Process chamber and semiconductor processing equipment
By designing annular heating parts, reflective structures, annular shading structures and adjustment devices in the process chamber, the problems of condensation and uneven temperature of reaction sources in the atomic layer deposition equipment during low temperature transmission are solved, and more uniform temperature control is achieved and process quality is improved.
Patent Information
- Application Number
- CN202311062548.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-22
- Publication Date
- 2025-02-25
AI Technical Summary
The reaction source in the atomic layer deposition equipment is prone to condense during low-temperature transmission, resulting in uneven temperature and affecting the process quality.
A process chamber is designed, including an annular heating member, a reflective structure, an annular shading structure and an adjustment device. A heat source is provided through an annular heating member. The reflective structure reflects the heat source to heat the inner cavity. The annular shading structure adjusts the heat source irradiation area to ensure the uniform temperature of the heating base.
It effectively improves the temperature uniformity of the wafer environment during the process, avoids the problems of reaction source condensation and uneven temperature, and improves the stability and quality of the process.
Smart Images
Figure CN119506834A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of semiconductor manufacturing equipment, and in particular to a process chamber and semiconductor processing equipment. Background Art
[0002] Atomic layer deposition (ALD) is a commonly used thin film deposition method. Specifically, multiple reaction gases or steam pulses are alternately introduced into the reaction chamber. Through chemical reactions in the reaction chamber, they are accumulated layer by layer in the form of single atomic layers to the target film thickness. It has been widely used in semiconductor devices, integrated circuits, solar cells and other industries.
[0003] The reaction source in the atomic layer deposition equipment is extremely sensitive to temperature. If a cold spot appears during the transmission process or the transmission is performed at a lower temperature, there will be a risk that the reaction source will be difficult to purge or even condense to produce particles, especially solid reaction sources are more sensitive to low temperatures.
[0004] Therefore, how to ensure the temperature uniformity of the environment in which the wafer is located during the process becomes an urgent problem to be solved. Summary of the invention
[0005] In response to the above technical problems, the present application provides a process chamber and a semiconductor processing equipment, which can improve the temperature uniformity of the environment in which the wafer is located during the process.
[0006] In order to solve the above technical problems, in a first aspect, an embodiment of the present application provides a process chamber, comprising:
[0007] An outer cavity, wherein the bottom of the outer cavity has a through hole;
[0008] An inner cavity is arranged in the outer cavity, and a transfer window is provided at the bottom of the inner cavity;
[0009] The bearing structure includes a lifting shaft and a heating base, wherein the heating base is used to bear and heat the wafer, the top end of the lifting shaft passes through the through hole and is connected to the heating base, and the lifting shaft is used to drive the heating base to rise to the transfer window to block the transfer window;
[0010] An annular heating element, disposed in the outer cavity and surrounding the lifting shaft, for providing a heat source;
[0011] A reflective structure, disposed in the outer cavity and below the inner cavity, for reflecting the heat source toward the inner cavity;
[0012] An annular shielding structure, disposed between the annular heating element and the heating base, for shielding the heat source;
[0013] An adjusting device is connected to the annular shielding structure and is used to adjust the shielding range of the annular shielding structure so as to adjust the area of the heating base irradiated by the heat source.
[0014] Optionally, the annular shielding structure includes:
[0015] An annular mounting portion, disposed between the annular heating element and the lifting shaft;
[0016] At least three movable plates are connected to the annular mounting portion and are distributed along the circumference of the annular mounting portion on the outside of the annular mounting portion. The movable plates can be folded up and down relative to the annular mounting portion, and at least one folding angle can completely prevent the heat source from irradiating the heating base; the projections of all the movable plates in the vertical direction form a circular ring;
[0017] The adjusting device is used to drive the movable plate to fold up and down relative to the annular side panel.
[0018] Optionally, there is no gap between the projections of two adjacent movable panels in the vertical direction.
[0019] Optionally, the annular mounting portion is an annular side panel, which is used to prevent the heat source from irradiating the lifting shaft;
[0020] The at least three movable panels are hinged to the top of the annular side panel.
