A multi-station photolithography machine silicon wafer stage system

Abstract

The present invention discloses a multi-station photolithography machine silicon wafer stage system, which relates to the technical field of photolithography machines, including a driving ring, a plurality of follower frames arranged equidistantly along a circular trajectory are arranged above the driving ring, a wafer carrier that can move synchronously with the follower frames is provided on the plurality of follower frames, and each follower frame is connected to the driving ring through a first synchronization unit, and when the driving ring rotates, the plurality of follower frames move synchronously along the diameter direction of the driving ring until the wafer carrier is located at a switching position between a processing and a unloading station. The present invention forms a multi-station structure to facilitate loading of a plurality of wafers, so that the photolithography machine can perform processing operations on a plurality of wafers. At the same time, a plurality of wafer carriers can be quickly moved, so that the wafer carrier can quickly switch positions between a processing station and an unloading station, thereby improving the efficiency of the position switching operation of a plurality of wafers in the multi-station structure, and thereby improving the efficiency of the photolithography machine in the process of performing processing operations on the wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of photolithography machines, and in particular to a multi-station photolithography machine silicon wafer stage system. Background Art

[0002] A photolithography machine is a commonly used device in the semiconductor industry. It is used to transfer the chip circuit diagram on the mask to the silicon wafer. It is the core link of IC manufacturing. The working principle of the photolithography machine is to use the light emitted by the photolithography machine to expose the thin film coated with photoresist through the mask with a pattern. The photoresist will change its properties after being exposed to light, so that the pattern on the mask is copied to the thin film, so that the thin film has the function of an electronic circuit diagram. Wafers are circular thin films of semiconductor materials, usually 12 inches or larger in diameter. During the photolithography process, the wafer is placed in the photolithography machine and the circuit pattern is transferred by ultraviolet light. This process is called photolithography.

[0003] Most of the existing photolithography machine processing tables used for wafers can only carry one wafer. After the photolithography machine is completed, if it is necessary to continue processing the next wafer, the processed wafer needs to be taken out and then a new wafer to be processed needs to be installed by a robotic arm or manually. If it is used in a processing environment for multiple wafers, the time consumed in the process of continuously unloading and loading the wafers is long, which affects the processing efficiency. Therefore, the present application provides a multi-station photolithography machine silicon wafer table system to meet the needs. Summary of the invention

[0004] In response to the above problems, the present application provides a multi-station lithography machine silicon wafer stage system.

[0005] To achieve the above-mentioned objectives, the present application provides the following technical solutions: a multi-station lithography machine silicon wafer stage system, comprising a driving ring, above which is provided a plurality of follower frames equidistantly arranged along a circular trajectory, on which are provided a wafer carrier that can move synchronously therewith, and each follower frame is connected to the driving ring through a first synchronization unit, and when the driving ring rotates, the plurality of follower frames move synchronously along the diameter direction of the driving ring until the wafer carrier is located at a switching position between processing and unloading stations.

[0006] It also includes a suction cup arranged on the unloading station, a lifting arm equipped with the suction cup, and a second power shaft capable of controlling the rotation of the lifting arm. The second power shaft is connected to the driving ring through a second synchronization unit. As the driving ring rotates, the suction cup can move on the unloading station to transfer the wafer on the wafer carrier.

[0007] Furthermore, the first synchronization unit includes a first linkage gear and a guide gear located above the first linkage gear, the first linkage gear and the guide gear are connected through a synchronization shaft, the outer periphery of the driving ring is provided with an outer gear ring meshing with multiple first linkage gears, and the inner side of the follower frame is provided with a transmission rack meshing with the guide gear, when the driving ring and the outer gear ring rotate synchronously, the first linkage gear and the guide gear rotate synchronously until the transmission rack, the follower frame and the wafer carrier move synchronously.

[0008] Furthermore, a driving frame, a base for carrying the driving frame, and a driver for controlling the rotation of the driving frame are provided below the driving ring.

[0009] The base is provided with a plurality of connection platforms arranged equidistantly along a circular trajectory, support arms distributed on both sides of the follower frame, and guide rails arranged on the support arms. Both sides of the follower frame are provided with follower roller groups adapted to the guide rails. When the wafer carrier moves, the follower roller groups are located inside the guide rails and move.

[0010] Furthermore, the second synchronization unit includes a second linkage gear, a first power shaft arranged at the center axis position of the second linkage gear and a driving wheel arranged on the first power shaft, and an inner gear ring meshing with multiple second linkage gears is arranged on the inner side of the drive ring.

