Substrate holding apparatus, substrate manufacturing apparatus, and substrate manufacturing method

Abstract

The invention relates to a substrate holding apparatus, a substrate manufacturing apparatus, and a substrate manufacturing method. A substrate holding device (1) is provided with: a holding roller (51); and a fluid blowing-out device (60) that blows out a pressurized fluid to the inclined surface section (B) held by the holding roller (51).

Description

Technical Field

[0001] The invention relates to a substrate holding device, a substrate manufacturing device and a substrate manufacturing method. Background Art

[0002] In the three-dimensional assembly technology of stacking / assembling multiple substrates, after the device surfaces of the multiple substrates are bonded to each other, the non-device surface of one of the substrates is ground. The substrate has a shape with rounded edges or a chamfered shape (beveled portion) in advance.

[0003] Therefore, if the bevel portion is thinned by grinding, a sharp end (blade portion) will be formed, resulting in the worry of defects such as breakage or chipping. Therefore, in the bevel filling technology, the gap between the bevel portions in the stacked substrate is filled with a filler to support the blade portion and prevent defects.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2022-38834

[0007] Problems to be solved by the invention

[0008] However, if bubbles are mixed into the filler applied to the gap between the beveled portions, there is a concern that defects may occur in the substrate due to bubbles (i.e., voids) inside the filler. More specifically, if a grinding load is applied to the blade portion, the blade portion in the void portion cannot be fully supported by the filler, resulting in a concern that defects such as breakage or notches may occur in the substrate. Therefore, from the perspective of preventing defects from occurring in the substrate, it is extremely important to remove the bubbles mixed into the filler.

[0009] In addition, from the perspective of preventing defects from occurring on the substrate, it is also extremely important to remove foreign matter (such as liquid or particles) attached to the inclined surface of the substrate. Not limited to the above-mentioned laminated substrate, in a general substrate (i.e., an unlaminated substrate), if foreign matter is attached to the inclined surface of the substrate, the substrate is contaminated, and as a result, there is also a concern that defects may occur on the substrate.

[0010] As described above, it is extremely important to maintain the cleanliness of the bevel portion of the substrate, including the removal of bubbles mixed into the filler and the removal of foreign matter from the bevel portion, from the viewpoint of preventing defects from occurring in the substrate. Summary of the invention

[0011] Therefore, an object of the present invention is to provide a substrate holding device, a substrate manufacturing device, and a substrate manufacturing method that can prevent defects from occurring on a substrate.

[0012] (Methods to solve the problem)

[0013] In one embodiment, a substrate holding device is provided, comprising: a holding roller that rotates the substrate while holding an inclined portion of the substrate; and a fluid blowing device that is connected to the holding roller and blows pressurized fluid onto the inclined portion held by the holding roller.

[0014] In one embodiment, the fluid blowing device includes: a fluid supply line connected to a blowing port formed in the holding roller; and a fluid supply device connected to the fluid supply line.

[0015] In one embodiment, the substrate holding device includes a clamp device that brings a first clamping portion and a second clamping portion of the holding roller that clamp the inclined surface portion closer to or farther from each other.

[0016] In one embodiment, the substrate holding device includes a roller moving device that moves the holding roller between a contact position where the holding roller contacts the inclined surface portion and a separation position where the holding roller separates from the inclined surface portion.

[0017] In one embodiment, a substrate manufacturing device is provided for manufacturing a laminated substrate formed by laminating a first substrate and a second substrate. The substrate manufacturing device comprises: a holding roller that rotates the laminated substrate while holding the laminated substrate; a fluid blowing device that is connected to the holding roller and blows a pressurized fluid into a gap between the laminated substrates held by the holding roller; and a coating device that applies a filler to the gap.

[0018] In one embodiment, the fluid blowing device includes: a fluid supply line connected to a blowing port formed in the holding roller; and a fluid supply device connected to the fluid supply line.

[0019] In one embodiment, the substrate manufacturing apparatus includes a clamp device that brings a first clamping portion and a second clamping portion of the holding roller that clamp the inclined surface portion of the stacked substrate into close proximity with or away from each other.

[0020] In one embodiment, the substrate manufacturing apparatus includes a roller moving device that moves the holding roller between a contact position where the holding roller contacts the inclined surface portion of the stacked substrate and a separation position where the holding roller is separated from the inclined surface portion.

