Circuit board structure and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a circuit board structure, which comprises the following steps: a first outer substrate and a second outer substrate are respectively arranged on two opposite sides of an inner circuit board, the first outer substrate comprises a first shielding body, the second outer substrate comprises a second shielding body, the second shielding body is arranged corresponding to the first shielding body, and the first shielding body is arranged corresponding to the second shielding body; the inner side circuit board comprises a plurality of signal lines, the signal lines are arranged between the first shielding body and the second shielding body, and the signal lines, the first shielding body and the second shielding body are arranged at intervals. And communicating two corresponding ends of the first shielding body and the second shielding body to form a shielding structure which surrounds the plurality of signal lines to obtain the circuit board structure. The manufacturing method provided by the invention can reduce signal transmission loss. In addition, the invention also provides a circuit board structure.

Description

Technical Field

[0001] The present application relates to the field of circuit board manufacturing, and in particular to a circuit board structure and a manufacturing method thereof. Background Art

[0002] As mid- to high-end consumer electronic products (such as smartphones, tablets, ultra-thin laptops, etc.) have increasing requirements for high-speed signal transmission, the demand for low-loss circuit board applications is gradually increasing.

[0003] However, in the prior art, the method of using insulating resin materials to wrap the signal line to isolate the external electromagnetic interference medium (EMI) can achieve signal line isolation, but due to the large dielectric loss, the transmission line has obvious signal attenuation problems. This will significantly affect the performance and reliability of the circuit board in applications that require high-speed signal transmission, especially in consumer electronic products. Summary of the invention

[0004] In order to solve the problem in the background technology, the present application provides a circuit board structure to reduce signal transmission loss.

[0005] In addition, it is also necessary to provide a method for manufacturing a circuit board structure.

[0006] A method for manufacturing a circuit board structure comprises the following steps: a first outer substrate and a second outer substrate are respectively arranged on opposite sides of an inner circuit board, the first outer substrate comprises a first shielding body, the second outer substrate comprises a second shielding body, the second shielding body is arranged corresponding to the first shielding body, the inner circuit board comprises a plurality of signal lines, the signal lines are arranged between the first shielding body and the second shielding body, and the signal lines are arranged at intervals from the first shielding body and the second shielding body. The corresponding ends of the first shielding body and the second shielding body are connected to form a shielding structure, the shielding structure surrounds the plurality of signal lines, and the circuit board structure is obtained.

[0007] In some possible embodiments, the manufacturing method of the inner circuit board includes the steps of: providing a copper-clad carrier board, the copper-clad carrier board including a peeling layer and a copper foil layer disposed on one side of the peeling layer. Etching the copper foil layer to form a circuit pattern, the circuit pattern having a plurality of wire grooves, a portion of the peeling layer exposed at the bottom of the plurality of wire grooves, and the circuit pattern also including a plurality of signal lines. Disposing an insulating material in the plurality of wire grooves to form an insulating filling layer. And removing the peeling layer to obtain the inner circuit board.

[0008] In some possible embodiments, the circuit pattern also includes two grounding circuits arranged at intervals, and the plurality of signal circuits are arranged between the two grounding circuits, and the step of "connecting the corresponding ends of the first shielding body and the second shielding body" also includes: connecting the corresponding ends of the first shielding body and the second shielding body and the two grounding circuits.

[0009] In some possible embodiments, the step of "connecting the corresponding ends of the first shielding body and the second shielding body" includes: penetrating the first outer substrate, the inner circuit board and the second outer substrate to form a first through hole and a second through hole, wherein the first through hole and the second through hole are respectively arranged on both sides of the shielding structure. A first conductive body is arranged in the first through hole, the first conductive body connects the first shielding body and the second shielding body, and a second conductive body is arranged in the second through hole, the second conductive body connects the first shielding body and the second shielding body.

