Chip welding processing device

Abstract

The invention relates to the technical field of chip processing, and particularly discloses a chip welding processing device, which comprises a machine body, and further comprises a paste outlet assembly arranged on the machine body and used for discharging solder paste; and the paste brushing assembly is arranged on the paste discharging assembly, and the paste brushing assembly is used for brushing the solder paste discharged by the paste discharging assembly. The PCB can be stably clamped through the paste discharging assembly, solder paste can be discharged from the position, needing to be welded, of the PCB, the discharge amount of the solder paste can be adjusted and controlled according to different sizes of chips, it is prevented that much or less solder paste is discharged, the solder paste discharged by the paste discharging assembly can be brushed through the paste brushing assembly, and the solder paste discharging efficiency is improved. Solder paste can be evenly brushed on the welding position of the PCB, and the welding effect of a chip is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of chip processing, in particular to a chip welding processing device. Background Art

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing an integrated circuit. It is very small and is often a part of a computer or other electronic device. The casing used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. The contacts on the chip are connected to the pins of the package casing with wires, and these pins are connected to other devices through wires on the printed circuit board.

[0003] In the chip processing process, a chip welding processing device is used to complete the welding of the chip. Solder paste is applied to the welding position of the PCB board and the chip, and then the heating head is moved to the chip position. The solder is adhered to the chip electrode by a high-temperature welding method, thereby performing the chip welding process. However, when applying solder paste to the position of the PCB board that needs to be welded, more or less solder paste may be applied. Applying more solder paste may result in a waste of solder paste, and the solder paste may flow to other areas of the PCB board after being heated and melted, thereby affecting other components of the PCB board. Applying less solder paste may affect the welding effect of the chip. For this reason, we propose a chip welding processing device. Summary of the invention

[0004] The object of the present invention is to provide a chip welding processing device to solve the problem raised in the above background technology that when applying solder paste to the position of the PCB board that needs to be welded, there may be a situation where more or less solder paste is applied. Applying more solder paste may cause waste of solder paste, and the solder paste may flow to other areas of the PCB board after being heated and melted, thereby affecting other components of the PCB board, and applying less solder paste may affect the welding effect of the chip.

[0005] To achieve the above object, the present invention provides the following technical solution: a chip welding processing device, comprising: a machine body, a support frame is arranged on one side of the machine body, a mounting frame is arranged on the upper side of the support frame, and a heating head is arranged on one side of the mounting frame, It also includes: a paste discharging component, which is arranged on the machine body and is used for discharging solder paste; The paste brushing component is arranged on the paste discharging component and is used for brushing the solder paste discharged from the paste discharging component.

[0006] Among them, the paste discharge component includes connecting frames fixed on both sides of the upper end of the machine body, sliding seats are slidably arranged on the upper sides of the two connecting frames, and limiting grooves matched with the sliding seats are arranged on the connecting frames. The telescopic end of the first electric push rod is fixed at one end of one slide seat, the first electric push rod is fixed to one side of the connecting frame, a connecting rod is fixed between the two slide seats, second electric push rods are fixed on the upper sides of the two slide seats, and a clamping member is fixed at the telescopic end of the second electric push rod.

[0007] Among them, a first bracket is fixed on the upper side of a sliding seat on one side, a first rod is slidably arranged on the upper side of the first bracket, a third electric push rod is fixed on the first bracket, the telescopic end of the third electric push rod is fixed to the first rod, a first electric lifting rod is fixed on the lower side of the first rod, a shell is fixed on the telescopic end of the first electric lifting rod, a first soft pad is fixed on the lower side of the shell, adsorption holes are correspondingly opened on the shell and the first soft pad, a negative pressure device is fixed on one side of the connecting frame on one side, and a connecting pipe is fixedly connected between the negative pressure device and the shell.

[0008] Among them, a fixed block is fixed on one side of the connecting frame, a second bracket is fixed on the upper side of the fixed block, a second rod is slidably arranged on the upper side of the second bracket, a fourth electric push rod is fixed on the second bracket, the telescopic end of the fourth electric push rod is fixed to the second rod, a second electric lifting rod is fixed on the lower side of the second rod, and a mounting plate is fixed on the telescopic end of the second electric lifting rod.

[0009] Among them, a solder paste cylinder and a cylinder body are respectively fixed on the mounting plate, a sealing cap is threadedly arranged on the upper side of the solder paste cylinder, a piston block is slidably arranged in the solder paste cylinder, a connecting piece penetrating the sealing cap is fixed on the upper side of the piston block, a telescopic end of a fifth electric push rod is fixed on the lower side of the connecting piece, the fifth electric push rod is fixed to the mounting plate, a filling port is arranged on one side of the solder paste cylinder, and a blocking cap is threadedly arranged on the filling port of the solder paste cylinder.

