Wafer rotating device

Abstract

The invention provides a wafer rotating device. The wafer rotating device comprises a rotating shaft tube, a rotating disc, a driving mechanism, a central sucking disc, a plurality of outer ring sucking discs and a lifting mechanism, the rotating shaft pipe is vertically arranged and can rotate, and a pressure cavity is formed in the rotating shaft pipe. The rotating disc is arranged at the top of the rotating shaft tube. And the driving mechanism is linked with the rotating shaft tube to drive the rotating shaft tube to rotate. The center sucker is arranged on the rotating disc and communicates with the pressure cavity. The outer ring suction cups are arranged on the rotating disc around the center suction cup, and all the outer ring suction cups communicate with the pressure cavity. The lifting mechanism is arranged on the rotating disc and linked with the outer ring suction cups so as to drive at least one part of the outer ring suction cups to ascend and descend relative to the center suction cup. The center sucker and the outer ring sucker are configured corresponding to wafers of different sizes, and the outer ring sucker can ascend and descend to cooperate with the mechanical arm to work to take and place the wafers.

Description

Technical Field

[0001] The invention relates to a wafer rotating device, in particular to a wafer rotating device which cooperates with a mechanical arm and is applicable to wafers of various sizes. Background Art

[0002] In today's wafer processing technology, a rotating disk is often required to rotate the wafer. Generally speaking, the rotating disk is provided with a clamping claw to clamp the outer edge of the wafer. However, the existing rotating disk is only suitable for wafers of a single size, but the wafers to be processed are generally not of uniform size, so corresponding rotating disks need to be set up respectively, which makes the equipment setting cost higher and also causes a higher equipment idle rate.

[0003] In view of this, the inventor has devoted himself to studying the above-mentioned prior art and has applied theoretical knowledge to try his best to solve the above-mentioned problems, which has become the goal of the inventor's improvement. Summary of the invention

[0004] The invention provides a wafer rotating device which cooperates with a mechanical arm and is applicable to wafers of various sizes.

[0005] The present invention provides a wafer rotating device, which comprises a rotating shaft tube, a rotating disk, a driving mechanism, a central suction cup and a plurality of outer ring suction cups. The rotating shaft tube is arranged upright and can rotate, and a pressure chamber is formed in the rotating shaft tube. The rotating disk is arranged at the top of the rotating shaft tube. The driving mechanism links the rotating shaft tube to drive the rotating shaft tube to rotate. The central suction cup is arranged on the rotating disk and connected to the pressure chamber. The outer ring suction cups are arranged on the rotating disk around the central suction cup, and each outer ring suction cup is connected to the pressure chamber respectively.

[0006] In one embodiment of the present invention, the central suction cup is provided with a through hole and the pressure chamber is connected to the through hole to communicate with the central suction cup, and each outer ring suction cup is provided with a connecting pipe connected to the rotating shaft tube to communicate with the pressure chamber.

[0007] In one embodiment of the present invention, the wafer rotating device includes a valve stem inserted into a rotating shaft tube and a first actuator for linking the valve stem to axially translate. The valve stem is configured corresponding to the through hole, and the first actuator can move the valve stem to close the through hole.

[0008] In one embodiment of the present invention, the bottom end of the rotating shaft tube is pivotally connected to a connecting cavity, and the connecting cavity is located between the rotating shaft tube and the negative pressure source, the rotating shaft tube is connected to the connecting cavity, the connecting cavity is fixedly configured and connected to a negative pressure source. The connecting cavity is formed in the body.

[0009] In one embodiment of the present invention, the wafer rotating device further includes a ring frame supported on the outer ring suction cups.

[0010] In one embodiment of the present invention, the wafer rotating device further comprises a lifting mechanism, which is disposed on the rotating disk and links the outer ring suction cups to drive at least a portion of the outer ring suction cups to rise and fall relative to the central suction cup.

[0011] In one embodiment of the present invention, the lifting mechanism includes a linkage and a second actuator, the second actuator is disposed on the main body, the outer ring suction cup is disposed on the linkage, and the lifting mechanism links the linkage to drive the linkage to rise and fall.

[0012] In one embodiment of the present invention, the center of the central suction cup is aligned with the central axis of the rotating shaft tube.

[0013] In one embodiment of the present invention, the outer ring suction cups are arranged equidistantly relative to the central axis of the rotating shaft tube.