[0021] Optionally, the adjusting device includes an adjusting mechanism connected to the movable plates in a one-to-one correspondence, and the adjusting mechanism is used to drive the corresponding movable plate to fold up and down relative to the annular mounting portion.
[0022] Optionally, the adjustment mechanism includes:
[0023] A lifting rod passes through the bottom of the outer cavity and is movably connected to the bottom of the outer cavity, and the top of the lifting rod is slidably connected to the corresponding movable plate;
[0024] The first driving source is connected to the bottom end of the lifting rod and is used to drive the lifting rod to move up and down, so as to drive the corresponding movable plate to fold up and down.
[0025] Optionally, the movable plate is provided with a through slot extending in a direction away from the mounting portion;
[0026] The top end of the lifting rod is a dumbbell-shaped structure, and the dumbbell-shaped structure can be slidably fitted in the through slot;
[0027] The annular shielding structure also includes:
[0028] A shielding member corresponding to each of the through slots, the shielding member being used to shield a heat source passing through the through slots.
[0029] Optionally, the adjustment mechanism further includes:
[0030] The first bellows, the lifting rod is sleeved in the first bellows, and is movably connected to the bottom of the outer cavity through the first bellows.
[0031] Optionally, the reflective structure includes:
[0032] An annular bottom wall is sleeved on the outside of the lifting shaft and is located below the annular heating element;
[0033] The cylindrical side wall is arranged along the inner side wall of the outer cavity and connected to the outer edge of the annular bottom wall.
[0034] Optionally, the bearing structure further includes:
[0035] A fixing seat connected to the outside of the bottom of the outer cavity;
[0036] A lifting seat, slidably connected to the fixing seat up and down, and connected to the bottom end of the lifting shaft;
[0037] The second driving source is used to drive the lifting seat to move up and down.
[0038] Optionally, the bearing structure further includes:
[0039] A second bellows, wherein the lifting sleeve is arranged in the second bellows and is connected to the through hole in a liftable manner through the second bellows.
[0040] In a second aspect, an embodiment of the present application provides a semiconductor processing device, including a process chamber as described in the above embodiments.
[0041] As described above, in the process chamber of the present application, an annular heating element and a reflecting structure are arranged in the outer cavity. The reflecting structure can reflect the heat source toward the inner cavity to heat the inner cavity. Under the heat preservation of the outer cavity, the gas in the inner cavity can maintain a higher temperature. The annular shielding structure is arranged between the annular heating element and the heating base to shield the heat source. The adjusting device is connected to the annular shielding structure to adjust the shielding range of the annular shielding structure to adjust the area of the heating base irradiated by the heat source. When the heating base is blocked in the transfer window and contacts the inner cavity, due to heat transfer, the temperature of the edge area of the heating base is lower than the temperature of the middle area. At this time, the annular shielding structure can be adjusted by the adjusting device so that the annular heating element can directly irradiate the corresponding area of the heating base for heating. When the overall temperature difference of the heating base is heated to within the preset range, the annular shielding structure can be adjusted to completely shield the annular heating element to prevent the annular heating element from continuously heating the heating base and causing temperature out of control. The present application can make additional compensation for the temperature of the heating base to improve the temperature uniformity of the heating base. BRIEF DESCRIPTION OF THE DRAWINGS
[0042] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.
[0043] Figure 1 It is a structural schematic diagram of a process chamber of a comparative example provided by the applicant during the research and development process;
[0044] Figure 2 It is a schematic diagram of the arrangement structure of the heating wire inside the heating base;
[0045] Figure 3 yes Figure 1 A schematic diagram of a temperature distribution when a process chamber heats a susceptor surface during application;
[0046] Figure 4 is a schematic structural diagram of a process chamber provided in an embodiment of the present application;
[0047] Figure 5 is a schematic cross-sectional structural diagram of a bearing structure provided in an embodiment of the present application;
[0048] Figure 6 It is a schematic diagram of an adjustment method of an annular shielding structure provided in an embodiment of the present application;
[0049] Figure 7is a schematic diagram of a partial three-dimensional structure of an annular shielding structure provided in an embodiment of the present application;
[0050] Figure 8 yes Figure 7 A schematic diagram of a partial cross-sectional structure;
[0051] Fig. 9 A schematic diagram of a top view of an annular shielding structure provided in an embodiment of the present application.
