Light transmitting and receiving integrated assembly and related equipment

Abstract

The embodiment of the invention discloses an optical transceiver integrated assembly and related equipment, which are used for reducing the connection cost between a BOSA and a PCB under the condition that the signal bandwidth is improved. The optical transceiving integrated assembly provided by the embodiment of the invention comprises a first pin surface, a second pin surface and a plurality of pins extending from the first pin surface, wherein the first pin surface is not parallel to the second pin surface. And a pin extending from the first pin surface and a pin extending from the second pin surface are used for communicating with different optical paths in the BOSA. The plurality of pins comprise signal pins and grounding pins, the signal pins are used for transmitting communication signals, and the grounding pins are used for grounding. On the first pin surface, the distance between the signal pin and the grounding pin is d1, d1 is the minimum pin spacing on the first pin surface, and the grounding pin is used for providing a signal loop and suppressing electromagnetic resonance on the signal pin.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of optical communications, and in particular, to an integrated optical transceiver assembly and related equipment. Background Art

[0002] In optical communication equipment, the bi-directional optical sub-assembly (BOSA) includes a receiving optical path (receiver, RX) and a transmitting optical path (transport, TX). BOSA is used to receive and send optical signals. BOSA needs to be connected to a printed circuit board (PCB) to form a circuit loop between BOSA and PCB. The circuit loop is used to transmit electrical signals between BOSA and PCB. The commonly used connection method is to connect BOSA to PCB through a flexible printed circuit (FPC) or pins on BOSA.

[0003] With the development of optical communication technology, the bandwidth of signals transmitted in communication networks is getting larger and larger. FPC can support the transmission of large-bandwidth signals, but the preparation process is complex and the cost is high. If FPC is used to connect BOSA and PCB, it will lead to high costs. The preparation process of the pin is simple and low-cost, but it is easy to produce electromagnetic resonance and cannot support the transmission of large-bandwidth signals.

[0004] If BOSA is designed to realize the communication of large bandwidth signals, in order to support the transmission of large bandwidth signals between BOSA and PCB, FPC must be used to connect BOSA and PCB. The use of FPC will increase the connection cost between BOSA and PCB. Summary of the invention

[0005] The embodiments of the present application provide an integrated optical transceiver assembly and related equipment, which are used to reduce the connection cost between BOSA and PCB while improving the signal bandwidth.

[0006] In the first aspect, an embodiment of the present application provides an integrated optical transceiver assembly BOSA. The BOSA includes: a first pin surface, a second pin surface, and a plurality of pins extending from the first pin surface. The first pin surface is not parallel to the second pin surface. The pins extending from the first pin surface and the pins extending from the second pin surface are used to communicate with different optical paths in the BOSA (the different optical paths in the BOSA include the receiving optical path and the transmitting optical path of the BOSA). The plurality of pins extending from the first pin surface include a signal pin and a ground pin. The signal pin is used to transmit a communication signal, and the ground pin is used for grounding. Among the plurality of pins, the distance between the signal pin and the ground pin is d1, and d1 is the smallest pin spacing among the plurality of pins. The ground pin is used to provide a signal loop to suppress electromagnetic resonance on the signal pin.

[0007] In the embodiment of the present application, since the ground pin is grounded, the ground pin can be used as a reference ground for the signal pin. The distance d1 between the signal pin and the ground pin is the smallest pin spacing among the multiple pins on the first pin surface, so the distance between the signal pin and the ground pin is close, and a loop of the communication signal can be formed between the ground pin and the signal pin. If the signal pin is suspended, the communication signal is transmitted on the signal loop, which can reduce the parasitic capacitance between the signal pin and other pins, and the signal pin is less likely to produce electromagnetic resonance. Therefore, in the BOSA structure provided in the embodiment of the present application, the ground pin that is close to the signal pin can suppress the electromagnetic resonance on the signal pin, thereby reducing the loss of the signal pin to the communication signal. The reduction in loss enables the signal pin to support the transmission of large bandwidth signals. There is no need to use FPC to connect BOSA and PCB, which can reduce the cost of connecting BOSA and PCB.

[0008] In an optional implementation, the pins extending from the first pin plane and the pins extending from the second pin plane are both used to connect to the PCB, and the PCB is parallel to the second pin plane.

[0009] In the embodiment of the present application, the PCB is parallel to the second pin surface, and the first pin surface is not parallel to the second pin surface, so the first pin surface is not parallel to the PCB. A plurality of pins extending from the first pin surface (used to connect the BOSA and the PCB) are suspended between the mutually non-parallel first pin surface and the PCB. Among the plurality of suspended pins, the ground pin that is closer to the distance (d1) between the signal pin can be used as a reference ground for the signal pin. A signal loop of the communication signal is formed between the signal pin and the ground pin, thereby preventing the communication signal from generating electromagnetic resonance on the suspended signal pin.

