Light emitting control method and device of laser, equipment and medium

Abstract

The invention discloses a light emitting control method and device of a laser, equipment and a medium. The method comprises the following steps: acquiring plate parameters; based on the plate parameters, an instruction of emitting light in a first mode or an instruction of emitting light in a second mode is issued to the laser; and issuing the instruction of emitting light in the first mode to the laser to control the laser to emit light in the first mode. When it is determined that the plate can be cut in the first mode based on the plate parameters, the laser can be controlled to operate in the first mode, and due to the fact that the instantaneous light emitting power of the laser is larger than the rated light emitting power in the first mode, potential of the laser can be fully excavated, the cutting speed can be met, and the cutting efficiency is improved. And the light emitting utilization rate of the laser is improved.

Description

[0001] Cross-references to related patent applications

[0002] This patent application claims priority to Chinese patent application 2024114616489 filed on October 18, 2024, the entire text of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to the field of laser technology, and in particular to a laser light emission control method, device, equipment and medium. Background Art

[0004] Laser cutting equipment irradiates the laser generated by the laser onto the surface of the workpiece, causing the workpiece to reach its melting point or boiling point, and at the same time uses high-pressure gas to blow away the molten or vaporized metal. As the relative position of the laser beam and the workpiece moves, a cut is eventually formed in the material, thereby achieving the purpose of cutting.

[0005] When performing laser cutting, no matter what type of material is being processed (such as carbon steel and stainless steel), when the material thickness is the same, high-power lasers are usually used for faster cutting. However, traditional laser cutting equipment uses a fixed-power light-emitting mode, which usually has a maximum light-emitting power limit. Regardless of whether it is a continuous or pulsed light-emitting mode, the light-emitting power will not exceed the maximum light-emitting power. This will cause the laser cutting equipment to not fully utilize the laser's light-emitting capacity and power, and the potential of the laser will not be fully tapped. Summary of the invention

[0006] The present invention provides a laser light output control method, device, equipment and medium to fully tap the potential of the laser so that the laser cutting equipment can fully use the laser light output capability for cutting.

[0007] To achieve the above object, a first embodiment of the present invention provides a method for controlling light output of a laser, comprising the following steps:

[0008] Get the plate parameters;

[0009] Based on the plate parameters, an instruction to emit light in a first mode or an instruction to emit light in a second mode is sent to the laser;

[0010] The instruction to emit light in the first mode is to control the laser to emit light in the first mode, wherein, in the first mode, the laser emits light in a manner of instantaneous light output power and a pulse duty cycle, the instantaneous light output power is greater than the rated light output power, and the product of the instantaneous light output power and the pulse duty cycle is less than or equal to the rated light output power;

[0011] The instruction to emit light in the second mode is sent to the laser to control the laser to emit light in the second mode, wherein in the second mode, the laser emits light with a normal light output power not greater than the rated light output power.

[0012] Optionally, before obtaining the plate parameters, the following steps are also included:

[0013] Forming a first mapping relationship between the plate parameters and the light emission mode of the laser;

[0014] The sending of an instruction to the laser to emit light in the first mode, or an instruction to emit light in the second mode, includes:

[0015] Based on the plate parameters and the first mapping relationship, an instruction to emit light in a first mode is sent to the laser, or an instruction to emit light in a second mode is sent.

[0016] Optionally, controlling the laser to emit light in the first mode includes: calling an optimal processing waveform corresponding to the plate parameters from a process library pre-stored in the laser, and controlling the laser to emit light in the optimal processing waveform.

[0017] Optionally, the process library is established based on a mapping relationship between the plate parameters and an optimal processing waveform corresponding to the plate parameters.

[0018] Optionally, the instantaneous optical output power is 1-1.2 times the rated optical output power.

[0019] Optionally, controlling the laser to emit light in the second mode includes:

[0020] The laser is controlled to emit light in a continuous light emitting or pulsed light emitting mode at a normal light emitting power.

