Staggered stacked light-emitting chip structure, manufacturing method thereof and image display equipment

Abstract

The invention provides a staggered stacking type light-emitting chip structure, a manufacturing method thereof and image display equipment. The staggered stacking type light-emitting chip structure comprises a first light-emitting chip, a second light-emitting chip and a third light-emitting chip. The first light-emitting chip, the second light-emitting chip and the third light-emitting chip are sequentially stacked from bottom to top and staggered in the horizontal direction. The vertical projection of the second positive electrode welding pad and the vertical projection of the second negative electrode welding pad of the second light-emitting chip do not fall on the first top light-emitting surface of the first light-emitting chip at all. The vertical projection of a third positive electrode welding pad of the third light-emitting chip and the vertical projection of a third negative electrode welding pad of the third light-emitting chip do not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip at all. Therefore, mutual optical influence among the projection light beam generated by the first light-emitting chip, the projection light beam generated by the second light-emitting chip and the projection light beam generated by the third light-emitting chip can be minimized.

Description

Technical Field

[0001] The present invention relates to a stacked light-emitting chip structure and a manufacturing method thereof, and in particular to a staggered stacked light-emitting chip structure and a manufacturing method thereof, and an image display device using the staggered stacked light-emitting chip structure. Background Art

[0002] In the prior art, an LED display device can provide a pixel image by the cooperation of a red LED chip, a green LED chip, and a blue LED chip. However, the red LED chip, the green LED chip, and the blue LED chip that can cooperate with each other to generate a pixel image need to be arranged side by side on a circuit substrate, which will occupy a larger usable space. Summary of the invention

[0003] The problem to be improved or solved by the present invention is to provide a staggered stacked light-emitting chip structure and a manufacturing method thereof, as well as an image display device using the staggered stacked light-emitting chip structure in view of the deficiencies in the prior art.

[0004] In order to improve or solve the above-mentioned problems, one of the technical means adopted by the present invention is to provide a staggered stacked light-emitting chip structure, which includes: a first light-emitting chip, a second light-emitting chip and a third light-emitting chip. The first light-emitting chip has a first top light-emitting surface, a first bottom non-welding pad area, a first positive electrode pad and a first negative electrode pad. The second light-emitting chip has a second top light-emitting surface, a second bottom non-welding pad area, a second positive electrode pad and a second negative electrode pad. The third light-emitting chip has a third top light-emitting surface, a third bottom non-welding pad area, a third positive electrode pad and a third negative electrode pad. The first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence from bottom to top, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered with each other in the horizontal direction; the vertical projection of the second bottom non-weld pad area of ​​the second light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip, and the vertical projection of the third bottom non-weld pad area of ​​the third light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip; the vertical projection of the second positive electrode solder pad and the vertical projection of the second negative electrode solder pad of the second light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip at all, and the vertical projection of the third positive electrode solder pad and the vertical projection of the third negative electrode solder pad of the third light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip at all.

[0005] In order to improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a method for manufacturing a staggered stacked light-emitting chip structure, which includes: providing a circuit substrate; setting a first light-emitting chip on the circuit substrate and electrically connecting to the circuit substrate, the first light-emitting chip having a first top light-emitting surface, a first bottom non-welding pad area, a first positive electrode pad and a first negative electrode pad; stacking a second light-emitting chip on the first light-emitting chip and electrically connecting to the circuit substrate, the second light-emitting chip having a second top light-emitting surface, a second bottom non-welding pad area, a second positive electrode pad and a second negative electrode pad; and, stacking a third light-emitting chip on the second light-emitting chip and electrically connecting to the circuit substrate, the third light-emitting chip having a third top light-emitting surface, a third bottom non-welding pad area, a third positive electrode pad and a third negative electrode pad. The first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence from bottom to top, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered with each other in the horizontal direction; the vertical projection of the second bottom non-weld pad area of ​​the second light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip, and the vertical projection of the third bottom non-weld pad area of ​​the third light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip; the vertical projection of the second positive electrode solder pad and the vertical projection of the second negative electrode solder pad of the second light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip at all, and the vertical projection of the third positive electrode solder pad and the vertical projection of the third negative electrode solder pad of the third light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip at all.

[0006] In order to improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide an image display device, which includes: a circuit substrate and a plurality of staggered stacked light-emitting chip structures. The plurality of staggered stacked light-emitting chip structures are arranged on the circuit substrate and are electrically connected to the circuit substrate. Among them, each staggered stacked light-emitting chip structure includes a first light-emitting chip, a second light-emitting chip and a third light-emitting chip, the first light-emitting chip has a first top light-emitting surface, a first bottom non-welding pad area, a first positive electrode pad and a first negative electrode pad, the second light-emitting chip has a second top light-emitting surface, a second bottom non-welding pad area, a second positive electrode pad and a second negative electrode pad, and the third light-emitting chip has a third top light-emitting surface, a third bottom non-welding pad area, a third positive electrode pad and a third negative electrode pad; wherein the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence from bottom to top, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are arranged horizontally. The two light-emitting chips are staggered in direction; wherein a vertical projection of the second bottom non-solder pad area of ​​the second light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip, and a vertical projection of the third bottom non-solder pad area of ​​the third light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip; wherein a vertical projection of the second positive electrode solder pad and a vertical projection of the second negative electrode solder pad of the second light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip at all, and a vertical projection of the third positive electrode solder pad and a vertical projection of the third negative electrode solder pad of the third light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip at all.

[0007] One of the beneficial effects of the present invention is that the present invention provides a staggered stacked light-emitting chip structure, which can minimize the mutual optical influence between the projection beam generated by the first light-emitting chip, the projection beam generated by the second light-emitting chip, and the projection beam generated by the third light-emitting chip (or minimize the mutual shielding influence between the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip) through the technical scheme of "the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are stacked in sequence from bottom to top", "the first light-emitting chip, the second light-emitting chip, and the third light-emitting chip are staggered in the horizontal direction", "the vertical projection of the second positive electrode pad of the second light-emitting chip and the vertical projection of the second negative electrode pad will not fall on the first top light-emitting surface of the first light-emitting chip" and "the vertical projection of the third positive electrode pad of the third light-emitting chip and the vertical projection of the third negative electrode pad will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip".

