Wafer disc exchange platform

Abstract

The present invention provides a wafer disc interchange platform, which relates to the technical field of semiconductor production equipment. The platform comprises a platform support, a photolithography component and a top plate arranged in the inner cavity of the platform support. A through hole is provided on the top of the platform support, and a clamping assembly is placed at the bottom of the photolithography component. The clamping assembly comprises a mounting seat installed at the bottom of the top plate, a support plate is fixedly connected to the bottom of the mounting seat, a sealing plate is arranged at one end of the support plate, a support column is fixedly connected to the top of the mounting seat, a sliding block is sleeved on the outer surface of the support column close to one end of the mounting seat, and a fixed block is fixedly connected to the outer surface of the support column away from one end of the mounting seat. By arranging the photolithography component, the placed wafer disc can be photolithographically processed, a push rod is arranged on the top of the top plate, and a certain slope is arranged on the bottom of the touch block. When in use, the wafer disc is first placed in the inner cavity of a placement ring through manual and mechanical cooperation, and then the placement ring is placed in the inner cavity of a groove.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production equipment, and in particular to a wafer disk interchange platform. Background Art

[0002] Wafer exchange platforms are commonly used in fields such as semiconductor manufacturing. They can conveniently replace wafers of different sizes to adapt to diverse production needs. Through precise adaptation, they ensure stable transmission and positioning of wafers in processing, testing and other links, effectively improving the versatility and flexibility of production equipment, reducing equipment replacement costs, and improving overall production efficiency and benefits.

[0003] In actual work, the wafer exchange platform of the existing technology can meet the basic needs of wafers through the use of control systems and connection devices, but there are still the following problems:

[0004] In the semiconductor manufacturing process, wafers often have different sizes due to the requirements of the lithography process. Traditional fixed processing platforms are pre-set and have a single size adaptability. When faced with processing tasks for wafers of different sizes, another set of corresponding equipment has to be prepared, which greatly increases manufacturing costs and reduces work efficiency. For this reason, the present application provides a wafer interchange platform to meet the needs. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and provide a wafer disk interchange platform.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a wafer disk interchange platform, comprising a platform support, and a photolithography component and a top plate arranged in the inner cavity of the platform support, wherein a through hole is opened on the top of the platform support;

[0007] A clamping assembly, the clamping assembly is placed at the bottom of the photolithography component, the clamping assembly includes a mounting seat installed at the bottom of the top plate, the bottom of the mounting seat is fixedly connected to a support plate, one end of the support plate is provided with a sealing plate, the top of the mounting seat is fixedly connected to a support column, the outer surface of the support column close to one end of the mounting seat is sleeved with a sliding block, the outer surface of the support column away from one end of the mounting seat is fixedly connected to a fixed block, the top of the fixed block is provided with a tray, the bottom of the tray is fixedly connected to a fixed seat, the inner cavity of the fixed seat is provided with a sliding column, one end of the sliding column is fixedly connected to a touch block, the top of the tray is provided with a groove, and the inner cavity of the groove is provided with a placement ring;

[0008] A positioning assembly, the positioning assembly is placed on the side of the mounting seat, the positioning assembly includes a protective shell installed in the inner cavity of the support plate, a support plate is fixedly connected to the side of the inner wall of the protective shell, a fixing plate is provided at the bottom of the support plate, and both ends of the fixing plate are fixedly connected to support members;

[0009] A connecting component is placed on one side of the inner wall of the support plate, and the connecting component includes a fixed sleeve installed on one end of the sealing plate close to the groove, a sliding sleeve is slidably connected to the side of the fixed sleeve, and a fourth spring sheet is fixedly connected to one end of the sliding sleeve close to the fixed sleeve, and an end of the fourth spring sheet away from the sliding sleeve is connected to one end of the fixed sleeve.

[0010] As a preferred embodiment, a first spring sheet is fixedly connected to the bottom of the fixed block, an end of the first spring sheet away from the fixed block is fixedly connected to the top of the sliding block, an inner cavity of the fixed seat is provided with a placement groove, one end of the sliding column extends to the inner cavity of the placement groove, and one end of the sliding column is slidably connected to the inner cavity of the placement groove.

[0011] The technical effect of adopting the above technical solution is: by providing the first spring sheet, the sliding block can be assisted in resetting, and by providing the sliding column, the sliding block can be engaged with the fixed block.

