Optical module packaging structure and manufacturing method thereof

Abstract

The invention provides an optical module packaging structure and a manufacturing method thereof. The optical module packaging structure comprises a circuit board, an electronic element, a lead frame and a light emitting module. The electronic component is arranged on the circuit board. The lead frame is arranged on the electronic element, wherein the lead frame is provided with a first connecting part electrically connected with the circuit board. The light emitting module is arranged on the lead frame and comprises a first connecting pad located at the bottom of the light emitting module, and the first connecting pad is electrically connected with the circuit board through a first connecting part of the lead frame.

Description

Technical Field

[0001] The invention relates to an optical module packaging structure and a manufacturing method thereof. Background Art

[0002] As electronic products become thinner and smaller, the packaging structures inside electronic products continue to develop towards miniaturization. Therefore, how to further reduce the volume of the packaging structure has become a technical issue in the field. Summary of the invention

[0003] The object of the present invention is to provide an optical module packaging structure and a manufacturing method thereof to solve at least one of the above problems.

[0004] The present invention provides an optical module packaging structure, which includes a circuit board, an electronic component, a lead frame and a light emitting module. The electronic component is arranged on the circuit board. The lead frame is arranged on the electronic component, wherein the lead frame has a first connecting portion electrically connected to the circuit board. The light emitting module is arranged on the lead frame, wherein the light emitting module includes a first connecting pad located at the bottom of the light emitting module, and the first connecting pad is electrically connected to the circuit board through the first connecting portion of the lead frame.

[0005] In some embodiments of the present invention, the optical emission module further includes a vertical-cavity surface-emitting laser (VCSEL).

[0006] In some embodiments of the present invention, the electronic component is a driver electrically connected to the circuit board, and the driver is electrically connected to the first connection pad through the circuit board and the first connection portion.

[0007] In some embodiments of the present invention, one end of the first connection portion is electrically connected to the circuit board via solder, and the driver is electrically connected to the first connection pad via the circuit board, the solder, and the first connection portion.

[0008] In some embodiments of the present invention, the optical module packaging structure further includes: a conductive adhesive layer disposed between the first connection pad and the first connection portion of the lead frame.

[0009] In some embodiments of the present invention, the optical module packaging structure further includes: a thermal conductive adhesive layer disposed between the lead frame and the top of the electronic component.

[0010] In some embodiments of the present invention, the optical module packaging structure further includes: a heat sink disposed between the thermal conductive adhesive layer and the top of the electronic component; and a bonding layer disposed between the heat sink and the top of the electronic component.

[0011] In some embodiments of the present invention, the lead frame also has a second connecting portion, which is separated from the first connecting portion and electrically connected to the circuit board. The optical transmission module also includes a second connecting pad located at the bottom of the optical transmission module and separated from the first connecting pad. The second connecting pad is electrically connected to the circuit board through the second connecting portion of the lead frame.

[0012] In some embodiments of the present invention, the first connecting portion has a first convex portion, the second connecting portion has a second convex portion, and the first convex portion and the second convex portion are opposite to each other.

[0013] In some embodiments of the present invention, the width of the first protrusion is the same as or substantially the same as the width of the second protrusion.

[0014] The present invention also provides a method for manufacturing an optical module packaging structure, which includes: receiving a circuit board and an electronic component, the electronic component being located on the circuit board; fixing a lead frame on the bottom of the optical transmitter module to form a stacked structure; fixing the lead frame of the stacked structure on the electronic component; and electrically connecting the lead frame to the circuit board.

[0015] In some embodiments of the present invention, fixing the lead frame on the bottom of the light emitting module includes: forming a conductive adhesive layer on the bottom of the light emitting module; bonding the lead frame to the conductive adhesive layer; and performing a curing process to fix the lead frame on the bottom of the light emitting module through the conductive adhesive layer.

[0016] In some embodiments of the present invention, the lead frame has a first connecting portion, the optical transmission module includes a first connecting pad located at the bottom of the optical transmission module, and a curing process is performed to fix the lead frame to the bottom of the optical transmission module through a conductive adhesive layer, including: fixing a portion of the first connecting portion to the first connecting pad through the conductive adhesive layer.

[0017] In some embodiments of the present invention, the lead frame further has a second connection portion and an interconnection portion, the interconnection portion is connected between the first connection portion and the second connection portion, the optical transmission module also includes a second connection pad located at the bottom of the optical transmission module and separated from the first connection pad, and a curing process is performed to fix the lead frame to the bottom of the optical transmission module through a conductive adhesive layer, and further includes: fixing a portion of the second connection portion to the second connection pad through the conductive adhesive layer.

