Bearing assembly, control method thereof and semiconductor process equipment

Abstract

The invention discloses a bearing assembly and a control method thereof and semiconductor process equipment, the bearing assembly comprises a base and at least three jacking mechanisms, the base and the at least three jacking mechanisms are respectively used for supporting a to-be-processed workpiece, the base is provided with a plurality of through holes, each jacking mechanism comprises a jacking part, and the jacking parts are used for supporting the to-be-processed workpiece. The plurality of jacking pieces can be arranged in the plurality of through holes in a penetrating manner in a one-to-one correspondence manner; at least one jacking mechanism further comprises a pressure detection piece, and the jacking piece in the jacking mechanism is supported on the pressure detection piece. According to the bearing assembly, the problem that the wafer is invalid and even broken due to the fact that the wafer slip phenomenon possibly occurring in the wafer conveying process cannot be monitored by the existing semiconductor process equipment and the subsequent processing process is carried out when the wafer is in a relative eccentric state relative to the base can be solved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a carrier component and a control method thereof and semiconductor process equipment. Background Art

[0002] Since metal tungsten has good electrical conductivity and anti-electromigration ability, in the semiconductor processing process, chemical vapor deposition is usually used to fill metal tungsten in holes or grooves to achieve the purpose of electrical connection between the front-end device and the back-end metal interconnection. Generally speaking, after completing the metal filling process, it is necessary to use the chemical mechanical flattening method to remove the metal tungsten remaining on the surface of the wafer. In order to ensure that the metal removal process can proceed normally, before the metal deposition process, it is usually necessary to cover the edge of the wafer with a shielding ring whose inner diameter is slightly smaller than the outer diameter of the wafer, so as to ensure that the upper surface of the wafer can form a sediment-free and equal-width annular area from its outer edge. Of course, in order to ensure that the width of the sediment-free area formed at the outer edge of the wafer is equal or substantially equal, it is necessary to ensure that the ring, the wafer and the base for carrying the wafer are concentrically arranged. In the current wafer transfer process, a plurality of ejectors are usually used to pre-support the wafer. Then, during the process of the base rising, the base lifts the wafer from the top of the ejector and drives the wafer to continue to rise to the process station.

[0003] Since current process equipment cannot detect the possible slippage of the wafer when it is moved to the ejector pin, the position of the wafer when it is carried on the ejector pin may be relatively eccentric to the base. In this case, when the base supports the wafer to complete the metal deposition process, the wafer may be eccentric after edge trimming, or even fail or break into pieces. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a supporting component and its control method and semiconductor process equipment, so as to solve the problem that the current semiconductor process equipment is unable to monitor the wafer slip phenomenon that may occur during the wafer transfer process, resulting in the wafer being in a state of relative eccentricity with the base during subsequent processing, which may cause wafer failure or even fragmentation.

[0005] In a first aspect, an embodiment of the present application discloses a bearing assembly, which includes a base and at least three supporting mechanisms, wherein the base and the at least three supporting mechanisms are respectively used to support a workpiece to be processed, the base is provided with a plurality of through holes, each of the supporting mechanisms includes a supporting member, and the plurality of supporting members can be correspondingly inserted into the plurality of through holes;

[0006] At least one of the supporting mechanisms further includes a pressure detecting member, and the supporting member in the supporting mechanism is supported by the pressure detecting member.

[0007] In a second aspect, an embodiment of the present application discloses a control method, which is applied to the above-mentioned bearing assembly, wherein the bearing assembly further includes a position adjustment mechanism, each of the supporting mechanisms is installed on the position adjustment mechanism, and the position adjustment mechanism is used to drive each of the supporting mechanisms to move relative to the base in a direction perpendicular to the axial direction of the through hole, and the control method includes:

[0008] S1, obtaining the detection value of the pressure detection component;

[0009] S2. When the detection value does not meet the preset pressure, the position adjustment mechanism is controlled to drive the plurality of supporting mechanisms to move relative to the base, so as to reduce the distance between the center of the workpiece to be processed and the center of the base in a direction perpendicular to the axial direction of the through hole.

[0010] In a third aspect, an embodiment of the present application further discloses a semiconductor process equipment, which includes a process chamber and the above-mentioned supporting assembly, and the base can be installed in the process chamber in a liftable manner.

