A power-off protection integrated circuit packaging structure and packaging method thereof

Abstract

The present invention relates to the field of circuit packaging, and in particular to a power-off protection integrated circuit packaging structure and a packaging method thereof. The present invention comprises an opening and closing component, on which a rotating component is installed, and two groups of power-off protection components are symmetrically installed on the bottom edge of the rotating component; the present invention drives the protective shell to move in a direction away from the packaging structure, and the protective shell moves while driving the sliding rod to squeeze the compression spring, and the compression spring exerts a rebound force on the pressure sensor while being squeezed; when a power failure occurs, the compression spring starts to rebound after sensing the disappearance of the pressure, and during the rebound process, drives the sliding rod to slide in the sleeve tube, and while sliding, drives the two groups of protective shells to wrap and protect the packaging structure, thereby improving the integrated circuit packaging effect and the power-off protection effect of the device.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit packaging, and in particular relates to a power-off protection integrated circuit packaging structure and a packaging method thereof. Background Art

[0002] In the prior art, Chinese Patent Publication No.: CN221651454U, Authorization Publication Date: 2024-09-03, discloses a high-precision integrated circuit packaging structure, including a workbench, the lower end surface of the workbench is fixedly connected to a hydraulic rod, the surface of the hydraulic rod passes through the side wall of the workbench and is fixedly connected to a connecting block, and two connecting rods are rotatably connected in the connecting block; the above embodiment improves the stability of the circuit board during welding.

[0003] However, the device still has the following defects:

[0004] When performing integrated circuit packaging work, if a power outage occurs, the packaging structure cannot be protected in time, thereby reducing the working effect of the integrated circuit packaging structure. Summary of the invention

[0005] In view of the above problems, the present invention provides a power-off protection integrated circuit packaging structure, which includes an opening and closing component, a rotating component is installed on the opening and closing component, and two groups of power-off protection components are symmetrically installed on the bottom edge of the rotating component;

[0006] The rotating assembly includes a packaging structure, the power-off protection assembly includes a compression mechanism, and a pressure protection mechanism is installed on the compression mechanism;

[0007] When a power outage occurs, the compression mechanism senses the disappearance of pressure and begins to rebound, driving the pressure protection mechanism to wrap and protect the packaging structure during the rebound process.

[0008] Furthermore, two groups of clamping assemblies are symmetrically installed on the inner wall of the opening and closing assembly, and a group of auxiliary components is installed on the top of each group of the clamping assemblies; the opening and closing assembly includes a packaging box, a first fixing plate is installed on one side wall of the packaging box, a first electric push rod is installed on the top of the first fixing plate, and a cover plate is installed on the output end of the first electric push rod.

[0009] Furthermore, the clamping assembly includes a second fixed plate, one end of each group of the second fixed plates is installed on the inner wall of the packaging box, a group of second electric push rods is installed on one side wall of each group of the second fixed plates, and a group of third fixed plates is installed on the output end of each group of the second electric push rods.

[0010] Furthermore, two groups of fourth fixing plates are symmetrically installed on one side wall of the third fixing plate, a group of third electric push rods are installed on one side wall of each group of fourth fixing plates, and a group of clamping blocks are installed on the output end of each group of third electric push rods.

[0011] Furthermore, the auxiliary component includes a first electric slide, the bottom of each group of the first electric slides is installed on the top of one group of third fixed plates, and the output end of each group of the first electric slides is transmission-connected to a group of first motors.

[0012] Furthermore, a group of first connecting plates are transmission-connected to the output end of each group of the first motors, a group of second electric slides are installed on one side wall of each group of the first connecting plates, and a group of fourth electric push rods are transmission-connected to the output end of each group of the second electric slides.

[0013] Furthermore, the rotating assembly also includes a transmission plate, a third motor is installed on the bottom of the transmission plate, an output end of the third motor is transmission-connected to a second mounting plate, and the packaging structure is installed on the bottom of the second mounting plate.