[0021] To achieve the above-mentioned purpose, a second embodiment of the present invention provides a laser light output control device, which is characterized by comprising:

[0022] Acquisition module, used to obtain plate parameters;

[0023] A control module, configured to send an instruction to the laser to emit light in a first mode or an instruction to emit light in a second mode based on the plate parameters;

[0024] The instruction to emit light in the first mode is to control the laser to emit light in the first mode, wherein, in the first mode, the laser emits light in a manner of instantaneous light output power and a pulse duty cycle, the instantaneous light output power is greater than the rated light output power, and the product of the instantaneous light output power and the pulse duty cycle is less than or equal to the rated light output power;

[0025] The instruction to emit light in the second mode is sent to the laser to control the laser to emit light in the second mode, wherein in the second mode, the laser emits light with a normal light output power not greater than the rated light output power.

[0026] Optionally, the laser light output control device further includes:

[0027] A first training module, used to form a first mapping relationship between the plate parameters and the light emission mode of the laser;

[0028] The control module is used to determine, based on the plate parameters and the first mapping relationship, to send an instruction to the laser to emit light in a first mode.

[0029] To achieve the above objective, a third aspect of the present invention provides an electronic device, the electronic device comprising:

[0030] at least one processor; and

[0031] a memory communicatively connected to the at least one processor; wherein,

[0032] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the laser light emission control method described in any embodiment of the present invention.

[0033] To achieve the above objectives, a fourth aspect of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the laser light control method described in any embodiment of the present invention when executed.

[0034] The technical solution of the embodiment of the present invention is to obtain the plate parameters; based on the plate parameters, send the laser an instruction to emit light in the first mode, or send the laser an instruction to emit light in the second mode; the instruction to emit light in the first mode is to control the laser to emit light in the first mode, wherein, in the first mode, the laser emits light in the form of instantaneous light output power combined with the pulse duty cycle, the instantaneous light output power is greater than the rated light output power, and the product of the instantaneous light output power and the pulse duty cycle is less than or equal to the rated light output power; the instruction to emit light in the second mode is to control the laser to emit light in the second mode, wherein, in the second mode, the laser emits light with a normal light output power not greater than the rated light output power. Furthermore, when it is clear based on the plate parameters that the plate can be cut in the first mode, the laser can be controlled to operate in the first mode. Since in the first mode, the instantaneous light output power of the laser is greater than the rated light output power, the potential of the laser can be fully tapped, which can not only meet the cutting speed, but also improve the light output utilization rate of the laser.

[0035] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 : is a flow chart of a laser light output control method according to an embodiment of the present invention;

[0038] Figure 2 hereinafter is a first mode light output waveform diagram of a laser light output control method according to an embodiment of the present invention;

[0039] Figure 3 2 is a first mode pulse light output waveform diagram of a light output control method of a device in another embodiment of the present invention;

[0040] Figure 4 2 is a second mode continuous light output waveform diagram of the laser light output control method in an embodiment of the present invention;

[0041] Figure 5 2 is a second mode pulse light output waveform diagram of the laser light output control method in an embodiment of the present invention;

[0042] Figure 6 7 is a first mode pulse light output waveform diagram of a laser light output control method in another embodiment of the present invention;

[0043] Figure 7 hereinafter is a flow chart of a method for controlling the light emission of a laser in a specific embodiment of the present invention;

[0044] Figure 8 It is a schematic diagram of the structure of an electronic device for implementing the laser light emission control method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0046] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0047] It should be noted that the mechanical part of the laser cutter head does not contact the workpiece, and will not scratch the workpiece surface during operation; the laser cutting speed is fast, the incision is smooth and flat, and generally no subsequent processing is required; the cutting heat affected zone is small, the plate deformation is small, and the cutting seam is narrow (0.1mm~0.3mm); the incision has no mechanical stress and no shear burrs; the processing accuracy is high, the repeatability is good, and the material surface is not damaged; CNC programming can process any plane diagram, and can cut a large whole plate without opening a mold, which is economical and time-saving. Laser cutting processing replaces traditional mechanical tools with invisible laser beams. It has the characteristics of high precision, fast cutting speed, smooth incision, automatic typesetting to save materials, and low processing cost. It has gradually become the preferred processing solution for metal sheet cutting. Laser cutting technology is developing at an unprecedented speed, maintaining a growth rate of more than 25% for many years, and has broad development prospects and huge application space.

