A performance analysis method for high-temperature extreme working conditions conducted emission test probe

Abstract

The present invention discloses a performance analysis method for a conduction emission detection probe under extreme high-temperature operating conditions, comprising the following steps: S1. constructing an electromagnetic field simulation model for the conduction emission detection probe's operating scenario and calculating the electromagnetic loss power of each component in that scenario; S2. constructing a temperature field simulation model for the conduction emission detection probe's operating scenario and obtaining the temperature distribution of each component in that scenario; S3. constructing a mechanical field simulation model for the conduction emission detection probe's operating scenario and obtaining the structural thermal deformation results of each component; S4. constructing an electromagnetic field simulation model for the conduction emission detection probe's operating scenario under thermal deformation conditions and calculating the performance indicators of the conduction emission detection probe. Using three-dimensional electromagnetic, thermal, and mechanical field simulation analysis software, the present invention can more accurately determine the performance changes of the conduction detection probe under extreme high-temperature operating conditions, providing data support for optimizing high-temperature conduction emission detection probes.

Description

Technical Field

[0001] The present invention relates to the field of conducted emission electromagnetic interference detection of complex electronic systems. Specifically, the present invention implements a performance analysis method for conducted emission test probes under high temperature extreme working conditions by modeling the multi-physical field coupling effects of conducted emission test probes that measure conducted interference currents on transmission cables of complex electronic systems under extreme working conditions such as high temperature. Background Art

[0002] With the continuous advancement of electronic technologies such as chips and electronic packaging, electronic systems are becoming increasingly integrated and their structures are becoming more complex. To ensure signal transmission delay within integrated circuits, the size of complex electronic systems continues to shrink, yet circuit integration is increasing, and their operating spectrum density is significantly increasing. However, a major challenge facing complex electronic systems is the intensification of electromagnetic compatibility (EMC) issues. This increased operating spectrum density leads to increasingly serious issues with signal integrity and power integrity in device signal transmission, especially between complex electronic systems. In particular, system interference caused by interference is becoming increasingly severe. Signal transmission in complex electronic systems uses numerous cables for power distribution and signal transmission. Electromagnetic interference can generate interference currents in cables through coupling and be transmitted to sensitive devices. When the interference energy is excessive, it can adversely affect the normal operation of sensitive devices. Among many EMC issues, cables are often a major source of interference. Therefore, to verify the EMC of complex electronic systems and accurately measure the conducted interference currents caused by EMI in cables within these systems, conducted emission detection probes are required. However, in actual operating conditions, cables often operate in unconventional or even extremely high-temperature environments. Therefore, conductive detection probes are inevitably placed in these environments, which can easily affect their test accuracy. Each physical property of a current probe is affected in actual operating environments, and there is a certain degree of coupling between electromagnetic, thermal, and mechanical properties. However, current research rarely considers the performance changes of conductive emission probes under extreme high temperatures, making it difficult to provide a reference for the forward design and optimization of high-temperature conductive emission detection probes. Summary of the Invention

[0003] The purpose of the present invention is to overcome the shortcomings of the existing technology and provide a performance analysis method for conduction emission test probes under high-temperature extreme working conditions. Through three-dimensional electromagnetic field, thermal and mechanical field simulation analysis software, the performance changes of the conduction detection probe under high-temperature extreme working conditions can be more accurately obtained, providing data support for the optimization of high-temperature conduction emission detection probes.

[0004] The object of the present invention is achieved through the following technical solution: A performance analysis method for a high-temperature extreme working condition conducted emission test probe comprises the following steps:

[0005] S1. Construct an electromagnetic field simulation model for the conducted emission detection probe working scenario, obtain the voltage and current of each component in the conducted emission detection probe working scenario based on the electromagnetic field simulation model, and calculate the electromagnetic loss power of each component in the conducted emission detection probe working scenario;

[0006] The step S1 comprises:

[0007] S101. Components of a given conducted emission detection probe in a working scenario: Assume that the working scenario is to test a cable under test using a conducted emission detection probe, where the conducted emission detection probe includes a magnetic core, a winding coil, and a filler medium. The conducted emission detection probe working scenario then includes four components: the magnetic core, the winding coil, the filler medium, and the cable under test.