[0008] One of the beneficial effects of the present invention is that the present invention provides a method for manufacturing a staggered stacked light-emitting chip structure, which can be achieved by "providing a circuit substrate, arranging a first light-emitting chip on the circuit substrate and electrically connected to the circuit substrate, stacking a second light-emitting chip on the first light-emitting chip and electrically connected to the circuit substrate, and stacking a third light-emitting chip on the second light-emitting chip and electrically connected to the circuit substrate", "the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence from bottom to top", "the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered in the horizontal direction", "the vertical projection of the second positive electrode pad of the second light-emitting chip and the vertical projection of the second negative electrode pad are The technical scheme of "the vertical projection of the third positive electrode pad of the third light-emitting chip and the vertical projection of the third negative electrode pad will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip" is adopted, so that when the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence, the mutual optical influence between the projection light beam generated by the first light-emitting chip, the projection light beam generated by the second light-emitting chip and the projection light beam generated by the third light-emitting chip can be minimized (or the mutual shielding influence between the first light-emitting chip, the second light-emitting chip and the third light-emitting chip can be minimized).

[0009] One of the beneficial effects of the present invention is that an image display device provided by the present invention can be realized by "a plurality of staggered stacked light-emitting chip structures are arranged on a circuit substrate and electrically connected to the circuit substrate", "each staggered stacked light-emitting chip structure includes a first light-emitting chip, a second light-emitting chip and a third light-emitting chip", "the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence from bottom to top", "the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered with each other in the horizontal direction", "the vertical projection of the second positive electrode pad and the vertical projection of the second negative electrode pad of the second light-emitting chip will not fall on the first light-emitting chip at all The technical scheme of "a vertical projection of the third positive electrode pad of the third light-emitting chip and a vertical projection of the third negative electrode pad will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip" is adopted, so that when the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence, the mutual optical influence between the projection light beam generated by the first light-emitting chip, the projection light beam generated by the second light-emitting chip and the projection light beam generated by the third light-emitting chip can be minimized (or the mutual shielding influence between the first light-emitting chip, the second light-emitting chip and the third light-emitting chip can be minimized).

[0010] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a flow chart of a method for manufacturing a staggered stacked light-emitting chip structure provided in the first embodiment of the present invention.

[0012] Figure 2 It is a schematic side view of a first light emitting chip of a staggered stacked light emitting chip structure provided by the first embodiment of the present invention.

[0013] Figure 3 It is a schematic top view of a first light-emitting chip of a staggered stacked light-emitting chip structure provided by the first embodiment of the present invention.

[0014] Figure 4 It is a schematic side view of the second light-emitting chip of the staggered stacked light-emitting chip structure provided by the first embodiment of the present invention.

[0015] Figure 5 It is a top view schematically showing that a second light-emitting chip of the staggered stacked light-emitting chip structure provided by the first embodiment of the present invention is staggered and stacked on a first light-emitting chip.

[0016] Figure 6 It is a schematic side view of the third light-emitting chip of the staggered stacked light-emitting chip structure provided by the first embodiment of the present invention.

[0017] Figure 7 It is a top view schematically showing that a third light-emitting chip of the staggered stacked light-emitting chip structure provided in the first embodiment of the present invention is staggeredly stacked and disposed on a second light-emitting chip.

[0018] Figure 8 This is a three-dimensional schematic diagram of a first light-emitting chip, a second light-emitting chip and a third light-emitting chip of a staggered stacked light-emitting chip structure provided by the first embodiment of the present invention, in which the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered and stacked in sequence from bottom to top.

[0019] Fig. 9 This is a three-dimensional schematic diagram of a first light-emitting chip, a second light-emitting chip and a third light-emitting chip of a staggered stacked light-emitting chip structure provided by a second embodiment of the present invention, in which the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered and stacked in sequence from bottom to top.

[0020] Fig.10 A schematic top view of an image display device provided by a third embodiment of the present invention using a plurality of staggered stacked light emitting chip structures. DETAILED DESCRIPTION

[0021] The following is an explanation of the implementation methods of the "offset stacked light-emitting chip structure", "method for manufacturing an offset stacked light-emitting chip structure" and "image display device" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0022] First embodiment

[0023] See also Figures 1 to 8 As shown, the first embodiment of the present invention provides a method for manufacturing a staggered stacked light emitting chip structure S, which may include the following steps: first, Figure 1 , Figure 2 and Figure 3 As shown, a circuit substrate P is provided (step S100), and then a first light-emitting chip 1 is disposed on the circuit substrate P and electrically connected to the circuit substrate P through a conductive material (such as a solder ball or solder paste) (step S102), wherein the first light-emitting chip 1 has a first top light-emitting surface 101, a first bottom non-pad area 102 (or a first bottom non-electrode area), a first positive electrode pad 103, and a first negative electrode pad 104; then, Figure 1 , Figure 4 and Figure 5 As shown, a second light-emitting chip 2 is stacked horizontally offset (or horizontally misaligned) on the first light-emitting chip 1 and electrically connected to the circuit substrate P through a conductive material (such as a solder ball or solder paste) (step S104), wherein the second light-emitting chip 2 has a second top light-emitting surface 201, a second bottom non-welding pad area 202 (or a second bottom non-electrode area), a second positive electrode pad 203 and a second negative electrode pad 204; then, with Figure 1 , Figure 6 and Figure 7 As shown, a third light-emitting chip 3 is stacked horizontally offset (or horizontally misaligned) on the second light-emitting chip 2 and electrically connected to the circuit substrate P through a conductive material (such as solder balls or solder paste) (step S106), wherein the third light-emitting chip 3 has a third top light-emitting surface 301, a third bottom non-solder pad area 302 (or a third bottom non-electrode area), a third positive electrode solder pad 303 and a third negative electrode solder pad 304.