[0011] The driving wheel is connected to the driven wheel through a synchronous belt, and the driven wheel is arranged on the second power shaft. When the driving ring and the inner gear ring rotate synchronously, the second linkage gear rotates synchronously with the driving wheel until the second power shaft and the driven wheel rotate.

[0012] Furthermore, the first power shaft is connected to the synchronous shaft through a balancing frame, the synchronous belt passes through the synchronous shaft, the synchronous shaft and the second power shaft are both arranged on a connecting table, the balancing frame is arranged on the connecting table, and the central axes of the synchronous shaft, the first power shaft and the second power shaft are all located on the same straight path.

[0013] Furthermore, a cylinder is provided on the second power shaft, and the lifting arm is located at the output end of the cylinder. When the lifting arm moves up and down, the suction cup with the wafer adsorbed thereon can move up and down synchronously.

[0014] Furthermore, a threaded rod that can rotate synchronously with the first power shaft is installed at the bottom end of the first power shaft, a reinforcement frame that can accommodate the threaded rod is provided on the balance frame, an extension bar that can move up and down is provided on the threaded rod, and a positioning block is provided at one end of the extension bar facing the driving ring, and an alignment plate that can be connected to the positioning block is provided at the bottom end of the follower frame. When the follower frame moves from the unloading station to the processing station, the positioning block and the alignment plate are in a docking state.

[0015] Furthermore, a pair of guide rods are provided at the bottom end of the reinforcement frame, and a sliding bar which is sleeved with the guide rods is provided on the extension bar. As the extension bar rises and falls, the sliding bar moves along the distribution direction of the guide rods.

[0016] In summary, the technical effects and advantages of the present invention are as follows:

[0017] 1. The present invention can form a multi-station structure by combining multiple wafer stages and follower frames to facilitate loading of multiple wafers, so that the photolithography machine can perform processing operations on multiple wafers. At the same time, multiple wafer stages can be quickly moved, so that the wafer stages can quickly switch positions in the processing station and the unloading station, thereby improving the efficiency of the position switching operation of multiple wafers in the multi-station structure, and further improving the efficiency of the photolithography machine in the process of performing processing operations on the wafers.

[0018] 2. In the process of moving the follower frame, the wafer stage and the wafer, the present invention can control the synchronous movement of the lifting arm and the suction cup, so that the lifting arm and the suction cup can be docked and offset with the unloading station as the wafer stage moves, and the unloading operation can be performed on multiple unloading stations simultaneously, thereby improving the unloading efficiency of multiple wafers in the multi-station system. This makes it easier to perform material replacement operations on the wafer stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0021] Figure 2 It is a schematic structural diagram of the shell of the present invention from a second viewing angle.

[0022] Figure 3 This is a schematic diagram of the structure of the base after disassembly of the present invention.

[0023] Figure 4 This is a schematic diagram of the structure from a second viewing angle after the base of the present invention is disassembled.

[0024] Figure 5 It is a schematic diagram of the connection between the outer gear ring, the inner gear ring, the first linkage gear and the second linkage gear of the present invention.

[0025] Figure 6 This is a schematic diagram of the connection of the outer gear ring, the inner gear ring, the first linkage gear and the second linkage gear from a second perspective of the present invention.

[0026] Figure 7 It is a schematic diagram of the positions of the first linkage gear, the second linkage gear and the follower frame of the present invention.

[0027] Figure 8 It is a schematic diagram of the second viewing angle position of the first linkage gear, the second linkage gear and the follower frame of the present invention.

[0028] Fig. 9 It is a schematic diagram of the state when the wafer carrier of the present invention moves to the unloading position.

[0029] In the figure: 1. driving ring; 101. outer gear ring; 102. inner gear ring; 103. driving frame; 104. driver; 2. base; 201. connecting table; 202. support arm; 203. guide rail; 3. first linkage gear; 4. guide gear; 5. synchronization shaft; 6. follower frame; 601. transmission rack; 602. follower roller group; 603. alignment plate; 7. wafer carrier; 8. second linkage gear; 9. first power shaft; 10. driving rotary wheel; 11. second power shaft; 12. driven rotary wheel; 13. synchronous belt; 14. cylinder; 15. lifting arm; 16. suction cup; 17. threaded rod; 18. extension bar; 1801. sliding bar; 19. positioning block; 20. balance frame; 21. reinforcement frame; 2101. guide rod. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Example 1: Reference Figure 1-4 A multi-station photolithography machine wafer stage system is shown, comprising a driving ring 1, a plurality of follower frames 6 arranged equidistantly along a circumferential track are provided above the driving ring 1, and a wafer carrier 7 which can move synchronously with the follower frames 6 is provided on the plurality of follower frames 6. The combination of the plurality of wafer carriers 7 and the plurality of follower frames 6 can form a multi-station structure to achieve the purpose of loading a plurality of wafers at the same time, so that the photolithography machine can perform processing operations on a plurality of wafers.

