Preparation method for performing laser etching chemical plating on ferrite surface and ferrite structure thereof

Abstract

The invention relates to a preparation method for performing laser etching chemical plating on a ferrite surface and a ferrite structure thereof, which is characterized in that at least one surface of a base material body is subjected to laser activation treatment, the base material body is made of a copper-containing ferrite material, and the laser activation treatment part of the base material body is subjected to chemical plating treatment. A conductive circuit is formed on the laser activating treatment part of the base material body; therefore, the invention can overcome the defects in the prior art, can successfully carry out laser activation treatment, and can plate a conductive circuit layer on the part subjected to laser activation treatment through chemical plating treatment so as to be applied to a circuit device.

Description

Technical Field

[0001] The present invention relates to a preparation method for laser engraving and chemical plating on the surface of ferrite and a ferrite structure thereof, in particular to a ferrite substrate structure capable of forming a circuit line through laser engraving and chemical plating. Background Art

[0002] Currently, 3D circuits are generally used in mobile phone antennas. The general method is to first inject a high-melting viscosity plastic into a substrate, then use an LPKF laser machine to receive digital circuit data, activate the surface of the substrate, and then apply electroplating metalization to produce metal circuits on the surface of the thermoplastic plastic.

[0003] Since most laser direct molding (LDS) technologies use thermoplastics for injection molding, and most of these plastic materials have high viscosity, they have a low flow length and the molded surface is too rough, which in turn leads to low circuit resolution. In order to solve the above problems, this case uses low-viscosity epoxy resin plastic for preparation. However, due to the special material properties of epoxy resin plastic, additional conditions must be combined with other resins or compounds to be able to use laser direct molding (LDS) technology to prepare a conductive substrate with high circuit resolution.

[0004] If you try to perform laser direct structuring (LDS) on the surface of general ferrite materials, it is often difficult to plate a metal layer on the surface. However, the high resistance characteristics of ferrite materials can reduce their eddy current losses to prevent high-frequency electromagnetic noise (electromagnetic interference) from entering or being transmitted from the device. Therefore, if the problem of being unable to perform laser direct structuring (LDS) on ferrite materials can be overcome, it will be able to bring more applications and technological progress.

[0005] Therefore, after the copper-containing ferrite material is used in the present case for laser direct structuring (LDS) technology, the above-mentioned material can be successfully laser activated. In this way, a conductive circuit layer can be plated on the laser activated area through a chemical plating process for use in circuit devices. Therefore, the present invention should be an optimal solution. Summary of the invention

[0006] Therefore, the purpose of the present invention is to provide a preparation method for laser engraving and chemical plating on the surface of ferrite and its ferrite structure, which can overcome the defects of the prior art, can successfully carry out laser activation treatment, and can then plate a conductive circuit layer on the laser activated area through a chemical plating treatment for use in circuit devices.

[0007] To achieve the above object, the present invention discloses a preparation method for laser engraving and chemical plating on the surface of ferrite, which is characterized by the following steps:

[0008] Performing laser activation treatment on at least one surface of a substrate body, the substrate body being made of a copper-containing ferrite material;

[0009] Then, a chemical plating process is performed on the laser activated portion of the substrate body to form a conductive circuit on the laser activated portion of the substrate body.

[0010] The copper-containing ferrite material is copper ferrite, copper-nickel ferrite, copper-nickel-zinc ferrite or cobalt-zinc-copper ferrite.

[0011] The laser pulse frequency of the laser activation treatment is 200-10000 Hz, the laser power is 0.5-25 W, the laser spot diameter is 20-200 μm, and the laser spot spacing is 10-100 μm.

[0012] Among them, the minimum line width of the conductive circuit is 30μm, and the laser pulse frequency of the laser activation treatment that meets the minimum line width is 20-50Hz, the laser power is 0.5-5W, the laser spot diameter is 20-50μm, and the laser spot spacing is 10-50μm.

[0013] The chemical plating process is carried out in an electroplating tank, wherein the electroplating tank contains an electroplating solution, wherein the electroplating solution is an electrolyte solution containing pre-plated metal ions, and a power supply device is connected to at least one cathode terminal and one anode terminal, wherein the cathode terminal is connected to the substrate body, and the anode terminal is connected to a metal material. After a DC power supply is passed through the power supply device, the conductive circuit can be plated on the laser activated treatment part of the substrate body.