[0052] The realization of the purpose, functional features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. The above-mentioned drawings have shown clear embodiments of this application, which will be described in more detail later. These drawings and textual descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0053] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0054] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.
[0055] It should be further understood that the terms "comprising" and "including" indicate the presence of the described features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or", "and / or", "including at least one of the following", etc. used in this application may be interpreted as inclusive, or mean any one or any combination. For example, "including at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C", and for another example, "A, B or C" or "A, B and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.
[0056] It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this document, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless otherwise indicated in the context.
[0057] It should be understood that the orientations or positional relationships indicated by terms such as "top", "bottom", "up", "down", "vertical", and "horizontal" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0058] For ease of description, in the following embodiments, the orthogonal space formed by the horizontal plane and the vertical direction is used as an example for explanation, and this premise should not be understood as a limitation to the present application.
[0059] See also Figure 1 , Figure 1This is a schematic diagram of the structure of a process chamber of a comparative example provided by the applicant during the research and development process. The process chamber adopts the form of an inner and outer outer cavity. The inner cavity 20a is used as the process chamber. The upper heating element 41a and the lower heating element 42a heat the inner cavity 20a from the upper and lower sides respectively. A reflector 50a is provided below and on the side of the lower heating element 42a to improve the heating efficiency of the inner cavity 20a. The inner cavity 20a is kept at a relatively high temperature as a whole to prevent condensation. The outer cavity 10a is used as a protective chamber to better solve the cold spot problem. When performing thin film deposition, the interior of the entire outer cavity 10a is a vacuum environment. The heating base 30a seals the inner cavity 20a from the bottom. The wafer 101a is placed on the heating base 30a. Please refer to Figure 2 , Figure 2 It is a schematic diagram of the arrangement structure of the heating wire inside the heating base. The wafer 101a is heated to the process required temperature by the heating base 30a. There is an air intake device above the wafer 101a. Taking two-way gas as an example, gas 1 and gas 2 enter the fan-shaped uniform flow cover 21a and the fan-shaped uniform flow disk 22a of the inner cavity 20a from two pipelines respectively, enter the inner cavity 20a after being homogenized and diffuse to the wafer 101a to form a deposited film. In order to prevent the heat of the lower heating element 42a from directly hitting the heating base 30a, resulting in the heating base 30a being underpowered and unable to control the uniformity of the temperature of the heating base 30a, a shading plate 60a is also arranged between the lower heating element 42a and the heating base 30a. The lower heating element 42a is used to heat the inner cavity 20a, and the temperature of the heating base 30a is controlled separately.
[0060] However, the applicant has found that when the wafer 101a is seated on the heating base 30a or in contact with the heating base 30a, the heating base 30a still has a local non-uniform temperature distribution, such as Figure 3 As shown, Figure 3 yes Figure 1 A schematic diagram of temperature distribution of the surface of the heating base when the process chamber is used. According to the applicant's analysis, this temperature non-uniformity mainly comes from the heat loss caused by the contact between the edge of the heating base 30a and the inner cavity 20a. Based on this, the present application provides a process chamber and a semiconductor processing device.
[0061] See also Figure 4 , Figure 4 It is a structural schematic diagram of a process chamber provided in an embodiment of the present application, wherein the process chamber includes an outer cavity 10, an inner cavity 20, a supporting structure 30, an annular heating element 40, a reflecting structure 50, an annular shielding structure 60 and an adjusting device 70.
[0062] The outer cavity 10 has a through hole 11 at the bottom, the inner cavity 20 is disposed in the outer cavity 10, and a transfer window 21 is disposed at the bottom of the inner cavity 20. The supporting structure 30 includes a lifting shaft 31 and a heating base 32. The heating base 32 is used to support and heat the wafer 101. The top of the lifting shaft 31 passes through the through hole 11 and is connected to the heating base 32. The lifting shaft 31 is used to drive the heating base 32 to rise to the transfer window 21 to block the transfer window 21. It should be noted that Figure 4 It is just a schematic diagram. During the process, the transfer window 21 is in a sealed state. As an example, the heating base 32 and the inner cavity 20 can form a step-shaped "concave-convex" matching structure at the transfer window 21. Please refer to Figure 5 , Figure 5 It is a schematic diagram of the cross-sectional structure of a bearing structure provided in an embodiment of the present application. The lifting shaft 31 can be a hollow setting. The cable 311 and the thermocouple 312 both extend from the inside of the lifting shaft 31 to the heating base 32. The cable 311 is used to supply power to the heating wire in the heating base 32. The thermocouple 312 can perform temperature detection on each area of the heating base, so as to determine whether the temperature of the heating base 32 is uniform to achieve heating and temperature control.
