Water-cooling heat dissipation device

Abstract

The invention relates to a water-cooling heat dissipation device which comprises a water-cooling head, a water-cooling row containing working liquid and two water guide pipes connected between the water-cooling head and the water-cooling row, and the surface of the water-cooling head is used for being tightly attached to a heating element, so that heat generated by the heating element enters the water-cooling head, and the water-cooling head is used for cooling the working liquid. The working liquid in one of the water guide pipes is taken away into the water cooling row for cooling; the water cooling device is characterized in that at least one bearing device is combined on one side of the water cooling row and is used for bearing the two water guide pipes.

Description

Technical Field

[0001] The present application relates to the technical field of computer accessories, and in particular to a water cooling device. Background Art

[0002] In recent years, computer devices have developed rapidly. With the evolution of the times, computer devices can be seen everywhere, becoming what we call computers today. Computers have a variety of execution and calculation functions to meet people's needs. Personal computers have entertainment, word processing, image playback and other functions in family life. Industrial computers provide control, supervision and computing services for factory operations. Car computers provide drivers and passengers with multimedia entertainment and the function of receiving information in real time. Overall, computers have become an indispensable device in human social life.

[0003] Since the components in the computer will continuously generate high heat and accumulate in the computer case during the process of operation, execution and transmission, in order to maintain its stability during operation, the most common method in current home desktop computers is to install fans to achieve the heat dissipation effect inside the computer by means of extraction or exhaust. Among all the components that generate heat, the heat dissipation problem of the central processing unit (CPU) and the graphics chip processor, which have the highest workload, is the most difficult. The graphics of various computer games are becoming more and more delicate, and the functions of computer-aided graphics software are becoming more and more powerful. When running, such software often puts the central processing unit and the graphics chip processor in a high-load state, and also causes a large amount of heat energy to be generated. If this heat energy cannot be effectively dissipated, it will cause the performance of the central processing unit or the graphics chip processor to decline at the least, and in serious cases, it may cause damage to the central processing unit or the graphics chip processor or greatly reduce its service life.

[0004] As attached Figure 7 As shown, in order to reduce the operating temperature of heat-generating electronic components, a general water-cooling device on the market consists of a water-cooling radiator a connected to a water-cooling head c in contact with a heat-generating component d (such as a central processing unit) through two water pipes b. A working liquid with a certain water pressure takes away the heat of the heat-generating component d through the water-cooling head c, and flows to the water-cooling radiator a for heat dissipation and continuous circulation cooling to quickly dissipate the heat.

[0005] However, after the above-mentioned conventional water-cooling device is installed, most of the volume of the two water pipes is exposed on the motherboard, which not only affects the wiring of other devices, but also makes the wiring inside the computer case messy and causes visual unsightly feeling. Summary of the invention

[0006] The present application provides a water-cooling heat dissipation device to solve the problem that the water pipe of the water-cooling heat dissipation device in the prior art leaks out on the mainboard, which not only affects the arrangement of other devices but also affects the appearance.

[0007] The present application provides a water-cooled heat dissipation device, including a water-cooling head, a water-cooling radiator containing a working liquid, and two water conduits connected between the water-cooling head and the water-cooling radiator, wherein the surface of the water-cooling head is used to closely place a heating element, so that the heat generated by the heating element enters the water-cooling head and is carried away by the working liquid in one of the water conduits to the water-cooling radiator for cooling, and at least one supporting device is combined with one side of the water-cooling radiator for supporting the two water conduits.

[0008] According to some embodiments of the present application, the supporting device is an L-shaped bracket having a bottom plate and a side plate, wherein the side plate and one side of the water cooling radiator form a placement space for two water conduits to be supported in the placement space.

[0009] According to some embodiments of the present application, a fan device is provided at the bottom of the water cooling radiator, and the supporting device is combined with the fan device.

[0010] According to some embodiments of the present application, a water inlet and a water outlet are provided at the front end of the water cooling head. After the water cooling radiator is connected to two water conduits, it can be connected to the water inlet and water outlet of the water cooling head respectively, so that the working liquid circulates between the water cooling radiator and the water cooling head through the two water conduits.

[0011] According to some embodiments of the present application, the water-cooling radiator and each water conduit are connected by a corner joint.

[0012] According to some embodiments of the present application, a cover is provided under the corner joint of the water-cooling radiator to cover the corner joint, and a water absorbing element is provided at the bottom of the cover.

[0013] According to some embodiments of the present application, the heating element is a central processing unit (CPU). BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0016] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0017] Figure 1 A schematic diagram of the appearance of a water-cooling heat dissipation device provided in an embodiment of the present application is shown in which a supporting device is combined with a water-cooling row before the supporting device is combined with a water-cooling row.

[0018] Figure 2 Shows Figure 1 Schematic diagram of the appearance of the carrying device.

[0019] Figure 3 Shows Figure 1 Schematic diagram of the appearance after the load-bearing device and the water cooling row are assembled.

[0020] Figure 4 Shows Figure 1 Schematic diagram of the appearance of the water cooling device after the corner joint is assembled.

[0021] Figure 5 A schematic diagram showing the appearance of a water conduit after being placed on a carrying device in an embodiment of the present application is shown.

[0022] Figure 6 A schematic diagram showing the appearance of a water cooling device in an embodiment of the present application assembled in a computer case is shown.

[0023] Figure 7 The figure shows the appearance of a water-cooling device in the prior art when in use.

