Probe pressure adjusting method, probe type measuring instrument and probe pressure adjusting device

Abstract

The invention provides a probe pressure adjusting method, a probe type measuring instrument, a probe pressure adjusting device, electronic equipment and a computer readable storage medium. The adjusting method comprises the steps that the relation between the initial height from the tip of a probe of the probe type measuring instrument to the surface of a sample and the pressure generated when the probe pierces the sample is obtained; and according to the relationship and the required pressure when the probe is pricked into the sample, setting the initial height from the tip of the probe to the surface of the sample so as to adjust the pressure when the probe is pricked into the sample. According to the invention, the probe of the same model can be used to adapt to wafers of different materials / different pricking depths.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film measurement, and in particular to a method for adjusting probe pressure, a probe-type measuring instrument, a probe pressure adjusting device, an electronic device and a computer-readable storage medium. Background Art

[0002] The four-probe measurement method is widely used to measure the square resistance Rs in various fields, especially in the production and manufacturing of semiconductor integrated circuit chips. The four-probe measurement is an essential means for the detection of various conductive film preparation processes. The four-probe measurement of square resistance requires precise control of the penetration depth of the probe into the sample to ensure the accuracy of the measurement results.

[0003] In order to match different wafer materials or to achieve a predetermined penetration depth into the wafer, traditional four-probe measuring instruments require probes with different probe pressures. That is to say, when the surface of the wafer needs to match different pressures (the pressure when the probe penetrates the wafer), the probe of the measuring instrument needs to be replaced.

[0004] Therefore, how to use the same type of probe head to adapt to wafers of different materials / different penetration depths has become the focus of technical personnel in this field. Summary of the invention

[0005] The purpose of the present invention is to provide a probe pressure adjustment method, a probe measuring instrument, a probe pressure adjustment device, an electronic device and a computer-readable storage medium, which can use the same type of probe probe to adapt to wafers of different materials / different penetration depths.

[0006] In order to achieve the above object, the present invention provides a method for adjusting probe pressure, which is applied to a probe type measuring instrument, and the method comprises:

[0007] Obtaining the relationship between the initial height of the needle tip of the probe of the probe type measuring instrument from the sample surface and the pressure when the probe penetrates the sample;

[0008] According to the relationship and the required pressure when the probe is inserted into the sample, the initial height of the needle tip of the probe from the sample surface is set to adjust the pressure when the probe is inserted into the sample.

[0009] In an optional solution, the relationship between the initial height and the pressure of the probe inserted into the sample is obtained according to the following formula:

[0010]

[0011]

[0012]

[0013]

[0014] Wherein, F is the pressure of the probe piercing into the sample, m is the sum of the masses of all the probes, k is the elastic coefficient of the spring, g is the acceleration of gravity, H is the initial height, v is the velocity variable from when the probe contacts the sample surface to when the probe stops piercing the sample, t is the time variable from when the probe contacts the sample surface to when the probe stops piercing the sample, x is the expansion length of the spring at time t, A, ω, are the amplitude, angular frequency and initial phase of simple harmonic oscillation respectively.

[0015] The present invention also provides a probe type measuring instrument, comprising: a spring, a probe, a processing unit, and a driving component and a lifting connecting rod connected to each other;

[0016] The lifting connecting rod is provided with a plurality of springs, each of which is connected to a probe below, and the needle tips of all the probes are located in the same plane;

[0017] The processing unit calculates the initial height of the needle tip of the probe from the sample surface based on the required pressure when piercing the sample;

[0018] The processing unit controls the movement of the driving component, and the driving component drives the lifting rod to move up and down. When the height between the needle tip of the probe and the sample surface is the initial height, the driving component stops moving, and the probe automatically falls along with the lifting rod, so that the probe is inserted into the sample with the required pressure when piercing the sample.

[0019] In an optional solution, the driving component includes a motor and a cam;

[0020] The processing unit controls the motor to rotate, the motor drives the cam to rotate, and the cam drives the lifting connecting rod to move up and down. When the height of the needle tip of the probe from the sample surface is the initial height, the processing unit controls the motor to decouple the cam to stop the driving component from moving.

[0021] In an optional solution, the probe-type measuring instrument has four probes, and the four probes are arranged in a straight line, and the distances between adjacent probes are equal.

[0022] The present invention also provides a probe pressure adjustment device, which is applied to a probe type measuring instrument, and the device comprises:

[0023] An acquisition module, used for obtaining the relationship between the initial height of the needle tip of the probe of the probe type measuring instrument from the sample surface and the pressure when the probe is inserted into the sample;

[0024] A calculation module, used for calculating the initial height of the needle tip of the probe from the sample surface according to the relationship and the required pressure when piercing the sample;

[0025] The control module is used to control the driving component to raise the probe until the height of the probe tip from the sample surface is the initial height.

[0026] The present invention also provides an electronic device, comprising:

[0027] A memory storing executable instructions;

[0028] A processor runs the executable instructions in the memory to implement the above-mentioned method for adjusting the probe pressure.