[0010] Among them, a mounting block is slidably arranged in the cylinder, a first switch electrically connected to the fifth electric push rod is installed on the mounting block, a first spring fixed to the bottom end of the cylinder is fixed on the lower side of the mounting block, and a ventilation pipe is fixedly connected between the cylinder located at the lower side of the mounting block and the shell.

[0011] Among them, a gear rod which movably passes through the top of the cylinder is fixed on the upper side of the mounting block, a mounting shell fixed to the cylinder is provided on one side of the gear rod, a gear block which cooperates with the gear rod is slidably provided in the mounting shell, an electromagnetic block which can be adsorbed with the gear block is fixed in the mounting shell, and a second spring fixed to the mounting shell is symmetrically provided on one side of the gear block.

[0012] Among them, a connecting block is arranged above the solder paste cylinder, a support rod fixed to the mounting plate is fixed on the lower side of the connecting block, a second soft pad is fixed on the upper side of the connecting block, pressure blocks are slidably arranged on the front side and left and right sides of the connecting block, a sliding cavity is arranged at the pressure block of the connecting block, a docking hole is arranged on the upper side of the sliding cavity of the connecting block, a second switch is installed on the top of the sliding cavity of the connecting block, a third spring fixed to the connecting block is fixed on the lower side of the pressure block, through holes are penetrated on the upper and lower sides of the sliding cavity of the connecting block, and a through groove is arranged on one side of a through hole on the upper side of the connecting block.

[0013] Among them, the paste brush assembly includes an annular block fixedly mounted on the outside of the solder paste tube, a gear ring is rotatably arranged on the outside of the annular block, a gear is meshed and connected to one side of the gear ring, a motor is fixed on the upper side of the mounting plate, the output shaft of the motor movably passes through the mounting plate and is fixed to the gear, mounting parts are fixed on both sides of the lower end of the gear ring, and bristles are arranged on the lower side of the mounting parts.

[0014] Among them, a paste storage cylinder is arranged on one side of the machine body, a delivery pump is arranged on the paste storage cylinder, a connecting pipe is fixedly connected between the delivery pump and the filling port of the solder paste cylinder, the other end of the delivery pump is fixedly connected to the delivery pipe connected to the paste storage cylinder, and a paste injection port is arranged on the upper side of the paste storage cylinder.

[0015] The present invention has at least the following beneficial effects: The present invention can stably clamp the PCB board through the paste discharge component, discharge solder paste to the position of the PCB board that needs to be welded, and adjust the discharge amount of solder paste according to the different sizes of chips to prevent more or less solder paste from being discharged. When more solder paste is discharged, it may cause waste of solder paste, and the solder paste may flow to other areas of the PCB board after being heated and melted by the heating head, thereby affecting other components of the PCB board. When less solder paste is discharged, it may affect the chip welding effect. The solder paste discharged by the paste discharge component can be brushed through the paste brushing component, so that the solder paste is evenly brushed on the welding position on the PCB board, thereby ensuring the chip welding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Figure 2 It is a structural schematic diagram of the paste discharging component of the present invention; Figure 3 It is a structural schematic diagram of the slide connection of the present invention; Figure 4 It is a schematic structural diagram of a cross-section of the housing and the first cushion of the present invention; Figure 5 This is a schematic diagram of the structure of the mounting plate connection of the present invention; Figure 6 It is a structural schematic diagram of the cross-section of the solder paste cylinder and the cylinder body of the present invention; Figure 7 It is a schematic structural diagram of a cross-section of the installation shell of the present invention; Figure 8 It is a structural schematic diagram of a partial cross-section of the connecting block and the second cushion of the present invention; Fig. 9 It is a structural schematic diagram of the connection between the mounting plate and the paste brush assembly of the present invention; Fig.10 It is a structural schematic diagram of the paste brush assembly of the present invention; Fig.11 It is a schematic structural diagram of a cross-section of a gear ring of the present invention; Fig.12 It is a three-dimensional structural schematic diagram of the fourth embodiment of the present invention; Fig.13 It is a structural schematic diagram of the connection of the paste storage cylinder of the present invention.

