Display panel disconnection repair device control method, device, equipment and storage medium
By controlling the laser beam scanning of the chemical vapor deposition equipment and detecting the fracture position, the scanning speed is reduced to deposit the metal medium at the fracture, which solves the problem that the laser CVD process cannot completely fill the fracture and improves the success rate of repairing the broken wires in the metal layer of the display panel.
Patent Information
- Application Number
- CN202411715954.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2044-11-27
AI Technical Summary
In the prior art, when a display panel is repairing a broken metal layer, the laser CVD process cannot completely fill the fracture, resulting in gaps in the repair layer and causing repair failure.
By controlling the laser beam of the chemical vapor deposition equipment to scan on the non-metallic layer, the fracture position is detected by the sensor, and the scanning speed is reduced when the fracture is scanned. The repair layer is deposited at the fracture at the second speed until the first speed is restored after the scanning is completed to ensure that the fracture is completely filled with the metal medium.
Complete filling of the fracture is achieved, the step difference of the repair layer is avoided, and the success rate of repairing the broken wire of the metal layer is improved.
Smart Images

Figure CN119530779B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor device control technology, and in particular to a display panel disconnection repair device control method, device, equipment and storage medium. Background Art
[0002] During the manufacturing process of the display panel, a pixel driving circuit needs to be formed on a glass substrate. The pixel driving circuit includes metal lines such as data lines, scan lines, and compensation lines. The metal lines are thin metal layers in the display panel.
[0003] like Figure 1 As shown in a, from top to bottom are non-metal 1, metal layer 2 and glass substrate 3. When foreign matter 4 exists in the metal layer 2 during the deposition process, the metal layer 2 is separated by the foreign matter 4 and breaks. The metal layers 2 on both sides of the foreign matter 4 cannot be energized, as shown in FIG. Figure 1 As shown in b, in order to repair the broken metal layer 4, foreign matter in the metal layer 2 is first removed to form a fracture 5, and then a first repair hole 6 and a second repair hole 7 are set on both sides of the fracture 5 with a depth reaching the upper surface of the glass substrate 3. Then, after the metal medium is deposited in the first repair hole 6 and the second repair hole 7 by the laser CVD (Chemical Vapor Deposition) process, the laser CVD is controlled to scan and move at a uniform speed from the first repair hole 6 to the second repair hole 7 to form a repair layer 8 on the non-metallic layer 1.
[0004] like Figure 1 As shown in Figure c, since the fracture 5 has a certain depth, when the laser CVD scans and moves at a uniform speed from the first repair hole 6 to the second repair hole 7 to form the repair layer 8, the metal medium cannot be completely filled at the fracture 5 to form a complete repair layer 8, and a gap 10 is formed in the fracture 5. There is a problem that the repair layer 8 is broken or there is a gap 10 in the repair layer 8 in the fracture 5 and it cannot connect to the metal layer 2 at the fracture 5, resulting in failure to repair the metal layer 2. Summary of the Invention
[0005] The present invention provides a display panel disconnection repair device control method, device, equipment and storage medium to solve the problem that the display panel disconnection repair device control is not perfect, resulting in display panel disconnection repair failure.
[0006] In a first aspect, the present invention provides a method for controlling a display panel broken wire repair device, which is used to control a chemical vapor deposition device to repair a broken metal layer, wherein the chemical vapor deposition device is provided with a sensor, and a non-metallic layer is provided on the metal layer, comprising:
[0007] Depositing a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer;
[0008] Controlling the laser beam of the chemical vapor deposition device to scan at a first speed with the first repair hole as a starting point to deposit a repair layer on the non-metallic layer;
[0009] Controlling the sensor to collect detection data;
[0010] determining whether the laser beam scans the fracture according to the detection data;
[0011] If not, return to the step of controlling the sensor to collect detection data;
[0012] If yes, controlling the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed;
[0013] After detecting that the laser beam has finished scanning the fracture, a repair layer is deposited on the non-metallic layer by scanning at the first speed with the second repair hole as an end point.