[0011] An embodiment of the present application discloses a bearing assembly, which includes a base and at least three supporting mechanisms respectively used to support the workpiece to be processed. The base is provided with a plurality of through holes, and the supporting members of each supporting mechanism can be inserted into the plurality of through holes in a one-to-one correspondence, thereby ensuring that the supporting mechanism and the base both have the ability to support the workpiece to be processed. At the same time, at least one of the multiple supporting mechanisms also includes a pressure detection component, and the supporting component in the supporting mechanism is supported by the pressure detection component, so that the pressure detection component can detect the size of the pressure value borne by the supporting component, and then when the workpiece to be processed is carried on multiple supporting mechanisms, by comparing the relationship between the pressure detection value of the pressure detection component and the preset pressure value, it can be determined whether the center of the workpiece to be processed is concentric or basically concentric with the center of the base, and when the workpiece to be processed does not meet the concentricity requirement with the base, the workpiece to be processed can be re-transferred into the process chamber by re-executing the film transfer step, etc., and when the workpiece to be processed does not slip, the workpiece to be processed can be stably carried on multiple supporting mechanisms, and the center of the workpiece to be processed and the center of the base meet the concentricity requirement, thereby ensuring that the subsequent process can be carried out reliably and a workpiece that meets the processing requirements is formed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0013] Figure 1 A schematic diagram of a partial structure of a load-bearing assembly disclosed in an embodiment of the present application;

[0014] Figure 2It is a schematic diagram of the assembly between the top holding member and the pressure detection member in the load-bearing assembly disclosed in the embodiment of the present application;

[0015] Figure 3 It is a schematic diagram of the assembly between the driving member and the connecting frame disclosed in the embodiment of the present application;

[0016] Figure 4 It is a schematic diagram showing that the base of the bearing assembly disclosed in the embodiment of the present application and the workpiece to be processed are in a concentric state;

[0017] Figure 5 It is a schematic diagram of an eccentric state between the base of the bearing assembly disclosed in an embodiment of the present application and the workpiece to be processed;

[0018] Figure 6 A schematic diagram of the distribution position relationship between the center of the base and the through holes in the load-bearing assembly disclosed in the embodiment of the present application;

[0019] Figure 7 A schematic diagram of a portion of the structure of a semiconductor process equipment disclosed in an embodiment of the present application;

[0020] Figure 8 A schematic diagram of a part of the structure of the semiconductor process equipment disclosed in an embodiment of the present application in another state;

[0021] Fig. 9 This is a flow chart of the control method disclosed in an embodiment of the present application.

[0022] Reference numerals:

[0023] 100-base, 110-through hole,

[0024] 210-top holder, 220-pressure detection part, 230-base, 240-cable,

[0025] 310-driving member, 311-first transmission shaft, 312-second transmission shaft, 320-connecting frame, 330-elastic sleeve, 340-connecting rod, 350-extension boss, 360-sealing ring,

[0026] 400-process chamber, 410-exhaust port, 420-perforation,

[0027] 500-Parts to be processed. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0030] like Figure 1-Figure 8 As shown, the embodiment of the present application discloses a bearing assembly, which can be applied to semiconductor process equipment and used to provide a support function for a wafer waiting to be processed 500. Figure 1 As shown, the supporting assembly includes a base 100 and at least three supporting mechanisms.

[0031] The base 100 and at least three supporting mechanisms are used to support the workpiece 500, respectively. The supporting mechanisms are mainly used to provide temporary support for the workpiece 500 before the wafer waits for the workpiece 500 to be processed, so as to provide a avoidance function for the movement of the wafer transfer mechanism when the wafer transfer mechanism transfers the workpiece 500 from outside the process chamber 400 to inside the process chamber 400. Figure 1 As shown, the supporting mechanism may include a supporting member 210, and the supporting member 210 may specifically be a metal needle-shaped structure, so that while it has a reliable supporting function, parameters such as the diameter of the supporting member 210 are relatively small, thereby reducing the space occupied by the supporting member 210.

[0032] As mentioned above, the number of the supporting mechanisms is at least three. More specifically, any supporting mechanism can provide a point support for the workpiece 500 to be processed. When three or more supporting mechanisms work together, they can provide a reliable support for the workpiece 500 to be processed; or, in other words, the workpiece 500 to be processed can be supported on at least three supporting mechanisms at the same time. Optionally, the number of supporting mechanisms is four or more to improve the support effect of the workpiece 500 to be processed. In a specific embodiment of the present application, Figure 1 As shown, there are three supporting mechanisms, and the connecting lines between the tops of the three supporting mechanisms form an acute triangle.

[0033] As mentioned above, the base 100 is also used to support the workpiece 500 to be processed, and during the process of the workpiece 500 to be processed, the base 100 is used to replace the supporting mechanism to support the workpiece 500 to be processed, and by enabling the base 100 to have corresponding functions, the base 100 can also provide functions such as heating or cooling for the workpiece 500 to be processed. Specifically, the base 100 may include a chuck, and in the case where the carrier assembly is used in a semiconductor process equipment, such as Figure 1 and Figure 7 As shown, the susceptor 100 can be installed in the process chamber 400 in a liftable manner by means of a lifting mechanism, so that the susceptor 100 has a process station and a wafer transfer station, etc.