[0014] Furthermore, the compression mechanism includes a third mounting plate, a group of sleeve tubes are installed on one side wall of each group of the third mounting plates, and one end of a group of compression springs are installed on one side inner wall of each group of the sleeve tubes; the pressure protection mechanism includes sliding rods, one end of each group of the sliding rods is installed on the other end of the compression spring, a group of pressure sensors are installed at the junction of each group of the sliding rods and the compression springs, and a group of protective shells are installed on one side wall of each group of the sliding rods.

[0015] Furthermore, the top of each group of the third mounting plates is mounted on the bottom of the second mounting plates, a group of sixth electric push rods is mounted on one side wall of each group of the third mounting plates, a group of first electromagnetic blocks is mounted on the output end of each group of the sixth electric push rods, and a group of second electromagnetic blocks is mounted on the outer wall of each group of the sliding rods, and the first electromagnetic blocks are magnetically connected to the second electromagnetic blocks.

[0016] A packaging method for a power-off protection integrated circuit packaging structure, the packaging method comprising:

[0017] Drive the pressure protection mechanism to move in a direction away from the packaging structure;

[0018] The pressure protection mechanism applies the rebound force to the compression mechanism;

[0019] When a power outage occurs, the compression mechanism senses the loss of pressure and begins to rebound;

[0020] During the rebound process, the pressure protection mechanism is driven to wrap and protect the packaging structure.

[0021] The beneficial effects of the present invention are:

[0022] 1. Drive the protective shell to move away from the packaging structure. When the protective shell moves, it drives the sliding rod to squeeze the compression spring. The compression spring exerts a rebound force on the pressure sensor while being squeezed. When a power outage occurs, the compression spring starts to rebound after sensing the disappearance of the pressure. During the rebound process, it drives the sliding rod to slide in the sleeve. While sliding, it drives the two sets of protective shells to wrap and protect the packaging structure, thereby improving the integrated circuit packaging effect and the power-off protection effect of the device.

[0023] 2. Drive the connecting rod to slide in the sleeve to squeeze the tension spring, start the first electric slide to drive the edge grinding plate to move horizontally to grind the outer wall of the chip, and polish the burrs on it. Then, when facing the chip with uneven outer walls, it will use the rebound of the tension spring for buffering and grinding, which improves the adaptive edge grinding effect while avoiding damage to the chip; start the fourth electric push rod to adjust the height so that the adsorption mud plate fits on the polished outer wall of the chip, and then start the first electric slide to drive the adsorption mud plate to adsorb impurities, which improves the precision of subsequent packaging work.

[0024] 3. Start the fifth electric push rod to push the packaging structure down for packaging work. In order to improve the flexibility of packaging, the third motor can be started for rotation packaging. For irregular chips, the second motor can be started to drive the transmission plate to rotate. The transmission plate rotates and drives the packaging structure to rotate at the same time. Then, multi-angle packaging work is started, which improves the flexibility of packaging work.

[0025] 4. When the protective shell moves toward the packaging structure, the inner wall of the protective shell hits the sliding push plate, and the sliding push plate slides in the placement box. As it slides, the second output cavity is located directly above the first output cavity. Then, the cold air generated by the condensation block in the placement box is discharged downward, and the cold air is discharged into the protective shell, so as to cool down the packaging structure after the power-off protection, thereby improving the cooling protection effect and the storage effect of the device.

[0026] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of a circuit packaging structure according to an embodiment of the present invention is shown;

[0029] Figure 2 A schematic structural diagram of a clamping assembly according to an embodiment of the present invention is shown;

[0030] Figure 3 It shows a schematic structural diagram of a rotating assembly according to an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of the structure of an opening and closing assembly according to an embodiment of the present invention is shown;

[0032] Figure 5 A schematic diagram of the structure of a second fixing plate according to an embodiment of the present invention is shown;

[0033] Figure 6 A schematic diagram of the structure of an auxiliary component according to an embodiment of the present invention is shown;

[0034] Figure 7 A schematic cross-sectional view of a sleeve tube according to an embodiment of the present invention is shown;

[0035] Figure 8 It shows a schematic structural diagram of a first mounting plate according to an embodiment of the present invention;

[0036] Fig. 9 A schematic diagram of the structure of a power failure protection component according to an embodiment of the present invention is shown;

[0037] Fig.10 A schematic cross-sectional view of a sleeve according to an embodiment of the present invention is shown;

[0038] Fig.11 A schematic cross-sectional view of a self-cooling component according to an embodiment of the present invention is shown.

