Display module

Abstract

The invention provides a display module which comprises a silicon-based micro light-emitting diode display panel and a heat dissipation device, the heat dissipation device comprises a heat dissipation cavity and an electro-deformation piece, the heat dissipation cavity is formed in the back face of the silicon-based micro light-emitting diode display panel, and the electro-deformation piece is arranged at the cavity bottom of the heat dissipation cavity. Under the condition that the electro-deformation piece is powered on, the electro-deformation piece deforms to avoid a channel for communicating the external environment with the heat dissipation cavity, so that external air enters the heat dissipation cavity, the temperature of the external air is low, heat of the silicon-based micro light-emitting diode display panel can be taken away, and the heat dissipation efficiency of the silicon-based micro light-emitting diode display panel is improved. Therefore, the temperature of the silicon-based micro light-emitting diode display panel can be reduced, and the heat dissipation capability of the display module is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module. Background Art

[0002] Compared with traditional micro display technology, silicon-based micro light emitting diode (Mirco LED) display technology has the advantages of excellent brightness, high luminous efficiency, low energy consumption, high response speed, high contrast, ultra-high resolution and color saturation.

[0003] At present, when radiation and compound light are generated inside silicon-based Micro LED chips, most of the energy is converted into heat energy, and excessively high chip junction temperature will reduce the luminous efficiency of the LED. In addition, since silicon-based Micro LED display modules are mainly used in products with high miniaturization requirements such as AR glasses, how to improve the heat dissipation capacity of silicon-based Micro LED display modules has become an important technical problem faced by silicon-based Micro LED display technology.

[0004] Therefore, it is necessary to provide a display module to improve this defect. Summary of the invention

[0005] The embodiments of the present application provide a display module, which can speed up the air flow inside the display module, accelerate the reduction of the temperature of the silicon-based micro-light emitting diode display panel, and improve the heat dissipation capacity of the display module.

[0006] An embodiment of the present application provides a display module, comprising:

[0007] Silicon-based micro-light-emitting diode display panel;

[0008] A heat dissipation device, comprising:

[0009] A heat dissipation cavity is arranged on the back of the silicon-based micro-light emitting diode display panel;

[0010] An electrodeformable element, arranged at the bottom of the heat dissipation cavity;

[0011] Wherein, when the electrodeformable element is energized, the electrodeformable element is deformed to avoid a passage connecting the external environment and the heat dissipation cavity.

[0012] According to an embodiment of the present application, the electrodeformable element includes a first electrode, a piezoelectric material layer and a second electrode, and the piezoelectric material layer is disposed between the first electrode and the second electrode.

[0013] According to an embodiment of the present application, an air inlet is provided on the bottom of the heat dissipation cavity, an air outlet is provided on the wall of the heat dissipation cavity, and the electrodeformable element includes:

[0014] at least one deformation portion, the deformation portion having an orthographic projection on the cavity bottom covering the air inlet;

[0015] A fixing portion, disposed at the periphery of the deformation portion and connected to the deformation portion, wherein the orthographic projection of the fixing portion on the cavity bottom does not overlap with the air inlet;

[0016] Among them, the fixed part is fixedly connected to the bottom of the cavity, and the deformable part is not connected to the bottom of the cavity; when the electrodeformable element is energized, the deformable part is deformed toward the direction of the silicon-based micro-light-emitting diode display panel, and there is a gap between the deformable part and the bottom of the cavity, and the gap between the deformable part and the bottom of the cavity connects the air inlet with the interior of the heat dissipation cavity.

[0017] According to an embodiment of the present application, the heat dissipation device further includes a baffle, which is disposed between the electrodeformable element and the cavity bottom, and includes:

[0018] An inactive portion is fixedly connected to the cavity bottom, and the orthographic projection of the inactive portion on the cavity bottom does not overlap with the air inlet;

[0019] an active portion, which is arranged on a side of the inactive portion close to the air inlet and connected to the inactive portion, the active portion is not connected to the cavity bottom, and the orthographic projection of the active portion on the cavity bottom covers the air inlet;

[0020] In which, during the process of the electrodeformable element deforming toward the silicon-based micro-light-emitting diode display panel, the movable part is tilted toward the silicon-based micro-light-emitting diode display panel, and there is a gap between the movable part and the bottom of the cavity. The gap between the movable part and the bottom of the cavity connects the air inlet with the interior of the heat dissipation cavity.

[0021] According to an embodiment of the present application, when the electrodeformable element is powered off or when the electrodeformable element is restored to a state before deformation, the movable portion abuts against the cavity bottom and covers the air inlet, separating the air inlet from the interior of the heat dissipation cavity.

[0022] According to an embodiment of the present application, when the electrodeformable element is powered off or when the electrodeformable element is restored to a state before deformation, the movable portion abuts against the cavity bottom and covers the air inlet, separating the air inlet from the interior of the heat dissipation cavity.

[0023] According to an embodiment of the present application, the electrodeformable element includes:

[0024] A plurality of first deformation parts, wherein the plurality of first deformation parts are arranged at intervals from each other;

[0025] A plurality of second deformation parts are inserted between adjacent first deformation parts or arranged on one side of the first deformation part, and there is a gap between the first deformation part and the adjacent second deformation part;

[0026] A fixing portion, disposed at the periphery of the first deformation portion and the second deformation portion and connected to the first deformation portion and the second deformation portion respectively;

[0027] Among them, when the electrodeformable element is energized, alternating current is passed through both the first deformation part and the second deformation part, and the phase of the alternating current passed through the first deformation part is different from the phase of the alternating current passed through the second deformation part, the first deformation part and the second deformation part both vibrate, and the gap between the first deformation part and the second deformation part connects the interior of the heat dissipation cavity with the external environment.