[0018] In some embodiments of the present invention, the method further includes: after performing the curing process and before fixing the lead frame of the stacked structure on the electronic component, disconnecting the interconnection portion to electrically isolate the first connection portion from the second connection portion.

[0019] In some embodiments of the invention, disconnecting the interconnect uses a laser having a wavelength between 960 nanometers and 1070 nanometers.

[0020] In some embodiments of the present invention, the lead frame of the stacked structure is fixed on the electronic component. The lead frame of the stacked structure is fixed on the electronic component through a thermal conductive adhesive layer.

[0021] In some embodiments of the present invention, a solder jet process is used to electrically connect the lead frame to the circuit board.

[0022] In some embodiments of the present invention, the optical transmission module includes a vertical cavity surface laser, and the electronic component is a driver electrically connected to the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The following will be read in conjunction with the accompanying drawings, and various aspects of the present invention may be best understood based on the following embodiments. However, it should be understood that, in accordance with industry practice, the various features are not necessarily drawn to scale. In fact, for the sake of clarity, the shapes of the various features may be appropriately adjusted, and the sizes of the various features may be increased or decreased at will.

[0024] Figure 1 FIG. 4 is a three-dimensional schematic diagram of an optical module packaging structure according to an embodiment of the present invention.

[0025] Figure 2 FIG. 4 is a schematic cross-sectional view of an optical module packaging structure according to an embodiment of the present invention.

[0026] Figure 3 FIG. 4 is a schematic three-dimensional diagram of a lead frame according to an embodiment of the present invention.

[0027] Figure 4 FIG. 4 is a perspective schematic diagram of a light emitting module according to an embodiment of the present invention.

[0028] Figure 5 FIG. 4 is a schematic cross-sectional view of an optical module packaging structure according to another embodiment of the present invention.

[0029] Figures 6 to 11 Schematic diagram of a three-dimensional structure of an optical module packaging structure in various process stages according to an embodiment of the present invention.

[0030] The reference numerals are as follows:

[0031] 110: Circuit board

[0032] 120: Electronic components

[0033] 130: Lead frame

[0034] 130i: Interconnection

[0035] 131: First connection part

[0036] 132: Second connection part

[0037] 133: Third connection

[0038] 134: Fourth connection

[0039] 140: Optical transmitter module

[0040] 140b: Bottom

[0041] 141: First connection pad

[0042] 142: Second connection pad

[0043] 143: Third connection pad

[0044] 144: Fourth connection pad

[0045] 150: Conductive adhesive layer

[0046] 160: Thermal conductive adhesive layer

[0047] 170: Solder

[0048] 180: Optical receiving module DETAILED DESCRIPTION

[0049] The advantages and features of the present invention and the optical module packaging structure thereof will be described in more detail with reference to the exemplary embodiments and drawings so as to be more easily understood. However, the present invention can be implemented in different forms and should not be understood to be limited to the embodiments described herein. On the contrary, for those skilled in the art, the embodiments provided will make the present invention more thorough and comprehensive and fully convey the scope of the present invention.

[0050] The spatially relative terms used in this document, such as "lower" and "upper", are used to facilitate the description of the relative relationship between one element or feature and another element or feature in the drawings. The true meaning of these spatially relative terms includes other orientations. For example, when the drawings are flipped 180 degrees up and down, the relationship between one element and another element may change from "lower" to "upper". The spatially relative descriptions used in this document should also be interpreted in the same way.

[0051] As described in the prior art, how to further reduce the volume of the packaging structure has become a technical issue in this field. Accordingly, the present invention provides an optical module packaging structure, which includes a circuit board, electronic components, a lead frame and an optical transmission module. Compared with the packaging structure in which the optical transmission module and the electronic components are arranged at different positions, the packaging structure of the present invention adopts vertically stacked electronic components and optical transmission modules, which occupy a smaller plane space (ie, X / Y size). On the other hand, the packaging structure of the present invention adopts a thin and light-weight lead frame as an electrical connector between the optical transmission module and the circuit board, which can make the volume of the packaging structure of the present invention smaller and can be applied to various electronic products with miniaturized sizes (such as AR glasses or VR glasses). In addition, the lead frame has a good thermal conductivity, which can make the packaging structure of the present invention have good heat dissipation performance. Various embodiments of the optical module packaging structure of the present invention will be described in detail below.

