Field lens self-adaptive debugging method and device

Abstract

The invention discloses a field lens self-adaptive debugging method and device, and relates to the technical field of laser cutting, and the field lens self-adaptive debugging method comprises the following steps: determining a suitable distance between a field lens and black photographic paper; judging whether angle inclination exists in field lens installation or not; correcting a cutting curve; in the process of installing and debugging the field lens, a technician does not need to frequently take down the black photographic paper from a vacuum adsorption platform and manually adjust the microscope to measure the etching trace of the black photographic paper subjected to laser etching; according to the field lens self-adaptive debugging method, the suitable distance between the field lens and the black photographic paper can be quickly confirmed, and the problems that when the field lens is installed and debugged at present, installation and debugging are inconvenient, the installation and debugging efficiency is not high, and the production efficiency of a production line is affected are solved.

Description

Technical Field

[0001] The invention relates to the technical field of laser cutting, and in particular to a method and a device for adaptively debugging a field lens. Background Art

[0002] OLED (Organic Light Emitting Diode) display is a display technology based on organic materials that can achieve higher contrast, wider viewing angle and faster response time. Due to its thinness, softness and good backlight uniformity, OLED display has become an important technology for smartphones, TVs and other consumer electronic products. In the production process of OLED display, laser cutting technology is often used, such as substrate cutting, package cutting, interlayer cutting, etc.

[0003] At present, in the field of laser cutting of OLED display screens, there are some limitations and shortcomings when installing and debugging the field lens. For example: when determining the most suitable working distance between the field lens and the work surface, technicians need to frequently peel off the black photo paper from the processing platform, and then place it on the microscope platform, and manually adjust the microscope platform to measure the width of the stripes in the laser-etched black photo paper, and then determine the appropriate working distance between the field lens and the work surface; it is impossible to confirm whether the horizontal installation position of the field lens is appropriate, and whether there is an angle tilt. At the same time, when facing different cutting contours, technicians also need to frequently peel off the black photo paper from the processing platform, manually adjust the microscope platform to measure the size of the laser etching marks on the OLED screen, and gradually adjust the cutting contour parameters; when the OLED screen cutting is abnormal, there is no good way to determine the cause of the problem.

[0004] In summary, when installing and debugging the field mirror, there are problems such as inconvenience in installation and debugging, low installation and debugging efficiency, and affecting the production efficiency of the production line. Therefore, a method and device that can improve the efficiency of field mirror installation and debugging is urgently needed. Summary of the invention

[0005] Based on this, in order to solve the above problems, the present invention proposes a method and device for adaptive debugging of field mirrors, which solves the problems of inconvenience and low efficiency in installing and debugging field mirrors, thus affecting the production efficiency of the production line.

[0006] The technical solution of the present invention is:

[0007] A method for adaptively debugging a field mirror comprises the following steps:

[0008] Step A: Determine the appropriate distance between the field lens and the black photo paper;

[0009] Step A1: adsorb the black photo paper on the vacuum adsorption table, and then move the XY moving platform to the bottom of the field mirror; adjust the output power and pulse frequency of the laser galvanometer, and adjust the output power and pulse frequency of the femtosecond laser to 40% of that used for cutting the OLED screen;

[0010] Step A2: With the Z-direction moving platform adjusting the limit process as the movement range, the field lens is moved from the lowest position in the Z direction to the highest position. During the movement, for every z1mm movement of the field lens in the Z direction, the black photo paper moves y1mm in the Y direction, and a plurality of etching stripes with a length of b1mm are etched on the black photo paper by laser;

[0011] Step A3: Move the XY mobile platform to the bottom of the microscope camera, collect the image of the etching stripes on the black photographic paper through the microscope camera, and calculate the width of each etching stripe through image processing; select the etching stripe with the smallest width, and give the Z-direction height Z0 of the field lens corresponding to the etching stripe with the smallest width;

[0012] Step A4: Move the XY moving platform to below the field lens, adjust the field lens to a height of Z0 by the Z moving platform, and then use the laser to etch a number of etching stripes with a length of b2 mm on the black photographic paper by moving z2 mm in the Z direction and y2 mm in the Y direction;

[0013] Step A5: Move the XY mobile platform to the bottom of the microscope camera, collect the image of the etching stripes on the black photographic paper through the microscope camera, and calculate the width of each etching stripe through image processing; select the etching stripes with the smallest width, and give the Z-direction height Z1 of the field lens corresponding to the etching stripes with the smallest width, where Z1 is the appropriate distance between the field lens and the black photographic paper;

[0014] Step B: Determine whether the field mirror is installed at an angle;

[0015] Step C: Cutting curve correction.

[0016] Preferably, in steps A3 and A5, the image processing calculation process is: using the gray threshold to extract the image contour, calculating the number of pixels of two gray threshold boundary lines, and then calculating the width of each etching stripe, the calculation formula is as follows:

[0017] The number of pixels is the number of pixels occupied by the etching stripes in the image, which can be analyzed based on the image.

[0018]

[0019] The technology shows that the pixel size is the actual size corresponding to each pixel, which can be directly obtained based on the parameters of the microscope camera used. The objective lens magnification is the magnification of the microscope camera used, which can be directly obtained based on the parameters of the microscope camera.

[0020] Preferably, step B: determining whether the field mirror is installed at an angle tilted specifically comprises:

[0021] Step B1: adsorb the black photo paper on the vacuum adsorption table, then move the XY moving platform to below the field lens, and adjust the field lens to a height Z1 through the Z moving platform;

[0022] Step B2: Adjust the output power and pulse frequency of the laser galvanometer, adjust the output power of the femtosecond laser to 40% of that used for cutting the OLED screen, and adjust the pulse frequency to 10% of that used for cutting the OLED screen;

[0023] Step B3: Etching on black photographic paper along the outline of the maximum format of the field lens (200*200) to obtain a number of etching points distributed along the outline that are approximately circular;

[0024] Step B4: Move the XY mobile platform to the bottom of the microscope camera, and collect images of approximately circular etching points on the black photographic paper through the microscope camera, and calculate the fitting circle diameters and roundnesses corresponding to several etching points through image processing, and then compare the fitting circle diameters, roundnesses and shapes corresponding to the etching points that are symmetrically distributed up and down and left and right. If the fitting circle diameters and roundnesses corresponding to the four diagonally distributed etching points are inconsistent, it means that the installation angle of the field lens is tilted, and then adjust the installation angle of the field lens according to the fitting circle diameter, roundness and shape;