[0028] According to an embodiment of the present application, the phase of the alternating current supplied to the first deformation portion is opposite to the phase of the alternating current supplied to the second deformation portion;

[0029] When the electrodeformable element is energized, when the first deformation portion reaches a maximum positive amplitude, the second deformation portion reaches a maximum negative amplitude; when the first deformation portion reaches a maximum negative amplitude, the second deformation portion reaches a maximum positive amplitude.

[0030] According to an embodiment of the present application, the first deformation portion and the second deformation portion are both in the shape of straight long strips;

[0031] Alternatively, the first deformation portion has a plurality of first extension portions that are spaced apart and extend in the direction of the second deformation portion, and a first recessed portion located between adjacent first extension portions; the second deformation portion has a plurality of second extension portions that are spaced apart and extend in the direction of the first deformation portion, and a second recessed portion located between adjacent second extension portions; when the electrodeformable element is not energized, the first extension portion is accommodated in the second recessed portion, and the second extension portion is accommodated in the first recessed portion.

[0032] According to an embodiment of the present application, the cavity bottom of the heat dissipation cavity is an open structure, the cavity wall of the heat dissipation cavity is a closed structure, and the electrodeformable component is covered on the cavity bottom of the heat dissipation cavity.

[0033] According to an embodiment of the present application, the display module further includes a heat dissipation support layer, and the heat dissipation support layer is arranged between the silicon-based micro-LED display panel and the heat dissipation device;

[0034] The cavity top of the heat dissipation cavity is an open structure, and the heat dissipation support layer sealing cover is arranged on the cavity top of the heat dissipation cavity.

[0035] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display module, which includes a silicon-based micro-LED display panel and a heat dissipation device, the heat dissipation device includes a heat dissipation cavity and an electro-deformable element, the heat dissipation cavity is arranged on the back of the silicon-based micro-LED display panel, and the electro-deformable element is arranged at the bottom of the heat dissipation cavity. When the electro-deformable element is energized, the electro-deformable element is deformed to avoid a channel connecting the external environment and the heat dissipation cavity, so that outside air enters the heat dissipation cavity. The temperature of the outside air is relatively low, and it can take away the heat of the silicon-based micro-LED display panel, thereby reducing the temperature of the silicon-based micro-LED display panel and improving the heat dissipation capacity of the display module; in addition, since the electro-deformable element has a low requirement for the deformation space in the thickness direction, it can reduce the thickness of the heat dissipation device while making the heat dissipation performance of the heat dissipation device better, thereby taking into account the small volume and high heat dissipation efficiency requirements of the silicon-based micro-LED display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic structural diagram of a display module of a first embodiment provided in an embodiment of the present application;

[0037] Figure 2 for Figure 1 A schematic diagram of deformation of an electrodeformable element in a display module shown;

[0038] Figure 3 A schematic diagram of the structure of a baffle provided in an embodiment of the present application;

[0039] Figure 4 A schematic diagram of the structure of a display module of a second embodiment provided in an embodiment of the present application;

[0040] Figure 5 A schematic structural diagram of a display module of a third embodiment provided in an embodiment of the present application;

[0041] Figure 6 A schematic structural diagram of a heat dissipation support layer provided in the third embodiment of the present application;

[0042] Figure 7 A schematic structural diagram of another heat dissipation support layer provided for the third embodiment of the present application;

[0043] Figure 8 A schematic structural diagram of a display module of a fourth embodiment provided in an embodiment of the present application;

[0044] Fig. 9for Figure 8 A schematic diagram of the planar structure of the electrodeformable element of the display module shown;

[0045] Fig.10 for Figure 8 A schematic diagram of the vibration of the electrodeformable element of the display module shown;

[0046] Fig.11 FIG. 4 is a schematic diagram of the planar structure of another electrodeformable element of the display module shown. DETAILED DESCRIPTION

[0047] The following descriptions of the embodiments are made with reference to the attached drawings to illustrate specific embodiments that the present application may be implemented in. The directional terms mentioned in the present application, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, rather than to limit the present application. In the drawings, units with similar structures are represented by the same reference numerals.

[0048] The present application is further described below in conjunction with the accompanying drawings and specific embodiments.

[0049] An embodiment of the present application provides a display module, which can speed up the air flow inside the display module, inhale cold air through the air inlet, use the cold air to absorb the heat of the silicon-based micro-LED display panel and convert it into hot air, and discharge the hot air from the air outlet. In this way, the temperature of the silicon-based micro-LED display panel can be reduced, thereby improving the heat dissipation capacity of the display module, improving the light output efficiency of the light-emitting device, and reducing the power consumption of the silicon-based micro-LED display panel.

[0050] See also Figure 1 , Figure 1 A structural schematic diagram of the display module of the first embodiment provided for the embodiments of the present application, the display module includes a silicon-based micro-LED display panel 1 and a heat dissipation device 2, the heat dissipation device 2 is arranged on the back side of the silicon-based micro-LED display panel 1, and is used to reduce the temperature of the silicon-based micro-LED display panel 1.

[0051] In an embodiment of the present application, a silicon-based micro light-emitting diode display panel 1 includes a silicon-based backplane and a plurality of light-emitting devices arranged on the silicon-based backplane, wherein the light-emitting devices are Micro LED chips, and the size of the Micro LED chip is less than 100 microns.

[0052] The display module also includes a cover plate 3, a flexible circuit board 4, a signal line 5 and a filling glue 6. The cover plate 3 is covered on the light-emitting surface of the silicon-based micro-LED display panel 1. The flexible circuit board 4 is electrically connected to the silicon-based micro-LED display panel 1 through the signal line 5. The filling glue 6 covers the signal line 5 and is bonded to the flexible circuit board 4 and the silicon-based micro-LED display panel 1, thereby fixing the signal line 5 and the flexible circuit board 4.