[0039] In the figure: 1. opening and closing assembly; 101. packaging box; 102. first fixed plate; 103. first electric push rod; 104. cover plate; 2. clamping assembly; 201. second fixed plate; 202. second electric push rod; 203. third fixed plate; 204. fourth fixed plate; 205. third electric push rod; 206. clamping block; 3. auxiliary assembly; 301. first electric slide; 302. first motor; 303. first connecting plate; 304. second electric slide; 305. fourth electric push rod; 306. second connecting plate; 307. sleeve tube; 308. tension spring; 309. connecting rod; 310. edge grinding plate; 311. cavity; 312. adsorption mud plate ;4. Rotating assembly;401. Fifth electric push rod;402. First mounting plate;403. Second motor;404. Transmission plate;405. Third motor;406. Second mounting plate;407. Packaging structure;5. Power-off protection assembly;501. Third mounting plate;502. Socket sleeve;503. Compression spring;504. Sliding rod;505. Pressure sensor;506. Protective shell;507. Sixth electric push rod;508. First electromagnetic block;509. Second electromagnetic block;6. Self-cooling assembly;601. Fourth mounting plate;602. Placement box;603. First output cavity;604. Condensation block;605. Sliding push plate;606. Second output cavity. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] The embodiment of the present invention provides a power-off protection integrated circuit packaging structure. It includes an opening and closing component 1, exemplarily, as Figure 1 , Figure 2 and Figure 3 As shown, two groups of clamping components 2 are symmetrically installed on the inner wall of the opening and closing component 1, and a group of auxiliary components 3 are installed on the top of each group of the clamping components 2. A rotating component 4 is installed on the opening and closing component 1, and two groups of power-off protection components 5 are symmetrically installed on the bottom edge of the rotating component 4, and two groups of self-cooling components 6 are symmetrically installed on the bottom.

[0042] For example, Figure 4As shown, the opening and closing assembly 1 includes a packaging box 101, a first fixing plate 102 is installed on one side wall of the packaging box 101, a first electric push rod 103 is installed on the top of the first fixing plate 102, and a cover plate 104 is installed on the output end of the first electric push rod 103.

[0043] For example, Figure 5 As shown, the clamping assembly 2 includes a second fixing plate 201, one end of each group of the second fixing plates 201 is mounted on the inner wall of the packaging box 101, a group of second electric push rods 202 are mounted on one side wall of each group of the second fixing plates 201, a group of third fixing plates 203 are mounted on the output end of each group of the second electric push rods 202, two groups of fourth fixing plates 204 are symmetrically mounted on one side wall of the third fixing plates 203, a group of third electric push rods 205 are mounted on one side wall of each group of the fourth fixing plates 204, and a group of clamping blocks 206 are mounted on the output end of each group of the third electric push rods 205.

[0044] For example, Figure 6 and Figure 7 As shown, the auxiliary component 3 includes a first electric slide 301, the bottom of each group of the first electric slide 301 is installed on the top of one group of the third fixed plates 203, the output end of each group of the first electric slide 301 is connected to a group of first motors 302, the output end of each group of the first motors 302 is connected to a group of first connecting plates 303, a group of second electric slides 304 are installed on one side wall of each group of the first connecting plates 303, the output end of each group of the second electric slides 304 is connected to a group of fourth electric push rods 305, and the output end of each group of the fourth electric push rods 305 is connected to the A group of second connecting plates 306 are installed, and a group of sleeve tubes 307 are installed on one side wall of each group of the second connecting plates 306, one end of a group of tension springs 308 are installed on the inner wall of one side of each group of the sleeve tubes 307, and a group of connecting rods 309 are installed on the other end of each group of the tension springs 308, and the outer wall of each group of the connecting rods 309 is slidably connected in the sleeve tubes 307, and a group of edge grinding plates 310 are installed on one side wall of each group of the connecting rods 309, and a group of cavities 311 are opened on one side wall of each group of the edge grinding plates 310, and a group of mud adsorption plates 312 are installed in each group of the cavities 311.

