Supporting piece of weighing equipment

Abstract

A support for a weighing apparatus, the support comprising: a support portion for supporting an object during weight measurement; the mounting part is used for mounting the supporting piece on the weighing equipment; wherein the supporting part and the mounting part are electrically connected through a component with a resistor larger than or equal to 100 kilohms and smaller than or equal to 10 megohms.

Description

Technical Field

[0001] The invention relates to a support for a weighing device and to a weighing device having the support. Background Art

[0002] Microelectronic devices are manufactured on semiconductor wafers (eg, silicon) using various techniques (eg, including deposition techniques and removal techniques). The semiconductor wafer may be further processed in a manner that changes its mass, such as by cleaning, ion implantation, photolithography, etc.

[0003] Depending on the device being manufactured, each semiconductor wafer may sequentially undergo hundreds of different processing steps to build and / or remove the layers and materials required for its final operation. In effect, each semiconductor wafer passes through a production line. The nature of semiconductor manufacturing means that certain processing steps or sequences of steps in the production flow may be repeated in a similar or identical manner. For example, this could be building similar layers of metal conductors to interconnect different parts of an active circuit.

[0004] The cost and complexity of the processing steps required to produce complete silicon wafers, and the time required to reach the end of the production line where its operation can be properly evaluated, has led to a desire to monitor the operation of the production line equipment and the quality of the wafers processed during processing so that confidence in the performance and yield of the final wafers can be ensured.

[0005] Wafer processing techniques often result in quality variations at or on the surface of semiconductor wafers. Often, the configuration of the surface variations is critical to the function of the device, so for quality control purposes it is desirable to evaluate the wafer during production to determine whether it has the correct configuration.

[0006] Specialized metrology tools can be used within a production flow, allowing monitoring to be performed immediately after the relevant process of interest and typically before any subsequent processing (ie, between processing steps).

[0007] Measuring the mass variation of a wafer on either side of a processing step is an attractive approach to implementing production wafer metrology. It is relatively low cost, high speed, and can automatically adapt to different wafer circuit patterns. In addition, it can often provide results with higher accuracy than other techniques. For example, on many common materials, the thickness of a material layer can be measured accurately to the atomic level. The wafer in question is weighed before and after the processing step of interest. The mass variation is related to the performance of the production equipment and / or the desired characteristics of the wafer.

[0008] On a wafer, the charge can exist on its surface (surface charge) or within its bulk (substrate, embedded charge). The charge can be generated in various ways, such as by earlier processing or manufacturing steps, tribology, contact electrification, etc.

[0009] When a charged wafer is present on a weighing plate of a weighing device, and the charge on the wafer is not discharged, the charge may cause electrostatic forces between the wafer and the surrounding environment. For example, electrostatic forces may exist between the wafer and a load cell of the weighing device, or between the wafer and a measuring housing of the weighing device.

[0010] This electrostatic force can cause the gravity measured by the load cell to be erroneously high or low, depending on the direction of the electrostatic force, leading to errors in the weight measurement.

[0011] It is therefore advantageous to allow charged wafers present on a weighing pan of a weighing device to discharge, for example by the weighing device, before performing a weight measurement, in order to prevent such electrostatic forces from causing errors in the weight measurement.

[0012] This can be achieved, for example, by making all parts of the weigh pan from a conductive material such as metal so that when the wafer is on the weigh pan, any charge on the wafer can freely discharge through the weigh pan to the load cell.

[0013] However, if the discharge peaks through the load cell of the weighing device are too high, this may lead to errors in the measured output of the load cell, and / or damage the load cell.

[0014] The load cells of weighing equipment are usually grounded (electrically connected to ground). If there is a large amount of static charge on the wafer (e.g., surface potential of hundreds to thousands of volts), when the wafer is loaded onto the weighing pan, the charge may discharge to ground through the weighing pan and the load cell. This discharge may result in a discharge spike with low current and high voltage that lasts for a very short period of time, such as a few nanoseconds. Such transient voltage spikes may affect and / or damage sensitive electronic components in the weighing sensor.

[0015] Additionally or alternatively, if the charge on the wafer is large enough, an arcing event may occur as the wafer is lowered onto the scale and the distance between the wafer and the scale pan decreases, just before full contact is made between the wafer and the scale pan. Such an arcing event may result in a very rapid, short duration voltage spike that may affect and / or damage sensitive electronic components in the load cell.