[0034] In addition, since the supporting mechanism can also be used to support the workpiece 500 to be processed, and a plurality of through holes 110 are further provided on the base 100, as described above, the supporting mechanism includes a plurality of supporting members 210. Based on this, the plurality of supporting members 210 can be respectively arranged in the plurality of through holes 110. Of course, due to the different connection relationship between the supporting members 210 and the base 100, during the operation of the supporting assembly disclosed in the embodiment of the present application, the supporting members 210 can always be accommodated in the corresponding through holes 110, or, when the base 100 and the supporting members 210 have the ability to move relative to each other, when the base 100 is lifted to the process station, the supporting members 210 can be separated from the through holes 110, that is, the supporting members 210 are located outside the through holes 110 and below the base 100.

[0035] In a specific embodiment of the present application, the supporting mechanism can be movably cooperated with the base 100 in the supporting direction, or in other words, the supporting mechanism can be fixedly installed in the process chamber 400, and when the base 100 moves upward relative to the process chamber 400, the base 100 can rise to the top of the supporting mechanism and support the workpiece 500 to be processed, so that the detection accuracy of the supporting mechanism is relatively higher.

[0036] Furthermore, in the bearing assembly disclosed in the embodiment of the present application, at least one holding mechanism further includes a pressure detection member 220, which can be specifically a pressure sensor with relatively high accuracy, and its detection accuracy can usually reach 0.01 N. At the same time, in the holding mechanism including the pressure detection member 220, the holding member 210 thereof is supported by the pressure detection member 220, so that the pressure detection member 220 can detect the magnitude of the pressure exerted on the holding member 210 connected thereto, and then based on the specific distribution of the plurality of holding mechanisms relative to the center of the base 100, the specific position parameters of the holding mechanism where the pressure detection member 220 is located, and the weight and other parameters of the workpiece 500 to be processed, when the film transmission mechanism transmits the workpiece 500 to the plurality of holding mechanisms, the pressure detection value of the pressure detection member 220 can be used to judge whether the position of the workpiece 500 to be processed is centered, that is, whether the center of the workpiece 500 to be processed and the base 100 are in a concentric state.

[0037] Specifically, one end of the supporting member 210 can be fixedly connected to the detection head of the pressure detection member 220 by bonding or other methods, so that the pressure detection member 220 has the ability to detect the pressure exerted on the supporting member 210. More specifically, when one end of the supporting member 210 is fixed to the detection head of the pressure detection member 220, the pressure detection member 220 can be directly or indirectly fixed in the process chamber 400.

[0038] Of course, in order to reduce the difficulty of installing the pressure detection member 220, as Figure 2 As shown, the supporting mechanism may also include a base 230, and the base 230 is pre-set with the pressure detection component 220, and then in the process of installing the supporting mechanism, the base 230 can be used to install the entire supporting mechanism in the process chamber 400, and the installation accuracy of the pressure detection component 220 is relatively high. Among them, the pressure detection component 220 and the base 230 can form a relatively reliable relative fixed relationship by pre-bonding or threaded connection, and by setting a perforation in the middle of the base 230, it can be ensured that the cable 240 of the pressure detection component 220 can be led out from the base 230, thereby realizing the ability of information transmission. In addition, in other embodiments of the present application, in order to meet corresponding needs, the supporting mechanism can also be enabled to have the ability to move relative to the process chamber 400.

[0039] For example, if there are four supporting mechanisms, and the connecting lines between the tops of the four supporting mechanisms form a square, and the distances between the four supporting mechanisms and the center of the base 100 are equal, if the workpiece 500 is simultaneously supported on the tops of the supporting members 210 of the four supporting mechanisms, and the center of the workpiece 500 is concentric with the center of the base 100, then no matter which of the four supporting mechanisms includes the pressure detection member 220, the pressure detection value of the pressure detection member 220 is equal to or substantially equal to one-fourth of the gravity of the workpiece 500. Accordingly, in the process, when the supporting mechanism adopts the above technical solution, if the pressure detection value of the pressure detection member 220 is less than or greater than one-fourth of the gravity of the workpiece 500, it can be basically determined that there is a non-concentricity between the workpiece 500 and the base 100. Of course, a preset range can also be set according to parameters such as the weight of the workpiece 500 to be processed, and the pressure detection value of the pressure detection component 220 can be compared with the aforementioned preset range to prevent the detection accuracy and error of the pressure detection component 220 from being greatly affected, thereby greatly increasing the difficulty of transferring the workpiece 500 and reducing the efficiency of transferring the workpiece 500.