[0014] In a second aspect, the present invention provides a control device for display panel broken wire repair equipment, which is used to control a chemical vapor deposition device to repair a broken metal layer, wherein the chemical vapor deposition device is provided with a sensor, and a non-metallic layer is provided on the metal layer, comprising:
[0015] a repair hole deposition module, configured to deposit a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metallic layer and the metal layer;
[0016] a first scanning control module, configured to control the laser beam of the chemical vapor deposition device to scan at a first speed starting from the first repair hole to deposit a repair layer on the non-metallic layer;
[0017] A detection data acquisition module, used to control the sensor to collect detection data;
[0018] a fracture detection and judgment module, configured to determine whether the laser beam has scanned the fracture according to the detection data, and if not, execute the detection data acquisition module; if so, execute the second scanning control module;
[0019] a second scanning control module, configured to control the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed;
[0020] A third scanning control module, after detecting that the laser beam has finished scanning the fracture, deposits a repair layer on the non-metallic layer by scanning at the first speed with the second repair hole as an end point.
[0021] In a third aspect, the present invention provides an electronic device, comprising:
[0022] at least one processor; and
[0023] a memory communicatively connected to the at least one processor; wherein,
[0024] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the display panel line break repair device control method described in the first aspect of the present invention.
[0025] In a fourth aspect, the present invention provides a computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a processor to implement the display panel line break repair device control method described in the first aspect of the present invention when executed.
[0026] In an embodiment of the present invention, after depositing the metal medium in the first repair hole and the second repair hole, the laser beam of the chemical vapor deposition equipment is controlled to scan at a first speed with the first repair hole as the starting point to deposit the repair layer on the non-metallic layer, and the detection data is collected by the sensor, and it is determined by the detection data whether the laser beam has scanned the fracture of the metal layer. If so, the fracture is scanned from the first speed to the second speed to form a metal layer at the fracture, and the first speed is restored to scan to the second repair hole after the scanning of the fracture is completed. Since the scanning speed is reduced at the fracture, the residence time of the laser beam at the fracture is increased, and a complete repair layer can be fully deposited at the fracture through the chemical vapor deposition process, thereby avoiding the problem of the laser beam scanning too fast to fully deposit the metal layer at the fracture, so that the deposited layer formed at the fracture can completely connect the metal layers on both sides of the fracture, thereby improving the success rate of repairing the broken wire of the metal layer.
[0027] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0029] Figure 1 It is a schematic diagram of repairing a broken metal wire in the prior art;
[0030] Figure 2 This is a flow chart of a method for controlling a display panel disconnection repair device provided in the first embodiment of the present invention;
[0031] Figure 3 This is a schematic diagram of the effect of repairing a metal wire using the control method according to an embodiment of the present invention;
[0032] Figure 4 This is a flow chart of a method for controlling a display panel disconnection repair device provided in a second embodiment of the present invention;
[0033] Figure 5 This is a schematic diagram of detecting fracture surfaces through images;
[0034] Figure 6 This is a schematic diagram of detecting a fracture through an optical signal;
[0035] Figure 7 This is a structural diagram of a display panel disconnection repair device control device provided in a third embodiment of the present invention;
[0036] Figure 8 It is a structural diagram of an electronic device provided in Embodiment 4 of the present invention. DETAILED DESCRIPTION
[0037] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.
[0038] Example 1
[0039] Figure 2This is a flow chart of a method for controlling a display panel line break repair device provided in the first embodiment of the present invention. This embodiment is applicable to the case where a display panel line break repair device is controlled to repair a line break. The method can be executed by a display panel line break repair device control device. The display panel line break repair device control device can be implemented in the form of hardware and / or software and can be configured in an electronic device, such as in a host computer of a display panel line break repair device. Figure 2 As shown, the display panel disconnection repair device control method includes:
[0040] S201 , depositing a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer.
