Mounting device and mounting method

Abstract

The present invention provides a mounting device and a mounting method for supplying a large amount of cooling air and a large amount of electric power to a heater with a simple structure. A bonding device (200) for mounting a large-scale semiconductor chip (130) on a substrate (41) comprises: a first bonding head (10) and a second bonding head (20) to which power and cooling air are supplied, respectively; and a large heater (60) attached to the lower portion of the first joining head (10), and the joining device (200) comprises: a first large heater connection cable (18C) and a second large heater connection cable (28C) connecting the large heater (60) with the first joining head (10) and the second joining head (20), respectively; and a first large-scale heater cooling air connection pipe (17C) and a second large-scale heater cooling air connection pipe (27C) respectively connecting the large-scale heater (60) and the first joint (10) and the second joint (20).

Description

Technical Field

[0001] The present invention relates to a mounting device and a mounting method for mounting a semiconductor chip on a wafer or a substrate. Background Art

[0002] In recent years, semiconductor chips have become larger in size. Therefore, Patent Document 1 discloses a mounting device in which two suction cups are mounted on a motor base, and a large collet is sucked and held by the two suction cups to pick up a large semiconductor chip.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent No. 7228932 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] When mounting a semiconductor chip on a wafer or substrate, the semiconductor chip is rapidly heated by a heater and pressed and mounted on the wafer by a bonding tool. Then, in order to mount the next semiconductor chip, the heater or bonding tool needs to be rapidly cooled. Therefore, a ceramic heater capable of high-speed heating is used as the heater, and in most cases, cooling air is supplied to the heater.

[0008] However, if the semiconductor chip is enlarged, the heater is also enlarged. Therefore, the heat capacity of the heater becomes larger, and the power required for high-speed heating becomes larger. In addition, the flow rate of cooling air required for cooling also increases. Therefore, it is required to supply a large amount of power and a large amount of cooling air to the heater.

[0009] Therefore, an object of the present disclosure is to supply a large amount of electric power and a large amount of cooling air to a heater with a simple structure.

[0010] [Technical means to solve the problem]

[0011] The mounting device disclosed in the present invention mounts a semiconductor chip on a mounted body, and the mounting device is characterized in that it includes: a plurality of mounting heads, which are supplied with power and cooling air; and a heater, which is mounted at the bottom of one mounting head, and the mounting device includes: a cable, which connects the heater and each mounting head; and a cooling air piping, which connects the heater and each mounting head.

[0012] In this way, power and cooling air can be supplied to the heater from one mounting head and other mounting heads via cables and cooling air piping, so that a large amount of power and a large amount of cooling air can be supplied to the heater with a simple structure. Thus, the heater can be rapidly heated and rapidly cooled, and semiconductor chips can be mounted in a short time.

[0013] In the mounting device of the present disclosure, mounting heads other than the one mounting head may be arranged near the one mounting head and move following the one mounting head.

[0014] This makes it possible to shorten the cables and connecting pipes of the electric cables and cooling air pipes attached to other mounting heads and the heater.

[0015] In the mounting device of the present disclosure, while one mounting head presses the semiconductor chip to the mounted object, the other mounting heads can press the semiconductor chip from above the heater.

[0016] This makes it possible to mount a semiconductor chip, for which the pressing force by one mounting head is insufficient, on a mounting target object.

[0017] In the mounting device of the present disclosure, the mounted object may be a wafer, a substrate, or other semiconductor chips.

[0018] The mounting method disclosed herein mounts a semiconductor chip on a mounted body, and the mounting method is characterized in that a mounting device including a plurality of mounting heads is prepared, the plurality of mounting heads are supplied with power and cooling air, a heater is mounted at the bottom of one mounting head, the heater and each mounting head are respectively connected by cables, and the heater and each mounting head are connected by cooling air piping, power is supplied from each mounting head to the heater via each cable to heat the semiconductor chip, and at the same time, the semiconductor chip is pressed to the mounted body by one mounting head, and then, cooling air is supplied from each mounting head to the heater via each cooling air piping to cool the heater.

[0019] In the mounting method of the present disclosure, mounting heads other than the one mounting head may be arranged near the one mounting head and may be moved following the one mounting head.

[0020] In the mounting method of the present disclosure, while one mounting head presses the semiconductor chip to the mounted object, the other mounting heads may press the semiconductor chip from above the heater.