[0014] Also disclosed is a ferrite structure, characterized in that it comprises:

[0015] A substrate body is made of a copper-containing ferrite material. A laser activation treatment is performed on at least one surface of the substrate body, and then a chemical plating treatment is performed on the laser activated portion of the substrate body to form a conductive circuit on the laser activated portion of the substrate body.

[0016] The copper-containing ferrite material is copper ferrite, copper-nickel ferrite, copper-nickel-zinc ferrite or cobalt-zinc-copper ferrite.

[0017] The conductive circuits are formed on different surfaces of the substrate body, and a through hole connected to the conductive circuits is passed through the substrate body to enable the conductive circuits on different surfaces to be electrically connected.

[0018] Through the above content, the present invention can achieve the following technical effects:

[0019] 1. After using copper-containing ferrite materials for laser direct structuring (LDS) technology, the material can be successfully laser activated. In this way, a conductive circuit layer can be plated on the laser activated area through a chemical plating process, which can be used in circuit devices, overcoming the defects of the prior art.

[0020] 2. The use of copper-containing ferrite materials for laser direct structuring (LDS) technology enables the circuit devices produced by LDS to have the characteristics of preventing high-frequency electromagnetic noise (electromagnetic interference) from entering or being transmitted from the device, and its performance is better, with wider applications and technological progress. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 : A schematic flow chart of the steps of the preparation method for laser engraving and chemical plating on the surface of ferrite according to the present invention.

[0022] Figure 2 : A schematic diagram of the first embodiment of the ferrite structure of the present invention in which laser engraving and chemical plating are performed on the ferrite surface.

[0023] Figure 3 : The present invention is a preparation method for laser engraving and chemical plating on the surface of ferrite and a schematic diagram of chemical plating implementation of the ferrite structure.

[0024] Figure 4A : The present invention is a preparation method for laser engraving and chemical plating on the surface of ferrite and a schematic diagram of chemical plating implementation of non-copper ferrite in ferrite structure.

[0025] Figure 4B : The present invention is a preparation method for laser engraving and chemical plating on the surface of ferrite and a schematic diagram of chemical plating implementation of copper-containing ferrite in a ferrite structure.

[0026] Figure 5 A schematic diagram of a second embodiment of the present invention is a method for preparing a ferrite surface by laser engraving and chemical plating and a ferrite structure thereof.

[0027] Figure 6 A schematic diagram of a conductive through-hole structure of a second embodiment of a preparation method for laser engraving and chemical plating on a ferrite surface and a ferrite structure thereof is provided.

[0028] Figure 7 : The present invention is a preparation method for laser engraving and chemical plating on the surface of ferrite and a schematic diagram of the contrast pattern of the ferrite structure.

[0029] Figure 8 : The present invention is a preparation method for laser engraving and chemical plating on the surface of ferrite and a schematic diagram of the fine line pattern of the ferrite structure.

[0030] Fig.9A: A schematic diagram of the front side implementation of a circuit of a ferrite structure and its application in an LDSPI antenna using a method for preparing the ferrite surface by laser engraving and chemical plating according to the present invention.

[0031] Fig. 9B : The present invention discloses a method for preparing a ferrite surface by laser engraving and chemical plating, and a schematic diagram of the back side of a circuit of the ferrite structure applied to an LDSPI antenna.

[0032] Fig. 9C : The present invention discloses a preparation method for laser engraving and chemical plating on the surface of ferrite and a schematic diagram of a conductive through hole of a ferrite structure applied to an LDSPI antenna. DETAILED DESCRIPTION

[0033] Other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings.

[0034] See also Figure 1 , is a schematic diagram of the first implementation structure of a preparation method for laser engraving and chemical plating on a ferrite surface. As shown in the figure, the steps are:

[0035] 1. Performing laser activation treatment on at least one surface of a substrate body, wherein the substrate body is made of a copper-containing ferrite material 101;

[0036] 2. Perform a chemical plating process on the laser activated portion of the substrate body to form a conductive circuit 102 on the laser activated portion of the substrate body.

