A method, apparatus and readable storage medium for flat lapping

Abstract

The application provides a planar polishing method, device and readable storage medium, the method comprising: obtaining coordinate information of a polished object surface through a 3D camera; screening a polishing area according to height information in the coordinate information; setting an overall polishing path according to the screened polishing area; planning a specific polishing route for each polishing area according to a contact area of a polishing tool and the polished object; setting the size of force and the residence time for each contact polishing on the specific polishing route according to the influence of the size of force on the speed of polishing depth and the measured height information corresponding to the contact area of the polishing tool and the polished object. The method, device and readable storage medium can solve the problem that the existing constant force floating device needs to accurately adjust the size of force to balance the accuracy and efficiency during the polishing process, which is difficult, and the accuracy of the measured height information is not high during the polishing process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of polishing, in particular to a planar polishing method, device and readable storage medium. BACKGROUND

[0002] The constant force floating device is mainly based on the force analysis of the traditional polishing, mainly including five ways of milling, peripheral grinding, end face flat grinding, end face angle polishing and planar eccentric polishing. The constant force polishing is realized by combining the high flexibility and high automation of the robot, the development of flexible polishing, the ordinary cylinder, the servo cylinder and the servo electric cylinder to realize the axial floating, the floating device to complete the radial floating, and the six-axis torque sensor and the self-weight compensation to further guarantee the constant force polishing. It is the mainstream solution of flexible polishing at present.

[0003] However, the existing constant force floating device needs to accurately adjust the size of the force during the polishing process to balance the accuracy and efficiency, which is difficult. At the same time, the height information measured by the existing constant force floating device during the polishing process is not accurate. SUMMARY

[0004] The technical problem to be solved by the present application is to solve the above-mentioned problems of the prior art, that is, to provide a planar polishing method, device and readable storage medium, which can solve the problem that the existing constant force floating device needs to accurately adjust the size of the force during the polishing process to balance the accuracy and efficiency, which is difficult, and the height information measured during the polishing process is not accurate.

[0005] In a first aspect, the present application provides a planar polishing method, which comprises:

[0006] acquiring coordinate information of the surface of the object to be polished by a 3D camera;

[0007] screening the area to be polished according to the height information in the coordinate information;

[0008] setting an overall polishing path according to the screened polishing area;

[0009] planning a specific polishing route for each polishing area according to the contact area of the grinding tool and the object to be polished;

[0010] According to the influence of the size of the force on the speed of the polishing depth, and combining the measured height information corresponding to the contact area of the grinding tool and the object to be polished, the size of the force and the residence time are set for each contact polishing on the specific polishing route for each polishing area;

[0011] The polishing path, the specific polishing route of each polishing area, and the force and dwell time of each contact polishing setting on the specific polishing route are sent to the robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete the corresponding plane polishing work according to the polishing path, the specific polishing route of each polishing area, and the force and dwell time of each contact polishing setting on the specific polishing route.

[0012] Further, the coordinate information of the surface of the object to be polished is obtained by a 3D camera, specifically including:

[0013] The surface information of the object to be polished is collected by a 3D camera;

[0014] The collected surface information is converted into coordinate information.

[0015] Further, the 3D camera is based on a line structured light mode, and before the surface information of the object to be polished is collected by the 3D camera, the method further includes:

[0016] According to the accuracy requirement of polishing, the sampling points and sampling intervals of the line structured light of the 3D camera are set.

[0017] Further, the 3D camera is arranged on a trolley, and the surface information of the object to be polished is collected by the 3D camera, specifically including:

[0018] According to the initial center point of the 3D camera or the trolley, a control instruction is sent to the robot control cabinet, and the control instruction is used to control the trolley to move and scan the entire object to be polished, so that the 3D camera collects the surface information of the object to be polished.

[0019] Further, the overall polishing path is set according to the screened polishing area, specifically including:

[0020] The object to be polished is divided into four quadrants;

[0021] The polishing path planning is performed in the preset order, and for the polishing route planning in any quadrant, the polishing route planning can be planned according to the order of X axis from small to large and Y axis from small to large, and the planning is performed by connecting the maximum value point of the X axis of the last polishing area to the minimum value point of the X axis of the next polishing area.

[0022] Further, the specific polishing route is planned according to the order of X axis from small to large and Y axis from small to large.

[0023] Further, the specific polishing path for each polishing area sets the force size and residence time for each contact polishing on the specific polishing path according to the influence of force size on the speed of polishing depth, combined with the height information corresponding to the measured contact area of the polishing tool and the polished object, at the same time or after setting the force size and residence time, the method further comprises:

[0024] Planning the force size and residence time of the constant force floating device in the movement process from the last contact of the polishing tool and the polished object to the next contact of the polishing tool and the polished object;

[0025] Sending the force size and residence time of the constant force floating device in the movement process to the robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete the corresponding adjustment and movement operation according to the force size and residence time of the constant force floating device in the movement process.