[0052] Figure 1 FIG. 4 is a three-dimensional schematic diagram of an optical module packaging structure according to an embodiment of the present invention. Figure 2 FIG. 4 is a schematic cross-sectional view of an optical module packaging structure according to an embodiment of the present invention. Figure 3 FIG. 4 is a schematic three-dimensional diagram of a lead frame according to an embodiment of the present invention. Figure 4 is a three-dimensional schematic diagram of an optical transmitter module according to an embodiment of the present invention. Figures 1 to 4 The optical module packaging structure includes a circuit board 110 , an electronic component 120 , a lead frame 130 and a light emitting module 140 .

[0053] like Figure 1 and Figure 2 As shown, the electronic component 120 is disposed on the circuit board 110. In some embodiments, the electronic component 120 is electrically connected to the circuit board 110. Figure 2 As shown, the electronic component 120 is fixed on the circuit board 110 through solder balls (not shown) or other suitable conductive members and is electrically connected to the circuit board 110 (e.g., an interconnection structure (not shown) within the circuit board 110). In some embodiments, the electronic component 120 is a driver (e.g., a driver IC), a passive component, or other suitable electronic component.

[0054] like Figure 1 and Figure 2 As shown, the lead frame 130 is disposed on the electronic component 120. Figure 1 , Figure 2 and Figure 3 As shown, the lead frame 130 has a first connection portion 131, which is electrically connected to the circuit board 110. In some embodiments, one end of the first connection portion 131 is electrically connected to the circuit board 110 through the solder 170. However, the present invention is not limited to the aforementioned embodiment, and the first connection portion 131 can also be electrically connected to the circuit board 110 through other conductive members.

[0055] In some embodiments, the lead frame 130 further has a second connection portion 132 which is separated from the first connection portion 131 and electrically connected to the circuit board 110. Figure 1 and Figure 3 As shown, the lead frame 130 has a third connection portion 133 and / or a fourth connection portion 134 in addition to the first connection portion 131 and the second connection portion 132. In some embodiments, as Figure 3 As shown, the first connection portion 131, the second connection portion 132, the third connection portion 133 and the fourth connection portion 134 are separated from each other. In some embodiments, the thickness of the lead frame 130 is less than or equal to 0.2 mm, or even less than or equal to 0.15 mm.

[0056] like Figure 1 and Figure 2 As shown, the optical transmission module 140 is disposed on the lead frame 130. Figure 1 , Figure 2 and Figure 4 As shown, the optical transmission module 140 includes a first connection pad 141, which is located at the bottom 140b of the optical transmission module 140. Figure 2 As shown, the first connection pad 141 is electrically connected to the circuit board 110 through the first connection portion 131 of the lead frame 130 .

[0057] In some embodiments, the optical transmission module 140 further includes a second connection pad 142, which is located at the bottom of the optical transmission module 140 and is separated from the first connection pad 141. The second connection pad 142 is electrically connected to the circuit board 110 through the second connection portion 132 of the lead frame 130. Figure 4 As shown, the optical transmission module 140 includes, in addition to the first connection pad 141 and the second connection pad 142, a third connection pad 143 and / or a fourth connection pad 144. In some embodiments, as Figure 4 As shown, the first connection pad 141, the second connection pad 142, the third connection pad 143 and the fourth connection pad 144 are separated from each other. In some embodiments, the bottom 140b of the light emitting module 140 is provided with a heat dissipation substrate (e.g., a ceramic substrate), and the first connection pad 141, the second connection pad 142, the third connection pad 143 and the fourth connection pad 144 are exposed from the lower surface of the heat dissipation substrate.

[0058] In some embodiments, the light emitting module 140 further includes a vertical-cavity surface-emitting laser (VCSEL) (not shown) or other suitable light emitting elements. In some embodiments, the light emitting module 140 is a packaging structure of a vertical-cavity surface-emitting laser. In some embodiments, the vertical-cavity surface-emitting laser is electrically connected to the first connection portion 131, the second connection portion 132, the third connection portion 133 and / or the fourth connection portion 134. In some embodiments, refer to Figure 2 , the electronic component 120 is a driver electrically connected to the circuit board 110, and the driver is electrically connected to the first connection pad 141 through the circuit board 110 (e.g., the interconnection structure in the circuit board 110) and the first connection portion 131. In some embodiments, the driver is electrically connected to the first connection pad 141 through the circuit board 110, the solder 170, and the first connection portion 131. In some embodiments, the driver is used to stabilize the power output of the light emitting element (e.g., a vertical cavity surface laser) to stabilize the emission wavelength to comply with IEC60825 or other safety standards for laser products.