[0021] In the mounting method of the present disclosure, the mounted object may be a wafer, a substrate, or other semiconductor chips.

[0022] [Effects of the Invention]

[0023] The mounting device disclosed in the present invention can supply a large amount of power and a large amount of cooling air to the heater with a simple structure, thereby enabling rapid heating and rapid cooling of the heater, and enabling semiconductor chips to be mounted in a short time. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is an elevation view showing the structure of a bonding device according to a reference example.

[0025] Figure 2 It is an elevation view showing a joining device according to an embodiment.

[0026] Figure 3 It is a flowchart showing the operation of the bonding apparatus according to the embodiment.

[0027] Figure 4 This is an explanatory diagram showing the operation of the bonding apparatus according to the embodiment, and is a diagram showing a state in which the first nozzle is lowered to press the large semiconductor chip against the substrate while the large semiconductor chip is heated by the large heater.

[0028] Figure 5 It is an explanatory diagram showing the operation of the bonding apparatus according to the embodiment, and is a diagram showing a state in which the first nozzle is raised and cooling air is passed through the large heater to cool the large heater.

[0029] Figure 6 It is an elevation view showing the structure of a joining device according to another embodiment.

[0030] Figure 7 Yes means Figure 6 The diagram is an explanatory diagram of the operation of the bonding apparatus shown, and shows a state in which the large semiconductor chip is pressed against the substrate by lowering the first nozzle while the large semiconductor chip is heated by the large heater, and the large semiconductor chip is pressed from above the large heater by the second nozzle.

[0031] Figure 8 It is a plan view showing the structure of a bonding device according to still another embodiment.

[0032] [Explanation of Symbols]

[0033] 10: First bonding head / bonding head

[0034] 11: First Subject

[0035] 12: First nozzle / nozzle

[0036] 12A: First slider

[0037] 12B: First nozzle part

[0038] 13: First Voice Coil Motor / Voice Coil Motor

[0039] 14: First Y-direction driving unit / Y-direction driving unit

[0040] 15: First small heater / small heater

[0041] 16: First small bonding tool / small bonding tool

[0042] 17A: First cooling air supply pipe / cooling air supply pipe

[0043] 17B: First cooling air connecting pipe / cooling air connecting pipe

[0044] 17C: First large heater cooling air connecting pipe / large heater cooling air connecting pipe

[0045] 18A: First power supply cable / power supply cable

[0046] 18B: First connection cable / connection cable

[0047] 18C: First large heater connection cable / Large heater connection cable

[0048] 20: Second bonding head / bonding head

[0049] 21: Second Subject

[0050] 22: Second nozzle / nozzle

[0051] 22A: Second slider

[0052] 22B: Second nozzle section

[0053] 23: Second voice coil motor / voice coil motor

[0054] 24: Second Y-direction driving unit / Y-direction driving unit

[0055] 25: Second small heater / small heater

[0056] 26: Second small bonding tool / small bonding tool

[0057] 27A: Second cooling air supply pipe / cooling air supply pipe

[0058] 27B: Second cooling air connecting pipe / cooling air connecting pipe

[0059] 27C: Second large heater cooling air connecting pipe / large heater cooling air connecting pipe

[0060] 28A: Second power supply cable / power supply cable

[0061] 28B: Second connection cable / connection cable

[0062] 28C: Second large heater connection cable / large heater connection cable

[0063] 30: Guide rail

[0064] 31: X-direction drive unit

[0065] 40: Jointing table

[0066] 41: Substrate

[0067] 50: Control Department

[0068] 51: CPU

[0069] 52: Memory

[0070] 60, 61, 62: Large heater

[0071] 65: Large joining tools

[0072] 70: Third joint head / joining head

[0073] 72: Third nozzle / nozzle

[0074] 77C: Third large heater cooling air connecting pipe / large heater cooling air connecting pipe

[0075] 78C: Third large heater connection cable / large heater connection cable

[0076] 80: Fourth joint head / joining head

[0077] 82: Fourth nozzle / nozzle

[0078] 87C: Fourth large heater cooling air connecting pipe / large heater cooling air connecting pipe

