Wafer transfer device and wafer transfer method

Abstract

The invention discloses a wafer transfer device and a wafer transfer method.The wafer transfer device comprises a clamping assembly, the clamping assembly comprises a plurality of clamping mechanisms, each clamping mechanism comprises a telescopic arm and a clamping part, the clamping parts are connected to the ends of the telescopic arms, and the clamping parts of the multiple clamping mechanisms define a clamping space in the circumferential direction; the clamping part comprises a groove structure with an opening facing the clamping space, the groove structure comprises a channel penetrating in the circumferential direction, and the clamping assembly comprises a tightening station used for clamping a wafer and an opening station used for picking and placing the wafer; when the clamping assembly is located at the tightening station, the bottom wall of the groove structure is externally tangent to the first virtual pattern, the outer diameter of the first virtual pattern is larger than the diameter of the wafer, and when the clamping assembly is located at the tightening station, the end, close to the clamping space, of the side wall of the groove structure is externally tangent to the second virtual pattern, and the outer diameter of the second virtual pattern is larger than the diameter of the wafer. The outer diameter of the second virtual pattern is smaller than the diameter of the wafer. The wafer transfer device provided by the invention is better in transfer yield.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a wafer transfer device and a wafer transfer method. Background Art

[0002] In the integrated circuit manufacturing process, the cleaning module of the chemical mechanical polishing equipment (CMP) includes a wafer transfer component, which clamps the edge of the wafer for transmission. That is, the wafer transfer component is in close contact with the edge of the wafer, which can easily cause damage to the wafer and seriously affect the transfer yield of the wafer. Summary of the invention

[0003] The purpose of the present application is to at least solve the problem that the wafer transfer device is prone to causing damage to the wafer during the transfer process. This purpose is achieved through the following technical solutions: The first aspect of the present application provides a wafer transfer device for clamping a wafer and moving the wafer, the wafer transfer device comprising: A clamping assembly, wherein the clamping assembly comprises a plurality of clamping mechanisms, wherein the clamping mechanisms comprise a telescopic arm and a clamping portion, wherein the clamping portion is connected to the end of the telescopic arm, wherein the clamping portions of the plurality of clamping mechanisms enclose a clamping space along a circumferential direction, wherein the clamping portion comprises a groove structure opening toward the clamping space, wherein the groove structure comprises a channel penetrating along the circumferential direction, and wherein the clamping assembly comprises a tightening station for clamping the wafer and an opening station for picking up and placing the wafer in a circumferential direction; In which, when the clamping assembly is in the tightening position, the bottom wall of the groove structure is circumscribed to a first virtual figure, the outer diameter of the first virtual figure is larger than the diameter of the wafer, and when the clamping assembly is in the tightening position, the side wall of the groove structure is circumscribed to a second virtual figure near the end of the clamping space, and the outer diameter of the second virtual figure is smaller than the diameter of the wafer.

[0004] The wafer transfer device provided in the present application includes a clamping assembly, which is used to clamp the wafer, so as to realize the movement of the wafer. Specifically, the clamping assembly includes a plurality of clamping mechanisms, the clamping mechanism includes a telescopic arm and a clamping part, the clamping assembly includes a tightening station for clamping the wafer and an opening station for picking up and placing the wafer, wherein the extended state of the telescopic arm corresponds to the opening station of the clamping assembly, and the contracted state of the telescopic arm corresponds to the tightening station of the clamping assembly. The clamping part is connected to the end of the telescopic arm, and is used to limit the wafer, so as to realize the picking of the wafer. The clamping parts of the plurality of clamping mechanisms are enclosed in the circumferential direction to form a clamping space, and the clamping space is adapted to the shape of the wafer, so as to accommodate and limit the wafer to be moved. The clamping part includes a groove structure formed by a depression on one side surface facing the clamping space, and the groove structure includes a channel penetrating in the circumferential direction, and the groove structure can be used to clamp and limit the edge of the wafer to be moved. When the clamping assembly is in the tightening position, the bottom wall of the groove structure is circumscribed to the first virtual figure, and the outer diameter of the first virtual figure is larger than the diameter of the wafer, that is, when the wafer to be moved is picked up, the wafer to be moved only contacts the bottom wall of part of the groove structure, and does not contact the bottom wall of the other part of the groove structure, so that the wafer to be moved can be prevented from being over-extruded and causing damage to the edge of the wafer, or from causing damage to the internal stress of the wafer and causing the wafer to break during the process, which helps to improve the transfer yield of the wafer. And when the clamping assembly is in the tightening position, the side wall of the groove structure close to the end of the clamping space is circumscribed to the second virtual figure, and the outer diameter of the second virtual figure is smaller than the diameter of the wafer, so that the edge of the wafer can be limited in the groove structure by the side walls of multiple groove structures, preventing the wafer from slipping out and causing damage during the transfer process. The wafer transfer device can effectively improve the yield of wafer transfer, improve the stability and reliability of transfer, and reduce the probability of wafer damage.