[0037] The ferrite structure of the present invention comprises a substrate body, which is made of a copper-containing ferrite material. A laser activation treatment is performed on at least one surface of the substrate body, and then a chemical plating treatment is performed on the laser activated portion of the substrate body to form a conductive circuit on the laser activated portion of the substrate body.

[0038] The substrate in this system can be a flat surface, a curved surface or an irregular surface. This case first uses a flat plate as an implementation description, but this case is not limited to being implemented on a flat surface.

[0039] like Figure 2 As shown in the figure, the substrate body 1 is made of a copper-containing ferrite material, and the substrate body 1 has a first surface 11 and a second surface 12 .

[0040] A laser activation treatment is performed on the first surface 11 or the second surface 12, and then a conductive circuit layer 2 is plated on the laser activated portion of the first surface 11 or the second surface 12 through a chemical plating process (different circuit requirements require different conductive circuits to be formed). The conductive circuit layer 2 can be welded with multiple circuit elements electrically connected to the conductive circuit.

[0041] The copper-containing ferrite material is copper ferrite, copper-nickel ferrite, copper-nickel-zinc ferrite or cobalt-zinc-copper ferrite.

[0042] In this case, the first surface 11 or the second surface 12 is activated by using a laser beam (laser engraving is applied to process the pre-designed circuit track and engrave a plurality of grooves, which can be divided into shallow and deep grooves according to the degree of laser engraving, and the shallow degree can even be invisible to the human eye). The laser engraving system can be two-dimensional laser engraving or three-dimensional laser engraving. In addition, the laser engraving system can use different types of laser light, such as green laser with a wavelength of 532nm, UV laser with a wavelength of 355nm, and IR laser with a wavelength of 1064nm.

[0043] The above-mentioned laser activation treatment uses a laser beam to irradiate the surface of the prepared substrate body 1. When irradiated by the laser light, a physical and chemical reaction will occur to activate the metal. The surface of the substrate body 1 will be ablated (micro-etched) to form a circuit route, and the surface roughness will be increased to enhance adhesion. The roughness is conducive to the attachment and rooting of particles on the surface during the chemical plating process.

[0044] The laser pulse frequency of the laser activation treatment is 200-10000 Hz, the laser power is 0.5-25 W, the laser spot diameter is 20-200 μm, the laser spot spacing is 10-100 μm, and the laser scanning speed is 300 mm / s.

[0045] The minimum line width of the conductive circuit is 30 μm, and the laser pulse frequency of the laser activation treatment that meets the minimum line width is 20-50 Hz, the laser power is 0.5-5 W, the laser spot diameter is 20-50 μm, and the laser spot spacing is 10-50 μm.

[0046] In this case, metal is deposited on the surface irradiated by laser through chemical plating. Chemical plating is a copper plating process with high stability and fast deposition rate. This process can make the circuit fully present. Cleaning must be carried out before chemical plating. After cleaning, the sample is placed in the chemical plating electrolyte. The circuit traces produced after being irradiated by laser light will produce a layer of deposited metal. Because the activated metal particles become the target in chemical plating, that is, the crystal nucleus, they are reduced to metal, and after metal deposition, a layer of fine and continuous metal circuit pattern with a thickness of about 5-8 microns is formed.

[0047] The metal layer (conductive circuit layer 2) can be deposited locally on the surface or deposited on the entire surface.

[0048] Further explanation, such as Figure 2 As shown, the chemical plating process is carried out in an electroplating tank 3, wherein the electroplating tank 3 contains an electroplating solution 31, wherein the electroplating solution 31 is an electrolyte solution containing pre-plated metal ions, and a power supply device 4 is connected to at least a cathode terminal 41 and an anode terminal 42, wherein the cathode terminal 41 is connected to the part to be laser activated, and the anode terminal 42 is connected to a metal material 5, and after a DC power supply is passed through the power supply device 4, the metal layer (wherein the metal layer includes copper, nickel, gold, silver, platinum, palladium, tin, zinc, chromium or a combination thereof) can be plated on the part to be laser activated.

