Bonding head with individually displaceable bonding arms

Abstract

A method of transporting a plurality of electronic devices with a bond head mechanism having a bond head including a plurality of individually displaceable bond arms. The method includes, in a pick-up operation, moving the bond head mechanism to position a first bond arm of the bond head mechanism over a first electronic device of a set of electronic devices from an electronic device supply disposed in a pick-up region, and actuating only the first bonding arm to pick up the first electronic device from the set of electronic devices; and moving the bond head to position a second bond arm of the bond head over a second electronic device of the set of electronic devices, and actuating only the second bond arm of the bond head to pick up the second electronic device.

Description

Technical Field

[0001] The present invention relates to a method and apparatus for transferring a plurality of electronic devices using a bond head mechanism having a bond head including a plurality of individually displaceable bond arms. Background Art

[0002] When processing electronic devices (e.g., chips, dies, or other such parts), it may be desirable to provide an apparatus having a bond head mechanism for picking up, transferring, and placing such objects at a bonding station for bonding. For example, a die may be picked up by the bond head mechanism (with the aid of an ejector if necessary) and transferred to a bonding location on a substrate (e.g., a lead frame bond pad on a workpiece fixture at a bonding station). As production volume requirements increase, processing performance may also need to increase accordingly.

[0003] However, when looking to increase processing performance, some problems may arise.

[0004] It would be beneficial to provide a device having improved performance compared to the prior art. Summary of the invention

[0005] Therefore, an object of the present invention is to seek to provide a method and / or apparatus that at least overcomes some of the problems in the above-mentioned prior art.

[0006] According to a first aspect of the present invention, there is provided a method for conveying a plurality of electronic devices using a bond head mechanism, the bond head mechanism having a bond head including a plurality of individually displaceable bond arms. The method comprises: in a picking operation, moving the bond head mechanism to position a first bond arm of the bond head mechanism over a first electronic device from a group of electronic devices from an electronic device supply source disposed in a picking area, and actuating only the first bond arm to pick up the first electronic device from the group of electronic devices; and moving the bond head to position a second bond arm of the bond head over a second electronic device from the group of electronic devices, and actuating only the second bond arm of the bond head to pick up the second electronic device.

[0007] A first aspect recognizes that the problem with improving electronic device processing performance is that the output may be limited by the distance the electronic devices need to be transported and the speed at which the bond head mechanism operates. In particular, changing the layout by shortening the pick-to-bond distance may cause interference between any ejectors, wafer stages, and workpiece fixtures. In addition, there are problems with increasing the bond head movement speed because the movement speed is limited by hardware such as encoder performance, linear slide guides, and module stiffness. In addition, increasing the movement speed will also shorten the service life of the linear slide guide and cause encoder signals to be lost. Therefore, a method is provided. The method can be a method of transporting multiple electronic devices, packages, or chips using a bond head mechanism. The bond head mechanism can have a bond head. The bond head can have multiple bond arms that can be individually displaced. The method can include: in a pick operation, moving the bond head mechanism to position a first bond arm of the bond head mechanism above a first electronic device in a group or set of electronic devices from an electronic device supply source or electronic device source disposed in a pick area. The method can include: actuating only or only the first bond arm to pick up the first electronic device from the group of electronic devices. The method may include: moving the bond head to position the second bond arm of the bond head above the second electronic device in the group of electronic devices. The method may include: actuating only the second bond arm of the bond head to pick up the second electronic device. In this way, multiple electronic devices can be picked up by the same bond head, thereby increasing the number of electronic devices that can be transferred and improving production.

[0008] The method may include: during the picking operation, moving the bond head to position a subsequent bond arm of the bond head over a subsequent electronic device in the group of electronic devices. The method may include: actuating only the subsequent bond arm of the bond head to pick up the subsequent electronic device from the group of electronic devices.

[0009] The method may include: during the picking operation, moving the bond head to position a third bond arm of the bond head over a third electronic device in the group of electronic devices. The method may include: actuating only the third bond arm of the bond head to pick up the third electronic device from the group of electronic devices.

[0010] The method may include: during the picking operation, moving the bond head to position a fourth bond arm of the bond head over a fourth electronic device in the group of electronic devices. The method may include: actuating only the fourth bond arm of the bond head to pick up the fourth electronic device from the group of electronic devices.

[0011] Each bond arm of the bond head may include a separate actuator, which is configured to displace the bond arm in a direction towards and away from the group of electronic devices. The method may include: activating the separate actuator associated with the bond arm so as to displace the bond arm only towards the group of electronic devices to engage with the corresponding electronic device, and then displacing the bond arm away from the group of electronic devices to pick up the electronic device. Therefore, individual bond arms can be displaced one by one. In this way, individual electronic devices can be picked up without having to pick up the entire group of electronic devices together. This is useful when the electronic devices to be picked up are adhered to an adhesive substrate and allows different spacings between the electronic devices and between the bond arms.

[0012] The method may include activating the separate actuator associated with the bond arm to displace only the bond arm between a retracted position spaced apart from the group of electronic devices and an extended position in contact with the respective electronic device to be picked up.

[0013] The method may include, during the picking operation, sequentially moving the group of electronic devices to position each electronic device in the group of electronic devices over an ejector pin, and shifting the ejector pin to pick up the electronic device through a corresponding bond arm. Thus, the same ejector may be reused to assist in picking up electronic devices.

[0014] The second bond arm of the bond head may be adjacent to the first bond arm of the bond head.

[0015] The second electronic device may be adjacent to the first electronic device in the group of electronic devices.

[0016] The first electronic device may be arranged adjacent to the second electronic device along a row of electronic devices.

[0017] The bond arms of the bond heads may be adjacent to each other in sequence.