[0063] The annular heating element 40 is arranged in the outer cavity 10 and surrounds the lifting shaft 31 to provide a heat source. The annular heating element 40 can be an annular heating tube. The heating principle can be resistance wire heating or infrared heating source. This embodiment is not particularly limited. According to the heating power requirement, the annular heating element 40 can be designed as a single-ring or multi-ring ring. In order to improve the temperature uniformity of the inner cavity 20, an upper annular heating element 80 can also be arranged above the inner cavity 20 to heat the inner cavity 20.
[0064] The reflective structure 50 is arranged in the outer cavity 10 and below the inner cavity 20, and is used to reflect the heat source toward the inner cavity 20. For example, the reflective structure 50 can be made of stainless steel with a bright surface. Taking the reflective structure 50 arranged below the inner cavity 20 as an example, the heat source emitted downward and outward by the annular heating element 40 is irradiated onto the outer cavity 10 and cannot be effectively utilized. By setting the reflective structure 50, this part of the heat source can be reflected upward, including obliquely upward, that is, reflected toward the inner cavity 20, so as to heat the inner cavity 20 and improve the heating efficiency and energy efficiency.
[0065] The annular shielding structure 60 is disposed between the annular heating element 40 and the heating base 32 to shield the heat source, thereby preventing the annular heating element 40 from directly heating the heating base 32 for a long time, causing the heating base 32 to be underpowered and unable to control the uniformity of the temperature of the heating base 32.
[0066] The adjusting device 70 is connected to the annular shielding structure 60 and is used to adjust the shielding range of the annular shielding structure 60 so as to adjust the area of the heating base 32 irradiated by the heat source.
[0067] As described above, the outer cavity 10 of the present application is provided with an annular heating element 40 and a reflecting structure 50, the reflecting structure 50 can reflect the heat source toward the inner cavity 20, heat the inner cavity 20, and the gas in the inner cavity 20 can maintain a relatively high temperature under the heat preservation of the outer cavity 10, and the annular shielding structure 60 is provided between the annular heating element 40 and the heating base 32, which can shield the heat source. The adjusting device 70 adjusts the area of the heating base 32 irradiated by the heat source by adjusting the shielding range of the annular shielding structure 60. When the heating base 32 is blocked in the transfer window 21 and contacts the inner cavity 20, due to heat transfer, the temperature of the edge area of the heating base 32 is lower than the temperature of the middle area. At this time, the annular shielding structure 60 can be adjusted by the adjusting device 70, so that the annular heating element 40 can irradiate the corresponding area of the heating base 32 for heating. When the overall temperature difference of the heating base 32 is heated to within a preset range, the annular shielding structure 60 can be adjusted to completely shield the annular heating element 40 to prevent the annular heating element 40 from continuously heating the heating base 32. It can be understood that the annular heating element 40 can heat the annular area centered on the lifting shaft 31 more evenly.
[0068] Preferably, the preset annular area on the edge of the lower surface of the heating base 32 may be sandblasted to improve the heat absorption capacity of the outer ring of the heating base 32 and thus improve the temperature control efficiency.
[0069] It should be noted that the adjusting device 70 adjusts the annular shielding structure 60 to adjust the area of the heating base 32 irradiated by the heat source, and there may be a variety of adjustment structures. Figure 4 The vertical swing structure shown in FIG. 1 may also be configured as follows: Figure 6 The structure shown performs horizontal reciprocating translation.