[0045] Before the circuit packaging structure works, the two groups of chips to be packaged are placed between the two groups of clamping blocks 206 respectively, and then the third electric push rod 205 is started to drive the two groups of clamping blocks 206 to clamp and limit the chips, and then the second electric push rod 202 is started to push the two groups of chips to move in opposite directions, and then the fourth electric push rod 305 is started to drive the edge grinding plate 310 to move to a position parallel to the edge of the chip during the movement, and then the second electric slide 304 is started to drive the edge grinding plate 310 to contact the outer wall of the chip, and in the process of its movement, it drives the connecting rod 309 to slide in the sleeve tube 307 to squeeze the tension spring 308, and then the first electric slide is started. The table 301 drives the edge grinding plate 310 to move horizontally to grind the outer wall of the chip and polish the rough edges thereof. Subsequently, when facing a chip with an uneven outer wall, the rebound of the tension spring 308 is used for buffering and grinding, thereby improving the adaptive edge grinding effect while avoiding damage to the chip. Subsequently, the fourth electric push rod 305 is started to adjust the height so that the adsorption mud plate 312 fits the outer wall of the polished chip. Subsequently, the first electric slide table 301 is started to drive the adsorption mud plate 312 to adsorb impurities, thereby improving the precision of subsequent packaging work. When packaging is required, the first motor 302 is started to drive the edge grinding plate 310 to rotate and adjust the position to avoid blocking the packaging structure.

[0046] For example, Figure 8 As shown, the rotating component 4 includes a fifth electric push rod 401, the top of the fifth electric push rod 401 is installed on the bottom of the cover plate 104, a first mounting plate 402 is installed on the output end of the fifth electric push rod 401, a second motor 403 is installed on a side wall of the first mounting plate 402, a transmission plate 404 is transmission-connected to the output end of the second motor 403, a third motor 405 is installed on the bottom of the transmission plate 404, a second mounting plate 406 is transmission-connected to the output end of the third motor 405, and a packaging structure 407 is installed on the bottom of the second mounting plate 406.

[0047] The packaging work begins, and the fifth electric push rod 401 is started to push the packaging structure 407 down to perform the packaging work. In order to improve the flexibility of the packaging, the third motor 405 can be started to perform rotational packaging. For irregular chips, the second motor 403 can be started to drive the transmission plate 404 to rotate. The transmission plate 404 rotates and drives the packaging structure 407 to rotate at the same time. Then, multi-angle packaging work is started, which improves the flexibility of the packaging work.

[0048] For example, Fig. 9 and Fig.10As shown, the power-off protection assembly 5 includes a third mounting plate 501, the top of each group of the third mounting plates 501 is mounted on the bottom of the second mounting plate 406, a group of sleeve tubes 502 are mounted on one side wall of each group of the third mounting plates 501, one end of a group of compression springs 503 are mounted on the inner wall of one side of each group of the sleeve tubes 502, and a group of sliding rods 504 are mounted on the other end of each group of the compression springs 503, and each group of the sliding rods 504 are slidably connected in the sleeve tube 502, and each group of the sliding rods A group of pressure sensors 505 are installed at the junction of 504 and the compression spring 503, a group of protective shells 506 are installed on one side wall of each group of sliding rods 504, a group of sixth electric push rods 507 are installed on one side wall of each group of the third mounting plates 501, a group of first electromagnetic blocks 508 are installed on the output end of each group of the sixth electric push rods 507, and a group of second electromagnetic blocks 509 are installed on the outer wall of each group of the sliding rods 504, and the first electromagnetic blocks 508 and the second electromagnetic blocks 509 are magnetically connected.

