A microelectronic chip packaging device and a packaging process

Abstract

This application relates to a microelectronic chip packaging device and a packaging process, belonging to the technical field of microelectronic chip packaging. It includes a film laminating machine, on which a clamping mechanism is provided. An encapsulation machine is installed outside the film laminating machine, and a robotic arm is installed on the encapsulation machine. For this microelectronic chip packaging device and process, when packaging the microelectronic chip frame, first remove a peeling layer and directly laminate a film on the back of the microelectronic chip frame and then fix it to the bottom of the heating plate. Soften the adhesive film outside the microelectronic chip frame through the heating base to make the microelectronic chip frame fully contact with the adhesive film. Then transfer the baked microelectronic chip frame to the processing seat through the robotic arm, and perform grinding and leveling on the microelectronic chip frame to remove the excess adhesive layer.

Description

Technical Field

[0001] This application relates to the technical field of microelectronic chip packaging, and specifically provides a microelectronic chip packaging device and a packaging process. Background Art

[0002] Microelectronic chip packaging refers to installing a chip in a housing to protect the chip, enhance its electrothermal performance, and achieve connection with external circuits. The packaging process includes fixing and sealing the chip in a protective shell and connecting it to other electronic components through pins. Its main function is to protect the chip from external environments such as temperature changes, humidity, dust, and static electricity, ensuring that the chip can operate stably under various working conditions.

[0003] For example, in the patent with publication number CN113698890A, the support film obtained by coating a polyimide resin binder on a polyimide film substrate and a specific preparation method has good performance, can prevent the welding resin from penetrating into the shielding area during the plastic packaging process to form burrs, has good heat resistance, and has no residual glue after peeling at high temperature, thus improving the wire bonding yield.

[0004] However, when packaging microelectronic chips, due to comprehensive factors such as the reduction of the bonding area on the back of the high-density frame, frequent physical friction during long-term material transportation, high-temperature environment, and high-power plasma cleaning process, it is extremely easy to cause deformation of the frame structure, local peeling or damage and leakage of the glue film, which will ultimately directly lead to a decrease in product yield and reliability. Summary of the Invention

[0005] The purpose of this application is to provide a microelectronic chip packaging device.

[0006] A microelectronic chip packaging device provided by this application adopts the following technical solutions:

[0007] A microelectronic chip packaging device includes a film laminating machine, a clamping mechanism is arranged on the film laminating machine, a packaging machine is installed outside the film laminating machine, and a robotic arm is installed on the packaging machine;

[0008] The clamping mechanism includes a fixed shell, a connecting rod, a torsion spring, a clamping plate, and a gasket. The fixed shell is installed on the film laminating machine, one end of the fixed shell is connected through the connecting rod, the outer wall of the connecting rod is sleeved with the torsion spring, one end of the connecting rod is connected through the clamping plate, and the gasket is fixed on the outer wall of the clamping plate.

[0009] By adopting the above technical solution, when the microelectronic chip frame is fixed to the bottom of the heating plate through the clamping plate, as the microelectronic chip frame is installed, the clamping plates on both sides of the heating plate will be extruded outwards. At this time, the torsion spring will provide a pulling force, and at the same time, the friction between the microelectronic chip frame and the clamping plate is increased through the gasket, so that it is not easy to fall off on the heating plate.

[0010] Optionally, the film laminating machine includes a housing, a heating base, a push rod and a heating plate. The heating base is installed inside the housing, the push rod is installed inside the housing, and a heating plate is fixed to one end of the push rod.

[0011] By adopting the above technical solution, then the ultra-thin rigid fixture is installed on the heating base, and then the microelectronic chip frame is installed on the heating plate. Then, the heating plate presses the film up and down onto the ultra-thin rigid fixture, and then the microelectronic chip frame is transported to the packaging machine for packaging.

[0012] Optionally, a grinding mechanism is provided outside the film laminating machine. The grinding mechanism includes a machine body, a support frame, a cover plate, a processing seat, a telescopic rod, a motor and a grinding disc. The machine body is installed outside the housing. A support frame is fixed on the machine body, a cover plate is fixed on the support frame, a processing seat is arranged on the machine body, a telescopic rod is installed on the bottom wall of the cover plate, a motor is installed at one end of the telescopic rod, and a grinding disc is installed at the output end of the motor.