[0024] It is worth noting that with Figure 7 and Figure 8 As shown, the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 can be stacked sequentially from bottom to top, and the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 can be staggered (or offset) from each other in the horizontal direction. Thus, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked sequentially from bottom to top, the vertical projection (or orthographic projection) of the second bottom non-pad area 202 of the second light-emitting chip 2 can partially fall on the first top light-emitting surface 101 of the first light-emitting chip 1 (coordinate with the vertical projection) of the second bottom non-pad area 202 of the second light-emitting chip 2. Figure 5 and Figure 8 As shown), and the vertical projection of the third bottom non-pad area 302 of the third light-emitting chip 3 can partially fall on the first top light-emitting surface 101 of the first light-emitting chip 1 and the second top light-emitting surface 201 of the second light-emitting chip 2 (cooperating with Figure 7 and Figure 8 In addition, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in a staggered manner from bottom to top, the vertical projection of the second positive electrode pad 203 and the vertical projection of the second negative electrode pad 204 of the second light-emitting chip 2 will not fall on the first top light-emitting surface 101 of the first light-emitting chip 1 (coordinated with the Figure 5 and Figure 8 As shown), the vertical projection of the third positive electrode pad 303 of the third light-emitting chip 3 and the vertical projection of the third negative electrode pad 304 will not fall on the first top light-emitting surface 101 of the first light-emitting chip 1 and the second top light-emitting surface 201 of the second light-emitting chip 2 (cooperating with Figure 7 and Figure 8 shown).

[0025] Furthermore, cooperation Figures 2 to 8 As shown, the first embodiment of the present invention further provides a staggered stacked light emitting chip structure S, which includes: a first light emitting chip 1, a second light emitting chip 2 and a third light emitting chip 3. More specifically, the first light emitting chip 1 has a first top light emitting surface 101, a first bottom non-welding pad area 102, a first positive electrode welding pad 103 and a first negative electrode welding pad 104 (cooperating with Figure 2 and Figure 3 As shown), the second light emitting chip 2 has a second top light emitting surface 201, a second bottom non-pad area 202, a second positive electrode pad 203 and a second negative electrode pad 204 (coordinated with Figure 4 and Figure 5As shown), the third light emitting chip 3 has a third top light emitting surface 301, a third bottom non-pad area 302, a third positive electrode pad 303 and a third negative electrode pad 304 (matching Figure 6 and Figure 7 It is worth noting that with Figure 7 and Figure 8 As shown, the first light emitting chip 1 , the second light emitting chip 2 and the third light emitting chip 3 may be stacked sequentially from bottom to top, and the first light emitting chip 1 , the second light emitting chip 2 and the third light emitting chip 3 may be staggered with each other in the horizontal direction.

[0026] For example, if Figure 7 As shown, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in a staggered manner from bottom to top, the first light-emitting chip 1 can be horizontally deflected by a first predetermined deflection angle θ1 relative to the second light-emitting chip 2, the second light-emitting chip 2 can be horizontally deflected by a second predetermined deflection angle θ2 relative to the third light-emitting chip 3, and the third light-emitting chip 3 can be horizontally deflected by a third predetermined deflection angle θ3 relative to the first light-emitting chip 1, and the first predetermined deflection angle θ1, the second predetermined deflection angle θ2 and the third predetermined deflection angle θ3 can be the same or different from each other. In addition, with Figure 2 , Figure 4 and Figure 6 As shown, the thickness H1 of the first light-emitting chip 1 can be less than the thickness H2 of the second light-emitting chip 2 (or, the thickness H1 of the first light-emitting chip 1 can be less than the thickness of the second positive electrode pad 203 and the thickness of the second negative electrode pad 204 of the second light-emitting chip 2), the thickness H2 of the second light-emitting chip 2 can be less than the thickness H3 of the third light-emitting chip 3 (or, the thickness H2 of the second light-emitting chip 2 can be less than the thickness of the third positive electrode pad 303 and the thickness of the third negative electrode pad 304 of the third light-emitting chip 3), and the thickness H1 of the first light-emitting chip 1, the thickness H2 of the second light-emitting chip 2, and the thickness H3 of the third light-emitting chip 3 can all be less than 10 μm. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0027] For example, with Figure 7 and Figure 8As shown, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in a staggered manner from bottom to top, the vertical projection of the second bottom non-pad area 202 of the second light-emitting chip 2 can partially fall on the first top light-emitting surface 101 of the first light-emitting chip 1, and the vertical projection of the third bottom non-pad area 302 of the third light-emitting chip 3 can partially fall on the first top light-emitting surface 101 of the first light-emitting chip 1 and the second top light-emitting surface 201 of the second light-emitting chip 2. Further, in one of the feasible embodiments, the second light-emitting chip 2 can be directly stacked on the first top light-emitting surface 101 of the first light-emitting chip 1, and the first light-emitting chip 1 and the second light-emitting chip 2 are insulated from each other. In addition, the third light-emitting chip 3 can be directly stacked on the second top light-emitting surface 201 of the second light-emitting chip 2, and the second light-emitting chip 2 and the third light-emitting chip 3 are insulated from each other. However, the above example is only one of the feasible embodiments and is not intended to limit the present invention.