[0025] In step B4, the image processing process is as follows: using the grayscale threshold to extract the image contour of the approximately circular etching point, then using two concentric circles and the image contour of the approximately circular etching point to generate a circumscribed circle and an inscribed circle, and calculating the circularity, then using the circle to fit the image contour of the approximately circular etching point, and calculating the diameter of the fitting circle;

[0026] The roundness calculation formula is as follows:

[0027]

[0028] The formula for calculating the major axis length is:

[0029]

[0030] The formula for calculating the minor axis length is:

[0031]

[0032] The calculation formula of the fitting circle diameter is as follows:

[0033]

[0034] Among them, the number of pixels of the circumscribed circle diameter, the number of pixels of the inscribed circle diameter and the number of pixels of the circle diameter can be obtained through image analysis technology. The pixel size is the actual size corresponding to each pixel, which can be directly obtained according to the parameters of the microscope camera used. The objective lens magnification is the magnification of the microscope camera used, which can be directly obtained according to the parameters of the microscope camera.

[0035] Preferably, step C: cutting curve correction specifically comprises the following steps:

[0036] Step C1: adsorb the black photo paper on the vacuum adsorption table, then move the XY moving platform to below the field lens, and adjust the field lens to a height Z1 through the Z moving platform;

[0037] Step C2: Adjust the output power and pulse frequency of the laser galvanometer, adjust the output power of the femtosecond laser to 40% of that used for cutting the OLED screen, adjust the pulse frequency to that used for cutting the OLED screen, and etch the etching line on the black photo paper along the cutting contour line on the OLED screen drawing by laser;

[0038] Step C3: Move the XY mobile platform to the bottom of the microscope camera, and use the microscope camera to collect the image of the etching line on the black photo paper, use the grayscale threshold to extract the cutting curve image of the etching line, and compare it with the cutting contour line on the OLED screen drawing, calculate the size difference between the cutting curve image and the cutting contour line on the OLED screen drawing, and then make corrections based on the size difference.

[0039] A field mirror adaptive debugging device, applied to the field mirror adaptive debugging method described above, comprises:

[0040] Mounting platform, the mounting platform is used to mount the XY moving platform, the Z moving platform and the microscope camera;

[0041] An XY moving platform, which is slidably arranged on the mounting platform and is used to adjust the position of the vacuum adsorption table in the X and Y directions;

[0042] A vacuum adsorption table, which is arranged on an XY moving platform and is used for adsorbing and fixing the black photo paper;

[0043] A Z-axis moving platform, which is arranged on a mounting platform and is used to adjust the distance between the laser galvanometer and the field lens and the black photo paper;

[0044] Laser galvanometer, which is arranged on a Z-axis movable platform and used to emit laser light, and the field mirror can be installed below the laser galvanometer;

[0045] A microscope camera is arranged on a mounting platform and is used to collect an image of etching stripes on black photographic paper;

[0046] Among them, the XY mobile platform, the laser galvanometer and the microscope camera are arranged in coordination, the XY mobile platform can be moved to the bottom of the laser galvanometer, and can also be moved to the bottom of the microscope camera, the XY mobile platform includes an X-direction mobile platform and a Y-direction mobile platform, the X-direction mobile platform is slidably arranged on the mounting platform, the Y-direction mobile platform is arranged on the X-direction mobile platform, and the vacuum adsorption table is arranged on the Y-direction mobile platform; the laser galvanometer includes a femtosecond laser, a beam expander and a galvanometer body connected in sequence, the galvanometer body is arranged on the Z-direction mobile platform, and the field mirror can be installed under the galvanometer body.

[0047] Preferably, the X-axis moving platform includes a first rail mounting plate, a first driving structure, a pair of first sliding rails and at least one pair of first sliding blocks, the first rail mounting plate is arranged on the mounting platform, and the bottom of the first rail mounting plate is slidably connected to the mounting platform, a pair of first sliding rails are arranged on the first rail mounting plate, at least one pair of first sliding blocks are respectively arranged on the pair of first sliding rails and are slidably connected to the first sliding rails, and the first driving structure is arranged on the first rail mounting plate and is located between the pair of first sliding rails.

[0048] Preferably, the Y-axis moving platform includes a second track mounting plate, a second driving structure, a pair of second sliding rails and at least one pair of second sliding blocks, the second track mounting plate is arranged on at least one pair of first sliding blocks and is detachably connected to the first sliding blocks, one end of the first driving structure is detachably connected to the bottom of the second track mounting plate, and is used to drive the second track mounting plate to slide along the pair of first sliding rails, a pair of second sliding rails are arranged on the second track mounting plate, at least one pair of second sliding blocks are respectively arranged on a pair of second sliding rails and are slidably connected to the second sliding rails, the second driving structure is arranged on the second track mounting plate and is located between the pair of second sliding rails, the vacuum adsorption table is arranged on at least one pair of second sliding blocks and is detachably connected to the second sliding blocks, and one end of the second driving structure is detachably connected to the bottom of the vacuum adsorption table, and is used to drive the vacuum adsorption table to slide along the pair of second sliding rails.

[0049] Preferably, the first driving structure includes a first driving motor, a first threaded rod and a first threaded connecting block, the first driving motor is arranged on one side of the first track mounting plate and is fixedly connected to the first track mounting plate, one end of the first threaded rod is fixedly connected to the output shaft of the first driving motor, the first threaded connecting block is sleeved on the first threaded rod and is threadedly connected to the first threaded rod, the first threaded rod is rotatably connected to the first track mounting plate through a pair of first bearing seats, and the top of the first threaded connecting block is detachably connected to the bottom of the second track mounting plate.

[0050] Preferably, the second driving structure includes a second driving motor, a second threaded rod and a second threaded connecting block, the second driving motor is arranged on one side of the second track mounting plate and is fixedly connected to the second track mounting plate, one end of the second threaded rod is fixedly connected to the output shaft of the second driving motor, the second threaded connecting block is sleeved on the second threaded rod and is threadedly connected to the second threaded rod, the second threaded rod is rotatably connected to the second track mounting plate through a pair of second bearing seats, and the top of the second threaded connecting block is detachably connected to the bottom of the vacuum adsorption table.