[0014] The wafer rotating device of the present invention has a central suction cup and at least one group of outer ring suction cups respectively corresponding to wafers of different sizes. The outer ring suction cups can be raised and lowered to cooperate with a robot arm to take and place the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A top view of a wafer rotating device according to an embodiment of the present invention;

[0016] Figure 2 A cross-sectional view of a wafer rotating device according to an embodiment of the present invention;

[0017] Figures 3 to 6 A schematic diagram of a wafer rotating device according to an embodiment of the present invention being applied to a small-sized wafer;

[0018] Figures 7 to 9 A schematic diagram of a wafer rotating device according to an embodiment of the present invention being applied to a large-size wafer;

[0019] Fig.10 A schematic diagram of a wafer rotating device according to another embodiment of the present invention being applied to a large-size wafer;

[0020] Fig.11 This is a schematic diagram of a wafer rotating device according to another embodiment of the present invention being applied to a large-size wafer;

[0021] Wherein, the reference numerals are:

[0022] 10: first wafer;

[0023] 20: second wafer;

[0024] 21: ring frame;

[0025] 100: Ontology;

[0026] 101: bearing;

[0027] 102: communicating cavity;

[0028] 110: negative pressure source;

[0029] 200: rotating shaft tube;

[0030] 201: pressure chamber;

[0031] 210: rotating disk;

[0032] 300: driving mechanism;

[0033] 310: stator;

[0034] 320: rotor;

[0035] 400: switching valve;

[0036] 410: valve stem;

[0037] 411: bearing;

[0038] 420: first actuator;

[0039] 510: center suction cup;

[0040] 511: through hole;

[0041] 512: Porous membrane;

[0042] 520: outer ring suction cup;

[0043] 521: connecting pipe;

[0044] 530: lifting mechanism;

[0045] 531: Linking member;

[0046] 532: second actuator;

[0047] 533:Bearing. DETAILED DESCRIPTION

[0048] In the description of the present invention, it should be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0049] As used herein and not otherwise defined, the terms "substantially" and "approximately" are used to describe and describe small variations. When applied to an event or circumstance, the term may include the exact moment the event or circumstance occurred, as well as the event or circumstance occurring to a close approximation. For example, when applied to a numerical value, the term may include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0050] The detailed description and technical contents of the present invention will be described as follows with reference to the accompanying drawings, however, the drawings are only for illustrative purposes and are not intended to limit the present invention.

[0051] See also Figure 1 to Figure 2 An embodiment of the present invention provides a wafer rotating device, which is applicable to processing and drying of wafers of various sizes. In this embodiment, the wafer rotating device of the present invention at least comprises a body 100, a rotating shaft tube 200, a rotating disk 210, a driving mechanism 300, a central suction cup 510, a plurality of outer ring suction cups 520 and a lifting mechanism 530.

[0052] In this embodiment, the main body 100 is a hollow cylinder, but the invention is not limited thereto.

[0053] The rotating shaft tube 200 is vertically pivoted on the body 100. In this embodiment, the rotating shaft tube 200 is inserted into the body 100, and a bearing 101 is sandwiched between the rotating shaft tube 200 and the body 100 so that the rotating shaft tube 200 can rotate relative to the body 100. In addition, a pressure chamber 201 is formed in the rotating shaft tube 200, and the pressure chamber 201 is connected to a negative pressure source 110. The rotating disk 210 is arranged at the top of the rotating shaft tube 200.

[0054] The driving mechanism 300 is accommodated in the body 100 , and the driving mechanism 300 links the rotating shaft tube 200 to drive the rotating shaft tube 200 to rotate. In this embodiment, the driving mechanism 300 may include a stator 310 fixed to the body 100 and a rotor 320 attached to the rotating shaft tube 200 .

[0055] The central suction cup 510 is disposed on the top surface of the rotating disk 210, and the center of the central suction cup 510 is aligned with the central axis of the rotating shaft tube 200. The central suction cup 510 is provided with a through hole 511, which is arranged at the center of the central suction cup 510, and the through hole 511 is connected to the pressure chamber 201 at the bottom surface of the central suction cup 510 so that the central suction cup 510 is connected to the pressure chamber 201 through the through hole 511. Specifically, a porous membrane 512 is disposed on the top surface of the central suction cup 510, and the porous membrane 512 is connected to the pressure chamber 201 through the through hole 511 and can be used for adsorption.

[0056] The outer ring suction cups 520 are arranged around the central suction cup 510 on the rotating disk 210 and are equidistantly arranged relative to the central axis of the rotating shaft tube 200. The outer ring suction cups 520 can be selectively fixed on the rotating disk 210 according to process requirements. Each outer ring suction cup 520 is connected to the pressure chamber 201, and specifically, each outer ring suction cup 520 is provided with a connecting pipe 521 connected to the rotating shaft tube 200 to connect to the pressure chamber 201.