[0028] For example, with Figure 7 and Figure 8 As shown, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked and arranged in a staggered manner from bottom to top, the vertical projection of the second positive electrode pad 203 of the second light-emitting chip 2 and the vertical projection of the second negative electrode pad 204 will not fall on the first top light-emitting surface 101 of the first light-emitting chip 1, and the vertical projection of the third positive electrode pad 303 and the vertical projection of the third negative electrode pad 304 of the third light-emitting chip 3 will not fall on the first top light-emitting surface 101 of the first light-emitting chip 1 and the second top light-emitting surface 201 of the second light-emitting chip 2. In other words, the second positive electrode pad 203 and the second negative electrode pad 204 of the second light-emitting chip 2 can avoid the first light-emitting chip 1 and will not contact the first light-emitting chip 1, and the third positive electrode pad 303 and the third negative electrode pad 304 of the third light-emitting chip 3 can avoid the first light-emitting chip 1 and the second light-emitting chip 2 at the same time and will not contact the first light-emitting chip 1 and the second light-emitting chip 2. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0029] For example, with Figure 7 and Figure 8As shown, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in an offset manner from bottom to top, the first top light-emitting surface 101 of the first light-emitting chip 1 has a first light-emitting area A1 (the first light-emitting area A1 may include a first left light-emitting surface and a first right light-emitting surface separated from each other) that will not be shielded by the second bottom non-welding pad area 202 of the second light-emitting chip 2, the second top light-emitting surface 201 of the second light-emitting chip 2 has a second light-emitting area A2 (the second light-emitting area A2 may include a second left light-emitting surface and a second right light-emitting surface separated from each other) that will not be shielded by the third bottom non-welding pad area 302 of the third light-emitting chip 3, and the third top light-emitting surface 301 of the third light-emitting chip 3 has a third light-emitting area A3 (that is, the original complete light-emitting area of ​​the third light-emitting chip 3) that will not be completely shielded. Furthermore, the first light emitting area A1 of the first top light emitting surface 101 may be greater than, equal to, or smaller than the second light emitting area A2 of the second top light emitting surface 201, and the third light emitting area A3 of the third top light emitting surface 301 may be greater than the first light emitting area A1 of the first top light emitting surface 101 and the second light emitting area A2 of the second top light emitting surface 201. In addition, the first light emitting area A1 may occupy approximately 50% to 90% of the surface area of ​​the first top light emitting surface 101 (that is, approximately 50% to 90% (for example, any positive integer percentage between 50% and 90%) of the first top light emitting surface 101 is the actual available light emitting area), and the second light emitting area A2 may occupy approximately 50% to 90% of the surface area of ​​the second top light emitting surface 201 (that is, approximately 50% to 90% (for example, any positive integer percentage between 50% and 90%) of the second top light emitting surface 201 is the actual available light emitting area). Thus, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in sequence, the mutual optical influence between the projection beams generated by the first light-emitting chip 1, the projection beams generated by the second light-emitting chip 2 and the projection beams generated by the third light-emitting chip 3 can be minimized (or the mutual shielding influence between the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 can be minimized). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0030] For example, with Figure 5 , Figure 7 and Figure 8As shown, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in an offset manner from bottom to top, the first top light-emitting surface 101 of the first light-emitting chip 1 has a first shielding area B1 shielded by the second bottom non-pad area 202 of the second light-emitting chip 2, and the second top light-emitting surface 201 of the second light-emitting chip 2 has a second shielding area B2 shielded by the third bottom non-pad area 302 of the third light-emitting chip 3. Furthermore, the first shielding area B1 occupies approximately 10% to 50% of the surface area of ​​the first top light-emitting surface 101 (that is, approximately 10% to 50% (for example, any positive integer percentage between 10% and 50%) of the first top light-emitting surface 101 is a light-emitting area that cannot be utilized), and the second shielding area B2 occupies approximately 10% to 50% of the surface area of ​​the second top light-emitting surface 201 (that is, approximately 10% to 50% (for example, any positive integer percentage between 10% to 50%) of the second top light-emitting surface 201 is a light-emitting area that cannot be utilized). Thereby, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in sequence, the mutual optical influence between the projection beam generated by the first light-emitting chip 1, the projection beam generated by the second light-emitting chip 2 and the projection beam generated by the third light-emitting chip 3 can be minimized (or the mutual shielding influence between the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 can be minimized). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0031] For example, with Figure 2 , Figure 4 and Figure 6 As shown, in one of the feasible embodiments, the first light-emitting chip 1 can be configured as a red light-emitting diode bare die (that is, a red light-emitting bare die that has not been packaged) for providing a red light beam, the second light-emitting chip 2 can be configured as a green light-emitting diode bare die (that is, a green light-emitting bare die that has not been packaged) for providing a green light beam, and the third light-emitting chip 3 can be configured as a blue light-emitting diode bare die (that is, a blue light-emitting bare die that has not been packaged) for providing a blue light beam. Figure 7 and Figure 8As shown, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in a staggered manner from bottom to top, the green light beam provided by the green light-emitting diode die (the second light-emitting chip 2) will be projected upward without passing through the red light-emitting diode die (the first light-emitting chip 1), and the blue light beam provided by the blue light-emitting diode die (the third light-emitting chip 3) will be projected upward without passing through the red light-emitting diode die (the first light-emitting chip 1) and the green light-emitting diode die (the second light-emitting chip 2). Thus, when the red light beam provided by the red light-emitting diode die, the green light beam provided by the green light-emitting diode die and the blue light beam provided by the blue light-emitting diode die cooperate with each other, the staggered stacked light-emitting chip structure S allows to be configured as an image pixel of an image display device. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0032] Second embodiment

[0033] See also Fig. 9 As shown, the second embodiment of the present invention provides a staggered stacked light emitting chip structure S, which includes: a first light emitting chip 1, a second light emitting chip 2 and a third light emitting chip 3. Fig. 9 and Figure 8 It can be seen from the comparison that the main difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the second light-emitting chip 2 can be arranged on the first top light-emitting surface 101 of the first light-emitting chip 1 through a first light-transmitting insulating layer 4, so that the first light-emitting chip 1 and the second light-emitting chip 2 are insulated from each other, and the third light-emitting chip 3 can be arranged on the second top light-emitting surface 201 of the second light-emitting chip 2 through a second light-transmitting insulating layer 5, so that the second light-emitting chip 2 and the third light-emitting chip 3 are insulated from each other.