[0013] Optionally, a fixing component is provided on the grinding mechanism. The fixing component includes a chute, a mounting block, a cylinder and a fixing plate. A chute is opened on the machine body, a mounting block is arranged on the machine body, a cylinder is arranged on the outer wall of the mounting block, a fixing plate is arranged at the output end of the cylinder, and the fixing plate can slide in the chute.

[0014] By adopting the above technical solution, when the microelectronic chip frame is ground and leveled, the telescopic rod extends downward, and then the motor with the grinding disc is moved downward. When the grinding disc is about to contact the microelectronic chip frame, the telescopic rod stops extending at this time. Then the motor is started, and the motor drives the grinding disc to rotate. At the same time, the telescopic rod is controlled to move downward slowly until the grinding disc contacts the microelectronic chip frame and then stops telescoping. Then the microelectronic chip frame can be ground and leveled to remove the excess adhesive layer.

[0015] Optionally, the robotic arm includes a base, a clamping arm and a clamping block. The base is installed on the packaging machine, the clamping arm is arranged on the base, and the clamping block is arranged on the clamping arm.

[0016] By adopting the above technical solution, the frame after grinding and leveling treatment is transported to the film laminating machine by a robotic arm. Before transportation, the ultra-thin rigid fixture is installed on the heating base, and then the microelectronic chip frame is installed on the heating plate. Then, the film is pressed onto the ultra-thin rigid fixture by the up-and-down movement of the heating plate. Subsequently, the microelectronic chip frame is transported to the encapsulation machine for encapsulation.

[0017] Optionally, the robotic arm is provided with a buffer assembly. The buffer assembly includes an installation groove, a connection hole, a limiting groove, a spring, a connection column, and a buffer block. An installation groove is opened on the outer wall of the clamping block. A connection hole is opened on the inner wall of the installation groove. A limiting groove is opened on the inner wall of the installation groove. A spring is installed inside the limiting groove. A connection column is installed inside the connection hole. One end of the connection column is fixed with a buffer block.

[0018] By adopting the above technical solution, when using the robotic arm to transport the microelectronic chip frame, at this time, the clamping arm rotates on the base, and the microelectronic chip frame is clamped by the clamping block. At this time, the buffer block will first come into contact with the microelectronic chip frame, and as the clamping block tightens, the buffer block will contract into the installation groove. At the same time, the spring will provide an outward force, which can avoid problems such as film wrinkles, foreign object adhesion, or scratches caused by physical friction during the transfer of the microelectronic chip frame, resulting in a decrease in the coplanarity of the pins and pads and inability to perform bonding and wire bonding. Moreover, the buffer block is made of a soft material, so that the film layer is not easily detached during the transfer of the microelectronic chip frame.

[0019] Optionally, a cleaning assembly is provided on the grinding mechanism. The cleaning assembly includes a fixed groove, a blower, an air supply pipe, an air outlet pipe, and a protective net. A fixed groove is opened on the outer wall of the machine body. A blower is installed inside the fixed groove. An air supply pipe is connected through the inner wall of the fixed groove. One end of the air supply pipe is fixed with an air outlet pipe. A protective net is installed on the inner wall of the fixed groove.

[0020] Optionally, the sliding grooves are symmetrically opened with respect to the central axis of the machine body, and the mounting blocks are evenly distributed on the machine body.

[0021] Optionally, one end of the torsion spring is connected to the heating plate, and the other end of the torsion spring is connected to the clamping plate.

[0022] By adopting the above technical solution, when grinding and leveling the microelectronic chip frame to remove the excess adhesive layer, the blower is started, and air is blown onto the surface of the microelectronic chip frame through the air supply pipe and the air outlet pipe. At this time, the flowing air will blow away the dust generated on the surface of the microelectronic chip frame due to grinding, thereby avoiding the influence of dust on the effect of the grinding disc in removing the adhesive layer.