[0053] See also Figure 1 The heat dissipation device 2 includes a heat dissipation cavity 21 and an electrodeformable element 22. The heat dissipation cavity 21 is arranged on the back of the silicon-based micro-LED display panel 1. The interior of the heat dissipation cavity 21 is a hollow structure. The electrodeformable element 22 is arranged on the cavity bottom of the heat dissipation cavity 21. When the electrodeformable element 22 is energized, the electrodeformable element 22 is deformed to avoid the passage connecting the external environment and the interior of the heat dissipation cavity 21, so that the outside air can enter the heat dissipation cavity 21. Since the temperature of the outside air is relatively low, it can take away the temperature of the silicon-based micro-LED display panel 1, thereby accelerating the reduction of the temperature of the silicon-based micro-LED display panel 1 and improving the heat dissipation capacity of the display module.

[0054] In some embodiments, an air inlet 211 is provided on the cavity bottom 210 of the heat dissipation cavity 21, and an air outlet 213 is provided on the cavity wall 212 of the heat dissipation cavity 21. The air inlet 211 and the air outlet 213 are both in a grid shape, that is, the cavity bottom 210 has a bottom plate, which closes the bottom of the heat dissipation cavity 21, the air inlet 211 is provided on the bottom plate of the cavity bottom 210, the cavity wall 212 has a side plate, which closes the periphery of the heat dissipation cavity 21, and the air outlet is provided on the side plate of the cavity wall 212. When the air inlet 211 and the air outlet 213 are not blocked, the interior of the heat dissipation cavity 21 can be connected to the external environment through the air inlet 211 and the air outlet 213.

[0055] The electrodeformable element 22 is arranged on the bottom plate of the cavity bottom 210, and the orthographic projection of the electrodeformable element 22 on the cavity bottom 210 covers the air inlet 211. It should be noted that the cavity bottom 210 has an inner cavity bottom and an outer cavity bottom, the inner cavity bottom refers to the bottom of the hollow structure inside the heat dissipation cavity bottom, the outer cavity bottom refers to the bottom of the part of the heat dissipation cavity 21 exposed to the outside, and the electrodeformable element 22 is arranged on the cavity bottom 210, which means that the electrodeformable element 22 is arranged on the inner cavity bottom of the heat dissipation cavity 21. The electrodeformable element 22 can be deformed under the action of the electric field, and can be restored to the state before deformation after the electric field disappears.

[0056] Combination Figure 1 and Figure 2 As shown, Figure 2 for Figure 1The deformation diagram of the electrodeformable element in the display module shown in the figure shows that when the electrodeformable element 22 is powered off, the electrodeformable element 22 is entirely attached to the cavity bottom 210, and the electrodeformable element 22 is deformed. When the electrodeformable element 22 is powered on, the electrodeformable element 22 repeatedly deforms toward the direction of the silicon-based micro-LED display panel 1.

[0057] In the embodiment of the present application, the electrodeformable member 22 includes a first electrode 221, a piezoelectric material layer 223 and a second electrode 222, wherein the piezoelectric material layer 223 is disposed between the first electrode 221 and the second electrode 222. The materials of the first electrode 221 and the second electrode 222 are both metals, such as copper or aluminum, and the metal has good ductility, which can prevent the first electrode 221 and the second electrode 222 from breaking when deformed. The material of the piezoelectric material layer 223 is an organic piezoelectric material, which can be, but is not limited to, polyvinylidene difluoride (PVDF).

[0058] The electrodeformable element 22 is supplied with an alternating current, and an alternating electric field can be applied to the piezoelectric material layer 223 through the first electrode 221 and the second electrode 222, which can cause the piezoelectric material layer 223 to produce mechanical deformation, thereby causing the electrodeformable element 22 to produce mechanical deformation as a whole. The action of the electrodeformable element 22 repeatedly deforming toward the silicon-based micro-LED display panel 1 and returning to the state before deformation can be regarded as vibration. By adjusting the frequency of the alternating current, the electrodeformable element 22 can be adjusted along the direction of the silicon-based micro-LED display panel 1. Figure 2 The vertical vibration frequency under the viewing angle shown. When the high-frequency alternating electric field reaches a certain frequency, the electrodeformable element will vibrate at a quasi-ultrasonic frequency, with an amplitude of several microns to tens of microns. This vibration will generate a strong negative pressure, thereby driving the gas flow.

[0059] In the embodiment of the present application, the frequency of the alternating current is 5 MHz. In some other embodiments, the frequency of the alternating current is not limited to 5 MHz in the above embodiment, but may also be 1 MHz, 3 MHz, 7 MHz or 10 MHz, etc. It only needs to be greater than or equal to 1 MHz and less than or equal to 10 MHz to ensure that the electrodeformable element 22 generates vibrations of a similar ultrasonic frequency to meet the heat dissipation requirements of the display module.

[0060] In some embodiments, the frequency of the alternating current may increase as the temperature of the silicon-based micro-LED display panel increases, and decrease as the temperature of the silicon-based micro-LED display panel decreases. For example, the frequency of the alternating current is set to multiple levels, each level corresponding to a different temperature range, and the display module may further include a temperature sensor, and according to the temperature of the silicon-based micro-LED display panel detected by the temperature sensor, the corresponding frequency of the alternating current is used to cool the silicon-based micro-LED display panel.

[0061] Combination Figure 1 and Figure 2 As shown, when the electrodeformable element 22 is deformed toward the silicon-based micro-LED display panel, negative pressure is generated above the air inlet 211, and the negative pressure causes the cold air in the external environment to enter the heat dissipation cavity 21 through the air inlet 211. Since the electrodeformable element 22 will squeeze the space between the electrodeformable element 22 and the cavity top when it is deformed toward the silicon-based micro-LED display panel, the hot air near the silicon-based micro-LED display panel is squeezed toward the cavity wall 212 of the heat dissipation cavity 21 and discharged from the air outlet 213. After the hot air is discharged, the cold air flows to the cavity top and absorbs the heat of the silicon-based micro-LED display panel and is converted into hot air, and then discharged from the air outlet 213 in the above manner, and this cycle is repeated many times until the temperature of the silicon-based micro-LED display panel is reduced. The hot air finally discharged out of the heat dissipation cavity 21 can be discharged into the outside air through the heat dissipation channel of the whole machine equipped with the display module. In this way, the temperature reduction rate of the silicon-based micro-light-emitting diode display panel can be accelerated through the active heat dissipation of the electrodeformable element 22, thereby improving the heat dissipation performance of the display module. In addition, since the electrodeformable element 22 has a lower requirement for the deformation space in the thickness direction, the heat dissipation device can have better heat dissipation performance while reducing the thickness of the heat dissipation device, thereby taking into account the small size and high heat dissipation efficiency requirements of the silicon-based micro-light-emitting diode display module.