[0016] exist Figure 1In FIG. 4 , there is schematically shown a weighing pan 1 for a weighing device, which has been used before by the inventors and which allows at least partially controlled discharge of charged wafers.

[0017] like Figure 1 As shown, the weighing pan 1 comprises a pan portion 3 for supporting a wafer during weight measurement. The pan portion 3 is configured to contact the underside of the wafer to support the wafer.

[0018] The disk 3 comprises a plurality of pins 4 which protrude from the top surface of the disk 3 perpendicularly to the main plane of the disk 3. The pins 4 are configured to contact the underside of the wafer so as to support the wafer. Typically, there are three pins 4 which are arranged in a triangular configuration.

[0019] The weighing pan 1 further comprises feet 5 extending perpendicularly to the pan portion 3. The feet 5 are configured to be received by a weighing device so as to mount the weighing pan 1 on the weighing device.

[0020] The support foot 5 may be in the form of a cylinder, a rod or a pin. In some cases, the support foot 5 may be conical.

[0021] The weighing pan 1 further comprises an electrical and thermal insulator portion 7 between the pan portion 3 and the legs 5. The pan portion 3 and the legs 5 are physically separated by the electrical and thermal insulator portion 7. Furthermore, the pan portion 3 and the legs 5 are electrically and thermally isolated from each other by the electrical and thermal insulator portion 7.

[0022] Typically, the electrical and thermal insulator portion 7 is made of ceramic.

[0023] The electrical and thermal insulator portion 7 prevents heat from the wafer on the weighing pan 1 from being conducted to the load cell through the weighing pan 1, which may cause an error in the output of the load cell.

[0024] However, as described above, the charge captured on the wafer on the weighing pan 1 also causes inaccurate measurements by the load cell due to electrostatic forces between the wafer and the surrounding environment.

[0025] Therefore, in order to be able to discharge the charge on the wafer to the load cell through the weighing pan 1, the weighing pan 1 includes a metal spring 9 which electrically connects the pan portion 3 to the legs 5. The metal spring 9 is located within the electrical and thermal insulator portion 7 and extends through (i.e. across) the electrical and thermal insulator portion 7.

[0026] The spring 9 is a conductor that allows the charge to be discharged from the pan 3 to the legs 5 where it can be discharged to the load cell. Thus, the charge can be discharged from the wafer through the weigh pan 1.

[0027] Typically, the metal spring 9 is a helical spring.

[0028] The support leg 5 is made of a conductive material (such as stainless steel), so that electric charges can be conducted to the weighing sensor through the support leg 5 .

[0029] In order to control the discharge of charge from the wafer, the pin 4 is not completely conductive. In particular, at least a portion of the pin 4 that contacts the wafer can be made of a semiconductor material. This semiconductor material can control the discharge of charge from the wafer to the weighing pan 3.

[0030] In one example, the pin 4 may include a metal shaft with a silicon carbide ball at the top of the metal shaft such that the silicon carbide ball is disposed to contact the underside of the wafer. Silicon carbide is a semiconductor, and its resistance is not uniform with respect to voltage.

[0031] In a second example, the pins 4 may comprise a conductive PEEK plastic arranged to contact the underside of the wafer. Conductive PEEK plastic is also a semiconductor whose resistance varies non-uniformly with voltage.

[0032] The other parts of the weighing pan 3 can be made conductive. For example, the other parts of the weighing pan 3 can be made of one or more conductive materials, such as metal. Summary of the invention

[0033] The inventors have recognized that with the above arrangement, a sharp discharge spike of charge from the weighing pan 1 to the load cell may still occur in some cases. As described above, a large discharge spike of the load cell may cause errors in the measured output of the load cell.

[0034] Furthermore, the inventors have recognised that, using the above arrangement, the charge on the wafer may not be fully discharged in some circumstances, thereby resulting in errors in the measurement output as described above.

[0035] In particular, the inventors have recognized that the resistance of the path from the wafer to ground will control the voltage and current characteristics of the discharge spike. Ideally, the charge on the wafer would be completely dissipated, causing the wafer to reach ground potential (V=0). However, the resistance and breakdown characteristics of the materials used in the discharge path may result in residual charge (V>0) remaining on the wafer.