[0008] S102. Construct a three-dimensional model of each component in the working scene of the conducted emission detection probe;

[0009] S103. Add material parameters for each component and their changes with temperature:

[0010] The material parameters mainly include magnetic permeability μ, dielectric constant ε and electrical conductivity σ;

[0011] The changes of the material parameters with temperature include:

[0012] For each component, the material parameters include magnetic permeability μ, dielectric constant ε and electrical conductivity σ;

[0013] The changes of the material parameters with temperature include:

[0014] The magnetic permeability changes with temperature. For each component, the magnetic permeability μ at room temperature is first given, and then the magnetic permeability μ1, μ2...μ at different N high temperature extreme working conditions are given. N , where N represents the total number of temperatures of the high temperature limit condition; the magnetic permeability at different temperatures is linearly interpolated to obtain the magnetic permeability versus temperature curve, so that the magnetic permeability changes with temperature;

[0015] Changes in conductivity with temperature: For each component, the conductivity at the reference temperature t1 is recorded as σ, and the conductivity change coefficient at N different high temperature extreme working conditions is given. The change of conductivity with temperature is obtained by multiplying the conductivity σ at the reference temperature t1 by the conductivity variation coefficient;

[0016] Dielectric constant changes with temperature: For each component, the dielectric constant at room temperature t1 is given as ε, and the dielectric constants at N different high temperature extreme working conditions are given as ε1, ε2...ε N, linear interpolation of the dielectric constant at different temperatures is performed to obtain the dielectric constant versus temperature curve as the core permeability, and the dielectric constant of the medium changes with temperature;

[0017] To simplify the modeling, for the magnetic core, the change in magnetic permeability is mainly considered. For the winding coil and the tested cable, their materials are copper, and only the change in electrical conductivity is considered. Assuming that the temperature at one high temperature limit is t2, then:

[0018]

[0019] For filling media, the change of dielectric constant is mainly considered.

[0020] S104. Set the system input and load: Set the measured current on the tested cable to I1 and the winding coil output to a 50Ω resistor R as the load.

[0021] S105. Set the size conditions of the simulation electromagnetic field grid: Set the operating frequency f, according to the formula Calculate the metal skin depth d and set the internal mesh size of the winding coil and the tested cable to no more than d / 2;

[0022] S106. According to the settings of steps S102 to S105, an electromagnetic field simulation model of the conducted emission detection probe working scenario is constructed in the simulation software. The parasitic capacitance C, the winding coil inductance L, and the induced voltage U across the winding coil output load R of the conducted emission detection probe at room temperature are obtained by simulation. The transmission impedance Z at the working frequency f and the resonant frequency are calculated by the formula Z=U / I1.

[0023] The parasitic capacitance C refers to the total distributed capacitance on the winding coil at room temperature. The resonant frequency refers to the operating frequency at which the parasitic capacitance C and the winding coil inductance L resonate. That is, when the operating frequency f equals the resonant frequency, the transmission impedance will suddenly change, causing the probe to malfunction.

[0024] S107. Obtain the voltage and current of each component of the conducted emission detection probe from the simulation software, and obtain the electromagnetic loss power of each component according to the power formula W=U·I.

[0025] S2. Based on the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe, a temperature field simulation model of the working scenario of the conducted emission detection probe is constructed, and the temperature distribution of each component in the working scenario of the conducted emission detection probe is obtained according to the temperature field simulation model;

[0026] The step S2 comprises:

[0027] S201. Set material parameters: Add thermal analysis parameters of each component in the working scenario of the conduction emission detection probe, including: material heat transfer coefficient and specific heat capacity;

[0028] S202. Setting thermal simulation environment conditions: Setting the ambient temperature of the conducted emission detection probe to any one of the N high temperature limit conditions, and using the electromagnetic loss obtained in step S1 as the input load in the temperature field simulation;

[0029] S203. Set the temperature field grid size conditions of the temperature field simulation software, that is, set the maximum temperature grid size x1, x1 is a custom preset size, and make it as uniform and regular as possible under the resource conditions of the simulation software to ensure good convergence and accuracy;

[0030] S204. According to the settings of steps S201 to S203, a temperature field simulation model of the conducted emission detection probe in the working scenario is constructed using temperature field simulation software, and temperature simulation is performed to obtain an accurate temperature distribution of the conducted emission detection probe.