[0048] When performing laser cutting, no matter what type of material is being processed (such as carbon steel and stainless steel), when the material thickness is the same, high-power lasers are usually used for faster cutting. Traditional laser cutting equipment uses a fixed-power light-emitting mode, and usually has a maximum light-emitting power limit. Regardless of whether it is a continuous or pulsed light-emitting mode, the light-emitting power will not exceed the maximum light-emitting power. Taking the commonly used 10,000-watt model as an example, the actual power of the laser when it is fully powered (100% power) is 10,000W before it leaves the factory. During actual use, whether it is continuous or pulsed light, its instantaneous power will not exceed 10,000W. The reason for limiting the maximum light-emitting power of the laser is that if the pump source that generates the laser in the laser is used for a long time under conditions exceeding the rated power, the service life will be greatly reduced or even damaged quickly. Lasers produced by different laser manufacturers may reserve a certain power margin to ensure that the total power of the laser will not decrease when part of the pump source is necrotic after long-term use, but it is usually not allowed to be used beyond the rated power. At the same time, when determining the rated output power of the laser, laser manufacturers generally do not use the maximum output power when all pump sources are turned on, but give a slight discount. In other words, to increase the cutting speed, a higher power laser is required. Although ordinary lasers have a certain power margin, they are limited by the maximum rated output power and are not allowed to exceed the maximum power. The potential of the laser is not fully tapped.

[0049] The energy consumption of laser cutting equipment is quite high. The widespread application of laser cutting equipment is somewhat different from the requirements of energy conservation and emission reduction in today's world. Reducing the energy consumption of lasers will reduce the cost of using laser cutting equipment and enhance product competitiveness.

[0050] In view of the shortcomings of the traditional laser cutting equipment mentioned above, which does not fully utilize the light output capacity and power of the laser and has excessive energy consumption, the present invention proposes a solution for a laser light output control method. In the laser cutting equipment developed according to this solution, the laser can output light exceeding the maximum rated light output power under certain restrictions. Under the premise of not affecting the pump source and the service life of the laser, a higher power can be used for laser cutting to increase the cutting speed while saving energy and reducing emissions. The laser controlled by the method of the present invention outputs light, so that the laser cutting equipment has a fast cutting speed, low energy consumption, and good cross-section quality, which will have a clear competitive advantage in the market.

[0051] The following is an explanation of a laser light emission control method provided by an embodiment of the present invention. Figure 1 As shown, the method comprises the following steps:

[0052] S101, obtaining plate parameters;

[0053] S102, based on the plate parameters, sending an instruction to the laser to emit light in the first mode, or an instruction to emit light in the second mode;

[0054] The instruction to emit light in the first mode is to control the laser to emit light in the first mode, wherein in the first mode, the laser emits light in a manner of instantaneous light output power and a pulse duty cycle, the instantaneous light output power is greater than the rated light output power, and the product of the instantaneous light output power and the pulse duty cycle is less than or equal to the rated light output power;

[0055] The instruction to emit light in the second mode is to control the laser to emit light in the second mode, wherein in the second mode, the laser emits light at a normal light output power not greater than the rated light output power.

[0056] It should be noted that the plate parameters are the parameters of the plate to be laser cut, including the thickness and material of the plate. After obtaining the parameters such as the thickness and material of the plate, you can choose to use the first mode or the second mode. Exemplarily, when the thickness of the plate is thicker and the material is harder, the second mode can be selected, the unit density energy is lower, the heat effect is smaller, and it is not easy to form cutting ripples. When the thickness of the plate is thinner and the material hardness is average, the first mode can be selected, the unit density energy is higher, which is conducive to instantaneous penetration and is not easy to form cutting ripples. Among them, a corresponding relationship can be established in advance between the plate parameters and the light output mode of the laser, and stored in the laser, so that after obtaining the plate parameters, an instruction of the corresponding light output mode can be issued to the laser.

