Substrate processing apparatus and abnormality determination method

Abstract

A substrate processing apparatus and an abnormality determination method for determining an abnormality in handover of a substrate from a substrate holding device for substrate polishing processing to a transfer table. The substrate processing apparatus includes an abnormality determination unit that determines an abnormality based on a time difference between a first time when a first sensor detects that a substrate has been placed on a placement surface of a transfer table and a second time when a second sensor detects that the substrate has been placed on the placement surface. It is determined that the transfer of the substrate from the substrate holding device to the transfer table is abnormal.

Description

Technical Field

[0001] The invention relates to a substrate processing device and an abnormality determination method. Background Art

[0002] In the manufacturing process of semiconductor devices, a chemical mechanical polishing (CMP) device is used to flatten the surface of the substrate. The substrate used to manufacture semiconductor devices is in most cases in the shape of a circular plate. In addition, not only semiconductor devices, but also the requirements for flatness when flattening the surface of quadrilateral substrates such as CCL substrates (Copper Clad Laminate), PCB (Printed Circuit Board) substrates, mask substrates, and display panels are also increasing. In addition, the requirements for surface flattening of packaging substrates of electronic devices equipped with PCB substrates are also increasing.

[0003] In such a substrate processing device, in order to make the relative pressing force between the substrate being polished and the polishing surface of the polishing pad uniform or adjust the pressing force, a substrate holding device using an elastic film (film) is used. As an example, a pressure chamber formed by an elastic film (film) is provided at the lower part of a top ring as a substrate holding device, and by supplying gas such as air to the pressure chamber, the substrate is pressed against the polishing surface of the polishing pad and polished.

[0004] After the polishing process is completed, the substrate holding device moves to a position above the conveyor table while holding the substrate, and delivers the substrate to the conveyor table. As an example, the delivery of the substrate is performed by supplying gas to the pressure chamber while spraying gas to the gap between the substrate and the elastic membrane, so that the substrate is separated from the elastic membrane. The seating of the substrate on the conveyor table is detected by a plurality of sensors for detecting different positions of the substrate. The substrate placed on the conveyor table is delivered to the swing conveyor device and transported to the subsequent process.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2012-178608

[0008] Technical problem to be solved by the invention

[0009] In the above-mentioned substrate processing device, there is a case where damage or breakage of the substrate is detected in the swing conveyor. Since the swing conveyor conveys the substrate in multiple processing steps, when damage or breakage of the substrate is detected in the swing conveyor, it is confirmed in multiple processing steps respectively, and the maintenance processing becomes complicated. Here, such damage or breakage of the substrate sometimes occurs when the substrate is handed over from the substrate holding device to the conveyor table. According to the research of the inventors, it was found that especially when the elastic membrane of the substrate holding device deteriorates, there is a case where the substrate cannot be detached from the elastic membrane smoothly and the substrate is detached at an angle, thereby damaging or breaking the substrate. Summary of the invention

[0010] The present invention has been made in view of the above technical problems, and one of its objects is to provide a substrate processing apparatus and an abnormality determination method capable of determining abnormality in the transfer of a substrate from a substrate holding device for substrate polishing processing to a conveyor table.

[0011] Technical means for solving technical problems

[0012] According to one embodiment of the present invention, a substrate processing device is provided for performing a grinding process on a grinded surface of a substrate, the substrate processing device comprising: a grinding table for supporting a grinding pad; a substrate holding device having a substrate holding surface and a pressure chamber formed of an elastic film, configured to hold the substrate by the substrate holding surface and press the substrate against the grinding pad by the pressure in the pressure chamber; a conveying table having a loading surface for loading the substrate, configured to transfer the substrate from the substrate holding device to the loading surface by a substrate detachment action performed by the substrate holding device; a plurality of sensors, the plurality of sensors including a first sensor and a second sensor configured to detect different parts of the substrate, for detecting that the substrate has been loaded on the loading surface; and an abnormality determination unit, the abnormality determination unit determining an abnormality in the transfer of the substrate from the substrate holding device to the conveying table based on a time difference between a first moment when the first sensor detects that the substrate has been loaded on the loading surface and a second moment when the second sensor detects that the substrate has been loaded on the loading surface.

[0013] According to one embodiment of the present invention, an abnormality determination method is proposed to determine abnormality in the handover of a substrate in a substrate processing device, the substrate processing device comprising: a grinding table, the grinding table is used to support a grinding pad; a substrate holding device, the substrate holding device having a substrate holding surface and a pressure chamber composed of an elastic film, configured to hold the substrate by the substrate holding surface and press the substrate against the grinding pad by the pressure in the pressure chamber; and a conveying table, the conveying table having a loading surface for loading the substrate, configured to hand over the substrate from the substrate holding device to the loading surface by a detachment action of the substrate performed by the substrate holding device, the abnormality determination method comprising: when it is determined that the substrate has been loaded on the loading surface, based on a time difference between a first moment when a first portion of the substrate is detected to have been loaded on the loading surface and a second moment when a second portion of the substrate different from the first portion is detected to have been loaded on the loading surface, determining abnormality in the handover of the substrate from the substrate holding device to the conveying table. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a plan view showing the overall structure of a substrate processing apparatus according to one embodiment of the present invention.

[0015] Figure 2 It is a schematic diagram showing the structure of the polishing unit according to this embodiment.

[0016] Figure 3 It is a schematic cross-sectional view of a top ring constituting a substrate holding device that holds a wafer as a polishing object and presses it against a polishing surface on a polishing table.

[0017] Figure 4 This is a schematic diagram showing the substrate transfer device from above.

[0018] Figure 5A This is a schematic diagram showing a wafer delivery process from a top ring to a substrate delivery device.