[0079] 88C: 4th Large Heater Connection Cable / Large Heater Connection Cable

[0080] 91, 92, 93, 94: Arrows

[0081] 100, 200, 300, 400: Jointing device

[0082] 110, 120: Small semiconductor chips

[0083] 130: Large semiconductor chips

[0084] S101, S102, S103, S104, S105, S106: Steps

[0085] X, Y, Z: direction DETAILED DESCRIPTION

[0086] Hereinafter, a bonding device 200 as a mounting device according to an embodiment will be described with reference to the drawings. Before describing the bonding device 200 according to the embodiment, a bonding device 100 according to a reference example will be described. Figure 1As shown, in the following description, the extending direction of the guide rail 30 which is parallel to the bonding stage 40 is referred to as the Y direction, the direction perpendicular to the Y direction in the horizontal plane is referred to as the X direction, and the up-down direction is referred to as the Z direction.

[0087] like Figure 1 As shown, the bonding apparatus 100 includes: a bonding stage 40, a guide rail 30, an X-direction drive unit 31, a first bonding head 10, a second bonding head 20, a first small heater 15, a second small heater 25, a first small bonding tool 16, a second small bonding tool 26, a first cooling air supply pipe 17A, a second cooling air supply pipe 27A, a first cooling air connection pipe 17B, a second cooling air connection pipe 27B, a first power supply cable 18A, a second power supply cable 28A, a first connection cable 18B, a second connection cable 28B, and a control unit 50. The bonding apparatus 100 can simultaneously mount two small semiconductor chips 110 and 120 on a substrate 41 using the first bonding head 10 and the second bonding head 20.

[0088] like Figure 1 As shown, a substrate 41 as a mounted object is vacuum-adsorbed on the upper surface of the bonding stage 40. In addition, a small semiconductor chip 110 and a small semiconductor chip 120 may be bonded to the upper surface of the substrate 41. In this case, the mounted object is the other small semiconductor chips 110 and 120 bonded to the substrate 41. In addition, a wafer as another mounted object may be vacuum-adsorbed on the upper surface of the bonding stage 40.

[0089] The guide rail 30 is a long member extending in the Y direction on the upper part of the bonding table 40. The guide rail 30 may be, for example, a Y-direction track of a gantry crane. The guide rail 30 is driven by an X-direction driving unit 31 in the X direction orthogonal to the Y direction.

[0090] The first bonding head 10 includes a first body 11, a first Y-direction driving unit 14, and a first nozzle 12. The first bonding head 10 is a mounting head. The first Y-direction driving unit 14 is guided by a guide rail 30 and moves along the Y-direction by a Y-direction driving motor housed therein.

[0091] The first body 11 is connected to the lower side of the first Y-direction driving unit 14 and moves in the Y direction integrally with the first Y-direction driving unit 14. The first body 11 accommodates a first voice coil motor 13 for driving the first nozzle 12 in the Z direction.

[0092] The first nozzle 12 includes a first slider 12A that moves in the vertical direction by a first voice coil motor 13, and a first nozzle 12B that vacuum-adsorbs the first small heater 15 on the lower surface. The first nozzle 12 is connected to a first cooling air supply pipe 17A and a first power supply cable 18A that supply cooling air and power from the outside.

[0093] The first small heater 15 is fixed to the lower surface of the first nozzle part 12B by screws. In the bonding device 100 of the reference example, the planar shape of the first small heater 15 is substantially the same as the planar shape of the first nozzle part 12B, and the first small heater 15 is fixed to the lower surface of the first nozzle part 12B by screws in such a way that the outer periphery is consistent with the lower surface of the first nozzle part 12B. The first small heater 15 is a ceramic heater capable of rapid heating.

[0094] The first small bonding tool 16 is vacuum-adsorbed on the lower surface of the first small heater 15. The small semiconductor chip 110 is vacuum-adsorbed on the lower surface of the first small bonding tool 16.

[0095] The first nozzle 12 and the first small heater 15 are connected by a first cooling air connection pipe 17B and a first connection cable 18B. The first small heater 15 is supplied with cooling air from the first nozzle 12 via the first cooling air connection pipe 17B. In addition, the first small heater 15 is supplied with power from the first nozzle 12 via the first connection cable 18B.