[0031] S3. Combined with the temperature distribution of each component in the working scene of the conducted emission detection probe, a mechanical field simulation model of the working scene of the conducted emission detection probe is constructed, and based on the mechanical field simulation model, the structural thermal deformation results of each component in the working scene of the conducted emission detection probe are obtained;

[0032] The step S3 comprises:

[0033] S301. Set material parameters: Add material parameters related to structural analysis for each component, including thermal expansion coefficient, elastic modulus, and Poisson's ratio;

[0034] S302. Add simulation settings of mechanical field simulation software: the thermal distribution obtained in step S2 is used as the initial condition for mechanical field analysis;

[0035] S303. Set the size conditions of the mechanical field grid of the mechanical field simulation software, that is, set the maximum grid size of the mechanical field to x2, where x2 is a custom preset size. Make it as uniform and regular as possible under the resource conditions of the simulation software to ensure good convergence and accuracy.

[0036] S304. According to the settings of steps S301 to S303, a mechanical field simulation model of the conducted emission detection probe working scene is constructed by mechanical field simulation software, and the conducted emission detection probe is simulated to obtain accurate thermal deformation results;

[0037] S305. Output the thermal deformation results of the conducted emission detection probe structure in the form of a three-dimensional model.

[0038] S4. Based on the structural thermal deformation results of each component in the working scenario of the conducted emission detection probe, an electromagnetic field simulation model of the working scenario of the conducted emission detection probe under thermal deformation conditions is constructed. Based on the electromagnetic field simulation model, the equivalent circuit parameters are obtained and the performance indicators of the conducted emission test probe are calculated.

[0039] The step S4 comprises:

[0040] S401. Add simulation settings: Use the 3D model of the thermal deformation results of the conducted emission detection probe as the simulation model, and the temperature distribution as the initial condition for the electromagnetic field analysis;

[0041] S402. The parasitic capacitance C′ and the winding inductance L′ of the conducted emission detection probe are obtained by simulation under the influence of high temperature t2 and structural thermal deformation, and the induced voltage U′ across the winding output load R is obtained by simulation;

[0042] Among them, the parasitic capacitance C′ is the sum of the distributed capacitance on the winding coil under the influence of high temperature t2 and structural thermal deformation;

[0043] S403. Calculate the performance indicators of the conducted emission test probe:

[0044] Calculate the transmission impedance Z′=U′ / I1 of the conducted emission detection probe under the influence of high temperature t2 and structural thermal deformation, and the resonant frequency is

[0045] S404. Calculate the absolute value of the difference between Z' and the transmission impedance Z at room temperature. The smaller the absolute value of the difference, the better the stability of the conducted emission detection probe. Furthermore, when setting the operating frequency at high temperature t2, it should be below the resonant frequency to avoid the impact of resonance on normal operation. In this application, the performance of the conducted emission detection probe is primarily reflected in the transmission impedance and resonant frequency. By analyzing the changes in transmission impedance under extreme high temperature conditions, the conducted emission detection probe test results can be made more accurate under these conditions. By analyzing the resonant frequency, the operating frequency can be set below the resonant frequency to avoid impacting normal operation.

[0046] At high temperature t2, the performance of the conducted emission detection probe at different frequencies can also be evaluated by setting different operating frequencies;

[0047] Under N different high temperature extreme working conditions, for any high temperature, the transmission impedance and resonant frequency analysis can be performed according to steps S2 to S4.

[0048] The beneficial effects of the present invention are as follows: during operation, the conduction emission detection probe generates heat and is in an extreme high-temperature working condition. At this time, the material properties of the components will change with the change of temperature, and due to the high temperature, the components will inevitably undergo thermal deformation, which changes the spacing between the components, thereby causing the parasitic parameters between the components to be affected by the dual influence of temperature and structural deformation, and the probe performance will be affected. The present invention uses three-dimensional electromagnetic field, thermal, and mechanical field simulation analysis software to more accurately obtain the performance changes of the conduction detection probe under extreme high-temperature working conditions, providing data support for the optimization of high-temperature conduction emission detection probes. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 is a flow chart of the method of the present invention;

[0050] Figure 2 This is a flow chart of the simulation of multi-physical field coupling effects of the conducted emission detection probe under high temperature extreme working conditions of the present invention;

[0051] Figure 3 This is a schematic diagram of the simulation model of the conducted emission detection probe;