[0036] Variations in the discharge characteristics may result in variations in the amount of residual charge on the wafer, which, as described above, may introduce errors in the measured output.

[0037] The present invention may address one or more of these problems.

[0038] Although the above discussion is about weighing wafers, such as semiconductor wafers, the present invention is also applicable to weighing other objects.

[0039] In most general terms, the present invention proposes to provide a resistive member having a predetermined resistance between two parts of a weighing support to limit and / or control the discharge of electrical charge through the weighing support.

[0040] Therefore, the peak value of the discharge through the weighing support can be controlled by controlling the predetermined resistance of the resistance component. For example, if the predetermined resistance of the resistance component is made higher, the peak value of the discharge can be reduced. However, if the predetermined resistance of the resistance component is too high, the charge of the object may not be discharged effectively or efficiently.

[0041] According to a first aspect of the present invention, there is provided a support member for a weighing device, the support member comprising:

[0042] a support portion for supporting the object during weight measurement; and

[0043] A mounting portion, which is used to mount the support member on the weighing device;

[0044] The supporting portion and the mounting portion are electrically connected via a component, and the component has a resistance greater than or equal to 100 kΩ and less than or equal to 10 MΩ.

[0045] The resistance of 100 kΩ or more and 10 MΩ or less is low enough to allow the charge on the wafer to discharge through the weighing support, but high enough to limit the peak of the discharge.

[0046] The support of the present invention improves the variability of the measured output of a weighing device by controlling the resistance of the discharge path from the object to the weighing device and / or ground, thereby improving the consistency of the discharge and the residual voltage left on the object.

[0047] The first aspect of the present invention may have any one of the following optional features, or, where compatible, any combination of the following optional features.

[0048] The support member may be a disc member. Therefore, unless incompatible, the term "support member" may be replaced by the term "disc member" throughout the text.

[0049] The pan may be a weighing pan or a balancing pan.

[0050] The support portion may be a disk portion. Therefore, unless incompatible, the term "support portion" may be replaced by the term "disk portion" throughout.

[0051] The pan portion may be a weighing pan portion or a balancing pan portion.

[0052] The support may be a weighing support.

[0053] The support may be used to support the object during weight measurement.

[0054] The support may be used in or with a weighing device.

[0055] The support may be referred to as a support device or a support assembly.

[0056] Weighing equipment may refer to equipment used to perform weight measurements on objects.

[0057] A weighing device may refer to a device used to produce a measurement output that is indicative of the weight of an object.

[0058] A weighing device may refer to a device used to weigh an object and / or measure the weight of an object.

[0059] The support portion may be used to support the object during a period in which the weighing device performs a weight measurement on the object.

[0060] The support portion may be configured to support the object during weight measurement.

[0061] The object may be a wafer, such as a semiconductor wafer.

[0062] The support may thus be configured to support the wafer during weight measurement.

[0063] Supporting an object may mean supporting the weight of the object.

[0064] Supporting an object may mean holding or carrying the object.

[0065] The mounting portion may be configured to be received by a weighing device to mount the support member on the weighing device.

[0066] The mounting portion may be, for example, a foot, or a pin, or a shaft.

[0067] The mounting portion may extend perpendicularly or substantially perpendicularly to the support portion.

[0068] The mounting portion may be tapered.

[0069] The mounting portion may be a protrusion or a projection.

[0070] The mounting portion may be cylindrical, or substantially cylindrical.

[0071] When an object is loaded on the supporting portion of the support, the gravity may be transferred to the weighing device through the mounting portion.

[0072] The mounting portion may be located on or substantially on a central axis of the support.

[0073] The mounting portion may extend along or substantially along a central axis of the support.

[0074] The mounting portion may be a shaft, such as a central shaft or an axial shaft.

[0075] The mounting portion may support the supporting portion.

[0076] The support portion may be mounted on the mounting portion.

[0077] When the support member is mounted on the weighing device, the mounting portion is located below the support member portion.

[0078] Mounting the support on the weighing device may include positioning or locating the support on the weighing device, and / or the support being received by the weighing device (eg, the mounting portion being received by the weighing device).

[0079] The support is typically located on top of the weighing device and / or above the weighing device.