[0040] Accordingly, if the pressure detection value of the pressure detection member 220 determines that the center of the workpiece 500 to be processed is not concentric with the center of the base 100, it is considered that the sheet slip phenomenon may have occurred when the sheet transfer mechanism transfers the workpiece 500 to the supporting mechanism. Based on this, the sheet transfer mechanism can be used to move the transferred workpiece 500 out of the process chamber 400, and then, if the workpiece 500 to be processed meets other requirements, the sheet transfer mechanism can transfer the workpiece 500 to the process chamber 400 again, and the workpiece 500 is carried on the supporting mechanism, so that the center of the workpiece 500 can be concentric or substantially concentric with the center of the base 100.

[0041] An embodiment of the present application discloses a bearing assembly, which includes a base 100 and at least three supporting mechanisms respectively used to support the workpiece 500 to be processed. The base 100 is provided with a plurality of through holes 110. The supporting members 210 of each supporting mechanism can be respectively inserted into the plurality of through holes 110, thereby ensuring that the supporting mechanism and the base 100 both have the ability to support the workpiece 500 to be processed. At the same time, at least one of the multiple supporting mechanisms also includes a pressure detection component 220, and the supporting component 210 in the supporting mechanism is supported by the pressure detection component 220, so that the pressure detection component 220 can detect the size of the pressure value borne by the supporting component 210, and then when the workpiece 500 to be processed is carried on multiple supporting mechanisms, by comparing the relationship between the pressure detection value of the pressure detection component 220 and the preset pressure value, it can be determined whether the center of the workpiece 500 to be processed is concentric or basically concentric with the center of the base 100, and when the workpiece 500 to be processed does not meet the concentricity requirement with the base 100, the workpiece 500 to be processed can be re-transferred into the process chamber 400 by re-executing the film transfer step, etc., and when the workpiece 500 to be processed does not slip, the workpiece 500 to be processed can be stably carried on multiple supporting mechanisms, and the center of the workpiece 500 to be processed and the center of the base 100 meet the concentricity requirement, thereby ensuring that the subsequent process can be carried out reliably and a workpiece that meets the processing requirements is formed.

[0042] During the operation of the bearing assembly disclosed in the above embodiment, by comparing the relationship between the detection value of the pressure detection member 220 and the preset pressure, it can be determined whether the workpiece 500 to be processed is transferred to a position concentric with the base 100. In addition, during the transfer process of the workpiece 500 to be processed, if the workpiece 500 to be processed slips, so that it cannot be concentric with the base 100 when it is carried on the supporting mechanism, it may be necessary to use the transfer mechanism to re-perform the transfer step, which will have a greater adverse effect on the process efficiency.

[0043] Based on this, in the embodiment of the present application, the bearing assembly further includes a position adjustment mechanism, each supporting mechanism is installed on the position adjustment mechanism, and the position adjustment mechanism is used to drive each supporting mechanism to move relative to the base 100 in a direction perpendicular to the axial direction of the through hole 110, so that the bearing assembly disclosed in the embodiment of the present application can provide a position adjustment function for the workpiece 500 to be processed supported on multiple supporting mechanisms during operation. It should be noted that, since the supporting member 210 of the supporting mechanism is inserted into the through hole 110 of the base 100, the adjustment range of the position adjustment mechanism disclosed in the embodiment of the present application is limited.

[0044] Specifically, the number of position adjustment mechanisms can be made the same as the number of supporting mechanisms, and each supporting mechanism can be equipped with a position adjustment mechanism one by one. By keeping the driving direction and driving amount of each position adjustment mechanism consistent, the displacements of multiple supporting mechanisms relative to the base 100 can be made the same, thereby ensuring that the workpiece 500 to be processed can be stably supported on the supporting mechanism.

[0045] In another embodiment of the present application, in order to reduce the number of moving parts and thus reduce the difficulty of control, optionally, the position adjustment mechanism includes a driving member 310 and a connecting frame 320, each supporting mechanism is installed on the connecting frame 320, and the driving member 310 is connected to the connecting frame 320, so that the same driving member 310 is used to simultaneously drive multiple supporting mechanisms to move relative to the base 100, which can further improve the consistency of the movements of the multiple supporting mechanisms and improve the stability of the workpiece 500 when it moves relative to the base 100 in a direction perpendicular to the axial direction of the through hole 110.

[0046] Specifically, the driving member 310 may include a device with a linear driving function, such as a linear motor, and the linear driving mechanism may be equipped with a transmission mechanism. By changing the state of the transmission mechanism, or connecting the linear motors to different transmission mechanisms, the linear driving device can drive the workpiece 500 to be processed to move in directions perpendicular to each other through the transmission mechanism, so that the workpiece 500 to be processed is as concentric as possible with the base 100.