[0021] In one embodiment, the fluid blowing device includes a heater that heats the fluid to be blown onto the inclined surface of the stacked substrate.

[0022] In one embodiment, the coating device includes a spray nozzle that sprays a pressurized fluid onto a filler supplied to a supply nozzle that supplies the filler toward the gap.

[0023] In one embodiment, a substrate manufacturing method is provided, which manufactures a laminated substrate formed by laminating a first substrate and a second substrate. The substrate manufacturing method includes the following steps: a step of rotating the laminated substrate while holding the laminated substrate by a holding roller; a step of applying a filler to a gap between the laminated substrates; and a step of connecting to the holding roller and blowing a pressurized fluid to the gap.

[0024] In one embodiment, the step of blowing out the pressurized fluid includes a step of blowing out the pressurized fluid from a blowing port formed in the holding roller.

[0025] In one embodiment, the substrate manufacturing method includes a step of bringing a first clamping portion and a second clamping portion of the holding roller that clamp the inclined surface portion of the stacked substrate into close proximity with or away from each other.

[0026] In one embodiment, the substrate manufacturing method includes the step of moving the holding roller between a contact position where the holding roller contacts the inclined surface portion of the stacked substrate and a separation position where the holding roller is separated from the inclined surface portion.

[0027] In one embodiment, the substrate manufacturing method includes a step of heating a fluid to be blown onto the inclined surface of the stacked substrate.

[0028] In one embodiment, the substrate manufacturing method includes a step of ejecting a pressurized fluid onto a filler supplied to a supply nozzle that supplies the filler toward the gap.

[0029] Effects of the Invention

[0030] The fluid blowing device can keep the bevel portion of the substrate clean by blowing the pressurized fluid onto the bevel portion of the substrate, thereby preventing defects from occurring on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1A This is an enlarged cross-sectional view showing the peripheral edge of a wafer as an example of a substrate.

[0032] Figure 1B This is an enlarged cross-sectional view showing the peripheral edge of a wafer as an example of a substrate.

[0033] Figure 2A This is a schematic diagram showing an example of a stacked wafer in which two wafers are bonded together.

[0034] Figure 2B It means that Figure 2A A schematic diagram of a stacked wafer after the second wafer is ground (thinned) as shown.

[0035] Figure 3It is a diagram showing one embodiment of a substrate manufacturing apparatus.

[0036] Figure 4 It is a figure which shows one embodiment of a substrate holding device.

[0037] Figure 5A This is a diagram showing how a pressurized fluid is sprayed into a gap between stacked wafers.

[0038] Figure 5B This is a diagram showing how a pressurized fluid is sprayed into a gap between stacked wafers.

[0039] Figure 6 It is a diagram showing a stacking process of stacking wafers.

[0040] Figure 7 This is a diagram showing a chuck device for clamping stacked wafers with holding rollers.

[0041] Figure 8 It is a figure which shows another embodiment of a fluid blowing device.

[0042] Fig. 9 It is a diagram showing another embodiment of the coating device. DETAILED DESCRIPTION

[0043] Figure 1A and Figure 1B : is an enlarged cross-sectional view showing the peripheral edge of a wafer as an example of a substrate. More specifically, Figure 1A This is a cross-sectional view of a so-called straight wafer. Figure 1B This is a cross-sectional view of a so-called round wafer. Figure 1A In the chip W, the bevel portion is the outermost peripheral surface of the chip W (indicated by the symbol B) composed of the upper inclined portion (upper bevel portion) P, the lower inclined portion (lower bevel portion) Q and the side portion (top end) R.

[0044] exist Figure 1B In the wafer W, the chamfer portion is a portion having a curved cross section constituting the outermost peripheral surface of the wafer W (indicated by the symbol B). The top edge portion E1 is a flat portion located in an area closer to the inside in the radial direction than the chamfer portion B and located closer to the outside in the radial direction than the area D where the device is formed. The top edge portion E1 may also include an area where the device is formed. The bottom edge portion E2 is a flat portion located on the side opposite to the top edge portion E1 and located closer to the inside in the radial direction than the chamfer portion B. These top edge portions E1 and bottom edge portions E2 may also be collectively referred to as near edge portions.