[0005] In some embodiments of the present application, the wafer transfer device also includes a driving component, which is connected to the clamping component, used to keep the clamping component in a state where the circumferential direction is tangent to the gravity direction, and to drive the clamping component to move along a preset direction, wherein the preset direction includes a first direction perpendicular to the gravity direction and a second direction parallel to the gravity direction.

[0006] In some embodiments of the present application, the inner wall of the groove structure is arc-shaped, and the depth of the groove structure is D, 2mm≤D≤3mm; and / or, the groove structure includes two opposite side walls, the channel is formed between the two side walls, and the maximum distance between the two side walls is L, 2.3mm≤L≤2.7mm.

[0007] In some embodiments of the present application, the clamping mechanism further includes a support rod, the clamping portion includes a through hole for accommodating the support rod, and the support rod is arranged to pass through the through hole along the axial direction of the through hole.

[0008] In some embodiments of the present application, the support rods extend in a straight line, and ends of a plurality of the support rods are fixed to each other to form a fixed area, and the telescopic arm can extend in a direction away from the fixed area and shorten in a direction close to the fixed area.

[0009] In some embodiments of the present application, the support rod also includes a limiting portion for limiting the stroke of the telescopic arm, the limiting portion includes a receiving hole for receiving the telescopic arm, the axial direction of the receiving hole is parallel to the axial direction of the through hole, the telescopic arm passes through the receiving hole along the axial direction of the receiving hole, and the limiting portion is used to limit the clamping portion to a side away from the fixed area.

[0010] In some embodiments of the present application, the wafer transfer device also includes a wear monitoring device, which includes an infrared sensor. The infrared sensor is arranged in the groove structure, and the top of the detection end of the infrared sensor is spaced from the bottom wall of the groove structure by a first preset distance in a direction perpendicular to the bottom wall, and the first preset distance is less than the depth of the groove structure. In some embodiments of the present application, a accommodating portion is provided on the side wall of the groove structure, the infrared sensor is located in the accommodating portion, and the top of the detection end of the infrared sensor is flush with the side wall of the groove structure.

[0011] The second aspect of the present application also provides a wafer transfer method, comprising: Providing a wafer to be moved, wherein the wafer to be moved is located on a carrying surface of a carrier, and the wafer to be moved is perpendicular to the carrying surface; The wafer to be moved is clamped by any one of the wafer transfer devices provided in the first aspect of the present application, comprising: In some embodiments of the present application, the wafer to be moved is clamped by any one of the wafer transfer devices provided in the first aspect of the present application, including: Driving the clamping assembly to be in a state where the circumferential direction is tangent to the gravity direction, and driving the clamping assembly to be in an open position; Driving the clamping assembly to move along a first direction so that the wafer to be moved is located in the clamping space and the bottom wall of the groove structure is opposite to the edge of the wafer, wherein the first direction is perpendicular to the gravity direction; The clamping assembly is driven to be in a tightening position, and is driven to move along a second direction away from the carrying surface, so that the wafer to be moved contacts the bottom wall of a portion of the groove structure and is spaced a second preset distance from the bottom wall of another portion of the groove structure, wherein the second direction is parallel to the direction of gravity.