[0047] Furthermore, the driving member 310 and the related transmission mechanism can be installed inside the process chamber 400. In order to prevent the existence of the aforementioned devices from having an adverse effect on the process accuracy, in another embodiment of the present application, the connecting frame 320 is arranged inside the process chamber 400, and the center of the connecting frame 320 is kept concentric with the center of the process chamber 400. The driving member 310 is arranged outside the process chamber 400, and a through hole 420 is provided at a corresponding position on the process chamber 400 to ensure that the driving connection structure of the driving member 310 can be connected to the connecting frame 320 inside the process chamber 400 through the aforementioned through hole 420.

[0048] At the same time, in the case where the aforementioned through hole 420 is provided on the process chamber 400, in order to prevent the process environment in the process chamber 400 from being destroyed by the external atmospheric environment, an elastic sleeve 330 can be provided at the through hole 420. The elastic sleeve 330 is specifically formed of a material with relatively high structural strength such as stainless steel, and it can be a corrugated structure so that it has a certain deformation ability, so that when the driving member 310 drives the connecting frame 320 to move, it is ensured that the elastic sleeve 330 can always provide a good blocking effect for the through hole 420. Among them, the maximum relative displacement of the opposite ends of the elastic sleeve 330 in the direction perpendicular to the axial direction of the elastic sleeve 330 is greater than the required active deviation correction amount of the supporting mechanism in the present application. For example, the maximum relative displacement of the elastic sleeve 330 can be 3mm, while the active deviation correction amount of the supporting mechanism is usually less than or equal to 1mm.

[0049] Specifically, one end of the elastic sleeve is connected to the outer wall of the process chamber 400, and the other end of the elastic sleeve is connected to the driving member 310 to block the through hole 420. Furthermore, in order to reduce the difficulty of installing the elastic sleeve 330, the driving member 310 can be connected to the connecting frame 320 through the connecting rod 340, and the end of the connecting rod 340 connected to the driving member 310 is provided with an extension boss 350, and then the elastic sleeve 330 is sleeved outside the connecting rod 340, and the end of the elastic sleeve 330 away from the process chamber 400 is connected to the extension boss 350. Of course, in order to further improve the sealing effect of the elastic sleeve 330, flexible sealing rings 360 can also be provided at both opposite ends of the elastic sleeve 330.

[0050] In addition, as described above, the driving member 310 is used to drive the connecting frame 320 to move in a plane perpendicular to the axial direction of the process chamber 400. In order to reduce the driving difficulty of the driving member 310, the driving member 310 may include a first transmission shaft 311 and a second transmission shaft 312, which are respectively used to provide driving action in a first direction and a second direction, and the first direction and the second direction are perpendicular to each other and are perpendicular to the axial direction of the process chamber 400, that is, the supporting direction.

[0051] Wherein, when one of the multiple supporting mechanisms includes a pressure detection member 220, the adjustment direction and adjustment size of the position adjustment mechanism can be determined according to the detection value of the pressure detection member 220 and the relative position between the pressure detection member 220 and the center of the base 100 and other parameters. Specifically, when the pressure detection value of the pressure detection member 220 is less than the preset pressure, it can be considered that: relative to the preset position of the workpiece 500, the actual position of the workpiece 500 is usually offset in a direction farther away from the pressure detection member 220. In this case, the position detection member can be used to drive the workpiece 500 to move in a direction from the center of the base 100 to the pressure detection member 220 through multiple supporting mechanisms; conversely, when the pressure detection value of the pressure detection member 220 is greater than the preset pressure value, the position detection member can be used to drive the workpiece 500 to move in a direction from the pressure detection member 220 to the center of the base 100 through multiple supporting mechanisms.

[0052] In the above embodiment, the adjustment accuracy is relatively low, and a single adjustment may not make the center of the workpiece 500 to be processed concentric or substantially concentric with the center of the base 100, resulting in a relatively large difficulty in adjusting the workpiece 500 to be processed. To this end, in the embodiment of the present application, further, each supporting mechanism includes a pressure detection member 220, and the supporting members 210 in any supporting mechanism are supported on the corresponding pressure detection member 220, so that the pressure of each supporting member 210 can be detected by the corresponding pressure detection member 220.

[0053] When the above-mentioned technical solution is adopted, when the film transmission mechanism transfers the workpiece 500 to multiple supporting mechanisms, the pressure detection components 220 of each supporting mechanism can obtain corresponding pressure detection values. Based on the multiple pressure detection values ​​and the relative position relationship between the multiple pressure detection components 220 and the center of the base 100, the direction and size of the offset of the workpiece 500 relative to the center of the base 100 can be obtained, that is, the offset vector of the workpiece 500. Based on the aforementioned offset vector, the position adjustment mechanism can provide position adjustment for the position of the workpiece 500 more accurately.