[0051] Preferably, the Z-axis movable platform comprises a fixed mounting frame, a driving unit, a rotating threaded rod, a threaded mounting block, a fixed mounting plate, a pair of fixed seats, a pair of guide slide bars and a pair of guide slide bars. The fixed mounting frame is arranged on the mounting platform and is arranged in cooperation with the XY movable platform. The pair of fixed seats is fixedly arranged on the upper end of the fixed mounting frame, the rotating threaded rod and the pair of guide slide bars are arranged between the pair of fixed seats, and the rotating threaded rod is located between the pair of guide slide bars, both ends of the rotating threaded rod respectively pass through a pair of fixed seats and are rotatably connected to the fixed seats, both ends of the pair of guide slide bars are respectively fixedly connected to the pair of fixed seats, the driving unit is arranged on one side of the fixed seat located at the upper end, and the driving unit is fixedly connected to the end portion of one end of the rotating threaded rod for driving the rotating threaded rod, the threaded mounting block is sleeved on the rotating threaded rod and is threadedly connected to the rotating threaded rod, a pair of guide slide bars are respectively sleeved on the pair of guide slide bars and are slidably connected to the guide slide bars, one side of the fixed mounting plate is fixedly connected to the threaded mounting block and the pair of guide slide bars, and the laser galvanometer can be mounted on the fixed mounting plate and detachably connected to the fixed mounting plate.

[0052] Compared with the prior art, the present invention has the following beneficial effects:

[0053] During the installation and debugging of the field lens of the present invention, the technicians are no longer required to frequently remove the black photographic paper from the vacuum adsorption platform. The etching marks of the laser-etched black photographic paper can be measured by manually adjusting the microscope. The suitable distance between the field lens and the black photographic paper can be quickly confirmed by the field lens adaptive debugging method of the present invention, thereby solving the problems of inconvenient installation and debugging, low installation and debugging efficiency, and affecting the production efficiency of the production line when installing and debugging the field lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a structural schematic diagram of a field mirror adaptive debugging device described in an embodiment of the present invention;

[0055] Figure 2 is a schematic diagram of the structure of the XY mobile platform described in an embodiment of the present invention;

[0056] Figure 3 It is a partial structural schematic diagram of the Z-axis moving platform and the laser galvanometer described in the embodiment of the present invention;

[0057] Figure 4 is a schematic diagram of a partial structure of the Z-direction moving platform described in an embodiment of the present invention;

[0058] Figure 5 is a schematic structural diagram of a microscope camera described in an embodiment of the present invention;

[0059] Figure 6 is a schematic diagram of etching stripes on black photographic paper in step A described in an embodiment of the present invention;

[0060] Figure 7 is a schematic diagram of a plurality of approximately circular etching points on black photographic paper in step B described in an embodiment of the present invention;

[0061] Figure 8 is a schematic diagram of etching lines on black photographic paper in step C described in an embodiment of the present invention;

[0062] Fig. 9 is a schematic diagram of a plurality of approximately circular etching points on black photographic paper in step D described in an embodiment of the present invention;

[0063] Description of reference numerals:

[0064] 10-mounting platform, 20-XY moving platform, 200-X-moving platform, 201-Y-moving platform, 202-first track mounting plate, 203-first sliding track, 204-first sliding block, 205-second track mounting plate, 206-second sliding track, 207-second sliding block, 208-first drive motor, 209-first threaded rod, 210-first threaded connection block, 211-first bearing seat, 212-second drive motor, 213-second threaded rod, 214-second threaded connection block , 215-second bearing seat, 30-vacuum adsorption table, 40-Z-moving platform, 400-fixed mounting frame, 401-driving unit, 402-rotating threaded rod, 403-threaded mounting block, 404-fixed mounting plate, 405-fixed seat, 406-guide slide bar, 407-guide slide block, 50-laser galvanometer, 51-field lens, 500-femtosecond laser, 501-beam expander, 502-galvanometer body, 60-microscope camera, 600-camera mounting frame, 601-camera body, 602-microscope lens. DETAILED DESCRIPTION

[0065] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0066] Example:

[0067] like Figure 1 As shown, this embodiment discloses a field mirror adaptive debugging method, comprising the following steps:

[0068] Step A: Determine the appropriate distance between the field lens 51 and the black photographic paper;

[0069] Step A1: adsorb the black photo paper onto the vacuum adsorption table 30, and then move the XY moving platform 20 to below the field lens 51; adjust the output power and pulse frequency of the laser galvanometer 50, and adjust the output power and pulse frequency of the femtosecond laser 500 to 40% of that used for cutting the OLED screen;

[0070] Step A2: With the Z-direction moving platform 40 adjusting the limit process as the moving range, the field lens 51 is moved from the lowest position in the Z direction to the highest position. During the movement, for every z1mm movement of the field lens 51 in the Z direction, the black photographic paper is moved y1mm in the Y direction, and a plurality of etching stripes with a length of b1mm are etched on the black photographic paper by laser;

[0071] Step A3: Move the XY moving platform 20 to below the microscope camera 60, collect the image of the etching stripes on the black photographic paper through the microscope camera 60, and calculate the width of each etching stripe through image processing; select the etching stripe with the smallest width, and give the Z-direction height Z0 of the field lens 51 corresponding to the etching stripe with the smallest width;

[0072] Step A4: Move the XY moving platform 20 to below the field lens 51, adjust the field lens 51 to a height Z0 through the Z moving platform 40, and then use the laser to etch a number of etching stripes with a length of b2 mm on the black photographic paper at a Z-direction movement of z2 mm and a Y-direction movement of y2 mm;

[0073] Step A5: Move the XY moving platform 20 to below the microscope camera 60, collect images of etching stripes on the black photographic paper through the microscope camera 60, and calculate the width of each etching stripe through image processing; select the etching stripe with the smallest width, and give the Z-direction height Z1 of the field lens 51 corresponding to the etching stripe with the smallest width, where Z1 is the appropriate distance between the field lens 51 and the black photographic paper;

[0074] Step B: Determine whether the field lens 51 is installed at an angle tilted;