[0010] In an optional implementation, the signal pin is a pin closest to the second pin plane among a plurality of pins extending from the first pin plane.

[0011] In an embodiment of the present application, the second pin surface of BOSA is usually facing the PCB, and the pins extending from the second pin surface are used to achieve the connection between BOSA and PCB. The closer the distance between the pins extending from the first pin surface and the second pin surface is, the closer the distance between the pins and the PCB is. Therefore, among the multiple pins extending from the first pin surface, the signal pin closest to the second pin surface is the pin closest to the PCB among the multiple pins. Then, among the multiple pins between the first pin surface and the PCB, the signal pin is the shortest pin. Since the longer the length of the pin through which the communication signal flows, the greater the loss caused by the pin to the communication signal. Therefore, transmitting the communication signal through a shorter signal pin can reduce the loss caused by the signal pin to the communication signal and improve the signal quality of the communication signal.

[0012] In an optional implementation, the pins extending from the first pin surface are used to communicate with the transmitting optical path in the BOSA, and the pins extending from the second pin surface are used to communicate with the receiving optical path in the BOSA. The BOSA also includes an optical port and an optical transmitting chip, and the optical port is used to connect to the optical fiber. The communication signal comes from the PCB. The signal pin is used to transmit the communication signal from the PCB to the optical transmitting chip. The optical transmitting chip is used to generate a target optical signal according to the communication signal, and send the target optical signal to the optical fiber through the optical port.

[0013] In an embodiment of the present application, the transmitting optical path of BOSA includes the above-mentioned optical transmitting chip. A plurality of pins extending from the first pin surface of BOSA are used to realize communication between the transmitting optical path and the PCB. Correspondingly, a plurality of pins extending from the second pin surface are used to realize communication between the receiving optical path and the PCB. If the second pin surface (RX end) is facing the PCB, the ground pin on the first pin surface (TX end) that is closer to the signal pin can suppress the electromagnetic resonance on the signal pin at the TX end, thereby reducing the loss of the communication signal at the TX end.

[0014] In an optional implementation, BOSA further includes a monitoring photodiode (MPD). The MPD is used to detect the optical signal emitted by the optical emission chip. The plurality of pins extending from the first pin surface include an MPD pin, and the MPD pin is used to communicate with the MPD. The distance between the signal pin and the MPD pin is d2, and d2≥d1. The MPD pin is used to provide a signal loop to suppress electromagnetic resonance on the signal pin.

[0015] In the embodiment of the present application, the MPD pin is also grounded and can be used as a reference ground for the signal pin. The distance d2 between the MPD pin and the signal pin is small, and a signal loop of the communication signal can be formed between the MPD pin and the signal pin, and electromagnetic resonance is less likely to occur on the signal pin. Therefore, the MPD pin can suppress the electromagnetic resonance on the signal pin, further reducing the loss of the communication signal by the signal pin.

[0016] In an optional implementation, the signal pin is an RF pin, and the ground pin is a GND pin.

[0017] In an optional implementation, the pins extending from the first pin surface are used to communicate with the receiving optical path in the BOSA, and the pins extending from the second pin surface are used to communicate with the transmitting optical path in the BOSA. The BOSA also includes an optical port and an optoelectronic conversion chip, wherein the optical port is used to connect to the optical fiber. The optoelectronic conversion chip is used to convert the received optical signal from the optical port into a communication signal. The signal pin is used to transmit the communication signal from the optoelectronic conversion chip to the PCB.

[0018] In an embodiment of the present application, the receiving optical path of BOSA includes the above-mentioned photoelectric conversion chip. The multiple pins extending from the first pin surface of BOSA are used to realize the communication between the receiving optical path and the PCB. Correspondingly, the multiple pins extending from the second pin surface are used to realize the communication between the transmitting optical path and the PCB. If the second pin surface (TX end) is facing the PCB, the ground pin on the first pin surface (RX end) that is closer to the signal pin can suppress the electromagnetic resonance on the signal pin at the RX end, thereby reducing the loss of the communication signal at the RX end.

[0019] In an optional implementation, the photoelectric conversion chip includes a photodetector, which is used to convert the received optical signal into a communication signal, and the signal pin and the ground pin are both in communication with the photodetector. The signal pin is used to connect to the positive electrode of the photodetector, and the ground pin is used to connect to the negative electrode of the photodetector; or, the signal pin is used to connect to the negative electrode of the photodetector, and the ground pin is used to connect to the positive electrode of the photodetector.