[0041] In this embodiment, the display panel line breakage may refer to a breakage of a metal layer in the display panel. For example, the metal layer in the display panel may be a data line, a scan line, a power line (VDD Line), a compensation line (REF Line), etc.
[0042] like Figure 1 In one example, there is a metal layer 2 on a glass substrate 3, and a non-metallic layer 1 (transparent non-metallic layer) on the metal layer 2. If a foreign object 4 invades during the deposition process to form the metal layer 2, after the non-metallic layer 1 is formed, the foreign object 4 will cause the non-metallic layer 1 to bulge and crack, and also cause the metal layer 2 to break, requiring the metal layer 2 to be repaired.
[0043] Among them, it is necessary to use laser to remove foreign matter 4 to form a fracture 5, and in order to ensure the quality of repair, a first repair hole 6 and a second repair hole 7 are also formed on both sides of the fracture 5 by laser, wherein the fracture 5, the first repair hole 6 and the second repair hole 7 all penetrate the non-metallic layer 1 and the metal layer 2.
[0044] Before forming a repair layer on the non-metallic layer 1, it is necessary to deposit a metal medium in the first repair hole 6 and the second repair hole 7 so that the metal medium fills the first repair hole 6 and the second repair hole 7. In one embodiment, the metal medium can be deposited in the first repair hole 6 and the second repair hole 7 by a chemical vapor deposition device. The chemical vapor deposition device can be an existing device. For example, the chemical vapor deposition device can be a device that uses a laser beam as a heating device. Specifically, the laser beam of the chemical vapor deposition device can be controlled to move above the first repair hole 6 and the second repair hole 7 respectively, and then the output metal organic chemical gas is heated by the laser beam to deposit the metal in the metal organic chemical gas in the first repair hole 6 and the second repair hole 7 until the first repair hole 6 and the second repair hole 7 are filled, so that the metal medium in the first repair hole 6 and the second repair hole 7 can realize electrical signal transmission after being connected to the metal layer 2.
[0045] S202 , controlling the laser beam of the chemical vapor deposition equipment to scan at a first speed with the first repair hole as the starting point to deposit a repair layer on the non-metallic layer.
[0046] This embodiment can determine the first speed according to the required thickness of the repair layer, and control the laser beam of the chemical vapor deposition equipment to move from the first repair hole as the starting point to the second repair hole at the first speed to form a repair layer on the non-metallic layer and the fracture.
[0047] like Figure 1 As shown in c, the laser beam 9 moves at a uniform speed from the first repair hole 6 to the second repair hole 7 at a first speed v. During the movement, under the heating effect of the laser beam 9, the metal in the metal organic chemical gas is deposited on the surface of the non-metallic layer 1 to form a metal repair layer 8.
[0048] S203: Control the sensor to collect detection data.
[0049] The chemical vapor deposition equipment of this embodiment is provided with a sensor. When the laser beam is scanning from the first repair hole to the second repair hole, the sensor can collect detection data of the laser beam irradiation area according to a preset period.
[0050] S204: Determine whether the laser beam has scanned the fracture according to the detection data.
[0051] In one embodiment, the sensor may be a camera, which captures images through the camera and identifies whether the laser beam has scanned the fracture in the metal layer. In another embodiment, the sensor may also be a photoelectric sensor, which emits a light signal to the irradiation area of the laser beam and then receives a reflected light signal, and determines whether the laser beam has scanned the fracture through the reflected light signal.
[0052] If it is identified through the detection data that the laser beam scans the fracture, S205 is executed. If it is identified through the detection data that the laser beam does not scan the fracture, the process returns to S203 to continue collecting detection data.
[0053] S205 , controlling the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed.
[0054] In this embodiment, when the laser beam scans the fracture, the scanning speed is reduced, that is, the fracture is scanned at a second speed that is less than the first speed. This allows the laser beam to remain at the fracture for a longer time when scanning the fracture, allowing the laser beam sufficient time to deposit the metal in the metal organic chemical gas into the fracture and completely fill the fracture. Persons skilled in the art may pre-set the second speed based on the size and depth of the fracture. For example, the second speed may be 0.5 times the first speed. This embodiment does not impose any restrictions on the second speed.