[0018] The method may include, during a placement operation, moving the bond head to position the first bond arm of the bond head above a bonding position within a first portion of a substrate at a bonding station. The method may include actuating only the first bond arm of the bond head to place the first electronic device of the group of electronic devices at the bonding position within the first portion of the substrate. Thus, the bond head may be moved to the bonding position together with the picked-up electronic device. Furthermore, individual bond arms may be individually displaced one by one. This allows individual electronic devices to be placed without the need to place the entire group of devices together. This also allows different spacings between bonding positions and between bond arms.

[0019] The method may include, during the placing operation, subsequently moving the bond head to position the second bond arm of the bond head over a bonding location within the second portion of the substrate. The method may include actuating only the second bond arm of the bond head to place the second electronic device of the set of electronic devices at the bonding location within the second portion of the substrate.

[0020] The method may include subsequently moving the bond head to position a subsequent bond arm of the bond head over a bonding location within a subsequent portion of the substrate during the assembly operation. The method may include actuating only the subsequent bond arm of the bond head to place the subsequent electronic device of the set of electronic devices at the bonding location within the subsequent portion of the substrate.

[0021] The method may include, during the assembly operation, subsequently moving the bond head to position the third bond arm of the bond head over a bonding location within a third portion of the substrate. The method may include actuating only the third bond arm of the bond head to place the third electronic device of the set of electronic devices at the bonding location within the third portion of the substrate.

[0022] The method may include, during the placing operation, subsequently moving the bond head to position the fourth bond arm of the bond head over a bonding location within a fourth portion of the substrate. The method may include actuating only the fourth bond arm of the bond head to place the fourth electronic device of the group of electronic devices at the bonding location within the fourth portion of the substrate.

[0023] The bond head may include or be a first bond head. The bond head mechanism may also include a second or additional bond head separate from the first bond head. In other words, the bond head may include a plurality of bond heads. The second bond head may have a plurality of individually displaceable bond arms. The group of electronic devices may include a first group of electronic devices. The method may further include, in a pick and place operation, moving the second bond head to position a first bond arm of the second bond head over a first electronic device in the second group of electronic devices. The method may include actuating only the first bond arm of the second bond head to pick up the first electronic device from the second group of electronic devices. The method may include moving the first bond head to position the first bond arm of the first bond head over a first bonding position in a first portion of a substrate at a bonding station. The substrate may be divided into a plurality of bonding position portions. The method may include actuating only the first bond arm of the first bond head to place the first electronic device in the first group of electronic devices at the first bonding position in the first portion of the substrate. Thus, two bond heads may be provided. One bond head can place the electronic device while the other can pick it up. This helps improve yield.

[0024] The method may include subsequently moving the second bond head to position the second bond arm of the second bond head over a second electronic device in the second group of electronic devices during the pick and place operation. The method may include actuating only the second bond arm of the second bond head to pick up the second electronic device from the second group of electronic devices. The method may include subsequently moving the first bond head to position the second bond arm of the first bond head over a first bonding position within the second portion of the substrate. The method may include actuating only the second bond arm of the first bond head to place the second electronic device in the first group of electronic devices at the first bonding position within the second portion of the substrate.

[0025] The method may include subsequently moving the second bond head to position a subsequent bond arm of the second bond head over a subsequent electronic device in the second group of electronic devices during the pick and place operation. The method may include actuating only the subsequent bond arm of the second bond head to pick up the subsequent electronic device from the second group of electronic devices. The method may include subsequently moving the first bond head to position a subsequent bond arm of the first bond head over a first bonding position within a subsequent portion of the substrate. The method may include actuating only the subsequent bond arm of the first bond head to place the subsequent electronic device in the first group of electronic devices at the first bonding position within the subsequent portion of the substrate.

[0026] The method may include subsequently moving the second bond head to position a third bond arm of the second bond head over a third electronic device in the second group of electronic devices during the pick and place operation. The method may include actuating only the third bond arm of the second bond head to pick up the third electronic device from the second group of electronic devices. The method may include subsequently moving the first bond head to position the third bond arm of the first bond head over a first bonding position within a third portion of the substrate. The method may include actuating only the third bond arm of the first bond head to place the third electronic device in the first group of electronic devices at the first bonding position within the third portion of the substrate.

[0027] The method may include subsequently moving the second bond head to position a fourth bond arm of the second bond head over a fourth electronic device in the second group of electronic devices during the pick and place operation. The method may include actuating only the fourth bond arm of the second bond head to pick up the fourth electronic device from the second group of electronic devices. The method may include subsequently moving the first bond head to position the fourth bond arm of the first bond head over a first bonding position within a fourth portion of the substrate. The method may include actuating only the fourth bond arm of the first bond head to place the fourth electronic device of the first group of electronic devices at the first bonding position within the fourth portion of the substrate.

[0028] Each pick-up by the second bond head may occur simultaneously or synchronously with each placement by the first bond head.

[0029] The second bond arm of the second bond head may be adjacent to the first bond arm of the second bond head.

[0030] The second electronic device in the second group of electronic devices may be adjacent to the first electronic device in the second group of electronic devices.

[0031] Successive portions of the substrate may be adjacent to each other.

[0032] Each subsequent portion containing a bonding location may be adjacent to a previous portion containing a bonding location.

[0033] The method may include, in a placement operation, moving the second bond head to position the first bond arm of the second bond head over a second bonding location within the first portion of the substrate. The method may include actuating only the first bond arm of the second bond head to place the first electronic device of the second group of electronic devices at the second bonding location within the first portion of the substrate.

[0034] The method may include, during the placing operation, subsequently moving the second bond head to position the second bond arm of the second bond head over a second bonding location within the second portion of the substrate. The method may include actuating only the second bond arm of the second bond head to place the second electronic device of the second group of electronic devices at the second bonding location within the second portion of the substrate.

[0035] The method may include, during the placing operation, subsequently moving the second bond head to position a subsequent bond arm of the second bond head over a subsequent bond location within the third portion of the substrate. The method may include actuating only the subsequent bond arm of the second bond head to place the subsequent electronic device of the second group of electronic devices at the second bond location within the subsequent portion of the substrate.

