Wiring member for electrical equipment, and power conversion device

Abstract

The invention provides a wiring member for electrical equipment and a power conversion device using the wiring member, which can reduce inductance and power loss for high-frequency current. A wiring member (50) for an electrical device according to the present invention is provided with: a plurality of first conductors (2a, 2b) which are electrically connected to each other and are stacked; a second conductor (8) that is provided between the plurality of first conductors (2a, 2b) and is not electrically connected to the other conductors; and insulating materials (1) provided between the first conductors (2a, 2b) and the second conductor (8), respectively.

Description

Technical Field

[0001] The present invention relates to a wiring component and a power conversion device of an electric device, and in particular to a wiring component through which a high-frequency current flows and a power conversion device including the wiring component. Background Art

[0002] There are cases where the inductance of wiring components that carry high-frequency current is sought to be reduced. For example, in a power conversion device, power is converted between DC and AC by turning on and off a switching element. However, when the switching element is turned off, a surge voltage is applied to the switching element due to the change in current and the inductance of the wiring components connected to the switching element, and the switching element may be damaged. Therefore, it is necessary to reduce the inductance of the wiring components. In addition, for wiring components, it is sought to reduce power loss in order to efficiently conduct electricity.

[0003] Regarding conductors as wiring components, an example of a technology for reducing inductance is described in Patent Document 1. Patent Document 1 describes a power conversion device that includes a conductor (busbar) connected to a positive electrode of a DC power supply and a conductor connected to a negative electrode that overlap with an insulator sandwiched between them. The inductance is reduced by using a stacked busbar having a structure in which the conductors are adjacent to each other with an insulating material sandwiched between them.

[0004] In addition, regarding wiring components, an example of a technology for reducing power loss for high-frequency current is described in Patent Document 2. Patent Document 2 describes a wiring component for high-frequency current, which is composed of a plurality of stacked metal thin plates and an insulating material that insulates adjacent metal thin plates from each other, thereby reducing the influence of the skin effect and reducing power loss.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2008-245451

[0008] Patent Document 2: Japanese Patent Application Publication No. 2005-269873 Summary of the invention

[0009] Problems to be solved by the invention

[0010] In the prior art, it was difficult to reduce the inductance and power loss of wiring components to a level that fully satisfied users.

[0011] For example, in the technology of Patent Document 1, when the frequency of the current increases, due to the influence of the skin effect, the current flows only on the surface of the conductor, and the current does not flow inside the conductor, so it is difficult to reduce the inductance and power loss. In addition, in the technology of Patent Document 2, although the influence of the skin effect can be reduced, due to the proximity effect caused between multiple metal thin plates, that is, the magnetic flux generated by the current flowing in one metal thin plate affects other metal thin plates and makes it difficult for the current to flow, sometimes it is not possible to fully reduce the inductance and power loss.

[0012] An object of the present invention is to provide a wiring component of an electric device capable of reducing inductance and power loss with respect to a high-frequency current, and a power conversion device using the wiring component.

[0013] Solutions to Solve Problems

[0014] The wiring component of the electric device of the present invention comprises: a plurality of first conductors which are electrically connected to each other and stacked; a second conductor which is provided between the plurality of first conductors and is not electrically connected to other conductors; and an insulating material which is provided between the first conductors and the second conductors.

[0015] The power conversion device of the present invention comprises: a capacitor; a switching element that switches on and off a direct current; and a wiring that connects the capacitor to the switching element. In the wiring component of the present invention, the wiring is a wiring component having two components, the two components having the first conductor, the second conductor, and the insulating material. The two components are opposed to each other in the stacking direction of the first conductor, and an insulating material is provided between the components. The first conductor of one of the components is connected to the positive electrode of a direct current power supply. The first conductor of the other component is connected to the negative electrode of a direct current power supply.

[0016] Effects of the Invention

[0017] According to the present invention, it is possible to provide a wiring component of an electric device capable of reducing inductance and power loss with respect to a high-frequency current, and a power conversion device using the wiring component. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cross-sectional view of the wiring member showing an example of the structure of the wiring member according to the first embodiment of the present invention.

[0019] Figure 2A This is a front view showing an example of a laminated bus bar as a wiring component according to the second embodiment of the present invention.

[0020] Figure 2B yes Figure 2A Cross-sectional view at line AA.

[0021] Figure 3A This is a front view of a laminated bus bar showing an example of a structure in which an end portion of the laminated bus bar is connected to an external device in Example 2.