[0070] As an example of the above swing structure, please refer to Figure 4 , Figure 7-Figure 9 , Figure 7 is a partial three-dimensional structural diagram of a ring-shaped shielding structure provided in an embodiment of the present application, Figure 8 yes Figure 7 The local cross-sectional structure diagram in Fig. 9The schematic diagram of the top view of a ring-shaped shielding structure provided in an embodiment of the present application, the ring-shaped shielding structure 60 can be a stainless steel plate, and the side of the ring-shaped shielding structure 60 facing the ring-shaped heating element 40 can also be polished to improve the mirror reflection ability. The ring-shaped shielding structure 60 can include an annular mounting portion 61 and at least three movable plates 62. The annular mounting portion 61 is arranged between the annular heating element 40 and the lifting shaft 31, and the movable plates 62 are connected to the annular mounting portion 61 and are distributed along the circumference of the annular mounting portion 61 on the outside of the annular mounting portion 61. The movable plate 62 can be folded up and down relative to the annular mounting portion 61, and there is at least one folding angle that can completely prevent the heat source from irradiating the heating base 32. The projections of all movable plates 62 in the vertical direction form a circular ring, so that the gap between two adjacent movable plates 62 can be avoided. Light leakage, preferably, there is no gap between the projections of two adjacent movable plates 62 in the vertical direction. For example, the maximum outer diameter of the annular heating element 40 can be set to be no greater than the outer diameter of the heating base 32, the movable plate 62 can be fan-shaped, and its diameter can be slightly larger than the outer diameter of the heating base 32, adjacent movable plates 62 are staggered up and down in the height direction and partially overlap to avoid light leakage, and a suitable spacing is maintained between the movable plate 62 and the heating base 32 so that when the movable plate 62 is in a horizontal state, the heat source reflected by the reflective structure 50 just cannot irradiate the heating base 32.
[0071] In one embodiment, the annular mounting portion 61 may be an annular side panel 61, which is used to prevent the heat source from irradiating the lifting shaft 31; all movable panels 62 are hinged to the top of the annular side panel 61. In this embodiment, the annular side panel 61 can be used to block the heat source from irradiating the lifting shaft 31, thereby preventing the lifting shaft 31 from transferring heat to the heating base 32 and affecting the temperature control.
[0072] As an example, the cross section of the annular side panel 61 can be a circle, a polygon or other irregular shapes. Preferably, the annular side panel 61 is a regular polygon, and the number of sides is the same as the number of the movable panel 62. As an example, the annular side panel 61 can be formed into an annular shape by gradually bending a flat plate and finally welding it. For example, Fig. 9 There are six middle movable plates 62, and the cross section of the annular side panel 61 is a regular hexagon. The movable plates 62 are hingedly connected to each side of the side panel 61 in a one-to-one correspondence, so that the movable plates 62 can be folded up and down relative to the side panel 61. The annular side panel 61 can be made of a stainless steel sheet with a thickness of 1-2 mm. The annular side panel 61 surrounds the outside of the lifting shaft 31, and the lower end can be fixed to the bottom of the outer cavity 10 by screws.
[0073] It should be noted that the adjustment device 70 is used to drive the movable plate 62 to fold up and down relative to the annular mounting portion 61. For example, the adjustment device 70 may be provided with only one driving source, which is respectively connected to all the movable plates 62 through a transmission structure to drive all the movable plates 62 to swing upward or downward synchronously. For example, the transmission structure may include a lifting shaft, and each movable plate 62 is connected to the lifting shaft 31 through a connecting rod structure, similar to the support frame of an umbrella.
[0074] The adjusting device 70 of the above structure can only be adjusted synchronously. Figure 3 When the temperature is uneven, it is impossible to control a certain movable plate 62 to adjust the temperature. The embodiment of the present application provides a better adjustment device structure. Please continue to refer to Figure 4 The adjusting device 70 may include an adjusting mechanism 71 connected to the movable plates 62 in a one-to-one correspondence, and the adjusting mechanism 71 is used to drive the corresponding movable plates 62 to fold up and down relative to the annular mounting portion 61. In this embodiment, the folding angle of each movable plate 62 can be individually controlled according to the uneven temperature on the heating base 32, so that the edge of the heating base 32 can be heated and controlled more accurately.