[0049] like Figure 4A As shown, the nickel-zinc ferrite substrate was laser activated, and the laser activated area was subjected to chemical plating. As shown in the figure, no significant metal deposition was observed, which shows that the laser direct structuring (LDS) of the nickel-zinc ferrite substrate has obviously failed.

[0050] like Figure 4B As shown, the substrate body 1 of the present case (copper-nickel-zinc ferrite is used in this embodiment) is subjected to laser activation treatment, and chemical plating is performed on the laser activated portion. As shown in the figure, complete metal deposition can be displayed on the surface, so the presence of copper element plays an important role in the LDS process of ferrite.

[0051] This case has another embodiment. Figure 5 As shown, the preparation method for laser engraving and chemical plating on the ferrite surface and the ferrite structure thereof include a substrate body 6, the substrate body 6 is made of a copper-containing ferrite material, and the substrate body 6 has a first surface 61 and a second surface 62.

[0052] A laser activation treatment is performed on the first surface 61 and the second surface 62, and then a first conductive circuit layer 71 and a second conductive circuit layer 72 are plated on the laser activated areas of the first surface 61 and the second surface 62 through a chemical plating process (different circuit requirements require different conductive circuits to be formed).

[0053] The first conductive circuit layer 71 is located on the laser-activated portion of the first surface 61 .

[0054] The second conductive circuit layer 72 is located on the laser activated portion of the second surface 62 .

[0055] The copper-containing ferrite material is copper ferrite, copper-nickel ferrite, copper-nickel-zinc ferrite or cobalt-zinc-copper ferrite.

[0056] The above-mentioned laser activation treatment uses a laser beam to irradiate the surface of the prepared substrate body 6. When irradiated by the laser light, a physical and chemical reaction will occur, activating the metal, and the surface of the substrate body 1 will be ablated (micro-etched) to form a circuit route, and the surface roughness will be increased to enhance adhesion. The roughness is conducive to the attachment and rooting of particles on the surface during the chemical plating process.

[0057] The laser pulse frequency of the laser activation treatment is 200-10000 Hz, the laser power is 0.5-25 W, the laser spot diameter is 20-200 μm, and the laser spot spacing is 10-100 μm.

[0058] The minimum line width of the conductive circuit is 30 μm, and the laser pulse frequency of the laser activation treatment that meets the minimum line width is 20-50 Hz, the laser power is 0.5-5 W, the laser spot diameter is 20-50 μm, and the laser spot spacing is 10-50 μm.

[0059] The chemical plating process is as described above, in a plating tank, wherein the plating tank contains a plating solution, wherein the plating solution is an electrolyte solution containing pre-plated metal ions, and a power supply device is connected to at least one cathode terminal and one anode terminal, wherein the cathode terminal is connected to the laser activation treatment site, and the anode terminal is connected to a metal material. After a DC power supply is passed through the power supply device, a deposited metal layer can be plated on the activation treatment site. The deposition of the metal layer (the first conductive circuit layer 71 and the second conductive circuit layer 72) can be local surface deposition or entire surface deposition.

[0060] like Figure 6 As shown, a through hole 8 is formed through the first conductive circuit layer 71 and the second conductive circuit layer 72 to enable electrical connection between the first conductive circuit layer 71 and the second conductive circuit layer 72 .

[0061] like Figure 7 As shown, the laser conditions of the laser activation treatment in this case (laser pulse frequency of 200 to 10000 Hz, laser power of 0.5 to 25 W, laser spot diameter of 20 to 200 μm, laser spot spacing of 10 to 100 μm) can produce a line width range of 30 μm to 2000 μm.

[0062] Depend on Figure 8 It can be seen that in order to meet the demand for fine line width, after the above-mentioned laser conditions (laser pulse frequency of 20-50Hz, laser power of 0.5-5W, laser spot diameter of 20-50μm, laser spot spacing of 10-50μm) are actually applied to the surface of the laser-engravable coating, a line width range of 30μm to 50μm can be achieved.