[0023] A microelectronic chip encapsulation process includes the following steps:

[0024] S1. First, remove one layer of the release layer and directly apply the film on the back of the frame. After bonding, fix the frame on the heating plate through the clamping mechanism, then press the heating plate downward by the push rod to contact the heating base, and then apply pressure to level it. Utilize the characteristic that the adhesive layer becomes soft at high temperature to make the frame and the film fully contact;

[0025] S2. For the baked frame, remove the remaining release layer, place the frame sideways on the processing base and perform grinding and leveling treatment through the grinding disc to remove the excess adhesive layer;

[0026] S3. Transfer the frame after grinding and leveling to the laminator again through the robotic arm. Before transfer, install the ultra-thin rigid fixture on the heating base, then install the microelectronic chip frame on the heating plate, and then press the film up and down by the heating plate onto the ultra-thin rigid fixture. Subsequently, transfer the microelectronic chip frame to the encapsulator for encapsulation.

[0027] In summary, the present application includes at least one of the following beneficial technical effects:

[0028] 1. When encapsulating the microelectronic chip frame, first remove one layer of the release layer and directly apply the film on the back of the microelectronic chip frame. Then, fix it at the bottom of the heating plate through the clamping plate. Soften the film outside the microelectronic chip frame through the heating base to make the microelectronic chip frame and the film fully contact. Then, transfer the baked microelectronic chip frame to the processing base through the robotic arm, perform grinding and leveling treatment on the microelectronic chip frame to remove the excess adhesive layer. Then, transfer it to the laminator again through the robotic arm. Before transfer, install the ultra-thin rigid fixture on the heating base, then install the microelectronic chip frame on the heating plate, and then press the film up and down by the heating plate onto the ultra-thin rigid fixture. Subsequently, transfer the microelectronic chip frame to the encapsulator for encapsulation;

[0029] 2. When fixing the microelectronic chip frame at the bottom of the heating plate through the clamping plate, as the microelectronic chip frame is installed, the clamping plates on both sides of the heating plate will be extruded outward. At this time, the torsion spring will provide a pulling force, and at the same time, increase the friction between the microelectronic chip frame and the clamping plate through the gasket to make it not easy to fall off on the heating plate;

[0030] 3. When using the robotic arm to transfer the microelectronic chip frame, the clamping arm rotates on the base at this time, and the microelectronic chip frame is clamped by the clamping block. At this time, the buffer block will first come into contact with the microelectronic chip frame, and as the clamping block tightens, the buffer block will contract into the installation groove. At the same time, the spring will provide an outward force to clamp the microelectronic chip frame while avoiding problems such as film wrinkles, foreign object attachment, or scratches caused by physical friction during the transfer of the microelectronic chip frame, which may lead to issues such as the inability to bond and wire bond after the coplanarity of the pins and pads decreases. Moreover, the buffer block is made of a soft material, making it difficult for the film layer to fall off during the transfer of the microelectronic chip frame. Brief Description of the Drawings

[0031] Figure 1 is the overall structural schematic diagram of the embodiment of the present application;

[0032] Figure 2 is the schematic diagram of the clamping mechanism of the embodiment of the present application;

[0033] Figure 3 is the schematic diagram of the grinding mechanism of the embodiment of the present application;

[0034] Figure 4 is the schematic diagram of the fixing component of the embodiment of the present application;

[0035] Figure 5 is the schematic diagram of the encapsulation machine of the embodiment of the present application;

[0036] Figure 6 is the schematic diagram of the buffer component of the embodiment of the present application;

[0037] Figure 7 is the schematic diagram of the cleaning component of the embodiment of the present application.

[0038] Description of the reference numerals: 1, film laminating machine; 11, housing; 12, heating base; 13, push rod; 14, heating plate; 2, clamping mechanism; 21, fixed shell; 22, connecting rod; 23, torsion spring; 24, clamping plate; 25, gasket; 3, grinding mechanism; 31, machine body; 32, support frame; 33, cover plate; 34, processing base; 35, telescopic rod; 36, motor; 37, grinding disc; 4, fixing component; 41, chute; 42, mounting block; 43, cylinder; 44, fixing plate; 5, encapsulation machine; 6, robotic arm; 61, base; 62, clamping arm; 63, clamping block; 7, buffer component; 71, installation groove; 72, connection hole; 73, limit groove; 74, spring; 75, connecting column; 76, buffer block; 8, cleaning component; 81, fixing groove; 82, fan; 83, air supply pipe; 84, air outlet pipe; 85, protective net. Detailed Description of the Embodiment

[0039] The following is combined with the attached Figure 1 - attached Figure 7, a further detailed description of the present application is provided.