[0075] Step B1: adsorb the black photo paper onto the vacuum adsorption platform 30, then move the XY moving platform 20 to below the field lens 51, and adjust the field lens 51 to a height Z1 via the Z moving platform 40;

[0076] Step B2: adjusting the output power and pulse frequency of the laser galvanometer 50, adjusting the output power of the femtosecond laser 500 to 40% of that used for cutting the OLED screen, and adjusting the pulse frequency to 10% of that used for cutting the OLED screen;

[0077] Step B3: etching on black photographic paper along the outline of the maximum format 200*200 of the field lens 51 to obtain a plurality of approximately circular etching points distributed along the outline;

[0078] Step B4: Move the XY moving platform 20 to below the microscope camera 60, and collect images of approximately circular etching points on the black photographic paper through the microscope camera 60, and calculate the fitting circle diameters and roundnesses corresponding to a number of etching points through image processing, and then compare the fitting circle diameters, roundnesses and shapes corresponding to the etching points that are symmetrically distributed vertically and horizontally. If the fitting circle diameters and roundnesses corresponding to the four diagonally distributed etching points are inconsistent, it means that the installation angle of the field lens 51 is tilted, and then adjust the installation angle of the field lens 51 according to the fitting circle diameters, roundnesses and shapes;

[0079] Step C: Cutting curve correction;

[0080] Step C1: adsorb the black photo paper onto the vacuum adsorption platform 30, then move the XY moving platform 20 to below the field lens 51, and adjust the field lens 51 to a height Z1 via the Z moving platform 40;

[0081] Step C2: Adjust the output power and pulse frequency of the laser galvanometer 50, adjust the output power of the femtosecond laser 500 to 40% of that used for cutting the OLED screen, adjust the pulse frequency to that used for cutting the OLED screen, and etch the etching line on the black photographic paper by laser along the cutting contour line on the OLED screen drawing;

[0082] Step C3: Move the XY mobile platform 20 to under the microscope camera 60, and use the microscope camera 60 to capture the image of the etching line on the black photo paper, use the grayscale threshold to extract the cutting curve image of the etching line, and compare it with the cutting contour line on the OLED screen drawing, calculate the size difference between the cutting curve image and the cutting contour line on the OLED screen drawing, and then make corrections based on the size difference.

[0083] Among them, in steps A3 and A5, the image processing calculation process is: use the gray threshold to extract the image contour, calculate the number of pixels of two gray threshold boundary lines, and then calculate the width of each etching stripe. The calculation formula is as follows:

[0084]

[0085] Among them, the number of pixels is the number of pixels occupied by the etching stripes in the image, which can be obtained based on image analysis technology. The pixel size is the actual size corresponding to each pixel, which can be directly obtained based on the parameters of the microscope camera 60 used. The objective lens magnification is the magnification of the microscope camera 60 used, which can be directly obtained based on the parameters of the microscope camera 60.

[0086] In step B4, the image processing process is as follows: using the grayscale threshold to extract the image contour of the approximately circular etching point, then using two concentric circles and the image contour of the approximately circular etching point to generate a circumscribed circle and an inscribed circle, and calculating the circularity, then using the circle to fit the image contour of the approximately circular etching point, and calculating the diameter of the fitting circle;

[0087] The roundness calculation formula is as follows:

[0088]

[0089] The formula for calculating the major axis length is:

[0090]

[0091] The formula for calculating the minor axis length is:

[0092]

[0093] The calculation formula of the fitting circle diameter is as follows:

[0094]

[0095] Among them, the number of pixels of the circumscribed circle diameter, the number of pixels of the inscribed circle diameter and the number of pixels of the circle diameter can be obtained through image analysis technology, the pixel size is the actual size corresponding to each pixel, which can be directly obtained according to the parameters of the microscope camera 60 used, and the objective lens magnification is the magnification of the microscope camera 60 used, which can be directly obtained according to the parameters of the microscope camera 60.

[0096] In the process of installing and debugging the field lens 51 of the present invention, the technician no longer needs to frequently remove the black photographic paper from the vacuum adsorption platform, and manually adjust the microscope to measure the etching marks of the laser-etched black photographic paper. The field lens 51 adaptive debugging method described in the present invention can quickly confirm the appropriate distance between the field lens 51 and the black photographic paper, and quickly judge whether the installation position of the field lens 51 is appropriate and whether the field lens 51 is tilted at an angle. At the same time, when facing different cutting contours, through the field lens 51 adaptive debugging method described in the present invention, the technician does not need to frequently remove the black photographic paper from the vacuum adsorption platform, and manually adjust the microscope to measure the size of the laser etching marks of the OLED screen to gradually adjust the cutting contour parameters. The present invention can quickly complete the correction of the cutting curve and adjust it to the appropriate cutting contour parameters. It solves the problem that the installation and debugging of the field lens 51 is inconvenient and the installation and debugging efficiency is low, which affects the production efficiency of the production line.

[0097] like Figure 1 , Fig. 9As shown, when the OLED screen has continuous cutting and cutting residue, the following steps are also included:

[0098] Step D: cutting anomaly analysis;

[0099] Step D1: adsorb the black photo paper onto the vacuum adsorption platform 30, then move the XY moving platform 20 to below the field lens 51, and adjust the field lens 51 to a height Z1 via the Z moving platform 40;

[0100] Step D2: adjusting the output power and pulse frequency of the laser galvanometer 50, adjusting the output power of the femtosecond laser 500 to 40% of that used for cutting the OLED screen, and adjusting the pulse frequency to 10% of that used for cutting the OLED screen;

[0101] Step D3: etching the black photo paper by laser according to the preset cutting contour, to obtain a plurality of approximately circular etching points distributed along the preset cutting contour;

[0102] Step D4: Move the XY moving platform 20 to below the microscope camera 60, and collect images of approximately circular etching points on the black photographic paper through the microscope camera 60, and calculate the fitting circle diameters and roundness corresponding to several etching points through image processing, and then compare the calculated fitting circle diameters and roundness corresponding to several etching points. When the fitting circle diameter and roundness differ by more than 10%, it is regarded as an abnormal point, which can be compared with the actual cutting effect to complete the cutting abnormality analysis;

[0103] The image processing calculation process in step D4 is the same as the image processing calculation process in step B4.

