of wafer cutting according to an embodiment of the present disclosure.

[0021] Figure 4A It is a first schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0022] Figure 4B It is a second schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0023] Figure 4C is a schematic diagram of a transfer device according to an embodiment of the present disclosure.

[0024] Figure 5A is a first schematic diagram of an adsorption unit according to an embodiment of the present disclosure.

[0025] Figure 5B is a second schematic diagram of an adsorption unit according to an embodiment of the present disclosure.

[0026] Fig. 6AIt is a third schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0027] Figure 6B It is a fourth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0028] Figure 7 It is a bottom view of the fixing device according to an embodiment of the present disclosure.

[0029] Fig. 8A It is a fifth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0030] Figure 8B It is a sixth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0031] Fig.9A It is a seventh schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0032] Fig. 9B FIG. 8 is an eighth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0033] Fig. 10A It is a ninth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0034] Fig. 10B FIG. 10 is a tenth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present disclosure.

[0035] Fig.11 It is a schematic diagram of a fixing device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] In order to facilitate understanding of the technical features, contents and advantages of the present disclosure and the effects that can be achieved, the present disclosure is hereby described in detail in the form of embodiments in conjunction with the accompanying drawings. The drawings used therein are only for illustration and auxiliary explanation purposes and may not be the actual proportions and precise configurations after the implementation of the present disclosure. Therefore, the proportions and configurations of the attached drawings should not be interpreted to limit the scope of rights of the present disclosure in actual implementation. This should be stated in advance.

[0037] The following will describe embodiments of the present disclosure with reference to the relevant drawings. To facilitate understanding, the same elements in the following embodiments are labeled with the same symbols.

[0038] There are multiple cleaning processes in the process of semiconductor to prevent the wafer from being contaminated, so as to facilitate the smooth progress of subsequent processes such as lithography, etching, and packaging. In these processes, the wafer product 20 after cutting is very difficult to clean.

[0039] like Figure 2As shown, in today's semiconductor manufacturing process, the wafer product 20 is cut multiple times by the cutting device 106 to form multiple grains 201. Grooves 203 are formed between the multiple grains 201. In addition to being formed on the multiple grains 201, contaminants after grinding are also formed in the grooves 203.

[0040] like Figure 2 and Figure 3 As shown, in other processes, Figure 2 The cutting device 106 performs a first cutting process on the wafer product 20, and then the wafer product 20 is turned over, and the back of the wafer product 20 is removed by the grinding device 107, and finally a plurality of spaced-apart grains 201 are formed.

[0041] Regardless of the process used to form the crystal grains, contaminants will be generated, so a wafer cleaning device is needed to clean the contaminants. The present disclosure provides a wafer cleaning device for cleaning a plurality of crystal grains 201 spaced apart from each other after dicing and the spaces between the plurality of crystal grains 201 to be cleaned.

[0042] In one embodiment, the wafer cleaning device may include a driving device 101, a turntable 102, an adsorption device 103, a cleaning device 104, and a transfer device 108. Figure 4A and 4B As shown, since the turntable 102 is facing the ground (SpinChuck Face Down), after the die 201 is rotated and cleaned, the object 40 to be cleaned, such as particles, chemicals and other pollutants, can flow downward by gravity, thereby increasing the cleaning efficiency.

[0043] Further, in one embodiment, the driving device 101 may include a motor 1013, and the motor 1013 may be controlled to output rotational power to drive the turntable 102 to rotate. The turntable 102 may be connected to the driving device 101 and driven to rotate by the driving device 101. In a preferred embodiment, the turntable 102 may be connected to a driving shaft 1011 of the driving device 101, and the driving shaft 1011 transmits the power of the motor 1013.

[0044] like Figures 4A to 5B As shown, the adsorption device 103 is disposed in the turntable 102 and may include a plurality of adsorption units 1031. In one embodiment, the adsorption unit 1031 may be one or more of a magnetic adsorption element, a negative pressure adsorption element, and a vacuum adsorption element to adsorb at least one of the wafer frame 30 or the plurality of dies 201. In a preferred embodiment, the adsorption unit 1031 may be a vacuum adsorption element, and an air extraction port of the adsorption unit 1031 is disposed on the surface of the turntable 102 facing the ground.

[0045] Further, in the present disclosure, the cleaning device 104 is disposed toward the turntable 102, the plurality of dies 201 can be fixed on the wafer frame 30, and the adsorption device 103 adsorbs at least one of the wafer frame 30 or the plurality of dies 201 in the direction opposite to gravity, and the cleaning device 104 can spray at least one cleaning liquid, such as deionized water, cleaning agent, etc., toward the plurality of dies 201. When the cleaning device 104 finishes cleaning the dies 201, the transfer device 108 can be used to transfer the wafer frame 30 to the shipping area of ​​the wafer cleaning equipment.