[0020] Optionally, the photodetector may be a photodiode, an avalanche photodiode, a multiplication photodiode, etc., which is not limited in the present application.

[0021] In an optional implementation, the signal pin is a VCC+ pin, and the ground pin is a PD+ pin.

[0022] In an optional implementation, the signal pin is a labeled PD+ pin, and the ground pin is a labeled PD- pin.

[0023] In the embodiment of the present application, in order to facilitate the user to connect the multiple pins extending from the first pin plane to the PCB, the RF pin on the first pin plane is marked as the PD+ pin, and the VCC pin on the first pin plane is marked as the PD- pin. According to the marking, the user can quickly connect to the corresponding interface on the PCB to prevent connection errors.

[0024] In an optional implementation, the communication signal includes an analog signal or a digital signal.

[0025] In the embodiment of the present application, the ground pin can suppress the electromagnetic resonance on the signal pin, thereby reducing the loss caused by the electromagnetic resonance at certain frequencies. Since the loss at these frequencies is reduced, the frequency range of the communication signal transmitted by the BOSA can include these frequencies. For example, the communication signal can be an analog signal that the current BOSA cannot support, a 2.5 Gbps digital signal, a 5 Gbps digital signal, a 10 Gbps digital signal, or a digital signal with a higher rate.

[0026] In a second aspect, an embodiment of the present application provides a transceiver-integrated on-board optical assembly (BOSA on board, BOB). The BOB includes a printed circuit board PCB and the BOSA described in the first aspect. The signal pin and the ground pin of the BOSA are used to connect to the PCB.

[0027] In a third aspect, an embodiment of the present application provides an optical communication device, which includes the BOSA described in the first aspect.

[0028] The beneficial effects of the second and third aspects refer to the first aspect and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the structure of BOSA provided for this application;

[0030] Figure 2a A structural schematic diagram of the connection between BOSA and PCB provided in this application;

[0031] Figure 2b A structural schematic diagram of the connection between BOSA and PCB provided in this application;

[0032] Figure 2c A structural schematic diagram of the connection between BOSA and PCB provided in this application;

[0033] Figure 3 A structural diagram of BOSA provided in an embodiment of the present application;

[0034] Figure 4a Schematic diagram of the loss of BOSA provided for this application;

[0035] Figure 4b A loss diagram of BOSA provided in an embodiment of the present application;

[0036] Figure 5 Another structural schematic diagram of BOSA provided in an embodiment of the present application;

[0037] Figure 6 A schematic diagram of the distribution of multiple pins extending from a first pin surface provided in an embodiment of the present application;

[0038] Figure 7 Another structural schematic diagram of BOSA provided in an embodiment of the present application. DETAILED DESCRIPTION

[0039] The embodiments of the present application are described below in conjunction with the accompanying drawings.

[0040] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged in appropriate circumstances, which is only to describe the distinction mode adopted by the objects of the same attribute in the embodiments of the present application when describing. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment containing a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment. In addition, "at least one" refers to one or more, and "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist, for example, A and / or B can be represented: A exists alone, A and B exist simultaneously, and B exists alone. Wherein A, B can be singular or plural. The character " / " generally indicates that the associated objects before and after are a kind of "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc.

[0041] BOSA is a commonly used component in optical communication equipment. Figure 1 As shown, BOSA includes an optical port, an optical transmitter chip, an optoelectronic conversion chip, a TX end, and an RX end, etc. Among them, the optical port is used to connect the optical fiber, the optical transmitter chip and the TX end are included in the transmitting optical path of BOSA, and the optoelectronic conversion chip and the RX end are included in the receiving optical path of BOSA.

[0042] The optical transmitter chip is used to convert the transmit signal from the TX end into the transmit optical signal of BOSA, and transmit the transmit optical signal to the optical fiber through the optical port. The optical port is also used to receive the receive optical signal of BOSA through the optical fiber. The photoelectric conversion chip is used to perform photoelectric conversion on the receive optical signal from the optical port, and output the converted receive electrical signal through the RX end.

[0043] The TX and RX ends of BOSA need to be connected to the printed circuit board to transmit communication signals (including the above-mentioned transmitting electrical signals and receiving electrical signals) between BOSA and PCB. The commonly used connection method is to connect BOSA and PCB through the pins on the flexible printed circuit (FPC) or BOSA.

[0044] For example Figure 2a As shown in the figure, the TX and RX ends of BOSA are connected to the PCB through FPC. Figure 2b As shown in the figure, the TX end of BOSA is connected to the PCB through the pin, and the RX end is connected to the PCB through the FPC. Figure 2c As shown, the TX and RX ends of BOSA are connected to the PCB through pins.