[0040] Embodiment: A microelectronic chip packaging device includes a film laminating machine 1, a clamping mechanism 2 is arranged on the film laminating machine 1, a packaging machine 5 is installed outside the film laminating machine 1, and a robotic arm 6 is installed on the packaging machine 5;

[0041] The clamping mechanism 2 includes a fixed shell 21, a connecting rod 22, a torsion spring 23, a clamping plate 24 and a gasket 25. Fixed shells 21 are symmetrically installed on the heating plate 14. Two groups of fixed shells 21 are respectively penetrated and connected with a connecting rod 22. A torsion spring 23 is sleeved on the outer wall of the connecting rod 22. The end of the connecting rod 22 is penetrated and connected with a clamping plate 24. A gasket 25 is fixed on the outer wall of the clamping plate 24. When the microelectronic chip frame is fixed to the bottom of the heating plate 14 through the clamping plate 24, as the microelectronic chip frame is installed on the bottom wall of the heating plate 14, at this time, the clamping plates 24 on both sides of the heating plate 14 will be extruded outward by the microelectronic chip frame, and the torsion spring 23 will provide a pulling force. At the same time, the friction between the microelectronic chip frame and the clamping plate 24 is increased through the gasket 25, so that it is not easy to fall off on the heating plate 14.

[0042] The film laminating machine 1 includes a housing 11, a heating base 12, a push rod 13 and a heating plate 14. A heating base 12 is installed inside the housing 11. A push rod 13 is installed inside the housing 11. One end of the push rod 13 is fixed with a heating plate 14. Then, the ultra-thin rigid fixture is installed on the heating base 12 by clamping. Then, the microelectronic chip frame is installed on the heating plate 14 through the clamping plate 24. Then, the film is pressed up and down by the heating plate 14 onto the ultra-thin rigid fixture. Subsequently, the microelectronic chip frame is transferred to the packaging machine 5 by the robotic arm 6 for packaging.

[0043] A grinding mechanism 3 is arranged outside the film laminating machine 1. The grinding mechanism 3 includes a machine body 31, a support frame 32, a cover plate 33, a processing seat 34, a telescopic rod 35, a motor 36 and a grinding disc 37. The machine body 31 is installed outside the film laminating machine 1. The support frame 32 is fixed on the machine body 31. The cover plate 33 is fixed on the support frame 32. The processing seat 34 is arranged on the machine body 31. The telescopic rod 35 is installed on the bottom wall of the cover plate 33. One end of the telescopic rod 35 is installed with a motor 36. The output end of the motor 36 is installed with a grinding disc 37. Then, when grinding and leveling the microelectronic chip frame, the telescopic rod 35 extends downward, and then the motor 36 equipped with the grinding disc 37 is moved downward. When the grinding disc 37 is about to contact the microelectronic chip frame, at this time, the telescopic rod 35 stops extending. At this time, the motor 36 is started, and the motor 36 drives the grinding disc 37 to rotate. At the same time, the telescopic rod 35 is controlled to move downward slowly until the grinding disc 37 contacts the microelectronic chip frame and then stops telescoping. Then, the microelectronic chip frame can be ground and leveled to remove the excess adhesive layer.

[0044] A fixing component 4 is provided on the grinding mechanism 3. The fixing component 4 includes a chute 41, a mounting block 42, a cylinder 43 and a fixing plate 44. A chute 41 is formed on the body 31. A mounting block 42 is provided on the body 31. A cylinder 43 is provided on the outer wall of the mounting block 42. The output end of the cylinder 43 is provided with a fixing plate 44, and the fixing plate 44 can slide in the chute 41. When grinding and leveling the microelectronic chip frame, the baked microelectronic chip frame is transported to the processing seat 34 by the robotic arm 6. At this time, the cylinder 43 on the mounting block 42 will push the fixing plate 44 along the chute 41, so as to externally fix the microelectronic chip frame on the processing seat 34.