[0052] Figure 4 This is the encrypted grid diagram of the simulation model of the conducted emission detection probe within the skin depth;

[0053] Figure 5 This is the magnetic flux density distribution diagram of the magnetic core of the conducted emission detection probe;

[0054] Figure 6 This is the temperature distribution diagram of the conducted emission detection probe simulation model under extreme high temperature conditions;

[0055] Figure 7 This is the mechanical field mesh diagram of the conducted emission detection probe model;

[0056] Figure 8 This is the structural thermal deformation result diagram of the conducted emission detection probe simulation model;

[0057] Figure 9 This is the transmission impedance frequency response curve of the conducted emission detection probe. DETAILED DESCRIPTION

[0058] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0059] Using three-dimensional electromagnetic, thermal, and mechanical field simulation analysis software, the performance changes of conductive emission detection probes under extreme high-temperature conditions can be more accurately determined. This multi-physics field coupling effect modeling and simulation method provides relatively accurate data support for analyzing the measurement accuracy fluctuations of conductive emission detection probes under extreme high-temperature conditions, as well as for the forward design and optimization of high-temperature conductive emission detection probes. First, an electromagnetic simulation model of the conductive emission detection probe is established using electromagnetic field simulation software. By simulating the electromagnetic field changes in space, the current and magnetic field distributions on the different components of the conductive emission detection probe are calculated, thereby obtaining the changes in the distributed parameters of the conductive emission detection probe and its performance indicators such as transmission impedance and cutoff frequency. Because the temperature changes and mechanical deformation of the conductive emission detection probe cannot be calculated in electromagnetic field simulation, coupled simulation is performed with other physical fields. By calculating the electromagnetic loss of the conductive emission detection probe under normal temperature conditions, the model electromagnetic loss is used as the input load in the temperature field simulation. The temperature and fluid state of the conductive emission detection probe's environment are set in the temperature field simulation to simulate the probe's actual high-temperature extreme operating conditions. Finally, through temperature field simulation, the temperature distribution of the conduction emission detection probe is simulated and calculated and fed back to the electromagnetic field simulation, and the electromagnetic loss and performance changes of the conduction emission detection probe model at this temperature are recalculated. After repeated coupling several times, a more accurate temperature distribution of the conduction emission detection probe model will be obtained. In the mechanical field software, the corresponding contact form and constraint conditions are set, and the obtained model temperature distribution is used as the initial condition of the heat source. The structural deformation of the probe structure under the temperature condition and electromagnetic action is simulated and calculated, and the magnetic field distribution of the deformed model is recalculated. Through the extracted parasitic parameters, the field-path collaborative calculation is performed to obtain the transmission impedance of the conduction emission detection probe, thereby realizing the modeling and simulation of the multi-physical field coupling effect of the conduction emission detection probe in extreme electromagnetic environments such as high temperature. Specifically:

[0060] like Figure 1 As shown, a performance analysis method for a high-temperature extreme working condition conducted emission test probe includes the following steps:

[0061] S1. Construct an electromagnetic field simulation model for the conducted emission detection probe working scenario, obtain the voltage and current of each component in the conducted emission detection probe working scenario based on the electromagnetic field simulation model, and calculate the electromagnetic loss power of each component in the conducted emission detection probe working scenario;

[0062] According to the coupling relationship analysis of the conducted emission detection probe, a simulation process of the multi-physical field coupling effect of the conducted emission detection probe is established, such as Figure 2 A conducted emission detection probe mainly consists of three parts during operation: winding, magnetic core, and tested cable. Figure 3As shown in the figure, import the current probe CAD model into the Maxwell electromagnetic simulation module in Workbench. Material properties need to be assigned to each component. Since the cable and winding models do not contain an insulation layer, the model material can be set to copper. The cable is considered to be composed of multiple tightly wound turns of copper wire, while the winding is considered to be a single turn of wire. The insulation medium is polyvinyl chloride, and the core is made of Ferrite.

[0063] To ensure accurate measurement of the emission and conduction detection probe in high-temperature environments, we first needed to simulate and model the electromagnetic performance of the probe under multi-physics field coupling. Since the conducted emission monitoring probe primarily detects magnetic field changes generated by the cable, the laws of electromagnetic induction generate induced voltages and currents in the windings. Because the model requires subsequent bidirectional coupling simulation with icepak temperature field simulation software, it is necessary to define the material's temperature characteristics.