[0019] Figure 5B This is a schematic diagram showing a wafer delivery process from a top ring to a substrate delivery device.

[0020] Figure 5C This is a schematic diagram showing a wafer delivery process from a top ring to a substrate delivery device.

[0021] Figure 6 This is a flowchart showing an example of abnormality determination in wafer transfer performed by the controller.

[0022] Figure 7 This is a timing chart showing an example of detection signals of each sensor in a normal state.

[0023] Figure 8 This is a timing chart showing an example of detection signals of each sensor in an abnormal state.

[0024] Fig. 9 This is a diagram showing an example of the time difference between the seating timings of each wafer.

[0025] Explanation of symbols

[0026] W…Whip

[0027] 2…Loading port

[0028] 3(3A~3D)…Grinding components

[0029] 4…Cleaning components

[0030] 5…Controller

[0031] 6…First linear conveyor

[0032] 7…Second linear conveyor

[0033] 10…Abrasive pad

[0034] 10a…Grinding surface

[0035] 22…Conveyor robot

[0036] 30…Grinding table

[0037] 31…Top ring (substrate holding device)

[0038] 32…Grinding liquid supply nozzle

[0039] 33…Finisher

[0040] 34…Atomizer

[0041] 202…Top ring body

[0042] 203…Retaining ring

[0043] 204…Membrane (elastic membrane)

[0044] 205…Central Room

[0045] 206…Corrugated Chamber

[0046] 207…External Room

[0047] 208…Edge Room

[0048] 209…Block ring pressurized chamber

[0049] 800…Substrate transfer device

[0050] 801...lift pin

[0051] 802…Release nozzle

[0052] 811~813…Sensor

[0053] 815…Light projection department

[0054] 816…Light receiving part

[0055] 820…Loading surface. DETAILED DESCRIPTION

[0056] Below, refer to the attached Figure 1 The following describes the embodiments of the substrate processing device and the abnormality determination method involved in the present invention. In the drawings, the same or similar elements are marked with the same or similar reference numerals, and the repeated description of the same or similar elements is sometimes omitted in the description of each embodiment. In addition, the features shown in each embodiment can also be applied to other embodiments as long as they do not contradict each other.

[0057] Figure 1 FIG. 1 is a top view showing the overall structure of a substrate processing apparatus according to an embodiment of the present invention. Figure 1 As shown, the substrate processing device has a substantially rectangular housing 1, the interior of which is divided by partitions 1a and 1b into a loading port 2, a polishing assembly 3, and a cleaning assembly 4. The loading port 2, the polishing assembly 3, and the cleaning assembly 4 are independently assembled and independently exhausted. In addition, the substrate processing device has a controller 5 for controlling the substrate processing operation.

[0058] The loading port 2 has two or more (four in this embodiment) front loading parts 20 on which a wafer box storing a plurality of wafers (an example of substrates) is placed. These front loading parts 20 are arranged adjacent to the housing 1 and arranged along the width direction (a direction perpendicular to the long side direction) of the substrate processing apparatus. An open box, a SMIF (Standard Manufacturing Interface) box, or a FOUP (Front Opening Unified Pod) can be mounted on the front loading part 20. In addition, although a circular semiconductor wafer is used as an example of a substrate for explanation in this embodiment, it is not limited to such an example, and a square substrate can also be used, for example.

[0059] In addition, the load port 2 is provided with a travel mechanism 21 extending along the arrangement of the front loading section 20. A conveying robot (loader) 22 that can move along the arrangement direction of the wafer box is provided on the travel mechanism 21. The conveying robot 22 can access the wafer box loaded on the front loading section 20 by moving on the travel mechanism 21. In the present embodiment, the conveying robot 22 has two hands, one above and one below. As an example, the conveying robot 22 uses the upper hand when returning the processed wafer to the wafer box, and uses the lower hand when taking out the wafer from the wafer box before processing.

[0060] The loading port 2 is a clean area, and the inside of the loading port 2 is maintained at a higher pressure than the outside of the substrate processing apparatus, the polishing unit 3, and the cleaning unit 4. The polishing unit 3 is a dirty area because slurry is used as the polishing liquid. Negative pressure is formed inside the polishing unit 3, and the pressure is maintained lower than the internal pressure of the cleaning unit 4.

[0061] The polishing unit 3 is an area where the wafer is polished (planarized), and includes a first polishing unit 3A, a second polishing unit 3B, a third polishing unit 3C, and a fourth polishing unit 3D. Figure 1 As shown, in this embodiment, the first grinding assembly 3A, the second grinding assembly 3B, the third grinding assembly 3C and the fourth grinding assembly 3D are arranged along the long side direction of the substrate processing device. In addition, the grinding assembly can also be provided with one, two, three or more than five. Since the first grinding assembly 3A, the second grinding assembly 3B, the third grinding assembly 3C and the fourth grinding assembly 3D have the same structure, only the first grinding assembly 3A will be described below.

[0062] The first polishing unit 3A includes a polishing table 30 on which a polishing pad 10 having a polishing surface is mounted, and a top ring (substrate holding device) 31 that holds a wafer and performs polishing while pressing the wafer against the polishing pad 10 on the polishing table 30. In addition, the first polishing unit 3A includes a polishing liquid supply nozzle 32 for supplying a polishing liquid or a dressing liquid (e.g., pure water) to the polishing pad 10, a dresser 33 for dressing the polishing surface of the polishing pad 10, and an atomizer 34 for spraying a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen) or a liquid (e.g., pure water) onto the polishing surface in a mist form.