[0034] For example, any one of the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 includes at least a gallium nitride (GaN) material layer, a quantum well (MQW) structure layer, an N-type gallium nitride material layer, a P-type gallium nitride material layer, a positive electrode layer and a negative electrode layer that can cooperate with each other. Thus, the first top light-emitting surface 101 of the first light-emitting chip 1, the second top light-emitting surface 201 of the second light-emitting chip 2 and the third top light-emitting surface 301 of the third light-emitting chip 3 can all be gallium nitride material surfaces, and the first bottom non-welding pad area 102 of the first light-emitting chip 1, the second bottom non-welding pad area 202 of the second light-emitting chip 2 and the third bottom non-welding pad area 302 of the third light-emitting chip 3 can all be P-type gallium nitride material surfaces or N-type gallium nitride material surfaces (or N-type gallium nitride material surfaces). That is to say, when the second light-emitting chip 2 is disposed on the first top light-emitting surface 101 of the first light-emitting chip 1, the first light-emitting chip 1 (the first top light-emitting surface 101) and the second light-emitting chip 2 (the second bottom non-welding pad area 202) can be insulated from each other by using a first light-transmitting insulating layer 4 (such as silicone, epoxy resin or any light-transmitting insulating material). In addition, when the third light-emitting chip 3 is disposed on the second top light-emitting surface 201 of the second light-emitting chip 2, the second light-emitting chip 2 (the second top light-emitting surface 201) and the third light-emitting chip 3 (the third bottom non-welding pad area 302) can be insulated from each other by using a second light-transmitting insulating layer 5 (such as silicone, epoxy resin or any light-transmitting insulating material). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0035] Third embodiment

[0036] See also Fig.10 As shown, the third embodiment of the present invention provides an image display device D (or LED display), which includes: a circuit substrate P and a plurality of staggered stacked light-emitting chip structures S, and the plurality of staggered stacked light-emitting chip structures S are arranged on the circuit substrate P and electrically connected to the circuit substrate P. Furthermore, each staggered stacked light-emitting chip structure S used in the third embodiment can adopt the staggered stacked light-emitting chip structure S provided in the first embodiment or the second embodiment.

[0037] For example, with Figure 2 , Figure 4 and Figure 6As shown, each staggered stacked light-emitting chip structure S includes a first light-emitting chip 1, a second light-emitting chip 2 and a third light-emitting chip 3, wherein the first light-emitting chip 1 has a first top light-emitting surface 101, a first bottom non-welding pad area 102, a first positive electrode pad 103 and a first negative electrode pad 104, the second light-emitting chip 2 has a second top light-emitting surface 201, a second bottom non-welding pad area 202, a second positive electrode pad 203 and a second negative electrode pad 204, and the third light-emitting chip 3 has a third top light-emitting surface 301, a third bottom non-welding pad area 302, a third positive electrode pad 303 and a third negative electrode pad 304. Thus, when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are staggered and stacked sequentially from bottom to top, and the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 can be staggered with each other in the horizontal direction by a predetermined rotation angle.

[0038] Advantageous Effects of Embodiments

[0039] One of the beneficial effects of the present invention is that the present invention provides a staggered stacked light-emitting chip structure S, which can be realized by "the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in sequence from bottom to top", "the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are staggered in the horizontal direction", "the vertical projection of the second positive electrode pad 203 and the vertical projection of the second negative electrode pad 204 of the second light-emitting chip 2 will not fall on the first top light-emitting surface 101 of the first light-emitting chip 1" and "the vertical projection of the third positive electrode pad 303 and the third negative electrode pad 304 of the third light-emitting chip 3 will not fall on the first top light-emitting surface 101 of the first light-emitting chip 1". The vertical projection of the solder pad 304 will not fall on the first top light emitting surface 101 of the first light emitting chip 1 and the second top light emitting surface 201 of the second light emitting chip 2”, so that when the first light emitting chip 1, the second light emitting chip 2 and the third light emitting chip 3 are stacked in sequence, the mutual optical influence between the projection light beam generated by the first light emitting chip 1, the projection light beam generated by the second light emitting chip 2 and the projection light beam generated by the third light emitting chip 3 can be minimized (or the mutual shielding influence between the first light emitting chip 1, the second light emitting chip 2 and the third light emitting chip 3 can be minimized).

[0040] One of the beneficial effects of the present invention is that the present invention provides a method for manufacturing a staggered stacked light-emitting chip structure S, which can be achieved by “providing a circuit substrate P, arranging a first light-emitting chip 1 on the circuit substrate P and electrically connected to the circuit substrate P, stacking a second light-emitting chip 2 on the first light-emitting chip 1 and electrically connected to the circuit substrate P, and stacking a third light-emitting chip 3 on the second light-emitting chip 2 and electrically connected to the circuit substrate P”, “the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in sequence from bottom to top”, “the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are staggered with each other in the horizontal direction”, and “the vertical projection of the second positive electrode pad 203 of the second light-emitting chip 2 and the vertical projection of the second negative electrode pad 204 are completely The technical scheme of "the vertical projection of the third positive electrode pad 303 of the third light-emitting chip 3 and the vertical projection of the third negative electrode pad 304 will not fall on the first top light-emitting surface 101 of the first light-emitting chip 1 and the second top light-emitting surface 201 of the second light-emitting chip 2" is adopted, so that when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in sequence, the mutual optical influence between the projection light beam generated by the first light-emitting chip 1, the projection light beam generated by the second light-emitting chip 2 and the projection light beam generated by the third light-emitting chip 3 can be minimized (or the mutual shielding influence between the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 can be minimized).