[0062] In the embodiment of the present application, the heat dissipation device 2 has an electrodeformable member 22, and an air inlet 211 is provided on the cavity bottom 210. In some other embodiments, a plurality of air inlets 211 arranged at intervals may also be provided on the cavity bottom 210, and the number of the electrodeformable members 22 may be the same as the number of the air inlets 211, or may be less than the number of the air inlets 211. For example, when the heat dissipation device 2 has one electrodeformable member 22, one electrodeformable member 22 may cover a plurality of air inlets 211 at the same time; when the heat dissipation device 2 has a plurality of electrodeformable members 22, each electrodeformable member 22 may cover one or more air inlets 211.

[0063] In the embodiment of the present application, the heat dissipation cavity 21 is a cubic structure, and the heat dissipation cavity 21 has four cavity walls 212, and each cavity wall 212 may be provided with one or more air outlets 213. In some other embodiments, the air outlet 213 may be provided on only one cavity wall 212 or two cavity walls 212 disposed opposite to each other.

[0064] Combination Figure 1 and Figure 2As shown, the electrodeformable element 22 includes at least one deformation portion 2201 and a fixed portion 2202. The fixed portion 2202 is arranged on the periphery of the deformation portion 2201 and is connected to the deformation portion 2201. The orthographic projection of the deformation portion 2201 on the cavity bottom 210 covers the air inlet 211, and the orthographic projection of the fixed portion 2202 on the cavity bottom 210 does not overlap with the air duct path of the air inlet 211.

[0065] In the embodiment of the present application, the electrodeformable element 22 has a deformable portion 2201, the deformable portion 2201 and the fixed portion 2202 are an integral structure, the fixed portion 2202 is fixedly connected to the cavity bottom 210, and the deformable portion 2201 is not connected to the cavity bottom 210. When the electrodeformable element 22 is energized, since the fixed portion 2202 is fixed to the cavity bottom 210 and the deformable portion 2201 is not connected to the cavity bottom 210, the fixed portion 2202 will not deform. However, the deformable portion 2201 will repeatedly deform under the action of the alternating electric field and return to the state before deformation. When the electrodeformable element 22 is energized, the deformable portion 2201 is deformed toward the silicon-based micro-LED display panel 1, and a gap is formed between the deformable portion 2201 and the cavity bottom 210. The gap between the deformable portion 2201 and the cavity bottom 210 and the air inlet 211 form a channel connecting the external environment with the interior of the heat dissipation cavity 21. The gap between the deformable portion 2201 and the cavity bottom 210 connects the air inlet 211 with the interior of the heat dissipation cavity 21.

[0066] In practical applications, the electrodeformable element 22 may also have a plurality of deformation portions 2201 , which are arranged side by side and spaced apart from each other and connected to the fixing portion 2202 .

[0067] An adhesive layer 23 is provided between the fixed portion 2202 and the cavity bottom 210. The adhesive layer 23 is used to bond the fixed portion 2202 to the cavity bottom 210. The material of the adhesive layer 23 is insulating glue. The deformable portion 2201 is not connected to the cavity bottom 210, which means that there is no adhesive layer or other structure for fixing the deformable portion 2201 to the cavity bottom 210 between the deformable portion 2201 and the cavity bottom 210.

[0068] In an embodiment of the present application, the width of the deformation portion 2201 is greater than the width of the air inlet 211. Under this structure, the fixed portion 2202 can be prevented from blocking the air inlet 211, and the cold air can be prevented from being inhaled into the heat dissipation cavity 21 due to insufficient deformation of the deformation portion 2201.

[0069] In the embodiment of the present application, the material of the heat dissipation cavity 21 is metal, which can be but not limited to aluminum alloy, stainless steel, titanium alloy, etc., so that the heat dissipation cavity 21 has high strength and good heat dissipation performance. In practical applications, the material of the heat dissipation cavity 21 is not limited to metal, but can also be other non-metallic materials with good strength and heat dissipation performance.

[0070] like Figure 3 As shown, Figure 3 A schematic diagram of the structure of the baffle provided in the embodiment of the present application, the heat dissipation device 2 further includes a baffle 24, which is disposed between the electrodeformable member 22 and the cavity bottom 210. The baffle 24 includes an inactive portion 241 and an active portion 242, the active portion 242 is disposed on a side of the inactive portion 241 close to the air inlet 211 and connected to the inactive portion 241, the inactive portion 241 is fixedly connected to the cavity bottom 210, the active portion 242 is not connected to the cavity bottom 210, the orthographic projection of the inactive portion 241 on the cavity bottom 210 does not overlap with the air inlet 211, and the orthographic projection of the active portion 242 on the cavity bottom 210 covers the air inlet 211. When there is negative pressure above the baffle 24, the baffle 24 is tilted toward the silicon-based micro-LED display panel under the action of pressure, and a gap is formed between the baffle 24 and the cavity bottom 210, so that the air inlet 211 is connected to the interior of the heat dissipation cavity 21, and the cold air in the external environment can enter the heat dissipation cavity through the air inlet 211 and the gap between the baffle 24 and the cavity bottom 210.

[0071] In the embodiment of the present application, the inactive portion 241 and the active portion 242 are an integral structure. The baffle 24 is a sheet-like structure, and the inactive portion 241 and the active portion 242 are different parts of the sheet-like structure. The inactive portion 241 can be fixed to the cavity bottom 210 by adhesive.