[0063] Next, the conveying mechanism for conveying the wafer will be described. Figure 1As shown, a first linear transport device 6 is disposed adjacent to the first polishing assembly 3A and the second polishing assembly 3B. The first linear transport device 6 is a mechanism for transporting wafers between four transport positions (first transport position TP1, second transport position TP2, third transport position TP3, and fourth transport position TP4 in order from the load port side) along the direction in which the first polishing assembly 3A and the second polishing assembly 3B are arranged.

[0064] Furthermore, a second linear transporter 7 is disposed adjacent to the third polishing unit 3C and the fourth polishing unit 3D. The second linear transporter 7 is a mechanism for transporting wafers between three transport positions (the fifth transport position TP5, the sixth transport position TP6, and the seventh transport position TP7 in order from the load port side) along the direction in which the third polishing unit 3C and the fourth polishing unit 3D are arranged.

[0065] The wafer is transported to the first grinding assembly 3A and the second grinding assembly 3B by the first linear conveyor 6. The top ring 31 of the first grinding assembly 3A moves between the grinding position and the second conveying position TP2 by the swinging action of the top ring head. Then, the wafer is handed over to the top ring 31 at the second conveying position TP2. Similarly, the top ring 31 of the second grinding assembly 3B moves between the grinding position and the third conveying position TP3, and the wafer is handed over to the top ring 31 at the third conveying position TP3. The top ring 31 of the third grinding assembly 3C moves between the grinding position and the sixth conveying position TP6, and the wafer is handed over to the top ring 31 at the sixth conveying position TP6. The top ring 31 of the fourth grinding assembly 3D moves between the grinding position and the seventh conveying position TP7, and the wafer is handed over to the top ring 31 at the seventh conveying position TP7.

[0066] An elevator 11 for receiving wafers from the transport robot 22 is arranged at the first transport position TP1. The wafer is delivered from the transport robot 22 to the first linear transport device 6 via the elevator 11. A gate (not shown) is provided on the partition 1a between the elevator 11 and the transport robot 22. When the wafer is transported, the gate is opened and the wafer is delivered from the transport robot 22 to the elevator 11. In addition, a swing transport device 12 is arranged between the first linear transport device 6, the second linear transport device 7 and the cleaning component 4. The swing transport device 12 has a hand that can move between the fourth transport position TP4 and the fifth transport position TP5, and the wafer is delivered from the first linear transport device 6 to the second linear transport device 7 by the swing transport device 12. The wafer is transported to the third polishing component 3C and / or the fourth polishing component 3D by the second linear transport device 7. In addition, the wafer polished by the polishing component 3 is transported to the cleaning component 4 via the swing transport device 12.

[0067] Figure 22 is a schematic diagram showing the structure of the first polishing unit 3A according to the present embodiment. Figure 2 As shown, the first polishing assembly 3A includes a polishing table 30 and a top ring 31 that holds a substrate such as a wafer as a polishing object and presses it against the polishing surface on the polishing table. The polishing table 30 is connected to a motor (not shown) arranged below it via a polishing table shaft 30A, and can rotate around the polishing table shaft 30A. A polishing pad 10 is attached to the upper surface of the polishing table 30, and the polishing surface 10a of the polishing pad 10 constitutes the polishing surface of the polishing wafer W. A polishing liquid supply nozzle 32 is provided above the polishing table 30, and a polishing liquid Q is supplied to the polishing pad 10 on the polishing table 30 through the polishing liquid supply nozzle 32.

[0068] The top ring 31 includes a top ring body 202 for pressing the wafer W against the polishing surface 10 a and a retaining ring 203 for holding the outer peripheral edge of the wafer W so that the wafer W does not fall out of the top ring.

[0069] The top ring 31 is connected to a top ring shaft 111, and the top ring shaft 111 is moved up and down relative to the top ring head 110 by the up and down movement mechanism 124. The top ring 31 as a whole is lifted and lowered relative to the top ring head 110 and positioned by the up and down movement of the top ring shaft 111.

[0070] The vertical movement mechanism 124 for vertically moving the top ring shaft 111 and the top ring 31 includes: a bridge 128 that rotatably supports the top ring shaft 111 via a bearing 126 ; a ball screw 132 attached to the bridge 128 ; a support table 129 supported by a support column 130 ; and a servo motor 138 provided on the support table 129 .

[0071] The ball screw 132 includes a threaded shaft 132a connected to the servo motor 138 and a nut 132b screwed to the threaded shaft 132a. The top ring shaft 111 moves up and down integrally with the bridge 128. Therefore, when the servo motor 138 is driven, the bridge 128 moves up and down via the ball screw 132, and thereby the top ring shaft 111 and the top ring 31 move up and down.

[0072] The top ring shaft 111 is connected to the rotating cylinder 112 via a key (not shown). The rotating cylinder 112 has a timing pulley 113 on its outer circumference. A top ring rotating motor 114 is fixed to the top ring head 110, and the timing pulley 113 is connected to a timing pulley 116 provided on the top ring rotating motor 114 via a timing belt 115. Therefore, by rotating the top ring rotating motor 114, the rotating cylinder 112 and the top ring shaft 111 are rotated integrally via the timing pulley 116, the timing belt 115, and the timing pulley 113, and the top ring 31 is rotated. The top ring rotating motor 114 has an encoder 140. The encoder 140 has a function of detecting the rotation angle position of the top ring 31 and a function of accumulating the rotation speed of the top ring 31. In addition, a sensor for detecting the rotation angle "reference position (0 degrees)" of the top ring 31 may be separately provided. The top ring head 110 is supported by a top ring head shaft 117 rotatably supported by a frame (not shown). Each device in the apparatus, represented by the top ring rotation motor 114 , the servo motor 138 , and the encoder 140 , is controlled by the controller 5 .