[0022] Figure 3B yes Figure 3A Cross-sectional view at line BB.

[0023] Figure 4A This is a front view of a laminated bus bar showing an example of the structure of the end portion of the laminated bus bar in Example 2.

[0024] Figure 4B yes Figure 4A Cross-sectional view at line CC.

[0025] Figure 5A This is a front view of a laminated bus bar showing another example of the structure of the end portion of the laminated bus bar in the second embodiment.

[0026] Figure 5B yes Figure 5A Cross-sectional view at line DD.

[0027] Fig. 6A This is a front view showing an example of a multilayer printed circuit board as a wiring member according to a third embodiment of the present invention.

[0028] Figure 6B yes Fig. 6A Cross-sectional view at line EE.

[0029] Fig. 7A This is a front view of a bus bar showing an example of a bus bar as a wiring component according to a fourth embodiment of the present invention.

[0030] Figure 7B yes Fig. 7A Cross-sectional view at line FF.

[0031] Figure 8 It is a diagram showing a circuit configuration of a power conversion device according to a fifth embodiment of the present invention. DETAILED DESCRIPTION

[0032] The wiring component of the electrical device of the present invention comprises at least one of a positive electrode side conductor and a negative electrode side conductor formed by stacking a plurality of conductors, and an electromagnetic shielding member is provided between the stacked conductors. The wiring component of the present invention can reduce inductance and power loss for high frequency current by the effect of the electromagnetic shielding member as a conductor.

[0033] The power conversion device of the present invention includes the wiring member of the present invention, and can reduce inductance and power loss with respect to high-frequency current.

[0034] Hereinafter, the wiring components and the power conversion device of the electrical equipment of the embodiments of the present invention are described in detail using the accompanying drawings. The embodiments described below are for illustrating the present invention, and the present invention is not limited to these embodiments. Therefore, the present invention is not limited to the following embodiments as long as it does not deviate from its purpose, and can be implemented in various ways. In addition, in the drawings used in this specification, the same or corresponding components are marked with the same reference numerals, and repeated descriptions of these components are sometimes omitted.

[0035] Example 1

[0036] A wiring component of an electric device according to a first embodiment of the present invention will be described. In this embodiment, a basic structure of a wiring component for reducing inductance and power loss with respect to a high-frequency current will be described.

[0037] Figure 1 1 is a diagram showing an example of the structure of the wiring member 50 of this embodiment, and is a cross-sectional view of the wiring member 50. The wiring member 50 of this embodiment includes a positive wiring member 5, a negative wiring member 16, and an insulating material 1 located therebetween.

[0038] The positive electrode wiring member 5 includes a positive electrode side conductor 2, an electromagnetic shielding material 8, and an insulating material 1. The negative electrode wiring member 16 includes a negative electrode side conductor 13, an electromagnetic shielding material 8, and an insulating material 1.

[0039] The positive electrode side conductor 2 is formed by stacking a plurality of flat plate-shaped conductors electrically connected to each other. The number of conductors stacked and electrically connected to each other can be determined arbitrarily. Hereinafter, the case where the number of these conductors is two is described as an example. That is, the positive electrode side conductor 2 is formed by stacking two flat plate-shaped positive electrode side conductors 2a and 2b electrically connected to each other.

[0040] The negative electrode side conductor 13 is also composed of a plurality of flat plate-shaped conductors electrically connected to each other, similarly to the positive electrode side conductor 2. The number of these conductors can be determined arbitrarily. Hereinafter, the case where the number of these conductors is two is described as an example. That is, the negative electrode side conductor 13 is composed of two flat plate-shaped negative electrode side conductors 13a and negative electrode side conductors 13b electrically connected to each other.

[0041] The electromagnetic shielding member 8 is provided between each of the plurality of conductors constituting the positive electrode side conductor 2 and between each of the plurality of conductors constituting the negative electrode side conductor 13. Figure 1In the example shown, the electromagnetic shielding member 8 is provided between the positive electrode side conductor 2a and the positive electrode side conductor 2b, and between the negative electrode side conductor 13a and the negative electrode side conductor 13b. When the positive electrode side conductor 2 and the negative electrode side conductor 13 are formed by stacking three or more conductors, the electromagnetic shielding member 8 is provided between each of the three or more conductors. The electromagnetic shielding member 8 is formed by a flat plate-shaped conductor and is not electrically connected to other conductors such as the positive electrode side conductors 2a, 2b and the negative electrode side conductors 13a, 13b.