[0072] In the embodiment of the present application, the heat dissipation device 2 has two baffles 24, which are symmetrically arranged about the air inlet 211 and cover the air inlet 211. In practical applications, the number of baffles 24 is not limited to 2 in the above embodiment, but can also be 1 or more than 2, which is not the only limitation here.

[0073] In the embodiment of the present application, the material of the baffle 24 can be stainless steel (SUS) or polyethylene glycol terephthalate (PET). When the material of the baffle 24 is PET, the thickness of the baffle can be 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm, etc.; when the material of the baffle 24 is SUS, the thickness of the baffle can be 0.03 mm, 0.05 mm, 0.07 mm or 0.1 mm, etc., so that the stiffness of the baffle 24 can be ensured, and the baffle 24 will not be deformed during the process of the electrodeformable element 22 returning to its original state.

[0074] Combination Figure 3 As shown, Figure 3Part a shows the state of the baffle 24 when the electrodeformable element is powered off or when the electrodeformable element is restored to the state before deformation. When the electrodeformable element is powered off, the deformable portion of the electrodeformable element is not deformed, and the movable portion 242 of the baffle 24 is pressed against the cavity bottom 210 and covers the air inlet 211 to separate the air inlet 211 from the interior of the heat dissipation cavity 21. When the electrodeformable element is restored to the state before deformation, a downward airflow is formed above the baffle 24. Under the action of the airflow, the movable portion 242 is pressed against the cavity bottom 210 and cannot be deformed downward, and covers the air inlet 211, so that the airflow inside the heat dissipation cavity 21 cannot be discharged from the air inlet 211.

[0075] Figure 3 Part b shows the state of the baffle 24 during the process of the electrodeformable element deforming toward the silicon-based micro-LED display panel 1. During the process of the electrodeformable element deforming toward the silicon-based micro-LED display panel, when there is a negative pressure above the active part 242, the active part 242 is tilted toward the silicon-based micro-LED display panel under the action of pressure, and a gap is formed between the active part 242 and the cavity bottom 210. The gap between the active part 242 and the cavity bottom 210 connects the air inlet 211 with the interior of the heat dissipation cavity 21, and the cold air in the external environment (indicated by the arrow in the figure) can enter the heat dissipation cavity through the air inlet 211 and the gap between the active part 242 and the cavity bottom 210.

[0076] In combination with the above embodiments, it can be known that by setting a baffle 24 above the air inlet 211, the air inlet 211 can only be unidirectional, and only cold air in the external environment is allowed to enter the heat dissipation cavity 21, and the air in the heat dissipation cavity 21 is not allowed to be discharged through the air inlet 211, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0077] In an embodiment of the present application, the display module also includes a heat dissipation support layer 7, which is arranged between the silicon-based micro-LED display panel 1 and the heat dissipation device 2, the heat dissipation support layer 7 is adhered to the back of the silicon-based micro-LED display panel 1, the flexible circuit board 4 and the silicon-based micro-LED display panel 1 are fixedly installed on the same side surface of the heat dissipation support layer 7, and the heat dissipation device 2 is fixedly connected to the heat dissipation support layer 7.

[0078] In one embodiment, the material of the heat dissipation support layer 7 is metal, that is, the heat dissipation support layer 7 is a metal heat dissipation support plate. By providing the heat dissipation support layer 7 on the back of the silicon-based micro-LED display panel 1, not only can stable support and protection be provided for the silicon-based micro-LED display panel 1 and the flexible circuit board 4, but also the good thermal conductivity of metal can be utilized to dissipate the heat of the silicon-based micro-LED display panel 1 into the external environment through the heat dissipation support layer 7 or transfer it to the heat dissipation device 2 through the heat dissipation support layer 7, and then the heat is discharged through the heat dissipation device 2, thereby improving the heat dissipation performance of the display module.

[0079] In some other embodiments, the silicon-based micro-LED display panel 1 can be directly mounted on the heat dissipation cavity 21 of the heat dissipation device 2, that is, the cavity top of the heat dissipation cavity 21 is directly attached to the back of the silicon-based micro-LED display panel 1 through a thermally conductive adhesive layer, and the flexible circuit board 4 is bound to the silicon-based backplane of the silicon-based micro-LED display panel 1. The flexible circuit board 4 needs to be bound to the silicon-based backplane of the silicon-based micro-LED display panel 1. Under this structure, the heat dissipation device 2 also meets the heat dissipation requirements of the display module.

[0080] In one embodiment, if Figure 1 As shown, the cavity top 214 of the heat dissipation cavity 21 is a closed structure, and the cavity structure formed by the cavity top 214, the cavity wall 212 and the cavity bottom 210 can be connected to the external environment through the air inlet 211 and the air outlet 213.

[0081] The surface of the heat dissipation support layer 7 close to the silicon-based micro-LED display panel 1 and the surface close to the heat dissipation device 2 are both flat surfaces. A thermally conductive adhesive layer 8 is provided between the cavity top 214 and the heat dissipation support layer 7. The thermally conductive adhesive layer 8 is respectively bonded to the surface of the heat dissipation support layer 7 close to the heat dissipation device 2 and the surface of the cavity top 214. The material of the thermally conductive adhesive layer 8 can be any one of thermally conductive silicone grease and thermally conductive silver paste or a combination of the two. The heat dissipation device 2 is bonded to the heat dissipation support layer 7 by using the thermally conductive adhesive layer 8, which can reduce the overall thermal resistance of the display module.

[0082] like Figure 4 As shown, Figure 4 The structural diagram of the display module of the second embodiment provided in the embodiment of the present application needs to be explained as follows: Figure 4 The structure of the display module shown is Figure 1 The structures of the display modules shown are roughly the same, except that: Figure 4 In the illustrated embodiment, the cavity top of the heat dissipation cavity 21 is an open structure, and the heat dissipation support layer 7 is sealed and covered on the cavity top of the heat dissipation cavity 21 .