[0012] As a preferred embodiment, a sliding groove is provided on the top of the fixing seat, a mounting plate is fixedly connected to the side of the support plate, a buffer is fixedly connected to the top of the mounting plate, and a second spring is fixedly connected to the side of the sliding column.

[0013] The technical effect of adopting the above technical solution is: by providing a buffer, the stress generated when the tray is installed can be buffered, and by providing a second spring sheet, the touch block can be prompted to reset.

[0014] As a preferred embodiment, the top of the fixed plate is fixedly connected to a first connecting rod, the top of the support plate is fixedly connected to an elastic member, the top of the elastic member is fixedly connected to a touch plate and a telescopic rod, and the top of the telescopic rod is fixedly connected to the bottom of the support plate.

[0015] The technical effect of adopting the above technical solution is: by providing an elastic member, the touch plate can be assisted in resetting, and by providing a telescopic rod, the movement distance of the fixed plate can be compensated.

[0016] Compared with the prior art, the advantages and positive effects of the present invention are:

[0017] 1. By setting a photolithography component, the placed wafer disc can be photolithographically processed. A push rod is set on the top of the top plate, and a certain slope is set on the bottom of the touch block. When in use, the wafer disc is first placed in the inner cavity of the placement ring through manual and mechanical cooperation, and then the placement ring is placed in the inner cavity of the groove. After the placement is completed, the tray is placed on the top of the support plate. When placing, the bottom of the fixed seat contacts the top of the fixed block, so that the fixed block can be prompted to enter the inner cavity of the sliding groove. At this time, the tray is pressed, so that the sliding column can drive the touch block to move downward. When the touch block moves to a certain position, the bottom of the touch block contacts the top of the fixed block, so that the touch block can be prompted to be collected into the inner cavity of the placement groove. When the pallet is disassembled, the pallet only needs to be pressed downward to make the bottom of the pallet contact with the sliding block. When the pallet moves to a certain position, the pallet is lifted upward to drive the sliding block to move upward through the touch block. When the sliding block moves to a certain position, the first spring sheet stops compressing to make the pallet fall off quickly, thereby achieving the effect of photolithography on wafers of different sizes by directly replacing the pallet without the need for additional equipment, thereby effectively improving work efficiency and reducing processing costs.

[0018] 2. When the tray moves to a certain position, the bottom of the tray contacts the top of the touch panel, so that the fixed plate can be driven downward by the first connecting rod, and then the support can drive one end of the connecting rod to rotate clockwise. When the connecting rod rotates clockwise, the sliding seat can drive the first support rod to move toward the middle of the touch panel, and then the arc-shaped clamping plate can clamp the bottom of the tray, saving proofreading time and avoiding the angle deviation of the tray during placement, which leads to errors in photolithography. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a wafer exchange platform provided by the present invention;

[0020] Figure 2 A schematic diagram of the internal cross-sectional structure of a wafer exchange platform provided by the present invention;

[0021] Figure 3 A schematic diagram of the internal connection structure of a wafer exchange platform provided by the present invention;

[0022] Figure 4 A schematic cross-sectional view of a wafer exchange platform clamping assembly provided by the present invention;

[0023] Figure 5A schematic cross-sectional view of a wafer exchange platform positioning assembly provided by the present invention;

[0024] Figure 6 A schematic cross-sectional structure diagram of a wafer exchange platform connection assembly provided by the present invention.

[0025] Legend:

[0026] 1. platform support; 11. photolithography component; 12. top plate; 13. through hole;

[0027] 2. Snap-on assembly; 21. Mounting seat; 22. Sliding block; 23. Support column; 24. Fixed block; 25. First spring piece; 26. Fixed seat; 27. Placement slot; 28. Sliding column; 29. ​​Second spring piece; 210. Sliding slot; 211. Touch block; 212. Mounting plate; 213. Buffer; 214. Support plate; 215. Tray; 216. Placement ring; 217. Groove; 218. Closing plate;

[0028] 3. Positioning assembly; 31. Protective shell; 32. Fixing plate; 33. Telescopic rod; 34. Support member; 35. Connecting rod; 36. Sliding seat; 37. First supporting rod; 38. Third spring piece; 39. Ball; 310. Support plate; 311. Elastic member; 312. First connecting rod; 313. Touch plate; 314. Arc splint;