[0055] S206 , after detecting that the laser beam has finished scanning the fracture, depositing a repair layer on the non-metallic layer with the second repair hole as the end point and scanning at the first speed.
[0056] After the laser beam finishes scanning the fracture, the first speed can be restored so that the laser beam scans toward the second repair hole at the first speed to deposit a repair layer on the non-metallic layer.
[0057] like Figure 1 As shown, between the first repair hole 6 and the fracture 5, the laser beam 9 scans at a first speed to form a repair layer 8 on the non-metallic layer 1. When the laser beam 9 is detected to scan the fracture 5, the speed is reduced and the fracture 5 is scanned at a second speed so that the metal medium fills the fracture 5. Then the first speed is restored and the laser beam 9 scans from the fracture 5 to the second repair hole 7 to form a repair layer 8 on the non-metallic layer 1.
[0058] like Figure 3 As shown, since the speed is reduced at the fracture 5, the fracture 5 is completely filled with the metal medium to form a complete repair layer, and a complete repair layer 8 can be formed from the first repair hole 6 to the second repair hole 7, avoiding the problem of repair failure caused by the formation of a gap at the fracture 5 due to the first speed scanning from the first repair hole 6 to the second repair hole 7.
[0059] In an embodiment of the present invention, after depositing the metal medium in the first repair hole and the second repair hole, the laser beam of the chemical vapor deposition equipment is controlled to scan at a first speed with the first repair hole as the starting point to deposit the repair layer on the non-metallic layer, and the detection data is collected by the sensor, and it is determined by the detection data whether the laser beam has scanned the fracture of the metal layer. If so, the fracture is scanned from the first speed to the second speed to form a metal layer at the fracture, and the first speed is restored to scan to the second repair hole after the scanning of the fracture is completed. Since the scanning speed is reduced at the fracture, the residence time of the laser beam at the fracture is increased, and a complete repair layer can be fully deposited at the fracture through the chemical vapor deposition process, thereby avoiding the problem of the laser beam scanning too fast to fully deposit the metal layer at the fracture, so that the deposited layer formed at the fracture can completely connect the metal layers on both sides of the fracture, thereby improving the success rate of repairing the broken wire of the metal layer.
[0060] Example 2
[0061] Figure 4 This is a flow chart of a display panel disconnection repair device control method provided in the second embodiment of the present invention. The embodiment of the present invention is optimized based on the above-mentioned embodiment 1. Figure 4 As shown, the display panel disconnection repair device control method includes:
[0062] S401 , controlling the laser beam of the chemical vapor deposition device to deposit metal dielectrics in the first repair hole and the second repair hole respectively.
[0063] In this embodiment, when the detection station detects that the metal layer is broken and the line is broken, a fracture is formed at the fracture of the metal layer by laser, and a first repair hole and a second repair hole are formed on both sides of the fracture. Figure 1 As shown in a and b, when the metal layer 2 is broken due to foreign matter 4, the foreign matter 4 is removed by laser to form a fracture 5, and in order to facilitate repair and ensure the quality of repair, a first repair hole 6 and a second repair hole 7 are also formed on both sides of the fracture 5 by laser, wherein the fracture 5, the first repair hole 6 and the second repair hole 7 all penetrate the non-metallic layer 1 and the metal layer 2.
[0064] In one embodiment, a metal medium can be deposited in the first repair hole 6 and the second repair hole 7 by a chemical vapor deposition device. Specifically, the laser beam of the chemical vapor deposition device can be controlled to move above the first repair hole 6 and the second repair hole 7, and the output metal organic chemical gas can be heated by the laser beam to deposit the metal in the metal organic chemical gas in the first repair hole 6 and the second repair hole 7 until the first repair hole 6 and the second repair hole 7 are filled.
[0065] S402 , controlling the laser beam of the chemical vapor deposition device to scan at a first speed with the first repair hole as the starting point to deposit a repair layer on the non-metallic layer.