[0057] In addition, all or part of the outer ring suction cups 520 can also be selectively movably arranged on the rotating disk 210 according to process requirements. Moreover, the wafer rotating device of the present invention can further include a lifting mechanism 530 to link the outer ring suction cups 520 to drive at least part of the outer ring suction cups 520 to rise and fall relative to the central suction cup 510. In other words, the outer ring suction cups 520 can be as follows: Fig. 9 As shown in FIG. 5 , all the lifting mechanisms 530 are linked. Alternatively, as Fig.10 As shown, the outer ring suction cups 520 may include a portion (ie, at least one) of the linkage lifting mechanism 530 (see Fig.10 The outer ring suction cup 520 on the right side as shown in the figure) and another part (such as one or more) are fixed to the rotating disk 210 without linking the lifting mechanism 530 (see Fig.10 The outer ring suction cup 520 on the left side is shown). In this embodiment, the lifting mechanism 530 includes a linkage 531 and a second actuator 532. The second actuator 532 is disposed on the body 100. The outer ring suction cups 520 are disposed together on the linkage 531, and the lifting mechanism 530 links the linkage 531 to drive the linkage 531 to rise and fall. The linkage 531 may be disposed on the rotating disk 210 or on the second actuator 532. Specifically, a bearing 533 is disposed between the linkage 531 and the second actuator 532 so that the linkage 531 can rotate with the rotating disk 210 and can be driven by the second actuator 532 to rise and fall. Alternatively, the second actuator 532 and the linkage 531 may also be disposed together on the rotating disk 210 and rotate with the rotating disk 210.

[0058] In this embodiment, the wafer rotating device of the present invention further includes a switching valve 400, which is used to switch the connection between the central suction cup 510 and the negative pressure source 110. Specifically, the switching valve 400 includes a valve stem 410 and a first actuator 420. The valve stem 410 is inserted into the rotating shaft tube 200 and the valve stem 410 is configured corresponding to the through hole 511. The first actuator 420 links the valve stem 410 to axially translate. Therefore, the first actuator 420 can move the valve stem 410 to close the through hole 511 or open the through hole 511. When the valve stem 410 closes the through hole 511, the central suction cup 510 is not connected to the negative pressure source 110; when the valve stem 410 leaves the through hole 511 and opens the through hole 511, the central suction cup 510 is connected to the negative pressure source 110. In this embodiment, the first actuator 420 is arranged outside the pressure chamber 201, and the valve stem 410 penetrates into the pressure chamber 201. Specifically, the first actuator 420 is attached to the outside of the body 100, and the valve stem 410 passes through the body 100 and enters the pressure chamber 201. A bearing 411 can be provided between the valve stem 410 and the body 100 so that the valve stem 410 can still rotate with the rotating disk 210 when closing the through hole 511.

[0059] The bottom end of the rotating shaft tube 200 is pivotally connected to a connecting cavity 102 and is located between the rotating shaft tube 200 and the negative pressure source 110. Specifically, the connecting cavity 102 is formed in the body 100. The valve stem 410 penetrates the body 100 and enters the pressure cavity 201 through the connecting cavity 102.

[0060] See also Figure 3 and Figure 4 The wafer rotating device of the present invention further includes a ring frame 21 , and the ring frame 21 can be carried on the outer ring suction cups 520 .

[0061] The wafer rotating device of the present invention cooperates with the robot arm to operate and is applicable to at least two first wafers 10 of different sizes (see Figures 3 to 6 ) and the second wafer 20 (see Figures 7 to 9 ), the second wafer 20 is larger than the first wafer 10. Moreover, by providing a multi-layer outer ring suction cup 520 arranged at different distances relative to the rotating shaft tube 200, more second wafers 20 of different sizes can be used. Figures 7 to 9 When the second wafer 20 is set in the wafer rotating device, it needs to be fixed in the ring frame 21 of the corresponding diameter.