[0045] Figure 2A is a schematic diagram showing an example of a stacked wafer in which two wafers are bonded together. Figure 2B It means that Figure 2AA schematic diagram of a stacked wafer after the second wafer is ground (thinned) as shown. Figure 2A The stacked wafer Ws shown is formed by Figure 1B The circular first wafer W1 shown is manufactured by bonding with the second wafer W2.

[0046] like Figure 2B As shown, if the second wafer W2 is thinned, a blade portion NE is formed at the peripheral portion of the second wafer W2. The blade portion NE is easily notched due to physical contact, resulting in a concern that defects such as breakage or notches may occur in the stacked wafer Ws. Therefore, a filler is applied between the first wafer W1 and the second wafer W2 of the stacked wafer Ws, and the filler is cured to effectively protect the blade portion NE.

[0047] However, if bubbles are mixed into the filler, there is a concern that defects such as breakage or chipping may occur in the blade portion NE. From the viewpoint of preventing defects from occurring in the laminated wafer Ws, it is extremely important to remove bubbles mixed into the filler.

[0048] As described above, from the viewpoint of preventing defects from occurring on the wafer W, it is also extremely important to remove foreign matter (such as liquid or particles) attached to the bevel portion B of the wafer W. Therefore, a substrate manufacturing apparatus that can prevent defects from occurring on the wafer W (including stacked wafers Ws) will be described below with reference to the drawings.

[0049] Figure 3 1 is a diagram showing an embodiment of a substrate manufacturing apparatus. The substrate manufacturing apparatus is an apparatus for manufacturing (ie, processing) a stacked wafer Ws formed by bonding a first wafer W1 and a second wafer W2. Therefore, the substrate manufacturing apparatus may also be referred to as a substrate processing apparatus.

[0050] The substrate manufacturing apparatus comprises: a substrate holding device 1 for holding stacked wafers Ws; and a coating device 2 for coating a filler F on a gap between a bevel portion B of a first wafer W1 and a bevel portion B of a second wafer W2 (ie, a gap of the stacked wafers Ws).

[0051] The coating device 2 is arranged above the stacked wafer Ws held in the vertical direction. More specifically, the stacked wafer Ws is held in a state where its plane is perpendicular to the horizontal plane. In other words, the stacked wafer Ws is held in a state where it is placed vertically. The coating device 2 includes: a supply nozzle 4 for supplying a filler F toward the gap between the stacked wafers Ws; and a support arm 3 for supporting the supply nozzle 4.

[0052] Figure 4 1 is a diagram showing an embodiment of a substrate holding device. Figure 4As shown, the substrate holding device 1 comprises: a holding roller 51 for rotating the stacked chip Ws while holding the peripheral portion of the stacked chip Ws; and a fluid blowing device 60, which is connected to the holding roller 51 and blows pressurized fluid to the peripheral portion of the stacked chip Ws held by the holding roller 51.

[0053] The pressurized fluid is a fluid that has been given kinetic energy. In the present embodiment, the pressurized fluid refers to a gas that has been pressurized to a pressure required for removing bubbles from the filler F.

[0054] By holding the peripheral edge of the stacked wafer Ws with the holding roller 51, foreign matter can be prevented from adhering to the surface (and back surface) of the stacked wafer Ws. Figure 4 In the embodiment shown, the substrate holding device 1 has four holding rollers 51, but the number of holding rollers 51 is not limited to this embodiment as long as the stacked wafers Ws can be held. In this embodiment, the substrate holding device 1 holds the stacked wafers Ws in the vertical direction, but may also hold them in the horizontal direction.

[0055] like Figure 4 As shown, each holding roller 51 includes a first clamping portion 53A and a second clamping portion 53B for clamping the peripheral edge of the stacked wafer Ws, and a shaft portion 54 disposed between the first clamping portion 53A and the second clamping portion 53B.

[0056] The substrate holding device 1 includes a roller rotating device 70 for rotating the holding roller 51. The roller rotating device 70 includes a connecting rod 71 connected to the holding roller 51 (more specifically, the first clamping portion 53A (or the second clamping portion 53B)) and a motor 72 for rotating the connecting rod 71.

[0057] The fluid blowing device 60 includes: a fluid supply line 61 connected to the blowing port 52 formed on the outer peripheral surface of the shaft portion 54; a fluid supply device 62 connected to the fluid supply line 61; and an opening and closing valve 63 for opening and closing the fluid supply line 61. Figure 4 In the illustrated embodiment, a plurality of blowing outlets 52 are formed, but at least one blowing outlet 52 may be formed. The blowing outlet 52 is formed on the outer peripheral surface of the shaft portion 54 of the holding roller 51. Therefore, if the holding roller 51 holds the stacked wafers Ws, the blowing outlet 52 is opposite to the gap between the stacked wafers Ws.