[0041] One of the beneficial effects of the present invention is that an image display device D provided by the present invention can be realized by "a plurality of staggered stacked light-emitting chip structures S are arranged on a circuit substrate P and electrically connected to the circuit substrate P", "each staggered stacked light-emitting chip structure S includes a first light-emitting chip 1, a second light-emitting chip 2 and a third light-emitting chip 3", "the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in sequence from bottom to top", "the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are staggered with each other in the horizontal direction", and "the vertical projection of the second positive electrode pad 203 of the second light-emitting chip 2 and the vertical projection of the second negative electrode pad 204 will not fall on the first top of the first light-emitting chip 1 at all The technical scheme of "the vertical projection of the third positive electrode pad 303 of the third light-emitting chip 3 and the vertical projection of the third negative electrode pad 304 will not fall on the first top light-emitting surface 101 of the first light-emitting chip 1 and the second top light-emitting surface 201 of the second light-emitting chip 2" is adopted, so that when the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are stacked in sequence, the mutual optical influence between the projection light beam generated by the first light-emitting chip 1, the projection light beam generated by the second light-emitting chip 2 and the projection light beam generated by the third light-emitting chip 3 can be minimized (or the mutual shielding influence between the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 can be minimized).

[0042] The contents disclosed above are only optional feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A staggered stacked light emitting chip structure, characterized in that: The staggered stacked light-emitting chip structure comprises: A first light-emitting chip, wherein the first light-emitting chip has a first top light-emitting surface, a first bottom non-pad area, a first positive electrode pad, and a first negative electrode pad; a second light-emitting chip, the second light-emitting chip having a second top light-emitting surface, a second bottom non-pad area, a second positive electrode pad, and a second negative electrode pad; and a third light-emitting chip, the third light-emitting chip having a third top light-emitting surface, a third bottom non-pad area, a third positive electrode pad and a third negative electrode pad; Wherein, the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence from bottom to top, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered with each other in the horizontal direction; Wherein, a vertical projection of the second bottom non-pad area of ​​the second light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip, and a vertical projection of the third bottom non-pad area of ​​the third light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip; Among them, the vertical projection of the second positive electrode pad and the vertical projection of the second negative electrode pad of the second light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip at all, and the vertical projection of the third positive electrode pad and the vertical projection of the third negative electrode pad of the third light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip at all.

2. The staggered stacked light emitting chip structure according to claim 1, characterized in that: in, The second light emitting chip is disposed on the first top light emitting surface of the first light emitting chip through a first light-transmissive insulating layer, so that the first light emitting chip and the second light emitting chip are insulated from each other; The third light emitting chip is disposed on the second top light emitting surface of the second light emitting chip through a second light-transmissive insulating layer, so that the second light emitting chip and the third light emitting chip are insulated from each other; The first top light emitting surface of the first light emitting chip, the second top light emitting surface of the second light emitting chip, and the third top light emitting surface of the third light emitting chip are all gallium nitride material surfaces, and the first bottom non-welding pad area of ​​the first light emitting chip, the second bottom non-welding pad area of ​​the second light emitting chip, and the third bottom non-welding pad area of ​​the third light emitting chip are all P-type gallium nitride material surfaces or N-type gallium nitride material surfaces; The first light-emitting chip is horizontally deflected at a first predetermined deflection angle relative to the second light-emitting chip, the second light-emitting chip is horizontally deflected at a second predetermined deflection angle relative to the third light-emitting chip, and the third light-emitting chip is horizontally deflected at a third predetermined deflection angle relative to the first light-emitting chip, and the first predetermined deflection angle, the second predetermined deflection angle and the third predetermined deflection angle are the same or different from each other.

3. The staggered stacked light emitting chip structure according to claim 1, characterized in that: in, The second light emitting chip is directly stacked on the first top light emitting surface of the first light emitting chip, and the first light emitting chip and the second light emitting chip are insulated from each other; Wherein, the third light-emitting chip is directly stacked on the second top light-emitting surface of the second light-emitting chip, and the second light-emitting chip and the third light-emitting chip are insulated from each other; The first top light emitting surface of the first light emitting chip has a first light emitting area that will not be shielded by the second bottom non-pad area of ​​the second light emitting chip, the second top light emitting surface of the second light emitting chip has a second light emitting area that will not be shielded by the third bottom non-pad area of ​​the third light emitting chip, and the third top light emitting surface of the third light emitting chip has a third light emitting area that will not be completely shielded; The first light-emitting area of ​​the first top light-emitting surface is larger than, equal to, or smaller than the second light-emitting area of ​​the second top light-emitting surface, and the third light-emitting area of ​​the third top light-emitting surface is larger than the first light-emitting area of ​​the first top light-emitting surface and the second light-emitting area of ​​the second top light-emitting surface; The first light emitting area occupies 50% to 90% of the surface area of ​​the first top light emitting surface, and the second light emitting area occupies 50% to 90% of the surface area of ​​the second top light emitting surface; The first top light emitting surface of the first light emitting chip has a first shielding area shielded by the second bottom non-pad area of ​​the second light emitting chip, and the second top light emitting surface of the second light emitting chip has a second shielding area shielded by the third bottom non-pad area of ​​the third light emitting chip; The first shielding area occupies 10% to 50% of the surface area of ​​the first top light emitting surface, and the second shielding area occupies 10% to 50% of the surface area of ​​the second top light emitting surface.