[0104] Through the above steps, the situation of the abnormal point can be quickly confirmed, so as to analyze the cutting abnormality and provide data support for the cutting abnormality analysis.

[0105] In the above embodiment, the value range of z1 is 0.4-0.6 mm, the value range of y1 is 2.5-3.5 mm, and the value range of b is 20-40 mm;

[0106] The value range of z2 is 0.05-0.15mm, the value range of y1 is 2.5-3.5mm, and the value range of b is 20-40mm;

[0107] like Figures 6 to 8 As shown, this embodiment provides a specific debugging value, as follows:

[0108] In one embodiment, z1 is 0.5, y1 is 3, and b is 30; z2 is 0.1, y1 is 3, and b is 30.

[0109] That is, step A2 specifically includes: taking the Z-direction moving platform 40 as the movement range, moving the field lens 51 from the lowest position in the Z direction to the highest position, during which, for every 0.5 mm movement of the field lens 51 in the Z direction, the black photographic paper moves 3 mm in the Y direction, and a plurality of etching stripes with a length of 30 mm are etched on the black photographic paper by laser;

[0110] Step A4 is specifically as follows: move the XY moving platform 20 to below the field lens 51, adjust the field lens 51 to a height Z0 via the Z moving platform 40, and then use a laser to etch a number of etching stripes with a length of 30 mm on the black photographic paper at a movement of 0.1 mm in the Z direction and 3 mm in the Y direction; the remaining steps are the same as those in the above embodiment.

[0111] This embodiment is the best value obtained after multiple experiments. Using this embodiment can achieve the best effect of the present invention.

[0112] Also in other embodiments, for example:

[0113] Value case 1: z1 is 0.4, y1 is 2.5, b is 20; z2 is 0.05, y1 is 2.5, b is 20;

[0114] Value situation 2: z1 is 0.6, y1 is 3.5, b is 40; z2 is 0.15, y1 is 3.5, b is 40;

[0115] The above two groups of value conditions can both implement the method of the present invention.

[0116] like Figures 1 to 5 As shown, a field mirror adaptive debugging device is applied to the field mirror adaptive debugging method described above, comprising:

[0117] An installation platform 10, the installation platform 10 is used to install the XY moving platform 20, the Z moving platform 40 and the microscope camera 60;

[0118] An XY moving platform 20, which is slidably disposed on the mounting platform 10 and is used to adjust the position of the vacuum adsorption platform 30 in the X and Y directions;

[0119] A vacuum adsorption platform 30, which is disposed on the XY moving platform 20 and is used for adsorbing and fixing the black photo paper;

[0120] A Z-direction moving platform 40, which is disposed on the mounting platform 10 and is used to adjust the distance between the laser galvanometer 50 and the field lens 51 and the black photographic paper;

[0121] A laser galvanometer 50 is disposed on the Z-direction movable platform 40 and is used to emit laser light. A field lens 51 may be installed below the laser galvanometer 50;

[0122] A microscope camera 60, which is disposed on the mounting platform 10 and is used to capture an image of etching stripes on the black photographic paper;

[0123] Among them, the XY moving platform 20, the laser galvanometer 50 and the microscope camera 60 are arranged in coordination, the XY moving platform 20 can be moved to the bottom of the laser galvanometer 50, and can also be moved to the bottom of the microscope camera 60, the XY moving platform 20 includes an X-direction moving platform 200 and a Y-direction moving platform 201, the X-direction moving platform 200 is slidably arranged on the mounting platform 10, the Y-direction moving platform 201 is arranged on the X-direction moving platform 200, and the vacuum adsorption platform 30 is arranged on the Y-direction moving platform 201;

[0124] The laser galvanometer 50 includes a femtosecond laser 500, a beam expander 501 and a galvanometer body 502 which are connected in sequence. The galvanometer body 502 is arranged on the Z-direction moving platform 40, and the field lens 51 can be installed below the galvanometer body 502;

[0125] The microscope camera 60 includes a camera mounting frame 600, a camera body 601 and a microscope lens 602. The camera mounting frame 600 is set on the mounting platform 10 and is set in conjunction with the XY moving platform 20. The camera body 601 is installed on the camera mounting frame 600 and is detachably connected to the camera mounting frame 600. The microscope lens 602 is set on the camera body 601.

[0126] When in use, the vacuum adsorption table 30 can be moved in the X and Y directions through the XY moving platform 20. At the same time, the XY moving platform 20 can be slidably set on the mounting platform 10, so that the vacuum adsorption table 30 can cooperate with the laser galvanometer 50 and the microscope camera 60 respectively, thereby completing the etching of black photographic paper and the acquisition of the black photographic paper image by the microscope camera 60.

[0127] Among them, the femtosecond laser 500, the beam expander 501, the galvanometer body 502, the camera mounting bracket 600, the camera body 601 and the microscope lens 602 are all existing technologies.

[0128] like Figure 2As shown, in order to facilitate the movement of the black photo paper in the X and Y directions, and thus facilitate the etching of the black photo paper, this embodiment is improved on the basis of the above embodiment, and the difference from the above embodiment is that the X-axis moving platform 200 includes a first track mounting plate 202, a first driving structure, a pair of first sliding rails 203 and at least one pair of first sliding blocks 204, the first track mounting plate 202 is arranged on the mounting platform 10, and the bottom of the first track mounting plate 202 is slidably connected to the mounting platform 10, a pair of first sliding rails 203 are arranged on the first track mounting plate 202, at least a pair of first sliding blocks 204 are respectively arranged on a pair of first sliding rails 203, and are slidably connected to the first sliding rails 203, and the first driving structure is arranged on the first track mounting plate 202 and is located between the pair of first sliding rails 203.