[0063] like Fig.9A , Fig. 9B and Fig. 9C As shown, the above laser conditions (laser pulse frequency 200-10000 Hz, laser power 0.5-25 W, laser spot diameter 20-200 μm, laser spot spacing 10-100 μm) are actually applied to the LDS antenna circuit, where Fig.9A The front side of the antenna circuit (having through holes 111 and 112) is formed on one of the surfaces of the laser-engravable coating layer, and Fig. 9B The back side of the antenna circuit (having through holes 121 and 122, such as Fig. 9C As shown, the conductive via 121 is viewed through a microscope, and its line width is 500μm. The front side of the antenna circuit is connected to the circuit on the back side through the metallized wall of the conductive via. Further measurement of the resistance between the two electrodes is less than 0.1Ω, indicating that the connection has been achieved.

[0064] The preparation method of laser engraving and chemical plating on the ferrite surface and the ferrite structure provided by the present invention have the following advantages when compared with other conventional technologies:

[0065] (1) In this case, after using the copper-containing ferrite material for laser direct structuring (LDS) technology, the above-mentioned material can be successfully laser activated. In this way, a conductive circuit layer can be plated on the laser activated area through a chemical plating process for use in circuit devices.

[0066] (2) In this case, copper-containing ferrite material is used for laser direct structuring (LDS) technology, so that the circuit device prepared by LDS can have the characteristic of preventing high-frequency electromagnetic noise (electromagnetic interference) from entering or being transmitted from the device.

[0067] The present invention has been disclosed through the above embodiments, but they are not intended to limit the present invention. Anyone familiar with this technical field and having ordinary knowledge can make some changes and modifications without departing from the spirit and scope of the present invention after understanding the above technical features and embodiments of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the claims attached to this specification.

Claims

1. A preparation method for laser engraving and chemical plating on the surface of ferrite, characterized in that The steps are: Performing laser activation treatment on at least one surface of a substrate body, the substrate body being made of a copper-containing ferrite material; Then, a chemical plating process is performed on the laser activated portion of the substrate body to form a conductive circuit on the laser activated portion of the substrate body.

2. The method for preparing ferrite by laser engraving and chemical plating according to claim 1, characterized in that: The copper-containing ferrite material is copper ferrite, copper-nickel ferrite, copper-nickel-zinc ferrite or cobalt-zinc-copper ferrite.

3. The method for preparing ferrite by laser engraving and chemical plating according to claim 1, characterized in that: The laser pulse frequency of the laser activation treatment is 200-10000 Hz, the laser power is 0.5-25 W, the laser spot diameter is 20-200 μm, and the laser spot spacing is 10-100 μm.

4. The method for preparing ferrite by laser engraving and chemical plating according to claim 3, characterized in that: The minimum line width of the conductive circuit is 30 μm, and the laser pulse frequency of the laser activation treatment that meets the minimum line width is 20-50 Hz, the laser power is 0.5-5 W, the laser spot diameter is 20-50 μm, and the laser spot spacing is 10-50 μm.

5. The method for preparing ferrite surface by laser engraving and chemical plating as claimed in claim 1, characterized in that: The chemical plating process is carried out in an electroplating tank, wherein the electroplating tank contains an electroplating solution, wherein the electroplating solution is an electrolyte solution containing pre-plated metal ions, and a power supply device is connected to at least one cathode terminal and one anode terminal, wherein the cathode terminal is connected to the substrate body, and the anode terminal is connected to a metal material. After a DC power supply is passed through the power supply device, the conductive circuit can be plated on the laser activated treatment part of the substrate body.

6. A ferrite structure, characterized in that Include: A substrate body is made of a copper-containing ferrite material. A laser activation treatment is performed on at least one surface of the substrate body, and then a chemical plating treatment is performed on the laser activated portion of the substrate body to form a conductive circuit on the laser activated portion of the substrate body.

7. The ferrite structure according to claim 6, characterized in that The copper-containing ferrite material is copper ferrite, copper-nickel ferrite, copper-nickel-zinc ferrite or cobalt-zinc-copper ferrite.

8. The ferrite structure according to claim 6, characterized in that The conductive circuits are formed on different surfaces of the substrate body, and a through hole connected to the conductive circuits is penetrated through the substrate body to enable the conductive circuits on different surfaces to be electrically connected.

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