4. The staggered stacked light emitting chip structure according to claim 1, characterized in that: in, The second positive electrode pad and the second negative electrode pad of the second light emitting chip avoid the first light emitting chip and do not contact the first light emitting chip, and the third positive electrode pad and the third negative electrode pad of the third light emitting chip avoid the first light emitting chip and the second light emitting chip and do not contact the first light emitting chip and the second light emitting chip; The thickness of the first light-emitting chip is smaller than that of the second light-emitting chip, the thickness of the second light-emitting chip is smaller than that of the third light-emitting chip, and the thickness of the first light-emitting chip, the thickness of the second light-emitting chip and the thickness of the third light-emitting chip are all smaller than 10 μm; The first light emitting chip is configured as a red light emitting diode die for providing a red light beam, the second light emitting chip is configured as a green light emitting diode die for providing a green light beam, and the third light emitting chip is configured as a blue light emitting diode die for providing a blue light beam; Wherein, the green light beam provided by the green LED die is projected upward without passing through the red LED die, and the blue light beam provided by the blue LED die is projected upward without passing through the red LED die and the green LED die; Among them, when the red light beam provided by the red LED bare crystal, the green light beam provided by the green LED bare crystal and the blue light beam provided by the blue LED bare crystal cooperate with each other, the staggered stacked light-emitting chip structure allows to be configured as an image pixel of an image display device.

5. A method for manufacturing a staggered stacked light-emitting chip structure, characterized in that: The manufacturing method of the staggered stacked light-emitting chip structure comprises: Providing a circuit substrate; A first light-emitting chip is disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the first light-emitting chip has a first top light-emitting surface, a first bottom non-pad area, a first positive electrode pad, and a first negative electrode pad; A second light emitting chip is stacked on the first light emitting chip and electrically connected to the circuit substrate, wherein the second light emitting chip has a second top light emitting surface, a second bottom non-pad area, a second positive electrode pad and a second negative electrode pad; and A third light-emitting chip is stacked on the second light-emitting chip and electrically connected to the circuit substrate, wherein the third light-emitting chip has a third top light-emitting surface, a third bottom non-welding pad area, a third positive electrode welding pad, and a third negative electrode welding pad; Wherein, the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence from bottom to top, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered with each other in the horizontal direction; Wherein, a vertical projection of the second bottom non-pad area of ​​the second light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip, and a vertical projection of the third bottom non-pad area of ​​the third light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip; Among them, the vertical projection of the second positive electrode pad and the vertical projection of the second negative electrode pad of the second light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip at all, and the vertical projection of the third positive electrode pad and the vertical projection of the third negative electrode pad of the third light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip at all.

6. The method for manufacturing a staggered stacked light emitting chip structure according to claim 5, characterized in that: in, The second light emitting chip is disposed on the first top light emitting surface of the first light emitting chip through a first light-transmissive insulating layer, so that the first light emitting chip and the second light emitting chip are insulated from each other; The third light emitting chip is disposed on the second top light emitting surface of the second light emitting chip through a second light-transmissive insulating layer, so that the second light emitting chip and the third light emitting chip are insulated from each other; The first top light emitting surface of the first light emitting chip, the second top light emitting surface of the second light emitting chip, and the third top light emitting surface of the third light emitting chip are all gallium nitride material surfaces, and the first bottom non-welding pad area of ​​the first light emitting chip, the second bottom non-welding pad area of ​​the second light emitting chip, and the third bottom non-welding pad area of ​​the third light emitting chip are all P-type gallium nitride material surfaces or N-type gallium nitride material surfaces; The first light-emitting chip is horizontally deflected at a first predetermined deflection angle relative to the second light-emitting chip, the second light-emitting chip is horizontally deflected at a second predetermined deflection angle relative to the third light-emitting chip, and the third light-emitting chip is horizontally deflected at a third predetermined deflection angle relative to the first light-emitting chip, and the first predetermined deflection angle, the second predetermined deflection angle and the third predetermined deflection angle are the same or different from each other.

7. The method for manufacturing a staggered stacked light emitting chip structure according to claim 5, characterized in that: in, The second light emitting chip is directly stacked on the first top light emitting surface of the first light emitting chip, and the first light emitting chip and the second light emitting chip are insulated from each other; Wherein, the third light-emitting chip is directly stacked on the second top light-emitting surface of the second light-emitting chip, and the second light-emitting chip and the third light-emitting chip are insulated from each other; The first top light emitting surface of the first light emitting chip has a first light emitting area that will not be shielded by the second bottom non-pad area of ​​the second light emitting chip, the second top light emitting surface of the second light emitting chip has a second light emitting area that will not be shielded by the third bottom non-pad area of ​​the third light emitting chip, and the third top light emitting surface of the third light emitting chip has a third light emitting area that will not be completely shielded; The first light-emitting area of ​​the first top light-emitting surface is larger than, equal to, or smaller than the second light-emitting area of ​​the second top light-emitting surface, and the third light-emitting area of ​​the third top light-emitting surface is larger than the first light-emitting area of ​​the first top light-emitting surface and the second light-emitting area of ​​the second top light-emitting surface; The first light emitting area occupies 50% to 90% of the surface area of ​​the first top light emitting surface, and the second light emitting area occupies 50% to 90% of the surface area of ​​the second top light emitting surface; The first top light emitting surface of the first light emitting chip has a first shielding area shielded by the second bottom non-pad area of ​​the second light emitting chip, and the second top light emitting surface of the second light emitting chip has a second shielding area shielded by the third bottom non-pad area of ​​the third light emitting chip; The first shielding area occupies 10% to 50% of the surface area of ​​the first top light emitting surface, and the second shielding area occupies 10% to 50% of the surface area of ​​the second top light emitting surface.

8. The method for manufacturing a staggered stacked light emitting chip structure according to claim 5, characterized in that: in, The second positive electrode pad and the second negative electrode pad of the second light emitting chip avoid the first light emitting chip and do not contact the first light emitting chip, and the third positive electrode pad and the third negative electrode pad of the third light emitting chip avoid the first light emitting chip and the second light emitting chip and do not contact the first light emitting chip and the second light emitting chip; The thickness of the first light-emitting chip is smaller than that of the second light-emitting chip, the thickness of the second light-emitting chip is smaller than that of the third light-emitting chip, and the thickness of the first light-emitting chip, the thickness of the second light-emitting chip and the thickness of the third light-emitting chip are all smaller than 10 μm; The first light emitting chip is configured as a red light emitting diode die for providing a red light beam, the second light emitting chip is configured as a green light emitting diode die for providing a green light beam, and the third light emitting chip is configured as a blue light emitting diode die for providing a blue light beam; Wherein, the green light beam provided by the green LED die is projected upward without passing through the red LED die, and the blue light beam provided by the blue LED die is projected upward without passing through the red LED die and the green LED die; Among them, when the red light beam provided by the red LED bare crystal, the green light beam provided by the green LED bare crystal and the blue light beam provided by the blue LED bare crystal cooperate with each other, the staggered stacked light-emitting chip structure allows to be configured as an image pixel of an image display device.