[0010] In some possible embodiments, the first outer substrate further includes a first insulating layer, a first outer circuit layer and a second outer circuit layer, the first outer circuit layer and the second outer circuit layer are respectively arranged on opposite sides of the back of the first insulating layer, and part of the first shielding body passes through the second outer circuit layer and is embedded in the first insulating layer. The manufacturing method of the first outer substrate includes the steps of: providing a first double-sided copper clad laminate, the first double-sided copper clad laminate includes the first insulating layer, a first outer copper foil layer and a second outer copper foil layer, the first outer copper foil layer and the second outer copper foil layer are respectively arranged on opposite sides of the first insulating layer. A first slot is arranged in the first double-sided copper clad laminate, and the first slot passes through the second outer copper foil layer and part of the first insulating layer. A first electroplating layer is arranged in the second outer copper foil layer, and part of the first electroplating layer is filled in the first slot to form the first shielding body. The second outer copper foil layer and the first electroplating layer are etched to form the second outer circuit layer. A second electroplating layer is provided on the first outer copper foil layer, a part of the second electroplating layer is filled into the first through hole and / or the second through hole to form the first conductive body and / or the second conductive body, and the first outer copper foil layer and the second electroplating layer are etched to form the first outer circuit layer.

[0011] In some possible embodiments, the second outer substrate further includes a second insulating layer, a third outer circuit layer and a fourth outer circuit layer, the third outer circuit layer and the fourth outer circuit layer are respectively arranged on opposite sides of the back of the second insulating layer, a portion of the second shielding body passes through the fourth outer circuit layer and is embedded in the second insulating layer, and the manufacturing method of the second outer substrate includes the steps of:

[0012] A second double-sided copper clad laminate is provided, the second double-sided copper clad laminate includes the second insulating layer, the third outer copper foil layer and the fourth outer copper foil layer, the third outer copper foil layer and the fourth outer copper foil layer are respectively arranged on opposite sides of the second insulating layer. A second slot is arranged on the second double-sided copper clad laminate, the second slot passes through the fourth outer copper foil layer and part of the second insulating layer. A third electroplating layer is arranged on the fourth outer copper foil layer, part of the third electroplating layer is filled into the second slot to form the second shielding body. The fourth outer copper foil layer and the third electroplating layer are etched to form the fourth outer circuit layer. A fourth electroplating layer is arranged on the third outer copper foil layer, part of the fourth electroplating layer is filled into the first through hole and / or the second through hole to form the first conductive body and / or the second conductive body, and the third outer copper foil layer and the fourth electroplating layer are etched to form the third outer circuit layer.

[0013] In some possible embodiments, before the step of "connecting the corresponding ends of the first shielding body and the second shielding body", the step also includes: setting a first adhesive layer between the first outer substrate and the inner circuit board, and setting a second adhesive layer between the second outer substrate and the inner circuit layer.

[0014] A circuit board structure includes an inner circuit board, a first outer substrate, a second outer substrate and a conductive body, wherein the first outer substrate and the second outer substrate are respectively arranged on two opposite sides of the inner circuit board, the first outer substrate includes a first shielding body, the second outer substrate includes a second shielding body, the second shielding body is arranged corresponding to the first shielding body, the conductive body is connected between the first shielding body and the second shielding body to form a shielding structure, the inner circuit board includes a plurality of signal lines, and the shielding structure surrounds the plurality of signal lines.

[0015] In some possible embodiments, the inner circuit board further includes two ground circuits arranged at intervals, a plurality of the signal circuits are arranged between the two ground circuits, and the conductive body is connected to the ground circuits.

[0016] In some possible embodiments, the circuit board structure further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the first outer substrate and the inner circuit board, and the second adhesive layer is disposed between the second outer substrate and the inner circuit board.

[0017] Compared with the prior art, the manufacturing method of the circuit board structure provided in the present application is achieved by respectively pressing a first outer substrate and a second outer substrate on both sides of an inner circuit board, wherein the first outer substrate has a first shielding body, and the second outer substrate has a second shielding body, and the first shielding body and the second shielding body are connected to form a shielding structure, and multiple signal lines of the inner circuit layer are arranged in the shielding structure, thereby realizing electromagnetic shielding of multiple signal lines, which is beneficial to reducing the loss of high-speed signals during transmission and improving the performance and reliability of the circuit board structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic cross-sectional view of a copper-clad substrate provided in accordance with an embodiment of the present application.

[0019] Figure 2 For etching Figure 1 The cross-sectional view of the copper layer after being clad to form a circuit pattern is shown.

[0020] Figure 3 for Figure 2 A schematic cross-sectional view of a wiring duct of a circuit pattern shown in FIG.

[0021] Figure 4 To remove Figure 3 The peeling layer shown is a schematic cross-sectional view of the inner circuit board.