[0017] In the figure: 11, body; 12, support frame; 13, mounting frame; 14, heating head; 2, paste discharging assembly; 21, connecting frame; 22, first electric push rod; 23, slide seat; 24, limit groove; 25, second electric push rod; 26, connecting rod; 27, clamping member; 28, first bracket; 29, first rod; 210, third electric push rod; 211, first electric lifting rod; 212, shell; 213, first cushion; 214, adsorption hole; 215, negative pressure device; 216, connecting pipe; 217, fixing block; 218, second bracket; 219, second rod; 220, fourth electric push rod; 221, second electric lifting rod; 222, mounting plate; 223, solder paste cylinder; 224, cylinder; 225, piston block; 226 , sealing cover; 227, mounting block; 228, first switch; 229, plugging cover; 230, first spring; 231, connecting piece; 232, fifth electric push rod; 233, gear rod; 234, mounting shell; 235, vent pipe; 236, electromagnetic block; 237, gear block; 238, second spring; 239, connecting block; 240, second cushion; 241, pressure block; 242, third spring; 243, second switch; 244, docking hole; 245, through hole; 246, through groove; 247, support rod; 3, paste brush assembly; 31, annular block; 32, gear ring; 33, mounting piece; 34, bristles; 35, gear; 36, motor; 41, paste storage tube; 42, delivery pump; 43, connecting pipe; 44, delivery pipe; 45, paste injection port. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Embodiment 1 See also Figures 1 to 13 The present invention provides a technical solution: a chip welding processing device, comprising: a body 11, a support frame 12 is arranged on one side of the body 11, a mounting frame 13 is arranged on the upper side of the support frame 12, and a heating head 14 is arranged on one side of the mounting frame 13, It also includes: a paste discharging component 2, which is arranged on the body 11 and is used for discharging solder paste; The paste brushing component 3 is arranged on the paste discharging component 2 and is used for brushing the solder paste discharged from the paste discharging component 2 .

[0020] During the chip processing, the chip is welded by the chip welding processing device body 11, and the PCB board can be stably clamped by the paste discharge component 2, and the solder paste can be discharged to the position of the PCB board that needs to be welded, and the discharge amount of the solder paste can be adjusted according to the different sizes of the chip to prevent the solder paste from being discharged too much or too little, which may cause the waste of solder paste when the solder paste is discharged more, and the solder paste may flow to other areas of the PCB board after being heated and melted by the heating head 14, thereby affecting other components of the PCB board, and when the solder paste is discharged less, it may cause the chip welding effect to be affected, and the solder paste discharged by the paste discharge component 2 can be brushed by the paste brushing component 3, so that the solder paste is evenly brushed on the welding position of the PCB board to ensure the chip welding effect; then, by rotating the mounting frame 13 and the support frame 12, and the heating head 14 moving up and down and horizontally on the mounting frame 13, the heating head 14 is rotated to the front side and the position of the heating head 14 is adjusted to move the heating head 14 to the chip welding position, and the chip is welded (this is the prior art).

[0021] Embodiment 2 The paste discharging assembly 2 includes a connecting frame 21 fixedly mounted on both sides of the upper end of the body 11, and a slide seat 23 is slidably arranged on the upper side of the two connecting frames 21. A limiting groove 24 adapted to the slide seat 23 is arranged on the connecting frame 21, and the slide seat 23 slides along the limiting groove 24. A telescopic end of a first electric push rod 22 is fixedly mounted on one end of the slide seat 23 on one side. The first electric push rod 22 is fixedly mounted on the connecting frame 21 on one side, and a connecting rod 26 is fixedly mounted between the two slide seats 23. The first electric push rod 22 drives the slide seat 23 on one side to move along the limiting groove 24, and the connecting rod 26 can synchronously drive the slide seat 23 on the other side to move, so that the front and rear positions of the slide seats 23 on both sides can be adjusted, and thus the P The front and rear positions of the CB board are adjusted after being clamped by the clamping members 27; second electric push rods 25 are fixedly provided on the upper sides of the two slide seats 23, and clamping members 27 are fixedly provided at the telescopic ends of the second electric push rods 25. The PCB board is placed between the two clamping members 27 and located on the upper side of one end of the clamping members 27 that is close to each other. The bottom of the PCB board can be supported by the end side of the clamping members 27 that is close to each other, and the clamping members 27 are driven to move close to each other by the second electric push rods 25. The PCB board is stably clamped by the clamping members 27 on both sides, and the left and right positions of the PCB board after clamping can also be adjusted by controlling the telescopic length of the second electric push rods 25 on both sides.