[0066] This embodiment can determine the first speed according to the required thickness of the repair layer, and control the laser beam of the chemical vapor deposition equipment to move from the first repair hole as the starting point to the second repair hole at the first speed to form a repair layer on the non-metallic layer and the fracture.
[0067] like Figure 1 As shown in c, the laser beam 9 moves at a uniform speed from the first repair hole 6 to the second repair hole 7 at a first speed v. During the movement, under the heating effect of the laser beam 9, the metal in the metal organic chemical gas is deposited on the surface of the non-metallic layer 1 to form a metal repair layer 8.
[0068] S403: Control the camera to collect images according to a preset period.
[0069] In this embodiment, the sensor can be a camera, and the camera can be used to capture images of the area of the laser beam. For example, the period of image capture by the camera can be set according to the first speed. The period is negatively correlated with the first speed, that is, the greater the first speed, the smaller the period of image capture and the higher the frequency of image capture.
[0070] S404: Binarize the image to obtain a binary image.
[0071] Since the non-metallic layer 1 and the glass substrate 3 are both transparent and the metal layer 2 is non-transparent, the brightness of the metal layer 2 area in the collected image is quite different from that of the non-metallic layer 1 and the glass substrate 3. The collected image can be binarized. Specifically, each pixel in the image can be traversed, and pixels with brightness less than a preset brightness threshold are set to black, and pixels with brightness greater than or equal to the preset brightness threshold are set to white, to obtain a binary image, such as Figure 5 Shown is a schematic diagram of a binary image. Figure 5 There are two metal layers in the structure, one of which is a metal layer 2 with a fracture 5 and is the metal layer that needs to be repaired.
[0072] S405: Determine the black pixel area in the binary image as the metal layer area.
[0073] Since the metal layer is opaque, and the glass substrate and the non-metallic layer are translucent, the black pixel area in the binary image is the opaque area, that is, the area of the metal layer 2.
[0074] S406: If there is a white area behind the metal layer area in the binary image, determine that the white area is a fracture.
[0075] like Figure 5 As shown, the laser beam is scanned along the direction of the metal layer 2 to determine whether the area behind the metal layer is a white area. If so, the white area is determined to be the area of the fracture 5.
[0076] S407 , using preset calibration data to calculate the distance from the fracture to the laser beam, where the calibration data is position conversion data between the camera and the laser beam.
[0077] On the chemical vapor deposition equipment, the camera and the laser beam may not be in the same position, and the camera has a certain viewing angle. When the camera captures the fracture, the laser beam may not scan the fracture. For example, the laser beam may still be in front of the fracture. The position conversion data of the camera and the laser beam can be used to calculate the distance from the fracture to the laser beam. Specifically, the image boundary line between the white area and the black area in the image can be determined first, and the coordinates of the real boundary line between the fracture and the metal layer in the camera coordinate system can be calculated through the image coordinates of the image boundary line in the image. The distance from the real boundary line to the laser beam can be calculated through the position conversion data of the camera and the laser beam.
[0078] S408: When the distance is less than a preset distance threshold, determine that the laser beam has scanned the fracture.
[0079] If the calculated distance from the fracture to the laser beam is less than the distance threshold, it means that the laser beam has approached the fracture or scanned the fracture, wherein the distance threshold can be determined according to the first speed. For example, when the first speed is larger, the distance threshold can be set to be larger, and when the first speed is smaller, the distance threshold can be set to be smaller.
[0080] In another optional embodiment, the sensor may also be a photoelectric sensor, which may be controlled to transmit a light signal to the display panel, receive a reflected light signal, and calculate the light intensity of the reflected light signal. If the light intensity is less than a preset intensity threshold, it is determined that the laser beam has scanned the fracture. Figure 6 As shown, a photoelectric sensor can be installed on the emission head of the laser. The photoelectric sensor moves synchronously with the laser beam. The photoelectric sensor emits a light signal, such as an infrared light signal, vertically to the display panel. If the infrared light signal is irradiated on the metal layer 2, it will be strongly reflected. If it is irradiated on the fracture 5, it will be weakly reflected through the glass substrate 3. Therefore, it is possible to judge whether the laser beam has scanned the fracture 5 by the light intensity of the reflected light signal.