[0049] The third mounting plate 501 , the sleeve 502 and the compression spring 503 constitute a compression mechanism, and the sliding rod 504 , the pressure sensor 505 and the protective shell 506 constitute a pressure protection mechanism.

[0050] Before the packaging structure is operated, the sixth electric push rod 507 is first started to push the first electromagnetic block 508 and the second electromagnetic block 509 to be magnetically connected, and then the sixth electric push rod 507 is started to drive the protective shell 506 to move away from the packaging structure 407. While the protective shell 506 moves, it drives the sliding rod 504 to slide in the sleeve tube 502, and while sliding, it drives the sliding rod 504 to squeeze the compression spring 503, and while being squeezed, the compression spring 503 also exerts a rebound force on the pressure sensor 505; when a power outage occurs, the magnetic connection between the first electromagnetic block 508 and the second electromagnetic block 509 disappears, and then the compression spring 503 starts to rebound after sensing the disappearance of the pressure, and during the rebound process, it drives the sliding rod 504 to slide in the sleeve tube 502, and while sliding, it drives the two sets of protective shells 506 to wrap and protect the packaging structure 407, thereby improving the integrated circuit packaging effect while improving the power-off protection effect of the device.

[0051] For example, Fig.11As shown, the self-cooling component has a fourth mounting plate 601, and the top of each group of the fourth mounting plates 601 is mounted on the bottom of the second mounting plate 406; a group of placement boxes 602 are mounted on the bottom of each group of the fourth mounting plates 601; a group of first output cavities 603 are opened on the bottom of each group of the placement boxes 602; two groups of condensation blocks 604 are symmetrically installed on the inner wall of each group of the placement boxes 602; a group of sliding push plates 605 are slidably connected to one side wall of each group of the placement boxes 602 close to the protective shell 506; and a group of second output cavities 606 are opened on each group of the sliding push plates 605.

[0052] When the protective shell 506 moves toward the packaging structure 407, the inner wall of the protective shell 506 hits the sliding push plate 605, and the sliding push plate 605 slides in the placement box 602. As it slides, the second output cavity 606 is located directly above the first output cavity 603, and then the cold air generated by the condensation block 604 in the placement box 602 is discharged downward, and the cold air is discharged into the protective shell 506, so as to cool down the packaging structure 407 after the power-off protection, thereby improving the cooling protection effect and the storage effect of the device.

[0053] The protective shell 506 is driven to move in a direction away from the packaging structure 407. While the protective shell 506 moves, it drives the sliding rod 504 to squeeze the compression spring 503. While being squeezed, the compression spring 503 exerts a rebound force on the pressure sensor 505. When a power outage occurs, the compression spring 503 begins to rebound after sensing the disappearance of the pressure. During the rebound process, it drives the sliding rod 504 to slide in the sleeve 502. While sliding, it drives the two groups of protective shells 506 to wrap and protect the packaging structure 407, thereby improving the integrated circuit packaging effect while improving the power-off protection effect of the device.

[0054] The connecting rod 309 is driven to slide in the sleeve tube 307 to squeeze the tension spring 308, and the first electric slide 301 is started to drive the edge grinding plate 310 to move horizontally to grind the outer wall of the chip and polish the burrs. Subsequently, when facing the chip with a concave and convex outer wall, the rebound of the tension spring 308 is used for buffering and grinding, thereby improving the adaptive edge grinding effect and avoiding damage to the chip; the fourth electric push rod 305 is started to adjust the height so that the adsorption mud plate 312 fits on the polished chip outer wall, and then the first electric slide 301 is started again to drive the adsorption mud plate 312 to adsorb impurities, thereby improving the precision of subsequent packaging work.