[0083] In one embodiment, the size of the open structure is smaller than the size of the cavity top, and the open structure may have multiple openings, and the portion of the cavity top without openings may be bonded to the heat dissipation support layer 7 by dispensing glue or high-temperature adhesive tape. The cold air entering the heat dissipation cavity 21 from the air inlet 211 may directly contact the heat dissipation support layer 7 through the opening of the open structure, and take away the heat of the heat dissipation support layer 7, thereby reducing the overall thermal resistance of the display module.

[0084] In one embodiment, if Figure 4 As shown, the size of the open structure is the same as the size of the cavity top, that is, the entire cavity top of the heat dissipation cavity 21 is open, and the edge of the open structure can be bonded to the heat dissipation support layer 7 by dispensing glue or high-temperature tape. Under this structure, the heat exchange area between the cold air and the heat dissipation support layer 7 can be further increased, thereby further reducing the overall thermal resistance of the display module.

[0085] like Figure 5 As shown, Figure 5 The structural diagram of the display module of the third embodiment provided in the embodiment of the present application needs to be explained as follows: Figure 5 The structure of the display module shown is Figure 4 The structures of the display modules shown are substantially the same, except that: the surface of the heat dissipation support layer 7 close to the heat dissipation device 2 has a plurality of strip grooves 71 arranged at intervals. By forming a plurality of strip grooves 71 on the surface of the heat dissipation support layer 7 close to the heat dissipation device 2, the heat exchange area between the heat dissipation support layer 7 and the cold air can be increased, thereby increasing the convection heat dissipation efficiency of the surface of the heat dissipation support layer 7 close to the heat dissipation device 2, thereby further improving the overall heat dissipation capacity of the display module.

[0086] In the embodiments of the present application, Figure 6 As shown, Figure 6 A schematic diagram of the structure of a heat dissipation support layer provided in the third embodiment of the present application, wherein a plurality of strip grooves 71 are arranged side by side and spaced apart on the surface of the heat dissipation support layer 7 close to the heat dissipation device 2. In practical applications, the plurality of strip grooves 71 may also be arranged in a staggered manner on the surface of the heat dissipation support layer 7 close to the heat dissipation device 2, which is not the only limitation here.

[0087] In the embodiments of the present application, Figure 5 As shown, the cross-sectional shape of the strip groove 71 is a rectangle, and it should be noted that the cross-sectional shape refers to a surface perpendicular to the length direction of the strip groove 71. In practical applications, the cross-sectional shape of the strip groove 71 is not limited to a rectangle, but can also be any one of a triangle, a trapezoid and a semicircle, or a combination of at least two of the rectangle, triangle, trapezoid and semicircle.

[0088] like Figure 7 As shown, Figure 7The schematic diagram of the structure of another heat dissipation support layer provided in the third embodiment of the present application needs to be explained as follows: Figure 6 The structure of the heat dissipation support layer shown is Figure 6 The structures of the heat dissipation support layers shown are substantially the same, except that: the surface of the heat dissipation support layer 7 close to the heat dissipation device 2 has a plurality of openings 72 distributed in an array, and the openings 72 are through holes or blind holes. By forming a plurality of openings 72 on the surface of the heat dissipation support layer 7 close to the heat dissipation device 2, the heat exchange area between the heat dissipation support layer 7 and the cold air can be increased, thereby increasing the convection heat dissipation efficiency of the surface of the heat dissipation support layer 7 close to the heat dissipation device 2, thereby further improving the overall heat dissipation capacity of the display module.

[0089] In the embodiment of the present application, the shape of the opening 72 is any one of a triangle, a rectangle, a trapezoid and a circle, or a combination of at least two of them.

[0090] like Figure 8 As shown, Figure 8 A schematic diagram of the structure of a display module of a fourth embodiment provided in the embodiments of the present application, wherein the structure is similar to Figure 4 The structures of the display modules shown are roughly the same, except that:

[0091] The electrodeformable member 22 includes a plurality of first deformation portions 2203 and a plurality of second deformation portions 2204. The plurality of first deformation portions 2203 are arranged at intervals from each other. The second deformation portion 2204 is inserted between adjacent first deformation portions 2203 or is arranged on one side of the first deformation portion 2203. There is a gap between the first deformation portion 2203 and the second deformation portion 2204. The fixing portion 2202 is arranged on the periphery of the first deformation portion 2203 and the second deformation portion 2204 and is respectively connected to the first deformation portion 2203 and the second deformation portion 2204.

[0092] Combination Figure 8 and Fig. 9 As shown, Fig. 9 for Figure 8 The schematic diagram of the planar structure of the electrodeformable element of the display module shown in the figure shows that a second deformation portion 2204 is interspersed between every two first deformation portions 2203. It should be noted that: Figure 4 Only the positional relationship and structure of the first deformation part 2203 and the second deformation part 2204 are illustrated. Figure 4 The number of the first deformation parts 2203 and the second deformation parts 2204 shown in the figure does not represent the number of the first deformation parts 2203 and the second deformation parts 2204 in actual applications. The number of the first deformation parts 2203 and the second deformation parts 2204 can be set according to actual needs. For example, both can be 2, 3, 4 or more, and are not limited here.

[0093] In the embodiment of the present application, when the electrodeformable element 22 is energized, alternating current is passed through both the first deforming part 2203 and the second deforming part 2204, and the phase of the alternating current passed through the first deforming part 2203 is different from the phase of the alternating current passed through the second deforming part 2204, the first deforming part 2203 and the second deforming part 2204 both vibrate, and the gap between the first deforming part 2203 and the second deforming part 2204 connects the interior of the heat dissipation cavity with the external environment.