[0080] The weighing device may include a load cell.

[0081] The load cell may be grounded (electrically connected to ground).The weighing device may include a gravity sensor.

[0082] The weighing device may include or be an electronic balance.

[0083] The weighing device may include or be a micro balance.

[0084] A component may be a part, or an element.

[0085] The component may be directly electrically connected to the support portion and the mounting portion.

[0086] The component may contact both the support portion and the mounting portion.

[0087] The component electrically connecting the support portion and the mounting portion means that electricity can be conducted from the support portion to the mounting portion through or via the component.

[0088] The member electrically connecting the support portion and the mounting portion means electrically connecting the support portion to the mounting portion.

[0089] The component electrically connects the support portion and the mounting portion together or to each other.

[0090] The component may be a resistive component.

[0091] The component may have a resistance greater than or equal to 500 kΩ.

[0092] The component may have a resistance less than or equal to 5 MΩ.

[0093] The component may have a resistance less than or equal to 2 MΩ.

[0094] The component may have a resistance less than or equal to 1.5 MΩ.

[0095] The component may have a resistance greater than or equal to 500 kΩ and less than or equal to 2 MΩ.

[0096] For example, the component may include a resistor or a resistor wire or a resistor film or a resistor element or a resistor structure.

[0097] A resistor or a resistor wire or a resistor film or a resistor component or a resistor structure may have a specific resistance.

[0098] In addition to the electrical connection provided by the component, the support portion and the mounting portion may also be electrically insulated or isolated from each other.

[0099] There may be a single electrical path from the support portion to the mounting portion, wherein the single electrical path passes through or through the component.

[0100] The component may provide the only electrical connection between the support portion and the mounting portion.

[0101] The support may further include an electrical insulator portion located between the support portion and the mounting portion.

[0102] The electrical insulator portion may electrically isolate the support portion from the mounting portion, except for electrical connections provided via or through the component.

[0103] The component may be located within the electrical insulator portion.

[0104] The component may span the electrical insulator portion.

[0105] The electrical insulator portion may be positioned or located between the support portion and the mounting portion.

[0106] The support portion may be physically separated from the mounting portion by an electrical insulator portion.

[0107] The electrical insulator portion may contact both the support portion and the mounting portion.

[0108] The electrically insulating body portion may comprise, consist of, or consist essentially of one or more electrically insulating materials, such as ceramic and / or plastic.

[0109] The electrical insulator part may also be a thermal insulator. This is advantageous because heat conduction from the object to the weighing device can be prevented.

[0110] The support portion may be electrically conductive or a conductor.

[0111] The support portion may be configured to conduct electricity from an object supported by the support portion to the component.

[0112] The entirety (or substantially the entirety) of the support may be electrically conductive or a conductor.

[0113] The integral (or substantially integral) support portion may be electrically conductive or a conductor.

[0114] All (or substantially all) of the support portion may be electrically conductive or a conductor.

[0115] The support portion may be made of, or primarily made of, one or more electrically conductive materials or one or more conductors.

[0116] The entirety (or substantially the entirety) of the support portion may be made from one or more electrically conductive materials or one or more conductors.

[0117] The unitary (or substantially unitary) support portion may be made of one or more electrically conductive materials or one or more conductors.

[0118] All (or substantially all) of the support portion may be made of one or more electrically conductive materials or one or more conductors.

[0119] The support portion may be made of one or more metals, or may be made essentially of one or more metals.

[0120] The entirety (or substantially the entirety) of the support portion may be made from one or more metals.

[0121] The unitary (or substantially unitary) support portion may be made from one or more metals.

[0122] All (or substantially all) of the support portion may be made from one or more metals.

[0123] For example, the one or more metals may include or be aluminum or stainless steel. Aluminum may be preferred because of its light weight.

[0124] The mounting portion may be electrically conductive or a conductor.

[0125] The mounting portion may be configured to conduct electricity from the component to a weighing device on which the support is mounted.

[0126] The entirety (or substantially the entirety) of the mounting portion may be electrically conductive or a conductor.

[0127] The integral (or substantially integral) mounting portion may be electrically conductive or a conductor.

[0128] All (or substantially all) of the mounting portion may be electrically conductive or a conductor.

[0129] The mounting portion may be made of or consist essentially of one or more electrically conductive materials.