[0042] The positive electrode side conductor 2 , the negative electrode side conductor 13 , and the electromagnetic shield 8 can be made of materials such as copper and aluminum.

[0043] The insulating material 1 is provided between the positive electrode side conductor 2a and the electromagnetic shielding member 8, and between the electromagnetic shielding member 8 and the positive electrode side conductor 2b. Furthermore, the insulating material 1 is provided between the negative electrode side conductor 13a and the electromagnetic shielding member 8, and between the electromagnetic shielding member 8 and the negative electrode side conductor 13b. The electromagnetic shielding member 8 is insulated from the positive electrode side conductor 2 and the negative electrode side conductor 13 by these insulating materials 1. In addition, as described above, the insulating material 1 is also provided between the positive electrode wiring member 5 and the negative electrode wiring member 16. The insulating material 1 is solid, gas or liquid, for example, glass epoxy resin, air or insulating oil.

[0044] The wiring member 50 of the present embodiment may include only one of the positive wiring member 5 and the negative wiring member 16, or may include Figure 1 As shown in the figure, the positive electrode wiring member 5 and the negative electrode wiring member 16 are provided. That is, the wiring member 50 of the present embodiment can include one or both of the positive electrode side conductor 2 and the negative electrode side conductor 13.

[0045] In the structure in which the wiring member 50 includes both the positive wiring member 5 and the negative wiring member 16, the positive wiring member 5 and the negative wiring member 16 are arranged in such a way that the stacking direction of the positive side conductors 2a and 2b coincides with the stacking direction of the negative side conductors 13a and 13b, and face each other in their stacking directions to constitute the wiring member 50. Figure 1 In the example shown, the insulating material 1 located between the positive electrode wiring member 5 and the negative electrode wiring member 16 is provided between the positive electrode side conductor 2b and the negative electrode side conductor 13a.

[0046] An electrode of a DC power source, such as a positive electrode, can be connected to the positive electrode side conductor 2 (2a, 2b) of the positive electrode wiring member 5. An electrode of a DC power source, such as a negative electrode, can be connected to the negative electrode side conductor 13 (13a, 13b) of the negative electrode wiring member 16. When the electrodes of the DC power source are connected, the positive electrode side conductor 2 and the negative electrode side conductor 13 allow current to flow.

[0047] The wiring member 50 of this embodiment can reduce inductance and power loss for high-frequency components included in direct current when direct current flows. In this specification, not only high-frequency alternating current but also high-frequency components included in direct current are referred to as high-frequency current.

[0048] like Figure 1 As shown, the positive electrode side conductor 2 of the positive electrode wiring member 5 is disposed in the stacking direction ( Figure 1 The direction perpendicular to the left and right directions (for example, from Figure 1 When current 3 flows through the positive-side conductor 2a, magnetic flux 4 is generated by current 3. When current 6 flows through the positive-side conductor 2b, magnetic flux 7 is generated by current 6.

[0049] When the magnetic flux 4 and the magnetic flux 7 interlink with the electromagnetic shielding member 8, an eddy current 9 in the opposite direction to the currents 3 and 6 is generated in the electromagnetic shielding member 8. The eddy current 9 generates a magnetic flux 10 around the electromagnetic shielding member 8. When the magnetic flux 10 interlinks with the positive-side conductor 2a and the positive-side conductor 2b, an eddy current 11 is generated on the surface of the positive-side conductor 2a and the positive-side conductor 2b facing the electromagnetic shielding member 8. The eddy current 11 is in the same direction as the currents 3 and 6, and does not hinder the flow of the currents 3 and 6.

[0050] Therefore, high-frequency current easily flows through the surfaces of the positive-side conductors 2a and 2b facing the electromagnetic shield 8. Therefore, the positive-electrode wiring member 5 of the wiring member 50 of this embodiment can reduce inductance and power loss with respect to high-frequency current.

[0051] The negative wiring member 16 has the same structure as the positive wiring member 5. Therefore, the negative side conductor 13a and the negative side conductor 13b can easily flow high-frequency current on the surface opposite to the electromagnetic shielding member 8 according to the same principle as the positive wiring member 5. Therefore, the negative wiring member 16 of the wiring member 50 of this embodiment can reduce the inductance and power loss for high-frequency current. However, the direction of the current 14, 17 flowing in the negative side conductors 13a, 13b is opposite to the direction of the current 3, 6 flowing in the positive side conductors 2a, 2b, so the direction of the magnetic flux 15, 18 generated by the current 14, 17 is opposite to the direction of the magnetic flux 4, 7 generated in the positive wiring member 5. Furthermore, the direction of the eddy current 9 generated in the electromagnetic shielding member 8 by the magnetic fluxes 15 and 18 and the direction of the magnetic flux 10 generated around the electromagnetic shielding member 8 are also opposite to the direction in the positive wiring member 5, and the direction of the eddy current 11 generated on the surface of the negative side conductors 13a and 13b opposite to the electromagnetic shielding member 8 is also opposite to the direction in the positive wiring member 5.