[0075] As an example, see Figure 4 , the adjustment mechanism 71 may include a lifting rod 711 and a first driving source 712. The lifting rod 711 passes through the bottom of the outer cavity 10 and is movably connected to the bottom of the outer cavity 10 up and down, and the top of the lifting rod 711 is slidably connected to the corresponding movable plate 62. The first driving source 712 is connected to the bottom end of the lifting rod 711, and is used to drive the lifting rod 711 to move up and down, so as to drive the corresponding movable plate 62 to fold up and down. For example, when the angle between the movable plate 62 and the annular mounting portion 61 is 90°, the movable plate 62 just completely blocks the heat source from directly heating the heating base. When the movable plate 62 is folded downward so that the above angle is less than 90°, the heat of the annular heating element 40 can be reflected to the lower surface of the heating base 32 directly or through the reflection structure 50. The smaller the angle, the larger the area of heat compensation on the heating base 32.
[0076] For example, a dovetail groove may be provided on the bottom surface of the movable plate 62, the dovetail groove extending to the edge of the movable plate 62 in a direction away from the side panel 61, and a matching slider may be provided in the dovetail groove, and the top end of the lifting rod 711 may be hinged to the slider.
[0077] As another example of a slidable connection between the lifting rod 711 and the movable plate 62, please continue to refer to Figure 7-Figure 9, a through slot 621 extending away from the side panel 61 may be provided on the movable plate 62, and the top end of the lifting rod 711 is a dumbbell-shaped structure, which can be slidably fitted in the through slot 621. The annular shielding structure 60 may also include a shielding member 63 corresponding to the through slot 621, and the shielding member 63 is used to shield the heat source passing through the through slot 621, that is, the shielding member 63 can prevent the heat source emitted by the annular heating member 40 from irradiating the heating base 32 through the through slot 621, causing local temperature unevenness.
[0078] In one embodiment, the adjustment mechanism 71 may further include a first bellows 713, the lifting rod 711 is sleeved in the first bellows 713, and is movably connected to the bottom of the outer cavity 10 through the first bellows 713. At the same time, the first bellows 713 may also seal the connection between the lifting rod 711 and the bottom of the outer cavity 10.
[0079] In one embodiment, please refer to Figure 4 The reflective structure 50 may include an annular bottom wall 51 and a cylindrical side wall 52. The annular bottom wall 51 is sleeved outside the lifting shaft 31 and is located below the annular heating element 40. The cylindrical side wall 52 is arranged along the inner side wall of the outer cavity 10 and connected to the outer edge of the annular bottom wall 51. The reflective structure 50 of this embodiment reflects the heat source emitted by the annular heating element 40 from below and from the side, which can improve the heating efficiency and the energy efficiency of the annular heating element 40.
[0080] In one embodiment, please refer to Figure 4 The bearing structure 30 may further include a fixed seat 33, a lifting seat 34, and a second driving source 35. The fixed seat 33 is connected to the outside of the bottom of the outer cavity 10. The lifting seat 34 is connected to the fixed seat 33 in a sliding manner up and down, and is connected to the bottom end of the lifting shaft 31. For example, a vertical slide rail may be provided on the fixed seat 33, and the lifting seat 34 may be a slider fitted in the slide rail, and the bottom end of the lifting shaft 31 is connected to the slider. The second driving source 35 is used to drive the lifting seat 34 to move up and down, so that the heating base 32 may be driven to move up and down through the lifting shaft 31. In order to achieve the sealing of the bottom connection between the lifting shaft 31 and the outer cavity 10, the bearing structure 30 may further include a second bellows 36. The lifting shaft 31 is sleeved in the second bellows 36, and is connected to the through hole 11 at the bottom of the outer cavity 10 in a lifting manner through the second bellows 36.
[0081] For other working principles and processes of the semiconductor processing equipment of this embodiment, please refer to the description of the process chamber in the aforementioned embodiment of the present invention, which will not be repeated here.
[0082] The above is a detailed introduction to a process chamber and a semiconductor processing device provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. It should be noted that in the present application, the descriptions of various embodiments have different focuses. For parts that are not described or recorded in detail in a particular embodiment, please refer to the relevant descriptions of other embodiments.