[0045] The robotic arm 6 includes a base 61, clamping arms 62 and clamping blocks 63. The base 61 is installed on the encapsulator 5. The clamping arms 62 are provided on the base 61. The clamping blocks 63 are provided on the clamping arms 62. Then, during encapsulation, the microelectronic chip frame is transported by the robotic arm 6. The frame after grinding and leveling is transported to the film laminator 1 by the robotic arm 6. Before transportation, the ultra-thin rigid fixture is installed on the heating seat 12, and then the microelectronic chip frame is installed on the heating plate 14. Then, the heating plate 14 presses the film down to the ultra-thin rigid fixture, and then the microelectronic chip frame is transported to the encapsulator 5 for encapsulation.

[0046] The robotic arm 6 is provided with a buffer component 7. The buffer component 7 includes a mounting groove 71, a connection hole 72, a limiting groove 73, a spring 74, a connection column 75 and a buffer block 76. A mounting groove 71 is formed on the outer wall of the clamping block 63. A connection hole 72 is formed on the inner wall of the mounting groove 71. A limiting groove 73 is formed on the inner wall of the mounting groove 71. A spring 74 is installed inside the limiting groove 73. A connection column 75 is installed inside the connection hole 72. One end of the connection column 75 is fixed with a buffer block 76. Then, when the robotic arm 6 is used to transport the microelectronic chip frame, at this time, the clamping arm 62 rotates on the base 61 and clamps the microelectronic chip frame through the clamping block 63. At this time, the buffer block 76 will first contact the microelectronic chip frame, and as the clamping block 63 tightens, the buffer block 76 will contract into the mounting groove 71. At the same time, the spring 74 will provide an outward force to clamp the microelectronic chip frame while avoiding problems such as film wrinkles, foreign object adhesion or scratches caused by physical friction during the transfer of the microelectronic chip frame, resulting in a decrease in the coplanarity of the pins and pads and inability to perform bonding and wire bonding. Moreover, the buffer block 76 is made of a soft material, so that the film layer is not easily peeled off during the transfer of the microelectronic chip frame. When the robotic arm 6 places the microelectronic chip frame on the bottom wall of the heating plate 14 and then the robotic arm 6 releases the fixation of the microelectronic chip frame, at this time, the spring 74 will push out the buffer block 76 to continue to fix the microelectronic chip frame to ensure that the microelectronic chip frame is completely installed on the bottom wall of the heating plate 14.

[0047] A cleaning component 8 is provided on the grinding mechanism 3. The cleaning component 8 includes a fixing groove 81, a blower 82, an air supply pipe 83, an air outlet pipe 84, and a protective net 85. A fixing groove 81 is formed in the outer wall of the machine body 31. A blower 82 is installed inside the fixing groove 81. An air supply pipe 83 is connected through the inner wall of the fixing groove 81. One end of the air supply pipe 83 is fixed with an air outlet pipe 84. A protective net 85 is installed on the inner wall of the fixing groove 81. When grinding and leveling the microelectronic chip frame to remove the excess adhesive layer, the blower 82 is started, and air is blown onto the surface of the microelectronic chip frame through the air supply pipe 83 and the air outlet pipe 84. At this time, the flowing air will blow away the dust generated on the surface of the microelectronic chip frame due to grinding, thereby avoiding the influence of dust on the effect of the grinding disc 37 in removing the adhesive layer.

[0048] The microelectronic chip packaging process includes the following steps:

[0049] S1. First, remove a release layer and directly apply a film to the back of the frame. Fix the bonded frame on the heating plate 14 through the clamping mechanism. Then, press the heating plate 14 downward through the push rod 13 to contact the heating base 12, and then apply pressure to level it. Utilize the characteristic that the adhesive layer becomes soft at high temperature to make the frame fully contact with the film.