[0058] As long as the pressurized fluid can be supplied to the gap between the stacked wafers Ws, the blowing port 52 is not necessarily formed in the shaft portion 54. In one embodiment, the fluid blowing device 60 may include the blowing port 52 formed in at least one of the clamping portions 53A and 53B.

[0059] The substrate manufacturing apparatus includes a control device 40 (see Figure 3The control device 40 is electrically connected to the roller rotating device 70, and is configured to rotate the holding roller 51 through the roller rotating device 70. If the holding roller 51 rotates in a state where the stacked wafer Ws is held by the holding roller 51, the stacked wafer Ws rotates together with the holding roller 51.

[0060] The control device 40 is configured to control the operation of the fluid blowing device 60 . When the control device 40 drives the fluid supply device 62 with the on-off valve 63 opened, the pressurized fluid is blown out from the blow-out port 52 through the fluid supply line 61 .

[0061] The control device 40 is configured to control the operation of the coating device 2. The control device 40 operates the roller rotating device 70 to rotate the laminated wafer Ws through the holding roller 51, and operates the coating device 2, thereby supplying the filler F from above the laminated wafer Ws through the supply nozzle 4. By supplying the filler F while rotating the laminated wafer Ws, the gaps in the laminated wafer Ws are filled with the filler F over the entire circumference of the laminated wafer Ws.

[0062] exist Figure 3 and Figure 4 In the illustrated embodiment, the substrate holding device 1 has a roller moving device 80 that moves the holding roller 51 between a contact position where the holding roller 51 contacts the peripheral edge of the stacked wafer Ws and a separation position where the holding roller 51 is separated from the peripheral edge of the stacked wafer Ws.

[0063] In one embodiment, the roller moving device 80 may also include a linear actuator connected to the roller rotating device 70. The roller moving device 80 is configured to move the holding roller 51 through the roller rotating device 70. The components of the roller moving device 80 are not particularly limited as long as they can move the holding roller 51 between the contact position and the separation position. In one embodiment, the roller moving device 80 may also be a combination of a ball screw and a linear guide.

[0064] When the stacked wafer Ws transported to the substrate holding device 1 is held by the holding roller 51 by the transport device (not shown), the roller moving device 80 moves the holding roller 51 to the contact position. Then, the fluid blowing device 60 removes bubbles in the filler applied to the gap between the stacked wafers Ws. After the bubbles are removed, the roller moving device 80 moves the holding roller 51 to the separation position when separating the stacked wafer Ws from the holding roller 51. Then, the stacked wafer Ws is transported to a subsequent processing assembly by the transport device (not shown).

[0065] Figure 5A and Figure 5B FIG. 2 is a diagram showing the state of spraying pressurized fluid into the gap between stacked wafers. Figure 5AAs shown, the pressurized fluid is ejected from the holding roller 51 toward the filler F on the gap between the stacked wafers Ws, whereby the filler F is compressed.

[0066] like Figure 5B As shown, the bubbles mixed into the filler F are compressed together with the filler F and soon shrunk to a level that does not adversely affect the blade portion NE. The size of the bubbles shrunk by the injection of the pressurized fluid does not return to its original size. As shown above, the fluid blowing device 60 can remove bubbles in the filler applied to the gap between the stacked wafers Ws.

[0067] According to this embodiment, the fluid blowing device 60 can remove bubbles in the filler applied to the gap between the stacked wafers Ws. Therefore, the substrate manufacturing apparatus can prevent defects such as breakage or chipping of the blade portion NE due to bubbles mixed in the filler F.

[0068] According to this embodiment, the fluid blowing device 60 removes foreign matter (such as liquid or particles) attached to the bevel portion B of the wafer W, and can maintain the cleanliness of the bevel portion B. Therefore, the substrate manufacturing apparatus can prevent the occurrence of defects in the wafer W due to foreign matter attached to the bevel portion B of the wafer W.