[0064] Copper's material properties (primarily conductivity) vary with temperature, altering the distributed resistance. This, in turn, affects the temperature distribution of the conducted emission detection probe. This causes the distributed parameters of the probe structure to vary in different areas due to the temperature distribution, ultimately affecting the probe's transmission impedance and other performance characteristics. The core material properties play a key role in influencing the current probe's transmission impedance. Therefore, it is necessary to accurately define the core material's temperature characteristics. For example, the core permeability can be calculated by dividing the permeability at different temperatures by the room-temperature permeability to obtain the core permeability temperature variation coefficient. The room-temperature core permeability is used as the initial parameter in the simulation, and the temperature coefficient is multiplied by the room-temperature permeability to obtain the permeability under extreme high-temperature conditions. Furthermore, it is necessary to configure the temperature-dependent variations in the dielectric constant and loss factor of filling insulating materials, such as polyvinyl chloride, at both room and high-temperature extremes.

[0065] Due to the skin effect and proximity effect, the AC current will be mainly distributed on the surface of the winding model. The current magnitude decays exponentially from the surface to the center of the coil. Therefore, if the winding resistance is to be accurately calculated, the mesh within the skin depth of the coil must be denser to ensure that there are at least two layers of mesh on the coil surface to ensure the accuracy of the resistance calculation. The mesh of the single-turn coil cross section is as follows: Figure 4 As shown. After the solution is completed, the output voltage on the 50Ω load is obtained. The output voltage of the conducted emission detection probe at room temperature and 10MHz is 1.49mV, the measured current is 1.12mA, the electromagnetic loss is 0.0009W for the cable, 0.00636W for the winding coil, the transmission impedance of the conducted emission detection probe is 1.33Ω, the distributed capacitance is 2.658pF, the distributed inductance is 12uH, and the resonant frequency is 28.2MHz. At this time, the magnetic flux density on the core is evenly distributed, so the measurement is more accurate. The magnetic flux density distribution of the magnetic core of the conducted emission detection probe is as follows: Figure 5 shown.

[0066] S2. Based on the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe, a temperature field simulation model of the working scenario of the conducted emission detection probe is constructed, and the temperature distribution of each component in the working scenario of the conducted emission detection probe is obtained according to the temperature field simulation model;

[0067] This requires bidirectional coupling simulation of Maxwell and Icepak temperature field software to import electromagnetic losses into Icepak. After importing electromagnetic losses, Icepak completes the corresponding temperature field calculation with the ambient temperature at 80°C and feeds the temperature field results back to Maxwell after each iteration converges. After repeated coupling feedback, when the results converge, a more accurate temperature distribution of the current probe in a high temperature environment is obtained, such as Figure 6 shown.

[0068] S3. Combined with the temperature distribution of each component in the working scene of the conducted emission detection probe, a mechanical field simulation model of the working scene of the conducted emission detection probe is constructed, and based on the mechanical field simulation model, the structural thermal deformation results of each component in the working scene of the conducted emission detection probe are obtained;

[0069] After completing the temperature field simulation, it is necessary to perform structural field simulation on the current probe, apply the temperature distribution of the conduction emission detection probe to the mechanical field simulation software Mechanical as the initial condition of the simulation, and set the corresponding constraints and boundary conditions for the conduction emission detection probe and divide the mechanical field grid as follows: Figure 7 ,The thermal deformation results of the current probe under extreme high temperature conditions are solved through mechanical field simulation. Figure 8 shown.

[0070] S4. Based on the structural thermal deformation results of each component in the working scenario of the conducted emission detection probe, an electromagnetic field simulation model of the working scenario of the conducted emission detection probe under thermal deformation conditions is constructed. Based on the electromagnetic field simulation model, the equivalent circuit parameters are obtained and the performance indicators of the conducted emission test probe are calculated.