[0050] S2. For the frame that has been baked, remove the remaining release layer. Place the frame on the processing seat 34 sideways and perform grinding and leveling treatment through the grinding disc 37 to remove the excess adhesive layer.

[0051] S3. Transfer the frame after grinding and leveling treatment to the laminator 1 again through the robotic arm 6. Before transfer, install the ultra-thin rigid fixture on the heating base 12. Then, install the microelectronic chip frame on the heating plate 14. Then, press the film up and down through the heating plate 14 onto the ultra-thin rigid fixture. Subsequently, transfer the microelectronic chip frame to the packaging machine 5 for packaging.

[0052] The implementation principle of the embodiments of this application is as follows: When packaging a microelectronic chip, first remove a release layer and directly apply a film on the back of the microelectronic chip frame. Then, fix the microelectronic chip frame to the bottom of the heating plate 14 through the clamping plate 24. At this time, press the heating plate 14 downward through the push rod 13 so that the adhesive film outside the microelectronic chip frame contacts the heated heating base 12. At this time, soften the adhesive film outside the microelectronic chip frame through the heating base 12 to make the microelectronic chip frame fully contact the adhesive film. Then, transfer the baked microelectronic chip frame to the processing base 34 through the robotic arm 6. At this time, the air cylinder 43 on the mounting block 42 will push the fixing plate 44 out along the sliding groove 41, thereby fixing the outside of the microelectronic chip frame on the processing base 34. Then, the telescopic rod 35 extends downward, and further moves the motor 36 equipped with the grinding disc 37 downward. When the grinding disc 37 is about to contact the microelectronic chip frame, the telescopic rod 35 stops extending at this time. Then, start the motor 36, and the motor 36 drives the grinding disc 37 to rotate. At the same time, control the telescopic rod 35 to move downward slowly until the grinding disc 37 contacts the microelectronic chip frame and then stops telescoping. Then, the microelectronic chip frame can be ground and leveled to remove the excess adhesive layer. Then, transfer it to the laminator 1 again through the robotic arm 6. Before transfer, install the ultra-thin rigid fixture on the heating base 12, then install the microelectronic chip frame on the heating plate 14, and then press the film up and down to the ultra-thin rigid fixture through the heating plate 14. Subsequently, transfer the microelectronic chip frame to the encapsulator 5 for encapsulation. The encapsulator 5 will place the chip on a pre-prepared encapsulation substrate. After the chip and the substrate are aligned, the encapsulator firmly bonds the chip to the substrate through methods such as hot pressing and ultrasonic welding. Finally, the encapsulator will also perform back encapsulation to protect the chip and its connection points. This step may include injecting epoxy resin or using other encapsulation materials to ensure the integrity and durability of the encapsulation.

[0053] The embodiments of this specific implementation manner are all preferred embodiments of this application, and do not limit the protection scope of this application accordingly. The same components are denoted by the same reference numerals. Therefore, all equivalent changes made according to the structure, shape, and principle of this application shall be covered within the protection scope of this application.

Claims

1. A microelectronic chip packaging device, comprising a film laminating machine (1), the film laminating machine (1) being provided with a clamping mechanism (2), a packaging machine (5) being installed outside the film laminating machine (1), and a mechanical arm (6) being installed on the packaging machine (5), characterized in that; The clamping mechanism (2) comprises a fixed shell (21), a connecting rod (22), a torsion spring (23), a clamping plate (24) and a gasket (25); the fixed shell (21) is installed on the film laminating machine (1); one end of the fixed shell (21) is connected to the connecting rod (22); the outer wall of the connecting rod (22) is sleeved with a torsion spring (23); one end of the connecting rod (22) is connected to the clamping plate (24); the outer wall of the clamping plate (24) is fixed with a gasket (25); the outside of the film laminating machine (1) is provided with a grinding mechanism (3); the grinding mechanism (3) comprises a body (31), a support frame (32), a cover plate (33), a processing seat (34), a telescopic rod (35), a motor (36) and a grinding disc (37); the outside of the film laminating machine (1) is provided with a body (31); the body (31) is fixed with a support frame (32); A support frame (32) is provided, a cover plate (33) is fixed on the support frame (32), a processing seat (34) is provided on the machine body (31), a telescopic rod (35) is installed on the bottom wall of the cover plate (33), a motor (36) is installed on one end of the telescopic rod (35), a grinding disc (37) is installed on the output end of the motor (36), a fixing assembly (4) is provided on the grinding mechanism (3), the fixing assembly (4) comprises a slide groove (41), a mounting block (42), a cylinder (43) and a fixing plate (44), a slide groove (41) is provided on the machine body (31), a mounting block (42) is provided on the machine body (31), a cylinder (43) is provided on the outer wall of the mounting block (42), a fixing plate (44) is provided on the output end of the cylinder (43), and the fixing plate (44) can slide in the slide groove (41).