[0055] The fifth electric push rod 401 is started to push the packaging structure 407 down for packaging work. In order to improve the flexibility of packaging, the third motor 405 can be started for rotational packaging. For irregular chips, the second motor 403 can be started to drive the transmission plate 404 to rotate. When the transmission plate 404 rotates, it drives the packaging structure 407 to rotate. Then, multi-angle packaging work is started, which improves the flexibility of packaging work.

[0056] When the protective shell 506 moves toward the packaging structure 407, the inner wall of the protective shell 506 hits the sliding push plate 605, and the sliding push plate 605 slides in the placement box 602. As it slides, the second output cavity 606 is located directly above the first output cavity 603, and then the cold air generated by the condensation block 604 in the placement box 602 is discharged downward, and the cold air is discharged into the protective shell 506, so as to cool down the packaging structure 407 after the power-off protection, thereby improving the cooling protection effect and the storage effect of the device.

[0057] Based on the above-mentioned power-off protection integrated circuit packaging structure, an embodiment of the present invention further proposes a packaging method of the power-off protection integrated circuit packaging structure. Exemplarily, the packaging method includes:

[0058] Before the circuit packaging structure works, two groups of chips to be packaged are placed between two groups of clamping blocks respectively;

[0059] Start the third electric push rod to drive the two groups of clamping blocks to clamp and limit the chip, and then start the second electric push rod to push the two groups of chips to move in opposite directions;

[0060] Start the fourth electric push rod to drive the edge grinding plate to move to a position parallel to the edge of the chip, and then start the second electric slide to drive the edge grinding plate to contact the outer wall of the chip;

[0061] During the movement, the connecting rod is driven to slide in the sleeve tube to squeeze the tension spring, and then the first electric slide is started to drive the edge grinding plate to move horizontally to grind the outer wall of the chip;

[0062] The fourth electric push rod is started to adjust the height so that the adsorption mud plate is attached to the outer wall of the polished chip, and then the first electric slide is started to drive the adsorption mud plate to adsorb impurities;

[0063] The fifth electric push rod is started to push the packaging structure down to perform packaging work, and then the third motor is started to perform rotation packaging;

[0064] The second motor is started to drive the transmission plate to rotate, and the transmission plate drives the packaging structure to rotate at the same time;

[0065] Starting the sixth electric push rod to push the first electromagnetic block and the second electromagnetic block to achieve magnetic connection, and then starting the sixth electric push rod to drive the protective shell to move in a direction away from the packaging structure;

[0066] The protective shell drives the sliding rod to slide in the sleeve tube, and then drives the sliding rod to squeeze the compression spring;

[0067] The compression spring applies a rebound force to the pressure sensor;

[0068] When a power failure occurs, the magnetic connection between the first electromagnetic block and the second electromagnetic block disappears, and the compression spring begins to rebound after sensing the loss of pressure;

[0069] The compression spring drives the sliding rod to slide in the sleeve tube, and then drives the two sets of protective shells to wrap and protect the packaging structure;

[0070] The protective shell moves toward the packaging structure and drives the inner wall of the protective shell to collide with the sliding push plate, and the sliding push plate slides in the placement box;

[0071] The second output chamber is located directly above the first output chamber, and the cold air produced by the condensation block is discharged downward into the protective shell.