[0036] The method may include, during the placing operation, subsequently moving the second bond head to position the third bond arm of the second bond head over a second bonding location within the third portion of the substrate. The method may include actuating only the third bond arm of the second bond head to place the third electronic device of the second group of electronic devices at the second bonding location within the third portion of the substrate.

[0037] The method may include, during the placing operation, subsequently moving the second bond head to position the fourth bond arm of the second bond head over a second bonding location within the fourth portion of the substrate. The method may include actuating only the fourth bond arm of the second bond head to place the fourth electronic device of the second group of electronic devices at the second bonding location within the fourth portion of the substrate.

[0038] The first bond head and the second bond head may share a common positioning mechanism, which is used to position the first bond head and the second bond head along orthogonal X-axis and Y-axis. Between different pick-up and / or placement positions, the first bond head and the second bond head can move together along the X-axis and move independently along the Y-axis.

[0039] According to a second aspect of the present invention, there is provided a device configured to perform the method according to the first aspect of the present invention.

[0040] According to a second aspect of the present invention, there is provided an apparatus for conveying a plurality of electronic devices, the apparatus comprising a bonding head mechanism having a plurality of individually displaceable bonding arms, the apparatus being operable to: in a picking operation, position a first bonding arm of the plurality of individually displaceable bonding arms above a first electronic device in a group of electronic devices in a picking area, and actuate only the first bonding arm to pick up the first electronic device from the group of electronic devices; and position a second bonding arm of the plurality of individually displaceable bonding arms above a second electronic device in the group of electronic devices, and actuate only the second bonding arm to pick up the second electronic device from the group of electronic devices.

[0041] The apparatus is operable to position a third bond arm of the plurality of individually displaceable bond arms over a third electronic device in the group of electronic devices and actuate only the third bond arm of the bond head to pick up the third electronic device from the group of electronic devices.

[0042] The apparatus is operable to position a fourth bond arm of the plurality of individually displaceable bond arms over a fourth electronic device in the group of electronic devices and actuate only the fourth bond arm of the bond head to pick up the fourth electronic device from the group of electronic devices.

[0043] Each bond arm of the bond head may include a separate actuator configured to shift the bond arm in a direction toward and away from the group of electronic devices, and the bond head mechanism is operable to activate the separate actuator associated with the bond arm so as to shift the bond arm only toward the group of electronic devices to engage with the corresponding electronic device, and then shift the bond arm away from the group of electronic devices to pick up the electronic device.

[0044] The bond head mechanism is operable to activate the individual actuators associated with the bond arms to displace only the bond arms between a retracted position spaced from the group of electronic devices and an extended position in contact with the respective electronic device to be picked up.

[0045] The apparatus may include an ejector pin and a mechanism configured to sequentially move the group of electronic devices to position each electronic device in the group of electronic devices over the ejector pin. The apparatus is operable to displace the ejector pin so as to pick up the electronic device by a corresponding bond arm.

[0046] The second bond arm of the bond head may be adjacent to the first bond arm of the bond head.

[0047] The second electronic device may be adjacent to the first electronic device in the group of electronic devices.

[0048] The first electronic device may be arranged adjacent to the second electronic device along a row of electronic devices.

[0049] The apparatus is operable to: during a placement operation, move the bond head to position the first bond arm of the bond head above a bonding position within a first portion of a substrate at a bonding station, and actuate only the first bond arm of the bond head to place the first electronic device of the group of electronic devices at the bonding position within the first portion of the substrate.

[0050] The apparatus is operable to subsequently move the bond head to position the second bond arm of the bond head above a bonding position within the second portion of the substrate, and actuate only the second bond arm of the bond head to place the second electronic device of the group of electronic devices at the bonding position within the second portion of the substrate.

[0051] The apparatus is operable to subsequently move the bond head to position the third bond arm of the bond head above a bonding position within a third portion of the substrate, and actuate only the third bond arm of the bond head to place the third electronic device of the group of electronic devices at the bonding position within the third portion of the substrate.

[0052] The apparatus is operable to subsequently move the bond head to position the fourth bond arm of the bond head above a bonding position within a fourth portion of the substrate, and actuate only the fourth bond arm of the bond head to place the fourth electronic device of the group of electronic devices at the bonding position within the fourth portion of the substrate.

[0053] The bond head may include a first bond head. The bond head mechanism may also include a second bond head separate from the first bond head. The second bond head may have a plurality of individually displaceable bond arms. The group of electronic devices may include a first group of electronic devices. The apparatus is operable to: in a pick and place operation, move the second bond head to position the first bond arm of the second bond head over a first electronic device in the second group of electronic devices, and actuate only the first bond arm of the second bond head to pick up the first electronic device from the second group of electronic devices; move the first bond head to position the first bond arm of the first bond head over a first bonding position in a first portion of a substrate at a bonding station. The substrate may be divided into a plurality of bonding position portions. The apparatus is operable to: actuate only the first bond arm of the first bond head to place the first electronic device in the first group of electronic devices at the first bonding position in the first portion of the substrate.

[0054] The device is operable to: subsequently move the second bond head to position the second bond arm of the second bond head above a second electronic device in the second group of electronic devices, and actuate only the second bond arm of the second bond head to pick up the second electronic device from the second group of electronic devices; subsequently move the first bond head to position the second bond arm of the first bond head above a first bonding position within the second part of the substrate, and actuate only the second bond arm of the first bond head to place the second electronic device in the first group of electronic devices at the first bonding position within the second part of the substrate.