[0071] In order to accurately analyze the impact of temperature and structural deformation on the performance of the conducted emission detection probe, the thermal deformation model of the probe is exported, and the electromagnetic field simulation calculation is performed again on the model. Through field-circuit collaborative simulation, the influence of parasitic parameters can be considered in the electromagnetic field simulation calculation process to obtain more accurate electromagnetic simulation results. After re-simulating the electromagnetic field, the results in the Maxwell software show that the output voltage of the conducted emission detection probe is 4.437mV at 80°C, and the measured current is still 1.12mA. At this time, the transmission impedance is 3.96Ω, and the transmission impedance changes by 2.77 times. The distributed capacitance changes to 1.858pF due to the influence of temperature, and the distributed inductance is 26uH. The resonant frequency is 22.90MHz. The conducted emission detection probe model is simulated at different operating frequencies, and its output voltage frequency response curve before the resonant frequency is as follows: Figure 9 shown.

[0072] This invention can provide relatively accurate data support for analyzing the measurement accuracy fluctuations of conducted emission detection probes under extreme high-temperature conditions, as well as for the forward design and optimization of high-temperature conducted emission detection probes. It can also calibrate the errors in the measurement results of conducted emission detection probes in non-standard electromagnetic measurement environments, overcoming the problem of large measurement errors caused by performance fluctuations of traditional conducted emission detection probes in actual working environments, and can support future engineering applications.

[0073] The foregoing description shows and describes a preferred embodiment of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the form disclosed herein and should not be construed as excluding other embodiments. Instead, the present invention is applicable to various other combinations, modifications, and environments and is capable of modification within the scope of the inventive concept described herein, through the teachings above, or through techniques or knowledge in the relevant art. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention are intended to be within the scope of the appended claims.

Claims

1. A performance analysis method for a high-temperature extreme working condition conducted emission test probe, characterized by: The following steps are involved: S1. Construct an electromagnetic field simulation model for the conducted emission detection probe working scenario, obtain the voltage and current of each component in the conducted emission detection probe working scenario based on the electromagnetic field simulation model, and calculate the electromagnetic loss power of each component in the conducted emission detection probe working scenario; S2. Based on the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe, a temperature field simulation model of the working scenario of the conducted emission detection probe is constructed, and the temperature distribution of each component in the working scenario of the conducted emission detection probe is obtained according to the temperature field simulation model; S3. Combined with the temperature distribution of each component in the working scene of the conducted emission detection probe, a mechanical field simulation model of the working scene of the conducted emission detection probe is constructed, and based on the mechanical field simulation model, the structural thermal deformation results of each component in the working scene of the conducted emission detection probe are obtained; S4. Based on the structural thermal deformation results of each component in the working scenario of the conducted emission detection probe, an electromagnetic field simulation model of the working scenario of the conducted emission detection probe under thermal deformation conditions is constructed. Based on the electromagnetic field simulation model, the equivalent circuit parameters are obtained and the performance indicators of the conducted emission test probe are calculated.

2. The performance analysis method for a high-temperature extreme working condition conducted emission test probe according to claim 1 is characterized by: The step S1 comprises: S101. Components of a conducted emission detection probe in a given working scenario: Assume that the working scenario is to use a conducted emission detection probe to test a cable under test, wherein the conducted emission detection probe includes a magnetic core and a winding coil wound on the magnetic core, and the magnetic core and the winding coil are encapsulated by a filling material; The working scene of the conducted emission detection probe contains four components: the magnetic core, the winding coil, the filling medium and the cable under test; S102. Construct a three-dimensional model of each component in the working scene of the conducted emission detection probe; S103. Add material parameters for each component and their changes with temperature: For each component, the material parameters include magnetic permeability μ, dielectric constant ε and electrical conductivity σ; The changes of the material parameters with temperature include: The magnetic permeability changes with temperature. For each component, the magnetic permeability μ at room temperature is first given, and then the magnetic permeability μ1, μ2...μ at different N high temperature extreme working conditions are given. N , where N represents the total number of temperatures of the high temperature limit condition; the magnetic permeability at different temperatures is linearly interpolated to obtain the magnetic permeability versus temperature curve, so that the magnetic permeability changes with temperature; Changes in conductivity with temperature: For each component, the conductivity at the reference temperature t1 is recorded as σ, and the conductivity change coefficient at N different high temperature extreme working conditions is given. The change of conductivity with temperature is obtained by multiplying the conductivity σ at the reference temperature t1 by the conductivity variation coefficient; Dielectric constant changes with temperature: For each component, the dielectric constant at room temperature t1 is given as ε, and the dielectric constants at N different high temperature extreme working conditions are given as ε1, ε2...ε N , linear interpolation of the dielectric constant at different temperatures is performed to obtain the dielectric constant versus temperature curve as the core permeability, and the dielectric constant of the medium changes with temperature; S104. Set the system input and load: Set the measured current on the tested cable to I1 and the winding coil output to a 50Ω resistor R as the load. S105. Set the size conditions of the simulation electromagnetic field grid: Set the operating frequency f, according to the formula Calculate the metal skin depth d and set the internal mesh size of the winding coil and the tested cable to no more than d / 2; S106. According to the settings of steps S102 to S105, an electromagnetic field simulation model of the conducted emission detection probe working scenario is constructed in the simulation software. The parasitic capacitance C, the winding coil inductance L, and the induced voltage U across the winding coil output load R of the conducted emission detection probe at room temperature are obtained by simulation. The transmission impedance Z at the working frequency f and the resonant frequency are calculated by the formula Z=U / I1. The parasitic capacitance C refers to the total distributed capacitance on the winding coil at room temperature. The resonant frequency refers to the operating frequency at which the parasitic capacitance C and the winding coil inductance L resonate. That is, when the operating frequency f equals the resonant frequency, the transmission impedance will suddenly change, causing the probe to malfunction. S107. Obtain the voltage and current of each component of the conducted emission detection probe from the simulation software, and obtain the electromagnetic loss power of each component according to the power formula W=U·I.