[0012] Circumferential direction In some embodiments of the present application, in the clamping assembly, the bottom wall of the groove structure located at the center of the wafer to be moved close to the carrying surface is in contact with the wafer to be moved; In the clamping assembly, the bottom wall of the groove structure located at the center of the wafer to be moved away from the carrying surface is spaced from the edge of the wafer to be moved by the second preset distance, the second preset distance is parallel to the second direction, and the second preset distance is less than 2 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings: Figure 1 It is a structural schematic diagram of a wafer transfer device provided in an embodiment of the present application; Figure 2 It is a structural schematic diagram of a clamping assembly in a wafer transfer device provided in an embodiment of the present application; Figure 3 It is a schematic side view of a wafer transfer device provided in an embodiment of the present application; Figure 4 yes Figure 3 Enlarged view of the middle N region; Figure 5 is a schematic diagram of a clamping assembly of another wafer transfer device provided in an embodiment of the present application; Figure 6 yes Figure 2 Enlarged view of the middle M region; Figure 7 It is a flow chart of a wafer transfer method provided in an embodiment of the present application; Figure 8 is a flow chart of another wafer transfer method provided in an embodiment of the present application; Fig. 9 This is a schematic diagram of a wafer transfer process provided in an embodiment of the present application.

[0014] The reference numerals are as follows: 10. Wafer transfer device; 1. Clamping assembly; 11. Clamping mechanism; 111. Telescopic arm; 112. Clamping part; 1121. Through hole; 113. Groove structure; 1131. Channel; 1132. Side wall; 114. Support rod; 1141. Limiting part; 1142. Accommodating hole; 15. Infrared sensor; A. Clamping space; c. Circumferential direction; g. Gravity direction; y. First direction; b. Fixed area; 2. Driving assembly; 3. Wafer to be moved; x. Second direction; C1. First virtual figure; C2. Second virtual figure; 4. Carrier. DETAILED DESCRIPTION

[0015] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0016] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0017] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0018] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, the element described as "below other elements or features" or "below other elements or features" will be subsequently oriented to "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0019] like Figures 1 to 4 As shown, according to the embodiment of the present application, a wafer transfer device 10 is proposed, which is used to clamp and move a wafer, and the wafer transfer device 10 includes a clamping assembly 1. The clamping assembly 1 includes a plurality of clamping mechanisms 11, and the clamping mechanism 11 includes a telescopic arm 111 and a clamping portion 112, and the clamping portion 112 is connected to the end of the telescopic arm 111. The clamping portions 112 of the plurality of clamping mechanisms 11 enclose a clamping space A along a circumferential direction c, and the clamping portion 112 includes a groove structure 113 formed by a depression on a side surface facing the clamping space A, and the groove structure 113 includes a channel 1131 penetrating along the circumferential direction c, and the clamping assembly 1 includes a tightening station for clamping a wafer and an opening station for picking and placing a wafer. Among them, when the clamping assembly 1 is in the tightening position, the bottom wall of the groove structure 113 is circumscribed to the first virtual figure C1, and the outer diameter of the first virtual figure C1 is larger than the diameter of the wafer, and when the clamping assembly 1 is in the tightening position, the side wall 1132 of the groove structure 113 close to the end of the clamping space A is circumscribed to the second virtual figure C2, and the outer diameter of the second virtual figure C2 is smaller than the diameter of the wafer.

[0020] The wafer transfer device 10 provided in the present application includes a clamping assembly 1, and the clamping assembly 1 is used to clamp the wafer, so as to realize the movement of the wafer. Specifically, the clamping assembly 1 includes a plurality of clamping mechanisms 11, and the clamping mechanism 11 includes a telescopic arm 111 and a clamping portion 112. The clamping assembly 1 includes a tightening station for clamping the wafer and an opening station for picking up and placing the wafer, wherein the extended state of the telescopic arm 111 corresponds to the opening station of the clamping assembly 1, and the contracted state of the telescopic arm 111 corresponds to the tightening station of the clamping assembly 1. The clamping portion 112 is connected to the end of the telescopic arm 111, and is used to limit the wafer, so as to realize the picking up of the wafer. The clamping portions 112 of the plurality of clamping mechanisms 11 are enclosed along the circumferential direction c to form a clamping space A, and the clamping space A is adapted to the shape of the wafer, so as to accommodate and limit the wafer 3 to be moved. The clamping portion 112 includes a groove structure 113 formed by a depression on one side surface facing the clamping space A. The groove structure 113 includes a channel 1131 penetrating along the circumferential direction c. The groove structure 113 can be used to clamp and limit the edge of the wafer 3 to be moved. When the clamping assembly 1 is in the tightening position, the bottom wall of the groove structure 113 is circumscribed to the first virtual figure C1, and the outer diameter of the first virtual figure C1 is larger than the diameter of the wafer, that is, when the wafer 3 to be moved is picked up, the wafer 3 to be moved only contacts with the bottom wall of part of the groove structure 113, and does not contact with the bottom wall of another part of the groove structure 113, so that the wafer 3 to be moved can be prevented from being over-extruded to damage the edge of the wafer, or from being damaged by internal stress of the wafer to cause the wafer to break in the process, which helps to improve the transfer yield of the wafer. When the clamping assembly 1 is in the tightening position, the side wall 1132 of the groove structure 113 near the end of the clamping space A is circumscribed to the second virtual figure C2, and the outer diameter of the second virtual figure C2 is smaller than the diameter of the wafer, so that the edge of the wafer can be limited in the groove structure 113 by the side walls 1132 of the multiple groove structures 113, preventing the wafer from falling out and causing damage during the transfer process. The wafer transfer device 10 can effectively improve the yield of wafer transfer, improve the stability and reliability of transfer, and reduce the probability of wafer damage.