[0052] In the wiring component 50 of the present embodiment, the positive wiring component 5 and the negative wiring component 16 are opposed to each other with the insulating material 1 sandwiched therebetween. Therefore, due to the magnetic flux generated by the positive side conductor 2b and the negative side conductor 13a, eddy currents 19 and 12 are respectively generated on the surfaces of the positive wiring component 5 and the negative wiring component 16 that are opposed to the insulating material 1 (that is, the surfaces of the positive side conductor 2b and the negative side conductor 13a that are opposed to the insulating material 1). The eddy currents 19 and 12 are also in the same direction as the currents 6 and 14, respectively, and do not hinder the flow of the currents 6 and 14.

[0053] Therefore, high-frequency current can easily flow through the positive-side conductor 2b and the negative-side conductor 13a on the surface facing the insulating material 1 between the positive wiring member 5 and the negative wiring member 16. Therefore, the positive wiring member 5 and the negative wiring member 16 of the wiring member 50 of the present embodiment can reduce inductance and power loss with respect to high-frequency current.

[0054] The wiring member 50 of this embodiment includes the electromagnetic shielding member 8 which is not electrically connected to other conductors. The electromagnetic shielding member 8 generates eddy currents 9 and the positive electrode side conductor 2 and the negative electrode side conductor 13 generate eddy currents 11 , thereby reducing inductance and power loss for high frequency currents.

[0055] also, Figure 1 The structure and direction of the current shown are an example of the wiring member 50 of this embodiment. For example, even if the directions of the currents 3 and 6 and the currents 14 and 17 are opposite in the wiring member 50, the same effect as this embodiment can be obtained.

[0056] Example 2

[0057] A wiring member 50 of an electric device according to a second embodiment of the present invention will be described. In this embodiment, a laminated busbar formed by laminating insulating materials and conductors will be exemplified as the wiring member 50 for description.

[0058] Figure 2A and Figure 2B FIG. 1 is a diagram showing an example of a laminated bus bar as the wiring member 50 according to the present embodiment. Figure 2A This is the main view of the laminated busbar. Figure 2B yes Figure 2A Cross-sectional view at line AA.

[0059] Figure 2A and Figure 2BThe laminated busbar shown in the figure includes a positive wiring member 5, a negative wiring member 16, and an insulating material 1 provided between the positive wiring member 5 and the negative wiring member 16. The positive wiring member 5 includes a positive side conductor 2 (2a, 2b), an electromagnetic shielding member 8, and an insulating material 1 therebetween. The negative wiring member 16 includes a negative side conductor 13 (13a, 13b), an electromagnetic shielding member 8, and an insulating material 1 therebetween.

[0060] The structure of the electrode of the laminated busbar will be described.

[0061] On the positive side of the laminated busbar, the positive side conductor 2a and the positive side conductor 2b are electrically connected to each other through a separator 20. The separator 20 is a conductor, for example, a ring-shaped metal member. The positive side conductor 2a, the positive side conductor 2b and the separator 20 are mechanically connected, for example, by spot welding.

[0062] The laminated busbar includes a positive electrode 21. The positive electrode 21 is electrically connected to the positive conductor 2a and the positive conductor 2b. The positive electrode 21 can be formed of, for example, a metal cylinder, and can be provided on the laminated busbar by, for example, press-fitting. In order to insulate the positive electrode 21 from the negative conductor 13, an insulating material 1 is disposed between the positive electrode 21 and the negative conductor 13.

[0063] The negative side of the laminated busbar has the same structure as the positive side. The negative side conductor 13a and the negative side conductor 13b are electrically connected to each other through the separator 20. The laminated busbar has a negative side electrode 22 electrically connected to the negative side conductor 13a and the negative side conductor 13b. In order to insulate the negative side electrode 22 from the positive side conductor 2, an insulating material 1 is arranged between the negative side electrode 22 and the positive side conductor 2.