[0055] The device is operable to: subsequently move the second bond head to position the third bond arm of the second bond head above a third electronic device in the second group of electronic devices, and actuate only the third bond arm of the second bond head to pick up the third electronic device from the second group of electronic devices; subsequently move the first bond head to position the third bond arm of the first bond head above a first bonding position within a third portion of the substrate, and actuate only the third bond arm of the first bond head to place a subsequent electronic device in the first group of electronic devices at the first bonding position within the third portion of the substrate.

[0056] The device is operable to: subsequently move the second bond head to position the fourth bond arm of the second bond head above a fourth electronic device in the second group of electronic devices, and actuate only the fourth bond arm of the second bond head to pick up the fourth electronic device from the second group of electronic devices; subsequently move the first bond head to position the fourth bond arm of the first bond head above a first bonding position within a fourth portion of the substrate, and actuate only the fourth bond arm of the first bond head to place the fourth electronic device in the first group of electronic devices at the first bonding position within the fourth portion of the substrate.

[0057] The apparatus is operable such that each pick-up by the second bond head is performed simultaneously with each placement by the first bond head.

[0058] The second bond arm of the second bond head may be adjacent to the first bond arm of the second bond head.

[0059] The second electronic device of the second group of electronic devices may be adjacent to the first electronic device of the second group of electronic devices.

[0060] Successive portions of the substrate may be adjacent to each other.

[0061] Each subsequent portion containing a bonding location may be adjacent to a previous portion containing a bonding location.

[0062] The device is capable of operating for: in a placement operation, moving the second bond head to position the first bond arm of the second bond head above a second bonding position within the first portion of the substrate, and actuating only the first bond arm of the second bond head to place the first electronic device of the second group of electronic devices at the second bonding position within the first portion of the substrate.

[0063] The apparatus is operable to subsequently move the second bond head to position the second bond arm of the second bond head above a second bonding position within the second portion of the substrate, and actuate only the second bond arm of the second bond head to place the second electronic device of the second group of electronic devices at the second bonding position within the second portion of the substrate.

[0064] The apparatus is operable to subsequently move the second bond head to position the third bond arm of the second bond head above a second bonding position within the third portion of the substrate, and actuate only the third bond arm of the second bond head to place the third electronic device of the second group of electronic devices at the second bonding position within the third portion of the substrate.

[0065] The apparatus is operable to subsequently move the second bond head to position the fourth bond arm of the second bond head above a second bonding position within the fourth portion of the substrate, and actuate only the fourth bond arm of the second bond head to place the fourth electronic device of the second group of electronic devices at the second bonding position within the fourth portion of the substrate.

[0066] The first bond head and the second bond head may share a common positioning mechanism for positioning the first bond head and the second bond head along orthogonal X-axis and Y-axis. The first bond head and the second bond head can move together along the X-axis and independently along the Y-axis between different pick and / or place positions.

[0067] These and other features, aspects and advantages will become better understood with reference to the specification portion, appended claims and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which:

[0069] Figure 1 schematically illustrates a pick and place apparatus with a single bond head according to one embodiment;

[0070] Figure 2A and Figure 2B The configuration and operation of a single bond arm is schematically shown in more detail;

[0071] FIG. 3A to FIG. 3E A pick-up operation using a single bond head is schematically shown;

[0072] FIG. 4A to FIG. 4EA placement operation using a single bond head is schematically shown;

[0073] Figure 5 schematically illustrates a pick and place apparatus with a dual bond head according to one embodiment;

[0074] FIG. 6A to FIG. 6I The picking operation is schematically shown;

[0075] FIG. 7A to FIG. 7Q A pick and place operation using a dual bond head is schematically shown;

[0076] FIG. 8A to FIG. 8C schematically illustrates a placement operation; and

[0077] Fig. 9 A pick and place apparatus with a dual bond head according to a further embodiment is schematically shown.

[0078] In the drawings, the same components are denoted by the same reference numerals. DETAILED DESCRIPTION

[0079] Before discussing the embodiments, an overview is first provided. Some embodiments provide a device in which a bond head is provided with a plurality of individually displaceable bond arms. A single bond arm can be extended at any time to pick up a single device from a pick-up position. This enables the bond arm to pick up multiple devices in sequence during a pick-up operation, thereby accommodating any spacing differences between the bond arm and the device. In addition, picking up multiple devices during a pick-up operation can reduce the number of transfers between the pick-up position and the bonding position, thereby increasing the yield of the device. A single bond arm can be extended at any time to place a single device at a bonding position. Similarly, this enables the bond arm to place multiple devices in sequence during a placement operation, thereby accommodating any spacing differences between the bond arm and the bonding position. Some embodiments provide a plurality of bond heads, each having a plurality of individually displaceable bond arms. In this way, a simultaneous or synchronous pick-and-place operation can be achieved, wherein one bond head picks up at a pick-up position and another bond head places at a bonding position. This again increases the yield of the device.

[0080] Pick and place equipment - single bond head

[0081] Figure 1Schematically illustrated is a pick-up and place device 10 according to an embodiment. The pick-up and place device 10 includes a bond head 20. The bond head 20 includes four individually displaceable bond arms 30A-30D, which are linearly arranged in a row adjacent to each other along the Y-axis direction. However, it should be understood that more than four or as few as two bond arms can be provided. Each bond arm 30A-30D has a pick-up end, in which a vacuum chuck can be located and configured to pick up, hold and release electronic devices. Each bond arm 30A-30D is held in the Z-axis direction by its own actuator and can be individually displaced in the Z-axis direction. Each actuator is connected to a Z-axis motor 50. The Z-axis motor 50 is mounted on a Z-axis guide rail 60. The Z-axis guide rail 60 is connected to a Y-axis motor 70. The Y-axis motor 70 is mounted on a Y-axis guide rail 80. The Y-axis guide rail 80 is connected to an X-axis motor 90. The X-axis motor 90 is mounted on an X-axis guide rail 100. Therefore, the bond head 20 can move along the X-axis, the Y-axis, and the Z-axis, and each of the bond arms 30A-30D can move along the Z-axis individually.