[0073] exist Figure 2 In the first polishing unit 3A constructed as shown, the top ring 31 can hold a substrate such as a wafer W on its lower surface. The top ring head 110 is configured to be able to rotate around the top ring head axis 117, and the top ring 31 holding the wafer W on the lower surface is moved from the receiving position of the wafer W to the upper side of the polishing table 30 by the rotation of the top ring head 110. Then, the top ring 31 is lowered to press the wafer W against the surface (polishing surface) 10a of the polishing pad 10. At this time, the top ring 31 and the polishing table 30 are rotated respectively, and the polishing liquid is supplied to the polishing pad 10 from the polishing liquid supply nozzle 32 provided above the polishing table 30. In this way, the wafer W is brought into sliding contact with the polishing surface 10a of the polishing pad 10, and the surface of the wafer W is polished.

[0074] Next, the top ring (substrate holding device) 31 will be described in further detail. Figure 3 FIG. 1 is a schematic cross-sectional view of a top ring 31 constituting a substrate holding device that holds a wafer W as a polishing object and presses it against a polishing surface on a polishing table. Figure 3 In the figure, only the main components constituting the top ring 31 are shown.

[0075] like Figure 3As shown, the top ring 31 includes a top ring body 202, which presses the wafer W against the grinding surface 10a, and a retaining ring 203, which directly presses the grinding surface 10a. The top ring body 202 is composed of a roughly disc-shaped component, and the retaining ring 203 is installed on the outer periphery of the top ring body 202. The top ring body 202 is formed of a resin such as engineering plastics (for example, PEEK). A membrane (elastic membrane) 204 is installed on the lower surface of the top ring body 202 to abut against the back side of the wafer. The membrane 204 defines a pressure chamber and defines a substrate holding surface, and the lower surface of the substrate holding surface is in contact with the wafer W. The membrane 204 is formed of a rubber material with excellent strength and durability, such as ethylene propylene rubber (EPDM), polyurethane rubber, and silicone rubber.

[0076] As an example, in Figure 3 In the example shown, the membrane 204 has a plurality of concentric partitions 204a, and a circular center chamber 205, an annular bellows chamber 206, an annular outer chamber 207, and an annular edge chamber 208 are formed between the upper surface of the membrane 204 and the lower surface of the top ring body 202 through these partitions 204a. That is, the center chamber 205 is formed in the center portion of the top ring body 202, and the bellows chamber 206, the outer chamber 207, and the edge chamber 208 are concentrically formed in sequence from the center toward the periphery. The membrane 204 has a plurality of holes 204h that penetrate in the thickness direction of the elastic membrane for wafer adsorption in the bellows region (bellows chamber 206). Figure 3 In the example shown, the hole 204h is provided in the corrugated area, but it may be provided at a position outside the corrugated area. Figure 3 In the example shown, the film 204 has a plurality of concentric partition walls 204 a , but the invention is not limited to this example, and the partition walls may be provided so as to divide the film 204 into a plurality of regions in the circumferential direction, or the film 204 may not have the partition walls 204 a .

[0077] A flow path 211 communicating with the center chamber 205, a flow path 212 communicating with the bellows chamber 206, a flow path 213 communicating with the outer chamber 207, and a flow path 214 communicating with the edge chamber 208 are formed in the top ring body 202. The flow paths 211 to 214 are connected to flow paths 221 to 224 connected to a vacuum source and a pressure regulator (not shown) via a rotary joint 225.

[0078] In addition, a retaining ring pressurizing chamber 209 made of an elastic film is also formed directly above the retaining ring 203, and the retaining ring pressurizing chamber 209 is connected to a flow path 226 via a flow path 215 and a rotary joint 225 formed in the top ring body (carrier) 202. In addition, the flow path 226 is connected to a vacuum source and a pressure regulating unit (not shown).

[0079] In such a top ring 31, the pressures inside the center chamber 205, the bellows chamber 206, the outer chamber 207, the edge chamber 208, and the retaining ring pressurizing chamber 209 can be independently adjusted by the vacuum source and the pressure adjusting section. With such a structure, the pressing force of the wafer W against the polishing pad 10 can be adjusted for each region of the wafer W, and the pressing force of the retaining ring 203 against the polishing pad 10 can be adjusted.

[0080] right Figure 1 to Figure 3 A series of grinding processing steps of the substrate processing device constructed as shown in the figure are described. The top ring 31 receives the wafer W from the first linear conveyor 6 and holds it by vacuum adsorption. A plurality of holes 204h for vacuum adsorption of the wafer W are provided in the membrane 204, and these holes 204h are connected to a vacuum source not shown in the figure. The top ring 31 holding the wafer W by vacuum adsorption descends to a preset setting position of the top ring during grinding. At this setting position during grinding, the retaining ring 203 contacts the surface (grinding surface) 10a of the grinding pad 10, but before grinding, since the wafer W is held by adsorption by the top ring 31, there is a small gap (for example, about 1 mm) between the lower surface (grinded surface) of the wafer W and the surface (grinding surface) 10a of the grinding pad 10. Then, both the grinding table 30 and the top ring 31 are driven to rotate. In this state, the film 204 located on the back side of the chip W is expanded, so that the lower surface (grinded surface) of the chip abuts against the surface (grinding surface) of the grinding pad 10, and the grinding table 30 and the top ring 31 move relative to each other, thereby grinding until the surface (grinded surface) of the chip W becomes a specified state (for example, a specified film thickness).

[0081] After the wafer processing step on the polishing pad 10 is completed, the wafer W is adsorbed to the top ring 31, the top ring 31 is raised, and moved to the substrate delivery device 800 of the first linear conveyor 6 to detach (release) the wafer W. In addition, in the present embodiment, the first linear conveyor 6, the second linear conveyor 7, or the substrate delivery device 800 they have, which detach the wafer W, is equivalent to an example of a "transportation table".