[0054] More specifically, after obtaining the offset vector of the workpiece 500, the position adjustment mechanism drives the workpiece 500 to move in a direction opposite to the offset vector by a distance equal to the value of the offset vector through multiple supporting mechanisms, so that the center of the workpiece 500 to be processed and the center of the base 100 can be concentric. Of course, in the case where the position adjustment mechanism only has the function of providing driving action in two directions perpendicular to each other, if the direction of the offset vector is inclined relative to the driving direction of the position adjustment mechanism, the center of the workpiece 500 to be processed and the center of the base 100 can meet the concentricity requirement by driving the position adjustment mechanism multiple times, wherein the combined motion of the multiple driving actions of the position adjustment mechanism is the opposite vector of the above-mentioned offset vector. In addition, considering that the weight of the workpiece 500 to be processed is relatively small, in order to improve the detection and adjustment accuracy, the detection accuracy of each pressure detection member 220 should be relatively high.

[0055] As described above, the number of the supporting mechanisms can be three, and the lines connecting the tops of the three supporting mechanisms form an acute triangle. Since the supporting members 210 of the supporting mechanisms are all correspondingly inserted into the through holes 110 of the base 100, that is, the number of the through holes 110 on the base 100 can be three, and the lines connecting the centers of the three through holes 110 form an acute triangle.

[0056] In order to further enhance the support stability of the workpiece 500 by the multiple supporting mechanisms and reduce the difficulty of obtaining the offset of the workpiece 500 by using the measurement values ​​of the multiple pressure detection parts 220, in the embodiment of the present application, the distances between the centers of the three through holes 110 and the center of the base 100 can be made equal, that is, the lines connecting the centers of the three through holes 110 form an equilateral triangle, and the center of the equilateral triangle is concentric with the center of the base 100.

[0057] Based on the above embodiment, the angles formed by any two adjacent supporting mechanisms and the center of the base 100 are 120°. In this case, when the workpiece 500 to be processed is carried on three supporting mechanisms and the center of the workpiece 500 to be processed is concentric with the center of the base 100, the detection values ​​of the pressure detection component 220 of any supporting mechanism are equal and are one-third of the gravity of the workpiece 500 to be processed (the weight of the supporting component 210 is not considered).

[0058] Accordingly, when the workpiece 500 is transferred to the supporting mechanism, if the detection value of any pressure detection element 220 is not equal to one third of the gravity of the workpiece 500, it means that there is eccentricity between the workpiece 500 and the base 100. In this case, the coordinate axes are established with the center of the base 100 pointing to the centers of the three through holes 110. like Figure 6As shown, the offset between the center of the workpiece 500 and the center of the base 100 is Substituting into the above coordinate system, the relationship is And F1+F2+F3=mg (mg is the weight of the workpiece 500 to be processed).

[0059] Based on the bearing assembly disclosed in any of the above embodiments, when the bearing assembly includes the above position adjustment mechanism, the embodiment of the present application further discloses a control method, such as Fig. 9 As shown, the control method includes:

[0060] S1. Obtain the detection value of the pressure detection member. Specifically, the pressure of the corresponding supporting member in the supporting mechanism can be obtained through the pressure detection member used to support the supporting member in the supporting mechanism. Then, the detection value of the pressure detection member can be compared with the preset pressure to determine the concentricity between the center of the workpiece to be processed and the center of the base.

[0061] Afterwards, the control method further includes:

[0062] S2. When the detection value does not meet the preset pressure, the position adjustment mechanism is controlled to drive the multiple supporting mechanisms to move relative to the base, so as to reduce the distance between the center of the workpiece to be processed and the center of the base in the direction perpendicular to the axial direction of the through hole. Specifically, by using the relationship between the detection value of the pressure detection member and the preset pressure, the general deviation direction of the center of the workpiece to be processed relative to the center of the base can be determined, and then the position adjustment mechanism can be used to drive the workpiece to be processed to move in the opposite direction, so that when the workpiece to be processed is carried on the base, the distance between the center of the workpiece to be processed and the center of the base can be made smaller, or even overlap.

[0063] In order to further quantify the adjustment parameters of the position adjustment mechanism, further, each supporting mechanism in the bearing assembly can include a pressure detection member, and the supporting members in any supporting mechanism are supported on the corresponding pressure detection member, so that the pressure of the supporting members of each supporting mechanism can be detected accordingly. In this case, in the control method disclosed in the embodiment of the present application, the above step S1 includes:

[0064] The detection value of each pressure detection component is obtained, that is, the pressure of each supporting component can be obtained through multiple pressure detection components. When any of the detection values ​​of each pressure detection component does not meet its corresponding preset pressure, it can be considered that there is eccentricity between the center of the workpiece to be processed and the center of the base.