[0057] It is understandable that if the rated light output power of the laser is 10000W, then the instantaneous light output power is greater than 10000W. That is to say, in the first mode, the instantaneous light output power of the laser is allowed to exceed 10000W, and the instantaneous light output power can be the rated light output power plus the power margin of the laser. Exemplarily, if the power margin is 2000W, the instantaneous light output power can be increased by 20% relative to the rated light output power, that is, it can be increased to 12000W at most. This mode is called the first mode. Since continuous light output at 12000W may cause damage to the laser pump source, the first mode should automatically protect this application scenario, and then when the device outputs light at a power of 12000W, the duty cycle of the light output should be automatically limited, such as limiting the duty cycle to no more than 80%, to ensure that although the instantaneous power of the laser has reached 12000W from 10000W, the average power is still below 10000W, thereby ensuring the service life of the laser.

[0058] That is to say, if the laser emits light at a power of 12000W, it will automatically match the pulse light output with a duty cycle not exceeding 80%. As a result, the product of the instantaneous light output power and the pulse duty cycle, i.e., 12000W*80%=9600W, is less than 10000W. Thus, the instantaneous light output power of the laser can be increased while ensuring the service life of the laser, so as to further improve the cutting rate.

[0059] In one embodiment, when the laser emits light in the first mode, since the product of the instantaneous light output power and the pulse duty cycle is less than the rated light output power, when the instantaneous light output power is determined, the range of the pulse duty cycle value is also determined, and the product of the instantaneous light output power and the pulse duty cycle can be as close to the rated light output power as possible.

[0060] in, Figure 2 FIG. 8 is a first mode light output waveform diagram of a laser light output control method in one embodiment of the present invention. Figure 3 FIG. 8 is a first mode pulse light output waveform diagram of a light output control method of a device in another embodiment of the present invention. Figure 2 In the middle, the laser operates in the first mode with a pulse duty cycle of 80%, and the average output power of the laser is 9600W. Figure 3 In the figure, the laser operates in the first mode with a pulse duty cycle of 50%, and the average output power of the laser is 6000 W. Compared with the case where the laser operates at the rated output power with the same pulse duty cycle, the output power is improved to a certain extent, and since the average power is within the rated output power, there is no damage to the equipment, and the laser output power margin can be better utilized.

[0061] For the second mode, the laser can emit light continuously at a power not greater than the rated light output power, or emit light in pulses at a power not greater than the rated light output power. In order to make the cutting speed of the laser cutting equipment as fast as possible, the rated light output power of the laser in the laser cutting equipment is usually used for cutting. Regardless of whether it is continuous or pulsed light output, its instantaneous maximum power remains unchanged and is the rated light output power. Taking a 10,000-watt laser as an example, the instantaneous maximum power is 10,000W. Among them, Figure 4 2 is a second mode continuous light output waveform diagram of the laser light output control method in an embodiment of the present invention. Figure 5 2 is a second mode pulse light waveform diagram of the laser light control method in an embodiment of the present invention. Figure 5 The figure in the middle shows the second mode with a pulse duty cycle of 50%, at which time the average output power of the laser is 5000W. This mode is suitable for thicker plates.

[0062] Therefore, the light emission mode of the laser can be selected based on the plate parameters, so that the cutting speed of the plate that can be cut using the first mode can be increased, the potential of the laser can be improved, the energy consumption of the laser can be reduced, and the cost can be reduced.

[0063] Optionally, before obtaining the plate parameters, the following steps are also included:

[0064] Forming a first mapping relationship between plate parameters and a light output mode of a laser;

[0065] Sending an instruction to the laser to emit light in the first mode, or an instruction to emit light in the second mode includes:

[0066] Based on the plate parameters and the first mapping relationship, an instruction to emit light in the first mode or an instruction to emit light in the second mode is sent to the laser.