[0062] See Figure 3 to Figure 4 When processing the first wafer 10 , the negative pressure source 110 is first turned off to depressurize the central suction cup 510 and the outer ring suction cup 520 . Figures 5 and 6, and then the ring frame 21 is placed on the outer ring suction cup 520 by the robot arm. If both movable and fixed outer ring suction cups 520 are provided, the fixed outer ring suction cup 520 can be used to position the ring frame 21. The through hole 511 of the center suction cup 510 is closed by the valve stem 410 and the negative pressure source 110 is opened so that the ring frame 21 is adsorbed on the outer ring suction cup 520 and the center suction cup 510 loses pressure. The ring frame 21 is lowered by the lifting mechanism 530 so that the robot arm can place the first wafer 10 on the center suction cup 510 (to prevent the ring frame 21 from interfering with the movement of the robot arm). The valve stem 410 is lowered to open the through hole 511 of the center suction cup 510 so that the center suction cup 510 is connected to the negative pressure source 110 and the first wafer 10 is adsorbed on the center suction cup 510 for processing. The ring frame 21 can shield the outer ring suction cup 520 to reduce the process liquid from contacting the outer ring suction cup 520 , thereby reducing the process liquid from damaging the outer ring suction cup 520 .

[0063] Figures 7 to 9 When processing the second wafer 20, first place the second wafer 20 in the ring frame 21 of the corresponding diameter. Turn off the negative pressure source 110 to depressurize the center suction cup 510 and the outer ring suction cup 520, maintain the center disk and the outer ring suction cup 520 at the same height, and the valve stem 410 leaves the through hole 511 of the center suction cup 510. Then, the ring frame 21 and the second wafer 20 are placed on the outer ring suction cup 520 and the center suction cup 510 by a robotic arm. Specifically, the second wafer 20 is placed on the center suction cup 510 and the ring frame 21 is placed on the outer ring suction cup 520. Turn on the negative pressure source 110 so that the second wafer 20 is adsorbed on the center suction cup 510 and the ring frame 21 is adsorbed on the outer ring suction cup 520 to perform the process.

[0064] The wafer rotating device of the present invention has a central suction cup 510 and at least one set of outer ring suction cups 520 corresponding to wafers of different sizes. The outer ring suction cups 520 can be raised and lowered to cooperate with the robot arm to pick up and place the wafer. However, in accordance with different process requirements (for example, another form of robot arm whose movement path may not interfere with the outer ring suction cup 520), the outer ring suction cup 520 can also be as follows Fig.11 Fixed settings shown.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the patent scope of the present invention. Other equivalent changes that apply the patent spirit of the present invention should all fall within the patent scope of the present invention.

Claims

1. A wafer rotating device, characterized in that: Include: one body; A rotating shaft tube, which is vertically pivoted on the body and has a pressure chamber formed inside the rotating shaft tube, the pressure chamber being connected to a negative pressure source; A rotating disk is arranged at the top end of the rotating shaft tube; A driving mechanism, linked to the rotating shaft tube to drive the rotating shaft tube to rotate; A central suction cup, disposed on the rotating disk and connected to the pressure chamber; and A plurality of outer ring suction cups are arranged on the rotating disk around the central suction cup, and each of the outer ring suction cups is connected to the pressure chamber respectively.

2. The wafer rotating device according to claim 1, characterized in that: The central suction cup is provided with a through hole and the pressure chamber is connected to the through hole to communicate with the central suction cup, and each of the outer ring suction cups is provided with a connecting pipe connected to the rotating shaft tube to communicate with the pressure chamber.

3. The wafer rotating device according to claim 2, characterized in that: It further comprises a switching valve, which comprises a valve stem penetrating the rotating shaft tube and a first actuator for linking the valve stem to axially translate. The valve stem is arranged corresponding to the through hole, and the first actuator can move the valve stem to close the through hole.

4. The wafer rotating device according to claim 1, characterized in that: The bottom end of the rotating shaft tube is pivotally connected to a communication cavity, and the communication cavity is located between the rotating shaft tube and the negative pressure source.

5. The wafer rotating device according to claim 4, characterized in that: The communication cavity is formed in the body.

6. The wafer rotating device according to claim 1, wherein: It further comprises a ring frame supported on the outer ring suction cups.

7. The wafer rotating device according to claim 1, characterized in that: The invention further comprises a lifting mechanism, which links the outer ring suction cups to drive at least a part of the outer ring suction cups to rise and fall relative to the central suction cup.

8. The wafer rotating device according to claim 7, characterized in that: The lifting mechanism comprises a linkage and a second actuator, wherein the second actuator is arranged on the main body, the outer ring suction cups are arranged on the linkage together, and the lifting mechanism links the linkage to drive the linkage to rise and fall.

9. The wafer rotating device according to claim 7, characterized in that: The center of the central suction cup is aligned with the central axis of the rotating shaft tube.

10. The wafer rotating device according to claim 7, wherein: The outer ring suction cups are arranged equidistantly relative to the central axis of the rotating shaft tube.

Images