[0082] The pick and place apparatus 10 is provided with a supply of electronic components. In this example, the electronic components are separated from the wafer 110, which is held on an adhesive substrate on a wafer stage that can be positioned above the pick station. However, it should be understood that other arrangements of electronic components may be provided.

[0083] The pick and place apparatus 10 further comprises a bonding station 120 having a substrate 130, in this example a lead frame having a plurality of lead frame pads positioned at different bonding locations 140. The length direction of the substrate 130 is parallel to the Y-axis.

[0084] Bonding arm

[0085] Figure 2A and Figure 2B The configuration and operation of a single bond arm 30A is schematically shown in more detail. The actuator 40A is provided by a pair of magnets 42A placed on either side of a voice coil 44A. Current passing through the voice coil 44A causes the bond arm 30A to move in the Z-axis direction. Figure 2A The extended or lowered position of Figure 2B This movement is important so that the other bond arm does not contact an object on the pick-up or bonding station 120 while another bond arm is performing a pick-up or placement (bonding) process.

[0086] Therefore, as can be seen, the entire bond head 20 can be moved along the X-axis, the Y-axis, and the Z-axis by the operation of the motors 50, 70, 90 on their respective guide rails 60, 80, 100. In addition, each bond arm 30A-30D can also be individually moved between a retracted position and an extended position along the Z-axis direction by operating its actuator.

[0087] Pickup Operation

[0088] Figure 3A A picking operation according to one embodiment is schematically illustrated. A first electronic device 150A of a first group of electronic devices 160 from a wafer 110 is placed on an ejector, which may be in the form of ejector pins 170 , at a pick station 180 of the pick and place apparatus 10 .

[0089] The first electronic device 150A is located above the ejector pin 170, and the bond head 20 is located above the first electronic device 150A. The bond arms 30B-30D are in the retracted position, and the bond arm 30A is in the extended position. The bond head 20 moves along the Z axis toward the first electronic device 150A. Figure 3B As shown, when the bond head 20 leaves the pick-up station 180 , the pick-up end 35A picks up and holds the first electronic device 150A with the aid of the ejector pins 170 .

[0090] like Figure 3C As shown, the wafer 110 is moved relative to the pick-up station 180 to position the second electronic device 150B in the first group of electronic devices 160 above the ejection pins 170. The bond head 20 is moved so that the second bond arm 30B is located above the second electronic device 150B in the first group of electronic devices 160. Figure 3D As shown, the bond head 20 is lowered, wherein only the second bond arm 30B is in the extended position, while the other bond arms 30A, 30C, 30D are in the retracted position. Figure 3E As shown, when the bond head 20 is raised along the Z-axis away from the pick-up station 180 , the pick-up end 35 of the second bond arm 30B picks up the second electronic device 150B with the help of the ejector pin 170 .

[0091] like Figure 4A As shown, the process continues until each bonding arm 30A-30D picks up the relevant electronic device 150A-150D from the first group of electronic devices 160. Although in this example, the first group of electronic devices 160 includes adjacent electronic devices, it can be understood that this is not necessarily the case, and the first group of electronic devices 160 can also include other electronic devices in addition to adjacent electronic devices.

[0092] Placement Operation

[0093] Once each bond arm 30A-30D has picked up the associated electronic device 150A-150D, the bond head 20 is repositioned above the bond station 120 by operating the Z-axis motor 50, the Y-axis motor 70, and the X-axis motor 90. In particular, in this example, the bond station 120 is divided into four sections 210A-210D. However, it should be understood that more or fewer sections may be provided. The bond head 20 is positioned so that the bond arm 30A is located above the first bonding position in the first section 210A. As shown in FIG. Figure 4A As shown, only the first bond arm 30A is extended, while the other bond arms 30B-30D remain in the retracted position.

[0094] like Figure 4B As shown, the bond head 20 is displaced along the Z-axis direction toward the bonding station 120 , and the first electronic device 150A is placed at a first bonding position in the first portion 210A.

[0095] like Figure 4C As shown, the bond head 20 is raised along the Z axis away from the bonding station 120, the first bond arm 30A is retracted, and only the second bond arm 30B is extended. Figure 4D As shown, the bond head 20 is positioned such that the second bond arm 30B is located above the first bonding position in the second portion 210B.

[0096] As from Figure 4E As can be seen, the bond head 20 moves along the Z-axis direction and the second electronic device 150B is placed at the first bonding position in the second portion 210B. This process continues until each electronic device 150A-150D is placed at the first bonding position in each portion 210A-210D.

[0097] The bond head 20 then returns to the pick station 180 to pick up the next set of electronic devices in the next pick operation, and then returns to the bond station 120 to place the electronic devices in each section in a subsequent placement operation, and so on.

[0098] The placements are usually spread out over multiple sections because, since the spacing between bond arms is usually larger than the spacing between adjacent bond locations, it is more efficient in terms of Y-axis movement to move a larger distance in a single direction rather than continuously tracking in smaller increments in the opposite direction. There is no time penalty because the Z-axis up and down movement that is done simultaneously with the Y-axis movement also takes time. Even if the Y distance is shortened, in either case, the time required to traverse the larger Y distance does not exceed the time required to traverse the Z distance, and the end result is roughly the same. In addition, despite the smaller movement distance, the bond arm still needs some time to stabilize.