[0032] Each follower frame 6 is connected to the driving ring 1 through a first synchronization unit. When the driving ring 1 rotates, multiple follower frames 6 move synchronously along the diameter direction of the driving ring 1 until the wafer carrier 7 is located at a switching position between the processing and unloading stations.

[0033] It also includes a suction cup 16 arranged on the unloading station, a lifting arm 15 equipped with the suction cup 16, and a second power shaft 11 that can control the rotation of the lifting arm 15. The second power shaft 11 is connected to the driving ring through a second synchronization unit. As the driving ring 1 rotates, the suction cup 16 can move on the unloading station to transfer the wafer on the wafer carrier 7 and perform unloading operations on the wafer.

[0034] Specifically, the first synchronization unit includes a first linkage gear 3 and a guide gear 4 located above the first linkage gear 3. The first linkage gear 3 and the guide gear 4 are connected through a synchronization shaft 5. The outer periphery of the driving ring 1 is provided with an outer gear ring 101 meshing with a plurality of first linkage gears 3. The inner side of the follower frame 6 is provided with a transmission rack 601 meshing with the guide gear 4. When the driving ring 1 and the outer gear ring 101 rotate synchronously, the first linkage gear 3 and the guide gear 4 rotate synchronously until the transmission rack 601, the follower frame 6 and the wafer carrier 7 move synchronously. During the movement, the follower frame 6 and the wafer carrier 7 can carry the wafer to reciprocate between the processing station and the unloading station to achieve the purpose of switching the wafer position.

[0035] Through the setting of the first synchronization unit, multiple wafer carriers 7 can be quickly and synchronously moved to quickly switch the positions of multiple wafers, perform material unloading operations on multiple wafers, and improve the operating efficiency of wafer switching positions at multiple stations. Improve the efficiency of the photolithography machine in the process of processing wafers.

[0036] like Figure 5 , Figure 6 As shown, a driving frame 103, a base 2 for carrying the driving frame 103, and a driver 104 for controlling the rotation of the driving frame 103 are provided below the driving ring 1. When the driver 104 is running, the driving frame 103 and the driving ring 1 can be controlled to rotate synchronously.

[0037] The base 2 is provided with a plurality of connection platforms 201 arranged equidistantly along a circumferential track, support arms 202 distributed on both sides of the follower frame 6, and guide rails 203 provided on the support arms 202. Both sides of the follower frame 6 are provided with follower roller groups 602 adapted to the guide rails 203. When the wafer stage 7 moves, the follower roller group 602 moves inside the guide rails 203. The combination of the wafer stage 7 and the follower roller group 602 can maintain the stability of the follower frame 6 and the wafer stage 7 during the movement.

[0038] like Figure 7-9 As shown, the second synchronization unit includes a second linkage gear 8, a first power shaft 9 arranged at the center axis position of the second linkage gear 8 and a driving wheel 10 arranged on the first power shaft 9, and an inner gear ring 102 meshing with multiple second linkage gears 8 is provided on the inner side of the drive ring 1.

[0039] The driving wheel 10 is connected to the driven wheel 12 through the synchronous belt 13. The driven wheel 12 is arranged on the second power shaft 11. In the top view, when the driving ring 1 and the outer gear ring 101 rotate synchronously, and the follower frame 6 and the wafer carrier 7 move from the processing station to the unloading station, the driving ring 1 rotates in the clockwise direction, and the first linkage gear 3 and the guide gear 4 rotate in the counterclockwise direction. Since the inner gear ring 102 also rotates synchronously with the driving ring 1, the second linkage gear 8, the first power shaft 9 and the driving wheel 10 all rotate synchronously in the clockwise direction. Under the connection of the synchronous belt 13, the second power shaft 11 and the driven wheel 12 also rotate in the clockwise direction. The rotation of the second power shaft 11 can make the lifting arm 15 rotate to the top of the unloading station.