[0029] 4. Connecting assembly; 41. Fixed sleeve; 42. Fourth spring piece; 43. Sliding sleeve; 44. Snap-in groove; 45. Slide groove; 46. Snap-in ball; 47. Block; 48. Second support rod; 49. Second connecting rod; 410. Snap joint; 411. Spherical groove; 412. Sliding rod; 413. Limiting groove. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] like Figure 1-Figure 6 As shown, this embodiment provides a technical solution: a wafer exchange platform, a platform support 1, and a photolithography component 11 and a top plate 12 arranged in the inner cavity of the platform support 1, and a through hole 13 is opened on the top of the platform support 1;

[0032] A clamping assembly 2 is placed at the bottom of the photolithography component 11. The clamping assembly 2 includes a mounting seat 21 mounted at the bottom of the top plate 12. A support plate 214 is fixedly connected to the bottom of the mounting seat 21. A sealing plate 218 is provided at one end of the support plate 214. A support column 23 is fixedly connected to the top of the mounting seat 21. A sliding block 22 is sleeved on the outer surface of the support column 23 close to one end of the mounting seat 21. A fixed block 24 is fixedly connected to the outer surface of the support column 23 away from one end of the mounting seat 21. A tray 215 is provided on the top of the fixed block 24. A fixed seat 26 is fixedly connected to the bottom of the tray 215. A sliding column 28 is provided in the inner cavity of the fixed seat 26. A touch block 211 is fixedly connected to one end of the sliding column 28. A groove 217 is provided on the top of the tray 215. A placement ring 216 is provided in the inner cavity of the groove 217.

[0033] The positioning assembly 3 is placed on the side of the mounting seat 21. The positioning assembly 3 includes a protective shell 31 installed in the inner cavity of the support plate 214. A support plate 310 is fixedly connected to the side of the inner wall of the protective shell 31. A fixing plate 32 is provided at the bottom of the support plate 310. Both ends of the fixing plate 32 are fixedly connected to support members 34.

[0034] The connecting component 4 is placed on one side of the inner wall of the support plate 214. The connecting component 4 includes a fixed sleeve 41 installed on the sealing plate 218 at one end near the groove 217. The side of the fixed sleeve 41 is slidably connected with a sliding sleeve 43. The end of the sliding sleeve 43 near the fixed sleeve 41 is fixedly connected with a fourth elastic piece 42. The end of the fourth elastic piece 42 away from the sliding sleeve 43 is connected to one end of the fixed sleeve 41. The bottom of the fixed block 24 is fixedly connected with a first elastic piece 25. The end of the first elastic piece 25 away from the fixed block 24 is fixedly connected to the top of the sliding block 22. The inner cavity of the fixed seat 26 is provided with a placement groove 27. One end of the sliding column 28 extends to the placement The inner cavity of the groove 27, one end of the sliding column 28 is slidably connected with the inner cavity of the placement groove 27, and by setting the photolithography component 11, the placed wafer can be photolithographically processed. The top of the top plate 12 is provided with a push rod, and the bottom of the touch block 211 is provided with a certain slope. When in use, the wafer is first placed in the inner cavity of the placement ring 216 through manual and mechanical cooperation, and then the placement ring 216 is placed in the inner cavity of the groove 217. After the placement is completed, the tray 215 is placed on the top of the support plate 214. When placing, the bottom of the fixing seat 26 contacts the top of the fixing block 24, so that the fixing block 24 can be prompted to enter the inner cavity of the sliding groove 210. The tray 215 is pressed at this time, so that the sliding column 28 can drive the touch block 211 to move downward. When the touch block 211 moves to a certain position, the bottom of the touch block 211 contacts the top of the fixed block 24, so that the touch block 211 can be contracted toward the inner cavity of the placement groove 27, so that the touch block 211 can continue to move downward. When the touch block 211 contracts, the second elastic sheet 29 is compressed, so that the generated stress can be stored. When the touch block 211 moves to a certain position, the second elastic sheet 29 releases the stress, so that the touch block 211 can be reset and engaged with the bottom of the fixed block 24. In this way, the tray 215 and the support plate 214 can be quickly spliced ​​together. When disassembly is required, the tray 215 is pressed downward, so that the touch block 211 can be prompted to move to the bottom of the sliding block 22. When the tray 215 moves to a certain position, the tray 215 is lifted upward, so that the sliding block 22 can be driven to move upward by the touch block 211. When the sliding block 22 moves to a certain position, the first spring piece 25 stops compressing, so that the tray 215 can be quickly removed, so that the effect of photolithography on wafers of different sizes can be achieved by directly replacing the tray 215 without the need for additional equipment, thereby effectively improving work efficiency and reducing processing costs.