[0099] Pick and place equipment---dual bond head

[0100] Figure 5 A pick and place apparatus 10A according to one embodiment is schematically shown, which is similar to Figure 1 The device shown in FIG. However, the pick-and-place device 10A in the present embodiment includes a bond head 20 and a second bond head 220. The arrangement of the second bond head 220 is the same as that of the bond head 20. The second bond head 220 includes four bond arms 32A-32D that can be displaced individually. It should be understood that more than four or as few as two bond arms can be provided. Each bond arm 32A-32D has a pick-up end that can include a vacuum chuck that is configured to pick up, hold, and release electronic devices. Each bond arm 32A-32D is held in the Z-axis direction by its own actuator and can be moved individually in the Z-axis direction. Each actuator is connected to a Z-axis motor 50. The Z-axis motor is mounted on a Z-axis guide rail 60. The Z-axis guide rail 60 is connected to a Y-axis motor 70. The Y-axis motor 70 is mounted on a Y-axis guide rail 80. The Y-axis guide rail 80 is connected to an X-axis motor 90. The X-axis motor 90 is mounted on an X-axis guide rail 100. Thus, the second bond head 220 can move along the X-axis, the Y-axis, and the Z-axis, while each bond arm 32A-32D can move individually along the Z-axis. Thus, the bond arms 30A-30D, 32A-32D move together along the X-axis, while being independently movable along the Y-axis and the Z-axis. Providing a second bond head 220 that shares the same Y-axis guide 80 helps reduce the size of the device while increasing throughput.

[0101] Pickup Operation

[0102] Fig. 6A A picking operation according to one embodiment is schematically illustrated. A first electronic device 150A from a first group of electronic devices 160A from a wafer 110 is placed over ejector pins 170 at a pick station 180 of a pick and place apparatus 10A.

[0103] The first electronic device 150A is located above the ejector pin 170, and the bond head 20 is located above the first electronic device 150A. The bond arms 30B-30D are in the retracted position, and the first bond arm 30A is in the extended position. The bond head 20 moves along the Z axis toward the first electronic device 150A. Figure 6B As shown, before the bond head 20 leaves the pick-up station 180 , the pick-up end 35A picks up and holds the first electronic device 150A with the aid of the ejector pins 170 .

[0104] like Figure 6C As shown, the wafer 110 is moved relative to the pick-up station 180 to position the second electronic device 150B in the first group of electronic devices 160 above the ejection pins 170. The bond head 20 is moved so that the second bond arm 30B is located above the second electronic device 150B in the first group of electronic devices 160A. Fig.6D As shown, the bond head 20 is lowered, wherein only the second bond arm 30B is in the extended position, and the other bond arms 30A, 30C, 30D are in the retracted position. Fig. 6E As shown, before the bond head 20 is lifted away from the pick-up station 180 along the Z-axis direction, the pick-up end 35 of the second bond arm 30B picks up the second electronic device 150B by means of the ejector pin 170 .

[0105] like FIG. 6F to FIG. 6I As shown, the process continues until each bond arm 30A-30D picks up the associated electronic device 150A-150D from the first group of electronic devices 160A, as shown in FIG. Figure 4A Although in this example, the first group of electronic devices 160A includes adjacent electronic devices, it can be understood that this is not necessarily the case, and the first group of electronic devices 160 may also include other electronic devices in addition to adjacent electronic devices.

[0106] Pick and place operations

[0107] Once each bond arm 30A-30D has picked up the associated electronic device 150A-150D, the bond head 20 is repositioned over the bond station 120 by operating the Z-axis motor 50, the Y-axis motor 70, and the X-axis motor 90. In particular, in this example, the bond station 120 is divided into four sections 210A-210D. The bond head 20 is positioned so that the bond arm 30A is positioned over the first bonding position in the first section 210A. Fig. 7A As shown, only the first bond arm 30A is extended, and the other bond arms 30B-30D remain in the retracted position. Figure 7B As shown in FIG. 1 (which respectively show a schematic plan view and a schematic side view of the operation of the pick and place apparatus 10A), the first electronic device 155A in the second group of electronic devices 160B is located above the ejection pins 170, and the second bond head 220 is located above the first electronic device 155A. The bond arms 32B-32D are in the retracted position, and the first bond arm 32A is in the extended position.

[0108] like Figure 7C As shown, the second bond head 220 moves toward the first electronic device 150A along the Z-axis. At the same time, the bond head 220 moves toward the bonding station 120 along the Z-axis direction, and the first electronic device 150A is placed at the first bonding position in the first portion 210A.

[0109] like Fig.7D As shown, before the second bond head 220 leaves the pick-up station 180, the pick-up end of the bond arm 32A picks up and holds the first electronic device 155A by means of the ejector pin 170. At the same time, the bond head 20 is raised along the Z axis away from the bond station 120, and the first bond arm 30A is retracted.

[0110] like Fig. 7E As shown, only the second bond arm 30B of the bond head 20 is extended, and only the second bond arm 32B of the second bond head 220 is extended.

[0111] like Figure 7F As shown, the bond head 20 is positioned so that the second bond arm 30B is positioned above the first bonding position in the second portion 210B. At the same time, the wafer 110 is moved relative to the pick-up station 180 to position the second electronic device 155B in the second group of electronic devices 160B above the ejector pins 170. The second bond head 220 is moved to position the second bond arm 32B above the second electronic device 155B in the second group of electronic devices 160B. The second bond head 220 is moved along the Y axis to align the pick-up position of the second bond arm 32B. Since the bond head 20 and the second bond head 220 share the same bond head axis X, the ejector pins 170 and the indexing of the wafer stage will move accordingly to compensate for the X position of the second bond arm 32B during the pick-up process. Figure 7J There are similar operations in .

[0112] like Figure 7G As shown, the second bond head 20 is lowered, wherein only the second bond arm 32B is in the extended position, and the other bond arms 32A, 32C, 32D are in the retracted position. Then, the second bond arm 32B picks up the second electronic device 155B with the help of the ejection pin 170. At the same time, the bond head 20 moves along the Z-axis direction, and the second electronic device 150B is placed at the first bonding position in the second part 210B.

[0113] like FIG. 7H to FIG. 7Q As shown, this process continues until each electronic device 150A- 150D is placed at a first bonding position in each portion 210A- 210D by the bond head 20 , and each electronic device 155A- 155D is picked up by the second bond head 220 .