[0022] A first bracket 28 is fixedly provided on the upper side of the slide seat 23 on one side, a first rod 29 is slidably provided on the upper side of the first bracket 28, a sliding cavity adapted to the first rod 29 is provided on the upper side of the first bracket 28, the first rod 29 slides along the sliding cavity on the upper side of the first bracket 28, the first bracket 28 can also support the first rod 29, a third electric push rod 210 is fixedly provided on the first bracket 28, the telescopic end of the third electric push rod 210 is fixedly provided on the first rod 29, and a third electric push rod 210 is fixedly provided on the lower side of the first rod 29 An electric lifting rod 211, a housing 212 is fixedly provided at the telescopic end of the first electric lifting rod 211, a first soft pad 213 is fixedly provided at the lower side of the housing 212, adsorption holes 214 are correspondingly penetrated and opened on the housing 212 and the first soft pad 213, and the adsorption holes 214 are densely arranged, a negative pressure device 215 is fixedly provided at one side of the connecting frame 21, a connecting pipe 216 is fixedly connected between the negative pressure device 215 and the housing 212, and the connecting pipe 216 is arranged as a hose to adapt to the movement of the housing 212; After the PCB board is placed between the two clamping members 27 and clamped by the clamping members 27, the position of the PCB board to be welded is within the left and right moving range of the shell 212. When in use, the chip can be placed in advance at the position to be welded on the PCB board, and then the left and right position of the shell 212 is adjusted by controlling the third electric push rod 210 to drive the movement of the first rod 29, and moved to the upper side of the welding position of the PCB board, and then the shell 212 is driven by the first electric lifting rod 211 to move down to the chip position, and the gas in the shell 212 is discharged through the connecting pipe 216 through the negative pressure device 215, so that negative pressure is formed in the shell 212, and the chip is stably adsorbed on the lower side of the first soft pad 213 on the lower side of the shell 212 through the adsorption hole 214, and then the shell 212 and the adsorbed chip are driven upward by the first electric lifting rod 211. When the first electric push rod 22 drives the slide 23 to move back and forth, the chip can always correspond to the position to be welded on the PCB board up and down.

[0023] A fixing block 217 is fixedly arranged on one side of the connecting frame 21, a second bracket 218 is fixedly arranged on the upper side of the fixing block 217, a second rod 219 is slidably arranged on the upper side of the second bracket 218, a sliding cavity adapted to the second rod 219 is arranged on the upper side of the second bracket 218, the second rod 219 slides along the sliding cavity on the upper side of the second bracket 218, and the second bracket 218 can also support the second rod 219, a fourth electric push rod 220 is fixedly arranged on the second bracket 218, the telescopic end of the fourth electric push rod 220 is fixedly arranged on the second rod 219, and the lower side of the second rod 219 A second electric lifting rod 221 is fixedly provided, and a mounting plate 222 is fixedly provided at the telescopic end of the second electric lifting rod 221; by controlling the fourth electric push rod 220 to drive the movement of the second rod 219, the left and right position of the mounting plate 222 can be adjusted, and the second electric lifting rod 221 drives the mounting plate 222 to move up and down, and the first electric push rod 22 drives the slide 23 to move forward and backward, so that the solder paste tube 223 can be moved to the upper left rear side of the PCB board welding position, and is located below the shell 212, and the solder paste starts to be discharged from the left rear side of the PCB board welding position.

[0024] The mounting plate 222 is respectively fixed with a solder paste cylinder 223 and a cylinder body 224. A sealing cap 226 is threadedly arranged on the upper side of the solder paste cylinder 223. The sealing cap 226 can block the inside of the solder paste cylinder 223 to prevent the entry of debris and facilitate the installation and removal of the sealing cap 226. A piston block 225 is slidably arranged in the solder paste cylinder 223. A rubber pad is arranged on the outer end of the piston block 225 so that the piston block 225 is closely abutted against the inner wall of the solder paste cylinder 223. A connecting piece 231 penetrating the sealing cap 226 is fixedly arranged on the upper side of the piston block 225. A fifth electric push rod 231 is fixedly arranged on the lower side of the connecting piece 231. 2, the fifth electric push rod 232 is fixed to the mounting plate 222, and the fifth electric push rod 232 is controlled to drive the connecting piece 231 to move downward, so as to drive the piston block 225 to move downward, so as to discharge the solder paste in the solder paste cylinder 223 downward to the welding position of the PCB board. A filling port is provided on one side of the solder paste cylinder 223, and a plugging cover 229 is threadedly provided on the filling port of the solder paste cylinder 223. When in use, the plugging cover 229 can be screwed down, and the solder paste can be injected into the solder paste cylinder 223 through the filling port through a syringe or other tools. After the filling is completed, the plugging cover 229 is rotatably installed on the filling port of the solder paste cylinder 223.