[0026] In the second aspect, the present application provides a device for planar polishing, comprising:

[0027] A coordinate information acquisition module for acquiring coordinate information of the surface of the polished object through a 3D camera;

[0028] A polishing area screening module connected with the coordinate information acquisition module, for screening the areas needing polishing according to the height information in the coordinate information;

[0029] A polishing path planning module connected with the polishing area screening module, for setting the overall polishing path according to the screened polishing areas;

[0030] A polishing path planning module connected with the polishing path planning module, for planning the specific polishing path of each polishing area according to the contact area of the polishing tool and the polished object;

[0031] A contact polishing setting module connected with the polishing path planning module, for setting the force size and residence time for each contact polishing on the specific polishing path of each polishing area according to the influence of force size on the speed of polishing depth, combined with the height information corresponding to the measured contact area of the polishing tool and the polished object;

[0032] A planar polishing module connected with the contact polishing setting module, for sending the polishing path, the specific polishing path of each polishing area, and the force size and residence time set for each contact polishing on the specific polishing path to the robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete the corresponding planar polishing work according to the polishing path, the specific polishing path of each polishing area, and the force size and residence time set for each contact polishing on the specific polishing path.

[0033] In a third aspect, the present application provides a device for planar polishing, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to implement the planar polishing method of the first aspect.

[0034] In a fourth aspect, the present application provides a computer readable storage medium, wherein the computer readable storage medium stores a computer program, and the computer program is executed by a processor to implement the planar polishing method of the first aspect.

[0035] The planar polishing method, device and readable storage medium provided by the present application first acquire coordinate information of a surface of an object to be polished by a 3D camera, and filter out polishing areas according to height information in the coordinate information; then set an overall polishing path according to the filtered polishing areas; further plan specific polishing routes for each polishing area according to a contact area between a polishing tool and the object to be polished; finally, according to the influence of the size of force on the speed of polishing depth, and in combination with the measured height information corresponding to the contact area between the polishing tool and the object to be polished, set the size of force and the residence time for each contact polishing on the specific polishing route for each polishing area; and send the polishing path, the specific polishing route for each polishing area, and the size of force and the residence time set for each contact polishing on the specific polishing route to a robot control cabinet, so that the robot control cabinet controls a constant force floating device and a robot to complete corresponding planar polishing work according to the polishing path, the specific polishing route for each polishing area, and the size of force and the residence time set for each contact polishing on the specific polishing route. The present application identifies the polishing areas to be polished by 3D camera machine vision, and accurately obtains height information, so as to plan a path, and comprehensively consider multiple factors such as the contact area between the polishing tool and the object to be polished and the influence of the size of force on the speed of polishing depth to adjust the size of force of the constant force floating device, thereby improving the flexibility and the polishing efficiency, solving the problem that the existing constant force floating device needs to accurately adjust the size of force to balance the accuracy and the efficiency, which is difficult, and the problem that the accuracy of the measured height information is not high during polishing. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 A flowchart of a planar polishing method according to Embodiment 1 of the present application;

[0037] Figure 2 A schematic diagram of a linkage mode of a robot and a constant force floating device according to the present application;

[0038] Figure 3 A side view of a 3D camera deployment mode according to the present application;

[0039] Figure 4 A top view of a 3D camera deployment for an embodiment of the present application;

[0040] Figure 5 A schematic diagram of a polishing path plan for an embodiment of the present application;

[0041] Figure 6 A schematic diagram of a specific polishing path plan for an embodiment of the present application;

[0042] Figure 7 An architectural diagram of a flat polishing system for an embodiment of the present application;

[0043] Figure 8 A structural schematic diagram of a flat polishing device for an embodiment 2 of the present application;

[0044] Figure 9 A structural schematic diagram of a flat polishing device for an embodiment 3 of the present application. DETAILED DESCRIPTION

[0045] In order to make the technical solution of the present application better understood by those skilled in the art, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0046] It can be understood that the specific embodiments and drawings described herein are only used to explain the present application, but not to limit the present application.

[0047] It can be understood that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0048] It can be understood that, for the convenience of description, only the parts related to the present application are shown in the drawings of the present application, and the parts unrelated to the present application are not shown in the drawings.

[0049] It can be understood that each unit and module involved in the embodiments of the present application can only correspond to one entity structure, or can be composed of multiple entity structures, or multiple units and modules can also be integrated into one entity structure.