[0096] The second bonding head 20 includes a second body 21, a second Y-direction drive unit 24, and a second nozzle 22 in the same manner as the first bonding head 10. The second body 21 and the second Y-direction drive unit 24 have the same structure as the first body 11 and the first Y-direction drive unit 14 of the first bonding head 10 described above. The second nozzle 22 includes a second slider 22A and a second nozzle 22B in the same manner as the first nozzle 12, and the second small heater 25 is fixed to the lower surface of the second nozzle 22B by screws. The second small bonding tool 26 and the small semiconductor chip 120 are vacuum-adsorbed on the lower surface of the second small heater 25. The second nozzle 22 is connected to the second cooling air supply pipe 27A and the second power supply cable 28A, and the second nozzle 22 and the second small heater 25 are connected by the second cooling air connection pipe 27B and the second connection cable 28B. In addition, the second bonding head 20 is another mounting head.

[0097] The control unit 50 is a computer including a central processing unit (CPU) 51 and a memory 52 storing a control program or control data. The first Y-direction driving unit 14, the second Y-direction driving unit 24, the X-direction driving unit 31, the first voice coil motor 13, the second voice coil motor 23, the first small heater 15, and the second small heater 25 are connected to the control unit 50 and operate according to the command of the control unit 50. The control unit 50 drives the first bonding head 10 and the second bonding head 20 in the XY direction through the first Y-direction driving unit 14, the second Y-direction driving unit 24, and the X-direction driving unit 31, and moves the first nozzle 12 and the second nozzle 22 in the up-down direction through the first voice coil motor 13 and the second voice coil motor 23, and simultaneously mounts the two small semiconductor chips 110 and 120 on the substrate 41.

[0098] Next, refer to Figure 2 The joining device 200 as an installation device of an embodiment is described. The joining device 200 includes, similarly to the joining device 100 described above, a joining table 40, a guide rail 30, an X-direction drive unit 31, a first joining head 10, a second joining head 20, a first cooling air supply pipe 17A, a second cooling air supply pipe 27A, a first power supply cable 18A, a second power supply cable 28A, and a control unit 50. Their structures are similar to those described above. Figure 1 Since the configurations of the components of the bonding apparatus 100 described above are the same, descriptions thereof will be omitted.

[0099] like Figure 2 As shown, the bonding device 200 is a device in which the first small heater 15 and the second small heater 25 fixed to the lower surfaces of the first nozzle 12 and the second nozzle 22 of the bonding device 100 by screws are removed, and the large heater 60 is fixed to the center of the lower surface of the first nozzle 12 by screws. The plane size of the large heater 60 is the same as the plane size of the large semiconductor chip 130, and is larger than the plane size of the lower surface of the first nozzle 12. Therefore, when the large heater 60 is fixed to the lower surface of the first nozzle 12, the outer peripheral portion of the large heater 60 protrudes to the outside of the first nozzle 12. In addition, the large bonding tool 65 is vacuum-adsorbed on the lower surface of the large heater 60. The large semiconductor chip 130 is vacuum-adsorbed on the lower surface of the large bonding tool 65.

[0100] In addition, the large heater 60 is set as "large" to distinguish it from the first small heater 15 and the second small heater 25 described above, but it does not necessarily need to be larger than the first small heater 15 and the second small heater 25. For example, in the case of a process that requires more power or cooling air flow than conventional heaters, the present invention can be applied regardless of the size of the heater. Similarly, the large bonding tool 65 and the large semiconductor chip 130 do not necessarily need to be larger than the small bonding tool 16, the small bonding tool 26, the small semiconductor chip 110, and the small semiconductor chip 120, respectively.

[0101] The first nozzle 12 and the large heater 60 are connected by a first large heater cooling air connection pipe 17C as a cooling air pipe and a first large heater connection cable 18C as an electric cable. In addition, the second nozzle 22 and the large heater 60 are connected by a second large heater cooling air connection pipe 27C as a cooling air pipe and a second large heater connection cable 28C as an electric cable. Moreover, cooling air is supplied from the first nozzle 12 and the second nozzle 22 to the large heater 60 via the first large heater cooling air connection pipe 17C and the second large heater cooling air connection pipe 27C. In addition, power is supplied from the first nozzle 12 and the second nozzle 22 to the large heater 60 via the first large heater connection cable 18C and the second large heater connection cable 28C. In addition, the large heater 60 is connected to the control unit 50 and operates according to the command of the control unit 50.