[0129] The Y-axis moving platform 201 includes a second track mounting plate 205, a second driving structure, a pair of second sliding rails 206 and at least one pair of second sliding blocks 207. The second track mounting plate 205 is arranged on at least one pair of first sliding blocks 204 and is detachably connected to the first sliding blocks 204. One end of the first driving structure is detachably connected to the bottom of the second track mounting plate 205, and is used to drive the second track mounting plate 205 to slide along the pair of first sliding rails 203. A pair of second sliding rails 206 are arranged on the second track mounting plate 205. At least one pair of second sliding blocks 207 are respectively arranged on a pair of second sliding rails 206 and are slidably connected to the second sliding rails 206. The second driving structure is arranged on the second track mounting plate 205 and is located between the pair of second sliding rails 206. The vacuum adsorption table 30 is arranged on at least one pair of second sliding blocks 207 and is detachably connected to the second sliding blocks 207. One end of the second driving structure is detachably connected to the bottom of the vacuum adsorption table 30, and is used to drive the vacuum adsorption table 30 to slide along the pair of second sliding rails 206.

[0130] The first driving structure includes a first driving motor 208, a first threaded rod 209 and a first threaded connecting block 210. The first driving motor 208 is arranged on one side of the first track mounting plate 202 and is fixedly connected to the first track mounting plate 202. One end of the first threaded rod 209 is fixedly connected to the output shaft of the first driving motor 208. The first threaded connecting block 210 is sleeved on the first threaded rod 209 and is threadedly connected to the first threaded rod 209. The first threaded rod 209 is rotatably connected to the first track mounting plate 202 through a pair of first bearing seats 211. The top of the first threaded connecting block 210 is detachably connected to the bottom of the second track mounting plate 205.

[0131] The second driving structure includes a second driving motor 212, a second threaded rod 213 and a second threaded connecting block 214. The second driving motor 212 is arranged on one side of the second track mounting plate 205 and is fixedly connected to the second track mounting plate 205. One end of the second threaded rod 213 is fixedly connected to the output shaft of the second driving motor 212. The second threaded connecting block 214 is sleeved on the second threaded rod 213 and is threadedly connected to the second threaded rod 213. The second threaded rod 213 is rotatably connected to the second track mounting plate 205 through a pair of second bearing seats 215. The top of the second threaded connecting block 214 is detachably connected to the bottom of the vacuum adsorption table 30.

[0132] The first drive motor 208 and the second drive motor 212 may be servo motors in the prior art.

[0133] When in use, the first threaded rod 209 can be driven by the first driving motor 208, thereby driving the first threaded connecting block 210 and the first sliding block 204, thereby driving the Y-direction moving platform 201 and the vacuum adsorption table 30 to move in the X direction, thereby realizing the movement of the black photo paper in the X direction; the second threaded rod 213 can be driven by the second driving motor 212, thereby driving the second threaded connecting block 214 and the second sliding block 207, thereby driving the vacuum adsorption table 30 to move in the Y direction, thereby realizing the movement of the black photo paper in the Y direction.

[0134] At the same time, the first track mounting plate 202 in the X-axis moving platform 200 is set on the mounting platform 10, and the bottom of the first track mounting plate 202 is slidably connected to the mounting platform 10, so that the XY moving platform 20 can be moved from under the field lens 51 to under the microscope camera 60 to form a match, which is convenient for etching of black photographic paper and collecting etching images.

[0135] like Figure 3 to Figure 4As shown, in order to facilitate the adjustment of the height of the field lens 51, this embodiment is improved on the basis of the above embodiment, and the difference from the above embodiment is that the Z-axis moving platform 40 includes a fixed mounting frame 400, a driving part 401, a rotating threaded rod 402, a threaded mounting block 403, a fixed mounting plate 404, a pair of fixed seats 405, a pair of guide slide bars 406 and a pair of guide slide blocks 407. The fixed mounting frame 400 is arranged on the mounting platform 10 and is arranged in coordination with the XY moving platform 20. The pair of fixed seats 405 are fixedly arranged at the upper end of the fixed mounting frame 400, the rotating threaded rod 402 and the pair of guide slide bars 406 are arranged between the pair of fixed seats 405, and the rotating threaded rod 402 is located between the pair of guide slide bars 406. The two ends of the rotating threaded rod 402 are respectively It passes through a pair of fixed seats 405 and is rotatably connected to the fixed seats 405. Both ends of a pair of guide slide bars 406 are respectively fixedly connected to the pair of fixed seats 405. The driving unit 401 is arranged on one side of the fixed seat 405 located at the upper end, and the driving unit 401 is fixedly connected to the end of one end of the rotating threaded rod 402, and is used to drive the rotating threaded rod 402. The threaded mounting block 403 is sleeved on the rotating threaded rod 402 and is threadedly connected to the rotating threaded rod 402. A pair of guide slide bars 407 are respectively sleeved on the pair of guide slide bars 406 and are slidably connected to the guide slide bars 406. One side of the fixed mounting plate 404 is fixedly connected to the threaded mounting block 403 and the pair of guide slide bars 407. The laser galvanometer 50 can be installed on the fixed mounting plate 404 and is detachably connected to the fixed mounting plate 404.

[0136] The driving unit 401 may be a servo motor in the prior art.

[0137] When in use, the driving part 401 can drive the rotating threaded rod 402, thereby driving the threaded mounting block 403 and a pair of guide sliders 407, and then driving the fixed mounting plate 404 and the laser galvanometer 50 to move, thereby realizing the height adjustment of the laser galvanometer 50 and the field lens 51, and then facilitating the adjustment of the field lens 51 to confirm the appropriate distance between the field lens 51 and the black photo paper.

[0138] Working principle of the present invention:

[0139] In the process of installing and debugging the field lens 51 of the present invention, the technician no longer needs to frequently remove the black photographic paper from the vacuum adsorption platform, and manually adjust the microscope to measure the etching marks of the laser-etched black photographic paper. The field lens 51 adaptive debugging method described in the present invention can quickly confirm the appropriate distance between the field lens 51 and the black photographic paper, and quickly determine whether the installation position of the field lens 51 is appropriate and whether the field lens 51 is tilted at an angle. At the same time, when facing different cutting contours, the field lens 51 adaptive debugging method described in the present invention does not need to frequently remove the black photographic paper from the vacuum adsorption platform, and manually adjust the microscope to measure the size of the laser etching marks of the OLED screen to gradually adjust the cutting contour parameters. The present invention can quickly complete the correction of the cutting curve and adjust to the appropriate cutting contour parameters.