[0082] Figure 4 is a schematic diagram showing the substrate transfer device 800 from above. Figure 5A to Figure 5C 1 is a schematic diagram showing the delivery process of the wafer W from the top ring 31 to the substrate delivery device 800. The substrate delivery device 800 has a mounting surface 820 for mounting the wafer W. In addition, the substrate delivery device 800 has a lifting pin 801 for lifting the retaining ring 203 of the top ring 31. The mounting surface 820 and the lifting pin 801 are configured to be able to move up and down respectively by a power source (not shown) such as a cylinder.

[0083] In addition, the substrate delivery device 800 of the present embodiment has three sensors 811 to 813 for detecting that the wafer W has been delivered from the top ring 31 to the mounting surface 820 (substrate delivery device 800). The sensors 811 to 813 are separately arranged along the circumferential direction of the wafer W to detect different parts of the wafer W. The detection signals of the sensors 811 to 813 are input to the controller 5. In addition, the substrate delivery device 800 preferably has at least two sensors for detecting that the wafer W has been delivered, and may also have four or more sensors.

[0084] like Figure 5A As shown in FIG. 8 , as an example, the sensor 811 includes a light projecting unit 815 and a light receiving unit 816. Figure 5A to Figure 5C In the figure, the sensors 812 and 813 are omitted, but the sensors 812 and 813 have the same structure as the sensor 811. The light projecting unit 815 is, for example, an optical fiber sensor that uses a flexible optical fiber cable as the light projecting unit of the photoelectronic sensor to miniaturize the detection head. The light receiving unit 816 is, for example, an optical fiber sensor that uses a flexible optical fiber cable as the light receiving unit of the photoelectronic sensor to miniaturize the detection head.

[0085] The light projecting unit 815 projects light in the direction of arrow A1 (see Figure 5A ). When the wafer W is not peeled off from the top ring 31, the light receiving portion 816 can receive the light projected from the light projecting portion 815. Figure 5C As shown, when the wafer W is separated from the top ring 31 and the wafer W is delivered to the mounting surface 820, the light projected from the light projecting unit 815 is blocked by the wafer W, and the light receiving unit 816 cannot detect the light. The controller 5 processes, for example, the time when the light receiving unit 816 cannot detect the light or the time when the light intensity detected by the light receiving unit 816 is lower than the threshold value as the time when the wafer W is detected. In addition, the light source of the light projecting unit 815 may be, for example, an LED, and the color of the light may be any color (for example, red, blue, green, white, etc.).

[0086] In addition, the substrate delivery device 800 of the present embodiment has, for example, three discharge nozzles 802 (see Figure 5A to Figure 5C The release nozzle 802 is connected to a pressurized fluid supply source (not shown), and the ejection of the pressurized fluid is controlled by the controller 5. However, the substrate delivery device 800 may have one, two, four or more release nozzles, or may not have a release nozzle.

[0087] Next, the operation of transferring the wafer W from the top ring 31 to the mounting surface 820 will be described. After the wafer processing step on the polishing pad 10 is completed, the top ring 31 moves to the substrate transfer device 800 while adsorbing the wafer W (see Figure 5A) to release (release) the wafer W. Alternatively, after moving to the substrate transfer device 800, the top ring 31 may be rotated while supplying pure water or a chemical solution to the wafer W held by the top ring 31 to perform a cleaning operation.

[0088] After the top ring 31 moves toward the substrate transfer device 800, the top ring 31 descends and the mounting surface 820 rises. As a result, the mounting surface 820 approaches the lower surface of the wafer W, but the two do not contact. In addition, by descending the top ring 31, the lifting pin 801 lifts the retaining ring 203 (refer to Figure 5B ). In this state, the bellows 206 of the film 204 is expanded, and the vacuum adsorption of the wafer W is stopped, and the wafer is released. At this time, a pressurized fluid can be sprayed from the release nozzle 802 toward the gap between the film 204 and the wafer W. As the pressurized fluid, at least one of a pressurized gas (e.g., pressurized nitrogen) and a pressurized liquid (e.g., pure water) can be used.

[0089] When the wafer W is placed on the placement surface 820, the sensors 811 to 813 detect the wafer W. When all the sensors 811 to 813 detect the wafer W, the controller 5 determines that the transfer of the wafer W from the top ring 31 to the placement surface 820 is completed. Then, the placement surface 820 on which the wafer W is placed descends, the top ring 31 ascends, and the transfer of the wafer W is completed (see Figure 5C ).

[0090] Next, the determination of abnormality in the transfer of the wafer W from the top ring 31 to the placement surface 820 by the controller 5 will be described. In addition, in the present embodiment, the controller 5 corresponds to an example of an "abnormality determination unit". The controller 5 may be composed of a microcomputer equipped with a CPU, a memory, etc., and realizing a predetermined function using software, or may be composed of a hardware circuit that performs dedicated calculation processing. In addition, the controller 5 is not limited to being composed of a single device, and as an example, may be composed of a plurality of devices that are separately provided. Figure 6 1 is a flowchart showing an example of abnormality determination in transfer of wafers W performed by the controller 5 . Figure 6 The abnormality determination shown is performed, as an example, when the polishing process of the wafer W is completed and the wafer W is transferred from the top ring 31 to the mounting surface 820 of the substrate transfer device 800 .