[0072] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A power-off protection integrated circuit packaging structure, comprising a switch assembly, characterized in that: A rotating assembly is installed on the opening and closing assembly, two sets of power-off protection assemblies are symmetrically installed on the bottom edge of the rotating assembly, and two sets of self-cooling assemblies are symmetrically installed on the bottom; The rotating assembly includes a packaging structure, the power-off protection assembly includes a compression mechanism, and a pressure protection mechanism is installed on the compression mechanism; When a power outage occurs, the compression mechanism senses the disappearance of pressure and starts to rebound, driving the pressure protection mechanism to wrap and protect the packaging structure during the rebound process; The compression mechanism comprises a third mounting plate, a set of sleeve tubes are mounted on one side wall of each set of the third mounting plates, and one end of a set of compression springs are mounted on one side inner wall of each set of the sleeve tubes; the pressure protection mechanism comprises sliding rods, one end of each set of the sliding rods is mounted on the other end of the compression spring, a set of pressure sensors are mounted on the joint of each set of the sliding rods and the compression spring, and a set of protection shells are mounted on one side wall of each set of the sliding rods; The top of each group of the third mounting plates is mounted on the bottom of the second mounting plates, a group of sixth electric push rods is mounted on one side wall of each group of the third mounting plates, a group of first electromagnetic blocks is mounted on the output end of each group of the sixth electric push rods, and a group of second electromagnetic blocks is mounted on the outer wall of each group of the sliding rods, and the first electromagnetic blocks are magnetically connected to the second electromagnetic blocks; The self-cooling assembly includes a fourth mounting plate, the top of each group of the fourth mounting plates is mounted on the bottom of the second mounting plate, a group of placement boxes is mounted on the bottom of each group of the fourth mounting plates, a group of first output cavities are opened on the bottom of each group of the placement boxes, two groups of condensation blocks are symmetrically mounted on the inner wall of each group of the placement boxes, a group of sliding push plates are slidably connected on one side wall of each group of the placement boxes close to the protective shell, and a group of second output cavities are opened on each group of the sliding push plates; When the protective shell moves toward the packaging structure, the inner wall of the protective shell hits the sliding push plate, and the sliding push plate slides in the placement box. As it slides, the second output cavity is located directly above the first output cavity. Then, the cold air generated by the condensation block in the placement box is discharged downward and into the protective shell, so as to cool down the packaging structure after power-off protection.

2. The power-off protection integrated circuit packaging structure according to claim 1, characterized in that: Two groups of clamping assemblies are symmetrically installed on the inner wall of the opening and closing assembly, and a group of auxiliary assemblies is installed on the top of each group of the clamping assemblies; the opening and closing assembly includes a packaging box, a first fixing plate is installed on one side wall of the packaging box, a first electric push rod is installed on the top of the first fixing plate, and a cover plate is installed on the output end of the first electric push rod.

3. The power-off protection integrated circuit packaging structure according to claim 2, characterized in that: The clamping assembly includes a second fixing plate, one end of each group of the second fixing plates is mounted on the inner wall of the packaging box, a group of second electric push rods is mounted on one side wall of each group of the second fixing plates, and a group of third fixing plates is mounted on the output end of each group of the second electric push rods.

4. The power-off protection integrated circuit packaging structure according to claim 3, characterized in that: Two groups of fourth fixing plates are symmetrically installed on one side wall of the third fixing plate, a group of third electric push rods are installed on one side wall of each group of fourth fixing plates, and a group of clamping blocks are installed on the output end of each group of third electric push rods.

5. The power-off protection integrated circuit packaging structure according to claim 3, characterized in that: The auxiliary component includes a first electric slide, the bottom of each group of the first electric slides is installed on the top of one group of third fixed plates, and the output end of each group of the first electric slides is transmission-connected to a group of first motors.

6. The power-off protection integrated circuit packaging structure according to claim 5, characterized in that: A group of first connecting plates are transmission-connected to the output end of each group of the first motors, a group of second electric slides are installed on one side wall of each group of the first connecting plates, and a group of fourth electric push rods are transmission-connected to the output end of each group of the second electric slides.

7. The power-off protection integrated circuit packaging structure according to claim 2, characterized in that: The rotating assembly also includes a transmission plate, a third motor is installed on the bottom of the transmission plate, a second mounting plate is transmission-connected to the output end of the third motor, and the packaging structure is installed on the bottom of the second mounting plate.

8. A packaging method of the power-off protection integrated circuit packaging structure according to any one of claims 1 to 7, characterized in that: The packaging method comprises: Drive the pressure protection mechanism to move in a direction away from the packaging structure; The pressure protection mechanism applies the rebound force to the compression mechanism; When a power outage occurs, the compression mechanism senses the loss of pressure and begins to rebound; During the rebound process, the pressure protection mechanism is driven to wrap and protect the packaging structure.

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