[0021] The top of the wafer refers to the top of the center of the wafer, and the bottom of the wafer refers to the bottom of the center of the wafer.

[0022] In the above embodiment, the wafer transfer device 10 includes a plurality of clamping mechanisms 11. When the clamping mechanisms 11 are worn, only the worn clamping mechanisms 11 can be replaced, and the clamping mechanisms 11 in good condition can continue to be used, thereby reducing the material cost and the time cost of maintenance of the wafer transfer device 10. Specifically, the clamping mechanism 11 located below the wafer is prone to wear because the groove structure 113 therein contacts the edge of the wafer, and the clamping mechanism 11 located above the wafer is not prone to wear because the groove structure 113 therein does not contact the edge of the wafer, and can be used for a long time.

[0023] Specifically, the clamping assembly 1 includes at least three clamping mechanisms 11 .

[0024] Preferably, when three clamping mechanisms 11 are included, two of the three clamping mechanisms 11 are located on the same horizontal plane to achieve more stable support for the wafer.

[0025] Specifically, the telescopic arm 111 may include a linear cylinder, which has a simple structure, strong operability, strong technical stability and low cost.

[0026] Specifically, the material of the clamping portion 112 can be plastic, which can meet the strength requirements for clamping and transferring the wafer and is not likely to wear the wafer.

[0027] Specifically, the wafer may be a wafer of basic specifications such as 6 inches, 10 inches and 12 inches.

[0028] Specifically, when the diameter of the wafer is 300 mm, the diameter of the first virtual figure C1 may be 302 mm, and the diameter of the second virtual figure C2 may be 295 mm.

[0029] Specifically, the interval between the wafer and the bottom wall of the groove structure 113 above the wafer is preferably 2 mm±0.2 mm.

[0030] In a feasible embodiment, the driving component 2 is used to control the state of the clamping component 1. The wafer transfer device 10 also includes a driving component 2, which is connected to the clamping component 1 and is used to keep the clamping component 1 in a state where the circumferential direction c is tangent to the gravity direction g, and to drive the clamping component 1 to move along a preset direction, wherein the preset direction includes a first direction y perpendicular to the gravity direction g and a second direction x parallel to the gravity direction g.

[0031] In the wafer transfer device 10, the driving component 2 is connected to the clamping component 1, and is used to keep the clamping component 1 in a state where the circumferential direction c is tangent to the gravity direction g, and to drive the clamping component 1 to move along a preset direction, wherein the preset direction includes a first direction y perpendicular to the gravity direction g and a second direction x parallel to the gravity direction g, so that the wafer, under the action of gravity, only contacts the bottom wall of the groove structure 113 located below the wafer, and does not contact the bottom wall of the groove structure 113 located above the wafer, thereby preventing excessive squeezing of the wafer.

[0032] In a feasible embodiment, the inner wall of the groove structure 113 is arc-shaped, and the depth of the groove structure 113 is D, 2mm≤D≤3mm; and / or, the groove structure 113 includes two opposite side walls 1132, a channel 1131 is formed between the two side walls 1132, and the maximum distance between the two side walls 1132 is L, 2.3mm≤L≤2.7mm.