[0069] Figure 6 FIG. 1 is a diagram showing the stacking process of stacked wafers. Figure 6 As shown, in the state where the wafer W1 and the wafer W3 (W4, W5) are bonded, the back side of the wafer W3 (W4, W5) is ground (thinned) to perform the grinding process. By repeating the grinding process shown above, the thickness of the stacked wafer Ws in the thickness direction increases by stacking the wafer W3 (W4, W5) on the wafer W1.

[0070] Figure 7 2 is a diagram showing a clamping device for clamping stacked wafers with holding rollers. Figure 7 In the embodiment shown, the roller rotating device 70 is omitted. Figure 7 As shown, the substrate holding device 1 includes a clamp device 90 for bringing the first clamping portion 53A and the second clamping portion 53B of the holding roller 51 closer to or away from each other. The clamp device 90 includes a first clamp actuator 56A connected to the first clamping portion 53A and a second clamp actuator 56B connected to the second clamping portion 53B.

[0071] Each of the clamp actuators 56A and 56B is configured to move each of the clamping parts 53A and 53B in the axial direction of the shaft part 54. Each of the clamp actuators 56A and 56B is, for example, a piston rod. The control device 40 is configured to control the operation of each of the clamp actuators 56A and 56B.

[0072] The control device 40 can move the clamping parts 53A and 53B in the direction of approaching or separating each other by operating each of the clamping actuators 56A and 56B. With the above-described configuration, the clamping device 90 can clamp stacked wafers Ws having various thicknesses.

[0073] exist Figure 7 In the illustrated embodiment, the blowing outlet 52 is formed at each of the inclined surfaces of the clamping parts 53A and 53B. In one embodiment, the blowing outlet 52 may also be formed at the shaft part 54. In this embodiment, since the blowing outlet 52 is opposite to the gap between the stacked wafers Ws, the fluid blowing device 60 can remove bubbles in the filler applied to the gap between the stacked wafers Ws.

[0074] As for the properties of the filler F, there are known fillers F that are cured by heating. If the filler F described above is used, in order to effectively protect the blade portion NE, it is preferable to heat the filler F by supplying a high-temperature gas (that is, a temperature required for curing the filler F) to the filler F after removing the bubbles in the filler F. The temperature required for curing the filler F is in other words the curing temperature.

[0075] Therefore, the fluid blowing device 60 may also be configured to supply a heated fluid heated to a temperature above the curing temperature from at least one of the plurality of holding rollers 51. For example, the fluid blowing device 60 may also include a heater 67 connected to the fluid supply line 61 (see Figure 7 ).

[0076] The fluid flowing in the fluid supply line 61 passes through the heater 67, and the heated fluid heated to a temperature above the curing temperature is blown out from the blowing port 52 of the holding roller 51, so that the filler F applied to the gap between the stacked wafers Ws is cured. In one embodiment, the pressurized fluid pressurized to a pressure required to remove bubbles in the filler F may be heated to a temperature above the curing temperature and supplied. With the above-described configuration, the fluid blowing device 60 can remove bubbles and cure the filler F.

[0077] exist Figure 3In the illustrated embodiment, four retaining rollers 51 are provided. Hereinafter, the retaining roller 51 disposed on the downstream side of the coating device 2 in the rotation direction of the stacked wafer Ws and adjacent to the coating device 2 is referred to as the first retaining roller 51. The retaining roller 51 disposed on the downstream side of the first retaining roller 51 in the rotation direction of the stacked wafer Ws and adjacent to the first retaining roller 51 is referred to as the second retaining roller 51. The retaining roller 51 disposed on the downstream side of the second retaining roller 51 in the rotation direction of the stacked wafer Ws and adjacent to the second retaining roller 51 is referred to as the third retaining roller 51. The retaining roller 51 disposed on the downstream side of the third retaining roller 51 in the rotation direction of the stacked wafer Ws and adjacent to the third retaining roller 51 is referred to as the fourth retaining roller 51.

[0078] At this time, the fluid blowing device 60 supplies unheated pressurized fluid from each of the first holding roller 51 and the second holding roller 51 to remove bubbles from the filler F, and supplies heating fluid from the third holding roller 51 and the fourth holding roller 51 to solidify the filler F from which bubbles have been removed. By the structure shown above, the filler F can be solidified immediately after the bubbles in the filler applied to the gap of the stacked wafers Ws are removed. Therefore, the application of the filler F, the removal of bubbles, and the solidification of the filler F can be performed in a short time, and as a result, the process time of the stacked wafers Ws can be shortened. In one embodiment, the heating fluid supplied from the third holding roller 51 and the fourth holding roller 51 can also be pressurized to a pressure required to remove bubbles from the filler F.