[0050] It can be understood that the terms "first", "second" and the like in the embodiments of the present application are used to distinguish different objects, or to distinguish different treatments of the same object, but not to describe a specific order of the object.

[0051] It can be understood that the functions and steps marked in the flowcharts and block diagrams of the present application can occur in an order different from that marked in the drawings without conflict.

[0052] It can be understood that the flowcharts and block diagrams of the present application show the possible implementation architecture, function and operation of the system, device, equipment and method according to the embodiments of the present application. Each block in the flowchart or block diagram can represent a unit, module, program segment, code, which contains executable instructions for implementing the specified function. Moreover, each block or combination of blocks in the block diagram and flowchart can be implemented by a hardware-based system for implementing the specified function, or by a combination of hardware and computer instructions.

[0053] It can be understood that the units and modules involved in the embodiments of the present application can be implemented by software or by hardware, for example, the units and modules can be located in a processor.

[0054] SUMMARY

[0055] The existing constant force floating device has the following technical problems in the polishing process:

[0056] 1. The constant force floating device needs to accurately adjust the size of the force during the polishing process to balance the precision and efficiency, which is difficult.

[0057] The constant force floating device ensures that the force remains unchanged during the polishing process, and achieves the polishing requirements through repeated polishing. However, in actual work, the size of the force needs to be measured multiple times. If the force is too large, it may damage the polished object, and if the force is too small, it may slow down the polishing speed or increase the number of polishing times, reducing efficiency.

[0058] 2. The constant force floating device has low accuracy in measuring height information during the polishing process.

[0059] The constant force floating device connects the cylinder or electric cylinder with the displacement sensor to obtain real-time height information during polishing. Compared with the 3D camera measuring point coordinate height information, the constant force floating device can only obtain the height information of the contact surface of the polished object, and the information accuracy needs to be improved.

[0060] 3. The constant force floating device mainly relies on the teaching robot for path planning during polishing, and the flexibility needs to be improved.

[0061] Currently, in robot polishing, the constant force floating device is used as a terminal actuator, and the overall line planning still relies on the teaching robot for overall path planning. For non-standard parts polishing, the path needs to be re-taught, which is low in efficiency and needs to be improved in flexibility.

[0062] To address the aforementioned technical problems, this application proposes a method, apparatus, and readable storage medium for planar grinding. It utilizes 3D camera machine vision to identify the area to be ground, accurately obtaining height information for path planning. Simultaneously, it comprehensively considers factors such as the contact area between the grinding tool and the object being ground, and the speed and force influence on the grinding depth, adjusting the force of the constant-force floating device. This improves both flexibility and grinding efficiency, at least solving the problems of existing constant-force floating devices requiring precise force adjustment to balance accuracy and efficiency during grinding, which is challenging, and the low accuracy of height information measured during grinding.

[0063] After introducing the basic principles of this application, various non-limiting embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0064] Example 1:

[0065] This embodiment provides a method for surface polishing, such as... Figure 1 As shown, the method includes:

[0066] Step S101: Obtain the coordinate information of the surface of the object to be polished using a 3D camera.

[0067] It should be noted that the planar grinding method provided in this embodiment is designed for planar grinding scenarios. It combines a six-axis robot (hereinafter referred to as the robot), a constant-force floating device, line structured light, and 3D camera machine vision to identify the grinding area and finely plan the grinding path. Furthermore, by adjusting the magnitude of the force and the dwell time along the path and incorporating the height information fed back by the constant-force floating device, the degree of fine grinding is further improved. The connection method between the robot and the constant-force floating device can be as follows: Figure 2 As shown, the robot may include a base (1), joint 1 (2), waist link (3), joint 2 (4), upper arm link (5), joint 3 (6), forearm rear link (7), joint 4 (8), forearm front link (9), joint 5 (10), wrist link (11), joint 6 (12), and a constant force floating device (13) connected to joint 6 (12).

[0068] In this embodiment, the 3D camera can be deployed as follows: Figure 3 and 4 As shown, Figure 3 This is a side view of the 3D camera deployment method according to an embodiment of the present invention. Figure 4 This is a top view of the 3D camera deployment method according to an embodiment of the present invention, as shown below. Figure 3 As shown, the 3D camera (17) is mounted on the pulley carriage (18), which can be one or more. The pulley carriage (18) is slidably mounted on the top of the bracket (16), and the polishing table (14) and the object to be polished (15) are located inside the bracket (16).

[0069] Optionally, the obtaining the coordinate information of the surface of the object being polished by the 3D camera specifically comprises:

[0070] collecting the surface information of the object being polished by the 3D camera;

[0071] performing coordinate transformation on the collected surface information to obtain the coordinate information.