[0067] It is understandable that due to the different materials and thicknesses of different cutting materials, the laser may be required to have different light emission modes, as well as different light emission powers under the same light emission mode, in order to achieve the corresponding cutting effect and meet the user's cutting needs. Furthermore, the material and thickness of the cutting material, and the corresponding relationship with the second mode or the first mode can be configured in the laser in advance. Thus, after obtaining the material and thickness plate parameters of the cutting material, the corresponding light emission mode instructions can be sent to the laser so that the laser can match the current cutting environment.

[0068] It should be noted that the above-mentioned first mapping relationship can be obtained in advance by means of empirical values, or by means of neural network model training, and can be pre-stored in the laser.

[0069] Exemplarily, the plate parameters include the first plate parameter, the second plate parameter and the third plate parameter, and the light output mode includes the first mode and the second mode; wherein the first plate parameter corresponds to a plate of the first thickness and the first material, the second plate parameter corresponds to a plate of the second thickness and the first material, the third plate parameter corresponds to a plate of the second thickness and the second material, the first thickness is greater than the second thickness, and the hardness of the first material is greater than the hardness of the second material. The first plate parameter corresponds to the second mode, for example, when the light output power is 10000W and the duty cycle is 100%, the cutting effect is best, the second plate parameter corresponds to the second mode, for example, when the light output power is 10000W and the duty cycle is 50%, the cutting effect is best, and the third plate parameter can correspond to the first mode, for example, when the light output power is 12000W and the duty cycle is 50%, the cutting effect is best. In this way, the following mapping relationship is formed, the first plate parameter corresponds to the second mode, the second plate parameter corresponds to the second mode, and the third plate parameter corresponds to the first mode.

[0070] Therefore, when the first plate parameters are obtained, an instruction can be sent to the laser to emit light in the second mode. When the second plate parameters are obtained, an instruction can be sent to the laser to emit light in the second mode. When the third plate parameters are obtained, an instruction can be sent to the laser to emit light in the first mode.

[0071] The above contents are only examples and are not intended to be specific limitations of the present invention. The first mapping relationship can be continuously enriched and improved with the increase of cutting experience and model samples.

[0072] Optionally, controlling the laser to emit light in the first mode includes: calling an optimal processing waveform corresponding to the plate parameters from a process library pre-stored in the laser, and controlling the laser to emit light with the optimal processing waveform.

[0073] Optionally, the process library is established based on a mapping relationship between plate parameters and optimal processing waveforms corresponding to the plate parameters.

[0074] Among them, in the first mode, a waveform editing module is provided in the controller of the laser, and the user can edit the processing waveform according to the plate parameters and the required cutting requirements, and form a second mapping relationship between the plate parameters and the cutting requirement processing waveform. In this way, after determining that the light emission mode of the laser is the first mode based on the plate parameters and the first mapping relationship, the corresponding optimal processing waveform can also be determined according to the plate parameters and the second mapping relationship, so that the laser cutting equipment can be controlled to process the plate with the optimal processing waveform. The optimal processing waveform corresponds to the optimal processing effect.

[0075] The process library pre-stores a second mapping relationship, which can be formed based on experience or neural network model training. This stage is mainly to conduct process application experiments, which are completed by cutting application engineers. For plates of different materials and thicknesses, various waveforms are edited, a large number of cutting experiments are carried out, and the experimental results data are recorded. The most ideal cutting waveform is found through massive data comparison and analysis. For example, when the laser emits light in the first mode, in order to meet the slower cutting speed of thick plates, the power can be reduced after the high-power laser is used to quickly melt the metal and use the waste heat to separate the metal, that is, the light emitting frequency can be lower and the power drop can be larger. When cutting thin plates, the speed is fast, the light emitting frequency is required to be high, and the power drop should be small rather than large. Note that during the cutting process, the power does not have to be reduced from the maximum value to 0, it can also be reduced to an intermediate value, such as Figure 6 The following is an example of waveform editing when the power drops from 12000W to 8000W. In other words, when using the first mode, the power drop value can be further limited to meet the cutting requirements under different plate thicknesses and materials. In addition, for perforation applications, it is usually more efficient to use high-power continuous light for perforation. Figure 2 The waveform in .