[0114] Placement Operation

[0115] Once each bond arm 32A-32D has picked up the associated electronic device 155A-155D, the bond head 20 is repositioned to one side of the bonding station 120. Fig. 8A As shown, the second bond head 220 is repositioned above the bonding station 120 .

[0116] The second bond head 220 is positioned so that the first bond arm 32A is positioned above the second bonding position in the first portion 210A. Figure 8B As shown, only the first bond arm 32A is extended, while the other bond arms 32B-32D remain in the retracted position.

[0117] The second bond head 20 is shifted toward the bonding station 120 along the Z-axis direction, and the first electronic device 150A is placed at the second bonding position in the first portion 210A.

[0118] This process continues until each electronic device 155A-155D is placed at a second bonding location in each portion 210A-210D.

[0119] Then, the bond head 20 and the second bond head 220 return to the pick-up station 180 to repeat the above-mentioned pick-up operation, pick-and-place operation, and placement operation for the next group of electronic devices, and so on.

[0120] Fig. 9 A pick and place device 10C according to a further embodiment is schematically shown, which is similar to Figure 5 The device shown. However, in the pick-and-place device 10C of the present embodiment, the bond head 20 and the bond arms of the second bond head 220 are arranged linearly along the X-axis. This can be achieved by changing or replacing the bond heads 20, 220 mounted on the Y-axis motor 70. Therefore, the replaced bond head has bond arms 30A-30D, 32A-32D arranged along the X-axis. In other words, the direction of the bond arms 30A-30D, 32A-32D has actually been rotated 90 degrees. In this case, the substrate is arranged so that its length extends parallel to the X-axis. However, it may also be advantageous (although not necessary) to rotate the substrate 130 so that its length extends parallel to the Y-axis, and then the various parts 210A-210D will also extend along the Y-axis.

[0121] In this embodiment, the bond head 20 and the second bond head 220 can move along the X-axis, the Y-axis, and the Z-axis, and each bond arm 30A-30D, 32A-32D can move individually along the Z-axis. Therefore, the bond arms 30A-30D, 32A-32D move together along the X-axis, but move independently of each other along the Y-axis and the Z-axis. Since the pick and place operation is similar to the conventional method except that the bond arms 30A-30D, 32A-32D are oriented in the X-axis direction instead of the Y-axis direction, the pick and place operation is performed in a manner similar to the conventional method. Figure 5 The above-described manner is performed to continuously pick up and / or place the electronic devices 150 , and therefore a detailed description of each process will not be repeated here.

[0122] Thus, it can be seen that some embodiments provide for chip transfer via a multi-bond arm module in a single or dual bond head configuration. This arrangement increases the number of chips transferred and improves the overall output or yield of the pick and place operation. In particular, some embodiments integrate a multi-bond arm module into one or both bond heads; using a local Z motor to control the up and down motion of the bond arm axis. A parallel pick and place bonding process is performed by a dual bond head equipped with four or more bond arms (one bond head performs the picking and the other bond head performs the bonding).

[0123] Although the present invention has been described in considerable detail with reference to certain embodiments, other embodiments are possible.

[0124] Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

Claims

1. A method of transferring a plurality of electronic devices using a bond head mechanism having a bond head including a plurality of individually displaceable bond arms, the method comprising: In a picking operation, the bond head mechanism is moved to position a first bond arm of the bond head mechanism over a first electronic device from a group of electronic devices from an electronic device supply source disposed in a picking area, and only the first bond arm is actuated to pick up the first electronic device from the group of electronic devices; as well as The bond head is moved to position a second bond arm of the bond head over a second electronic device in the group of electronic devices, and only the second bond arm of the bond head is actuated to pick up the second electronic device.

2. The method according to claim 1, comprising: During the picking operation, the bond head is moved to position a third bond arm of the bond head over a third electronic device in the group of electronic devices, and only the third bond arm of the bond head is actuated to pick up the third electronic device from the group of electronic devices.

3. The method according to claim 2, comprising: During the picking operation, the bond head is moved to position a fourth bond arm of the bond head over a fourth electronic device in the group of electronic devices, and only the fourth bond arm of the bond head is actuated to pick up the fourth electronic device from the group of electronic devices.

4. The method according to claim 1, wherein: Each bond arm of the bond head includes a separate actuator, which is configured to shift the bond arm in a direction toward and away from the group of electronic devices, and the actuation includes activating the separate actuator associated with the bond arm so as to shift the bond arm only toward the group of electronic devices to engage with the corresponding electronic device, and then shift the bond arm away from the group of electronic devices to pick up the electronic device.

5. The method according to claim 4, wherein: The actuation includes activating the separate actuator associated with the bond arm to displace only the bond arm between a retracted position spaced apart from the group of electronic devices and an extended position in contact with the respective electronic device to be picked up.

6. The method according to claim 1, comprising: During the picking operation, the group of electronic devices is moved sequentially to position each electronic device in the group of electronic devices over an ejector pin, and the ejector pin is displaced to pick up the electronic device by a corresponding bond arm.

7. The method according to claim 1, wherein: During the pick-up operation, the second bond arm of the bond head is adjacent to the first bond arm of the bond head.

8. The method according to claim 1, wherein: During the picking operation, the second electronic device is adjacent to the first electronic device in the group of electronic devices.

9. The method according to claim 1, wherein: During the picking operation, the first electronic device is arranged adjacent to the second electronic device along a row of electronic devices.

10. The method according to claim 1, comprising: During the placement operation, The bond head is moved to position the first bond arm of the bond head over a bonding location within a first portion of a substrate at a bonding station, and only the first bond arm of the bond head is actuated to place the first electronic device of the group of electronic devices at the bonding location within the first portion of the substrate.