[0064] The positive electrode 21 and the negative electrode 22 have through holes through which screws for fixing external devices such as capacitors and switching elements pass. Figure 2A and Figure 2B In the laminated busbar shown, external devices are connected to the positive electrode 21 and the negative electrode 22 at the inner periphery of the laminated busbar. The laminated busbar may also be configured such that external devices are connected to the positive electrode 21 and the negative electrode 22 at the ends thereof.

[0065] Figure 3A and Figure 3B This is a diagram showing an example of a structure in which, in a laminated bus bar as the wiring member 50 of the present embodiment, an end portion of the laminated bus bar is connected to an external device. Figure 3A This is the main view of the laminated busbar. Figure 3B yes Figure 3A Cross-sectional view at line BB.

[0066] like Figure 3BAs shown, the positive electrode side conductor 2a has a step-bend portion 23 at the end of the laminated busbar, and is bent at the step-bend portion 23 to connect with the positive electrode side conductor 2b. The positive electrode side conductor 2a and the positive electrode side conductor 2b are mechanically connected by, for example, spot welding. The connection portion between the positive electrode side conductor 2a and the positive electrode side conductor 2b is constituted as a positive electrode side electrode 21, and has a through hole for passing a screw for fixing an external device.

[0067] The negative electrode conductor 13b has the same structure as the positive electrode conductor 2a and is connected to the negative electrode conductor 13a by bending at the step bending portion 23. The connection portion between the negative electrode conductor 13a and the negative electrode conductor 13b is formed as a negative electrode 22 and has a through hole for passing a screw for fixing an external device.

[0068] like Figure 3A As shown, the positive electrode 21 and the negative electrode 22 are preferably located separately from each other so that external devices can be easily connected.

[0069] like Figure 2A , 2B and Figure 3A , 3B As shown, the positive electrode 21 and the negative electrode 22 of the laminated busbar as the wiring member 50 of the present embodiment have through holes, and external devices such as capacitors and switching elements can be connected by screwing using the through holes.

[0070] use Figure 4A , 4B and Figure 5A , 5B An example of the structure of the end portion of the laminated busbar as the wiring member 50 of the present embodiment will be described.

[0071] Figure 4A and Figure 4B FIG. 1 is a diagram showing an example of the structure of an end portion of a laminated bus bar as the wiring member 50 according to the present embodiment. Figure 4A This is the main view of the laminated busbar. Figure 4B yes Figure 4A Cross-sectional view at line CC.

[0072] like Figure 4B As shown, in the positive wiring member 5, an electromagnetic shielding insulating plate 25 as an insulating material 1 is provided between the positive side conductor 2a and the electromagnetic shielding member 8 and between the electromagnetic shielding member 8 and the positive side conductor 2b. The electromagnetic shielding insulating plate 25 is bonded to the positive side conductors 2a, 2b and the electromagnetic shielding member 8. The negative wiring member 16 also has the same structure as the positive wiring member 5. A positive-negative inter-electrode insulating plate 24 as an insulating material 1 is provided between the positive wiring member 5 and the negative wiring member 16.

[0073] The length of the electromagnetic shielding insulating plate 25 protruding from the positive electrode side conductors 2a, 2b and the negative electrode side conductors 13a, 13b is d2. The length of the positive-negative electrode insulating plate 24 protruding from the positive electrode side conductors 2a, 2b and the negative electrode side conductors 13a, 13b is d1.

[0074] The length d2 is preferably less than the length d1 (d2≤d1). In the laminated busbar, the potential difference between the positive side conductor 2 and the negative side conductor 13 is large. Therefore, the length d1 needs to be a constant length that increases the creeping distance between the positive side conductor 2 and the negative side conductor 13. On the other hand, the potential difference between the positive side conductors 2a, 2b and the electromagnetic shielding device 8 and the potential difference between the negative side conductors 13a, 13b and the electromagnetic shielding device 8 are smaller than the potential difference between the positive side conductor 2 and the negative side conductor 13. Therefore, the length d2 can be smaller than the length d1 (d2<d1). The length d2 can also be equal to the length d1 (d2=d1), but when it is smaller than the length d1, it has the advantage of being able to reduce the amount of insulating material used.

[0075] exist Figure 4A and Figure 4B In the example shown, an electromagnetic shielding insulating sheet 25, i.e., a plate-shaped insulating material, is used as the insulating material 1 for insulating the electromagnetic shielding member 8. As described above, the potential difference between the electromagnetic shielding member 8 and the positive-side conductor 2 and the potential difference between the electromagnetic shielding member 8 and the negative-side conductor 13 are small. Therefore, as the insulating material 1 for insulating the electromagnetic shielding member 8, a thin-film-shaped insulating material, such as a thin sheet or a thin film, can be used. Hereinafter, the structure of the end of the laminated busbar using the insulating sheet as the insulating material 1 for insulating the electromagnetic shielding member 8 will be described.