[0035] Further, such as Figure 2 , Figure 3 and Figure 5As shown: the top of the support member 34 is rotatably connected to the connecting rod 35, one end of the connecting rod 35 is rotatably connected to the sliding seat 36, the top of the sliding seat 36 is fixedly connected to the first support rod 37, the side of the first support rod 37 is fixedly connected to the third elastic piece 38, the top of the first support rod 37 is provided with a sphere 39, the side of the sphere 39 is fixedly connected to the arc clamping plate 314, the top of the fixed plate 32 is fixedly connected to the first connecting rod 312, the top of the support plate 310 is fixedly connected to the elastic member 311, the top of the elastic member 311 is fixedly connected to the touch plate 313 and the telescopic rod 33, the top of the telescopic rod 33 is fixedly connected to the bottom of the support plate 310, when the tray 215 moves to a certain position, the bottom of the tray 215 contacts the top of the touch plate 313, so that the fixed plate 32 can be driven to move downward through the first connecting rod 312, The effect of driving one end of the connecting rod 35 to rotate clockwise can be achieved through the support member 34. When the connecting rod 35 rotates clockwise, the first supporting rod 37 can be driven to move toward the middle of the touch panel 313 through the sliding seat 36, so that the arc clamping plate 314 can clamp the bottom of the tray 215, saving proofreading time and avoiding the angle deviation of the tray 215 during the placement process, which may cause errors in photolithography. By setting the third spring piece 38, the stress generated when the side of the arc clamping plate 314 contacts the bottom of the tray 215 can be buffered to avoid excessive clamping. By setting the sphere 39, the translation of the tray 215 during the positioning process can be assisted to avoid the tray 215 from continuously rubbing against the top of the first supporting rod 37 during the positioning process, which may cause damage.

[0036] During the wafer processing, debris often falls and accumulates at the connection between the sealing plate 218 and the support plate 214, affecting the processing effect. At the same time, when cleaning is required, the entire wafer needs to be disassembled, which reduces work efficiency. Figure 6As shown: In this solution, a clamping groove 44 is provided on the side of the inner wall of the fixed sleeve 41, a sliding groove 45 is provided on the outer surface of the fixed sleeve 41, a clamping ball 46 is provided on the outer surface of the sliding sleeve 43, a blocking block 47 is fixedly connected to the side of the inner wall of the sliding sleeve 43, a second support rod 48 is provided at one end of the sliding sleeve 43 away from the fixed sleeve 41, a second connecting rod 49 is fixedly connected to the end of the second support rod 48 close to the blocking block 47, a clamping joint 410 is fixedly connected to the side of the second connecting rod 49, and a clamping joint 410 is provided on the side of the second support rod 48 The spherical groove 411, the side of the inner wall of the second support rod 48 is provided with a limiting groove 413, the inner cavity of the limiting groove 413 is slidably connected with a sliding rod 412, and the side of the fixed sleeve 41 is fixedly connected to the side of the inner wall of the support plate 214. During installation, the sliding rod 412 is first pushed into the inner cavity of the second support rod 48 along the inner cavity of the limiting groove 413, and then the second support rod 48 is pushed into the inner cavity of the fixed sleeve 41. By setting the sliding groove 45 and the second connecting rod 49, the movement trajectory of the second support rod 48 can be limited. When the second support rod 48 moves to a certain position, one end of the second connecting rod 49 contacts the side of the blocking block 47. At this time, the second support rod 48 is continuously pushed, so that the sliding sleeve 43 can be driven to move toward one end close to the fixed sleeve 41 through the second connecting rod 49. When the second connecting rod 49 moves to a certain position, the clamping joint 410 arranged on the side of the second connecting rod 49 enters the inner cavity of the clamping groove 44, so that the second support rod 48 and the fixed sleeve 41 can be clamped. The locking ball 46 and the spherical groove 411 cooperate to further improve the stability of the connection. When cleaning is needed, the sliding rod 412 is pushed to cause the side of the sliding rod 412 to contact one end of the locking joint 410, thereby causing the locking joint 410 to be separated from the inner cavity of the locking groove 44. By setting the fourth spring piece 42, the sliding sleeve 43 can be assisted in resetting, thereby causing the second connecting rod 49 to quickly separate from the inner cavity of the fixed sleeve 41, thereby effectively improving work efficiency and facilitating cleaning.