[0102] The second bonding head 20 arranges the second nozzle 22 near the first nozzle 12 of the first bonding head 10 and at a position separated from the first nozzle 12. The second nozzle 22 is located slightly above the first nozzle 12, and a gap is left between the lower surface of the second nozzle 22 and the upper surface of the large heater 60.

[0103] The first bonding head 10 is a master bonding head that moves the large semiconductor chip 130 to a bonding position to be bonded according to the instruction of the control unit 50. In addition, the first bonding head 10 is a mounting head. The second bonding head 20 is a slave bonding head that is arranged near the first bonding head 10 and moves following the first bonding head 10. The second bonding head 20 is another mounting head. As described above, there is a gap between the lower surface of the second nozzle 22 of the second bonding head 20 and the upper surface of the large heater 60, and the second nozzle 22 does not press the large heater 60.

[0104] Next, refer to Figures 3 to 5The operation of the bonding device 200 will be described. The operation of the bonding device 200 is realized by the CPU 51 of the control unit 50 executing a control program stored in the memory 52. ​​Before the bonding device 200 is operated, remove the Figure 1 The first small heater 15 and the second small heater 25 of the bonding device 100 shown in the figure are fixed to the lower surface of the first nozzle 12 by screws. Then, the large bonding tool 65 is vacuum-adsorbed to the lower surface of the large heater 60, thereby forming Figure 2 The engagement device 200 is shown.

[0105] like Figure 3 As shown in step S101, the control unit 50 moves the first bonding head 10 and the second bonding head 20 to the pick-up table (not shown) by the first Y-direction drive unit 14, the second Y-direction drive unit 24, and the X-direction drive unit 31. At this time, the control unit 50 operates the first Y-direction drive unit 14 and the X-direction drive unit 31 to move the first bonding head 10 along the XY direction so that the center of the first nozzle 12 of the first bonding head 10 overlaps with the center of the large semiconductor chip 130 placed on the pick-up table. In addition, the control unit 50 moves the second bonding head 20 along the XY direction following the first bonding head 10 by the second Y-direction drive unit 24.

[0106] Then, after the center of the first nozzle 12 reaches the center position of the large semiconductor chip 130, the control unit 50 operates the first voice coil motor 13 to lower the first nozzle 12, so that the large semiconductor chip 130 is vacuum-adsorbed on the lower surface of the large bonding tool 65. Then, the control unit 50 operates the first voice coil motor 13 to raise the first nozzle 12, and picks up the large semiconductor chip 130 from the pickup stage. At this time, the control unit 50 does not lower the second nozzle 22, but maintains the second nozzle 22 at a height where the lower surface is slightly above the upper surface of the large semiconductor chip 130. The position of the second nozzle 22 is referred to as a standby position.

[0107] Next, if Figure 3 As shown in step S102, the control unit 50 moves the first bonding head 10 and the second bonding head 20 onto the bonding stage 40 via the first Y-direction driving unit 14, the second Y-direction driving unit 24, and the X-direction driving unit 31. Figure 3 As shown in step S103, the control unit 50 operates the first Y-direction drive unit 14 and the X-direction drive unit 31 to move the center of the first nozzle 12 to the center of the bonding position. In addition, the control unit 50 moves the second bonding head 20 following the first bonding head 10 and arranges the second nozzle 22 at the standby position.

[0108] Next, if Figure 3 Step S104, Figure 4 As shown, the control unit 50 supplies power from the first nozzle 12 and the second nozzle 22 to the large heater 60 via the first large heater connection cable 18C and the second large heater connection cable 28C, and operates the large heater 60 to rapidly heat the large semiconductor chip 130. Then, the control unit 50 operates the first voice coil motor 13, and Figure 4 The first nozzle 12 is lowered as shown by the arrow 91 in the figure, and the large semiconductor chip 130 is pressed to the bonding position of the substrate 41 while being heated, so that the large semiconductor chip 130 is mounted on the substrate 41. At this time, the control unit 50 does not operate the second voice coil motor 23 and keeps the second nozzle 22 at the standby position.

[0109] Next, the control unit 50 releases the vacuum suction of the large semiconductor chip 130. Figure 3 Step S105, Figure 5 The first voice coil motor 13 is operated as shown by the arrow 92 in the figure to raise the first nozzle 12. Then, the control unit 50 supplies cooling air from the first nozzle 12 and the second nozzle 22 to the large heater 60 via the first large heater cooling air connection pipe 17C and the second large heater cooling air connection pipe 27C, thereby rapidly cooling the large heater 60 and the large bonding tool 65.