[0072] In the embodiment, the 3D camera collects the surface information of the object being polished by means of pre-set sampling points and sampling intervals.

[0073] Optionally, the 3D camera is based on a line structured light mode, and before the collecting the surface information of the object being polished by the 3D camera, the method further comprises:

[0074] setting the sampling points and sampling intervals of the line structured light of the 3D camera according to the accuracy requirement of polishing.

[0075] In the embodiment, in order to further avoid error factors, the application uses a line structured light as the light source of the 3D camera. The 3D camera based on the line structured light mode is composed of an optical projector, a camera and a computer system, i.e. a structured light three-dimensional vision system. The system projects a light beam to the object, the light strip is modulated due to the change of the depth of the object surface and possible gaps, and the distortion and discontinuity of the light strip occur in the image. The degree of distortion is proportional to the depth, and the three-dimensional information of the object surface is obtained from the distorted light strip image information. When the relative position between the optical projector and the camera is certain, the three-dimensional shape profile of the object surface can be reproduced from the distorted two-dimensional light strip image coordinates.

[0076] In the embodiment, the sampling points and sampling intervals of the line structured light of the 3D camera can be set according to the accuracy requirement of polishing.

[0077] Optionally, the 3D camera is arranged on the trolley, and the collecting the surface information of the object being polished by the 3D camera specifically comprises:

[0078] sending a control instruction to the robot control cabinet according to the initial center point position of the 3D camera or the trolley, the control instruction being used to control the trolley to move and scan the entire object being polished, so that the 3D camera collects the surface information of the object being polished.

[0079] In the embodiment, as shown in Figure 3 the control instruction is used to control the trolley (18) to move in the positive and negative directions of the X axis. At the same time of executing the movement, the 3D camera (17) set collects the surface information of the object (15) being polished located on the base of the polishing table (14) by means of the line structured light.

[0080] Step S102: filtering out the area to be polished according to the height information in the coordinate information.

[0081] In the embodiment, the coordinate information includes information of X axis, Y axis and Z axis, wherein X is length information, Y is width information and Z is height information. The area to be polished can be identified by filtering the Z axis information.

[0082] Step S103: setting the overall polishing path according to the filtered polishing area.

[0083] In the embodiment, the filtered polishing area is usually multiple, and the overall polishing path between the polishing areas needs to be planned first.

[0084] Optionally, the setting of the overall polishing path according to the filtered polishing area specifically includes:

[0085] dividing the object to be polished into four quadrants;

[0086] planning the polishing path in the order of the quadrants, wherein the polishing path planning in any quadrant can be planned in the order of X axis from small to large and Y axis from small to large, and the planning can be performed by connecting the maximum value point of the X axis of the previous polishing area to the minimum value point of the X axis of the next polishing area.

[0087] In the embodiment, in order to better plan the polishing path, the object to be polished is divided into four quadrants (i.e., the polishing plane is divided into four areas), and the polishing path is planned in the order of the quadrants. The order can be, for example, 1-2-3-4 quadrants, 3-4-1-2 quadrants, etc., which is not limited in the application.

[0088] In the embodiment, the polishing path planning in any quadrant can be planned in the order of X axis from small to large and Y axis from small to large, and the planning can be performed by connecting the maximum value point of the X axis of the previous polishing area to the minimum value point of the X axis of the next polishing area (if the X axes of the two polishing areas are the same, the Y axis is used to distinguish in the order of small to large), for example, Figure 5 FIG. 3 shows a schematic diagram of the polishing path planning of quadrant 3.

[0089] Step S104: planning the specific polishing route of each polishing area according to the contact area of the polishing tool and the object to be polished.

[0090] In the embodiment, in order to ensure that the polishing area is completely covered, the specific polishing route of each polishing area is planned according to the contact area of the polishing tool and the object to be polished, and the specific polishing route can be planned in the order of X axis from small to large and Y axis from small to large (X axis first).

[0091] Specifically, taking the flat end grinding as an example, the specific grinding route planning diagram can be as shown in FIG. 1, wherein the circular area represents the contact area of the grinding tool and the object to be ground, and the arrow represents the specific grinding route. Figure 6 The specific grinding route planning diagram of the first grinding area in quadrant 3 is shown in FIG. 2. Figure 6 The specific grinding route planning diagram of the first grinding area in quadrant 3 is shown in FIG. 2.

[0092] It should be noted that the grinding tool is the part in direct contact with the grinding area, that is, the end effector, and the constant force floating device is the mechanical equipment connected to the grinding tool, which ensures the consistency of the force when the end effector is in contact with the grinding area.