[0029] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned method for adjusting the probe pressure is implemented.

[0030] The beneficial effects of the present invention are:

[0031] The present invention can achieve the purpose of measuring wafers of different materials using the same type of probe by adjusting the descending height of the probe (i.e. setting the initial height of the probe) according to the needs of the sample to be measured.

[0032] The processing unit controls the movement of the driving component, which controls the lifting link to move up and down, so that the needle tip of the probe is at a set height (initial height) from the sample surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, in which like reference numerals generally represent like components.

[0034] Figure 1 Schematic diagram of the structure of a probe-type measuring instrument in one embodiment of the present invention.

[0035] Figure Number:

[0036] 1-lifting connecting rod; 2-spring; 3-probe; 4-sample; 5-cam. DETAILED DESCRIPTION

[0037] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description and drawings, the advantages and features of the present invention will become clearer. However, it should be noted that the concept of the technical solution of the present invention can be implemented in a variety of different forms and is not limited to the specific embodiments described herein. The drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0038] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0039] Spatially relative terms such as "under," "below," "below," "under," "above," "above," etc., may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "on" the other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0040] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0041] Example 1

[0042] This embodiment provides a method for adjusting probe pressure, which is applied to a probe type measuring instrument. The method includes:

[0043] Obtaining the relationship between the initial height of the needle tip of the probe of the probe type measuring instrument from the sample surface and the pressure when the probe penetrates the sample;

[0044] According to the relationship and the required pressure when the probe is inserted into the sample, the initial height of the needle tip of the probe from the sample surface is set to adjust the pressure when the probe is inserted into the sample.

[0045] In this embodiment, the relationship between the initial height and the pressure of the probe inserted into the sample is obtained according to the following formula:

[0046]

[0047]

[0048]

[0049]

[0050]

[0051] Wherein, F is the pressure of the probe piercing into the sample, m is the sum of the masses of all the probes, k is the elastic coefficient of the spring, g is the acceleration of gravity, H is the initial height, v is the velocity variable from when the probe contacts the sample surface to when the probe stops piercing the sample, t is the time variable from when the probe contacts the sample surface to when the probe stops piercing the sample, x is the expansion length of the spring at time t, A, ω, are the amplitude, angular frequency and initial phase of simple harmonic oscillation respectively.

[0052] Since the time t from when the probe contacts the sample surface to when it stops penetrating the sample is very short, t≈0 in the second formula, and the calculation formula for the pressure F when the probe penetrates the sample is obtained. In this formula, the total mass m of all probes, the elastic coefficient k of the spring, and the acceleration of gravity g are all known quantities. Therefore, the required pressure can be obtained by adjusting the initial height H of the probe tip from the sample surface.

[0053] This embodiment can achieve the purpose of measuring wafers of different materials using the same type of probe probe by adjusting the descent height of the probe tip (i.e. setting the initial height of the probe tip) according to the pressure requirements of wafers of different materials / different penetration depths.

[0054] Example 2

[0055] Reference Figure 1 , this embodiment provides a probe type measuring instrument, comprising:

[0056] Spring 2, probe 3, processing unit and mutually connected driving components and lifting link 1;

[0057] The lifting connecting rod 1 is provided with a plurality of springs 2, each spring 2 is connected with a probe 3 below, and the needle tips of all the probes 3 are located in the same plane;

[0058] The processing unit calculates the initial height of the needle tip of the probe 3 from the surface of the sample 4 based on the required pressure when piercing the sample 4;

[0059] The processing unit controls the movement of the driving component, and the driving component drives the lifting rod 1 to move up and down. When the height between the needle tip of the probe 3 and the surface of the sample 4 is the initial height H, the driving component stops moving, and the probe automatically falls along with the lifting rod 1, so that the probe 3 is inserted into the sample 4 with the required pressure when piercing the sample.

[0060] In this embodiment, the driving component includes a motor and a cam 5; the processing unit controls the rotation of the motor, the motor drives the cam 5 to rotate, and the cam 5 drives the lifting link 1 to move up and down (because the rotation center of the cam 5 is fixed and its outer arc surface is variable, it can drive the lifting link 1 in contact with the outer arc surface to move up and down according to the change of the outer contour of the cam 5). When the height of the needle tip of the probe 3 from the sample surface is the initial height H, the processing unit controls the motor to decouple from the cam 5 to stop the movement of the driving component.

[0061] In this embodiment, the probe type measuring instrument has four probes, and the four probes are arranged in a straight line, and the distances between adjacent probes are equal.

[0062] Example 3

[0063] This embodiment provides a probe pressure adjustment device, which is applied to a probe type measuring instrument, and the device includes:

[0064] An acquisition module, used for obtaining the relationship between the initial height of the needle tip of the probe of the probe type measuring instrument from the sample surface and the pressure when the probe is inserted into the sample;

[0065] A calculation module, used for calculating the initial height of the needle tip of the probe from the sample surface according to the relationship and the required pressure when piercing the sample;

[0066] The control module is used to control the driving component to raise the probe until the height of the probe tip from the sample surface is the initial height.