[0130] The entirety (or substantially the entirety) of the mounting portion may be made from one or more electrically conductive materials or one or more conductors.

[0131] The unitary (or substantially unitary) mounting portion may be made from one or more electrically conductive materials or one or more conductors.

[0132] All (or substantially all) of the mounting portion may be made from one or more electrically conductive materials or one or more conductors.

[0133] The mounting portion may be made of or consist essentially of one or more metals.

[0134] The entirety (or substantially the entirety) of the mounting portion may be made from one or more metals.

[0135] The unitary (or substantially unitary) mounting portion may be made from one or more metals.

[0136] All (or substantially all) of the mounting portion may be made from one or more metals.

[0137] For example, the one or more metals may include or be aluminum or stainless steel. Aluminum may be preferred because of its light weight.

[0138] The support portion may include a plurality of contact elements configured to support the object during weight measurement.

[0139] A plurality of contact elements may extend or protrude from the top surface of the support portion.

[0140] The contact element may include or be a pin.

[0141] The contact element may include or be, for example, a contact portion or a contact member.

[0142] The contact element may be electrically conductive or a conductor.

[0143] The contact elements may be made of one or more electrically conductive materials.

[0144] The contact elements may be made of one or more metals.

[0145] The contact element may be made of, for example, stainless steel or aluminum. Stainless steel may be preferred because of its durability and / or its lower thermal conductivity.

[0146] The contact elements may be configured to contact an underside of the wafer to support the wafer.

[0147] There may be three contact elements.

[0148] There may be three or more contact elements.

[0149] The contact elements may be arranged in a triangle.

[0150] At least a portion of one or more contact elements may be coated, for example with a conductive coating.

[0151] The coating may be, for example, titanium nitride.

[0152] For example, at least the distal end of the contact element may be coated.

[0153] The support may be configured to provide an electrical path between an object supported by the support portion and a weighing device on which the support is mounted via the mounting portion, wherein the electrical path passes through or passes through the component.

[0154] The electrical path may include all electrically conductive material and / or conductors other than the components.

[0155] The support may be configured to provide only a single electrical path between an object supported by the support portion and a weighing device on which the support is mounted via the mounting portion, wherein the single electrical path passes through or through the component.

[0156] The electrical path may include all electrically conductive material and / or conductors other than the components.

[0157] The electrical path may be a discharge path or a static discharge path.

[0158] According to a second aspect of the present invention, there is provided a weighing device having a support member according to the first aspect of the present invention.

[0159] The second aspect of the present invention may have any feature of the first aspect of the present invention unless it is incompatible with the feature of the second aspect of the present invention.

[0160] For example, the weighing device may have any of the features of the weighing devices described above.

[0161] The support may have any of the features of the supports described above.

[0162] The support can be mounted on a weighing device.

[0163] The support member can be received by a weighing device. For example, the mounting portion of the support member can be received by a weighing device.

[0164] The weighing device may include a load cell.

[0165] The load cell may be grounded (electrically connected to earth).

[0166] The weighing device may include a gravity sensor.

[0167] A load cell or gravity sensor may be configured to measure the weight of an object carried on the support.

[0168] The weighing device may also include a measuring chamber.

[0169] A weighing device may be located within the measuring chamber.

[0170] The support may be configured to provide an electrical path between an object supported by the support and the weighing device, wherein the electrical path passes through or through the component.

[0171] The support may be configured to provide only a single electrical path between an object supported by the support and the weighing apparatus, wherein the single electrical path passes through or through the component.

[0172] The electrical path may be a discharge path or a static discharge path.

[0173] According to a third aspect of the present invention, there is provided a mass measuring device comprising the weighing apparatus according to the second aspect of the present invention.

[0174] The third aspect of the present invention may have any feature of the first or second aspect of the present invention unless incompatible with the features of the third aspect of the present invention.

[0175] The apparatus may be configured to calculate the mass of the object based at least on the measurement output of the weighing device.

[0176] According to a fourth aspect of the present invention, there is provided a support member for a weighing device, the support member comprising a first portion and a second portion, wherein the first portion and the second portion are electrically connected via a resistance component.

[0177] The resistance component may have a resistance greater than or equal to 100 kΩ and less than or equal to 10 MΩ.