[0083] The above are only preferred embodiments of the present application, and the patent scope of the present application is not limited thereto. The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of this application, or directly or indirectly used in other related technical fields, as long as there is no contradiction in the combination of these technical features, are equally included in the patent protection scope of the present application.
Claims
1. A process chamber, characterized in that: include: An outer cavity, wherein the bottom of the outer cavity has a through hole; An inner cavity is arranged in the outer cavity, and a transfer window is provided at the bottom of the inner cavity; The bearing structure includes a lifting shaft and a heating base, wherein the heating base is used to bear and heat the wafer, the top end of the lifting shaft passes through the through hole and is connected to the heating base, and the lifting shaft is used to drive the heating base to rise to the transfer window to block the transfer window; An annular heating element, disposed in the outer cavity and surrounding the lifting shaft, for providing a heat source; A reflective structure, disposed in the outer cavity and below the inner cavity, for reflecting the heat source toward the inner cavity; An annular shielding structure, disposed between the annular heating element and the heating base, for shielding the heat source; An adjusting device is connected to the annular shielding structure and is used to adjust the shielding range of the annular shielding structure so as to adjust the area of the heating base irradiated by the heat source.
2. The process chamber according to claim 1, characterized in that: The annular shielding structure comprises: An annular mounting portion, disposed between the annular heating element and the lifting shaft; At least three movable plates are connected to the annular mounting portion and are distributed along the circumference of the annular mounting portion on the outside of the annular mounting portion. The movable plates can be folded up and down relative to the annular mounting portion, and at least one folding angle can completely prevent the heat source from irradiating the heating base; the projections of all the movable plates in the vertical direction form a circular ring; The adjusting device is used to drive the movable plate to fold up and down relative to the annular side panel.
3. The process chamber according to claim 2, characterized in that: There is no gap between the projections of two adjacent movable panels in the vertical direction.
4. The process chamber according to claim 2, characterized in that: The annular mounting portion is an annular side panel, which is used to prevent the heat source from irradiating the lifting shaft; The at least three movable panels are hinged to the top of the annular side panel.
5. The process chamber according to claim 2, characterized in that: The adjusting device comprises an adjusting mechanism connected to the movable plates in a one-to-one correspondence, and the adjusting mechanism is used to drive the corresponding movable plates to fold up and down relative to the annular mounting portion.
6. The process chamber according to claim 5, characterized in that: The regulating mechanism comprises: A lifting rod passes through the bottom of the outer cavity and is movably connected to the bottom of the outer cavity, and the top of the lifting rod is slidably connected to the corresponding movable plate; The first driving source is connected to the bottom end of the lifting rod and is used to drive the lifting rod to move up and down, so as to drive the corresponding movable plate to fold up and down.
7. The process chamber according to claim 6, characterized in that: The movable plate is provided with a through slot extending in a direction away from the mounting portion; The top end of the lifting rod is a dumbbell-shaped structure, and the dumbbell-shaped structure can be slidably fitted in the through slot; The annular shielding structure also includes: A shielding member corresponding to each of the through slots, the shielding member being used to shield a heat source passing through the through slots.
8. The process chamber according to claim 6, characterized in that: The regulating mechanism also includes: The first bellows, the lifting rod is sleeved in the first bellows, and is movably connected to the bottom of the outer cavity through the first bellows.
9. The process chamber according to claim 1, characterized in that: The reflective structure comprises: An annular bottom wall is sleeved on the outside of the lifting shaft and is located below the annular heating element; The cylindrical side wall is arranged along the inner side wall of the outer cavity and connected to the outer edge of the annular bottom wall.
10. The process chamber according to claim 1, characterized in that: The bearing structure further comprises: A fixing seat connected to the outside of the bottom of the outer cavity; A lifting seat, slidably connected to the fixing seat up and down, and connected to the bottom end of the lifting shaft; The second driving source is used to drive the lifting seat to move up and down.
11. The process chamber according to claim 10, characterized in that: The bearing structure further comprises: A second bellows, wherein the lifting sleeve is arranged in the second bellows and is connected to the through hole in a liftable manner through the second bellows.
12. A semiconductor processing device, characterized in that: A process chamber comprising any one of claims 1-11.