[0025] A mounting block 227 is slidably provided in the cylinder 224, and a slot is provided through the top of the cylinder 224 so that the cylinder 224 located on the upper side of the mounting block 227 is connected to the outside, and a sealing gasket is provided at the outer end of the mounting block 227 so that the mounting block 227 and the inner wall of the cylinder 224 are closely abutted, and a first switch 228 electrically connected to the fifth electric push rod 232 is installed on the mounting block 227, and one end of the connecting member 231 away from the piston block 225 is located on the upper side of the first switch 228, and a first spring 230 fixed to the bottom end of the cylinder 224 is fixedly provided on the lower side of the mounting block 227, and a vent pipe 235 is fixedly connected between the cylinder 224 located on the lower side of the mounting block 227 and the housing 212, and the vent pipe 235 is provided as a hose to adapt to the movement of the housing 212 and the cylinder 224; When the gas in the shell 212 is extracted through the negative pressure device 215, a negative pressure is formed in the shell 212, and the chip is stably adsorbed on the lower side of the first cushion 213 through the adsorption hole 214, the negative pressure in the shell 212 is formed, and the gas below the mounting block 227 in the cylinder 224 enters the shell 212 through the vent pipe 235 and is extracted through the negative pressure device 215. The pressure below the mounting block 227 in the cylinder 224 is reduced, and the mounting block 227 moves downward under the action of the external atmospheric pressure, and the first spring 230 is compressed. When the negative pressure formed below the mounting block 227 in the cylinder 224 is balanced with the negative pressure in the shell 212, the mounting block 227 stops moving downward. When the chip size is small, the number of adsorption holes 214 covered by the chip is small, which will make the negative pressure in the shell 212 smaller, and the gas below the mounting block 227 of the cylinder 224 can be discharged less through the ventilation pipe 235, so that the mounting block 227 moves downward a smaller distance. Conversely, when the chip size is large, the mounting block 227 can move downward a larger distance.

[0026] A gear rod 233 that movably passes through the top of the cylinder 224 is fixedly arranged on the upper side of the mounting block 227. A tooth groove is arranged densely on the side of the gear rod 233 close to the tooth block 237. The arrangement of the gear rod 233 can also guide the up and down movement of the mounting block 227. A mounting shell 234 fixed to the cylinder 224 is arranged on one side of the gear rod 233. A tooth block 237 that cooperates with the gear rod 233 is slidably arranged in the mounting shell 234. An electromagnetic block 236 that can be attracted to the tooth block 237 is fixed in the mounting shell 234. A second spring 238 fixed to the mounting shell 234 is symmetrically fixed on one side of the tooth block 237. When in use, the electromagnetic block 236 can be controlled to be energized to produce an adsorption effect on the tooth block 237, so that the tooth block 237 moves away from the tooth rod 233 and disengages from the tooth groove of the tooth rod 233, thereby releasing the restriction on the tooth rod 233, and the second spring 238 is extended, so that under the action of the negative pressure formed in the shell 212, the mounting block 227 can drive the tooth rod 233 to move downward together. When the negative pressure formed below the mounting block 227 in the cylinder 224 is balanced with the negative pressure in the shell 212, the mounting block 227 stops moving downward. After stabilization, the electromagnetic block 236 is controlled to be de-energized, and under the action of the elastic force of the second spring 238, the tooth block 237 moves close to the tooth rod 233 and is stuck in the tooth groove of the tooth rod 233, thereby limiting the position of the mounting block 227. The cylinder 224 can be set It is set to be transparent and can be marked with scales, so that the downward movement state of the mounting block 227 can be observed. When the chip size is small, the downward movement distance of the mounting block 227 is small. When the fifth electric push rod 232 drives the connecting member 231 and the piston block 225 to move downward to discharge the solder paste in the solder paste cylinder 223, the connecting member 231 moves down a small distance to press the first switch 228, so that the fifth electric push rod 232 stops working and the solder paste is no longer discharged. On the contrary, when the chip size is large, the fifth electric push rod 232 will drive the connecting member 231 to move down a larger distance to discharge more solder paste to meet the welding of larger chips. Therefore, the total amount of solder paste discharged can be automatically adjusted according to the different sizes of the chips to prevent more or less solder paste from being discharged.