[0046] To further illustrate, the cleaning device 104 may include a nozzle cantilever 1041 and a nozzle 1042, the nozzle 1042 may be disposed on the nozzle cantilever 1041, and the nozzle 1042 is driven by the nozzle cantilever 1041 to move within the cleaning range. However, the present invention is not limited thereto. For example, in one embodiment, in order to prevent different cleaning liquids from being sprayed from the same nozzle 1042 and causing cross contamination, the cleaning device 104 may also include a plurality of nozzle cantilever 1041 and a plurality of nozzles 1042, or may also include a nozzle cantilever 1041 and a plurality of nozzles 1042, and different cleaning liquids, such as deionized water, etching solution, isopropyl ketone solution, etc., may be sprayed from different nozzles 1042.

[0047] In addition, in other embodiments, the nozzle 1042 can provide one or more cleaning liquids in a fan shape, a cone shape, or a needle shape when spraying, and the cleaning liquid sprayed by the nozzle 1042 can be a high-temperature, high-pressure cleaning liquid to facilitate the cleaning of the grains and the objects to be cleaned.

[0048] To further explain, the transfer device 108 may be a robot arm, and may include a telescopic arm 1081 and a carrying portion 1082. The carrying portion 1082 is disposed on the telescopic arm 1081, and the telescopic arm 1081 is controlled to move the carrying portion 1082. The carrying portion 1082 has a component that can attract the wafer frame 30, such as a suction cup, an air extraction hole, etc., to attract the surface of the wafer frame 30. Therefore, in one embodiment, the transfer device 108 can take the wafer frame 30 in a horizontal state to perform a cleaning operation.

[0049] In a preferred embodiment, the transfer device 108 may include two robotic arms, or may be Figure 4C The figure shows a dual-finger type robot arm. In other words, the transfer device 108 may include two telescopic arms 1081 and two carriers 1082. Therefore, different telescopic arms 1081 and different carriers 1082 may be used to avoid cross contamination of the wafer frame 30 and the die 201 before and after cleaning.

[0050] like Figure 5A and Figure 5BAs shown, the die 201 and the wafer frame 30 are adhered to the protective film 202, and the adsorption device 103 adsorbs the protective film 202, so the adsorption device 103 can adsorb the wafer frame 30 or at least one of the multiple die 201 adhered to the protective film 202. In a preferred embodiment, the protective film 202 can be an ultraviolet hardening tape (Ultraviolet Tape), which is a pressure-sensitive tape. Through the adhesive on the protective film 202, the protective film 202 can be firmly bonded to the die 201 and the wafer frame 30.

[0051] The protective film 202 includes a substrate and an adhesive. The substrate may be a plastic film, which may include one or more materials such as polyolefin, polyvinyl chloride, and polyethylene terephthalate. The adhesive is a pressure-sensitive adhesive that can be hardened after being irradiated with ultraviolet rays. The adhesive has high adhesion, but after being irradiated with ultraviolet rays, the polymer chains therein will form a three-dimensional network structure and harden, thereby causing the adhesion to drop sharply, and can be easily and cleanly peeled off to facilitate subsequent processes.

[0052] In the present disclosure, the position of the adsorption unit 1031 can be set according to the needs. Figure 5B As shown, the adsorption unit 1031 can be arranged corresponding to the position of the die 201 and the wafer frame 30, or can be arranged as shown in FIG. Figure 5A As shown, it is only set corresponding to the position of the wafer frame 30. In addition, other configurations can also be performed according to requirements, for example, the adsorption unit 1031 is only set corresponding to the position of the die 201. In a preferred embodiment, when the adsorption unit 1031 is Figure 5B When the positions of the die 201 and the wafer frame 30 are arranged correspondingly, a preferred adsorption effect of the die 201 and the wafer frame 30 can be provided.

[0053] Further, in order to further ensure that the wafer frame 30 and the die 201 can be firmly fixed, the wafer cleaning apparatus disclosed herein may further include a plurality of fixing devices 105. The plurality of fixing devices 105 may be disposed on the turntable 102 and cooperate with the adsorption device 103 to fix the wafer frame 30 at a fixed position or release the wafer frame 30 at a release position.