[0093] Step S105: For the specific grinding route of each grinding area, according to the influence of the size of the force on the speed of the grinding depth, combined with the measured height information corresponding to the contact area of the grinding tool and the object to be ground, the size of the force and the residence time for each contact grinding on the specific grinding route are set.

[0094] In this embodiment, the force includes axial force and radial force. Specifically, the influence of the axial force and the radial force on the speed in the grinding depth direction is comprehensively considered, combined with the difference in grinding mode such as flat end grinding, end face angle grinding, flat eccentric grinding, and circular grinding, and the size of the axial force and the radial force and the residence time are set according to the corresponding height of each contact area of the grinding tool and the object to be ground in the grinding area, so that the traditional constant force floating device is converted into variable force grinding in the overall grinding process through the setting of the size of the force at different points, so as to improve the degree and efficiency of flexible grinding.

[0095] Step S106: The grinding path, the specific grinding route of each grinding area, and the size of the force and the residence time set for each contact grinding on the specific grinding route are sent to the robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete the corresponding flat grinding work according to the grinding path, the specific grinding route of each grinding area, and the size of the force and the residence time set for each contact grinding on the specific grinding route.

[0096] In this embodiment, the constant force floating device is mainly responsible for adjusting the size of the axial force and the radial force, and the robot is mainly responsible for the movement process of the constant force floating device.

[0097] Optionally, at the same time or after the step of setting the size of the force and the residence time for each contact grinding on the specific grinding route according to the influence of the size of the force on the speed of the grinding depth and combined with the measured height information corresponding to the contact area of the grinding tool and the object to be ground, the method further comprises:

[0098] The force and the staying time of the constant force floating device during the movement from the last contact of the grinding tool with the object to the next contact of the grinding tool with the object are planned;

[0099] The force and the staying time of the constant force floating device during the movement from the last contact of the grinding tool with the object to the next contact of the grinding tool with the object are planned;

[0100] In the embodiment, in order to further improve the flexible polishing degree and efficiency, the force and the staying time of the constant force floating device during the movement from the last contact of the grinding tool with the object to the next contact of the grinding tool with the object are planned while the force and the staying time of the constant force floating device are set according to the corresponding height of the contact area of the grinding tool with the object in the polishing area, so that the setting of the force of the traditional constant force floating device through different points is converted into variable force polishing in the whole polishing process.

[0101] The application realizes the identification of the polishing area, the planning of the polishing path and the specific polishing route by the support, the trolley, and the 3D camera group, and sets the axial force and the radial force and the staying time for each contact of the terminal mold with the object in the polishing process in combination with the height information, and realizes the constant force keeping of each contact process by the constant force floating device, so as to form the whole variable force polishing capacity and further improve the flexible polishing degree and efficiency.

[0102] In a specific embodiment, the planar polishing method can include the following steps:

[0103] 1. Setting the line structured light sampling point and the sampling interval according to the polishing requirement;

[0104] 2. Taking the initial center point of the 3D camera as the origin, controlling the trolley to move and scan the whole object (such as a steel plate) to be polished, and collecting the coordinate information.

[0105] 3. Screening according to the height information to identify the area to be polished.

[0106] 4. Setting the whole polishing path according to the screened polishing area.

[0107] 5. Planning the specific polishing route according to the area to be polished and the contact area of the terminal grinding tool with the object to be polished.

[0108] 6. Considering the influence of the force on the polishing depth and the time factor, setting the staying time and the force for each contact polishing on the route in combination with the measured depth information (i.e. the height information);

[0109] 7. The accurate coordinates are sent to the robot control cabinet, and the robot control cabinet sends instructions to control the floating constant force device to complete the corresponding polishing work.

[0110] In another specific embodiment, the planar polishing method is applied to a planar polishing system as shown in Figure 7 The system includes a 3D camera (17), a pulley trolley (18), a gateway (19), a visual server (20), a computing server (21), a robot control cabinet (22), a robot (23), and a constant force floating device (13). The visual server (20) and the computing server (21) can be combined or independently set. The planar polishing method can include the following steps:

[0111] 1. According to the polishing accuracy requirement, set the sampling points and sampling interval of the line structured light.

[0112] 2. At the initial position, the position of the pulley trolley (18) is located at the center of the polishing table (14) in the X-axis direction, and the center point of the 3D camera (17) line structured light is located at the center of the support (16) in the Y-axis direction. The X-axis and Y-axis coordinates are used as the origin of the machine vision coordinate information for data collection. The computing server (21) sends the pulley trolley (18) movement trajectory command to the robot control cabinet (22) according to the initial position of the pulley trolley (18), and then controls the pulley trolley (18) to execute the movement. At the same time of executing the movement, the 3D camera group collects the surface information of the polished object (15) located on the polishing table (14) base by means of the line structured light, and the visual server (20) processes the collected surface information for coordinate transformation.