[0140] The above-mentioned embodiments only express the specific implementation of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A method for adaptively debugging a field lens, characterized in that: The following steps are involved: Step A: determining a suitable distance between the field lens (51) and the black photographic paper; Step A1: adsorbing black photo paper onto the vacuum adsorption table (30), and then moving the XY moving platform (20) to below the field mirror (51); adjusting the output power and pulse frequency of the laser galvanometer (50), and adjusting the output power and pulse frequency of the femtosecond laser (500) to 40% of that used for cutting the OLED screen; Step A2: Using the Z-direction moving platform (40) to adjust the limit process as the movement range, the field lens (51) is moved from the lowest position in the Z direction to the highest position. During the movement, when the field lens (51) moves z1mm in the Z direction, the black photographic paper moves y1mm in the Y direction, and a plurality of etching stripes with a length of b1mm are etched on the black photographic paper by laser; Step A3: moving the XY moving platform (20) to below the microscope camera (60), collecting images of etching stripes on the black photographic paper through the microscope camera (60), and calculating the width of each etching stripe through image processing; selecting the etching stripe with the smallest width, and giving the Z-direction height Z0 of the field lens (51) corresponding to the etching stripe with the smallest width; Step A4: Move the XY moving platform (20) to below the field lens (51), adjust the field lens (51) to a height Z0 via the Z moving platform (40), and then use a laser to etch a plurality of etching stripes with a length of b2 mm on the black photographic paper at a Z-direction movement of z2 mm and a Y-direction movement of y2 mm; Step A5: Move the XY moving platform (20) to below the microscope camera (60), collect images of etching stripes on the black photographic paper through the microscope camera (60), and calculate the width of each etching stripe through image processing; select the etching stripe with the smallest width, and give the Z-direction height Z1 of the field lens (51) corresponding to the etching stripe with the smallest width, where Z1 is the appropriate distance between the field lens (51) and the black photographic paper; Step B: determining whether the field mirror (51) is installed at an angle tilted; Step C: Cutting curve correction.

2. A method for adaptive debugging of a field lens according to claim 2, characterized in that: In steps A3 and A5, the image processing calculation process is: using the gray threshold to extract the image contour, calculating the number of pixels of two gray threshold boundary lines, and then calculating the width of each etching stripe. The calculation formula is as follows: The number of pixels is the number of pixels occupied by the etching stripes in the image, which can be obtained based on image analysis technology; the pixel size is the actual size corresponding to each pixel, which can be directly obtained based on the parameters of the microscope camera (60) used; and the objective lens magnification is the magnification of the microscope camera (60) used, which can be directly obtained based on the parameters of the microscope camera (60).

3. A method for adaptive debugging of a field lens according to claim 3, characterized in that: Step B: Determine whether the field mirror (51) is installed at an angle of inclination. The specific steps include: Step B1: adsorb the black photo paper onto the vacuum adsorption platform (30), then move the XY moving platform (20) to below the field lens (51), and adjust the field lens (51) to a height Z1 via the Z moving platform (40); Step B2: adjusting the output power and pulse frequency of the laser galvanometer (50), adjusting the output power of the femtosecond laser (500) to 40% of that used for cutting the OLED screen, and adjusting the pulse frequency to 10% of that used for cutting the OLED screen; Step B3: etching on black photographic paper along the contour of the field lens (51) with a maximum size of 200*200, to obtain a plurality of etching points distributed along the contour in a substantially circular shape; Step B4: Move the XY moving platform (20) to below the microscope camera (60), and collect images of approximately circular etching points on the black photographic paper through the microscope camera (60), and calculate the fitting circle diameters and roundnesses corresponding to a number of etching points through image processing, and then compare the fitting circle diameters, roundnesses and shapes corresponding to the etching points that are symmetrically distributed up and down and left and right. If the fitting circle diameters and roundnesses corresponding to the four etching points distributed diagonally are inconsistent, it means that the installation angle of the field lens (51) is tilted, and then adjust the installation angle of the field lens (51) according to the fitting circle diameters, roundnesses and shapes; In step B4, the image processing process is as follows: using the grayscale threshold to extract the image contour of the approximately circular etching point, then using two concentric circles and the image contour of the approximately circular etching point to generate a circumscribed circle and an inscribed circle, and calculating the circularity, then using the circle to fit the image contour of the approximately circular etching point, and calculating the diameter of the fitting circle; The roundness calculation formula is as follows: The formula for calculating the major axis length is: The formula for calculating the minor axis length is: The calculation formula of the fitting circle diameter is as follows: The number of pixels of the circumscribed circle diameter, the number of pixels of the inscribed circle diameter and the number of pixels of the circle diameter can be obtained by image analysis technology, the pixel size is the actual size corresponding to each pixel, which can be directly obtained according to the parameters of the microscope camera (60) used, and the objective lens magnification is the magnification of the microscope camera (60) used, which can be directly obtained according to the parameters of the microscope camera (60).

4. A method for adaptive debugging of a field lens according to claim 4, characterized in that: Step C: Cutting curve correction The specific steps include: Step C1: adsorb the black photo paper onto the vacuum adsorption platform (30), then move the XY moving platform (20) to below the field lens (51), and adjust the field lens (51) to a height Z1 via the Z moving platform (40); Step C2: adjusting the output power and pulse frequency of the laser galvanometer (50), adjusting the output power of the femtosecond laser (500) to 40% of that used for cutting the OLED screen, adjusting the pulse frequency to that used for cutting the OLED screen, and etching an etching line on the black photographic paper using a laser along the cutting contour line on the OLED screen drawing; Step C3: Move the XY moving platform (20) to below the microscope camera (60), and collect the image of the etching line on the black photographic paper through the microscope camera (60), extract the cutting curve image of the etching line using the grayscale threshold, and compare it with the cutting contour line on the OLED screen drawing, calculate the size difference between the cutting curve image and the cutting contour line on the OLED screen drawing, and then make corrections based on the size difference.