[0054] In one embodiment, if Fig. 6A and Figure 6BAs shown, each of the plurality of fixing devices 105 includes a pushing unit 1051, a pushing portion 1052, a rotating shaft 1053, a fixing portion 1054, and at least one releasing mechanism 1055. The pushing portion 1052 is connected to the pushing unit 1051, and the rotating shaft 1053 is disposed at the edge of the rotating disk 102, and the rotating shaft 1053 is located between the pushing portion 1052 and the fixing portion 1054. In a preferred embodiment, the pushing portion 1052 and the fixing portion 1054 can constitute an L-shaped rod, so that when the pushing portion 1052 is pushed, due to the rotation of the rotating shaft 1053, the fixing portion 1054 will have an opposite movement direction to the pushing portion 1052.

[0055] In a preferred embodiment, the push unit 1051 may be an elastic member, such as a spring. Therefore, the push unit 1051 may apply a force toward the first direction to the push portion 1052, for example, the push unit 1051 may push the push portion 1052 toward the edge of the rotating disk 102, so that the fixing portion 1054 of each of the plurality of fixing devices 105 may be located at a fixed position.

[0056] Therefore, in one embodiment, when the turntable 102 rotates, at least one of the wafer frame 30 or the die 201 can be adsorbed by the adsorption device 103, and the wafer frame 30 can also be fixed by the fixing device 105, thereby preventing the wafer frame 30 or the die 201 from sliding or falling off when the turntable 102 rotates.

[0057] In another embodiment, when the turntable 102 is not rotating (for example, the wafer frame 30 and the die 201 need to be sent to the wafer cleaning equipment for cleaning, or the die 201 in the wafer frame 30 has been cleaned), the release mechanism 1055 can apply a force toward the second direction to the pushing portion 1052, and the first direction is opposite to the second direction (for example, toward the center of the turntable 102). At this time, the fixing portion 1054 is in the release position to prepare for subsequent processes.

[0058] Further explanation, in the above embodiment, when the wafer frame 30 and the die 201 are sent to the wafer cleaning equipment for cleaning, the wafer frame 30 can be taken and turned over by a robot arm, a turning device, etc., and at least one of the wafer frame 30 or the die 201 is first adsorbed by the adsorption device 103 on the turntable 102, and then the fixing part 1054 of the fixing device 105 is moved to a fixed position so that the fixing part 1054 fixes the wafer frame 30. At this time, when the turntable 102 rotates, the wafer frame 30 or the die 201 can be prevented from sliding or falling off on the turntable 102.

[0059] After the wafer frame 30 and the die 201 are cleaned in the wafer cleaning equipment, the release mechanism 1055 can first move the fixing portion 1054 of the fixing device 105 to the release position, so that the fixing portion 1054 is separated from the wafer frame 30. When the wafer frame 30 is ready to be taken (for example, when the transfer device 108 is ready to transfer the wafer frame 30), the adsorption device 103 releases the adsorption force to facilitate the subsequent process.

[0060] In one embodiment, the release mechanism 1055 can rotate synchronously with the turntable 102, or can be a mechanism independent of the turntable 102 and not rotating with the turntable 102. In a preferred embodiment, FIG. 8A to FIG. 8B As shown, the release mechanism 1055 may be a ring mechanism, and the push unit 1051 may include an elastic member, such as a spring. Fig. 8A As shown, when the release mechanism 1055 is raised, the pushing unit 1051 will push the pushing portion 1052, and the fixing portion 1054 can be located at a fixed position to fix the wafer frame 30. Figure 8B As shown, when the release mechanism 1055 is lowered, the annular release mechanism 1055 will push the abutting portion 1052 toward the center of the turntable 102 . At this time, the fixing portion 1054 will be located at the release position, ready to release the wafer frame 30 .

[0061] In addition, in one embodiment, if Figure 7 As shown, in order to avoid interference between the fixing device 105 and other mechanisms (such as a transfer device 108 for taking wafers), the fixing device 105 can be disposed on opposite sides of the turntable 102 .

[0062] In other embodiments, the pushing unit 1051 may also include one or more of a pneumatic cylinder, a hydraulic lever, a motor, and a screw. FIG. 9A to FIG. 9B As shown, when the pushing unit 1051 itself is controlled to push or pull the pushing portion 1052, the above-mentioned release mechanism 1055 is no longer needed to make the fixing portion 1054 be located at the fixing position or the releasing position.

[0063] In one embodiment, it is also possible to FIG. 10A to FIG. 11As shown, other forms of fixing device 105 are provided. Fixing device 105 may include a first end 1056, a rotating shaft 1053 and a second end 1057. The first end 1056, the rotating shaft 1053 and the second end 1057 form a lever mechanism. The rotating shaft 1053 is located between the first end 1056 and the second end 1057, the first end 1056 is closer to the center of the turntable 102 than the second end 1057, and the weight of the first end 1056 is greater than the weight of the second end 1057. In a preferred embodiment, fixing device 105 may further include a housing 1058, the housing 1058 may be provided on the turntable 102, and the first end 1056, the rotating shaft 1053 and the second end 1057 may be provided in the housing 1058.