[0059] It is worth noting that, compared with using an insulating material with a conductive through-hole structure as an electrical connection between the light emitting module 140 and the circuit board 110, the present invention uses a lead frame 130 as an electrical connection between the light emitting module 140 and the circuit board 110, which can make the planar space (i.e., X / Y dimensions) occupied by the packaging structure of the present invention smaller. In addition, the lead frame 130 can conduct the heat energy generated during the operation of the light emitting module 140 / electronic component 120 to the outside world, so the packaging structure of the present invention has good heat dissipation performance.

[0060] In some embodiments, Figure 2 As shown, the optical module packaging structure further includes a conductive adhesive layer 150, which is disposed between the first connection pad 141 and the first connection portion 131 of the lead frame 130. In some embodiments, the conductive adhesive layer 150 is a patterned conductive adhesive layer (see Figure 7 ), which is also disposed between the second connection pad 142 and the second connection portion 132 of the lead frame 130. Figure 2 shown.

[0061] In some embodiments, Figure 2 As shown, the optical module packaging structure further includes a thermal conductive adhesive layer 160, which is disposed between the lead frame 130 and the top of the electronic component 120. The heat energy generated by the light emitting module 140 and / or the electronic component 120 during operation can be conducted to the outside through the lead frame 130 and the thermal conductive adhesive layer 160.

[0062] In some embodiments, Figure 1As shown, the optical module packaging structure further includes a light receiving module 180. In some embodiments, the light receiving module 180 has a light sensor. In some embodiments, the light receiving module 180 is a camera module.

[0063] Figure 5 FIG. 4 is a schematic cross-sectional view of an optical module packaging structure according to another embodiment of the present invention. Figure 5 and Figure 2 The difference is that Figure 5 The optical module packaging structure shown also includes a heat sink 162 and an adhesive layer 164. The heat sink 162 is disposed between the thermally conductive adhesive layer 160 and the top of the electronic component 120. The adhesive layer 164 is disposed between the heat sink 162 and the top of the electronic component 120. In some embodiments, the adhesive layer 164 is another thermally conductive adhesive layer, and its material can be the same as or different from that of the thermally conductive adhesive layer 160. The heat energy generated when the light emitting module 140 and / or the electronic component 120 is in operation can be conducted to the outside through the lead frame 130, the thermally conductive adhesive layer 160 and the heat sink 162. In some embodiments, since the heat sink 162 has a certain thickness, it can be used to adjust the height of the light emitting element in the light emitting module 140 so that the field of view (FOV) of the light emitting element is not blocked by other modules (such as the light receiving module 180) nearby.

[0064] The invention also provides a method for manufacturing the optical module packaging structure. Figures 6 to 11 1 is a three-dimensional schematic diagram of a manufacturing method of an optical module packaging structure according to an embodiment of the present invention at various process stages. The various steps of the manufacturing method of the present invention will be described in detail below.

[0065] Please refer to Figure 6 , receiving the circuit board 110 and the electronic component 120, the electronic component 120 is located on the circuit board 110. In some embodiments, the optical receiving module 180 is also located on the circuit board 110. In some embodiments, the electronic component 120 (or the optical receiving module 180) is connected to the circuit board 110 by solder balls (refer to Figure 2 ) or other suitable conductive members are fixed on the circuit board 110 and electrically connected to the circuit board 110. In some embodiments, the electronic component 120 (or the optical receiving module 180) is fixed on the circuit board 110 by surface mount technology (SMT). In some embodiments, the electronic component 120 is a driver, a passive component, or other suitable electronic component.

[0066] Please refer to Figure 7 and Figure 8, fixing the lead frame 130 on the bottom of the light emitting module 140 to form a stacked structure 34. In some embodiments, the light emitting module 140 includes a vertical cavity surface laser. In some embodiments, fixing the lead frame 130 on the bottom of the light emitting module 140 includes: forming a conductive adhesive layer 150 on the bottom of the light emitting module 140, such as Figure 7 The lead frame 130 is bonded to the conductive adhesive layer 150, as shown Figure 7 and Figure 8 and performing a curing process to fix the lead frame 130 on the bottom of the light emitting module 140 through the conductive adhesive layer 150 .