[0045] With the development of optical communication technology, the bandwidth of signals transmitted in communication networks is getting larger and larger. FPC can support the transmission of large bandwidth signals, but the preparation process is complex and the cost is high. Figure 2a and Figure 2b As shown in the figure, using FPC to connect BOSA and PCB will result in high cost. The preparation process of the pin is simple and low cost, but it is easy to produce electromagnetic resonance. Figure 2c The connection structure shown cannot support the transmission of large bandwidth signals.

[0046] If BOSA is designed to realize the communication of large bandwidth signals, in order to support the transmission of large bandwidth signals between BOSA and PCB, FPC must be used to connect BOSA and PCB (such as Figure 2a or Figure 2b The use of FPC will increase the connection cost between BOSA and PCB.

[0047] If the connection cost between BOSA and PCB is to be reduced, it should be considered how to replace FPC with pins to achieve the transmission of large bandwidth signals. Figure 2c The reason why the structure shown cannot support large bandwidth signal transmission is analyzed. In BOSA, due to the structural limitations of the receiving optical path and the transmitting optical path, the pins of the receiving optical path RX and the pins of the transmitting optical path TX are not on the same plane. For example Figure 1As shown in the figure, the TX pins are distributed on the xOz plane, and the RX pins are distributed on the xOy plane, and the two planes are perpendicular to each other. This results in some pins of the BOSA not being able to face the PCB, so that these pins are suspended between the BOSA and the PCB. Figure 2c As shown in the figure, if the RX pin (distributed on the xOy plane) faces the PCB, the TX pin (distributed on the xOz plane) perpendicular to the RX pin cannot face the PCB. The TX pin is suspended between the BOSA and the PCB, and the TX pin needs to be bent 90° to achieve connection with the PCB.

[0048] The shell of BOSA, PCB surface, etc. can be used as the reference ground of the circuit in BOSA. Since the TX end pin is suspended on BOSA and PCB, the distance between the TX end pin and the reference ground (such as PCB) is far, and the impedance on the TX end pin is large. The high-impedance TX end pin is equivalent to an antenna, and electromagnetic wave resonance will occur on the pin. Similarly, if the TX end pin is facing the PCB, electromagnetic wave resonance will also occur on the RX end pin.

[0049] The resonance of electromagnetic waves will radiate signals at certain frequencies, causing the loss of BOSA to increase greatly at these frequencies. If these high-loss frequencies are within the designed communication frequency band, and the loss at these high-loss frequencies is greater than the designed allowable loss value, it will cause signal distortion in this frequency band, affecting the communication in this frequency band. Since the frequency band of large-bandwidth signals is wide and the frequency range they occupy is large, these high-loss frequencies are very likely to fall into the frequency band of large-bandwidth signals, thereby affecting the transmission quality of large-bandwidth signals between BOSA and PCB.

[0050] That is to say, if the TX and RX ends of BOSA are connected to the PCB through pins, the electromagnetic resonance of the suspended pins will cause distortion of the wide bandwidth signal, making BOSA unable to support the transmission of wide bandwidth signals. If the electromagnetic resonance of the suspended pins can be avoided, the use of FPC between BOSA and PCB can be avoided, thereby reducing the connection cost between BOSA and PCB.

[0051] In order to solve the high cost problem of transmitting large-bandwidth signals between BOSA and PCB, the embodiment of the present application provides an integrated optical transceiver assembly BOSA and related equipment. In the BOSA provided in the embodiment of the present application, the distance between the ground pin and the signal pin is relatively close. The ground pin can suppress the electromagnetic resonance on the signal pin, thereby reducing the loss of the signal pin to the communication signal and preventing signal distortion. The suspended pin can also support the transmission of large-bandwidth signals, thereby avoiding the use of FPC between BOSA and PCB and reducing the cost of transmitting large-bandwidth signals between BOSA and PCB.

[0052] like Figure 3 As shown, the BOSA 3000 provided in the embodiment of the present application includes: a first pin surface 3100, a second pin surface 3200, and a plurality of pins 3300 extending from the first pin surface 3100. The first pin surface 3100 and the second pin surface 3200 are not parallel.

[0053] In the embodiment of the present application, the pin plane (such as the first pin plane 3100 or the second pin plane 3200) is a plane on the BOSA 3000 for arranging pins. The pins extending from the same pin plane are parallel to each other and communicate with the same optical path in the BOSA. The pins extending from different pin planes communicate with different optical paths in the BOSA.