[0094] Combination Fig.10 As shown, Fig.10 for Figure 8 FIG. 1 is a schematic diagram of the vibration of the electrodeformable element of the display module shown in FIG. 1 , wherein part a shows the state of the electrodeformable element 22 before power is supplied. Before power is supplied, the first deformable portion 2203, the second deformable portion 2204 and the fixed portion 2202 are located on the same plane. When alternating current is supplied, the first deformable portion 2203 and the second deformable portion 2204 can both vibrate in the direction of the arrow shown in part a. Part b shows the state of the electrodeformable element after power is supplied. Since the phase of the alternating current supplied to the first deformable portion 2203 is different from that supplied to the second deformable portion 2204, the vibrations of the first deformable portion 2203 and the second deformable portion 2204 are not performed synchronously, so that the first A large gap is generated between the deformation portion 2203 and the second deformation portion 2204. The gap between the first deformation portion 2203 and the second deformation portion 2204 constitutes a channel connecting the external environment and the inside of the heat dissipation cavity 21. External cold air can enter the heat dissipation cavity from the gap between the first deformation portion 2203 and the second deformation portion 2204 as shown by the arrow in part b, and the hot air in the heat dissipation cavity can also be discharged from the heat dissipation cavity through the gap between the first deformation portion 2203 and the second deformation portion 2204 as shown by the arrow in part b, thereby increasing the air flow speed near the electro-deformable element 22, and then quickly taking away the heat radiated into the air by the silicon-based micro-light-emitting diode display panel.

[0095] In one embodiment, the phase of the alternating current supplied to the first deformation portion 2203 is opposite to the phase of the alternating current supplied to the second deformation portion 2204. Fig.10As shown in the middle part b, since the phase of the alternating current passed into the first deformation part 2203 is opposite to the phase of the alternating current passed into the second deformation part 2204, when the electro-deformable element 22 is energized, when the first deformation part 2203 reaches the maximum positive amplitude, the second deformation part 2204 reaches the maximum negative amplitude; similarly, when the first deformation part 2203 reaches the maximum negative amplitude, the second deformation part 2204 reaches the maximum positive amplitude. Under this structure, by applying two alternating electric fields with opposite phases to each adjacent first deformation part 2203 and second deformation part 2204, the electro-deformable element 22 is mechanically deformed. When one of the deformation parts 2203 reaches the maximum amplitude, the adjacent second deformation part 2204 just reaches the maximum negative amplitude. The entire electro-deformable element 22 vibrates alternately and superimposedly in this way, which increases the air flow speed near the electro-deformable element 22, thereby quickly taking away the heat radiated from the silicon-based micro-LED display panel to the air.

[0096] It should be noted that the maximum positive amplitude refers to the maximum deformation amplitude that the first deformation part 2203 or the second deformation part 2204 can achieve in the direction toward the display panel, and the maximum negative amplitude refers to the maximum deformation amplitude that the first deformation part 2203 or the second deformation part 2204 can achieve in the direction away from the display panel.

[0097] In one embodiment, if Fig. 9 As shown, the first deformation portion 2203 and the second deformation portion 2204 are both in the shape of straight strips, and the first deformation portion 2203 and the second deformation portion 2204 are arranged side by side in parallel with each other.

[0098] In one embodiment, if Fig.11 As shown, Fig.11 Schematic diagram of the planar structure of another electrodeformable element of the display module shown, the first deformation part 2203 has a plurality of first extension parts 22031 arranged at intervals and extending toward the second deformation part 2204 and a first recessed part 22032 located between adjacent first extension parts 22031, the second deformation part 2204 has a plurality of second extension parts 22041 arranged at intervals and extending toward the first deformation part 2203 and a second recessed part 22042 located between adjacent second extension parts 22041, and the first deformation part 2203 and the second deformation part 2204 are both in a sawtooth structure. When the electrodeformable element 22 is not energized, the first extension part 22031 is accommodated in the second recessed part 22042, and the second extension part 22041 is accommodated in the first recessed part 22032, so that the junction length between the first deformation part 2203 and the second deformation part 2204 can be increased, thereby further increasing the heat exchange area between the external cold air and the inside of the heat dissipation cavity, and further enhancing the heat dissipation performance of the display module.

[0099] In practical applications, the shapes of the first deformation portion 2203 and the second deformation portion 2204 are not limited to the straight strip or sawtooth shape in the above embodiments, and may also be a triangle, a semicircle, a trapezoid or an S shape, etc., which is not limited here.

[0100] In the embodiments of the present application, Figure 8 As shown, the cavity bottom 210 of the heat dissipation cavity 21 is an open structure, the cavity wall 212 of the heat dissipation cavity 21 is a closed structure, and the electrodeformable member 22 is covered on the cavity bottom 210 of the heat dissipation cavity 21. The electrodeformable member 22 serves as the cavity bottom of the heat dissipation cavity 21. The electrodeformable member 22 and the cavity wall 212 of the heat dissipation cavity 21 enclose the heat dissipation cavity 21. The cavity wall 212 is bonded to the surface of the heat dissipation support layer 7 away from the silicon-based micro-LED display panel through a thermal conductive adhesive. There is no air outlet on the cavity wall 212. The outside air enters the heat dissipation cavity only through the gap between the first deformation part 2203 and the second deformation part 2204 of the electrodeformable member 22, and the hot air in the heat dissipation cavity is also discharged only through the gap between the first deformation part 2203 and the second deformation part 2204 of the electrodeformable member 22. Under this structure, the electrodeformable element 22 can be used as the bottom of the heat dissipation cavity, eliminating the original cavity bottom and the structure of the air inlet on the original cavity bottom, thereby reducing the complexity of the overall structure of the display module, and the heat dissipation device 2 can be directly bonded to the silicon-based micro-light-emitting diode display panel, so that the heat blown out by the electrodeformable element 22 can be more easily conducted out of the display module.