[0033] In the above embodiment, the inner wall of the groove structure 113 is arc-shaped. On the one hand, the arc is relatively smooth and can protect the edge of the wafer; on the other hand, when the alignment accuracy of the groove and the wafer is not high, the arc can make the wafer automatically slide to the lowest point of the arc under the action of gravity, thereby preventing the edge of the wafer from contacting the bottom wall of the groove structure 113 located above the wafer, thereby improving the protection effect of the edge of the wafer.

[0034] In the above embodiment, the depth of the groove structure 113 is in the range of 2 mm to 3 mm, so as to facilitate the wafer to be positioned in the groove structure 113 .

[0035] For example, when the interval between the wafer and the bottom wall of the groove structure 113 above the wafer is 2 mm±0.2 mm, using the groove structure 113 with a depth range of 2 mm-3 mm can prevent the wafer from falling out of the groove structure 113 above the wafer.

[0036] In the above embodiment, the groove structure 113 may be a U-shaped groove, which includes two opposite side walls 1132, a bottom wall and an opening opposite to the bottom wall, and a channel 1131 is formed between the two side walls 1132. The maximum distance between the two side walls 1132 is L, 2.3mm≤L≤2.7mm.

[0037] By limiting the maximum distance between the two side walls 1132 to a range of 2.3 mm-2.7 mm, the wafer can be well accommodated while taking stability into consideration, thereby preventing the wafer from shaking excessively along the arrangement direction of the two side walls 1132, thereby further improving the transfer yield of the wafer.

[0038] In a possible implementation, Figure 5As shown, the clamping mechanism 11 further includes a support rod 114 , and the clamping portion 112 includes a through hole 1121 for accommodating the support rod 114 , and the support rod 114 is disposed through the through hole 1121 along the axial direction of the through hole 1121 .

[0039] In the above embodiment, the clamping mechanism 11 further includes a support rod 114 , and the support rod 114 is used to enhance the mechanical strength of the clamping mechanism 11 and improve the reliability and stability of the clamping mechanism 11 .

[0040] Specifically, the support rod 114 may be in the shape of a rectangular strip structure, which can reduce shaking and other defects after being matched with the clamping portion 112 .

[0041] In a possible implementation, Figure 5 As shown, the support rods 114 extend in a straight line, and the ends of the plurality of support rods 114 are fixed to each other to form a fixed area b. The telescopic arm 111 can extend in a direction away from the fixed area b and shorten in a direction close to the fixed area b.

[0042] In the above embodiment, the telescopic rod may be a linear cylinder, and the extension direction of the support rod 114 may be parallel to the telescopic direction of the cylinder.

[0043] In the above embodiment, the ends of the plurality of support rods 114 are fixed to each other to form a fixing area b, which can further improve the stability of the structure on the one hand, and improve the integration of the wafer transfer device 10 on the other hand.

[0044] In the above embodiment, the end of the telescopic arm 111 that is not used for telescopic movement, i.e., the fixed end, can be fixed to the fixed area b, and a shell for accommodating the end of the support rod 114 and the fixed end of the telescopic arm 111 can be formed in the fixed area b to protect the fixed area b and improve the aesthetics.

[0045] In a possible implementation, Figure 5 As shown, the support rod 114 also includes a limiting portion 1141 for limiting the stroke of the telescopic arm 111, the limiting portion 1141 includes a receiving hole 1142 for receiving the telescopic arm 111, the axial direction of the receiving hole 1142 is parallel to the axial direction of the through hole 1121, the telescopic arm 111 passes through the receiving hole 1142 along the axial direction of the receiving hole 1142, and the limiting portion 1141 is used to limit the clamping portion 112 to a side away from the fixed area b.

[0046] In the above embodiment, the support rod 114 further includes a limit portion 1141 for limiting the travel of the telescopic arm 111 to prevent the telescopic arm 111 from over-extending and causing excessive squeezing of the wafer.

[0047] In the above embodiment, since the telescopic arm 111 can extend in the direction away from the fixed area b and shorten in the direction close to the fixed area b, a receiving hole 1142 can be formed on the support rod 114, and the telescopic arm 111 can be passed through the receiving hole 1142, and the clamping portion 112 is located on the side of the receiving hole 1142 away from the fixed area b, so that during the contraction of the telescopic arm 111, the limit stroke of the telescopic arm 111 during contraction can be limited by the limiting portion 1141, so that when the clamping assembly 1 is in the tightening position, the bottom wall of the groove structure 113 is circumscribed to the first virtual figure C1, and the side wall 1132 of the groove structure 113 is circumscribed to the second virtual figure C2 near the end of the clamping space A, wherein the outer diameter of the first virtual figure C1 is larger than the diameter of the wafer, and the outer diameter of the second virtual figure C2 is smaller than the diameter of the wafer.