[0076] Optionally, in the first mode, the instantaneous optical output power is 1-1.2 times the rated optical output power.

[0077] It should be noted that due to the limitations of the laser itself, the instantaneous optical power cannot be raised indefinitely, which will cause damage to the pump source in the laser. Since the power margin in the laser is generally 0-20%, the instantaneous optical power is generally selected to be 1-1.2 times the rated optical power. At this time, in the first mode, the corresponding pulse duty cycle must be at least in the range of 1 / 1.2-1.

[0078] Optionally, the controller emitting light in the first mode includes:

[0079] The operating current of the laser is adjusted to a first current, wherein the first current is greater than the rated current.

[0080] It is understandable that the output power of the laser is controlled by the working current provided to the pump source. Assuming that the rated output power is 10,000W when the working current of the pump source is 35A, the maximum optical power is actually limited by limiting the maximum working current of the pump source to no more than 35A. To make full use of the optical power margin of the laser, the optical power of the laser can be increased by increasing the working current of the pump source. It should be noted that although the maximum rated power determined by the laser manufacturer may have a certain margin, it is usually a reasonable value obtained through long-term light aging tests. If this value is exceeded directly in the continuous light state, it may cause damage to the pump source of the laser, which is not worth the loss. In the first mode, the laser is allowed to work continuously at high power for a short period of time. Taking a 10,000-watt laser as an example, the instantaneous maximum power of the laser is allowed to exceed 10,000W. Assuming that the instantaneous power is increased by 20%, the maximum power can be increased to 12,000W. Since continuous light emission at 12000W may cause damage to the laser pump source, the first mode should automatically protect this application scenario. When it is recognized that the laser is continuously emitting light at a power of 12000W, the duty cycle of the light emission should be automatically limited, for example, limiting the duty cycle to no more than 80%.

[0081] Optionally, controlling the laser to emit light in the second mode includes: controlling the laser to emit light in a continuous light emission or pulsed light emission mode at a normal light emission power.

[0082] Among them, in the first mapping relationship, the plate parameters can also correspond to the continuous light emission or pulsed light emission in the second mode. Therefore, when determining that the laser emits light in the second mode based on the plate parameters, the continuous light emission mode or the pulsed light emission mode can be directly selected, which can be obtained in advance based on experience or model training.

[0083] Optionally, when the laser emits light in the second mode, the method further includes:

[0084] The normal light output power of the laser is monitored, and when the normal light output power is greater than the rated light output power, the operation is switched to the first mode.

[0085] That is to say, when the laser emits light in the second mode, it is also necessary to monitor the output power of the laser in real time. Due to voltage instability or control error, the instantaneous output power in the second mode may be greater than the rated output power. In order to protect the laser from damage, the first mode can be started when the above situation occurs to make corresponding corrections to the second mode. And after the laser switches to the first mode to emit light, it also includes:

[0086] The instantaneous optical power of the laser is obtained. When the instantaneous optical power is less than the rated optical power, the laser is restored to the second mode for emitting light.

[0087] That is, after the second mode is corrected by the first mode, if it is detected that the instantaneous optical power is lower than the rated optical power, the second mode can be restored to emit light, thereby protecting the laser.

[0088] In addition, in the first mode, the processing waveform in the process library needs to satisfy the product of the instantaneous optical power and the pulse duty cycle is less than or equal to the rated optical power, that is, the average power needs to be less than or equal to the rated optical power. If the average power is greater than the rated optical power, the processing waveform can be reported and / or corrected. When the correction is performed, in a specific embodiment, Figure 7 As shown, the laser light emission control method includes:

[0089] S101, start, obtain plate parameters;

[0090] S102, based on the plate parameters, sending an instruction to the laser to emit light in a first mode, or an instruction to emit light in a second mode;

[0091] S103, after sending an instruction to the laser to emit light in the first mode, controlling the laser to operate in the first mode; executing S105;

[0092] S104, when the laser issues an instruction to emit light in the second mode, controlling the laser to operate in the second mode;

[0093] S105, obtaining the product of the instantaneous optical power and the pulse duty cycle;

[0094] S106, when the product is greater than the rated optical output power, adjust the instantaneous optical output power to reduce, or reduce the value of the pulse duty cycle; return to S105;

[0095] S107, until the product is less than the rated optical output power, the instantaneous optical output power and the pulse duty cycle are maintained at this time.