[0037] When the tray 215 is pressed, due to the different stress points applied, one end of the tray 215 will inevitably be slightly tilted, such as Figure 2As shown: In the present embodiment, a sliding groove 210 is provided on the top of the fixing seat 26, a mounting plate 212 is fixedly connected to the side of the support plate 214, a buffer 213 is fixedly connected to the top of the mounting plate 212, a second elastic piece 29 is fixedly connected to the side of the sliding column 28, and a flexible gasket is provided on the top of the buffer 213. By providing the buffer 213, the stress applied to the tray 215 can be buffered when the tray 215 is pressed and spliced. When one end of the tray 215 close to the buffer 213 is lifted up due to being pressed and then falls down, the flexible gasket and the buffer 213 cooperate with each other, so as to effectively absorb the stress of the tray 215 falling down, thereby preventing the wafer arranged in the inner cavity of the placement ring 216 from being displaced in position during the lifting and falling process of the tray 215.

[0038] Working principle:

[0039] like Figure 1-Figure 6 As shown:

[0040] During use: through manual and mechanical cooperation, the wafer is first placed in the inner cavity of the placement ring 216, and then the placement ring 216 is placed in the inner cavity of the groove 217. After the placement is completed, the tray 215 is placed on the top of the support plate 214. During the placement, the bottom of the fixing seat 26 contacts the top of the fixing block 24, thereby prompting the fixing block 24 to enter the inner cavity of the sliding groove 210. At this time, the tray 215 is pressed, so that the sliding column 28 can drive the touch block 211 to move downward. When the touch block 211 moves to a certain position, the bottom of the touch block 211 contacts the top of the fixing block 24, thereby prompting the touch block 211 to shrink toward the inner cavity of the placement groove 27, thereby achieving the effect of the touch block 211 continuing to move downward. As a result, when the touch block 211 contracts, the second spring piece 29 is compressed, so that the generated stress can be stored. When the touch block 211 moves to a certain position, the second spring piece 29 releases the stress, so that the touch block 211 can be reset and engaged with the bottom of the fixed block 24, thereby achieving the effect of rapid splicing of the tray 215 and the support plate 214. Similarly, when disassembly is required, the tray 215 is pressed downward, so that the touch block 211 can be moved to the bottom of the sliding block 22. When the tray 215 moves to a certain position, the tray 215 is lifted upward, so that the sliding block 22 can be driven to move upward through the touch block 211. When the sliding block 22 moves to a certain position, the first spring piece 25 stops compressing, so as to promote The tray 215 falls off quickly. At the same time, when the tray 215 moves to a certain position, the bottom of the tray 215 contacts the top of the touch plate 313, so that the fixing plate 32 can be driven downward by the first connecting rod 312, and then the effect of driving one end of the connecting rod 35 to rotate clockwise can be achieved through the support member 34. When the connecting rod 35 rotates clockwise, the first support rod 37 can be driven to move toward the middle of the touch plate 313 through the sliding seat 36, so that the arc-shaped clamping plate 314 can achieve the effect of positioning and clamping the bottom of the tray 215, further improving the stability. After the positioning is completed, when installing 218, first push the sliding rod 412 into the inner cavity of the second support rod 48 along the inner cavity of the limiting groove 413, and then The second support rod 48 is then pushed toward the inner cavity of the fixed sleeve 41, and the sliding groove 45 and the second connecting rod 49 are provided to cooperate, so that the movement trajectory of the second support rod 48 can be limited. When the second support rod 48 moves to a certain position, one end of the second connecting rod 49 contacts the side of the blocking block 47. At this time, the second support rod 48 is continued to be pushed, so that the sliding sleeve 43 can be driven by the second connecting rod 49 to move toward one end close to the fixed sleeve 41. When the second connecting rod 49 moves to a certain position, the clamping joint 410 provided on the side of the second connecting rod 49 enters the inner cavity of the clamping groove 44, so that the second support rod 48 and the fixed sleeve 41 can be clamped. When cleaning is needed, by pushing the sliding rod 412,Thus, the side of the sliding rod 412 can be brought into contact with one end of the clamping joint 410, thereby causing the clamping joint 410 to be separated from the inner cavity of the clamping groove 44. By providing the fourth elastic piece 42, the sliding sleeve 43 can be assisted to reset, thereby causing the second connecting rod 49 to quickly separate from the inner cavity of the fixed sleeve 41, effectively improving work efficiency and facilitating cleaning.