[0024] The above drawings contain the following reference numerals:

[0025] 1. Water cooling head; 11. Water inlet; 12. Water outlet; 2. Water cooling radiator; 21. Fan device; 22. Cover; 23. Water absorption element; 3. Water guide tube; 4. Carrying device; 41. Bottom plate; 42. Side plate; 43. Storage space; 5. Heating element; 6. Computer case; 7. Corner joint; a. Water cooling radiator; b. Water guide tube; c. Water cooling head; d. Heating element. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] The disclosure below provides many different embodiments or examples to implement different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0028] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0029] See also Figures 1 to 6 It is a water-cooling heat dissipation device of one embodiment of the present application, which is composed of a water-cooling head 1, a water-cooling row 2 containing a working liquid, two water pipes 3 connected between the water-cooling head 1 and the water-cooling row 2, and at least one supporting device 4.

[0030] The front end of the water cooling head 1 is provided with a water inlet 11 and a water outlet 12. After the water cooling row 2 is connected to the two water pipes 3, it can be connected to the water inlet 11 and the water outlet 12 of the water cooling head 1 respectively, so that the working liquid circulates between the water cooling row 2 and the water cooling head 1 through the two water pipes 3. The surface of the water cooling head 1 is used to closely place a heating element 5 (such as Figure 5 As shown), the heating element 5 is a central processing unit (CPU).

[0031] At least one supporting device 4 is combined with one side of the water-cooling radiator 2. In fact, the supporting device 4 can be set as a structure such as a bracket, double-sided tape, rope, etc. that can be used to support the water pipe 3. The supporting device 4 of this embodiment takes an L-shaped bracket as an example, which has a bottom plate 41 and a side plate 42. The side plate 42 and one side of the water-cooling radiator 2 form a placement space 43 for the two water pipes 3 to be carried in the placement space 43. A fan device 21 is provided at the bottom of the water-cooling radiator 2, and the bottom plate 41 of the bracket 4 can be locked to the fan device 21. In addition, if Figure 4 As shown, the water-cooling radiator 2 and each of the water conduits 3 are connected by a corner joint 7, so that after one end of each water conduit 3 is connected to the corner joint 7, the bending of the water conduit 3 can be reduced, and the water-cooling radiator 2 is provided with a cover 22 under the corner joint 7 to cover the corner joint 7, and a water absorbing element 23 is provided at the bottom of the cover 22.

[0032] Therefore, in actual implementation, when the water-cooling heat dissipation device provided in this embodiment is assembled in the computer case 6, the two water conduits 3 can be placed in the placement space 43 between the side plate 42 of the supporting device 4 and the water-cooling radiator 2. When the computer is running, the heat generated by the heating element 5 can enter the water-cooling head 1 and be taken away by the working liquid in one of the water conduits 3 to the water-cooling radiator 2 for cooling. The working liquid cooled in the water-cooling radiator 2 can pass through the water-cooling head 1 through the other water conduit 3 and take away the heat in the water-cooling head 1 again.

[0033] In summary, this application has the following advantages:

[0034] 1. Through the design of the embodiment of the present application, no matter where the water cooling radiator is assembled, the two water conduits 3 can be properly placed on the supporting device according to the distance between the water cooling head and the water cooling head, so that the interior of the computer case is orderly and not messy, and the user will not be hindered by the water conduits when adding or disassembling other devices.

[0035] 2. The embodiment of the present application has a newly added design of a corner joint, which makes it easier to connect the water conduit to the water cooling radiator, makes the working liquid flow more smoothly, and reduces excessive bending of the water conduit.

[0036] 3. In the embodiment of the present application, a cover is provided under the corner joint. In addition to the purpose of shielding and protection, the water absorption element at the bottom of the cover can effectively reduce the risk of leakage of the working fluid from the water cooling radiator.

[0037] The above is a specific embodiment of the embodiment of the present application and the technical means used. According to the disclosure or teaching of this article, many changes and modifications can be derived and deduced, which can still be regarded as equivalent changes made to the concept of the present application. The effects produced still do not exceed the essential spirit covered by the description and drawings, and should be regarded as within the technical scope of the present application. It is stated in advance.

[0038] In summary, based on the contents disclosed above, this application can indeed achieve the intended purpose of the invention and provide a water-cooling heat dissipation device that is extremely practical and valuable for industrial use, so an invention patent application is filed in accordance with the law.

Claims

1. A water-cooled heat dissipation device, comprising a water-cooling head, a water-cooling radiator containing a working liquid, and two water conduits connected between the water-cooling head and the water-cooling radiator, wherein the surface of the water-cooling head is used to closely contact a heating element, so that the heat generated by the heating element enters the water-cooling head and is taken away by the working liquid in one of the water conduits to the water-cooling radiator for cooling, characterized in that: At least one supporting device is combined with one side of the water cooling row to support the two water pipes.

2. The water cooling device according to claim 1, characterized in that: The carrying device is an L-shaped bracket having a bottom plate and a side plate. The side plate and one side of the water cooling row form a placement space for the two water pipes to be carried in the placement space.

3. The water cooling device according to any one of claims 1 or 2, characterized in that: A fan device is disposed at the bottom of the water cooling radiator, and the supporting device is combined with the fan device.

4. The water cooling device according to claim 1, characterized in that: The front end of the water cooling head is provided with a water inlet and a water outlet. After the water cooling radiator is connected to the two water conduits, it can be connected to the water inlet and water outlet of the water cooling head respectively, so that the working liquid circulates between the water cooling radiator and the water cooling head through the two water conduits.

5. The water cooling device according to any one of claims 1 or 4, characterized in that: The water cooling row and each of the water conduits are connected by an angle joint.

6. The water cooling device according to claim 5, characterized in that: The water cooling row is provided with a cover body below the corner joint for covering the corner joint, and a water absorbing element is provided at the bottom of the cover body.

7. The water cooling device according to claim 1, characterized in that: The heating element is a central processing unit (CPU).

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