[0065] Correspondingly, based on parameters such as the installation position of multiple supporting mechanisms relative to the base, the relative position between each pressure detection component and the center of the base is also a known parameter. Then, using the above parameters, the size and direction of the offset of the center of the workpiece to be processed relative to the center of the base can be obtained.

[0066] Specifically, the above step S2 may include:

[0067] In the case where any one of the multiple detection values ​​does not satisfy the corresponding preset pressure, the offset vector of the center of the workpiece to be processed relative to the base is obtained based on the multiple detection values. As described above, based on the relative positions between the multiple pressure detection parts and the center of the base, as well as the specific size of each detection value and other parameters, the size and direction of the offset of the center of the workpiece to be processed relative to the center of the base, that is, the aforementioned offset vector, can be calculated. It should be noted that when the equivalent relative positions between the centers of the multiple supporting mechanisms and the base are different, the preset pressures of the pressure detection parts may also be different, and when the spacings between the multiple supporting mechanisms and the base are equal, and the angles between the lines connecting any two adjacent supporting mechanisms and the centers of the base are equal, the preset pressures are the same value.

[0068] Furthermore, in the case of obtaining the above offset vector, the position adjustment mechanism can adjust the position of the workpiece accordingly. To this end, the above step S2 further includes:

[0069] When the value of the offset vector is less than or equal to the adjustment range of the position adjustment mechanism, the position adjustment mechanism is controlled to drive the multiple supporting mechanisms to move relative to the base. Accordingly, the adjustment distance of the position adjustment mechanism is equal to the value of the offset vector, that is, the adjustment distance is equal to the size of the offset vector, and the adjustment direction of the position adjustment mechanism is opposite to the direction of the offset vector, so that the position adjustment mechanism can drive the workpiece to be processed to move relative to the base, so that when the base rises and supports the workpiece to be processed, the center of the workpiece to be processed can be set concentrically with the center of the base. Among them, the adjustment range of the position adjustment mechanism is related to the size of the through hole in the direction perpendicular to its own axial direction, for example, it can be 1mm, etc., which is not limited in this article. In addition, as mentioned above, the process of the position adjustment mechanism driving the workpiece to be processed to move can be divided into multiple sub-movements, and the combined movement of the multiple sub-movements corresponds to the above-mentioned offset vector.

[0070] Since the workpiece to be processed may also produce a large slip during the film transfer process, causing the size of the offset vector to exceed the adjustment range of the position adjustment mechanism. Furthermore, in order to improve the processing accuracy of the workpiece to be processed, when the position adjustment mechanism cannot provide better adjustment capabilities, the position of the workpiece to be processed can no longer be adjusted by the position adjustment mechanism. Instead, the workpiece to be processed is transferred out of the process chamber. When other conditions of the workpiece to be processed meet the requirements, the film transfer mechanism can be used to transfer the workpiece to the process chamber again. In this case, if the slip phenomenon does not occur during the next film transfer process, then when the workpiece to be processed is supported on the supporting mechanism, it can be ensured that the center of the workpiece to be processed can be or basically can be concentric with the center of the base.

[0071] To this end, the above step S2 also includes:

[0072] When the value of the offset vector is greater than the adjustment range of the position adjustment mechanism, the workpiece to be processed is controlled to move out of the process chamber.

[0073] As mentioned above, in the above embodiment, the offset vector of the center of the workpiece to be processed relative to the center of the base can be obtained by using the detection values ​​of each of the multiple pressure detection components, and when the value of the offset vector exceeds the adjustment range of the position adjustment mechanism, the film transmission mechanism can be used to re-transmit the workpiece to be processed out of the process chamber to solve the film slip phenomenon that occurred during the last film transmission mechanism. However, since the deviation between the actual position of the workpiece to be processed and the preset position will not be too large when the film slip phenomenon occurs, after the film transmission process is completed, if the offset between the center of the workpiece to be processed carried on the supporting mechanism and the center of the base is relatively large, it is considered that the film transmission mechanism may have a film transmission failure.

[0074] To this end, in the control method of the embodiment of the present application, when the value of the offset vector is greater than the adjustment range of the position adjustment mechanism and less than the preset offset, it means that although the offset of the workpiece to be processed exceeds the adjustment range of the position adjustment mechanism, it is most likely caused by the sliding phenomenon. For this reason, the sheet conveying mechanism can be controlled to move the workpiece to be processed out of the process chamber and the sheet conveying step can be re-executed. During the next sheet conveying step, if the sliding phenomenon does not occur, the workpiece to be processed can be stably transferred to multiple supporting mechanisms, and the center of the workpiece to be processed can be concentric or substantially concentric with the center of the base.