[0096] Furthermore, the laser light emission control method proposed in the embodiment of the present invention is adopted. After determining that the plate supports the laser to emit light in the second mode and perform processing, a pulse signal is used to process the workpiece, the laser light output power is instantaneously increased, and the average power is kept within a safe range for a long time. Under the premise of ensuring the service life of the laser, it is measured that the performance (efficiency) can be improved by more than 20%, while energy saving and emission reduction are achieved. Taking the 10000W laser using the solution of the present invention as an example, when working in the first mode, the average power is still 10000W, but the instantaneous power is increased to 12000W, which can achieve the same cutting efficiency as the traditional 12000W equipment. Compared with the traditional 10000W equipment in the second mode, the cutting speed and efficiency are improved by more than 20%; compared with the traditional 12000W equipment in the second mode, it can save 20% of electricity, the use cost is low, and the cutting section effect is better.

[0097] The embodiment of the present invention further provides a laser light emission control device, comprising:

[0098] Acquisition module, used to obtain plate parameters;

[0099] A control module, used for sending an instruction to the laser to emit light in a first mode or an instruction to emit light in a second mode based on the plate parameters;

[0100] The instruction to emit light in the first mode is to control the laser to emit light in the first mode, wherein in the first mode, the laser emits light in a manner of instantaneous light output power and a pulse duty cycle, the instantaneous light output power is greater than the rated light output power, and the product of the instantaneous light output power and the pulse duty cycle is less than or equal to the rated light output power;

[0101] The instruction to emit light in the second mode is to control the laser to emit light in the second mode, wherein in the second mode, the laser emits light at a normal light output power not greater than the rated light output power.

[0102] Optionally, the control device further includes:

[0103] A first mapping relationship forming module, used to form a first mapping relationship between the plate parameters and the light emission mode of the laser;

[0104] The control module is used to send an instruction to the laser to emit light in the first mode, or an instruction to emit light in the second mode, based on the plate parameters and the first mapping relationship.

[0105] Optionally, the control module is further used to call an optimal processing waveform corresponding to the plate parameters from a process library pre-stored in the laser, and control the laser to emit light with the optimal processing waveform.

[0106] Optionally, the process library is established based on a mapping relationship between plate parameters and optimal processing waveforms corresponding to the plate parameters.

[0107] Optionally, the instantaneous optical output power is 1-1.2 times the rated optical output power.

[0108] Optionally, the control module is further used to control the laser to emit light in a continuous light emitting or pulsed light emitting manner at normal light emitting power.

[0109] The laser light emission control device provided in the embodiment of the present invention can execute the laser light emission control method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method, which will not be repeated here.

[0110] An embodiment of the present invention provides an electronic device, the electronic device comprising:

[0111] at least one processor; and

[0112] a memory communicatively connected to the at least one processor; wherein,

[0113] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the laser light emission control method described in any embodiment of the present invention.

[0114] Figure 8 A schematic diagram of an electronic device that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0115] like Figure 8As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the random access memory (RAM) 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the read-only memory (ROM) 12 and the random access memory (RAM) 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0116] A number of components in the electronic device 10 are connected to an input / output (I / O) interface 15, including an input unit 16, such as a keyboard, a mouse, etc., an output unit 17, such as various types of displays, speakers, etc., a storage unit 18, such as a disk, an optical disk, etc., and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0117] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a laser light control method.

[0118] In some embodiments, the laser light control method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via a read-only memory (ROM) 12 and / or a communication unit 19. When the computer program is loaded into a random access memory (RAM) 13 and executed by the processor 11, one or more steps of the laser light control method described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to execute the laser light control method in any other appropriate manner (for example, by means of firmware).

[0119] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0120] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0121] An embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the laser light emission control method described in any embodiment of the present invention when executed.