[0076] Figure 5A and Figure 5B FIG. 1 is a diagram showing another example of the structure of the end portion of the laminated bus bar as the wiring member 50 according to the present embodiment. Figure 5A This is the main view of the laminated busbar. Figure 5B yes Figure 5A Cross-sectional view at line DD.

[0077] like Figure 5B As shown, in the positive wiring member 5, an electromagnetic shielding insulating sheet 26 as an insulating material 1 is provided between the positive side conductor 2a and the electromagnetic shielding member 8 and between the electromagnetic shielding member 8 and the positive side conductor 2b. The electromagnetic shielding insulating sheet 26 is bonded to the positive side conductors 2a, 2b and the electromagnetic shielding member 8. The negative wiring member 16 also has the same structure as the positive wiring member 5. A positive-negative inter-electrode insulating plate 24 as an insulating material 1 is provided between the positive wiring member 5 and the negative wiring member 16.

[0078] Side insulating sheets 27 are attached to the side surfaces of the positive electrode wiring member 5 and the negative electrode wiring member 16 (that is, the side surfaces of the positive electrode side conductor 2 a and the negative electrode side conductor 13 b ).

[0079] At the end of the laminated busbar, the electromagnetic shielding insulating sheet 26 and the side insulating sheet 27 are overlapped and bonded to the positive-negative inter-electrode insulating plate 24 .

[0080] The laminated busbars as the wiring component 50 of this embodiment can reduce the inductance and power loss for high-frequency currents similarly to the wiring component 50 of the first embodiment. Figure 4A , 4B and Figure 5A , 5B The structure shown can effectively insulate the electromagnetic shield 8 from the positive electrode side conductor 2 and the negative electrode side conductor 13 at the end of the laminated bus bar.

[0081] Example 3

[0082] A wiring component 50 of an electric device according to a third embodiment of the present invention will be described. In this embodiment, a multilayer printed circuit board will be described as an example of the wiring component 50 .

[0083] Fig. 6A and Figure 6B FIG. 1 is a diagram showing an example of a multilayer printed circuit board as the wiring member 50 according to the present embodiment. Fig. 6A This is the front view of the multi-layer printed circuit board. Figure 6B yes Fig. 6A Cross-sectional view at line EE.

[0084] Fig. 6A and Figure 6B The multilayer printed circuit board shown in the figure includes a positive wiring component 5, a negative wiring component 16, and an insulating material 1 provided between the positive wiring component 5 and the negative wiring component 16. The positive wiring component 5 includes a positive side conductor 2 (2a, 2b), an electromagnetic shielding member 8, and an insulating material 1 therebetween. The negative wiring component 16 includes a negative side conductor 13 (13a, 13b), an electromagnetic shielding member 8, and an insulating material 1 therebetween. The positive side conductor 2, the negative side conductor 13, and the electromagnetic shielding member 8 can be formed by conductors of each layer of the printed circuit board. The insulating material 1 is an insulating component between layers of the printed circuit board, and can be formed by the base material of the printed circuit board.

[0085] In the multilayer printed circuit board as the wiring component 50 of this embodiment, it is preferable to determine the layout of the conductor pattern of each layer so that the insulating material 1 is present at the end, and the positive-side conductor 2, the negative-side conductor 13, and the electromagnetic shielding member 8 are located slightly inside the end. With such a layout, the electromagnetic shielding member 8 can be effectively insulated from the positive-side conductor 2 and the negative-side conductor 13 at the end of the multilayer printed circuit board.

[0086] The structure of the electrodes of the printed circuit board will be described. The printed circuit board includes a positive electrode 21 and a negative electrode 22 as electrodes.

[0087] The positive electrode 21 is composed of a through hole 28 with metal plating inside, and is located on the surface of the printed circuit board where the negative electrode conductor 13b is present. The through hole 28 is connected to the positive electrode conductor 2a and the positive electrode conductor 2b. When the printed circuit board has a via 29 that connects the positive electrode conductor 2a and the positive electrode conductor 2b, it is effective in reducing the conduction loss between the positive electrode conductor 2a and the positive electrode conductor 2b. In addition, if Fig. 6A As shown, the negative electrode side conductor 13 b exists around the positive electrode side electrode 21 , and therefore, the insulating material 1 is disposed around the positive electrode side electrode 21 in order to insulate the positive electrode side electrode 21 from the negative electrode side conductor 13 b .