[0113] 3. The visual server (20) transmits the collected polished object surface coordinate information to the computing server (21), and the computing server (21) filters according to the height information to select the polishing area.

[0114] 4. The computing server (21) plans the polishing path according to the selected polishing area, which can be divided into four quadrants according to the origin position described in 2, and the path planning is performed in the order of 1-2-3-4. For the polishing path planning in any quadrant, the X-axis is from small to large and the Y-axis is from small to large, and the connection line from the X-axis maximum point of the previous polishing area to the X-axis minimum point of the next polishing area is used for planning (if the X-axis of the two polishing areas is the same, the Y-axis is used for differentiation from small to large).

[0115] 5、The operation server (21) plans the specific polishing route of the polishing area according to the contact area between the terminal polishing tool and the polished object, guarantees the full coverage of the polishing area, and plans the specific polishing route according to the order of X-axis from small to large and Y-axis from small to large (X-axis priority).

[0116] 6、The influence of the axial force and the radial force on the speed of the polishing depth direction is comprehensively considered, the difference between the polishing methods such as flat end polishing, end face angle polishing, flat eccentric polishing, and circumferential polishing is combined, the size of the force and the residence time are set according to the corresponding height of the contact area between the polishing tool and the polished object in the polishing area, and the size of the corresponding force and the residence time of the constant force floating device during the movement from the contact between the last polishing tool and the polished object to the contact between the next polishing tool and the polished object are planned according to the calculation, thereby converting the setting of the size of the force at different points of the traditional constant force floating device into variable force polishing in the whole polishing process.

[0117] 7、The operation server (21) transmits the calculated polishing path, the action trajectory in the polishing area (i.e. the specific polishing route), and the size of the force and the residence time of each step in the trajectory to the robot control cabinet (22), and then sends instructions to control the constant force floating device (13) and the robot (23) by the robot control cabinet (22), wherein the constant force floating device (13) is mainly responsible for adjusting the size of the force, and the adjustment includes the axial force and the radial force, and the robot (23) is mainly responsible for the movement process of the constant force floating device (13).

[0118] The planar polishing method provided in this invention first acquires the coordinate information of the surface of the object to be polished using a 3D camera, and then filters out the areas to be polished based on the height information in the coordinate information. Next, an overall polishing path is set according to the selected polishing areas. Then, a specific polishing route is planned for each polishing area based on the contact area between the grinding tool and the object being polished. Finally, for each specific polishing route in each polishing area, based on the speed effect of force on polishing depth, and combined with the measured height information corresponding to the contact area between the grinding tool and the object being polished, the magnitude of the force and the dwell time are set for each contact polishing step on the specific polishing route. The polishing path, the specific polishing route for each polishing area, and the set force and dwell time for each contact polishing step on the specific polishing route are then sent to the robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete the corresponding planar polishing work according to the polishing path, the specific polishing route for each polishing area, and the set force and dwell time for each contact polishing step on the specific polishing route. This invention uses 3D camera machine vision to identify the area to be polished, accurately obtain height information, and then plan the path. At the same time, it comprehensively considers multiple factors such as the contact area between the grinding tool and the object being polished, and the speed effect of the force on the polishing depth, to adjust the constant force floating device. This improves both flexibility and polishing efficiency, solving the problem that existing constant force floating devices require precise adjustment of the force during the polishing process to balance accuracy and efficiency, which is difficult, and that the height information measured during the polishing process is not very accurate.

[0119] Example 2:

[0120] like Figure 8 As shown, this embodiment provides a surface grinding apparatus for performing the above-described surface grinding method, including:

[0121] The coordinate information acquisition module 11 is used to acquire the coordinate information of the surface of the object being polished through a 3D camera;

[0122] The grinding area filtering module 12 is connected to the coordinate information acquisition module 11 and is used to filter out the area to be ground based on the height information in the coordinate information.

[0123] The grinding path planning module 13 is connected to the grinding area filtering module 12 and is used to set the overall grinding path according to the filtered grinding area.

[0124] The grinding route planning module 14 is connected to the grinding path planning module 13 and is used to plan the specific grinding route for each grinding area based on the contact area between the grinding tool and the object being ground.

[0125] The contact polishing setting module 15 is connected with the polishing path planning module 14, and is configured to set the force and the residence time for each contact polishing on the specific polishing path of each polishing area according to the influence of the force on the polishing depth and the height information corresponding to the contact area between the polishing tool and the object to be polished.