[0054] For example, the first pin surface 3100 may be the pin surface of the TX end of the BOSA 3000. Then the multiple pins 3300 extending from the first pin surface 3100 may be used to communicate with the transmitting optical path of the BOSA 3000. Correspondingly, the pins extending from the second pin surface 3200 are used to communicate with the receiving optical path of the BOSA 3000. Conversely, the multiple pins 3300 extending from the first pin surface 3100 may communicate with the receiving optical path, and the pins extending from the second pin surface 3200 may communicate with the transmitting optical path, which is not limited in the present application.

[0055] The plurality of pins 3300 extending from the first pin surface 3100 include a signal pin 3310 and a ground pin 3320. The signal pin 3310 is used to transmit a communication signal of the BOSA 3000, and the ground pin 3320 is used for grounding.

[0056] On the first pin plane 3100, the distance between the signal pin 3310 and the ground pin 3320 is d1. d1 is the minimum pin spacing on the first pin plane 3100. The ground pin 3320 is used to provide a signal loop to suppress electromagnetic resonance on the signal pin.

[0057] In the embodiment of the present application, since the ground pin 3320 is grounded, the ground pin 3320 can be used as a reference ground for the signal pin 3310. The distance d1 between the signal pin 3310 and the ground pin 3320 is the minimum pin spacing on the first pin surface 3100, so the distance between the signal pin 3310 and the ground pin 3320 is relatively close, and a signal loop of a communication signal can be formed between the ground pin 3320 and the signal pin 3310.

[0058] If the first pin surface 3100 and the PCB are not parallel to each other, the multiple pins 3300 extending from the first pin surface 3100 are suspended between the first pin surface 3100 and the PCB. The suspended signal pin 3310 has an impedance inconsistent with that of the PCB (the suspended signal pin 3310 has a larger impedance), which results in parasitic capacitance between the suspended signal pin 3310 and other pins, the BOSA housing, and other signal lines on the PCB, causing the signal amplitude and frequency response to deteriorate. The deterioration of the signal amplitude and frequency response is reflected in the deterioration of the signal amplitude on the power-amplitude response curve, and the generation of electromagnetic resonance on the signal pin. Electromagnetic resonance causes the energy of certain frequencies to be radiated, and the loss at this frequency is large. For example Figure 4a As shown, at frequency 1, frequency 2 and frequency 3, energy is radiated due to the electromagnetic resonance of the signal pin 3100, resulting in large losses and low signal strength at the three frequencies.

[0059] In the embodiment of the present application, the ground pin 3320 which is close to the signal pin 3310 provides a return path for the communication signal. The return of the communication signal will reduce the parasitic capacitance between the signal pin 3310 and other pins, thereby suppressing the electromagnetic resonance of the signal pin 3310. When the electromagnetic resonance is suppressed, the energy of the signal is not easily radiated, thereby reducing the loss of the communication signal by the signal pin 3310. Figure 4b As shown, since the ground pin 3320 provides a signal loop for the signal pin 3310 and suppresses the electromagnetic resonance on the signal pin 3310, the energy at frequency points 1, 2 and 3 is not radiated due to electromagnetic resonance, and the losses of the three frequency points are reduced.

[0060] In the embodiment of the present application, the ground pin 3320 can suppress the electromagnetic resonance on the signal pin 3310, thereby reducing the loss caused by the electromagnetic resonance at certain frequencies. Since the loss at these frequencies is reduced, the frequency range of the communication signal transmitted by the BOSA 3000 can include these frequencies.

[0061] For example, the communication signal transmitted on the signal pin 3310 is a large-bandwidth analog signal that the current BOSA cannot support. Compared with digital signals, the analog bandwidth (frequency range of the transmitted signal) of analog signals is larger. Analog signals include frequency bands that are not included in digital signals. The BOSA that currently supports the transmission of digital signals may be unable to support the transmission of analog signals because the high-loss frequency point of electromagnetic resonance of the suspended pin falls within a certain frequency band. This frequency band is outside the frequency band range of digital signals and within the frequency band range of analog signals. Using the BOSA 3000 provided in the embodiment of the present application, it is possible to prevent these high-loss frequency signals from electromagnetically resonating on the signal pin 3310, thereby avoiding distortion of the analog signal, so that the BOSA that currently only supports the transmission of digital signals can support the transmission of analog signals.

[0062] In another optional implementation, the communication signal transmitted on the signal pin 3310 is a high-speed digital signal that the current BOSA cannot support, such as a 2.5Gbps digital signal, a 5Gbps digital signal, a 10Gbps digital signal, or a higher-speed digital signal. With the development of optical communications, the rate of digital signals has increased, and the frequency band used has also expanded accordingly. If the high-loss frequency point where electromagnetic resonance occurs on the suspended pin falls within the extended frequency band, signal distortion will occur, causing BOSA to be unable to support signal transmission in the extended frequency band. The BOSA 3000 provided by the embodiment of the present application can prevent these high-loss frequency signals from electromagnetically resonating on the signal pin 3310, thereby avoiding distortion of high-speed digital signals, so that the BOSA, which currently only supports low-speed digital signal transmission, can support the transmission of high-speed digital signals.