[0040] On the contrary, when the follower frame 6 and the wafer stage 7 move from the unloading station to the processing station, the first linkage gear 3 and the guide gear 4 rotate in the clockwise direction, the second linkage gear 8, the first power shaft 9 and the driving wheel 10 all rotate synchronously in the counterclockwise direction, and the second power shaft 11 and the driven wheel 12 also rotate in the counterclockwise direction. The rotation of the second power shaft 11 can make the lifting arm 15 rotate away from the unloading station.

[0041] like Figure 7 , Figure 8 As shown, in order to maintain the stability of the first power shaft 9, the first power shaft 9 is connected to the synchronous shaft 5 through the balance frame 20, and the synchronous belt 13 passes through the synchronous shaft 5 without affecting the rotation of the synchronous shaft 5. In order to maintain the stability of the synchronous shaft 5 and the second power shaft 11, the synchronous shaft 5 and the second power shaft 11 are both arranged on the connection table 201, and the balance frame 20 is arranged on the connection table 201. The central axes of the synchronous shaft 5, the first power shaft 9 and the second power shaft 11 are all located on the same straight path, which is the moving path of the wafer carrier 7.

[0042] It is worth mentioning that when the follower frame 6 carries the wafer stage 7 and moves from the processing station to the unloading station, in order to allow the suction cup 16 to smoothly descend to absorb the wafer and then control the wafer to be separated from the wafer stage 7, a cylinder 14 is provided on the second power shaft 11, and the lifting arm 15 is located at the output end of the cylinder 14. When the lifting arm 15 moves up and down, the suction cup 16 with the wafer absorbed can be synchronously raised and lowered. After the suction cup 16 descends to absorb the wafer and controls the wafer to be separated from the wafer stage 7, the wafer to be processed can be filled into the unloaded wafer stage 7 to implement the loading operation.

[0043] When the follower frame 6 carrying the wafer carrier 7 and the wafer to be processed moves from the unloading station to the processing station, as the driven wheel 12 and the second power shaft 11 rotate, the lifting arm 15 controls the suction cup 16 and the wafer to move away from the unloading station until the wafer reaches the subsequent wafer receiving station.

[0044] Example 2: Figure 8 As shown, on the basis of Example 1, a threaded rod 17 which can rotate synchronously with the first power shaft 9 is installed at the bottom end, a reinforcing frame 21 which can accommodate the threaded rod 17 is provided on the balance frame 20, an extension bar 18 which can rise and fall is provided on the threaded rod 17, and a positioning block 19 is provided at one end of the extension bar 18 facing the drive ring 1, and a positioning plate 603 which can be connected with the positioning block 19 is provided at the bottom end of the follower frame 6. When the follower frame 6 carries the wafer carrier 7 and moves from the unloading station to the processing station, since the first linkage gear 3 and the guide gear are in a rotating state, the second linkage gear 8 is also in a rotating state, and the threaded rod 17 connected to the first power shaft 9 is also in a rotating state. Therefore, the extension bar 18 rises, and the positioning block 19 is in a docking state with the positioning plate 603. On the contrary, when the follower frame 6 carries the wafer carrier 7 and moves from the processing station to the unloading station, the extension bar 18 falls, and the positioning block 19 is separated from the positioning plate 603.

[0045] In this embodiment, by docking the positioning block 19 with the alignment plate 603, the wafer carrier 7 carrying the wafer can be effectively prevented from shaking or shifting due to the vibration generated by the operation of the machine. The follower frame 6 and the wafer carrier 7 can maintain stability during the processing of the wafer, further ensuring the stability of the wafer carrier during the processing operation.

[0046] In order to maintain the stability of the extension bar 18 during movement, a pair of guide rods 2101 are provided at the bottom end of the reinforcement frame 21, and a sliding bar 1801 is provided on the extension bar 18, which is sleeved with the guide rods 2101. As the extension bar 18 rises and falls, the sliding bar 1801 moves along the distribution direction of the guide rods 2101. This can effectively prevent the extension bar 18 from deflecting or shaking when carrying the positioning block 19, and ensure the accuracy of the positioning block 19 and the alignment plate 603 when docking.

[0047] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-station photolithography machine silicon wafer stage system, characterized in that: It comprises a driving ring (1), a plurality of follower frames (6) arranged equidistantly along a circular track are provided above the driving ring (1), a wafer carrier (7) which can move synchronously with the follower frames (6) is provided on the plurality of follower frames (6), and each follower frame (6) is connected to the driving ring (1) via a first synchronization unit, and when the driving ring (1) rotates, the plurality of follower frames (6) move synchronously along the diameter direction of the driving ring (1) until the wafer carrier (7) is located at a switching position between a processing station and a material unloading station; It also includes a suction cup (16) disposed on the unloading station, a lifting arm (15) equipped with the suction cup (16), and a second power shaft (11) capable of controlling the rotation of the lifting arm (15); the second power shaft (11) is connected to the drive ring via a second synchronization unit; as the drive ring (1) rotates, the suction cup (16) can be moved on the unloading station to transfer the wafer on the wafer carrier (7).