[0126] The planar polishing module 16 is connected with the contact polishing setting module 15, and is configured to send the polishing path, the specific polishing path of each polishing area and the force and the residence time set for each contact polishing on the specific polishing path to the robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete the corresponding planar polishing work according to the polishing path, the specific polishing path of each polishing area and the force and the residence time set for each contact polishing on the specific polishing path.

[0127] Optionally, the coordinate information acquisition module 11 comprises:

[0128] The acquisition unit is configured to acquire the surface information of the object to be polished by the 3D camera.

[0129] The conversion unit is configured to convert the acquired surface information to obtain the coordinate information.

[0130] Optionally, the 3D camera is based on a line structured light mode, and the device further comprises:

[0131] The sampling setting module is configured to set the sampling points and the sampling interval of the line structured light of the 3D camera according to the polishing accuracy requirement.

[0132] Optionally, the 3D camera is arranged on the trolley, and the acquisition unit is specifically configured to:

[0133] The control instruction is sent to the robot control cabinet according to the initial center point of the 3D camera or the trolley, and the control instruction is configured to control the trolley to move and scan the entire object to be polished, so that the 3D camera acquires the surface information of the object to be polished.

[0134] Optionally, the polishing path planning module 13 comprises:

[0135] The division unit is configured to divide the object to be polished into four quadrants.

[0136] The planning unit is configured to plan the polishing path in the quadrants in a preset order, wherein the polishing path planning in any quadrant can be performed according to the order of the X axis from small to large and the Y axis from small to large, and the planning is performed by connecting the maximum value point of the X axis of the last polishing area to the minimum value point of the X axis of the next polishing area.

[0137] Optionally, the specific polishing route is planned according to the order from small to large along the X axis and from small to large along the Y axis.

[0138] Optionally, the device further comprises:

[0139] a movement planning module, configured to plan the size of the force corresponding to the constant force floating device and the residence time in the movement process from the contact of the last grinding tool with the object to be polished to the contact of the next grinding tool with the object to be polished;

[0140] an adjustment movement module, configured to send the size of the force corresponding to the constant force floating device and the residence time in the movement process to a robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete corresponding adjustment and movement operations according to the size of the force corresponding to the constant force floating device and the residence time in the movement process.

[0141] Embodiment 3:

[0142] Reference Figure 9 The embodiment provides a device for planar polishing, which comprises a memory 21 and a processor 22, the memory 21 stores a computer program, and the processor 22 is configured to execute the computer program to perform the planar polishing method in the embodiment 1.

[0143] The memory 21 is connected with the processor 22, the memory 21 can adopt a flash memory or a read-only memory or other memories, and the processor 22 can adopt a central processing unit or a single-chip microcomputer.

[0144] Embodiment 4:

[0145] The embodiment provides a computer readable storage medium, and the computer readable storage medium stores a computer program, and the computer program is executed by a processor to realize the planar polishing method in the above embodiment 1.

[0146] The computer-readable storage medium includes volatile or non-volatile, removable or non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, computer program modules or other data. The computer-readable storage medium includes, but is not limited to, RAM (Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable read only memory), flash memory or other memory technology, CD-ROM (Compact Disc Read-Only Memory), digital versatile disc (DVD) or other optical disc storage, magnetic cassette, magnetic tape, magnetic disk storage or other magnetic storage device, or any other medium that can be used to store desired information and can be accessed by a computer.

[0147] In summary, the method and device for planar polishing and the readable storage medium provided by the embodiments of the present application first acquire the coordinate information of the surface of the object to be polished by a 3D camera, and filter out the polishing area according to the height information in the coordinate information; then set the overall polishing path according to the filtered polishing area; then plan the specific polishing route of each polishing area according to the contact area of the polishing tool and the object to be polished; finally, according to the influence of the force on the polishing depth, and in combination with the height information corresponding to the contact area of the polishing tool and the object to be polished, set the force and the residence time for each contact polishing on the specific polishing route for the specific polishing route of each polishing area; and send the polishing path, the specific polishing route of each polishing area and the force and the residence time set for each contact polishing on the specific polishing route to the robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete the corresponding planar polishing work according to the polishing path, the specific polishing route of each polishing area and the force and the residence time set for each contact polishing on the specific polishing route. The present application identifies the polishing area by 3D camera machine vision, and accurately obtains the height information, so as to plan the path, and comprehensively considers the contact area of the polishing tool and the object to be polished and the influence of the force on the polishing depth, so as to adjust the force of the constant force floating device, improve the flexibility and the polishing efficiency, solve the problem that the constant force floating device needs to accurately adjust the force to balance the accuracy and the efficiency in the polishing process, and improve the accuracy of the height information measured in the polishing process.