[0081] S409 , controlling the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed.
[0082] In this embodiment, when the laser beam scans the fracture, the scanning speed is reduced, that is, the fracture is scanned at a second speed that is less than the first speed, so that when the laser beam scans the fracture, the residence time of the laser beam on the fracture is extended, so that the laser beam has sufficient time to deposit the metal in the metal organic chemical gas into the fracture to completely fill the fracture.
[0083] S410 , after detecting that the laser beam has finished scanning the fracture, depositing a repair layer on the non-metallic layer with the second repair hole as the end point and scanning at the first speed.
[0084] Specifically, the camera can be used to capture images or the photoelectric sensor can be used to receive reflected light to detect whether the laser beam has finished scanning the fracture. For example, Figure 5 In the binary image shown, if the distance between the black area after the white area and the laser beam is less than the threshold, it means that the laser beam has finished scanning the fracture, as shown in Figure 6 As shown, if the light intensity of the reflected light signal changes from less than the intensity threshold to greater than the intensity threshold, it is determined that the laser beam scanning the fracture has ended, and the first speed can be restored so that the laser beam scans toward the second repair hole at the first speed to deposit a repair layer on the non-metallic layer.
[0085] In this embodiment, in the process of controlling the laser beam of the chemical vapor deposition equipment to take the first repair hole as the starting point and scan at a first speed to deposit the repair layer on the non-metallic layer, the camera is controlled to collect images according to a preset period, and the collected image is binarized to obtain a binary image, and the black pixel area in the binary image is determined to be the metal layer area. If there is a white area behind the metal layer area in the binary image, the white area is determined to be a fracture, and the preset calibration data is used to calculate the distance from the white area to the laser beam. When the distance is less than a preset distance threshold, it is determined that the laser beam has scanned to the fracture, and the laser beam is controlled to scan at the fracture at a second speed. Scanning is used to deposit a repair layer. After detecting that the laser beam has finished scanning the fracture, the repair layer is deposited on the non-metallic layer with the second repair hole as the end point and scanning at the first speed, thereby realizing real-time detection of the fracture during the laser beam scanning process and reducing the scanning speed at the fracture. The residence time of the laser beam at the fracture is increased, and a complete repair layer can be fully deposited at the fracture through the chemical vapor deposition process, thereby avoiding the problem of the laser beam scanning too fast to fully deposit the metal layer at the fracture, so that the deposited layer formed at the fracture can completely connect the metal layers on both sides of the fracture, thereby improving the success rate of repairing the broken wires in the metal layer.
[0086] Example 3
[0087] Figure 7 This is a schematic diagram of the structure of a display panel disconnection repair device control device provided in the third embodiment of the present invention. Figure 7 As shown, the display panel broken line repair device control device is used to control the chemical vapor deposition device to repair the broken metal layer, the chemical vapor deposition device is provided with a sensor, and the non-metallic layer is located above the metal layer. The display panel broken line repair device control device includes:
[0088] A repair hole deposition module 701 is configured to deposit a metal dielectric in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer;
[0089] A first scanning control module 702 is configured to control the laser beam of the chemical vapor deposition device to scan at a first speed starting from the first repair hole to deposit a repair layer on the non-metallic layer;
[0090] A detection data acquisition module 703 is used to control the sensor to collect detection data;
[0091] a fracture detection and judgment module 704 for judging whether the laser beam has scanned the fracture according to the detection data, and if not, executing the detection data acquisition module 703; if so, executing the second scanning control module 705;
[0092] A second scanning control module 705 is configured to control the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed;
[0093] The third scanning control module 706 , after detecting that the laser beam has finished scanning the fracture, deposits a repair layer on the non-metallic layer by scanning at the first speed with the second repair hole as an end point.