[0048] In a possible implementation, Figure 6 As shown, the wafer transfer device 10 also includes a wear monitoring device, which includes an infrared sensor 15. The infrared sensor 15 is arranged in the groove structure 113, and the top of the detection end of the infrared sensor 15 is spaced from the bottom wall of the groove structure 113 by a first preset distance in a direction perpendicular to the bottom wall, and the first preset distance is less than the depth of the groove structure 113. In the above embodiment, a wear monitoring device is provided in the wafer transfer device 10 to monitor the wear condition of the clamping portion 112 .

[0049] Specifically, the wear monitoring device includes an infrared sensor 15, which is disposed in the groove structure 113. The infrared sensor 15 includes an infrared transmitter and an infrared receiver. When the infrared light emitted by the infrared transmitter encounters the wafer in the groove structure 113, part of the light is reflected back and received by the infrared receiver and converted into an electrical signal. By measuring the intensity of the reflected light, it can be determined whether the wafer exists, and then whether the clamping part 112 is worn.

[0050] Since the bottom wall of the groove structure 113 in the clamping part 112 located below the wafer contacts the wafer, the clamping part 112 located below the wafer is prone to wear. When the clamping part 112 is worn, that is, the bottom wall of the groove structure 113 is worn, the wafer placed in the clamping space A and in contact with the bottom wall of the groove will move downward compared to before wear. Before the clamping part 112 is worn, the infrared light emitted by the infrared transmitter in the infrared sensor 15 encounters the wafer in the groove structure 113, and part of the light is reflected back, which is received by the infrared receiver and converted into an electrical signal, so it can be determined that the wafer exists in the infrared light path. When the clamping part 112 is worn, the wafer moves downward and is not in the infrared light path, so the infrared light emitted by the infrared transmitter in the infrared sensor 15 will not be reflected, thereby monitoring the wear of the clamping part 112 below.

[0051] Specifically, since there is a certain distance between the wafer and the bottom wall of the groove structure 113 above, the top of the detection end of the infrared sensor 15 and the bottom wall of the groove structure 113 are spaced apart by a first preset distance in a direction perpendicular to the bottom wall. The first preset distance is smaller than the depth of the groove structure 113 so as to monitor the portion of the wafer that is in the groove portion, and the first preset distance is greater than the distance reserved between the wafer and the bottom wall of the groove structure 113 above (for example, 2mm±0.2mm), so as to monitor the wear of the lower clamping portion 112.

[0052] Specifically, the infrared sensor 15 may be disposed only in the groove structure 113 located on the top of the wafer.

[0053] In a feasible implementation manner, the first preset distance is greater than 1.8 mm and less than 3 mm.

[0054] In the above embodiment, the first preset distance is the distance between the top of the detection end of the infrared sensor 15 and the bottom wall of the groove structure 113 in a direction perpendicular to the bottom wall. Since the interval between the wafer and the bottom wall of the groove structure 113 above the wafer is 2 mm ± 0.2 mm, the range of the first preset distance should be greater than the distance between the wafer and the bottom wall of the groove structure 113 above the wafer, and the first preset distance is less than the depth of the groove. Specifically, the wear range to be monitored is the difference between the first preset distance and the interval between the wafer and the bottom wall of the groove structure 113 above the wafer.

[0055] In a feasible implementation manner, the side wall 1132 of the groove structure 113 is provided with a receiving portion, the infrared sensor 15 is located in the receiving portion, and the top of the detection end of the infrared sensor 15 is flush with the side wall 1132 of the groove structure 113 .

[0056] In the above embodiment, the top of the detection end of the infrared sensor 15 is flush with the side wall 1132 of the groove structure 113, thereby reducing the adverse effect of the setting of the infrared sensor 15 on the wafer edge and further improving the wafer yield.

[0057] The present application also provides a wafer transfer method, such as Figure 7 and Figure 8 As shown, including: S200 , providing a wafer 3 to be moved, wherein the wafer 3 to be moved is located on a carrying surface of a carrier 4 , and the wafer 3 to be moved is perpendicular to the carrying surface.