[0022] Figure 5 A schematic cross-sectional view of a first double-sided copper clad laminate provided in one embodiment of the present application.

[0023] Figure 6 for Figure 5 The cross-sectional schematic diagram of the first double-sided copper clad laminate after the first groove is provided.

[0024] Figure 7 for Figure 6 The cross-sectional schematic diagram shows a first slot after a first shielding body is arranged in the first slot.

[0025] Figure 8 A schematic cross-sectional view of a first outer substrate provided in accordance with an embodiment of the present application.

[0026] Fig. 9 A schematic cross-sectional view of a second double-sided copper clad laminate provided in one embodiment of the present application.

[0027] Fig.10 for Fig. 9 The cross-sectional schematic diagram of the second double-sided copper clad laminate after the second groove is provided.

[0028] Fig.11 for Fig.10 The cross-sectional schematic diagram shows a second slot after a second shielding body is arranged in the second slot.

[0029] Fig.12 A cross-sectional schematic diagram of a second outer substrate provided in one embodiment of the present application.

[0030] Fig.13 For pressing Figure 4 The inner circuit board shown, Figure 8 The first outer substrate and Fig.12 A cross-sectional schematic diagram of the second outer substrate is shown.

[0031] Fig.14 For pressing Fig.13 The inner circuit board, the first outer substrate and the second outer substrate are shown to obtain a cross-sectional schematic diagram of an intermediate body.

[0032] Fig.15 for Fig.14 The intermediate body shown is a schematic cross-sectional view after the first through hole and the second through hole are provided.

[0033] Fig.16 A schematic cross-sectional view of a circuit board structure provided in one embodiment of the present application.

[0034] Main component symbols

[0035] Circuit board structure 100

[0036] Inner circuit board 10

[0037] Circuit diagram 11

[0038] Wire duct 111

[0039] Ground line 112

[0040] Signal line 113

[0041] Insulation filling layer 12

[0042] Copper clad substrate 13

[0043] Peel layer 131

[0044] Copper layer 132

[0045] The first outer substrate 20

[0046] First insulating layer 21

[0047] First outer circuit layer 22

[0048] The second outer wiring layer 23

[0049] The first shielding body 24

[0050] First Containment Space 241

[0051] The first double-sided copper clad laminate 25

[0052] The first outer copper foil layer 252

[0053] The second outer copper foil layer 253

[0054] First slot 254

[0055] First electroplating layer 255

[0056] The second outer circuit layer 256

[0057] First connection pad 257

[0058] The second outer substrate 30

[0059] The second insulating layer 31

[0060] The third outer wiring layer 32

[0061] Fourth outer wiring layer 33

[0062] Second shielding body 34

[0063] The second double-sided copper clad laminate 35

[0064] The third outer copper foil layer 351

[0065] Fourth outer copper foil layer 352

[0066] Second slot 353

[0067] Second electroplating layer 355

[0068] The third outer circuit layer 356

[0069] Second connection pad 357

[0070] Second shielding body 36

[0071] Second Containment Space 361

[0072] The first adhesive layer 40

[0073] The first opening 401

[0074] Second adhesive layer 41

[0075] The second opening 411

[0076] Intermediate 42

[0077] First through hole 421

[0078] The second through hole 422

[0079] The first conductive body 50

[0080] First metal layer 51

[0081] The second metal layer 52

[0082] Shielding structure 53

[0083] The second conductive body 54

[0084] First covering layer 60

[0085] Second covering layer 61

[0086] First section width D1

[0087] Second section width D2

[0088] The third section width W1

[0089] Fourth section width W2

[0090] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0091] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0092] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or can be simultaneously present in a central element. When an element is considered to be "disposed on" another element, it can be directly disposed on the other element or can be simultaneously present in a central element.

[0093] See also Figures 1 to 16 An embodiment of the present application provides a method for manufacturing a circuit board structure 100, which specifically includes the following steps:

[0094] S1: See Figures 1 to 4 , an inner circuit board 10 is manufactured, and the inner circuit board 10 includes a circuit pattern 11 and an insulating filling layer 12. The circuit pattern 11 is penetrated by a plurality of wire grooves 111, and the insulating filling layer 12 is filled in the plurality of wire grooves 111. The thickness of the circuit pattern 11 is substantially the same as the thickness of the insulating filling layer 12.