[0064] Therefore, when the turntable 102 rotates, the first end 1056 will move toward the edge of the turntable 102 due to the centrifugal force, and at this time, the second end 1057 will be located at a fixed position. When the turntable 102 stops rotating, since the weight of the first end 1056 is greater than the weight of the second end 1057, the first end 1056 will return to the initial position due to the influence of gravity, and at this time, the second end 1057 will be located at the release position, ready to release the wafer frame 30. In this case, it is not necessary to set up other power mechanisms to control the fixing device 105.

[0065] In summary, in the present disclosure, the cut die 201 is set in the wafer frame 30, and the wafer frame 30 can be adsorbed by the adsorption device 103 in the turntable 102, so that the cleaned surface of the die 201 faces downward, and the die 201 is rotated and cleaned in a manner that the turntable 102 faces the ground. In addition, since the die 201 is fixed below the turntable, the wafer frame 30 can be further fixed on the turntable 102 using a fixing device 105 to prevent the wafer frame 30 from sliding. The nozzle 1042 is located at the bottom of the device and applies a cleaning liquid, such as deionized water or other liquid medicine, to the upper die 201. Therefore, during cleaning, contaminants can flow down from the grooves 203 between the die 201 by gravity. This can prevent the use of conventional technology to clean a single wafer by using a turntable rotating upward, which causes the liquid medicine at the groove to splash and cause cross contamination. Therefore, the present disclosure can overcome the problem of difficult cleaning of the grooves of the frame wafer.

[0066] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made thereto without departing from the spirit and scope of the present disclosure should be included in the claims.

Claims

1. A wafer cleaning device for cleaning a plurality of wafers separated from each other after dicing and objects to be cleaned between the plurality of wafers, characterized in that: The wafer cleaning equipment comprises: Drive device; A turntable connected to the driving device and driven to rotate by the driving device; an adsorption device, disposed in the turntable; and A cleaning device is disposed toward the turntable, The plurality of crystal grains are fixed on a wafer frame, the adsorption device adsorbs at least one of the wafer frame or the plurality of crystal grains in a direction opposite to gravity, and the cleaning device sprays at least one cleaning liquid toward the plurality of crystal grains.

2. The wafer cleaning equipment according to claim 1, characterized in that: It also includes a plurality of fixing devices, which are arranged on the turntable and are used to fix the wafer frame at a fixed position or release the wafer frame at a release position.

3. The wafer cleaning equipment according to claim 2, characterized in that: Each of the plurality of fixing devices comprises a pushing unit, a pushing portion, a rotating shaft and a fixing portion, wherein the pushing portion is connected to the pushing unit, the rotating shaft is arranged at the edge of the turntable, and the rotating shaft is located between the pushing portion and the fixing portion.

4. The wafer cleaning equipment according to claim 3, characterized in that: The pushing unit is an elastic member, and the pushing unit applies a force toward a first direction to the pushing portion, and the fixing parts of each of the plurality of fixing devices are at the fixing position.

5. The wafer cleaning equipment according to claim 4, characterized in that: It also includes at least one releasing mechanism, wherein the releasing mechanism applies a force toward a second direction to the pushing portion, and the first direction is opposite to the second direction, and the fixing portion is at the releasing position. The wafer cleaning equipment as claimed in claim 5 , wherein the release mechanism is a ring mechanism.

7. The wafer cleaning equipment as described in claim 3, wherein the pushing unit includes one or more of a pneumatic cylinder, a hydraulic lever, a motor, and a screw, and the pushing unit pushes or pulls the pushing part to make the fixed part be in the fixed position or the release position.

8. The wafer cleaning equipment according to claim 2, characterized in that: Each of the multiple fixing devices includes a first end, a rotating shaft and a second end, the first end, the rotating shaft and the second end form a lever mechanism, the rotating shaft is located between the first end and the second end, the first end is closer to the center of the turntable than the second end, and the weight of the first end is greater than the weight of the second end.

9. The wafer cleaning equipment according to claim 1, characterized in that: The cleaning device comprises a nozzle cantilever and at least one nozzle, wherein the nozzle is arranged on the nozzle cantilever, and the nozzle is driven by the nozzle cantilever to move within a cleaning range.

10. The wafer cleaning equipment according to claim 1, characterized in that: The adsorption device further comprises a plurality of adsorption units, and the plurality of adsorption units are arranged corresponding to the positions of the plurality of crystal grains and the wafer frame.

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