[0079] Figure 8 FIG. 2 is a diagram showing another embodiment of the fluid blowing device. Figure 8 In the embodiment shown, the fluid blowing device 60 is configured to switch between an unheated pressurized fluid and a heated fluid (pressurized fluid or unpressurized fluid). The fluid blowing device 60 includes: a bypass line 66 branching from the fluid supply line 61; a switching valve 65 connected to the fluid supply line 61 and the bypass line 66; and a heater 67 connected to the bypass line 66. The fluid blowing device 60 configured as shown above is connected to at least one of the plurality of retaining rollers 51.

[0080] The fluid blowing device 60 is configured to heat the fluid to be blown to the peripheral portion of the stacked wafer Ws by the heater 67. The control device 40 is configured to control the operation of the fluid blowing device 60. The control device 40 operates the switching valve 65 to open the fluid supply line 61 and close the bypass line 66. Through the above-mentioned operation, the fluid supplied from the fluid supply device 62 is supplied from the blowing port 52 without being heated.

[0081] The control device 40 opens the bypass line 66 and closes the upstream side of the fluid supply line 61 (that is, the fluid supply line 61 between the switching valve 65 and the fluid supply device 62) by switching the switching valve 65. Through the above-mentioned operation, the fluid supplied from the fluid supply device 62 is heated by the heater 67, and the heated pressurized fluid is supplied from the blower port 52.

[0082] Fig. 9 2 is a diagram showing another embodiment of the coating device. Fig. 9 As shown, the coating device 2 may also include: a syringe body 20, which is filled with a filler F; an introduction part 21, which introduces the filler F in the syringe body 20 to the supply nozzle 4 through the support arm 3; a rod 22, which pushes the filler F in the introduction part 21 to the supply nozzle 4; and an injection nozzle 23, which injects a pressurized fluid (such as nitrogen) to the filler in the syringe body 20.

[0083] The filler F in the syringe body 20 may contain air bubbles. Fig. 9 In the illustrated embodiment, the injection nozzle 23 is configured to inject pressurized fluid to the filler F supplied to the supply nozzle 4 (ie, the filler F in the syringe body 20 ) to remove bubbles before the filler F is applied to the gaps between the stacked wafers Ws.

[0084] The control device 40 is configured to control the operation of the injection nozzle 23. More specifically, the control device 40 is electrically connected to a fluid supply source (not shown) that supplies pressurized fluid through the injection nozzle 23. By injecting the pressurized fluid from the injection nozzle 23, the bubbles of the filler F mixed into the syringe body 20 are compressed together with the filler F, and soon shrink to a level that does not adversely affect the blade portion NE (see Figure 5A and Figure 5B ).

[0085] In the above embodiment, the substrate manufacturing apparatus including the substrate holding device 1 is applied to the stacked wafer Ws, but the substrate manufacturing apparatus of this embodiment is applicable not only to the stacked wafer Ws but also to general wafers W (i.e., unstacked wafers). The stacked wafer Ws in this embodiment is equivalent to the wafer W, and the peripheral edge of the stacked wafer Ws is equivalent to the bevel portion B of the wafer W. Therefore, the bevel portion B of the wafer W means the peripheral edge of the stacked wafer Ws.

[0086] The above embodiments are described for the purpose of enabling a person with ordinary knowledge in the technical field to which the present invention belongs to implement the present invention. Various modifications of the above embodiments can be accomplished naturally by a person skilled in the art, and the technical concept of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is interpreted as the maximum scope of the technical concept defined by the scope of the patent application.

[0087] Industrial Applicability

[0088] The present invention can be used in a substrate holding device, a substrate manufacturing device, and a substrate manufacturing method.