[0088] The negative electrode 22 is formed by a through hole 28 connecting the negative electrode conductor 13a and the negative electrode conductor 13b, and is located on the surface of the printed circuit board where the negative electrode conductor 13b exists. The negative electrode conductor 13a and the negative electrode conductor 13b are connected to each other through a via hole 29.

[0089] By using the through hole 28, external devices such as capacitors and switching elements are connected to the positive electrode 21 and the negative electrode 22. For example, if the diameter of the through hole 28 is slightly larger than the diameter of the lead of the device connected to the positive electrode 21 and the negative electrode 22, the lead of the device can be passed through the through hole 28 and the device can be fixed to the printed circuit board by welding. In addition, in the case of a device in which the electrodes of the device are fixed to the printed circuit board by screws, if the diameter of the through hole 28 is slightly larger than the diameter of the screw, the screw can be passed through the through hole 28 to fix the device to the printed circuit board.

[0090] In addition, the positions of the positive electrode 21 and the negative electrode 22 are not limited to Fig. 6A and Figure 6B For example, the positive electrode 21 and the negative electrode 22 may be located on the surface of the printed circuit board where the positive electrode conductor 2a exists. In this configuration, the positive electrode conductor 2a exists around the negative electrode 22, so in order to insulate the negative electrode 22 from the positive electrode conductor 2a, the insulating material 1 is arranged around the negative electrode 22.

[0091] The multilayer printed circuit board as the wiring component 50 of this embodiment can reduce the inductance and power loss for high-frequency currents, similarly to the wiring component 50 of Example 1. In addition, the wiring component 50 of this embodiment can effectively insulate the electromagnetic shielding member 8 from the positive-side conductor 2 and the negative-side conductor 13 at the end of the multilayer printed circuit board.

[0092] Example 4

[0093] A wiring component 50 of an electrical device according to a fourth embodiment of the present invention is described. In this embodiment, a busbar is used as an example of the wiring component 50 for description. In the second and third embodiments, an example in which the insulating material 1 is solid is described. The insulating material 1 may not be solid, but may be a gas such as air, or a liquid such as insulating oil. In this embodiment, a wiring component 50 (busbar) in which the insulating material 1 is air is described.

[0094] Fig. 7A and Figure 7B FIG. 1 is a diagram showing an example of a bus bar as the wiring member 50 according to the present embodiment. Fig. 7A This is the main view of the busbar. Figure 7B yes Fig. 7A Cross-sectional view at line FF.

[0095] Fig. 7A and Figure 7B The busbar shown does not include the negative electrode wiring member 16, includes the positive electrode wiring member 5, and includes the positive electrode side conductors 2 (2a, 2b), the electromagnetic shielding member 8, and the insulating material 1 therebetween. The insulating material 1 is air.

[0096] The positive electrode side conductor 2a and the positive electrode side conductor 2b are electrically connected to each other via the conductor separator 20. The positive electrode side conductor 2a and the positive electrode side conductor 2b can be fixed to the insulator 31 by bolts 32. The insulator 31 is fixed to the frame 30 that fixes the busbar.

[0097] The electromagnetic shielding member 8 is provided between the positive-side conductor 2a and the positive-side conductor 2b. The electromagnetic shielding member 8 can be provided, for example, by the following method. The electromagnetic shielding member 8 can be provided by providing an insulating spacer 35 between the electromagnetic shielding member 8 and the positive-side conductor 2a and between the electromagnetic shielding member 8 and the positive-side conductor 2b, and fixing the positive-side conductor 2a, the electromagnetic shielding member 8, the positive-side conductor 2b, and the insulating spacer 35 by bolts 33 and nuts 34.

[0098] The electromagnetic shielding member 8 has holes through which the bolts 33 pass. When the bolts 33 are made of a conductor such as metal, the insulating spacer 35 has a structure that covers the side surfaces of the holes of the electromagnetic shielding member 8. This structure insulates the electromagnetic shielding member 8 from the bolts 33.

[0099] The busbar as the wiring member 50 of this embodiment can reduce inductance and power loss for high-frequency currents similarly to the wiring member 50 of Embodiment 1. The wiring member 50 of this embodiment can insulate the electromagnetic shield 8 from conductors such as the positive electrode side conductor 2.