[0063] Optionally, the pins extending from the first pin surface 3100 and the pins extending from the second pin surface 3200 are both used to connect to the PCB, and the PCB is parallel to the second pin surface 3200. Optionally, the first pin surface 3100 is the pin surface of the TX end or the pin surface of the RX end of the BOSA 3000, which is not limited in this application.

[0064] Optionally, if the first pin surface 3100 is the TX end pin surface of BOSA 3000, the second pin surface 3200 is the RX end pin surface of BOSA 3000. The corresponding structure is as follows: Figure 5 As shown, BOSA 3000 also includes an optical port 3400 and an optical transmitter chip 3500. The optical port 3400 is used to connect to the optical fiber. The communication signal comes from the PCB. The signal pin 3310 is used to transmit the communication signal from the PCB to the optical transmitter chip 3500. The optical transmitter chip 3500 is used to generate a target optical signal according to the communication signal, and send the target optical signal to the optical fiber through the optical port.

[0065] In the embodiment of the present application, the transmitting optical path of BOSA 3000 includes an optical transmitting chip 3500. A plurality of pins extending from the first pin surface 3100 of BOSA 3000 are used to realize the communication between the transmitting optical path and the PCB. Correspondingly, a plurality of pins extending from the second pin surface 3200 are used to realize the communication between the receiving optical path and the PCB. If the second pin surface 3200 (RX end) is facing the PCB, the ground pin 3200 on the first pin surface 3100 (TX end) that is closer to the signal pin 3100 can suppress the electromagnetic resonance on the TX end signal pin 3100, thereby reducing the loss of the TX end communication signal (the transmitting signal of BOSA 3000).

[0066] Optional, such as Figure 5 As shown, BOSA 3000 further includes a monitoring photodiode MPD 3600. MPD 3600 is used to detect the optical signal emitted by the optical emission chip 3500. A plurality of pins 3300 extending from the first pin plane 3100 include an MPD pin 3330, and MPD pin 3330 is used to communicate with MPD 3600. On the first pin plane 3100, the distance between the signal pin 3310 and the MPD pin 3330 is d2, and d2≥d1. MPD pin 3330 is used to provide a signal loop to suppress electromagnetic resonance on the signal pin 3310.

[0067] Optionally, the distribution of the plurality of pins 3300 on the first pin plane 3100 may be as follows: Figure 6 As shown. In figure a, two ground pins 3320, a signal pin 3310 and a pin extend from the first pin surface 3100. Among them, the optical emission chip 3500 includes a direct-modulated laser, and the Bias pin is used to provide a bias current for the direct-modulated laser. In figure b, the distance d2 between the MPD pin 3330 and the signal pin 3310 is greater than the distance between the ground pin 3320 and the signal pin 3310. Figure c is symmetrical to figure b. In figure d, the distance d2 between the MPD pin 3330 and the signal pin 3310 is equal to the distance between the ground pin 3320 and the signal pin 3310.

[0068] Optionally, the signal pin 3310 is an RF pin and the ground pin 3320 is a GND pin.

[0069] In the embodiment of the present application, the MPD pin 3330 is also grounded and can be used as a reference ground for the signal pin 3310. The distance d2 between the MPD pin 3330 and the signal pin 3310 is small, and a signal loop of the communication signal can be formed between the MPD pin 3330 and the signal pin 3310. Therefore, the MPD pin 3330 can also suppress the electromagnetic resonance on the signal pin 3310 (same principle as the ground pin 3320), further reducing the signal pin 3310's loss of the communication signal.

[0070] In the embodiment of the present application, the loss of the communication signal caused by the signal pin can also be reduced by reducing the length of the signal pin 3310. Figure 5 As shown, the signal pin 3310 is the pin closest to the second pin plane 3200 among the plurality of pins 3300 extending from the first pin plane 3100 .

[0071] In the embodiment of the present application, the second pin surface 3200 of the BOSA 3000 is usually facing the PCB, and the pins extending from the second pin surface 3200 are used to realize the connection between the BOSA 3000 and the PCB. The closer the distance between the pins extending from the first pin surface 3100 and the second pin surface 3200 is, the closer the distance between the pins and the PCB is. Therefore, among the multiple pins 3300 extending from the first pin surface 3100, the signal pin 3310 closest to the second pin surface 3200 is the pin closest to the PCB among the multiple pins 3300. Then, among the multiple pins between the first pin surface 3100 and the PCB, the signal pin 3310 is the pin with the shortest length.