[0094] Optionally, also include:
[0095] The fracture and repair hole forming module is used to remove foreign matter in the metal layer on the display panel to form a fracture penetrating the non-metallic layer and the metal layer, and to form a first repair hole and a second repair hole penetrating the non-metallic layer and the metal layer on both sides of the fracture.
[0096] Optionally, the repair hole deposition module 701 includes:
[0097] The repair hole deposition control unit is used to control the laser beam of the chemical vapor deposition equipment to deposit metal media in the first repair hole and the second repair hole respectively.
[0098] Optionally, the sensor is a camera, and the detection data acquisition module 703 includes:
[0099] An image acquisition unit, used to control the camera to acquire images according to a preset period;
[0100] Optionally, the fracture detection and judgment module 704 includes:
[0101] A binarization processing unit, configured to perform binarization processing on the image to obtain a binary image;
[0102] a metal layer determining unit, configured to determine a black pixel area in the binary image as a metal layer area;
[0103] a fracture region determining unit, configured to determine that if a white region is behind the metal layer region in the binary image, the white region is a fracture;
[0104] a fracture distance calculation unit, configured to calculate the distance from the fracture to the laser beam using preset calibration data, wherein the calibration data is position conversion data of the camera and the laser beam;
[0105] The first fracture scanning determination unit is configured to determine that the laser beam has scanned the fracture when the distance is less than a preset distance threshold.
[0106] Optionally, the sensor is a photoelectric sensor, and the detection data acquisition module 703 includes:
[0107] The optical signal transceiver unit is used to control the photoelectric sensor to transmit an optical signal to the display panel and receive a reflected optical signal.
[0108] Optionally, the fracture detection and judgment module 704 includes:
[0109] a light intensity calculation unit, configured to calculate the light intensity of the reflected light signal;
[0110] The second fracture scanning determination unit is configured to determine that the laser beam has scanned the fracture if the light intensity is less than a preset intensity threshold.
[0111] The display panel line break repair equipment control device provided in the embodiment of the present invention can execute the display panel line break repair equipment control method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.
[0112] Example 4
[0113] Figure 8 A schematic diagram of the structure of an electronic device 40 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or claimed herein.
[0114] like Figure 8 As shown, the electronic device 40 includes at least one processor 41 and a memory, such as a read-only memory (ROM) 42, a random access memory (RAM) 43, etc., which is communicatively connected to the at least one processor 41. The memory stores a computer program that can be executed by the at least one processor, and the processor 41 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 42 or the computer program loaded from the storage unit 48 into the random access memory (RAM) 43. Various programs and data required for the operation of the electronic device 40 can also be stored in the RAM 43. The processor 41, ROM 42, and RAM 43 are connected to each other via a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.
[0115] Multiple components in the electronic device 40 are connected to the I / O interface 45, including an input unit 46, such as a keyboard, mouse, camera, photoelectric sensor, etc.; an output unit 47, such as various types of displays, speakers, etc.; a storage unit 48, such as a magnetic disk, optical disk, etc.; and a communication unit 49, such as a network card, modem, wireless communication transceiver, etc. The communication unit 49 allows the electronic device 40 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.
[0116] Processor 41 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any other suitable processors, controllers, microcontrollers, etc. Processor 41 executes the various methods and processes described above, such as the display panel disconnection repair device control method.
[0117] In some embodiments, the display panel disconnection repair device control method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 48. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 40 via the ROM 42 and / or the communication unit 49. When the computer program is loaded into the RAM 43 and executed by the processor 41, one or more steps of the display panel disconnection repair device control method described above can be performed. Alternatively, in other embodiments, the processor 41 can be configured to execute the display panel disconnection repair device control method by any other appropriate means (for example, by means of firmware).
[0118] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.
[0119] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.
[0120] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.
[0121] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).
[0122] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.
[0123] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.
[0124] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.
[0125] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.