[0095] In this embodiment, the step S1 of “making the inner circuit board 10” specifically includes the following steps:

[0096] S10: See Figure 1A copper-clad carrier board 13 is provided, wherein the copper-clad carrier board 13 includes a peeling layer 131 and a copper-clad layer 132 disposed on one side of the peeling layer 131. The peeling layer 131 is made of polyethylene terephthalate (PET).

[0097] S11: See Figure 2 , the copper clad layer 132 is etched to form the circuit pattern 11, the circuit pattern 11 has a plurality of wire grooves 111, and a portion of the stripping layer 131 is exposed at the bottom of the plurality of wire grooves 111. The circuit pattern 11 also includes two grounding circuits 112 and a plurality of signal circuits 113. The plurality of signal circuits 113 are arranged side by side and spaced apart between the two grounding circuits 112.

[0098] S12: See Figure 3 , filling the wire groove 111 of the circuit pattern 11 with insulating resin to form the insulating filling layer 12. The insulating filling layer 12 is made of polyimide (PI).

[0099] S13: See Figure 4 , remove the peeling layer 131 to obtain the inner circuit board 10.

[0100] S2: See Figures 5 to 8 , a first outer substrate 20 is manufactured, wherein the first outer substrate 20 includes a first insulating layer 21, a first outer copper foil layer 252, a second outer circuit layer 23 and a first shielding body 24. The first outer circuit layer 22 and the second outer circuit layer 23 are respectively arranged on two opposite outer sides of the first insulating layer 21. The first shielding body 24 passes through the second outer circuit layer 23 and is embedded in the first insulating layer 21.

[0101] In this embodiment, the step S2 of “making the first outer substrate 20” specifically includes the following steps:

[0102] S20: See Figure 5 A first double-sided copper clad laminate 25 is provided, wherein the first double-sided copper clad laminate 25 includes the first insulating layer 21, a first outer copper foil layer 252, and a second outer copper foil layer 253. The first outer copper foil layer 252 and the second outer copper foil layer 253 are respectively disposed on opposite sides of the first insulating layer 21.

[0103] S21: See Figure 6 A first slot 254 is provided on the first double-sided copper clad laminate 25. The first slot 254 penetrates the second outer copper foil layer 253 and a portion of the first insulating layer 21.

[0104] S22: See Figure 7 , a first electroplating layer 255 is disposed on the second outer copper foil layer 253. Part of the first electroplating layer 255 is filled into the first slot 254 to form the first shielding body 24. The first shielding body 24 is substantially "U"-shaped, and has a first receiving space 241. The first shielding body 24 has a first cross-sectional width D1.

[0105] S23: See Figure 8 The second outer copper foil layer 253 and the first electroplating layer 255 are etched to form a second outer circuit layer 256. The second outer circuit layer 256 includes two first connection pads 257, and the two first connection pads 257 are respectively connected to opposite ends of the first shielding body 24 to obtain the first outer substrate 20.

[0106] S3: See Figures 9 to 12 , a second outer substrate 30 is manufactured, wherein the second outer substrate 30 includes a second insulating layer 31, a third outer circuit layer 32, a fourth outer copper foil layer 352 and a second shielding body 34. The third outer circuit layer 32 and the fourth outer copper foil layer 352 are respectively arranged on two opposite outer sides of the second insulating layer 31. The second shielding body 34 passes through the fourth outer circuit layer 33 and is embedded in the second insulating layer 31.

[0107] In this embodiment, the step S3 of “making the second outer substrate 30” specifically includes the following steps:

[0108] S30: See Fig. 9 A second double-sided copper clad laminate 35 is provided, wherein the second double-sided copper clad laminate 35 includes the second insulating layer 31, a third outer copper foil layer 351, and a fourth outer copper foil layer 352. The third outer copper foil layer 351 and the fourth outer copper foil layer 352 are respectively disposed on opposite sides of the second insulating layer 31.

[0109] S31: See Fig.10 A second slot 353 is provided on the second double-sided copper clad laminate 35. The second slot 353 penetrates the third outer copper foil layer 351 and a portion of the second insulating layer 31.

[0110] S33: See Fig.11 , a second electroplating layer 355 is disposed on the third outer copper foil layer 351. Part of the second electroplating layer 355 is filled into the second slot 353 to form the second shielding body 36. The second shielding body 36 is substantially "U"-shaped, and the second shielding body 36 has a second receiving space 361. The second shielding body 36 has a second cross-sectional width D2, and the second cross-sectional width D2 is substantially the same as the first cross-sectional width D1.