[0101] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display module, which includes a silicon-based micro-LED display panel and a heat dissipation device, the heat dissipation device includes a heat dissipation cavity and an electro-deformable element, the heat dissipation cavity is arranged on the back side of the silicon-based micro-LED display panel, and the electro-deformable element is arranged on the bottom of the heat dissipation cavity, when the electro-deformable element is energized, the electro-deformable element deforms toward the silicon-based micro-LED display panel to allow outside air to enter the heat dissipation cavity, the temperature of the outside air is relatively low, and it can take away the heat of the silicon-based micro-LED display panel, thereby reducing the temperature of the silicon-based micro-LED display panel and improving the heat dissipation capacity of the display module; in addition, since the electro-deformable element has a relatively low requirement for the deformation space in the thickness direction, it can reduce the thickness of the heat dissipation device while making the heat dissipation device have better heat dissipation performance, thereby taking into account the small volume and high heat dissipation efficiency requirements of the silicon-based micro-LED display module.

[0102] In summary, although the present application is disclosed as above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application is based on the scope defined by the claims.

Claims

1. A display module, characterized in that: include: Silicon-based micro-light-emitting diode display panel; A heat dissipation device, comprising: A heat dissipation cavity is arranged on the back of the silicon-based micro-light emitting diode display panel; An electrodeformable element, arranged at the bottom of the heat dissipation cavity; Wherein, when the electrodeformable element is energized, the electrodeformable element is deformed to avoid a passage connecting the external environment and the heat dissipation cavity.

2. The display module according to claim 1, wherein: The electrodeformable element includes a first electrode, a piezoelectric material layer, and a second electrode, wherein the piezoelectric material layer is disposed between the first electrode and the second electrode.

3. The display module according to claim 1, wherein: An air inlet is provided on the bottom of the heat dissipation cavity, an air outlet is provided on the wall of the heat dissipation cavity, and the electrodeformable element comprises: at least one deformation portion, the deformation portion having an orthographic projection on the cavity bottom covering the air inlet; a fixing portion, disposed at the periphery of the deformation portion and connected to the deformation portion, wherein the orthographic projection of the fixing portion on the cavity bottom does not overlap with the air inlet; Among them, the fixed part is fixedly connected to the bottom of the cavity, and the deformable part is not connected to the bottom of the cavity; when the electrodeformable element is energized, the deformable part is deformed toward the direction of the silicon-based micro-light-emitting diode display panel, and there is a gap between the deformable part and the bottom of the cavity, and the gap between the deformable part and the bottom of the cavity connects the air inlet with the interior of the heat dissipation cavity.

4. The display module according to claim 3, wherein: The heat dissipation device further includes a baffle, which is disposed between the electrodeformable element and the cavity bottom, and includes: An inactive portion is fixedly connected to the cavity bottom, and the orthographic projection of the inactive portion on the cavity bottom does not overlap with the air inlet; an active portion, which is arranged on a side of the inactive portion close to the air inlet and connected to the inactive portion, the active portion is not connected to the cavity bottom, and the orthographic projection of the active portion on the cavity bottom covers the air inlet; In which, during the process of the electrodeformable element deforming toward the silicon-based micro-light-emitting diode display panel, the movable part is tilted toward the silicon-based micro-light-emitting diode display panel, and there is a gap between the movable part and the bottom of the cavity. The gap between the movable part and the bottom of the cavity connects the air inlet with the interior of the heat dissipation cavity.

5. The display module according to claim 4, characterized in that: When the electrodeformable element is powered off or when the electrodeformable element is restored to a state before deformation, the movable portion abuts against the cavity bottom and covers the air inlet, separating the air inlet from the interior of the heat dissipation cavity.

6. The display module according to claim 2, wherein: The electrodeformable element comprises: A plurality of first deformation parts, wherein the plurality of first deformation parts are arranged at intervals from each other; A plurality of second deformation parts are inserted between adjacent first deformation parts or arranged on one side of the first deformation part, and a gap is formed between the first deformation part and the adjacent second deformation part; A fixing portion, disposed at the periphery of the first deformation portion and the second deformation portion and connected to the first deformation portion and the second deformation portion respectively; Among them, when the electrodeformable element is energized, alternating current is passed through both the first deformation part and the second deformation part, and the phase of the alternating current passed through the first deformation part is different from the phase of the alternating current passed through the second deformation part, the first deformation part and the second deformation part both vibrate, and the gap between the first deformation part and the second deformation part connects the interior of the heat dissipation cavity with the external environment.

7. The display module according to claim 6, wherein: The phase of the alternating current supplied to the first deforming portion is opposite to the phase of the alternating current supplied to the second deforming portion; When the electrodeformable element is energized, when the first deformation portion reaches a maximum positive amplitude, the second deformation portion reaches a maximum negative amplitude; when the first deformation portion reaches a maximum negative amplitude, the second deformation portion reaches a maximum positive amplitude.

8. The display module according to claim 6, wherein: The first deformation portion and the second deformation portion are both in the shape of straight strips; Alternatively, the first deformation portion has a plurality of first extension portions that are spaced apart and extend in the direction of the second deformation portion, and a first recessed portion located between adjacent first extension portions; the second deformation portion has a plurality of second extension portions that are spaced apart and extend in the direction of the first deformation portion, and a second recessed portion located between adjacent second extension portions; when the electrodeformable element is not energized, the first extension portion is accommodated in the second recessed portion, and the second extension portion is accommodated in the first recessed portion.

9. The display module according to claim 6, wherein: The cavity bottom of the heat dissipation cavity is an open structure, the cavity wall of the heat dissipation cavity is a closed structure, and the electrodeformable component cover is arranged on the cavity bottom of the heat dissipation cavity.

10. The display module according to any one of claims 1 to 9, characterized in that: The display module further comprises a heat dissipation support layer, and the heat dissipation support layer is arranged between the silicon-based micro-LED display panel and the heat dissipation device; The cavity top of the heat dissipation cavity is an open structure, and the heat dissipation support layer sealing cover is arranged on the cavity top of the heat dissipation cavity.

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