[0110] After the large heater 60 and the large bonding tool 65 are cooled, the control unit 50 enters Figure 3 The control unit 50 performs the following steps: Figure 3 In step S106, it is determined whether the large semiconductor chip 130 is mounted at all the bonding positions. Then, the control unit 50 Figure 3 If the judgment in step S106 is "No", the Figure 3 In step S101, the next large semiconductor chip 130 is picked up and the next large semiconductor chip 130 is bonded to the next bonding position. Figure 3 If the determination result in step S106 is "YES", the control unit 50 ends the installation operation.

[0111] As described above, the bonding apparatus 200 of the embodiment supplies power to the large heater 60 from the first nozzle 12 and the second nozzle 22 via the first large heater connection cable 18C and the second large heater connection cable 28C, so that a large amount of power can be supplied to the large heater 60 at one time. Thus, the large heater 60 can be heated rapidly. In addition, the bonding apparatus 200 of the embodiment supplies cooling air to the large heater 60 from the first nozzle 12 and the second nozzle 22 via the first large heater cooling air connection pipe 17C and the second large heater cooling air connection pipe 27C, so that a large amount of cooling air can be circulated to the large heater 60 at one time. Thus, the large heater 60 can be cooled rapidly. Therefore, the large heater 60 can be rapidly heated and rapidly cooled with a simple structure, and the large semiconductor chip 130 can be mounted in a short time.

[0112] Furthermore, since the second bonding head 20 is configured to follow the movement of the first bonding head 10, the lengths of the first large heater connection cable 18C, the second large heater connection cable 28C, the first large heater cooling air connection pipe 17C, and the second large heater cooling air connection pipe 27C can be shortened, thereby simplifying the structure.

[0113] In addition, in the above embodiment, the case where the large semiconductor chip 130 is mounted on the substrate 41 is described, but the bonding device 200 may also vacuum adsorb the wafer onto the bonding stage 40 and mount the large semiconductor chip 130 on the wafer. In addition, the substrate 41 or wafer with the large semiconductor chip 130 mounted on it may be vacuum adsorbed onto the bonding stage 40, and a second-level large semiconductor chip 130 may be stacked and mounted on the large semiconductor chip 130.

[0114] In addition, in the above description, the first cooling air supply pipe 17A, the second cooling air supply pipe 27A, and the first power supply cable 18A and the second power supply cable 28A are respectively connected to the first nozzle 12 and the second nozzle 22, but the present invention is not limited thereto. For example, the first cooling air supply pipe 17A, the second cooling air supply pipe 27A, the first power supply cable 18A, and the second power supply cable 28A may be respectively connected to the first body 11 and the second body 21. In this case, the first large heater cooling air connection pipe 17C and the first large heater connection cable 18C may be connected between the first body 11 and the large heater 60, and the second large heater cooling air connection pipe 27C and the second large heater connection cable 28C may be connected between the second body 21 and the large heater 60.

[0115] Next, refer to Figure 6 Another embodiment of the bonding apparatus 300 will be described. Figure 1, Figure 2 The same parts of the bonding apparatus 100 and the bonding apparatus 200 described above are denoted by the same reference numerals, and the description thereof will be omitted.

[0116] The joining device 300 is a device that offsets the screw fixing position of the large heater 61 to the first nozzle 12. Figure 6 As shown, when the large heater 61 is fixed to the lower surface of the first nozzle 12 , the standby position of the second nozzle 22 can be overlapped with the upper surface of the right side of the large heater 61 .

[0117] Furthermore, when the control unit 50 Figure 7 When the first nozzle 12 is lowered as shown by the arrow 93 in FIG. 1 and the large semiconductor chip 130 is pressed to the bonding position of the substrate 41, as shown in FIG. Figure 7 As shown by the arrow 94 in FIG. 1 , the second nozzle 22 is lowered in coordination with the first nozzle 12, and the upper surface of the large heater 61 is pressed by the lower surface of the second nozzle 22. Thus, the second nozzle 22 presses the large semiconductor chip 130 from above the large heater 61 to the substrate 41. In this way, in the bonding apparatus 300, the large semiconductor chip 130 is pressed to the substrate 41 by the first nozzle 12 and the second nozzle 22.