[0091] First, the controller 5 moves the top ring 31 holding the wafer W toward the substrate delivery device 800 in order to deliver the wafer W from the top ring 31 to the mounting surface 820 (step S10). Figure 5AAs shown, a wafer W is arranged above the mounting surface 820. The controller 5 determines whether the required time for the detachment action of the wafer W has passed (step S12). At present, it is determined that the detachment action of the wafer W has not started and the required time has not passed (S12: No), and the next process (step S14) is entered. The process of step S12 is described in detail below.

[0092] Next, the controller 5 executes the detachment operation of the wafer W from the top ring 31 (step S14). Figure 5B As shown, the top ring 31 is close to the substrate delivery device 800. In addition, as described above, the film 204 expands, and the vacuum suction of the wafer W is stopped, and the pressurized fluid is ejected from the release nozzle 802.

[0093] The controller 5 determines whether the wafer W is detected by the sensors 811 to 813 (steps S15 and S16). Since the wafer W has rigidity and may slightly jump when it leaves the mounting surface 820, and in order to suppress erroneous detection by the sensors 811 to 813, the controller 5 preferably determines that the wafer W is detected by the sensor 811 (812, 813) when the wafer W is continuously detected for a predetermined time (e.g., 1 second).

[0094] When the controller 5 does not detect the wafer W through the sensors 811 to 813 (S15, S16: No), it returns to the process of step S12 and continues the detachment action of the wafer W until the required time has passed (S12, S14). Here, the required time is a time longer than the time required for the detachment action of the wafer W under normal conditions, and a time set in advance or set by external input or the like can be used. Then, when the controller 5 determines that the required time has passed since the top ring 31 was moved to the substrate delivery device 800 (S12: Yes), it determines that the wafer W cannot be delivered from the top ring 31 to the mounting surface 820 (step S22), and ends this process. That is, although the controller 5 performs the detachment action of the wafer W, when the sensors 811 to 813 do not detect the wafer W even after the required time has passed, it determines that the wafer W cannot be delivered. At this time, the controller 5 can use a display device, a lamp, a buzzer, etc., which are not shown, to notify that the wafer W cannot be delivered from the top ring 31 to the mounting surface 820. Furthermore, instead of or in addition to the process of step S12, when the sensors 811 to 813 do not detect the wafer W even after performing the wafer W detachment process for a predetermined number of times (for example, three times) or more, the controller 5 may determine that the wafer W cannot be delivered from the top ring 31 to the mounting surface 820. In this case, for example, the number of times the film 204 is expanded or the number of times the pressurized fluid is ejected from the release nozzle 802 may be calculated.

[0095] In addition, the controller 5 may also determine that the wafer W is placed in a state of being tilted on the placement surface 820 (step S22) and terminate the process when the wafer W is detected by some sensors (e.g., sensor 811) and not detected by the remaining sensors (e.g., sensors 812 and 813) within a predetermined determination time (e.g., 2 seconds, etc.) (S15: Yes). At this time, the controller 5 may notify the fact that the wafer W is placed in a tilted state on the placement surface 820 using a display device, a lamp, a buzzer, etc. (not shown).

[0096] When the wafer W is detected by all sensors 811 to 813 (S16: Yes), the controller 5 calculates the time difference Δt between the seating times detected by each sensor (step S18). In addition, when the wafer W is detected by all sensors 811 to 813, the controller 5 may stop the light projection from the light projection parts 815 of the plurality of sensors 811 to 813. In this way, the time for the plurality of sensors 811 to 813 to irradiate the wafer W with light can be shortened.

[0097] In the processing of step S18, as an example, the sensor (e.g., sensor 813) that detects the wafer W earliest among the multiple sensors 811 to 813 can be used as the first sensor, and the sensor (e.g., sensor 811) that detects the wafer W the latest can be used as the second sensor to calculate the time difference Δt of the seating time. Then, the controller 5 determines whether the wafer W is normally transferred by comparing the calculated time difference Δt with the specified abnormality determination time tref (step S20). Here, the abnormality determination time tref is a time (e.g., 0.5 seconds, etc.) for determining whether there is a possibility of abnormality in the wafer W due to the detachment action, and a pre-set time or a time set by external input can be used. In addition, as an example, the seating time of the multiple sensors 811 to 813 can also be obtained by referring to the time from the release nozzle 802 ejecting the pressurized fluid to the stop of the light projection from the light projection part 815 of the multiple sensors 811 to 813.

[0098] Figure 7 : is a time chart showing an example of detection signals of each sensor in a normal state. Figure 7 , the detection signals Sg1 to Sg3 generated by the sensors 811 to 813 are shown. The detection signals Sg1 to Sg3 of this embodiment are "off" when the chip W is not detected by the sensors 811 to 813, and "on" when the chip W is detected by the sensors 811 to 813. Figure 7 and Figure 8In the figure, when the chip W is detected by all sensors 811 to 813, the light projection from the light projection unit 815 stops, and the detection signals Sg1 to Sg3 become "off". As shown in the figure, in the normal handover process of the chip W, after the moment t0 when the chip W starts to detach, at approximately the same moment t1 to t3, the detection signals Sg1 to Sg3 become "on". In addition, as described above, the controller 5 preferably determines that the seating of the chip W is detected when the chip W is continuously detected for a specified time (for example, 1 second, etc.) (when the "on" signal continues), and obtains the moment of becoming "on" at this time as the moment (also called "seating moment") t1 to t3. And, at Figure 7 In the example shown, the time difference Δt between time t3 and time t1 is less than the abnormality determination time tref (S20: Yes), and the controller 5 determines that the separation action of the wafer W is performed normally (step S24), and ends the process. If the wafer W is normally transferred, the wafer W is transferred from the first linear conveyor 6 or the second linear conveyor 7 to the swing conveyor 12 and transported to the cleaning assembly 4.