[0067] In some embodiments, reference Figure 7 When forming the conductive adhesive layer 150 on the bottom of the light emitting module 140 , the conductive adhesive layer 150 (or patterned conductive adhesive layer) is roughly aligned with the first connection pad 141 , the second connection pad 142 , the third connection pad 143 and the fourth connection pad 144 of the light emitting module 140 .

[0068] In some embodiments, reference Figure 8 The lead frame 130 has a first connection portion 131 . The curing process is performed to fix the lead frame 130 on the bottom of the light emitting module 140 through the conductive adhesive layer 150 , including: fixing a part of the first connection portion 131 on the first connection pad 141 through the conductive adhesive layer 150 .

[0069] In some embodiments, reference Figure 8 The lead frame 130 also has a second connection portion 132 and an interconnection portion 130i, and the interconnection portion 130i is connected between the first connection portion 131 and the second connection portion 132. The curing process to fix the lead frame 130 on the bottom of the light emitting module 140 through the conductive adhesive layer 150 also includes: fixing a part of the second connection portion 132 on the second connection pad 142 through the conductive adhesive layer 150.

[0070] In some embodiments, reference Figure 8 , the lead frame 130 further has a third connection pad 143 and / or a fourth connection pad 144. In some embodiments, two adjacent ones of the first connection pad 141, the second connection pad 142, the third connection pad 143, and the fourth connection pad 144 are interconnected through an interconnection portion 130i.

[0071] In some embodiments, reference Figure 8 and Fig. 9 The method further includes after the curing process and before the lead frame of the stacked structure is fixed on the electronic component (reference Figures 9 to 11, which will be described in detail later), disconnecting the interconnection portion 130i to electrically isolate the first connection portion 131 from the second connection portion 132. In some embodiments, disconnecting Figure 8 All interconnections 130i shown are connected to separate the first connection pad 141, the second connection pad 142, the third connection pad 143 and the fourth connection pad 144 from each other. In some embodiments, the interconnection 130i is disconnected using a laser of a specific wavelength range so that the interconnection 130i effectively absorbs the heat energy of the laser and melts and disconnects, and the laser does not damage the bottom of the light emitting module 140. In some embodiments, the wavelength of the aforementioned laser is between 960 nanometers and 1070 nanometers.

[0072] However, the present invention is not limited to the above embodiments. In other embodiments, Fig. 9 The lead frame 130 (having a first connection pad 141 , a second connection pad 142 , a third connection pad 143 and a fourth connection pad 144 separated from each other) is fixed on the bottom of the light emitting module 140 to form a stacked structure 34A.

[0073] Please refer to Figures 9 to 11 , fix the lead frame 130 of the stacked structure 34A on the electronic component 120. In some embodiments, fix the lead frame 130 of the stacked structure 34A on the electronic component 120. Fix the lead frame 130 of the stacked structure 34A on the electronic component 120 through the thermal conductive adhesive layer 160. In some embodiments, fix the lead frame 130 of the stacked structure 34A on the electronic component 120 includes: forming a thermal conductive adhesive layer 160 on the electronic component 120, such as Fig.10 The lead frame 130 of the stacked structure 34A is bonded to the thermally conductive adhesive layer 160, as shown Figures 9 to 11 and performing a curing process to fix the lead frame 130 of the stacked structure 34A on the electronic component 120 through the thermally conductive adhesive layer 160 .

[0074] Please refer to Fig.11 and Figure 1 , so that the lead frame 130 is electrically connected to the circuit board 110. In some embodiments, the lead frame 130 is electrically connected to the circuit board 110 using a solder jet process to form a solder 170 electrically connected between the lead frame 130 and the circuit board.

[0075] However, the above is only the preferred embodiment of the present invention, and it cannot be used to limit the scope of the present invention. That is, all simple equivalent changes and modifications made according to the claims and the invention description of the present invention are still within the scope of the present invention. In addition, any embodiment or claim of the present invention does not need to achieve all the purposes, advantages or features disclosed in the present invention. In addition, the abstract part and the title are only used to assist the search of patent documents, and are not used to limit the scope of rights of the present invention.