[0100] Example 5

[0101] In Example 5, a power conversion device according to an embodiment of the present invention is described. The power conversion device according to this embodiment can be any power conversion device having the wiring member 50 according to an embodiment of the present invention. In this embodiment, as a power conversion device, a power conversion device that converts a direct current into a three-phase alternating current is exemplified for description.

[0102] Figure 8 1 is a diagram showing a circuit configuration of a power converter 40 of this embodiment. The power converter 40 is a device (eg, an inverter) that converts a DC current into a three-phase AC current, and can be connected to a DC power source 36 and a three-phase AC load 42 .

[0103] The power conversion device 40 includes a capacitor 37 and a switch element 41 as main components. The switch element 41 switches the DC current on and off. In addition, as a wiring (a flow path of the DC power supply 36) connecting the capacitor 37 and the switch element 41, a wiring component 50 of an embodiment of the present invention (for example, the wiring component 50 of Embodiment 2) is provided. Figure 8 In FIG. 1 , the wiring component 50 is indicated by a thick line.

[0104] Generally, in the wiring connecting the capacitor 37 and the switching element 41, there are positive side parasitic inductance 38 and negative side parasitic inductance 39 as inductance. When the switching element 41 is turned off from the on state to the off state, the current flowing in the wiring changes rapidly, and the current contains high-frequency components. Therefore, when the positive side parasitic inductance 38 and the negative side parasitic inductance 39 are large, an excessive surge voltage is applied to the switching element 41, and the switching element 41 may be destroyed.

[0105] The power conversion device 40 of this embodiment includes the wiring member 50 of the embodiment of the present invention as the wiring connecting the capacitor 37 and the switching element 41, so that the inductance and power loss can be reduced for high-frequency current (DC current containing high-frequency components). That is, in the power conversion device 40 of this embodiment, the inductance of the wiring connecting the capacitor 37 and the switching element 41 is small, so the surge voltage can be reduced and the destruction of the switching element 41 can be prevented.

[0106] In addition, the present invention is not limited to the above-mentioned embodiments, and various modifications are possible. For example, the above-mentioned embodiments are described in detail in order to explain the present invention in an easy-to-understand manner, and the present invention is not necessarily limited to a method having all the structures described. In addition, a part of the structure of a certain embodiment can be replaced with the structure of other embodiments. In addition, the structure of other embodiments can also be added to the structure of a certain embodiment. In addition, for a part of the structure of each embodiment, it is possible to delete, or add or replace other structures.

[0107] Explanation of symbols

[0108] 1—insulating material; 2, 2a, 2b—positive electrode conductor; 3—current; 4—magnetic flux; 5—positive electrode wiring component; 6—current; 7—magnetic flux; 8—electromagnetic shielding member; 9—eddy current; 10—magnetic flux; 11—eddy current; 12—eddy current; 13, 13a, 13b—negative electrode conductor; 14—current; 15—magnetic flux; 16—negative electrode wiring component; 17—current; 18—magnetic flux; 19—eddy current; 20—spacer; 21—positive electrode; 22—negative electrode; 23—step Bending portion; 24—insulating plate between positive and negative electrodes; 25—electromagnetic shielding insulating plate; 26—electromagnetic shielding insulating sheet; 27—side insulating sheet; 28—through hole; 29—via; 30—frame; 31—insulator; 32—bolt; 33—bolt; 34—nut; 35—insulating spacer; 36—DC power supply; 37—capacitor; 38—parasitic inductance on the positive side; 39—parasitic inductance on the negative side; 40—power conversion device; 41—switching element; 42—three-phase AC load; 50—wiring component.

Claims

1. A wiring component of an electrical device, characterized in that: have: a plurality of first conductors which are electrically connected to each other and stacked; A second conductor, which is disposed between the plurality of the first conductors and is not electrically connected to the other conductors; as well as Insulating materials are respectively disposed between the first conductor and the second conductor.

2. The wiring component of an electric device according to claim 1, characterized in that: comprising two components, the two components comprising the first conductor, the second conductor and the insulating material, The two components are opposed to each other in the lamination direction of the first conductor, and an insulating material is provided between the components.

3. The wiring component of the electric equipment according to claim 2, characterized in that: The first conductor of the component on one side is connected to the positive electrode of a DC power supply, The first conductor of the other member is connected to a negative electrode of a DC power source.

4. A power conversion device, characterized in that: have: Capacitors; a switching element that switches the direct current on and off; and wiring connecting the capacitor and the switching element, The wiring is the wiring component according to claim 3.

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