[0148] It is understood that the above embodiments are only exemplary for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the present application, and these modifications and improvements are also considered as the protection scope of the present application.

Claims

1. A method of flat lapping, characterized in that, The method comprises: Obtaining coordinate information of the surface of the object to be polished by a 3D camera, wherein the surface information of the object to be polished is collected by the 3D camera, and the collected surface information is coordinate-transformed to obtain the coordinate information; Filtering out the area to be polished according to the height information in the coordinate information; Setting an overall polishing path according to the filtered polishing area; Planning a specific polishing route for each polishing area according to the contact area of the grinding tool and the object to be polished; For the specific polishing route of each polishing area, according to the influence of the size of the force on the speed of the polishing depth, and combining the measured height information corresponding to the contact area of the grinding tool and the object to be polished, the size of the force and the residence time for each contact polishing on the specific polishing route are set, wherein the force includes axial force and radial force; The polishing path, the specific polishing route of each polishing area, and the size of the force and the residence time set for each contact polishing on the specific polishing route are sent to a robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete the corresponding planar polishing work according to the polishing path, the specific polishing route of each polishing area, and the size of the force and the residence time set for each contact polishing on the specific polishing route; The 3D camera is based on a line structured light mode, and before the surface information of the object to be polished is collected by the 3D camera, the method further comprises: Setting the sampling points and sampling intervals of the line structured light of the 3D camera according to the accuracy requirements of polishing.

2. The method of claim 1, wherein, The 3D camera is arranged on a trolley, and the surface information of the object to be polished is collected by the 3D camera, specifically comprising: Sending a control instruction to the robot control cabinet according to the initial center point of the 3D camera or the trolley, wherein the control instruction is used to control the trolley to move and scan the entire object to be polished, so that the 3D camera collects the surface information of the object to be polished.

3. The method of claim 1, wherein, The overall polishing path is set according to the filtered polishing area, specifically comprising: Dividing the object to be polished into four quadrants; According to a predetermined order, the quadrant is polished to plan a polishing path, wherein for any polishing route planning in a quadrant, the polishing route planning can be planned according to the order of X axis from small to large and Y axis from small to large, and the planning is performed by connecting the maximum X axis point of the last polishing area to the minimum X axis point of the next polishing area.

4. The method of claim 1, wherein, The specific polishing route is planned according to the order of X axis from small to large and Y axis from small to large.

5. The method of claim 1, wherein, For the specific polishing route of each polishing area, according to the influence of the size of the force on the speed of the polishing depth, and combining the measured height information corresponding to the contact area of the grinding tool and the object to be polished, the size of the force and the residence time for each contact polishing on the specific polishing route are set, wherein the force includes axial force and radial force; ​ The constant force floating device during the moving process sends the stress size and the residence time to the robot control cabinet, so that the robot control cabinet controls the constant force floating device and the robot to complete corresponding adjustment and moving operation according to the stress size and the residence time of the constant force floating device during the moving process.

6. A device for planarizing, characterized by The method comprises the steps of: The coordinate information acquisition module is configured to acquire coordinate information of a surface of the object to be polished by a 3D camera. The polishing area screening module is configured to screen a polishing area according to height information in the coordinate information. The polishing path planning module is configured to set an overall polishing path according to the screened polishing area. The polishing route planning module is configured to plan a specific polishing route for each polishing area according to a contact area of the polishing tool and the object to be polished. The contact polishing setting module is configured to set a force and a residence time for each contact polishing on the specific polishing route according to an influence of the force on a polishing depth speed and height information corresponding to the contact area of the polishing tool and the object to be polished. The planar polishing module is configured to send the polishing path, the specific polishing route of each polishing area, and the force and the residence time set for each contact polishing on the specific polishing route to a robot control cabinet, so that the robot control cabinet controls a constant force floating device and a robot to complete corresponding planar polishing work according to the polishing path, the specific polishing route of each polishing area, and the force and the residence time set for each contact polishing on the specific polishing route. The 3D camera is based on a line structured light mode, and the device further comprises: The sampling setting module is configured to set a sampling point and a sampling interval of the line structured light of the 3D camera according to polishing precision requirements.

7. A device for planarizing, characterized by The computer readable storage medium stores a computer program, and the computer program is executed by the processor to realize the planar polishing method of any one of claims 1-5.

8. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and the computer program is executed by the processor to realize the planar polishing method of any one of claims 1-5.

Images