[0075] When the value of the offset vector is greater than the adjustment range of the position adjustment mechanism and is equal to or greater than the preset offset, it means that the actual position of the workpiece to be processed may not necessarily be offset from the preset position due to the slip phenomenon during the film transfer process. In this case, the film transfer mechanism can be controlled to remove the workpiece to be processed from the process chamber, and an alarm signal can be issued to prompt the equipment or user to check the working status of the film transfer mechanism and other devices, etc., to ensure that all devices and set parameters in the semiconductor process equipment are in normal status. It should be noted that when an alarm message is issued, it does not necessarily mean that there is a fault in the device in the semiconductor process equipment.

[0076] Based on the carrier component disclosed in any of the above embodiments, the embodiments of the present application also disclose a semiconductor process equipment, which includes a process chamber and any of the above-mentioned carrier components. The base in the carrier component can be installed in the process chamber in a liftable manner. In addition, the process chamber 400 can also be provided with an exhaust port 410 so that by-products generated during the process can be extracted from the exhaust port 410 to the outside of the process chamber 400.

[0077] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0078] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A load-bearing assembly, characterized in that: The machine comprises a base and at least three supporting mechanisms, wherein the base and the at least three supporting mechanisms are respectively used to support the workpiece to be processed, the base is provided with a plurality of through holes, each of the supporting mechanisms comprises a supporting member, and the plurality of supporting members can be correspondingly inserted into the plurality of through holes; At least one of the supporting mechanisms further includes a pressure detecting member, and the supporting member in the supporting mechanism is supported by the pressure detecting member.

2. The bearing assembly according to claim 1, characterized in that: The bearing assembly further comprises a position adjustment mechanism, each of the supporting mechanisms is mounted on the position adjustment mechanism, and the position adjustment mechanism is used to drive each of the supporting mechanisms to move relative to the base along an axial direction perpendicular to the axial direction of the through hole.

3. The bearing assembly according to claim 2, characterized in that: The position adjustment mechanism comprises a driving member and a connecting frame, each of the supporting mechanisms is installed on the connecting frame, and the driving member is connected to the connecting frame.

4. The bearing assembly according to claim 1, characterized in that: Each of the supporting mechanisms comprises the pressure detecting member, and the supporting member in any of the supporting mechanisms is supported by the pressure detecting member.

5. The bearing assembly according to claim 4, characterized in that: The number of the through holes is three, and the lines connecting the centers of the three through holes form an acute triangle.

6. The bearing assembly according to claim 5, characterized in that: The distances between the centers of the three through holes and the center of the base are all equal.

7. A control method, applied to the load-bearing assembly according to claim 1, characterized in that: The bearing assembly further includes a position adjustment mechanism, each of the supporting mechanisms is mounted on the position adjustment mechanism, and the position adjustment mechanism is used to drive each of the supporting mechanisms to move relative to the base in a direction perpendicular to the axial direction of the through hole, and the control method includes: S1, obtaining the detection value of the pressure detection component; S2. When the detection value does not meet the preset pressure, the position adjustment mechanism is controlled to drive the plurality of supporting mechanisms to move relative to the base, so as to reduce the distance between the center of the workpiece to be processed and the center of the base in a direction perpendicular to the axial direction of the through hole.

8. The control method according to claim 7, characterized in that: Each of the supporting mechanisms comprises the pressure detection member, and the supporting member in any of the supporting mechanisms is supported by the pressure detection member. In the control method, The S1 includes: Obtaining the detection value of each of the pressure detection components; The S2 includes: When any one of the plurality of detection values ​​does not satisfy the corresponding preset pressure, based on the plurality of detection values, obtaining an offset vector of the center of the workpiece to be processed relative to the center of the base; When the value of the offset vector is less than or equal to the adjustment range of the position adjustment mechanism, the position adjustment mechanism is controlled to drive the plurality of holding mechanisms to move relative to the base, wherein the adjustment distance of the position adjustment mechanism is equal to the value of the offset vector, and the adjustment direction is opposite to the direction of the offset vector; When the value of the offset vector is greater than the adjustment range of the position adjustment mechanism, the workpiece to be processed is controlled to be moved out of the process chamber.

9. The control method according to claim 8, characterized in that: When the value of the offset vector is greater than the adjustment range of the position adjustment mechanism, controlling the workpiece to be processed to move out of the process chamber includes: When the value of the offset vector is greater than the adjustment range of the position adjustment mechanism and less than a preset offset, the workpiece to be processed is controlled to be moved out of the process chamber and the film transfer step is performed again; When the value of the offset vector is greater than the adjustment range of the position adjustment mechanism and is equal to or greater than the preset offset, the workpiece to be processed is controlled to be moved out of the process chamber and an alarm message is issued.

10. A semiconductor process equipment, characterized in that: It comprises a process chamber and the supporting assembly according to any one of claims 1 to 6, wherein the base is installed in the process chamber in a liftable manner.

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