[0111] S33: See Fig.12 , the third outer copper foil layer 351 and the second electroplating layer 355 are etched to form a third outer circuit layer 356. The third outer circuit layer 356 includes two second connection pads 357, and the two second connection pads 357 are respectively connected to the opposite ends of the second shielding body 34 to obtain the second outer substrate 30.

[0112] S4: See Fig.13 , providing a first adhesive layer 40 and a second adhesive layer 41, wherein the first adhesive layer 40 is provided with a first opening 401, and the second adhesive layer 41 is provided with a second opening 411. The third cross-sectional width W1 of the first opening 401 is substantially the same as the fourth cross-sectional width W2 of the second opening 411, and the third cross-sectional width W1 of the first opening 401 is substantially the same as the first cross-sectional width D1 of the second shielding body 34.

[0113] S5: See Fig.13 , align the first outer substrate 20, the first adhesive layer 40, the inner circuit board 10, the second adhesive layer 41 and the second outer substrate 30. Specifically, the first receiving space 241 of the first shielding body 24 corresponds to the second receiving space 361 of the second shielding body 36, and the first opening 401 and the second opening 411 correspond to the first receiving space 241 and the second receiving space 361 respectively. A plurality of signal lines 113 are arranged corresponding to the first receiving space 241 and the second receiving space 361. One of the grounding lines 112 corresponds to one of the first connection pads 257 and one of the second connection pads 357, and another of the grounding lines 112 corresponds to another of the first connection pads 257 and another of the second connection pads 357.

[0114] S6: See Fig.14 , the first outer substrate 20, the first adhesive layer 40, the inner circuit board 10, the second adhesive layer 41 and the second outer substrate 30 are pressed together to obtain an intermediate body 42. The first receiving space 241 is connected to the first opening 401, and the second receiving space 361 is connected to the second opening 411. The inner circuit board 10 is disposed between the first opening 401 and the second opening 411.

[0115] S7: See Fig.15A first through hole 421 and a second through hole 422 are formed through the intermediate body 42, the first through hole 421 and the second through hole 422 are spaced apart, and the first shielding body 24 and the second shielding body 36 are located between the first through hole 421 and the second through hole 422. One first connection pad 257, one second connection pad 357 and one grounding line 112 are exposed from the side wall of the first through hole 421, and another first connection pad 257, another second connection pad 357 and another grounding line 112 are exposed from the side wall of the second through hole 422.

[0116] S8: See Fig.16 , a first metal layer 51 and a second metal layer 52 are respectively disposed on two opposite outer sides of the intermediate body 42, and part of the first metal layer 51 and / or part of the second metal layer 52 are filled into the first through hole 421 to form a first conductive body 50, and the first conductive body 50 connects one first connection pad 257 and one second connection pad 357. Part of the first metal layer 51 and / or part of the second metal layer 52 are filled into the second through hole 422 to form a second conductive body 54, and the second conductive body 54 connects another first connection pad 257 and another second connection pad 357. In this way, the first shielding body 24, the second shielding body 36, part of the first conductive body 50, part of the second conductive body 54, two first connection pads 257 and two second connection pads 357 are collectively surrounded to form a shielding structure 53. The two grounding lines 112 are respectively connected to the first conductive body 50 and the second conductive body 54. The plurality of signal lines 113 are located in the shielding structure 53 and surrounded by the shielding structure 53. The first conductive body 50 and the second conductive body 54 are both hollow structures.

[0117] S9: Please see Fig.16 , etching the first metal layer 51 and the first outer copper foil layer 252 to form the first outer circuit layer 22, and etching the second metal layer 52 and the fourth outer copper foil layer 352 to form the fourth outer circuit layer 33, to obtain the circuit board structure 100.

[0118] See also Fig.16 In this embodiment, the manufacturing method of the circuit board structure 100 also includes the steps of: setting a first covering layer 60 on the first outer circuit layer 22, and setting a second covering layer 61 on the fourth outer circuit layer 33, and the first covering layer 60 and / or the second covering layer 61 are filled into the hollow first conductive body 50 and / or the hollow second conductive body 54.