5. A field mirror adaptive debugging device, characterized in that: A method for adaptively debugging a field mirror applied to any one of claims 1 to 4, comprising: A mounting platform (10), the mounting platform (10) being used to mount an XY moving platform (20), a Z moving platform (40) and a microscope camera (60); An XY moving platform (20), the XY moving platform (20) is slidably arranged on the mounting platform (10) and is used to adjust the position of the vacuum adsorption platform (30) in the X and Y directions; A vacuum adsorption platform (30), which is arranged on the XY moving platform (20) and is used for adsorbing and fixing the black photographic paper; A Z-direction moving platform (40), which is arranged on the mounting platform (10) and is used to adjust the distance between the laser galvanometer (50) and the field lens (51) and the black photographic paper; A laser galvanometer (50), which is arranged on a Z-direction movable platform (40) and is used to emit laser light, and a field lens (51) can be installed below the laser galvanometer (50); A microscopic camera (60), which is arranged on the mounting platform (10) and is used to collect an image of etching stripes on the black photographic paper; The XY moving platform (20), the laser galvanometer (50) and the microscope camera (60) are arranged in coordination, the XY moving platform (20) can be moved to the bottom of the laser galvanometer (50), and can also be moved to the bottom of the microscope camera (60), the XY moving platform (20) comprises an X-moving platform (200) and a Y-moving platform (201), the X-moving platform (200) is slidably arranged on the mounting platform (10), the Y-moving platform (201) is arranged on the X-moving platform (200), and the vacuum adsorption platform (30) is arranged on the Y-moving platform (201); the laser galvanometer (50) comprises a femtosecond laser (500), a beam expander (501) and a galvanometer body (502) which are connected in sequence, the galvanometer body (502) is arranged on the Z-moving platform (40), and the field lens (51) can be installed below the galvanometer body (502).

6. The field mirror adaptive debugging device according to claim 5, characterized in that: The X-axis moving platform (200) comprises a first rail mounting plate (202), a first driving structure, a pair of first sliding rails (203) and at least one pair of first sliding blocks (204); the first rail mounting plate (202) is arranged on the mounting platform (10), and the bottom of the first rail mounting plate (202) is slidably connected to the mounting platform (10); the pair of first sliding rails (203) are arranged on the first rail mounting plate (202); at least one pair of first sliding blocks (204) are respectively arranged on the pair of first sliding rails (203) and are slidably connected to the first sliding rails (203); and the first driving structure is arranged on the first rail mounting plate (202) and is located between the pair of first sliding rails (203).

7. The field mirror adaptive debugging device according to claim 6, characterized in that: The Y-axis moving platform (201) comprises a second track mounting plate (205), a second driving structure, a pair of second sliding rails (206) and at least one pair of second sliding blocks (207); the second track mounting plate (205) is arranged on at least one pair of first sliding blocks (204) and is detachably connected to the first sliding blocks (204); one end of the first driving structure is detachably connected to the bottom of the second track mounting plate (205) and is used to drive the second track mounting plate (205) to slide along the pair of first sliding rails (203); the pair of second sliding rails (206) are arranged on the second track mounting plate (20 5), at least one pair of second sliding blocks (207) are respectively arranged on a pair of second sliding rails (206) and are slidably connected to the second sliding rails (206), a second driving structure is arranged on the second rail mounting plate (205) and is located between the pair of second sliding rails (206), a vacuum adsorption platform (30) is arranged on at least one pair of second sliding blocks (207) and is detachably connected to the second sliding blocks (207), and one end of the second driving structure is detachably connected to the bottom of the vacuum adsorption platform (30) and is used to drive the vacuum adsorption platform (30) to slide along the pair of second sliding rails (206).

8. The field mirror adaptive debugging device according to claim 7, characterized in that: The first driving structure comprises a first driving motor (208), a first threaded rod (209) and a first threaded connection block (210); the first driving motor (208) is arranged on one side of the first track mounting plate (202) and is fixedly connected to the first track mounting plate (202); one end of the first threaded rod (209) is fixedly connected to the output shaft of the first driving motor (208); the first threaded connection block (210) is sleeved on the first threaded rod (209) and is threadedly connected to the first threaded rod (209); the first threaded rod (209) is rotatably connected to the first track mounting plate (202) via a pair of first bearing seats (211); and the top of the first threaded connection block (210) is detachably connected to the bottom of the second track mounting plate (205).

9. The field mirror adaptive debugging device according to claim 8, characterized in that: The second driving structure comprises a second driving motor (212), a second threaded rod (213) and a second threaded connection block (214); the second driving motor (212) is arranged on one side of the second track mounting plate (205) and is fixedly connected to the second track mounting plate (205); one end of the second threaded rod (213) is fixedly connected to the output shaft of the second driving motor (212); the second threaded connection block (214) is sleeved on the second threaded rod (213) and is threadedly connected to the second threaded rod (213); the second threaded rod (213) is rotatably connected to the second track mounting plate (205) via a pair of second bearing seats (215); and the top of the second threaded connection block (214) is detachably connected to the bottom of the vacuum adsorption table (30).

10. The field mirror adaptive debugging device according to claim 9, characterized in that: The Z-axis moving platform (40) comprises a fixed mounting frame (400), a driving part (401), a rotating threaded rod (402), a threaded mounting block (403), a fixed mounting plate (404), a pair of fixed seats (405), a pair of guide slide bars (406) and a pair of guide slide blocks (407). The fixed mounting frame (400) is arranged on the mounting platform (10) and is arranged in cooperation with the XY moving platform (20). The pair of fixed seats (405) are fixedly arranged on the upper end of the fixed mounting frame (400). The rotating threaded rod (402) and the pair of guide slide bars (406) are arranged between the pair of fixed seats (405), and the rotating threaded rod (402) is located between the pair of guide slide bars (406). The two ends of the rotating threaded rod (402) respectively pass through the pair of fixed seats (405) and are rotatably connected to the fixed seats (405). The two ends of a pair of guide slide bars (406) are respectively fixedly connected to a pair of fixed seats (405), the driving part (401) is arranged on one side of the fixed seat (405) located at the upper end, and the driving part (401) is fixedly connected to the end of one end of the rotating threaded rod (402) for driving the rotating threaded rod (402), the threaded mounting block (403) is sleeved on the rotating threaded rod (402) and is threadedly connected to the rotating threaded rod (402), a pair of guide slide blocks (407) are respectively sleeved on the pair of guide slide bars (406) and are slidably connected to the guide slide bars (406), one side of the fixed mounting plate (404) is fixedly connected to the threaded mounting block (403) and the pair of guide slide blocks (407), and the laser galvanometer (50) can be installed on the fixed mounting plate (404) and is detachably connected to the fixed mounting plate (404).

Images