2. The multi-station lithography machine wafer stage system according to claim 1, characterized in that: The first synchronization unit comprises a first linkage gear (3) and a guide gear (4) located above the first linkage gear (3); the first linkage gear (3) and the guide gear (4) are connected via a synchronization shaft (5); an outer gear ring (101) meshing with a plurality of first linkage gears (3) is provided on the outer periphery of the drive ring (1); a transmission rack (601) meshing with the guide gear (4) is provided on the inner side of the follower frame (6); when the drive ring (1) and the outer gear ring (101) rotate synchronously, the first linkage gear (3) and the guide gear (4) rotate synchronously until the transmission rack (601), the follower frame (6) and the wafer carrier (7) move synchronously.

3. The multi-station lithography machine wafer stage system according to claim 2, characterized in that: A driving frame (103), a base (2) capable of carrying the driving frame (103), and a driver (104) capable of controlling the rotation of the driving frame (103) are provided below the driving ring (1); The base (2) is provided with a plurality of connection platforms (201) arranged at equal intervals along a circular track, support arms (202) distributed on both sides of a follower frame (6), and guide rails (203) arranged on the support arms (202); both sides of the follower frame (6) are provided with follower roller groups (602) adapted to the guide rails (203); when the wafer carrier (7) moves, the follower roller groups (602) are located inside the guide rails (203) and move.

4. The multi-station lithography machine wafer stage system according to claim 3, characterized in that: The second synchronization unit comprises a second linkage gear (8), a first power shaft (9) arranged at the center axis position of the second linkage gear (8), and a driving rotating wheel (10) arranged on the first power shaft (9); an inner gear ring (102) meshing with a plurality of second linkage gears (8) is arranged on the inner side of the drive ring (1); The driving rotating wheel (10) is connected to the driven rotating wheel (12) via a synchronous belt (13); the driven rotating wheel (12) is arranged on the second power shaft (11); when the driving ring (1) and the inner gear ring (102) rotate synchronously, the second linkage gear (8) rotates synchronously with the driving rotating wheel (10) until the second power shaft (11) and the driven rotating wheel (12) rotate.

5. The multi-station photolithography machine wafer stage system according to claim 4, characterized in that: The first power shaft (9) is connected to the synchronous shaft (5) via a balancing frame (20); the synchronous belt (13) passes through the synchronous shaft (5); the synchronous shaft (5) and the second power shaft (11) are both arranged on a connection platform (201); the balancing frame (20) is arranged on the connection platform (201); and the central axes of the synchronous shaft (5), the first power shaft (9) and the second power shaft (11) are all located on the same straight path.

6. The multi-station photolithography machine wafer stage system according to claim 4, characterized in that: The second power shaft (11) is provided with a cylinder (14), and the lifting arm (15) is located at the output end of the cylinder (14). When the lifting arm (15) moves up and down, the suction cup (16) with the wafer adsorbed thereon can move up and down synchronously.

7. The multi-station photolithography machine wafer stage system according to claim 5, characterized in that: A threaded rod (17) is mounted at the bottom end of the first power shaft (9) and is rotatable synchronously therewith; a reinforcing frame (21) is arranged on the balancing frame (20) and is capable of accommodating the threaded rod (17) to pass through; an extension bar (18) is arranged on the threaded rod (17) and is capable of ascending and descending movement; a positioning block (19) is arranged at one end of the extension bar (18) facing the driving ring (1); a positioning plate (603) is arranged at the bottom end of the follower frame (6) and is capable of being connected to the positioning block (19); when the follower frame (6) moves from a material unloading station to a processing station, the positioning block (19) and the positioning plate (603) are in a docking state.

8. The multi-station lithography machine wafer stage system according to claim 7, characterized in that: A pair of guide rods (2101) are provided at the bottom end of the reinforcement frame (21), and a sliding bar (1801) is provided on the extension bar (18) and is sleeved with the guide rods (2101). As the extension bar (18) moves up and down, the sliding bar (1801) moves along the distribution direction of the guide rods (2101).

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