3. The performance analysis method for a high-temperature extreme working condition conducted emission test probe according to claim 2 is characterized by: The step S2 comprises: S201. Set material parameters: Add thermal analysis parameters of each component in the working scenario of the conduction emission detection probe, including: material heat transfer coefficient and specific heat capacity; S202. Setting the thermal simulation environment conditions of the temperature field simulation software: Setting the ambient temperature of the conducted emission detection probe to any one of the N high temperature limit conditions t2, and using the electromagnetic loss obtained in step S1 as the input load in the temperature field simulation; S203. Set the temperature field grid size conditions of the temperature field simulation software, ie, set the maximum temperature grid size; S204. According to the settings of steps S201 to S203, a temperature field simulation model of the conducted emission detection probe in the working scenario is constructed using temperature field simulation software, and temperature simulation is performed to obtain an accurate temperature distribution of the conducted emission detection probe.

4. The performance analysis method for a high-temperature extreme working condition conducted emission test probe according to claim 1 is characterized by: The step S3 comprises: S301. Set material parameters: Add material parameters related to structural analysis for each component, including thermal expansion coefficient, elastic modulus, and Poisson's ratio; S302. Add simulation settings of mechanical field simulation software: the thermal distribution obtained in step S2 is used as the initial condition for mechanical field analysis; S303 sets the mechanical field simulation software mechanical field grid size conditions, ie, sets the maximum mechanical field grid size; S304. According to the settings of steps S301 to S303, a mechanical field simulation model of the conducted emission detection probe working scene is constructed by mechanical field simulation software, and the conducted emission detection probe is simulated to obtain accurate thermal deformation results; S305. Output the thermal deformation results of the conducted emission detection probe structure in the form of a three-dimensional model.

5. The performance analysis method for a high-temperature extreme working condition conducted emission test probe according to claim 2 is characterized by: The step S4 comprises: S401. Add simulation settings: Use the 3D model of the thermal deformation results of the conducted emission detection probe as the simulation model, and the temperature distribution as the initial condition for the electromagnetic field analysis; S402. The parasitic capacitance C' and the winding inductance L' of the conducted emission detection probe are obtained by simulation under the influence of high temperature t2 and structural thermal deformation, and the induced voltage U' across the winding output load R is obtained by simulation; Among them, the parasitic capacitance C′ is the sum of the distributed capacitance on the winding coil under the influence of high temperature t2 and structural thermal deformation; S403. Calculate the performance indicators of the conducted emission test probe: Calculate the transmission impedance Z′=U′ / I1 of the conducted emission detection probe under the influence of high temperature t2 and structural thermal deformation, and the resonant frequency is S404. Calculate the absolute value of the difference between Z′ and the transmission impedance Z at room temperature. The smaller the absolute value of the difference, the better the stability of the conducted emission detection probe. When setting the operating frequency at high temperature t2, the operating frequency needs to be lower than the resonant frequency to avoid the influence of resonance on normal operation.

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