[0072] The loss of the communication signal caused by the signal pin 3310 mainly includes low-frequency dielectric loss and high-frequency skin effect. The above loss is positively correlated with the distance the communication signal is transmitted on the pin. In other words, the longer the pin length, the greater the loss to the communication signal. In the embodiment of the present application, the signal pin 3310 is the pin closest to the second pin surface 3200 on the first pin surface 3100, and the pin length is the shortest. Therefore, by transmitting the communication signal through the shorter signal pin 3310, the loss of the communication signal caused by the signal pin 3310 can be reduced, and the signal quality of the communication signal can be improved.

[0073] Optionally, if the first pin surface 3100 is the RX end pin surface of BOSA 3000, the second pin surface 3200 is the TX end pin surface of BOSA3000. The corresponding structure is as follows: Figure 7As shown, BOSA 3000 also includes an optical port 3400 and an optoelectronic conversion chip 3700. The optical port 3400 is used to connect to an optical fiber. The optoelectronic conversion chip 3700 is used to convert a received optical signal from the optical port 3400 into a communication signal. The signal pin 3310 is used to transmit the communication signal from the optoelectronic conversion chip 3700 to the PCB.

[0074] In the embodiment of the present application, the receiving optical path of the BOSA 3000 includes a photoelectric conversion chip 3700. A plurality of pins 3300 extending from the first pin surface 3100 of the BOSA 3000 are used to realize the communication between the receiving optical path and the PCB. Correspondingly, a plurality of pins extending from the second pin surface 3200 are used to realize the communication between the transmitting optical path and the PCB. If the second pin surface 3200 (TX end) is facing the PCB, the ground pin 3320 on the first pin surface 3100 (RX end) that is closer to the signal pin 3310 can suppress the electromagnetic resonance on the signal pin 3310 at the RX end, thereby reducing the loss of the communication signal at the RX end.

[0075] Optionally, the photoelectric conversion chip 3700 includes a photodetector, which is used to convert the received optical signal into a communication signal, and the signal pin 3310 and the ground pin 3320 both communicate with the photodetector. Among them, the signal pin 3310 is used to connect to the positive electrode of the photodetector 3700, and the ground pin 3320 is used to connect to the negative electrode of the photodetector 3700; or, the signal pin 3310 is used to connect to the negative electrode of the photodetector 3700, and the ground pin 3320 is used to connect to the positive electrode of the photodetector 3700.

[0076] Optionally, the positive electrode of the photodetector 3700 may be a PD+ pin among the plurality of pins 3300 , and the negative electrode of the photodetector 3700 may be a VCC pin among the plurality of pins 3300 .

[0077] Optionally, the photodetector 3700 may be a photodiode (PD), an avalanche photon diode (APD), a multiplication photodiode, etc., which is not limited in the present application.

[0078] Optionally, the signal pin 3310 is a VCC+ pin, and the ground pin 3320 is a PD+ pin.

[0079] Optionally, in order to facilitate the user to connect the multiple pins 3300 extending from the first pin plane 3100 to the PCB, the RF pin on the first pin plane is marked as a PD+ pin and used as a signal pin 3310; the VCC pin on the first pin plane is marked as a PD- pin and used as a ground pin 3320. According to the marking, the user can quickly realize the connection with the corresponding interface on the PCB to prevent connection errors.

[0080] It is worth noting that Figure 6 The four pins extending from the first pin surface 3100 are only examples. The number of pins extending from the first pin surface 3100 may be more or less, and this application does not limit this.

[0081] In the embodiment of the present application, the loss of the communication signal caused by the signal pin can also be reduced by reducing the length of the signal pin 3310. Figure 7 As shown, the signal pin 3310 is the pin closest to the second pin plane 3200 among the plurality of pins 3300 extending from the first pin plane 3100 .

[0082] In the embodiment of the present application, the second pin surface 3200 of the BOSA 3000 is usually facing the PCB, and the pins extending from the second pin surface 3200 are used to realize the connection between the BOSA 3000 and the PCB. The closer the distance between the pins extending from the first pin surface 3100 and the second pin surface 3200 is, the closer the distance between the pins and the PCB is. Therefore, among the multiple pins 3300 extending from the first pin surface 3100, the signal pin 3310 closest to the second pin surface 3200 is the pin closest to the PCB among the multiple pins 3300. Then, among the multiple pins between the first pin surface 3100 and the PCB, the signal pin 3310 is the pin with the shortest length.