[0178] The resistance component may have a resistance greater than or equal to 500 kΩ and less than or equal to 2 MΩ.

[0179] Unless incompatible with the fourth aspect of the invention, the fourth aspect of the invention may have any feature of the first, second or third aspect of the invention.

[0180] The present invention includes any combination of the described aspects and preferred features unless such combination is expressly not permitted or expressly avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0181] By way of example, embodiments of the present invention will now be discussed with reference to the accompanying drawings, in which:

[0182] Figure 1 It is a schematic diagram of a weighing pan previously used by the inventor.

[0183] Figure 2 is a schematic diagram of a weighing pan according to a first embodiment of the present invention.

[0184] Figure 3 1 is a schematic top view of a weighing pan according to a first embodiment of the present invention.

[0185] Figure 4 is a schematic diagram of a weighing pan according to a second embodiment of the present invention. and

[0186] Figure 5 is a schematic diagram of a weighing device according to a third embodiment of the present invention. DETAILED DESCRIPTION

[0187] Aspects and embodiments of the present invention will now be discussed with reference to the accompanying drawings. Further aspects and embodiments will be apparent to those skilled in the art. All documents mentioned herein are incorporated herein by reference.

[0188] Figure 2 is a schematic diagram of a weighing pan 11 (support member) according to a first embodiment of the present invention.

[0189] like Figure 2 As shown, the weighing pan 11 includes a pan portion 13 (support portion) for supporting the wafer during weight measurement.

[0190] For example, the weighing pan 11 may be referred to as a weighing pan component.

[0191] The weighing pan 11 may be referred to as a balance pan.

[0192] The tray portion 13 is configured to contact the lower side of the wafer to support the wafer.

[0193] like Figure 2 and 3 As shown, the disk 13 includes a plurality of pins 14, which protrude from the top surface of the disk 13 perpendicular to the main plane of the disk 13. The pins 14 are configured to contact the underside of the wafer to support the wafer. In this embodiment, there are three pins 14. Generally speaking, there can be three or more pins 14.

[0194] like Figure 3 As shown, in the embodiment, three pins 14 are arranged in a triangle around the center of the disk 13 (when Figure 3 For example, the three pins 14 may be arranged in an equilateral triangle centered at the center of the disk 13 (when viewed from above in FIG. Figure 3 When the disk portion 13 is viewed from above).

[0195] The disk portion 13 (including the pin 14 ) is electrically conductive.

[0196] In particular, the disk portion 13 (including the pin 14 ) is made of or primarily made of one or more electrically conductive materials.

[0197] For example, the disk portion 13 (including the pin 14) may be made of or primarily of one or more metals.

[0198] For example, the disc 13 (including the pin 14) may be made of or primarily of aluminum or stainless steel. Aluminum may be preferred because of its light weight.

[0199] For example, the body of the disk 13 may be made of aluminum, and the pins 14 may be made of stainless steel (due to its durability and lower thermal conductivity).

[0200] Therefore, when a charged wafer is positioned on the weighing pan 11 , the charge can be discharged from the wafer to the pan portion 13 .

[0201] A coating may be applied to at least a portion of the pin 14, such as a distal end of the pin 14 that is configured to contact a wafer, for example, to improve durability of the pin 14. For example, a titanium nitride coating may be applied to at least the distal end of the pin 14.

[0202] The weighing pan 11 further includes feet 15 (mounting portion) extending perpendicularly to the pan portion 13. The feet 15 are configured to be received by a weighing device to mount the weighing pan 11 on the weighing device.

[0203] More specifically, the feet 15 may be configured to be received by a load cell of a weighing device or by a housing of a load cell to mount the weighing pan 11 on the load cell.

[0204] The feet 15 may alternatively be referred to as mounting portions, which are used to mount the weighing pan 11 on a weighing device or a weighing sensor.

[0205] The leg 15 is electrically conductive. In particular, the leg 15 is made of or mainly made of one or more electrically conductive materials. For example, the leg 15 can be made of or mainly made of one or more metals.

[0206] In this embodiment, the support foot 15 is made of or mainly made of aluminum or stainless steel. Aluminum may be preferred due to its light weight.

[0207] The foot 15 is in the form of a longitudinal pin or axle which is located on the longitudinal axis of the weighing pan 11 and extends along the longitudinal axis.