[0027] A connecting block 239 is arranged above the solder paste cylinder 223, and the connecting block 239 is located on the upper side of the connecting piece 231. A support rod 247 fixed to the mounting plate 222 is fixed to the lower side of the connecting block 239. A second soft pad 240 is fixed to the upper side of the connecting block 239. A pressing block 241 is slidably arranged on the front side and the left and right sides of the connecting block 239. A sliding cavity is arranged at the pressing block 241 of the connecting block 239. A sealing gasket is arranged at the outer end of the pressing block 241 to ensure that the pressing block 241 and the connecting piece 231 are fixed to each other. The inner wall of the sliding cavity of the connecting block 239 is tightly abutted, the second cushion 240 is provided with a docking hole 244 on the upper side of the sliding cavity of the connecting block 239, the top of the sliding cavity of the connecting block 239 is installed with a second switch 243, the lower side of the pressing block 241 is fixed with a third spring 242 fixed with the connecting block 239, the upper and lower sides of the sliding cavity of the connecting block 239 are penetrated with through holes 245, and the connecting block 239 is provided with a through groove 246 on one side of a through hole 245 on the upper side; After the solder paste cylinder 223 is moved to the upper left rear side of the PCB board soldering position by controlling the fourth electric push rod 220, the second electric lifting rod 221 and the first electric push rod 22, the first soft pad 213 and the chip adsorbed on its lower side can be moved to the upper side of the second soft pad 240 by controlling the first electric lifting rod 211. At this time, the left docking hole 244 can be located at the left rear side of the chip, and the control circuit can be turned on. Under the action of the negative pressure formed in the housing 212 by the negative pressure device 215, the adsorption holes 214 corresponding to the upper and lower sides of the left docking hole 244 can be used to make the sliding cavity on the left side of the connecting block 239 and the pressing block 2 The gas on the upper side of 41 is extracted through the through hole 245. Although the outside gas can enter through the through slot 246, the diameter of the through slot 246 is small, and a negative pressure state can still be formed on the upper side of the pressing block 241. Therefore, under the action of the outside atmospheric pressure, the pressing block 241 will move up and press the second switch 243 on the left side, and the third spring 242 will extend. The control circuit will receive the signal, control the fourth electric push rod 220 to drive the second rod 219 to move right, and control the first electric push rod 22 to drive the slide 23 to move a certain distance to the rear side, so that the solder paste cylinder 223 can first move right along the rear side of the PCB board welding position. In the process of moving to the right, the outside gas can enter through the through slot 2 46 enters above the pressing block 241, and under the elastic force of the third spring 242, the pressing block 241 moves down and resets. When the solder paste cylinder 223 moves to the rightmost side of the PCB board welding position, the right docking hole 244 will move out of the chip range. Similarly, through the right docking hole 244 and the adsorption holes 214 corresponding to the upper and lower sides thereof, the right pressing block 241 can be moved up to press the right second switch 243, control the fourth electric push rod 220 to drive the second rod 219 to move left, and control the first electric push rod 22 to drive the slide 23 to move back a certain distance, so that the solder paste cylinder 223 moves left along the next position of the PCB board welding position; similarly, when the solder paste cylinder 223 moves When the soldering position of the PCB board reaches the leftmost side, the left docking hole 244 moves out of the chip range, and the left pressure block 241 can be moved upward again to press the left second switch 243 through the left docking hole 244 and the adsorption holes 214 corresponding to the left docking hole 244 and the left docking hole 244, and the fourth electric push rod 220 is controlled again to drive the second rod 219 to move right, and the first electric push rod 22 is controlled to drive the slide seat 23 to move back a certain distance, and so on, so that the solder paste cylinder 223 can move in an "S" shape along the soldering position of the PCB board, and the fifth electric push rod 232 drives the connecting member 231 and the piston block 225 to move downward gradually, so that the solder paste can be discharged from the soldering area of ​​the PCB board; As the first electric push rod 22 drives the slide 23 to move backward gradually, when the solder paste tube 223 moves to the front side of the PCB board welding position, the front docking hole 244 will move out of the range of the chip. Similarly, through the front docking hole 244 and the adsorption holes 214 corresponding to the upper and lower sides thereof, the front pressure block 241 can be pressed against the front second switch 243, indicating that the discharge of solder paste from the welding area of ​​the PCB board has been completed, and the work will be controlled and stopped.