[0067] Example 4

[0068] This embodiment provides an electronic device, including:

[0069] A memory storing executable instructions;

[0070] A processor runs the executable instructions in the memory to implement the above-mentioned method for adjusting the probe pressure.

[0071] The processing unit according to the embodiment of the present disclosure includes a memory and a processor. The memory is used to store non-temporary computer-readable instructions. Specifically, the memory may include one or more computer program products, and the computer program product may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may, for example, include a random access memory (RAM) and / or a cache memory (cache), etc. The non-volatile memory may, for example, include a read-only memory (ROM), a hard disk, a flash memory, etc.

[0072] The processor may be a central processing unit (CPU) or other forms of processing modules having data processing capabilities and / or instruction execution capabilities, and may control other components in the processing unit to perform desired functions. In one embodiment of the present disclosure, the processor is used to run the computer-readable instructions stored in the memory.

[0073] Those skilled in the art should be able to understand that in order to solve the technical problem of how to obtain a good user experience, the present embodiment may also include well-known structures such as a communication bus and an interface, and these well-known structures should also be included in the protection scope of the present disclosure.

[0074] In this embodiment, the probe type measuring instrument has four probes, and the four probes are arranged in a straight line, and the distances between adjacent probes are equal.

[0075] Example 5

[0076] This embodiment provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned method for adjusting the probe pressure is implemented.

[0077] The computer-readable storage medium according to this embodiment stores non-transitory computer-readable instructions, and when the non-transitory computer-readable instructions are executed by a processor, all or part of the steps of the methods of the embodiments of the present disclosure are executed.

[0078] The above-mentioned computer-readable storage media include, but are not limited to: optical storage media (e.g., CD-ROM and DVD), magneto-optical storage media (e.g., MO), magnetic storage media (e.g., magnetic tape or mobile hard disk), media with built-in rewritable non-volatile memory (e.g., memory card) and media with built-in ROM (e.g., ROM box).

[0079] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A method for adjusting probe pressure, applied to a probe type measuring instrument, characterized in that: The method comprises: Obtaining the relationship between the initial height of the needle tip of the probe of the probe type measuring instrument from the sample surface and the pressure when the probe penetrates the sample; According to the relationship and the required pressure when the probe is inserted into the sample, the initial height of the needle tip of the probe from the sample surface is set to adjust the pressure when the probe is inserted into the sample.

2. The method for adjusting probe pressure according to claim 1, characterized in that: The relationship between the initial height and the pressure of the probe inserted into the sample is obtained according to the following formula; Wherein, F is the pressure of the probe piercing into the sample, m is the sum of the masses of all the probes, k is the elastic coefficient of the spring, g is the acceleration of gravity, H is the initial height, v is the velocity variable from when the probe contacts the sample surface to when the probe stops piercing the sample, t is the time variable from when the probe contacts the sample surface to when the probe stops piercing the sample, x is the expansion length of the spring at time t, A, ω, are the amplitude, angular frequency and initial phase of simple harmonic oscillation respectively.

3. A probe type measuring instrument, characterized in that: include: Springs, probes, processing units and interconnected drive components and lifting links; The lifting connecting rod is provided with a plurality of springs, each of which is connected to a probe below, and the needle tips of all the probes are located in the same plane; The processing unit calculates the initial height of the probe tip from the sample surface based on the required pressure when piercing the sample; The processing unit controls the movement of the driving component, and the driving component drives the lifting rod to move up and down. When the height between the needle tip of the probe and the sample surface is the initial height, the driving component stops moving, and the probe automatically falls along with the lifting rod, so that the probe is inserted into the sample with the required pressure when piercing the sample.

4. A probe type measuring instrument as claimed in claim 3, characterized in that: The driving component includes a motor and a cam; The processing unit controls the motor to rotate, the motor drives the cam to rotate, and the cam drives the lifting connecting rod to move up and down. When the height of the needle tip of the probe from the sample surface is the initial height, the processing unit controls the motor to decouple the cam to stop the driving component from moving.

5. A probe type measuring instrument as claimed in claim 3, characterized in that: The probe type measuring instrument has four probes, which are arranged in a straight line, and the distances between adjacent probes are equal.

6. A probe pressure adjustment device, applied to a probe type measuring instrument, the device comprising: An acquisition module, used for obtaining the relationship between the initial height of the needle tip of the probe of the probe type measuring instrument from the sample surface and the pressure when the probe is inserted into the sample; A calculation module, used for calculating the initial height of the needle tip of the probe from the sample surface according to the relationship and the required pressure when piercing the sample; The control module is used to control the moving component to raise the probe until the height of the probe tip from the sample surface is the initial height.

7. An electronic device, characterized in that: include: A memory storing executable instructions; A processor, wherein the processor runs the executable instructions in the memory to implement the probe pressure adjustment method according to claim 1 or 2.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for adjusting the probe pressure of claim 1 or 2 is implemented.

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