2. A microelectronic chip packaging device according to claim 1, characterized in that: The film laminating machine (1) comprises a housing (11), a heating seat (12), a push rod (13) and a heating plate (14); the heating seat (12) is installed inside the housing (11); the push rod (13) is installed inside the housing (11); and the heating plate (14) is fixed to one end of the push rod (13).

3. A microelectronic chip packaging device according to claim 2, characterized in that: The mechanical arm (6) comprises a base (61), a clamping arm (62) and a clamping block (63); the packaging machine (5) is mounted with the base (61); the base (61) is provided with the clamping arm (62); and the clamping block (63) is provided with the clamping arm (62).

4. A microelectronic chip packaging device according to claim 3, characterized in that: The mechanical arm (6) is provided with a buffer assembly (7), the buffer assembly (7) comprising a mounting groove (71), a connecting hole (72), a limiting groove (73), a spring (74), a connecting column (75) and a buffer block (76), the outer wall of the clamping block (63) is provided with a mounting groove (71), the inner wall of the mounting groove (71) is provided with a connecting hole (72), the inner wall of the mounting groove (71) is provided with a limiting groove (73), the inner part of the limiting groove (73) is provided with a spring (74), the inner part of the connecting hole (72) is provided with a connecting column (75), and one end of the connecting column (75) is fixed with a buffer block (76).

5. A microelectronic chip packaging device according to claim 4, characterized in that: The grinding mechanism (3) is provided with a cleaning assembly (8), the cleaning assembly (8) comprising a fixed groove (81), a fan (82), an air supply pipe (83), an air outlet pipe (84) and a protective net (85); the outer wall of the machine body (31) is provided with a fixed groove (81), the fan (82) is installed inside the fixed groove (81), the inner wall of the fixed groove (81) is connected with an air supply pipe (83), one end of the air supply pipe (83) is fixed with an air outlet pipe (84), and the inner wall of the fixed groove (81) is provided with a protective net (85).

6. The microelectronic chip packaging device according to claim 5, characterized in that: The slide grooves (41) are symmetrically opened with respect to the central axis of the machine body (31), and the mounting blocks (42) are evenly spaced on the machine body (31).

7. The microelectronic chip packaging device according to claim 6, characterized in that: One end of the torsion spring (23) is connected to the heating plate (14), and the other end of the torsion spring (23) is connected to the clamping plate (24).

8. A microelectronic chip packaging process, using a microelectronic chip packaging device according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1, first remove a layer of peeling layer and directly stick the film on the back of the frame, fix the frame on the heating plate (14) through a clamping mechanism after bonding, and then press the heating plate (14) downward through a push rod (13) to contact with the heating seat (12), and then apply pressure to level it, and use the characteristic of the adhesive layer becoming soft under high temperature to make the frame and the film fully contact; S2, remove the remaining peeling layer from the baked frame, place the frame side on the processing seat (34), and grind and level it with a grinding disc (37) to remove the excess adhesive layer; S3, the frame after grinding and leveling is transferred to the film laminating machine (1) again through the robot arm (6), and the ultra-thin rigid fixture is installed on the heating seat (12) before transportation, and then the microelectronic chip frame is installed on the heating plate (14), and then the film is pressed up and down onto the ultra-thin rigid fixture by the heating plate (14), and then the microelectronic chip frame is transferred to the packaging machine (5) for packaging.

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