[0208] The weighing pan 11 further includes an electrical and thermal insulator portion 17 between the pan portion 13 and the legs 15. The pan portion 13 and the legs 15 are physically separated by the electrical and thermal insulator portion 17. In addition, the pan portion 13 and the legs 15 are electrically and thermally isolated from each other by the electrical and thermal insulator portion 17.

[0209] In the present embodiment, the electrical and thermal insulator part 17 is made of ceramic and / or plastic. However, other insulating materials may be used alternatively or additionally.

[0210] The electrical and thermal insulator portion 17 prevents heat from the wafer on the weighing pan 11 from being conducted to the load cell through the weighing pan 11, in which case the heat may cause an output error of the load cell.

[0211] However, as described above, the charge captured on the wafer on the weighing pan 11 may also cause inaccurate measurements by the load cell due to electrostatic forces between the wafer and the surrounding environment.

[0212] Therefore, in order to be able to control the discharge of the electric charge on the wafer, the weighing pan 11 further includes a component 19 having a predetermined resistance, which electrically connects the pan portion 13 to the support feet 15 .

[0213] In particular, in the present embodiment, the component 19 is, for example, a resistor or a resistor wire or a resistor film or a resistor structure.

[0214] For example, component 19 may have a resistance greater than or equal to 100 kΩ and less than or equal to 10 MΩ.

[0215] For example, component 19 may have a resistance greater than or equal to 500 kΩ.

[0216] The component 19 may have a resistance of, for example, less than or equal to 5 MΩ, or 2 MΩ, or 1.5 MΩ.

[0217] The component 19 may be located inside the electrical and thermal insulation portion 17 , or may be provided outside the electrical and thermal insulation portion 17 .

[0218] Component 19 allows charge to discharge from the wafer through weigh pan 11 to the load cell. However, the resistance of component 19 prevents or reduces the possibility of a sharp spike in discharge charge from weigh pan 11 to the load cell.

[0219] Thus, the discharge of the charge from the wafer to the load cell through the weigh pan 11 is controlled by the resistance of the component 19 .

[0220] Weigh pan 11 provides a single electrical path from a wafer carried on pan portion 13 to a weighing device on which weigh pan 11 is mounted by feet 15 , wherein the single electrical path passes through or through component 19 .

[0221] exist Figure 4 A weighing pan 21 according to a second embodiment of the present invention is shown in FIG.

[0222] and Figure 2 The same features as the corresponding features in the drawings will be represented by the same figure numbers, and their description will be omitted for brevity.

[0223] The weighing pan 21 according to the second embodiment may have any features of the weighing pan 11 according to the first embodiment unless they are incompatible with the features of the second embodiment.

[0224] The weighing pan 21 according to the second embodiment differs from the weighing pan 11 according to the first embodiment in that the electrical heat insulator portion 17 in the first embodiment is replaced with a member 23 having a predetermined resistance which electrically connects the pan portion 13 to the legs 15 .

[0225] The predetermined resistance of component 23 may be the same as the predetermined resistance of component 19 discussed above.

[0226] The member 23 is positioned or located between the tray 13 and the foot 15 , and physically separates the tray 13 from the foot 15 .

[0227] The component 23 may be thermally insulating.

[0228] Component 23 allows charge to discharge from the wafer through weigh pan 21 to the load cell. However, the resistance of component 23 prevents or reduces the possibility of a sharp spike in discharge charge from weigh pan 21 to the load cell.

[0229] Thus, the discharge of the charge from the wafer to the load cell through the weigh pan 21 is controlled by the resistance of the component 23 .

[0230] The member 23 may be in the form of a washer or a plate or a membrane.

[0231] Figure 5 is a schematic diagram of a weighing device 25 according to a third embodiment of the present invention.

[0232] The weighing device 25 comprises the weighing pan 11 of the first embodiment. The weighing pan 11 may have any one of the features of the first embodiment described above.

[0233] Alternatively, the weighing pan 11 may be replaced with a weighing pan 21 according to the second embodiment of the present invention.

[0234] The weighing pan 11 is mounted on a weighing sensor 27 of a weighing device 25 .

[0235] The load cell 27 is grounded (electrically connected to ground).