[0119] Compared with the prior art, the manufacturing method of the circuit board structure 100 provided in the present application has the following advantages:

[0120] (i) By pressing the first outer substrate 20 and the second outer substrate 30 on both sides of the inner circuit board 10, the first outer substrate 20 has a first shielding body 24, and the second outer substrate 30 has a second shielding body 36. The first shielding body 24 and the second shielding body 36 are connected to form a shielding structure 53. The multiple signal lines 113 of the inner circuit board 10 are arranged in the shielding structure 53, so as to achieve electromagnetic shielding of the multiple signal lines 113, which is beneficial to reduce the loss of high-speed signals during transmission and improve the performance and reliability of the circuit board structure 100.

[0121] (ii) The first shielding body 24 has a first receiving space 241, and the second shielding body 36 has a second receiving space 361. The first receiving space 241 and the second receiving space 361 are both filled with air, and air has a smaller signal attenuation than dielectric materials (for example, modified polyimide, liquid crystal polymer, polytetrafluoroethylene, etc.), thereby further reducing the transmission loss of high-speed signals in multiple signal lines 113.

[0122] See also Fig.16 The embodiment of the present application further provides a circuit board structure 100, comprising an inner circuit board 10, a first outer substrate 20, a second outer substrate 30 and a conductive body (a first conductive body 50, a second conductive body 54). The first outer substrate 20 and the second outer substrate 30 are respectively arranged on two opposite sides of the inner circuit board 10. The first outer substrate 20 comprises a first shielding body 24, the second outer substrate 30 comprises a second shielding body 36, the second shielding body 36 is arranged corresponding to the first shielding body 24, the conductive body is connected between the first shielding body 24 and the second shielding body 36 to form a shielding structure 53, the inner circuit board 10 comprises a plurality of signal lines 113, and the shielding structure 53 surrounds the plurality of signal lines 113.

[0123] See also Fig.16 In this embodiment, the inner circuit board 10 further includes two grounding circuits 112 arranged at intervals, a plurality of signal circuits 113 are arranged between the two grounding circuits 112 , and the conductive body connects the grounding circuits 112 .

[0124] See also Fig.16 In this embodiment, the circuit board structure 100 further includes a first adhesive layer 40 and a second adhesive layer 41. The first adhesive layer 40 is disposed between the first outer substrate 20 and the inner circuit board 10. The second adhesive layer 41 is disposed between the second outer substrate 30 and the inner circuit board 10.

[0125] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments are within the scope of protection claimed in the present application.

Claims

1. A method for manufacturing a circuit board structure, characterized in that: Includes steps: A first outer substrate and a second outer substrate are respectively arranged on opposite sides of an inner circuit board, the first outer substrate includes a first shielding body, the second outer substrate includes a second shielding body, the second shielding body is arranged corresponding to the first shielding body, the inner circuit board includes a plurality of signal lines, the signal lines are arranged between the first shielding body and the second shielding body, and the signal lines are arranged at intervals from the first shielding body and the second shielding body; The corresponding two ends of the first shielding body and the second shielding body are connected to form a shielding structure, and the shielding structure surrounds the plurality of signal lines to obtain the circuit board structure.

2. The manufacturing method according to claim 1, characterized in that The manufacturing method of the inner circuit board comprises the steps of: A copper-clad carrier is provided, wherein the copper-clad carrier comprises a peeling layer and a copper foil layer disposed on one side of the peeling layer; Etching the copper foil layer to form a circuit pattern, wherein the circuit pattern has a plurality of wire grooves, a portion of the stripping layer is exposed at the bottom of the plurality of wire grooves, and the circuit pattern also includes a plurality of the signal lines; Disposing insulating material in the plurality of wire slots to form an insulating filling layer; as well as The peeling layer is removed to obtain the inner circuit board.

3. The manufacturing method according to claim 2, characterized in that: The circuit pattern further includes two grounding circuits arranged at intervals, and the plurality of signal circuits are arranged between the two grounding circuits. The step of "connecting the corresponding ends of the first shielding body and the second shielding body" further includes: The corresponding two ends of the first shielding body and the second shielding body and the two grounding lines are connected.