[0028] Embodiment 3 The paste brush assembly 3 includes an annular block 31 fixedly sleeved on the outside of the solder paste cylinder 223, a gear ring 32 is rotatably arranged on the outside of the annular block 31, a gear 35 is meshedly connected to one side of the gear ring 32, a motor 36 is fixedly arranged on the upper side of the mounting plate 222, the motor 36 is electrically connected to the second switches 243 on the left and right sides, the output shaft of the motor 36 movably passes through the mounting plate 222 and is fixed to the gear 35, mounting parts 33 are fixedly arranged on both sides of the lower end of the gear ring 32, bristles 34 are arranged on the lower side of the mounting parts 33, and the mounting parts 33 and the bristles 34 on both sides are respectively located on the left and right sides of the solder paste cylinder 223; After the solder paste is discharged from the welding position of the PCB board through the paste discharge component 2, when the solder paste barrel 223 moves to the right, the left brush bristles 34 can brush the discharged solder paste. If there are impurities at the welding position of the PCB board, the right brush bristles 34 can remove the impurities at the welding position to ensure the welding effect of the chip. When the solder paste barrel 223 moves to the rightmost side of the welding position of the PCB board and the right side pressure block 241 moves up to press the right second switch 243, the motor 36 can be controlled to drive the gear 35 to rotate and the gear ring 32 can be rotated 180 degrees to the rear side, so as to brush the rightmost part of the discharged solder paste through the left brush bristles 34 and adapt to the adjustment of the leftward movement direction of the solder paste barrel 223. When the solder paste cylinder 223 moves to the left, the left brush bristles 34 rotate to the right to continue brushing the discharged solder paste, and the right brush bristles 34 rotate to the left to remove impurities on the PCB. When the solder paste cylinder 223 moves to the leftmost side of the PCB welding position and the left pressure block 241 moves up to press the left second switch 243, the motor 36 can be controlled to drive the gear 35 to reverse and rotate the gear ring 32 180 degrees to the front side, so as to brush the leftmost part of the discharged solder paste through the left brush bristles 34 rotating to the right and adapt to the adjustment of the rightward movement direction of the solder paste cylinder 223, and repeat this process to ensure the brushing of the discharged solder paste, thereby ensuring the welding effect of the chip.

[0029] Embodiment 4 A paste storage barrel 41 is provided on one side of the machine body 11, and solder paste is stored in the paste storage barrel 41. In this embodiment, the plugging cover 229 is no longer provided, and a delivery pump 42 is provided on the paste storage barrel 41. A connecting pipe 43 is fixedly connected between the delivery pump 42 and the filling port of the solder paste barrel 223. The connecting pipe 43 is provided as a hose to adapt to the movement of the solder paste barrel 223. The other end of the delivery pump 42 is fixedly connected to a delivery pipe 44 connected to the paste storage barrel 41. A paste injection port 45 is provided on the upper side of the paste storage barrel 41, and solder paste can be injected into the paste storage barrel 41 through the paste injection port 45. A discharge pipe can be provided at the rear end of the lower side of the paste storage barrel 41, and a control valve is provided on the discharge pipe. By opening the control valve, the inside of the paste storage barrel 41 can be cleaned. When in use, the solder paste in the paste storage tube 41 can be transported to the solder paste tube 223 through the delivery tube 44 and the connecting tube 43 by the delivery pump 42, so as to fill the solder paste into the solder paste tube 223. There is no need to inject the solder paste into the solder paste tube 223 through the filling port of the solder paste tube 223 through tools such as a syringe, thereby facilitating the filling of the solder paste and facilitating use.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip welding processing device, comprising: A machine body (11), a support frame (12) being arranged on one side of the machine body (11), a mounting frame (13) being arranged on the upper side of the support frame (12), and a heating head (14) being arranged on one side of the mounting frame (13), It is characterized in that it also comprises: a paste discharge component (2), the paste discharge component (2) being arranged on the machine body (11), and the paste discharge component (2) being used for discharging solder paste; A paste brushing component (3), wherein the paste brushing component (3) is arranged on the paste discharging component (2), and the paste brushing component (3) is used to brush the solder paste discharged by the paste discharging component (2).

2. The chip bonding processing device according to claim 1, characterized in that: The paste discharging assembly (2) comprises a connecting frame (21) fixedly mounted on both sides of the upper end of the machine body (11); a slide seat (23) is slidably mounted on the upper side of the two connecting frames (21); a limit groove (24) matched with the slide seat (23) is mounted on the connecting frame (21); a telescopic end of a first electric push rod (22) is fixedly mounted on one end of the slide seat (23); the first electric push rod (22) is fixedly mounted on the connecting frame (21) on one side; a connecting rod (26) is fixedly mounted between the two slide seats (23); a second electric push rod (25) is fixedly mounted on the upper side of the two slide seats (23); and a clamping member (27) is fixedly mounted on the telescopic end of the second electric push rod (25).

3. The chip bonding processing device according to claim 2, characterized in that: A first bracket (28) is fixedly provided on the upper side of the sliding seat (23) on one side, a first rod (29) is slidably provided on the upper side of the first bracket (28), a third electric push rod (210) is fixedly provided on the first bracket (28), a telescopic end of the third electric push rod (210) is fixedly provided on the first rod (29), a first electric lifting rod (211) is fixedly provided on the lower side of the first rod (29), a shell (212) is fixedly provided on the telescopic end of the first electric lifting rod (211), a first soft pad (213) is fixedly provided on the lower side of the shell (212), and adsorption holes (214) are correspondingly penetrated through the shell (212) and the first soft pad (213), and a negative pressure device (215) is fixedly provided on one side of the connecting frame (21) on one side, and a connecting pipe (216) is fixedly connected between the negative pressure device (215) and the shell (212).