[0089] Explanation of symbols

[0090] 1: Substrate holding device

[0091] 2: Coating device

[0092] 3: Support arm

[0093] 4: Supply nozzle

[0094] 20: Syringe body

[0095] 21: Import

[0096] 22: Rod

[0097] 23: Spray nozzle

[0098] 40: Control device

[0099] 51: Holding roller

[0100] 52: Blow out

[0101] 53A: First clamping portion

[0102] 53B: Second clamping portion

[0103] 54: shaft

[0104] 56A: First clamp actuator

[0105] 56B: Second clamp actuator

[0106] 60: Fluid blowing device

[0107] 61: Fluid supply line

[0108] 62: Fluid supply device

[0109] 63: On / Off Valve

[0110] 65: Switching valve

[0111] 66: Bypass line

[0112] 67: Heater

[0113] 70: Roller rotating device

[0114] 71: Connecting rod

[0115] 72: Motor

[0116] 80: Roller moving device

[0117] 90: Clamping device.

Claims

1. A substrate holding device, characterized in that: have: a holding roller that rotates the substrate while holding the inclined surface of the substrate; and A fluid blowing device is connected to the holding roller and blows a pressurized fluid to the inclined surface held by the holding roller.

2. The substrate holding device according to claim 1, wherein: The fluid blowing device comprises: A fluid supply line connected to a blow-out port formed in the retaining roller; and A fluid supply device is connected to the fluid supply line.

3. The substrate holding device according to claim 1, wherein: The substrate holding device includes a clamp device that brings a first clamping portion and a second clamping portion of the holding roller that clamp the inclined surface portion closer to or farther from each other.

4. The substrate holding device according to claim 1, wherein: The substrate holding device includes a roller moving device that moves the holding roller between a contact position where the holding roller contacts the inclined surface portion and a separation position where the holding roller separates from the inclined surface portion.

5. A substrate manufacturing device for manufacturing a laminated substrate formed by laminating a first substrate and a second substrate, characterized in that: have: a holding roller that rotates the stacked substrate while holding the stacked substrate; a fluid blowing device connected to the holding roller and configured to blow a pressurized fluid into a gap between the stacked substrates held by the holding roller; and A coating device is provided for coating a filler on the gap.

6. The substrate manufacturing device according to claim 5, characterized in that: The fluid blowing device comprises: A fluid supply line connected to a blow-out port formed in the retaining roller; and A fluid supply device is connected to the fluid supply line.

7. The substrate manufacturing device according to claim 5, characterized in that: The substrate manufacturing apparatus includes a clamp device that brings a first clamping portion and a second clamping portion of the holding roller that clamp the inclined surface portion of the stacked substrate into close proximity with or away from each other.

8. The substrate manufacturing device according to claim 5, characterized in that: The substrate manufacturing apparatus includes a roller moving device that moves the holding roller between a contact position where the holding roller contacts the inclined surface portion of the stacked substrate and a separation position where the holding roller is separated from the inclined surface portion.

9. The substrate manufacturing device according to claim 5, characterized in that: The fluid blowing device includes a heater that heats the fluid to be blown onto the inclined surface of the stacked substrate.

10. The substrate manufacturing device according to claim 5, characterized in that: The coating device includes a spray nozzle that sprays a pressurized fluid onto a filler supplied to a supply nozzle that supplies the filler toward the gap.

11. A method for manufacturing a substrate, comprising manufacturing a laminated substrate formed by laminating a first substrate and a second substrate, wherein: The process includes the following: A step of rotating the stacked substrate while holding the stacked substrate by a holding roller; A step of applying a filler to the gaps between the laminated substrates; and A step of connecting to the holding roller and blowing a pressurized fluid into the gap.

12. The method for manufacturing a substrate according to claim 11, wherein: The step of blowing out the pressurized fluid includes a step of blowing out the pressurized fluid from a blowing port formed in the holding roller.

13. The method for manufacturing a substrate according to claim 11, wherein: The substrate manufacturing method includes the step of bringing a first clamping portion and a second clamping portion of the holding roller, which clamp the inclined surface portion of the stacked substrate, into close proximity with or away from each other.

14. The method for manufacturing a substrate according to claim 11, wherein: The substrate manufacturing method includes the step of moving the holding roller between a contact position where the holding roller contacts the inclined surface portion of the stacked substrate and a separation position where the holding roller is separated from the inclined surface portion.

15. The method for manufacturing a substrate according to claim 11, wherein: The substrate manufacturing method includes a step of heating a fluid to be blown onto the inclined surface portion of the stacked substrate.

16. The method for manufacturing a substrate according to claim 11, wherein: The substrate manufacturing method includes a step of spraying a pressurized fluid onto a filler supplied to a supply nozzle that supplies the filler toward the gap.

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