[0058] Specifically, the bottom of the wafer 3 to be moved can be limited in the limiting structure on the carrying surface, so that the wafer 3 to be moved is perpendicular to the carrying surface.

[0059] S400 , clamping the wafer 3 to be moved by using any one of the wafer transfer devices 10 provided in the above embodiments.

[0060] S400, including: S420, driving the clamping assembly 1 to be in a state where the circumferential direction c is tangent to the gravity direction g, and driving the clamping assembly 1 to be in an open position.

[0061] Specifically, the clamping assembly 1 is in a state where the circumferential direction c is tangent to the gravity direction g, so that the wafer 3 to be moved can be accommodated in the clamping space later. The clamping assembly 1 is driven to be in an open position, so that the edge of the wafer 3 to be moved can be clamped or limited by the clamping mechanism 11 later.

[0062] S440, driving the clamping assembly 1 to move along the first direction y so that the wafer 3 to be moved is located in the clamping space A and the bottom wall of the groove structure 113 is opposite to the edge of the wafer, and the first direction y is perpendicular to the gravity direction.

[0063] Specifically, the above steps can realize the alignment between the wafer 3 to be moved and the bottom wall of the groove, so that the edge of the wafer 3 to be moved can be clamped or limited by the clamping mechanism 11 later.

[0064] S460, such as Fig. 9 As shown, the clamping assembly 1 is driven to be in the tightening position, and is driven to move along the second direction x in a direction away from the carrying surface, so that the wafer 3 to be moved contacts the bottom wall of a portion of the groove structure 113, and is spaced a second preset distance from the bottom wall of another portion of the groove structure 113, wherein the second direction x is parallel to the gravity direction.

[0065] Specifically, the above-mentioned wafer transfer process makes the edge of the wafer 3 to be moved contact with the bottom wall of part of the groove structure 113, and not contact with the bottom wall of another part of the groove structure 113. Instead, the edge of the wafer to be moved is limited by the side wall 1132 of the groove structure 113, thereby avoiding affecting the wafer yield due to the clamping assembly 1 clamping the edge of the wafer 3 to be moved too tightly during the movement process.

[0066] Specifically, the above-mentioned driving process can be completed by the driving component 2, and the driving component 2 can drive the clamping component to move and can drive the telescopic arm to extend and retract.

[0067] In a feasible implementation, in the clamping assembly 1, the bottom wall of the groove structure 113 located at the center of the wafer 3 to be moved and close to the carrying surface is in contact with the wafer 3 to be moved; In the clamping assembly 1 , the bottom wall of the groove structure 113 located at the center of the wafer 3 to be moved away from the carrying surface is spaced from the edge of the wafer 3 to be moved by a second preset distance, the second preset distance is parallel to the second direction x, and the second preset distance is less than 2 mm.

[0068] In the above embodiment, gravity acts to make the wafer 3 to be moved only contact with the bottom wall of the groove structure 113 located at the center of the wafer 3 to be moved close to the supporting surface, and not contact with the bottom wall of the groove structure 113 located at the center of the wafer 3 to be moved away from the supporting surface, and separated by a second preset distance, the second preset distance is parallel to the second direction x, and the second preset distance is less than 2 mm, and the second preset distance is less than the depth of the groove structure 113, so that the edge of the wafer 3 to be moved can be limited in the groove structure 113, and the wafer can be supported and further limited by relying on the groove structure 113 below.

[0069] Specifically, after the wafer 3 to be moved is clamped through the above steps, the driving component 2 can also drive the clamping component 1 to move along the first direction y to achieve the transfer of the wafer 3 to be moved. After being transferred to the specified position, the bottom of the wafer can be brought into contact with the stopper of the stage 4, and then the clamping component 1 is placed in the open position to release the wafer.

[0070] The above are only preferred specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A wafer transfer device, used for clamping a wafer and moving the wafer, characterized in that: The wafer transfer device comprises: A clamping assembly, wherein the clamping assembly comprises a plurality of clamping mechanisms, wherein the clamping mechanisms comprise a telescopic arm and a clamping portion, wherein the clamping portion is connected to the end of the telescopic arm, wherein the clamping portions of the plurality of clamping mechanisms are enclosed in a circumferential direction to form a clamping space, wherein the clamping portion comprises a groove structure opening toward the clamping space, wherein the groove structure comprises a channel penetrating in the circumferential direction, and wherein the clamping assembly comprises a tightening station for clamping the wafer and an opening station for picking up and placing the wafer; In which, when the clamping assembly is in the tightening position, the bottom wall of the groove structure is circumscribed to a first virtual figure, the outer diameter of the first virtual figure is larger than the diameter of the wafer, and when the clamping assembly is in the tightening position, the side wall of the groove structure is circumscribed to a second virtual figure near the end of the clamping space, and the outer diameter of the second virtual figure is smaller than the diameter of the wafer.