Claims
1. A method for controlling a display panel disconnection repair device, characterized in that: Used to control a chemical vapor deposition device to repair a broken metal layer, the chemical vapor deposition device is provided with a sensor, and a non-metallic layer is provided on the metal layer, comprising: Depositing a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metal layer and the metal layer; Controlling the laser beam of the chemical vapor deposition device to scan at a first speed with the first repair hole as a starting point to deposit a repair layer on the non-metallic layer; Controlling the sensor to collect detection data; determining whether the laser beam scans the fracture according to the detection data; If not, return to the step of controlling the sensor to collect detection data; If yes, controlling the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed; After detecting that the laser beam has finished scanning the fracture, a repair layer is deposited on the non-metallic layer by scanning at the first speed with the second repair hole as an end point.
2. The display panel disconnection repair device control method according to claim 1, characterized in that: Before depositing the metal dielectric in the first repair hole and the second repair hole of the metal layer, the method further includes: Foreign matter in the metal layer is removed from the display panel to form a fracture penetrating the non-metal layer and the metal layer, and a first repair hole and a second repair hole penetrating the non-metal layer and the metal layer are formed on both sides of the fracture.
3. The display panel disconnection repair device control method according to claim 1, characterized in that: Depositing a metal dielectric in the first repair hole and the second repair hole of the metal layer includes: The laser beam of the chemical vapor deposition device is controlled to deposit metal media in the first repair hole and the second repair hole respectively.
4. The display panel disconnection repair device control method according to claim 1, characterized in that: The sensor is a camera, and controlling the sensor to collect detection data includes: Control the camera to collect images according to the preset cycle.
5. The display panel disconnection repair device control method according to claim 4, characterized in that: Determining whether the laser beam scans the fracture according to the detection data includes: performing binarization processing on the image to obtain a binary image; Determine the black pixel area in the binary image as the metal layer area; If a white area is behind the metal layer area in the binary image, determining that the white area is a fracture; Calculating the distance from the fracture to the laser beam using preset calibration data, wherein the calibration data is position conversion data between the camera and the laser beam; When the distance is less than a preset distance threshold, it is determined that the laser beam has scanned the fracture.
6. The display panel disconnection repair device control method according to claim 1, characterized in that: The sensor is a photoelectric sensor, and controlling the sensor to collect detection data includes: The photoelectric sensor is controlled to transmit a light signal to the display panel and receive a reflected light signal.
7. The display panel disconnection repair device control method according to claim 6, characterized in that: Determining whether the laser beam scans the fracture according to the detection data includes: Calculating the light intensity of the reflected light signal; If the light intensity is less than a preset intensity threshold, it is determined that the laser beam has scanned the fracture.
8. A display panel disconnection repair equipment control device, characterized in that: Used to control a chemical vapor deposition device to repair a broken metal layer, the chemical vapor deposition device is provided with a sensor, and a non-metallic layer is provided on the metal layer, comprising: a repair hole deposition module, configured to deposit a metal medium in a first repair hole and a second repair hole of the metal layer, wherein the first repair hole and the second repair hole are located on both sides of the fracture of the metal layer and penetrate the non-metallic layer and the metal layer; a first scanning control module, configured to control the laser beam of the chemical vapor deposition device to scan at a first speed starting from the first repair hole to deposit a repair layer on the non-metallic layer; A detection data acquisition module, used to control the sensor to collect detection data; a fracture detection and judgment module, configured to determine whether the laser beam has scanned the fracture according to the detection data, and if not, execute the detection data acquisition module; if so, execute the second scanning control module; a second scanning control module, configured to control the laser beam to scan the fracture surface at a second speed to deposit a repair layer, wherein the second speed is less than the first speed; A third scanning control module, after detecting that the laser beam has finished scanning the fracture, deposits a repair layer on the non-metallic layer by scanning at the first speed with the second repair hole as an end point.
9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the display panel line breakage repair device control method according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the display panel line breakage repair device control method according to any one of claims 1 to 7 when executed.
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