[0099] Figure 8 FIG. 1 is a time chart showing an example of detection signals of each sensor in an abnormal state. Figure 8 In, with Figure 7 Similarly, detection signals Sg1 to Sg3 generated by sensors 811 to 813 are shown. Figure 8 In the example shown, after the time t0 at which the detachment action of the wafer W is started, the detection signal Sg3 first becomes "ON" (time t3), and a little later the detection signals Sg1 and Sg2 become "ON" (time t1 and t2). This means that the wafer W is detached from the top ring 31 in a tilted state, and first the portion (first portion) corresponding to the sensor 813 is seated on the mounting surface 820, and then the portion (second portion) corresponding to the sensors 811 and 812 is seated on the mounting surface 820. Then, when the time difference Δt between the time t3 and the time t1 is greater than the abnormality determination time tref (S20: No), the controller 5 determines that there is a possibility that an abnormality has occurred in the wafer W due to the transfer of the wafer W (step S26), and ends the processing.

[0100] Fig. 9 : is a diagram showing an example of the time difference between the seating times of each chip. Fig. 9 In FIG. 1 , the horizontal axis represents the number of wafers W processed since the new film 204 was used. In addition, the vertical axis represents the time difference Δt of the seating time of each wafer when it is transferred from the top ring 31 to the substrate transfer device 800. In addition, the time difference Δt of the seating time is the time difference Δt between the earliest time when the plurality of sensors 811 to 813 detect the wafer W and the latest time when the plurality of sensors 811 to 813 detect the wafer W. Fig. 9In the example shown, when the time difference Δt of the seating timing of the Na-th wafer W becomes longer than the abnormality determination time tref (see the dotted line), it is determined that the wafer W may have an abnormality.

[0101] According to the research of the present inventors, even when the wafer W is detected by the plurality of sensors 811 to 813 and the wafer W is delivered from the top ring 31 to the mounting surface 820, if the wafer W is tilted away and sits on the mounting surface 820, the wafer W may be damaged or broken. Therefore, the controller 5 of the present embodiment determines whether the detachment action of the wafer W from the top ring 31 is performed normally based on the time difference Δt of the seating time of the wafer W detected by the plurality of sensors 811 to 813. Then, when the time difference Δt is greater than the abnormality determination time tref, it is determined that the wafer W is tilted away and there is a possibility that the wafer W may be damaged or broken. Thus, for example, before the wafer W is delivered to the swing conveyor 12, it is possible to determine that the delivery abnormality of the wafer W is abnormal, and the processing efficiency in the substrate processing device can be improved.

[0102] The present invention can also be described in the following aspects.

[0103] [Method 1] According to method 1, a substrate processing device is proposed, which is used to perform a grinding process on a grinded surface of a substrate, and comprises: a grinding table, which is used to support a grinding pad; a substrate holding device, which has a substrate holding surface and a pressure chamber composed of an elastic film, and is configured to hold the substrate by the substrate holding surface and press the substrate against the grinding pad by the pressure in the pressure chamber; a conveying table, which has a loading surface for loading the substrate, and is configured to transfer the substrate from the substrate holding device to the loading surface by a detachment action of the substrate performed by the substrate holding device; a plurality of sensors, the plurality of sensors including a first sensor and a second sensor configured to detect different parts of the substrate, and used to detect that the substrate has been loaded on the loading surface; and an abnormality determination unit, which determines an abnormality in the transfer of the substrate from the substrate holding device to the conveying table based on a time difference between a first moment when the first sensor detects that the substrate has been loaded on the loading surface and a second moment when the second sensor detects that the substrate has been loaded on the loading surface. According to aspect 1, when a substrate is delivered from the substrate holding device to the placement surface of the conveyance stage, abnormality in the delivery of the substrate can be detected based on detection by a plurality of sensors for detecting that the substrate is placed on the placement surface.

[0104] [Method 2] According to method 2, in method 1, the plurality of sensors include at least three sensors including the first sensor and the second sensor, the abnormality determination unit sets the sensor among the plurality of sensors that detects the substrate being placed on the placement surface earliest as the first sensor, sets the sensor among the plurality of sensors that detects the substrate being placed on the placement surface latest as the second sensor, and determines that there is an abnormality in the transfer of the substrate from the substrate holding device to the conveyor stage. According to method 2, it is possible to determine an abnormality in the transfer of the substrate based on detection by at least three sensors.

[0105] [Mode 3] According to Mode 3, in Mode 1 or 2, when all of the plurality of sensors detect that the substrate has been placed on the placement surface, and the time difference is greater than a predetermined abnormality determination time, the abnormality determination unit determines that there is a possibility that an abnormality has occurred in the substrate due to the transfer of the substrate. According to Mode 3, it can be determined that there is a possibility that an abnormality has occurred in the substrate due to the substrate being detached in a tilted state.

[0106] [Mode 4] According to Mode 4, in Modes 1 to 3, when a part of the plurality of sensors detects that the substrate is placed on the placement surface, and the remaining sensors of the plurality of sensors do not detect that the substrate is placed on the placement surface, the abnormality determination unit determines that the substrate is placed on the placement surface in an inclined state. According to Mode 4, it is possible to determine that the substrate is placed on the placement surface in an inclined state.

[0107] [Method 5] According to method 5, in methods 1 to 4, the multiple sensors have a light projecting part and a light receiving part, the light projecting part projects light in a manner blocked by the substrate when the substrate is placed on the loading surface, and the light receiving part receives light from the light projecting part, and when all sensors among the multiple sensors detect that the substrate has been placed on the loading surface, the light projection from the light projecting part of the multiple sensors is stopped.