[0118] according to Figure 6 , Figure 7 The bonding apparatus 300 described in can mount a large semiconductor chip 130 , for which the pressing force by the first nozzle 12 alone is insufficient, on the substrate 41 .

[0119] Next, refer to Figure 8 A bonding apparatus 400 according to still another embodiment will be described.

[0120] like Figure 8 As shown, the bonding apparatus 400 includes a third bonding head 70 and a fourth bonding head 80 in addition to the first bonding head 10 and the second bonding head 20. The central portion of the large heater 62 is fixed to the lower surface of the first nozzle 12 by screws. The first bonding head 10 is a master bonding head, and the second to fourth bonding heads 20, 70, 80 are slave bonding heads that follow the first bonding head 10.

[0121] The third nozzle 72 and the fourth nozzle 82 of the third bonding head 70 and the fourth bonding head 80 are connected to the large heater 62 by the third large heater cooling air connection pipe 77C and the fourth large heater cooling air connection pipe 87C as cooling air pipes and the third large heater connection cable 78C and the fourth large heater connection cable 88C as electrical cables. Furthermore, cooling air is supplied from the first to the fourth nozzles 12, 22, 72, 82 to the large heater 62 via the first to the fourth large heater cooling air connection pipes 17C, 27C, 77C, 87C. Furthermore, electric power is supplied from the first to the fourth nozzles 12, 22, 72, 82 to the large heater 62 via the first to the fourth large heater connection cables 18C, 28C, 78C, 88C.

[0122] The joining device 400 supplies power and cooling air to the large heater 62 from the four large heater connection cables 18C, 28C, 78C, and 88C and the four large heater cooling air connection pipes 17C, 27C, 77C, and 87C, respectively, so that a larger amount of cooling air and a larger amount of power can be supplied to the large heater 62 compared with the case of the joining device 200 described above. As a result, the large heater 62 can be heated more quickly and cooled more quickly.

[0123] Therefore, the large semiconductor chip 130 can be mounted in a shorter time.

[0124] In the above description, the bonding apparatus 400 includes four bonding heads, namely the first to fourth bonding heads 10 , 20 , 70 , and 80 , but the present invention is not limited thereto. For example, the bonding apparatus 400 may include three bonding heads or four or more bonding heads.

Claims

1. A mounting device for mounting a semiconductor chip on a mounted body, The installation device is characterized in that it comprises: Multiple mounting heads, supplied with power and cooling air; and a heater, mounted on a lower portion of a mounting head, The installation device includes: a cable connecting the heater and each of the installation heads; and a cooling air pipe connecting the heater and each of the mounting heads.

2. The mounting device according to claim 1, characterized in that: The other mounting heads other than the one mounting head are arranged near the one mounting head, and move following the one mounting head.

3. The mounting device according to claim 2, characterized in that: When the one mounting head presses the semiconductor chip to the mounted object, the other mounting head presses the semiconductor chip from above the heater.

4. The mounting device according to any one of claims 1 to 3, characterized in that: The mounted object is a wafer, a substrate or other semiconductor chips.

5. A mounting method, comprising mounting a semiconductor chip on a mounted body, The installation method is characterized in that preparing a mounting device including a plurality of mounting heads, the plurality of mounting heads being supplied with power and cooling air, A heater is installed at the bottom of a mounting head. The heater and each mounting head are connected by a cable, and the heater and each mounting head are connected by a cooling air pipe. The semiconductor chip is heated by supplying power from each mounting head to the heater via each of the cables, and the semiconductor chip is pressed to the mounted body by one mounting head. Thereafter, cooling air is supplied from each of the mounting heads to the heater via each of the cooling air pipes to cool the heater.

6. The installation method according to claim 5, characterized in that: Mounting heads other than the one mounting head are arranged near the one mounting head and are moved to follow the one mounting head.

7. The installation method according to claim 6, characterized in that: When the one mounting head presses the semiconductor chip to the mounted object, the other mounting head presses the semiconductor chip from above the heater.

8. The installation method according to any one of claims 5 to 7, characterized in that: The mounted object is a wafer, a substrate or other semiconductor chips.

Images