[0236] The load cell 27 is a force sensor that converts gravity applied to the load cell 27 into an electrical signal corresponding to the gravity.

[0237] For example, the load cell 27 or a housing of the load cell 27 may include a receiving portion 29 configured to receive the feet 15 of the weighing pan 11 to mount the weighing pan 11 on the load cell 27 .

[0238] Thus, when weighing pan 11 is mounted on load cell 27 and an object, such as a wafer, is loaded on weighing pan 11, load cell 27 will generate a measurement output corresponding to the weight of the object.

[0239] The disclosed features in the above description, or in the following claims, or in the accompanying drawings, represented in their specific form or as a means of performing the disclosed function, or as a method or process for obtaining the disclosed results, may be used alone or in any combination of these features to implement the invention in its various forms.

[0240] Although the present invention has been described in conjunction with the exemplary embodiments described above, it will be apparent to those skilled in the art that many equivalent modifications and variations will be apparent after obtaining the present disclosure. Therefore, the exemplary embodiments of the present invention described above are considered to be illustrative rather than restrictive. Various changes may be made to the described embodiments without departing from the spirit and scope of the present invention.

[0241] In order to avoid any doubt, any theoretical explanations provided herein are intended to enhance the reader's understanding. The inventors do not wish to be bound by any of these theoretical explanations.

[0242] Any section headings used herein are for organizational purposes only and are not to be construed as limiting the subject matter described.

[0243] In this specification, including the following claims, unless the context requires otherwise, the words "comprise" and "include", and variations such as "comprises", "comprising" and "including", will be understood to imply the inclusion of stated integers or steps or groups of integers or steps but not the exclusion of any other integers or steps or groups of integers or steps.

[0244] It should be noted that the singular forms "a", "an", and "the" used in this specification and the appended claims include plural referents unless the context clearly dictates otherwise. Ranges herein may be expressed as from "about" one particular value, and / or to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value and / or to the other particular value. Similarly, when a value is expressed as an approximation by using the preposition "about", it is understood that the particular value constitutes another embodiment. The term "about" in relation to a numerical value is optional, and, for example, means ±10%.

Claims

1. A support member for a weighing device, the support member comprising: a support portion for supporting the object during weight measurement; as well as A mounting portion, which is used to mount the support member on a weighing device; The support portion and the mounting portion are electrically connected via a component having a resistance greater than or equal to 100 kΩ and less than or equal to 10 MΩ. 2 . The support according to claim 1 , wherein the component has a resistance greater than or equal to 500 kΩ.

3. A support according to claim 1 or 2, wherein the component has a resistance less than or equal to 5 MΩ.

4. A support according to any one of the preceding claims, wherein the component comprises a resistor, or a resistive wire, or a resistive film, or a resistive structure.

5. A support according to any one of the preceding claims, wherein the support further comprises an electrical insulator portion located between the support portion and the mounting portion. The support according to claim 5 , wherein the electrical insulator portion is also a thermal insulator.

7. A support according to claim 5 or 6, wherein the electrical insulator portion comprises ceramic and / or plastic.

8. A support according to any one of the preceding claims, wherein the support portion is electrically conductive.

9. A support according to any one of the preceding claims, wherein the support portion is made of or consists essentially of one or more electrically conductive materials.

10. A support according to any preceding claim, wherein the support portion is made of or consists essentially of one or more metals.

11. A support according to any preceding claim, wherein the mounting portion is electrically conductive.

12. A support according to any preceding claim, wherein the mounting portion is made of or consists essentially of one or more electrically conductive materials.

13. A support according to any preceding claim, wherein the mounting portion is made from or consists essentially of one or more metals.

14. A support according to any one of the preceding claims, wherein the support portion comprises a plurality of contact elements configured to support the object during the weight measurement.

15. A support according to claim 14, wherein at least a portion of one or more of the contact elements is coated.

16. A support according to claim 14 or claim 15, wherein the contact element is electrically conductive.

17. A support according to any one of claims 14 to 16, wherein the contact element is made of or consists essentially of one or more electrically conductive materials.

18. A support according to any one of claims 14 to 17, wherein the contact element is made of or consists essentially of one or more metals.

19. A weighing device having a support as claimed in any one of the preceding claims.

20. The weighing device of claim 19, wherein the weighing device further comprises a load cell.

Images