4. The chip bonding processing device according to claim 2, characterized in that: A fixed block (217) is fixedly provided on one side of the connecting frame (21), a second bracket (218) is fixedly provided on the upper side of the fixed block (217), a second rod (219) is slidably provided on the upper side of the second bracket (218), a fourth electric push rod (220) is fixedly provided on the second bracket (218), a telescopic end of the fourth electric push rod (220) is fixedly provided to the second rod (219), a second electric lifting rod (221) is fixedly provided on the lower side of the second rod (219), and a mounting plate (222) is fixedly provided on the telescopic end of the second electric lifting rod (221).

5. The chip bonding processing device according to claim 4, characterized in that: A solder paste cylinder (223) and a cylinder body (224) are fixedly provided on the mounting plate (222), a sealing cap (226) is threadedly provided on the upper side of the solder paste cylinder (223), a piston block (225) is slidably provided in the solder paste cylinder (223), a connecting piece (231) penetrating the sealing cap (226) is fixedly provided on the upper side of the piston block (225), a telescopic end of a fifth electric push rod (232) is fixedly provided on the lower side of the connecting piece (231), the fifth electric push rod (232) is fixedly provided on the mounting plate (222), a filling port is provided on one side of the solder paste cylinder (223), and a plugging cap (229) is threadedly provided on the filling port of the solder paste cylinder (223).

6. The chip bonding processing device according to claim 5, characterized in that: A mounting block (227) is slidably disposed in the cylinder (224); a first switch (228) electrically connected to a fifth electric push rod (232) is mounted on the mounting block (227); a first spring (230) fixed to the bottom end of the cylinder (224) is fixedly disposed on the lower side of the mounting block (227); and a ventilation pipe (235) is fixedly connected between the lower side of the mounting block (227) and the housing (212) of the cylinder (224).

7. The chip bonding processing device according to claim 6, characterized in that: A gear rod (233) movably penetrating the top of the cylinder (224) is fixedly disposed on the upper side of the mounting block (227); a mounting shell (234) fixedly disposed on the cylinder (224) is disposed on one side of the gear rod (233); a gear block (237) cooperating with the gear rod (233) is slidably disposed in the mounting shell (234); an electromagnetic block (236) capable of being attracted to the gear block (237) is fixedly disposed in the mounting shell (234); and a second spring (238) fixedly disposed on one side of the gear block (237) is symmetrically fixedly disposed on the one side of the gear block (237).

8. The chip bonding processing device according to claim 5, characterized in that: A connecting block (239) is arranged above the solder paste cylinder (223); a support rod (247) fixed to the mounting plate (222) is fixed on the lower side of the connecting block (239); a second soft pad (240) is fixed on the upper side of the connecting block (239); a pressure block (241) is slidably arranged on the front side and the left and right sides of the connecting block (239); a sliding cavity is arranged at the pressure block (241) of the connecting block (239); the second soft pad (240) is located at the connecting block A docking hole (244) is provided on the upper side of the sliding cavity of the connecting block (239); a second switch (243) is installed on the top of the sliding cavity of the connecting block (239); a third spring (242) fixed to the connecting block (239) is fixed on the lower side of the pressing block (241); through holes (245) are provided on the upper and lower sides of the sliding cavity of the connecting block (239); and a through groove (246) is provided on one side of a through hole (245) on the upper side of the connecting block (239).

9. The chip bonding processing device according to claim 5, characterized in that: The paste brush assembly (3) comprises an annular block (31) fixedly sleeved on the outside of the solder paste cylinder (223), a gear ring (32) rotatably arranged on the outside of the annular block (31), one side of the gear ring (32) being meshingly connected with a gear (35), a motor (36) being fixedly arranged on the upper side of the mounting plate (222), an output shaft of the motor (36) movably passing through the mounting plate (222) and being fixedly arranged with the gear (35), mounting parts (33) being fixedly arranged on both sides of the lower end of the gear ring (32), and bristles (34) being arranged on the lower side of the mounting part (33).

10. The chip bonding processing device according to claim 5, characterized in that: A paste storage cylinder (41) is provided on one side of the machine body (11), a delivery pump (42) is provided on the paste storage cylinder (41), a connecting pipe (43) is fixedly connected between the delivery pump (42) and the filling port of the solder paste cylinder (223), a delivery pipe (44) connected to the paste storage cylinder (41) is fixedly connected at the other end of the delivery pump (42), and a paste injection port (45) is provided on the upper side of the paste storage cylinder (41).

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