[0083] The loss of the communication signal caused by the signal pin 3310 mainly includes low-frequency dielectric loss and high-frequency skin effect. The above loss is positively correlated with the distance the communication signal is transmitted on the pin. In other words, the longer the pin length, the greater the loss to the communication signal. In the embodiment of the present application, the signal pin 3310 is the pin closest to the second pin surface 3200 on the first pin surface 3100, and the pin length is the shortest. Therefore, by transmitting the communication signal through the shorter signal pin 3310, the loss of the communication signal caused by the signal pin 3310 can be reduced, and the signal quality of the communication signal can be improved.

[0084] The embodiment of the present application also provides a transceiver-on-board optical assembly (BOSA on board, BOB). The BOB includes a printed circuit board PCB and Figures 3 to 7The BOSA 3000 described in any one of the embodiments. The signal pin 3310 and the ground pin 3320 of the BOSA 3000 are used to connect to the PCB.

[0085] The embodiment of the present application also provides an optical communication device. The optical communication device includes Figures 3 to 7 BOSA 3000 as described in any one of the Examples.

[0086] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0087] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0088] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0089] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0090] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk and other media that can store program code.

Claims

1. An integrated optical transceiver assembly BOSA, characterized in that: include: A first pin plane, a second pin plane, and a plurality of pins extending from the first pin plane, wherein the first pin plane is not parallel to the second pin plane, and the pins extending from the first pin plane and the pins extending from the second pin plane are used to communicate with different optical paths in the BOSA; The plurality of pins include a signal pin and a ground pin, the signal pin is used to transmit a communication signal, and the ground pin is used for grounding; On the first pin plane, the distance between the signal pin and the ground pin is d1, d1 is the minimum pin spacing on the first pin plane, and the ground pin is used to provide a signal loop to suppress electromagnetic resonance on the signal pin.

2. The BOSA according to claim 1, characterized in that The pins extending from the first pin surface and the pins extending from the second pin surface are both used to connect to a printed circuit board PCB, and the PCB is parallel to the second pin surface.

3. The BOSA according to claim 1 or 2, characterized in that: The signal pin is a pin closest to the second pin surface among the plurality of pins.

4. The BOSA according to claim 2 or 3, characterized in that: The pins extending from the first pin surface are used to communicate with the transmitting optical path in the BOSA, and the pins extending from the second pin surface are used to communicate with the receiving optical path in the BOSA. The BOSA also includes an optical port and an optical transmitting chip, the optical port is used to connect to the optical fiber, and the communication signal comes from the PCB; The signal pin is used to transmit the communication signal from the PCB to the light emitting chip; The optical transmission chip is used to generate a target optical signal according to the communication signal, and send the target optical signal to the optical fiber through the optical port.

5. The BOSA according to claim 4, characterized in that The BOSA further comprises: a monitoring photodiode MPD; The MPD is used to detect the optical signal emitted by the optical emission chip; The plurality of pins extending from the first pin plane include an MPD pin, and the MPD pin is used to communicate with the MPD; On the first pin surface, the distance between the signal pin and the MPD pin is d2, d2≥d1, and the MPD pin is used to provide a signal loop to suppress electromagnetic resonance on the signal pin.

6. The BOSA according to claim 2 or 3, characterized in that: The pins extending from the first pin surface are used to communicate with the receiving optical path in the BOSA, and the pins extending from the second pin surface are used to communicate with the transmitting optical path in the BOSA. The BOSA also includes an optical port and a photoelectric conversion chip, and the optical port is used to connect to the optical fiber; The photoelectric conversion chip is used to convert the received optical signal from the optical port into the communication signal; The signal pin is used to transmit the communication signal from the photoelectric conversion chip to the PCB.

7. The BOSA according to claim 6, characterized in that The photoelectric conversion chip includes a photodetector, which is used to convert the received optical signal into the communication signal, and the signal pin and the ground pin both communicate with the photodetector; The signal pin is used to connect to the positive electrode of the photodetector, and the ground pin is used to connect to the negative electrode of the photodetector; or, The signal pin is used to be connected to the negative electrode of the photodetector, and the ground pin is used to be connected to the positive electrode of the photodetector.

8. The BOSA according to claim 6 or 7, characterized in that: The signal pin is a VCC+ pin, and the ground pin is a PD+ pin; or, The signal pin is marked as a PD+ pin, and the ground pin is marked as a PD- pin.

9. The BOSA according to any one of claims 1 to 8, characterized in that The communication signal includes an analog signal or a digital signal.

10. A transceiver-on-board optical component BOB, characterized in that: A BOSA comprising a printed circuit board PCB and any one of claims 1 to 9; The signal pin and the ground pin of the BOSA are used to connect with the PCB.

11. An optical communication device, characterized in that: The BOSA comprising any one of claims 1 to 9.

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