[0041] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A wafer exchange platform, characterized in that: include: A platform support (1), and a photolithography component (11) and a top plate (12) arranged in an inner cavity of the platform support (1), wherein a through hole (13) is provided on the top of the platform support (1); A clamping assembly (2), the clamping assembly (2) being placed at the bottom of the photolithography component (11), the clamping assembly (2) comprising a mounting seat (21) mounted at the bottom of the top plate (12), the bottom of the mounting seat (21) being fixedly connected to a support plate (214), one end of the support plate (214) being provided with a sealing plate (218), the top of the mounting seat (21) being fixedly connected to a support column (23), the outer surface of the support column (23) close to one end of the mounting seat (21) being provided with a sliding block (22), the support column (2 3) A fixed block (24) is fixedly connected to the outer surface of one end away from the mounting seat (21), a tray (215) is arranged on the top of the fixed block (24), a fixed seat (26) is fixedly connected to the bottom of the tray (215), a sliding column (28) is arranged in the inner cavity of the fixed seat (26), one end of the sliding column (28) is fixedly connected to the touch block (211), a groove (217) is arranged on the top of the tray (215), and a placement ring (216) is arranged in the inner cavity of the groove (217); A positioning assembly (3), the positioning assembly (3) being disposed on a side of the mounting seat (21), the positioning assembly (3) comprising a protective shell (31) mounted in an inner cavity of the support plate (214), a support plate (310) being fixedly connected to a side of an inner wall of the protective shell (31), a fixing plate (32) being disposed at the bottom of the support plate (310), and support members (34) being fixedly connected to both ends of the fixing plate (32); A connecting assembly (4), the connecting assembly (4) being disposed on one side of the inner wall of the support plate (214), the connecting assembly (4) comprising a fixed sleeve (41) mounted on one end of the sealing plate (218) close to the groove (217), a sliding sleeve (43) being slidably connected to a side surface of the fixed sleeve (41), an end of the sliding sleeve (43) close to the fixed sleeve (41) being fixedly connected to a fourth elastic sheet (42), an end of the fourth elastic sheet (42) away from the sliding sleeve (43) being connected to one end of the fixed sleeve (41); The bottom of the fixed block (24) is fixedly connected with a first spring sheet (25), one end of the first spring sheet (25) away from the fixed block (24) is fixedly connected with the top of the sliding block (22), the inner cavity of the fixed seat (26) is provided with a placement groove (27), one end of the sliding column (28) extends to the inner cavity of the placement groove (27), and one end of the sliding column (28) is slidably connected with the inner cavity of the placement groove (27); A sliding groove (210) is provided on the top of the fixing seat (26), a mounting plate (212) is fixedly connected to the side of the supporting plate (214), a buffer member (213) is fixedly connected to the top of the mounting plate (212), and a second spring piece (29) is fixedly connected to the side of the sliding column (28).

2. The wafer exchange platform according to claim 1, characterized in that: The top of the support member (34) is rotatably connected to a connecting rod (35), one end of the connecting rod (35) is rotatably connected to a sliding seat (36), the top of the sliding seat (36) is fixedly connected to a first supporting rod (37), the side of the first supporting rod (37) is fixedly connected to a third elastic sheet (38), the top of the first supporting rod (37) is provided with a sphere (39), and the side of the sphere (39) is fixedly connected to an arc-shaped clamping plate (314).

3. The wafer exchange platform according to claim 1, characterized in that: The top of the fixed plate (32) is fixedly connected to a first connecting rod (312), the top of the support plate (310) is fixedly connected to an elastic member (311), the top of the elastic member (311) is fixedly connected to a touch plate (313) and a telescopic rod (33), and the top of the telescopic rod (33) is fixedly connected to the bottom of the support plate (310).

4. The wafer exchange platform according to claim 1, characterized in that: A clamping groove (44) is provided on the side of the inner wall of the fixed sleeve (41), a sliding groove (45) is provided on the outer surface of the fixed sleeve (41), a clamping ball (46) is provided on the outer surface of the sliding sleeve (43), and a blocking block (47) is fixedly connected to the side of the inner wall of the sliding sleeve (43).

5. The wafer exchange platform according to claim 1, characterized in that: A second support rod (48) is provided at one end of the sliding sleeve (43) away from the fixed sleeve (41); an end of the second support rod (48) close to the blocking block (47) is fixedly connected to a second connecting rod (49); and a clamping joint (410) is fixedly connected to the side of the second connecting rod (49).

6. The wafer exchange platform according to claim 5, characterized in that: A spherical groove (411) is provided on the side of the second support rod (48), a limiting groove (413) is provided on the side of the inner wall of the second support rod (48), and a sliding rod (412) is slidably connected to the inner cavity of the limiting groove (413).

Images