[0108] [Mode 6] According to Mode 6, in Modes 1 to 5, a release nozzle is provided, and the release nozzle is configured to eject a pressurized fluid into the gap between the substrate holding surface and the substrate during the detachment operation of the substrate. According to Mode 6, the detachment operation of the substrate can be performed using the ejection of the pressurized fluid from the release nozzle.

[0109] [Method 7] According to method 7, an abnormality determination method is proposed to determine an abnormality in the transfer of a substrate in a substrate processing device, wherein the substrate processing device comprises: a grinding table for supporting a grinding pad; a substrate holding device having a substrate holding surface formed of an elastic film and a pressure chamber, configured to hold the substrate by the substrate holding surface and press the substrate against the grinding pad by the pressure in the pressure chamber; and a conveying table having a loading surface for loading the substrate, configured to transfer the substrate from the substrate holding device to the loading surface by a detachment action of the substrate performed by the substrate holding device, the abnormality determination method comprising: when it is determined that the substrate has been loaded on the loading surface, based on a time difference between a first moment when a first portion of the substrate is detected to have been loaded on the loading surface and a second moment when a second portion of the substrate different from the first portion is detected to have been loaded on the loading surface, determining an abnormality in the transfer of the substrate from the substrate holding device to the conveying table. According to aspect 7, when the substrate is delivered from the substrate holding device to the placement surface of the conveyor stage, it is possible to detect a delivery abnormality of the substrate based on the time difference between when different portions of the substrate are detected to be placed on the placement surface.

[0110] The above has been described the embodiments of the present invention, but the embodiments of the invention described above are for easy understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from its main purpose, and the present invention certainly includes its equivalents. In addition, within the scope of at least a part of the above-mentioned technical problem that can be solved or within the scope of at least a part of the effect that can be exerted, any combination of the embodiments and the modified examples can be performed, and any combination of the constituent elements described in the scope of the request and the specification can be performed or can be omitted.

[0111] This application claims priority based on Japanese Patent Application No. 2023-137889 filed on August 28, 2023. All disclosures including the specification, scope of claims, specification drawings, and specification abstract of Japanese Patent Application No. 2023-137889 are incorporated herein by reference as a whole. All disclosures including the specification, scope of claims, specification drawings, and specification abstract of Japanese Patent Publication No. 2012-178608 (Patent Document 1) are incorporated herein by reference as a whole.

Claims

1. A substrate processing device for performing a grinding process on a grinding surface of a substrate, characterized in that: have: A grinding table, the grinding table is used to support a grinding pad; a substrate holding device having a substrate holding surface formed of an elastic film and a pressure chamber, configured to hold the substrate by the substrate holding surface and press the substrate against the polishing pad by the pressure in the pressure chamber; a conveying table having a placing surface on which the substrate is placed, and configured to transfer the substrate from the substrate holding device to the placing surface by a detaching action of the substrate by the substrate holding device; a plurality of sensors including a first sensor and a second sensor configured to detect different locations of the substrate, for detecting that the substrate has been placed on the placement surface; as well as An abnormality determination unit determines an abnormality in the handover of the substrate from the substrate holding device to the conveyor table based on a time difference between a first moment when the first sensor detects that the substrate has been placed on the placing surface and a second moment when the second sensor detects that the substrate has been placed on the placing surface.

2. The substrate processing device according to claim 1, characterized in that: The plurality of sensors have at least three sensors including the first sensor and the second sensor, The abnormality determination unit sets the sensor among the multiple sensors that detects the substrate being placed on the placing surface the earliest as the first sensor, sets the sensor among the multiple sensors that detects the substrate being placed on the placing surface the latest as the second sensor, and determines an abnormality in the handover of the substrate from the substrate holding device to the conveyor table.

3. The substrate processing device according to claim 1, characterized in that: When all of the plurality of sensors detect that the substrate has been placed on the placement surface and the time difference is equal to or longer than a predetermined abnormality determination time, the abnormality determination unit determines that an abnormality may occur in the substrate due to the transfer of the substrate.

4. The substrate processing device according to claim 3, characterized in that: When a part of the multiple sensors detects that the substrate is placed on the loading surface, and the remaining sensors do not detect that the substrate is placed on the loading surface, the abnormality determination unit determines that the substrate is placed on the loading surface in a tilted state.

5. The substrate processing device according to claim 3, characterized in that: The multiple sensors include a light-projecting portion and a light-receiving portion. The light-projecting portion projects light in a manner blocked by the substrate when the substrate is placed on the mounting surface, and the light-receiving portion receives light from the light-projecting portion. When all sensors among the multiple sensors detect that the substrate has been placed on the mounting surface, the light-projecting portions of the multiple sensors stop projecting light.

6. The substrate processing apparatus according to claim 1, wherein: A release nozzle is provided, the release nozzle being configured to eject a pressurized fluid into a gap between the substrate holding surface and the substrate when the substrate is released.

7. A method for determining abnormality in the transfer of substrates in a substrate processing device, characterized in that: The substrate processing device comprises: A grinding table, the grinding table is used to support a grinding pad; a substrate holding device having a substrate holding surface formed of an elastic film and a pressure chamber, configured to hold the substrate by the substrate holding surface and press the substrate against the polishing pad by the pressure in the pressure chamber; and a conveyor table having a placement surface on which the substrate is placed, and configured to transfer the substrate from the substrate holding device to the placement surface by the substrate detaching action performed by the substrate holding device, The abnormality judgment method includes: when it is judged that the substrate has been placed on the loading surface, based on the time difference between a first moment when a first part of the substrate is detected to be placed on the loading surface and a second moment when a second part of the substrate different from the first part is detected to be placed on the loading surface, judging that there is an abnormality in the handover of the substrate from the substrate holding device to the conveying table.

Images