4. The manufacturing method according to claim 1, characterized in that: The step of "connecting the corresponding ends of the first shielding body and the second shielding body" includes: Penetrating the first outer substrate, the inner circuit board and the second outer substrate to form a first through hole and a second through hole, wherein the first through hole and the second through hole are respectively arranged on two sides of the shielding structure; A first conductive body is disposed in the first through hole, wherein the first conductive body connects the first shielding body and the second shielding body, and A second conductive body is disposed in the second through hole, and the second conductive body connects the first shielding body and the second shielding body.

5. The manufacturing method according to claim 4, characterized in that: The first outer substrate further includes a first insulating layer, a first outer circuit layer and a second outer circuit layer, the first outer circuit layer and the second outer circuit layer are respectively arranged on opposite sides of the back of the first insulating layer, a portion of the first shielding body passes through the second outer circuit layer and is embedded in the first insulating layer, and the manufacturing method of the first outer substrate includes the steps of: Providing a first double-sided copper clad laminate, the first double-sided copper clad laminate comprising the first insulating layer, a first outer copper foil layer and a second outer copper foil layer, wherein the first outer copper foil layer and the second outer copper foil layer are respectively arranged on opposite sides of the first insulating layer; A first slot is provided on the first double-sided copper clad laminate, wherein the first slot penetrates the second outer copper foil layer and a portion of the first insulating layer; Disposing a first electroplating layer on the second outer copper foil layer, and partially filling the first electroplating layer into the first slot to form the first shielding body; Etching the second outer copper foil layer and the first electroplating layer to form the second outer circuit layer; A second electroplating layer is provided on the first outer copper foil layer, and a part of the second electroplating layer is filled into the first through hole and / or the second through hole to form the first conductive body and / or the second conductive body, and The first outer copper foil layer and the second electroplating layer are etched to form the first outer wiring layer.

6. The manufacturing method according to claim 4, characterized in that: The second outer substrate further includes a second insulating layer, a third outer circuit layer and a fourth outer circuit layer, the third outer circuit layer and the fourth outer circuit layer are respectively arranged on opposite sides of the back of the second insulating layer, a portion of the second shielding body passes through the fourth outer circuit layer and is embedded in the second insulating layer, and the manufacturing method of the second outer substrate includes the steps of: Providing a second double-sided copper clad laminate, the second double-sided copper clad laminate comprising the second insulating layer, a third outer copper foil layer and a fourth outer copper foil layer, the third outer copper foil layer and the fourth outer copper foil layer are respectively arranged on opposite sides of the second insulating layer; A second slot is provided on the second double-sided copper clad laminate, wherein the second slot penetrates the fourth outer copper foil layer and a portion of the second insulating layer; Disposing a third electroplating layer on the fourth outer copper foil layer, and partially filling the third electroplating layer into the second slot to form the second shielding body; Etching the fourth outer copper foil layer and the third electroplating layer to form the fourth outer circuit layer; A fourth electroplating layer is provided on the third outer copper foil layer, and a portion of the fourth electroplating layer is filled into the first through hole and / or the second through hole to form the first conductive body and / or the second conductive body, and The third outer copper foil layer and the fourth electroplating layer are etched to form the third outer wiring layer.

7. The manufacturing method according to claim 1, characterized in that: Before the step of "connecting the corresponding two ends of the first shielding body to the second shielding body", the step further includes: A first adhesive layer is provided between the first outer substrate and the inner circuit board, and A second adhesive layer is disposed between the second outer substrate and the inner circuit layer.

8. A circuit board structure, characterized in that: The invention comprises an inner circuit board, a first outer substrate, a second outer substrate and a conductive body, wherein the first outer substrate and the second outer substrate are respectively arranged on two opposite sides of the inner circuit board, the first outer substrate comprises a first shielding body, the second outer substrate comprises a second shielding body, the second shielding body is arranged corresponding to the first shielding body, the conductive body is connected between the first shielding body and the second shielding body to form a shielding structure, the inner circuit board comprises a plurality of signal lines, and the shielding structure surrounds the plurality of signal lines.

9. The circuit board structure according to claim 8, characterized in that: The inner circuit board further includes two grounding circuits arranged at intervals, a plurality of signal circuits are arranged between the two grounding circuits, and the conductive body is connected to the grounding circuits.

10. The circuit board structure according to claim 8, characterized in that: It also includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is arranged between the first outer substrate and the inner circuit board, and the second adhesive layer is arranged between the second outer substrate and the inner circuit board.

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