[0122] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0123] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0124] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0125] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0126] The technical solution of the embodiment of the present invention is to obtain the plate parameters; based on the plate parameters, send the laser an instruction to emit light in the first mode, or send the laser an instruction to emit light in the second mode; the instruction to emit light in the first mode is to control the laser to emit light in the first mode, wherein, in the first mode, the laser emits light in the form of instantaneous light output power combined with the pulse duty cycle, the instantaneous light output power is greater than the rated light output power, and the product of the instantaneous light output power and the pulse duty cycle is less than or equal to the rated light output power; the instruction to emit light in the second mode is to control the laser to emit light in the second mode, wherein, in the second mode, the laser emits light with a normal light output power not greater than the rated light output power. Furthermore, when it is clear based on the plate parameters that the plate can be cut in the first mode, the laser can be controlled to operate in the first mode. Since in the first mode, the instantaneous light output power of the laser is greater than the rated light output power, the potential of the laser can be fully tapped, which can not only meet the cutting speed, but also improve the light output utilization rate of the laser.

[0127] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0128] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser light output control method, characterized in that: The following steps are involved: Get the plate parameters; Based on the plate parameters, an instruction to emit light in a first mode or an instruction to emit light in a second mode is sent to the laser; The instruction sent to the laser to emit light is to control the laser to emit light in the first mode, wherein, in the first mode, the laser emits light in a manner of instantaneous light output power and a pulse duty cycle, the instantaneous light output power is greater than the rated light output power, and the product of the instantaneous light output power and the pulse duty cycle is less than or equal to the rated light output power; The instruction to emit light in the second mode is sent to the laser to control the laser to emit light in the second mode, wherein in the second mode, the laser emits light with a normal light output power not greater than the rated light output power.

2. The laser light emission control method according to claim 1, characterized in that: Before obtaining the plate parameters, it also includes: Forming a first mapping relationship between the plate parameters and the light emission mode of the laser; The sending of an instruction to the laser to emit light in the first mode, or an instruction to emit light in the second mode, includes: Based on the plate parameters and the first mapping relationship, an instruction to emit light in a first mode is sent to the laser, or an instruction to emit light in a second mode is sent.

3. The laser light emission control method according to claim 1, characterized in that: Controlling the laser to emit light in the first mode includes: calling an optimal processing waveform corresponding to the plate parameters from a process library pre-stored in the laser, and controlling the laser to emit light in the optimal processing waveform.

4. The laser light emission control method according to claim 3, characterized in that: The process library is established based on the mapping relationship between the plate parameters and the optimal processing waveform corresponding to the plate parameters.

5. The laser light emission control method according to claim 1, characterized in that: The instantaneous optical output power is 1-1.2 times the rated optical output power.

6. The laser light emission control method according to claim 1, characterized in that: The controlling the laser to emit light in the second mode comprises: The laser is controlled to emit light in a continuous light emitting or pulsed light emitting mode at a normal light emitting power.

7. A laser light output control device, characterized in that: include: Acquisition module, used to obtain plate parameters; A control module, configured to send an instruction to the laser to emit light in a first mode or an instruction to emit light in a second mode based on the plate parameters; The instruction to emit light in the first mode is to control the laser to emit light in the first mode, wherein, in the first mode, the laser emits light in a manner of instantaneous light output power and a pulse duty cycle, the instantaneous light output power is greater than the rated light output power, and the product of the instantaneous light output power and the pulse duty cycle is less than or equal to the rated light output power; The instruction to emit light in the second mode is sent to the laser to control the laser to emit light in the second mode, wherein in the second mode, the laser emits light with a normal light output power not greater than the rated light output power.

8. The laser light emission control device according to claim 7, characterized in that: Also includes: A first training module, used to form a first mapping relationship between the plate parameters and the light emission mode of the laser; The control module is used to determine, based on the plate parameters and the first mapping relationship, to send an instruction to the laser to emit light in a first mode.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the laser light emission control method according to any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the laser light emission control method according to any one of claims 1 to 6 when executed.

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