2. The wafer transfer device according to claim 1, characterized in that: The wafer transfer device also includes: A driving assembly is connected to the clamping assembly, and is used to keep the clamping assembly in a state where the circumferential direction is tangent to the gravity direction, and to drive the clamping assembly to move along a preset direction, wherein the preset direction includes a first direction perpendicular to the gravity direction and a second direction parallel to the gravity direction.

3. The wafer transfer device according to claim 1, characterized in that: The inner wall of the groove structure is arc-shaped, and the depth of the groove structure is D, 2mm≤D≤3mm; and / or the groove structure includes two opposite side walls, the channel is formed between the two side walls, and the maximum distance between the two side walls is L, 2.3mm≤L≤2.7mm.

4. The wafer transfer device according to claim 1, characterized in that: The clamping mechanism further comprises a support rod, the clamping portion comprises a through hole for accommodating the support rod, and the support rod is arranged through the through hole along the axial direction of the through hole.

5. The wafer transfer device according to claim 4, characterized in that: The support rods extend in a straight line, and ends of a plurality of the support rods are fixed to each other to form a fixed area. The telescopic arm can be extended in a direction away from the fixed area and shortened in a direction close to the fixed area.

6. The wafer transfer device according to claim 5, characterized in that: The support rod also includes a limiting portion for limiting the stroke of the telescopic arm, the limiting portion includes a receiving hole for receiving the telescopic arm, the axial direction of the receiving hole is parallel to the axial direction of the through hole, the telescopic arm passes through the receiving hole along the axial direction of the receiving hole, and the limiting portion is used to limit the clamping portion to a side away from the fixed area.

7. The wafer transfer device according to claim 1, characterized in that: The wafer transfer device also includes a wear monitoring device, which includes an infrared sensor. The infrared sensor is arranged in the groove structure, and the top of the detection end of the infrared sensor is spaced from the bottom wall of the groove structure by a first preset distance in a direction perpendicular to the bottom wall, and the first preset distance is less than the depth of the groove structure.

8. The wafer transfer device according to claim 7, characterized in that: The side wall of the groove structure is provided with a receiving portion, the infrared sensor is located in the receiving portion, and the top of the detection end of the infrared sensor is flush with the side wall of the groove structure.

9. A wafer transfer method, characterized in that: include: Providing a wafer to be moved, wherein the wafer to be moved is located on a carrying surface of a carrier, and the wafer to be moved is perpendicular to the carrying surface; The wafer to be moved is clamped by the wafer transfer device as described in any one of claims 1-8.

10. The wafer transfer method according to claim 9, characterized in that: The clamping of the wafer to be moved by the wafer transfer device according to any one of claims 1 to 8 comprises: Driving the clamping assembly to be in a state where the circumferential direction is tangent to the gravity direction, and driving the clamping assembly to be in an open position; Driving the clamping assembly to move along a first direction so that the wafer to be moved is located in the clamping space and the bottom wall of the groove structure is opposite to the edge of the wafer, wherein the first direction is perpendicular to the gravity direction; The clamping assembly is driven to be in a tightening position, and is driven to move along a second direction away from the carrying surface, so that the wafer to be moved contacts the bottom wall of a portion of the groove structure and is spaced a second preset distance from the bottom wall of another portion of the groove structure, wherein the second direction is parallel to the direction of gravity.

11. The wafer transfer method according to claim 10, characterized in that: In the clamping assembly, the bottom wall of the groove structure located at the center of the wafer to be moved and close to the carrying surface is in contact with the wafer to be moved; In the clamping assembly, the bottom wall of the groove structure located at the center of the wafer to be moved away from the carrying surface is spaced from the edge of the wafer to be moved by the second preset distance, the second preset distance is parallel to the second direction, and the second preset distance is less than 2 mm.

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