11. The method according to claim 10, comprising: During the placement operation, The bond head is then moved to position the second bond arm of the bond head over a bonding position within the second portion of the substrate, and only the second bond arm of the bond head is actuated to place the second electronic device of the group of electronic devices at the bonding position within the second portion of the substrate.

12. The method according to claim 11, comprising: During the placement operation, The bond head is then moved to position the third bond arm of the bond head above a bonding position within a third portion of the substrate, and only the third bond arm of the bond head is actuated to place the third electronic device of the group of electronic devices at the bonding position within the third portion of the substrate.

13. The method according to claim 12, comprising: During the placement operation, The bond head is then moved to position the fourth bond arm of the bond head above a bonding position within a fourth portion of the substrate, and only the fourth bond arm of the bond head is actuated to place the fourth electronic device of the group of electronic devices at the bonding position within the fourth portion of the substrate.

14. The method according to claim 1, wherein: The bond head includes a first bond head, the bond head mechanism further includes a second bond head separate from the first bond head, the second bond head having a plurality of individually displaceable bond arms, and wherein the group of electronic devices includes a first group of electronic devices, and wherein, in a pick and place operation, the method further includes: moving the second bond head to position a first bond arm of the second bond head over a first electronic device in a second group of electronic devices, and actuating only the first bond arm of the second bond head to pick up the first electronic device from the second group of electronic devices; and The first bond head is moved to position the first bond arm of the first bond head above a first bonding position within a first portion of a substrate at a bonding station, the substrate being divided into a plurality of bonding position portions, and only the first bond arm of the first bond head is actuated to place the first electronic device of the first group of electronic devices at the first bonding position within the first portion of the substrate.

15. The method according to claim 14, comprising: During the pick and place operation, subsequently moving the second bond head to position a second bond arm of the second bond head over a second electronic device in a second group of electronic devices, and actuating only the second bond arm of the second bond head to pick up the second electronic device from the second group of electronic devices; as well as The first bond head is then moved to position the second bond arm of the first bond head above a first bonding position within the second portion of the substrate, and only the second bond arm of the first bond head is actuated to place the second electronic device of the first group of electronic devices at the first bonding position within the second portion of the substrate.

16. The method according to claim 15, comprising: During the pick and place operation, subsequently moving the second bond head to position a third bond arm of the second bond head over a third electronic device in the second group of electronic devices, and actuating only the third bond arm of the second bond head to pick up the third electronic device from the second group of electronic devices; as well as The first bond head is then moved to position the third bond arm of the first bond head above a first bonding location within a third portion of the substrate, and only the third bond arm of the first bond head is actuated to place a subsequent electronic device of the first group of electronic devices at the first bonding location within the third portion of the substrate.

17. The method according to claim 16, comprising: During the pick and place operation, subsequently moving the second bond head to position a fourth bond arm of the second bond head over a fourth electronic device in the second group of electronic devices, and actuating only the fourth bond arm of the second bond head to pick up the fourth electronic device from the second group of electronic devices; as well as The first bond head is then moved to position the fourth bond arm of the first bond head above the first bonding position within the fourth portion of the substrate, and only the fourth bond arm of the first bond head is actuated to place the fourth electronic device of the first group of electronic devices at the first bonding position within the fourth portion of the substrate.

18. The method according to claim 14, wherein: Each pick-up by the second bond head is performed simultaneously with each placement by the first bond head.

19. The method according to claim 14, wherein: During the pick and place operation, the second bond arm of the second bond head is adjacent to the first bond arm of the second bond head.

20. The method according to claim 14, wherein: During the pick and place operation, the second electronic device in the second group of electronic devices is adjacent to the first electronic device in the second group of electronic devices.

21. The method according to claim 14, wherein: During the pick and place operation, consecutive portions of the substrate are adjacent to each other.

22. The method according to claim 14, wherein: During the pick and place operation, each subsequent portion containing a bonding location is adjacent to a previous portion containing a bonding location.

23. The method according to claim 14, comprising: During the placement operation, The second bond head is moved to position the first bond arm of the second bond head above a second bonding location within the first portion of the substrate, and only the first bond arm of the second bond head is actuated to place the first electronic device of the second group of electronic devices at the second bonding location within the first portion of the substrate.

24. The method according to claim 23, comprising: During the placement operation, The second bond head is then moved to position the second bond arm of the second bond head above the second bonding position within the second portion of the substrate, and only the second bond arm of the second bond head is actuated to place the second electronic device of the second group of electronic devices at the second bonding position within the second portion of the substrate.

25. The method according to claim 24, comprising: During the placement operation, The second bond head is then moved to position the third bond arm of the second bond head above the second bonding position within the third portion of the substrate, and only the third bond arm of the second bond head is actuated to place the third electronic device of the second group of electronic devices at the second bonding position within the third portion of the substrate.

26. The method according to claim 25, comprising: During the placement operation, The second bond head is then moved to position the fourth bond arm of the second bond head above the second bonding position within the fourth portion of the substrate, and only the fourth bond arm of the second bond head is actuated to place the fourth electronic device of the second group of electronic devices at the second bonding position within the fourth portion of the substrate.

27. The method of claim 14, wherein: The first bond head and the second bond head share a common positioning mechanism, which is used to position the first bond head and the second bond head along orthogonal X-axis and Y-axis. Between different pick-up and / or placement positions, the first bond head and the second bond head can move together along the X-axis and move independently along the Y-axis.

28. An apparatus for transporting a plurality of electronic devices, comprising: A bonding head mechanism having a plurality of individually displaceable bonding arms, the device being operable to: in a picking operation, position a first bonding arm of the plurality of individually displaceable bonding arms above a first electronic device in a group of electronic devices in a picking area, and actuate only the first bonding arm to pick up the first electronic device from the group of electronic devices; and position a second bonding arm of the plurality of individually displaceable bonding arms above a second electronic device in the group of electronic devices, and actuate only the second bonding arm to pick up the second electronic device from the group of electronic devices.

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