Claims

1. An optical module packaging structure, comprising: a circuit board; an electronic component, disposed on the circuit board; a lead frame disposed on the electronic component, wherein the lead frame has a first connection portion electrically connected to the circuit board; and An optical transmitter module is arranged on the lead frame, wherein the optical transmitter module comprises a first connection pad located at a bottom of the optical transmitter module, and the first connection pad is electrically connected to the circuit board through the first connection portion of the lead frame.

2. The optical module packaging structure as claimed in claim 1, wherein the optical transmission module further comprises a vertical cavity surface laser. 3 . The optical module packaging structure as claimed in claim 1 , wherein the electronic component is a driver electrically connected to the circuit board, and the driver is electrically connected to the first connection pad through the circuit board and the first connection portion.

4. The optical module packaging structure as claimed in claim 3, wherein one end of the first connecting portion is electrically connected to the circuit board via a solder, and the driver is electrically connected to the first connecting pad via the circuit board, the solder and the first connecting portion.

5. The optical module packaging structure according to claim 1, further comprising: A conductive adhesive layer is disposed between the first connection pad and the first connection portion of the lead frame.

6. The optical module packaging structure according to claim 1, further comprising: A heat-conducting adhesive layer is arranged between the lead frame and a top of the electronic component.

7. The optical module packaging structure according to claim 6, further comprising: A heat dissipation plate, disposed between the thermally conductive adhesive layer and the top of the electronic component; as well as An adhesive layer is disposed between the heat dissipation plate and the top of the electronic component.

8. An optical module packaging structure as described in claim 1, wherein the lead frame also has a second connection portion, which is separated from the first connection portion and electrically connected to the circuit board, and the optical transmission module also includes a second connection pad located at the bottom of the optical transmission module and separated from the first connection pad, and the second connection pad is electrically connected to the circuit board through the second connection portion of the lead frame. 9 . The optical module packaging structure as claimed in claim 8 , wherein the first connecting portion has a first protrusion, the second connecting portion has a second protrusion, and the first protrusion and the second protrusion are opposite to each other. 10 . The optical module packaging structure as claimed in claim 9 , wherein a width of the first protrusion is the same as a width of the second protrusion.

11. A method for manufacturing an optical module packaging structure, comprising: receiving a circuit board and an electronic component, the electronic component being located on the circuit board; Fixing a lead frame on a bottom of an optical transmitter module to form a stacked structure; Fixing the lead frame of the stacked structure on the electronic component; as well as The lead frame is electrically connected to the circuit board.

12. The manufacturing method as claimed in claim 11, wherein fixing the lead frame on the bottom of the optical transmitter module comprises: forming a conductive adhesive layer on the bottom of the light emitting module; bonding the lead frame to the conductive adhesive layer; as well as A curing process is performed to fix the lead frame on the bottom of the light emitting module through the conductive adhesive layer.

13. The manufacturing method as claimed in claim 12, wherein the lead frame has a first connection portion, the light emitting module includes a first connection pad located at the bottom of the light emitting module, and performing the curing process to fix the lead frame to the bottom of the light emitting module through the conductive adhesive layer comprises: A portion of the first connecting portion is fixed on the first connecting pad through the conductive adhesive layer.

14. The manufacturing method according to claim 13, wherein the lead frame further comprises a second connection portion and an interconnection portion, the interconnection portion is connected between the first connection portion and the second connection portion, the optical transmitter module further comprises a second connection pad located at the bottom of the optical transmitter module and separated from the first connection pad, and the curing process is performed to fix the lead frame to the bottom of the optical transmitter module through the conductive adhesive layer, and further comprises: A portion of the second connecting portion is fixed on the second connecting pad through the conductive adhesive layer.

15. The manufacturing method according to claim 14, further comprising: After the curing process is performed and before the lead frame of the stacked structure is fixed on the electronic component, the interconnection portion is disconnected to electrically isolate the first connection portion from the second connection portion. 16 . The manufacturing method of claim 15 , wherein the disconnecting of the interconnection portion uses a laser having a wavelength between 960 nanometers and 1070 nanometers. 17 . The manufacturing method as claimed in claim 11 , wherein the lead frame of the stacked structure is fixed on the electronic component, and the lead frame of the stacked structure is fixed on the electronic component via a thermal conductive adhesive layer.

18. The method of claim 11, wherein electrically connecting the lead frame to the circuit board uses a solder jetting process.

19. The manufacturing method as claimed in claim 11, wherein the light emitting module comprises a vertical cavity surface laser, and the electronic component is a driver electrically connected to the circuit board.

Images