9. An image display device, characterized in that: The image display device comprises: a circuit substrate; and A plurality of staggered stacked light-emitting chip structures, wherein the plurality of staggered stacked light-emitting chip structures are disposed on the circuit substrate and electrically connected to the circuit substrate; Wherein, each of the staggered stacked light-emitting chip structures includes a first light-emitting chip, a second light-emitting chip and a third light-emitting chip, wherein the first light-emitting chip has a first top light-emitting surface, a first bottom non-welding pad area, a first positive electrode pad and a first negative electrode pad, the second light-emitting chip has a second top light-emitting surface, a second bottom non-welding pad area, a second positive electrode pad and a second negative electrode pad, and the third light-emitting chip has a third top light-emitting surface, a third bottom non-welding pad area, a third positive electrode pad and a third negative electrode pad; Wherein, the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are stacked in sequence from bottom to top, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are staggered with each other in the horizontal direction; Wherein, a vertical projection of the second bottom non-pad area of ​​the second light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip, and a vertical projection of the third bottom non-pad area of ​​the third light-emitting chip partially falls on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip; Among them, the vertical projection of the second positive electrode pad and the vertical projection of the second negative electrode pad of the second light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip at all, and the vertical projection of the third positive electrode pad and the vertical projection of the third negative electrode pad of the third light-emitting chip will not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip at all.

10. The image display device according to claim 9, characterized in that in, The second light emitting chip is disposed on the first top light emitting surface of the first light emitting chip through a first light-transmissive insulating layer, so that the first light emitting chip and the second light emitting chip are insulated from each other; The third light emitting chip is disposed on the second top light emitting surface of the second light emitting chip through a second light-transmissive insulating layer, so that the second light emitting chip and the third light emitting chip are insulated from each other; The first top light emitting surface of the first light emitting chip, the second top light emitting surface of the second light emitting chip, and the third top light emitting surface of the third light emitting chip are all gallium nitride material surfaces, and the first bottom non-welding pad area of ​​the first light emitting chip, the second bottom non-welding pad area of ​​the second light emitting chip, and the third bottom non-welding pad area of ​​the third light emitting chip are all P-type gallium nitride material surfaces or N-type gallium nitride material surfaces; The first light-emitting chip is horizontally deflected by a first predetermined deflection angle relative to the second light-emitting chip, the second light-emitting chip is horizontally deflected by a second predetermined deflection angle relative to the third light-emitting chip, and the third light-emitting chip is horizontally deflected by a third predetermined deflection angle relative to the first light-emitting chip, and the first predetermined deflection angle, the second predetermined deflection angle and the third predetermined deflection angle are the same or different from each other; The first top light emitting surface of the first light emitting chip has a first light emitting area that will not be shielded by the second bottom non-pad area of ​​the second light emitting chip, the second top light emitting surface of the second light emitting chip has a second light emitting area that will not be shielded by the third bottom non-pad area of ​​the third light emitting chip, and the third top light emitting surface of the third light emitting chip has a third light emitting area that will not be completely shielded; The first light-emitting area of ​​the first top light-emitting surface is larger than, equal to, or smaller than the second light-emitting area of ​​the second top light-emitting surface, and the third light-emitting area of ​​the third top light-emitting surface is larger than the first light-emitting area of ​​the first top light-emitting surface and the second light-emitting area of ​​the second top light-emitting surface; The first light emitting area occupies 50% to 90% of the surface area of ​​the first top light emitting surface, and the second light emitting area occupies 50% to 90% of the surface area of ​​the second top light emitting surface; The first top light emitting surface of the first light emitting chip has a first shielding area shielded by the second bottom non-pad area of ​​the second light emitting chip, and the second top light emitting surface of the second light emitting chip has a second shielding area shielded by the third bottom non-pad area of ​​the third light emitting chip; The first shielding area occupies 10% to 50% of the surface area of ​​the first top light-emitting surface, and the second shielding area occupies 10% to 50% of the surface area of ​​the second top light-emitting surface; The second positive electrode pad and the second negative electrode pad of the second light-emitting chip avoid the first light-emitting chip and do not contact the first light-emitting chip, and the third positive electrode pad and the third negative electrode pad of the third light-emitting chip avoid the first light-emitting chip and the second light-emitting chip and do not contact the first light-emitting chip and the second light-emitting chip; The thickness of the first light-emitting chip is smaller than that of the second light-emitting chip, the thickness of the second light-emitting chip is smaller than that of the third light-emitting chip, and the thickness of the first light-emitting chip, the thickness of the second light-emitting chip and the thickness of the third light-emitting chip are all smaller than 10 μm; The first light emitting chip is configured as a red light emitting diode die for providing a red light beam, the second light emitting chip is configured as a green light emitting diode die for providing a green light beam, and the third light emitting chip is configured as a blue light emitting diode die for providing a blue light beam; Wherein, the green light beam provided by the green LED die is projected upward without passing through the red LED die, and the blue light beam provided by the blue LED die is projected upward without passing through the red LED die and the green LED die; Among them, when the red light beam provided by the red LED bare crystal, the green light beam provided by the green LED bare crystal and the blue light beam provided by the blue LED bare crystal cooperate with each other, the staggered stacked light-emitting chip structure allows to be configured as an image pixel of the image display device.

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